CN117677796A - Seal assembly and method of manufacture - Google Patents

Abstract

An optical module (100) is disclosed comprising a housing (20) made at least partly of a thermally conductive material and comprising an annular recess. A sealant (23) is provided in the annular recess, and the optical plate (10) is provided in the housing (20). A portion (10 a) of the optical plate (10) is disposed above the annular recess (21), and a sealant (23) forms a bond between the housing (20) and the portion (10 a). The LED module (11) is disposed between the housing (20) and the optical plate (10). At least some of the heat generated by the LED module 11 is transferred to the housing (20) and dissipated. The light module (100) may also include a fastener (12) and the housing (20) may include a fastener stop (22). The fastener (12) is connected to the housing (20) and supports the optical plate (10). Excessive pressure exerted by the fastener (12) on the optical plate (10) is prevented by the fastener stopper (22).

Description

Seal assembly and method of manufacture

Technical Field

The present invention relates to a sealing assembly and a method of manufacturing the same, and more particularly, to a sealed LED lighting module including an optical plate and a housing/heat sink.

Background

Light Emitting Diode (LED) lighting devices can meet a variety of lighting application requirements due to advantages such as energy conservation, long life, good applicability, short response time, and environmental protection. There are many applications for LED lighting devices, including roadway lighting, parking lot lighting, and commercial and residential lighting. For these different lighting applications, different types of LED lighting units (i.e. devices carrying an LED array) have to be used. Each lighting application may present challenges such as the need for high brightness, reliability, durability, and the need for a watertight/airtight housing and cost considerations. This is because the LED lighting unit is susceptible to humidity, temperature and mechanical vibrations, thereby affecting the service life.

In addition, the handling of the heat dissipation requirements required for high brightness LED lighting units must also be considered. Electronic devices (such as lighting units or luminaires, etc.) also often require heat sinks. The lighting unit typically includes a light source, optics, control/drive circuitry, and a heat sink to help dissipate heat generated by the light source. A heat sink is a passive heat exchanger that transfers heat generated by electronic or mechanical devices to dissipate the heat from the devices. This helps to regulate the temperature of the device.

In view of the lighting applications and requirements described above, unique mounting and heat dissipation structures may be required. This may increase the cost and complexity of the lighting unit and increase the complexity/cost of the manufacturing method of such lighting units.

For example, there are conventional lighting units with exposed optical plates mounted on a heat sink, which are manufactured by various assembly methods (e.g., using gaskets, glue, and mechanical fasteners). Such an illumination unit without protective lenses provides increased light output and improved beam control, thereby providing a cheaper solution. However, such an optical plate assembly solution including washers and fasteners may create mechanical stresses on the optical plate and long-term cracking, thereby compromising the seal around the optical plate.

As described above, sealing of the optical plate may be achieved by compressing the components with mechanical fasteners. However, such assembly/installation solutions may use clips that increase the risk of seal failure. Furthermore, the use of mechanical fasteners such as screws can create localized mechanical stresses on plastic components such as optical sheets. Furthermore, the use of multiple components increases costs and may increase the risk of seal failure. The use of gaskets to seal multiple fixation points (to prevent deformation of the optical plate) is a labor intensive operation and increases manufacturing costs.

The apparatus and methods described in this document are directed to addressing at least some of the problems discussed above and/or other problems discussed below.

Disclosure of Invention

Aspects and embodiments of the present invention address the above issues.

One aspect of the invention relates to a sealed light module comprising a heat sink, a liquid adhesive sealant, an LED light source, an optical plate, a vent pad and fasteners, and an assembly method for securing and sealing the light module without applying pressure to the optical plate. This will also reduce and/or optimize the assembly time of the sealed light module.

Other aspects of the invention include the manufacture of heat sinks (to which optical sheets may be attached) with grooves/channels to apply adhesive sealants and the assembled fastener stops included. Mechanical fasteners are used to secure the optical plate in place. The optical plate may be made of a plastic material. The groove/and fastener stop provides a false-proof (poke-y) feature during assembly by preventing excessive pressure (i.e., pressure that may damage the optical plate) from being applied to the optical plate, which may damage the optical plate during assembly. In this regard, error proofing is a term that means "preventing errors" or "preventing unintentional errors. Error proofing is any mechanism in the process that helps device operators avoid errors/flaws by preventing, correcting, or asking attention to human errors when they occur.

