CN117659878A - Hydrophobic patterned adhesive tape and manufacturing method thereof - Google Patents
Hydrophobic patterned adhesive tape and manufacturing method thereof Download PDFInfo
- Publication number
- CN117659878A CN117659878A CN202211030999.5A CN202211030999A CN117659878A CN 117659878 A CN117659878 A CN 117659878A CN 202211030999 A CN202211030999 A CN 202211030999A CN 117659878 A CN117659878 A CN 117659878A
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- Prior art keywords
- layer
- patterned
- hydrophobic
- plate body
- tape
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Links
- 230000002209 hydrophobic effect Effects 0.000 title claims abstract description 108
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000010410 layer Substances 0.000 claims abstract description 188
- 238000000059 patterning Methods 0.000 claims abstract description 33
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 17
- 239000011241 protective layer Substances 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000005661 hydrophobic surface Effects 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 238000007788 roughening Methods 0.000 claims description 4
- 238000001771 vacuum deposition Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- -1 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
- B60J10/00—Sealing arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60J—WINDOWS, WINDSCREENS, NON-FIXED ROOFS, DOORS, OR SIMILAR DEVICES FOR VEHICLES; REMOVABLE EXTERNAL PROTECTIVE COVERINGS SPECIALLY ADAPTED FOR VEHICLES
- B60J10/00—Sealing arrangements
- B60J10/20—Sealing arrangements characterised by the shape
- B60J10/27—Sealing arrangements characterised by the shape having projections, grooves or channels in the longitudinal direction
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention provides a hydrophobic patterned adhesive tape and a manufacturing method thereof, wherein the hydrophobic patterned adhesive tape comprises: the patterning layer is provided with an upper surface and a lower surface and is of a ladder structure; a hydrophobic film layer disposed on an upper surface of the patterned layer; a glue layer disposed on a lower surface of the patterned layer; the release film layer is arranged on the adhesive layer; and the hydrophobic protective layer is arranged on the hydrophobic film layer. According to the technical scheme, the patterning layer is of a step structure, so that the adhesive layer arranged on the lower surface of the patterning layer can be adhered to and cover the adhesive surface with the height difference on the parts to be sealed, and a gap between the upper end faces with the height difference on the two adjacent parts to be sealed is sealed. Further expanding the application range of the hydrophobic patterned adhesive tape. Meanwhile, the problem that the gap sealing effect between two parts to be sealed with the height difference is poor due to the adhesive tape with the flat tape structure in the related technology is solved.
Description
Technical Field
The invention relates to the technical field of sealing equipment, in particular to a hydrophobic patterned adhesive tape and a manufacturing method thereof.
Background
Currently, adhesive tapes are typically provided in a flat tape configuration that acts as a seal that can be used to seal holes or slits in the component to be sealed. However, when the tape seals a gap between the upper surfaces of two members to be sealed, which has a height difference, its sealing effect is poor.
That is, the adhesive tape in the related art has a problem of poor sealing effect against a gap between two members to be sealed, which has a height difference.
Disclosure of Invention
Aiming at the problems in the prior art, the application provides a hydrophobic patterned adhesive tape and a manufacturing method thereof, which solve the problem that the sealing effect of a gap between two parts to be sealed with height difference is poor.
The hydrophobic patterned adhesive tape of the present invention comprises: the patterning layer is provided with an upper surface and a lower surface and is of a ladder structure; and a hydrophobic film layer disposed on an upper surface of the patterned layer; and a glue layer disposed on a lower surface of the patterned layer; the release film layer is arranged on the adhesive layer; and a hydrophobic protective layer disposed on the hydrophobic film layer.
In one embodiment, the patterned layer includes a patterned bulk layer. According to the embodiment, the patterning main body layer can enable the adhesive layer arranged on the lower surface of the patterning main body layer to bond and seal gaps between the upper end faces of the two adjacent parts to be sealed, which have height differences, and can enhance the overall strength of the hydrophobic patterning adhesive tape. Thereby ensuring that the hydrophobic patterned adhesive tape has better applicability and stronger sealing capability.
In one embodiment, the patterned layer includes a planar bulk layer and a patterned film layer disposed on the planar bulk layer. Through this embodiment, the plane main part layer and the patterning rete can make the glue film bonding that sets up on its lower surface seal the gap between the up end that has the difference in height on two adjacent waiting sealing member, can strengthen the bulk strength of hydrophobic patterning sticky tape again. Thereby ensuring that the hydrophobic patterned adhesive tape has better applicability and stronger sealing capability.
In one embodiment, the hydrophobic patterned adhesive tape is provided with a first positioning hole, the first positioning hole penetrates through the hydrophobic protective layer, and the first positioning hole is used for bonding and positioning the hydrophobic patterned adhesive tape and the part to be sealed. Through this embodiment, the first locating hole that sets up on the hydrophobic membrane layer can be aligned with the location structure on waiting to seal the part to ensure that the glue film that sets up on the patterning layer can cover the step face that forms on waiting to seal the part, thereby ensure that the hydrophobic patterning sticky tape can seal the gap between the up end that has the difference in height on two adjacent waiting to seal the part of bonding.
In one embodiment, the glue layer is a stepped plate structure comprising: a first plate body; one end of the second plate body is connected with the first plate body in a bending way; the third plate body is bent and connected with the other end of the second plate body; the first plate body and the third plate body are arranged in parallel and are respectively positioned at two sides of the second plate body which are oppositely arranged.
In one embodiment, the glue layer is a stepped plate structure comprising: a first plate body; and the second plate body is arranged in parallel with the first plate body, and the second plate body and the first plate body are staggered in the first direction.