One embodiment of the invention relates to an optical module comprising a housing made at least partly of a thermally conductive material and comprising an annular recess. A sealant is disposed in the annular recess, and an optical plate is disposed in the housing. At least a portion of the optical plate is disposed on the annular recess, and the sealant forms a bond between the housing and the portion. The LED module is arranged between the shell and the optical plate. At least some of the heat generated by the LED module is transferred to the housing and dissipated. The light module may further comprise a fastener, and the housing may further comprise a fastener stop. The fastener is connected to the housing and supports the optical plate. Excessive pressure exerted on the optical plate by the fastener is prevented by the fastener stopper.

In various embodiments, the light module is an LED light module and forms at least a portion of a housing of the luminaire. The luminaire may further comprise a mounting assembly connected to the LED light module to form a sealed housing against environmental hazards.

Another embodiment of the invention is directed to an optical module that includes a housing that includes a recess and a fastener stop. A sealant is disposed in the recess, and a transparent panel made of a plastic material is disposed in the housing. At least a portion of the transparent panel is disposed on the recess, and the sealant forms a bond between the housing and the portion. The fastener is connected to the housing supporting the transparent panel and is prevented from exerting excessive pressure on the transparent panel by the fastener stopper.

In one embodiment of the invention, the fastener is a screw and the fastener stop is a protrusion on the housing that prevents the fastener from being inserted below the predetermined location.

It is to be understood that all combinations of the foregoing concepts and additional concepts discussed in more detail below (assuming such concepts are not mutually inconsistent) are contemplated as being part of the inventive subject matter disclosed herein. In particular, all combinations of claimed subject matter appearing at the end of this disclosure are considered part of the inventive subject matter disclosed herein. It will be further understood that terms, such as those specifically used herein, that may also be present in any disclosure incorporated by reference should be given the most consistent meaning with the specific concepts disclosed herein.

Drawings

Further details, aspects and embodiments of the invention will be described, by way of example only, with reference to the accompanying drawings. Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. In the drawings, elements corresponding to elements already described may have the same reference numerals. In the drawings:

figure 1 shows a diagram of an optical module according to one embodiment of the invention,

figure 2 shows various unassembled components of the light module of figure 1,

figure 3 shows a cross-sectional view of the light module of figure 1 after assembly,

FIGS. 4A and 4B show more detailed cross-sectional views of the optical module of FIG. 1, an

Fig. 5 illustrates a luminaire in accordance with various aspects of the present invention.

Detailed Description

While this invention is susceptible of embodiment in many different forms, there is shown in the drawings and will herein be described in detail one or more specific embodiments, with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and is not intended to limit the invention to the specific embodiments illustrated and described.

In the following, elements of the embodiments are described in operation for the sake of understanding. It will be apparent, however, that the various elements are arranged to perform the functions described as being performed by them.

Furthermore, the invention is not limited to the embodiments and lies in each and every novel feature or combination of features described herein or in the mutually different dependent claims.

Fig. 1 shows an example of an optical module 100 according to an embodiment of the invention. It should be appreciated that the light module 100 may be manufactured in a variety of shapes and sizes. The configuration of the light module 100 may be designed to suit various lighting applications.

Fig. 2 shows various unassembled components of the optical module 100. The light module 100 includes an optical plate (or panel) 10, an LED module 11 (i.e., an LED-based light source), a housing 20, and one or more fasteners 12.

The term "controller" or "module" as used herein generally describes a structure or circuit that may be implemented in a number of ways (e.g., using dedicated hardware and/or software) to perform the various functions discussed herein. A "processor" is one example of a controller (or central component of a controller) that employs one or more microprocessors that may be programmed using software (e.g., microcode) to perform the various functions discussed herein. A controller may be implemented with or without a processor, and a controller may also be implemented as a combination of dedicated hardware to perform some functions and a processor (e.g., one or more programmed microprocessors and associated circuitry) to perform other functions. Examples of controller components that may be employed in various embodiments of the present disclosure include, but are not limited to, conventional microprocessors, application Specific Integrated Circuits (ASICs), and Field Programmable Gate Arrays (FPGAs).

The optical plate 10 may have one or more of the following functions. The light source of the LED module 11 is guided so that the light is uniformly distributed over the entire surface of the optical plate 10 (some optical plates can control the exit angle in addition to making the light uniform). The LED module 11 is supported to protect the underlying material from damage. The optical plate 10 can also utilize a reflection mechanism to more effectively utilize the light flux and control the light distribution. The optical plate 10 may be made of a transparent plastic material such as a polycarbonate sheet or an acrylic sheet. Such materials are widely used because of their high light transmittance and high impact resistance. For example, the transparent acrylic sheet may be resistant to oxidation and have a light transmittance of more than 92%.

The LED module 11 (or LED array) is an assembly of LED packages (components) or dies (or chips) on a printed circuit board or substrate, typically with optical elements, so that the light generated by the LEDs can have a desired distribution pattern. The LED module is typically a plastic or ceramic material with thermal management, mechanical support and electrical interface to couple to the load side of the current source of the LED driver/controller. The LED modules may be of any shape or size to meet the needs of the lighting application.

The term "LED" should be understood to include any electroluminescent diode or other type of carrier injection/junction based system capable of generating radiation in response to an electrical signal. Thus, the term LED includes, but is not limited to, various semiconductor-based structures that emit light in response to an electrical current, light emitting polymers, organic Light Emitting Diodes (OLEDs), electroluminescent strips, and the like. In particular, the term LED refers to all types of light emitting diodes (including semiconductor and organic light emitting diodes) that may be configured to produce radiation in one or more of the various portions of the infrared, ultraviolet, and visible light spectrums (typically including radiation wavelengths from about 400 nanometers to about 700 nanometers). Some examples of LEDs include, but are not limited to, various types of infrared LEDs, ultraviolet LEDs, red LEDs, blue LEDs, green LEDs, yellow LEDs, amber LEDs, orange LEDs, and white LEDs (discussed further below). It should also be appreciated that LEDs may be configured and/or controlled to generate radiation having various bandwidths (e.g., full width at half maximum, or FWHM) for a given spectrum (e.g., narrow bandwidth, wide bandwidth) and various dominant wavelengths within a given general color type.

It should also be understood that the term LED is not limited to the physical and/or electrical packaging type of the LED. For example, as described above, an LED may refer to a single light emitting device having multiple dies configured to emit different spectra of radiation, respectively (e.g., which may or may not be individually controllable). Further, an LED may be associated with a phosphor that is considered to be an integral part of the LED (e.g., some types of white LEDs). In general, the term "LED" may refer to packaged LEDs, non-packaged LEDs, surface mount LEDs, chip-on-board LEDs, T-package LEDs, radial package LEDs, power package LEDs, LEDs that include some type of enclosure and/or optical element (e.g., a diffusing lens), and the like.

The housing 20 may function in part as a heat sink. The housing 20 may be made in whole or in part of a thermally conductive material, such as an aluminum metal plate. Suitable materials for the housing 20 include one or more of the following: aluminum alloys 1051, 6061, 6063, copper-tungsten, magnesium, silver, and combinations of two or more of the foregoing. However, other thermally conductive materials may also be applied. The term "thermally conductive" refers to a material having a thermal conductivity of at least 5W/(m K), for example a material having a thermal conductivity of at least 10W/(m K), especially having a thermal conductivity of at least 100W/(m K). Examples of suitable materials include steel, aluminum, copper, alN, BN, siC, and AL6061.

The heat generated by the LED module 11 and/or other heat generating components may be conducted to the housing 20 and then dissipated to the outside, so that the light module 100 does not require cooling fins to dissipate heat. This embodiment allows the housing 20 to serve more than one purpose and eliminates additional components that may be required for a heat sink. This saves assembly costs and time for the light module 100.

Fig. 2 shows an example of a configuration of the housing 20. In this embodiment, the housing 20 is rectangular. It should be appreciated that other geometries may be used to accommodate the needs of the lighting application. For example, the housing 20 may also include a circular, rectangular, pentagonal, hexagonal, elliptical, or octagonal cross-section or overall shape. Thus, in various embodiments, the housing 20 has a cross-section selected from the group consisting of circular, oval, triangular, square, rectangular, pentagonal, hexagonal, and octagonal. The housing 20 may be composed entirely or partially of one or more of the thermally conductive materials described above.

The housing 20 includes a recess 21, which recess 21 may be partially or completely filled with a sealant 23 (as shown in fig. 4B). In a preferred embodiment, the recess 21 forms a closed circuit (e.g., annular) in the housing 20. In other embodiments, there may be one or more recesses 21 that are not fully connected to form a closed loop. In the embodiment of fig. 2, the closed loop has a generally rectangular shape with rounded corners, however other shapes may be used to accommodate the assembly of the LED module 11 in the housing 20. As shown in fig. 4A and 4B, the concave portion 21 has a semicircular shape. However, the recess 21 may have other cross-sectional shapes, such as oval, triangular, square, rectangular, pentagonal, hexagonal, and octagonal. However, the exact location of the recess 21 will depend on the configuration, shape and/or orientation of the optical plate 10 and the LED module 11 as desired for the lighting application. For example, a recess 21 may be located on the periphery of the housing 20 to surround the LED module 11 (when assembled) and allow the optical plate 10 to cover the LED module 11, as described below.

The fastener 12 is a mechanical device for engaging or holding at least the optical plate 10 to the housing 20. This may be a permanent or non-permanent engagement. As shown in fig. 2, the fastener 12 is a screw. Other types of fasteners 12 include bolts, nuts, washers, split joints, rivets, inserts, and snap rings.

The housing 20 also includes a fastener stop 22. When the fastener 12 is used to assemble/hold the optical plate 10 to the housing 20 above the LED module 11, the fastener stop 22 reduces and/or prevents excessive pressure from being exerted on the optical plate 10. As shown in fig. 4B, the fastener stop 22 is a raised protrusion that prevents the fastener 21 from being inserted below a fixed depth/position. In this embodiment, the raised protrusion is at approximately the same height as at least a portion 10a of the optical plate 10 when assembled in the housing 20 (see line 1 in fig. 4B). In this regard, the optical plate 10 may include a portion 10a covering a central region of the LED module 11 and disposed above the recess 21. The central region and the portion 10a may have a varying height measured from the top of the LED. The fastener stopper 22 prevents part or all of the pressure from the fastener 21 from being applied to the optical plate 10. As shown in fig. 4B, when assembled in the housing 20, the portion 10a of the optical plate 10 is disposed above the recess 21 and at least partially rests on the housing 20. The portion 10a of the optical plate 10 may also be used to hold/support the LED module 11 in place within the housing 20.

During assembly, the sealant 23 is disposed in the recess 21. When the sealant 23 is cured, the sealant 23 provides a seal between the optical plate 10 and the housing 20. The seal may be airtight and waterproof. The sealant 23 is applied in a liquid or tacky state that undergoes a curing process to create a holding force between the two surfaces. The sealant 23 may be, for example, a silicone adhesive, a two-part plastic adhesive or epoxy, or a liquid adhesive sealant. The most common liquid viscous sealant is an acrylic resin, which, although polymethyl methacrylate (PMMA), typically contains hydroxyl and amine groups.

Fig. 3 shows a cross-sectional view of the assembled light module 100, which shows the arrangement of the optical plate 10, the LED module 11, the housing 20 and the fastener 12. The LED module 11 is disposed in the case 20, and the optical plate 10 entirely covers the LED module 11. Notably, screw 30 is shown in fig. 3 (as well as fig. 1 and 2). The screw 30 is located below the optical plate 10 and does not support the optical plate 10. Screws 30 (or other types of fasteners) are optional and may be used to support the LED modules 11 in the housing 20.

Fig. 5 illustrates a luminaire 200 including a light module 100 and a mounting assembly 101 according to aspects of the present invention. In this embodiment, the luminaire 200 is an LED-based lighting unit using the light module 100. The optical module 100 is physically and electrically coupled to a mounting assembly 101. The luminaire 200 may also comprise other elements (not shown), such as a controller or a light driving unit, and a power supply or a power connector to provide the necessary power to the light module 100. It should also be appreciated that the light module 100 and the mounting assembly 101 are comprised of a single integrated unit.

The term "luminaire" or "lighting unit" as used herein refers to the implementation or arrangement of one or more lighting units in a particular form factor, assembly or package. A given lighting unit may have any of a variety of mounting arrangements, enclosure/housing arrangements and shapes, and/or electrical and mechanical connection configurations. Additionally, a given lighting unit may optionally be associated with (e.g., include coupled to and/or packaged together with) various other components (e.g., control circuitry) related to the operation of the light source. "LED-based lighting unit" refers to a lighting unit that includes only one or more LED-based light sources as described above, or a combination of one or more LED-based light sources as described above with other non-LED-based light sources.

The luminaire 200 may be designed for outdoor lighting applications. In this regard, the luminaire 200 may be IP-rated. IP rating systems are widely used worldwide to rate the level of protection provided by an enclosure against environmental hazards. The IP-grade enclosure provides dust and water proof functions. The various components of the luminaire 200 may be made of stainless steel, carbon steel, aluminum, and/or polycarbonate.

Although several inventive embodiments have been described and illustrated herein, one of ordinary skill in the art will readily devise various other arrangements and/or structures for performing the functions and/or obtaining the results and/or one or more of the advantages described herein, and each such variation and/or modification is considered to be within the scope of the inventive embodiments described herein. For example, the housing 20 is not limited to a structure for a luminaire.

More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and/or configurations will depend upon the specific application or applications for which the teachings of the present invention is/are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific inventive embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, inventive embodiments may be practiced otherwise than as specifically described and claimed. Inventive embodiments of the present disclosure are directed to each individual feature, system, article, material, kit, and/or method described herein. Furthermore, if such features, systems, articles, materials, kits, and/or methods are not mutually inconsistent, any combination of two or more such features, systems, articles, materials, kits, and/or methods is included within the scope of the present disclosure.

All definitions as defined and used herein are to be understood to have precedence over dictionary definitions, definitions in documents incorporated by reference, and/or ordinary meanings of the defined terms.

The indefinite articles "a" or "an" as used herein in the specification and claims should be understood to mean "at least one" unless explicitly indicated to the contrary. "

The phrase "and/or" as used herein in the specification and claims should be understood to mean "either or both" of the elements so combined, i.e., elements that are in some cases combined and in other cases not combined. Several elements listed with "and/or" should be construed in the same manner, i.e. "one or more" of the elements so combined. In addition to the elements specifically identified by the "and/or" clause, other elements may optionally be present, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to "a and/or B" when used in conjunction with an open language such as "comprising" may refer in one embodiment to a alone (optionally including elements other than B); in another embodiment, refer to B only (optionally including elements other than a); in yet another embodiment, both a and B (optionally including other elements), and so forth.

As used herein in the specification and claims, "or" should be understood to have the same meaning as "and/or" defined above. For example, when items in a list are separated, "or" and/or "should be construed as inclusive, i.e., including at least one of the plurality of elements or lists of elements, but also including more than one, and optionally, additional unlisted items. Only the explicit indication of the contrary terms, such as "only one" or "exactly one" or "consisting of … …" when used in the claims, shall mean that exactly one element in a plurality or list of elements is included. In general, the term "or" as used herein should be interpreted to mean an exclusive substitution (i.e., "one or the other, but not both") only when an exclusive term (e.g., "either," "one," "only one," or "exactly one") is added to the foregoing. "consisting essentially of … …" when used in the claims should have its ordinary meaning as used in the patent statutes.

As used in the specification and claims, the phrase "at least one" in a list referring to one or more elements is understood to mean at least one element selected from any one or more elements in the list of elements, but not necessarily including at least one of each element specifically listed in the list of elements, and not excluding any combination of elements in the list of elements. The definition also allows that elements other than those specifically identified in the list of elements recited in the phrase "at least one" may optionally be present, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, "at least one of a and B" (or, equivalently, "at least one of a or B," or, equivalently, "at least one of a and/or B") may refer, in one embodiment, to at least one, optionally including more than one, a without B (and optionally including elements other than B); in another embodiment, at least one, optionally including more than one B without a (and optionally including elements other than a); in yet another embodiment, at least one, optionally including more than one a and at least one, optionally including more than one B (and optionally including other elements), and so forth.

It should also be understood that in any method claimed herein that includes more than one step or act, the order of the steps or acts of the method is not necessarily limited to the order in which the steps or acts of the method are recited, unless explicitly indicated to the contrary.

In the claims and in the above description, all transitional phrases such as "comprising," "including," "carrying," "having," "containing," "involving," "holding," "composing," and the like are to be understood to be open-ended, i.e., to mean including but not limited to. As set forth in section 2111.03 of the U.S. patent office patent review program handbook, only the transitional phrases "consisting of … …" and "consisting essentially of … …" should be closed or semi-closed transitional phrases, respectively.

In the claims, any reference signs placed between parentheses refer to any reference signs in the drawings of the exemplary embodiments or to formulas in the embodiments, thereby increasing the intelligibility of the claims. These reference signs should not be construed as limiting the claims.

Claims (15)

1. An optical module (100), comprising:

a housing (20) comprising a recess (21) and a fastener stop (22);

a liquid or adhesive sealant (23) disposed in the recess (21);

a transparent panel (10) made of plastic material arranged inside the housing (20), wherein at least a portion (10 a) of the transparent panel (10) is arranged on the recess (21) and when the liquid or adhesive sealant (23) is cured, the sealant (23) forms a bond between the housing (20) and the portion (10 a); and

a fastener (12) connected to a housing (20) supporting the transparent panel (10) and preventing the fastener (12) from exerting excessive pressure on the transparent panel (10) by a fastener stopper (22), wherein the fastener stopper (22) is a raised protrusion to prevent the fastener (12) from being inserted below a fixed depth/position, wherein the raised protrusion is the same height as at least a portion (10 a) of the optical plate (10).

2. The light module (100) of claim 1, wherein the fastener (12) is a screw (12) and the fastener stop (22) is a protrusion on the housing (20) that prevents insertion of the fastener (12) below a predetermined position.

3. The light module (100) according to claim 1, wherein the recess (21) is annular and has a cross-section selected from the group consisting of circular, elliptical, triangular, square, rectangular, pentagonal, hexagonal or octagonal.

4. A light module (100) according to claim 3, wherein the bond is waterproof.

5. The light module (100) according to claim 4, further comprising an LED module (11) arranged between the housing (20) and the transparent panel (10), wherein the housing (20) at least partly acts as a heat sink and the transparent panel (10) is an optical plate (10).

6. The light module (100) of claim 5, wherein the encapsulant (23) is a liquid viscous encapsulant (23).

7. The light module (100) of claim 1, wherein the light module (100) forms at least a portion of a housing (200) of a luminaire.

8. A luminaire (200) comprising the light module of claim 1 and a mounting assembly (101), wherein the light module (100) and the mounting assembly (101) are connected to form a sealed housing against environmental hazards.

9. The light module (100) according to claim 1, wherein the housing (20) is at least partly made of a thermally conductive material and the recess (21) is an annular recess, wherein the transparent panel (10) is an optical plate; and an LED module (11) is disposed between the housing (20) and the optical plate, and wherein at least some of the heat generated by the LED module 11 is transferred to the housing (20) and dissipated.

10. The light module (100) of claim 9, further comprising a fastener (12), and the housing (20) further comprises a fastener stopper (22), wherein the fastener (12) is connected to the housing (20) and supports the optical plate (10), and the fastener (12) is prevented from exerting excessive pressure on the optical plate (10) by the fastener stopper (22).

11. The light module (100) of claim 10, wherein the fastener (12) is a screw (12) and the fastener stop (22) is a protrusion on the housing (20) that prevents insertion of the fastener (12) below a predetermined position.

12. The light module (100) according to claim 11, wherein the annular recess (21) has at least a partial cross-section selected from the group consisting of circular, elliptical, triangular, square, rectangular, pentagonal, hexagonal or octagonal.

13. The light module (100) of claim 9, wherein the bond is waterproof.

14. The light module (100) of claim 9, wherein the light module (100) forms at least a portion of a housing of a luminaire (200).

15. A luminaire (200) comprising the light module of claim 1 and a mounting assembly (101), wherein the light module (100) and the mounting assembly (101) are connected to form a sealed housing against environmental hazards.