The invention also provides a tape manufacturing method, which is used for manufacturing the hydrophobic patterned tape and comprises the following steps: manufacturing a patterning layer;
double-sided roughening of the patterned layer;
hydrophobizing the upper surface of the patterned layer to form a hydrophobic film layer;
a hydrophobic protective layer is attached to the hydrophobic surface of the hydrophobic membrane layer;
attaching glue to the lower surface of the patterned layer to form a glue layer;
and a release film is attached to the adhesive surface of the adhesive layer to form a release film layer.
In one embodiment, fabricating the patterned layer includes the steps of:
coating a photoresist layer on the surface of the main body layer;
placing the prepared mask plate in a shielding area for first ultraviolet exposure;
leaving a patterned photoresist layer after the first development;
performing a second ultraviolet exposure on the patterned photoresist layer;
depositing a film layer on the patterned photoresist layer and the surface of the main body layer after the second ultraviolet exposure;
the second development leaves behind the bulk layer and the patterned film layer.
In one embodiment, in the step of depositing a film layer on the patterned photoresist layer and the surface of the main body layer after the second ultraviolet exposure, a vacuum coating method is used to deposit a film layer.
In one embodiment, fabricating the patterned layer includes the steps of:
coating a photoresist layer on a silicon wafer;
placing the prepared mask plate in a shielding area for ultraviolet exposure;
leaving a patterned photoresist layer on the developed silicon wafer;
inverting the template solution on the patterned photoresist layer and performing ultraviolet exposure;
crosslinking and solidifying the template solution to form a template;
tearing off the template, and coating the solution of the patterning main body layer on the template;
and (3) removing the template after the solution of the patterning main body layer is solidified to obtain the patterning main body layer.
The above-described features may be combined in various suitable ways or replaced by equivalent features as long as the object of the present invention can be achieved.
Compared with the prior art, the hydrophobic patterned adhesive tape and the manufacturing method thereof have the following beneficial effects:
because the patterning layer is of a step structure, the adhesive layer arranged on the lower surface of the patterning layer can be adhered to and cover the adhesive surface with the height difference on the parts to be sealed, so that a gap between the upper end surfaces with the height difference on the two adjacent parts to be sealed is sealed. Further expanding the application range of the hydrophobic patterned adhesive tape. Meanwhile, the problem that the gap sealing effect between two parts to be sealed with the height difference is poor due to the adhesive tape with the flat tape structure in the related technology is solved.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
FIG. 1 is a schematic view showing a structure of a hydrophobic patterned adhesive tape according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a hydrophobic patterned adhesive tape according to a second embodiment of the present invention;
FIG. 3 is a schematic view showing the structure of the hydrophobic patterned tape of FIGS. 1 and 2 for sealing a part to be sealed;
FIG. 4a shows a schematic diagram of the adhesion of the hydrophobic patterned tape according to the first embodiment of the present invention to the component to be sealed in FIG. 3 (the hydrophobic protective film is not removed after positioning);
FIG. 4b shows a schematic diagram of the adhesion of the hydrophobic patterned tape according to the first embodiment of the present invention to the component to be sealed in FIG. 3 (after positioning, the hydrophobic protective film is removed);
FIGS. 5a, 5b, 5c, 5d, 5e and 5f are schematic views showing a process for manufacturing a hydrophobic patterned tape according to a first embodiment of the present invention;
fig. 6a, 6b, 6c, 6d, 6e, 6f and 6g show schematic views of the manufacturing process of the hydrophobic patterned adhesive tape according to the second embodiment of the invention.
In the drawings, like parts are designated with like reference numerals. The figures are not to scale.
Reference numerals:
10. patterning the layer; 11. an upper surface; 12. a lower surface; 13. patterning the film layer; 14. patterning the body layer; 15. a silicon wafer; 16. a body layer; 17. a planar body layer; 20. a hydrophobic membrane layer; 30. a glue layer; 40. a release film layer; 50. a hydrophobic protective layer; 60. a first positioning hole; 100. a hydrophobic patterned tape; 200. a member to be sealed; 201. an adhesive surface; 2011. an upper end surface; 2012. a side surface; 202. a second positioning hole; 300. a slit; 400. a mask plate; 500. a photoresist layer; 600. a template; 700. and (3) a film layer.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
Note that, in the present application, the number of the members to be sealed 200 is plural, and the members to be sealed 200 are arranged at intervals along the horizontal direction (not limited to the horizontal direction), and the upper end faces 2011 of two adjacent members to be sealed 200 have a height difference, and a gap 300 to be sealed is formed between the upper end faces 2011 of two adjacent members to be sealed 200.
The shape of the patterned layer 10 in the present application is complementary to the pattern shape of the pre-bonding area (for example, the pattern shape of the pre-bonding area is stepped, and the shape of the patterned layer 10 is also stepped to ensure that the pre-bonding area is covered). By "patterning" in this application is meant complementing the pattern shape of the pre-bonded area.
As shown in fig. 1 and 2, the present invention provides a hydrophobic patterned adhesive tape 100, which includes a patterned layer 10, a hydrophobic film layer 20, an adhesive layer 30, a release film layer 40, and a hydrophobic protective layer 50. The patterned layer 10 has an upper surface 11 and a lower surface 12, and the patterned layer 10 has a step structure. The hydrophobic film layer 20 is disposed on the upper surface 11 of the patterned layer 10, the adhesive layer 30 is disposed on the lower surface 12 of the patterned layer 10, and the hydrophobic protective layer 50 is disposed on the hydrophobic film layer 20.
In the above arrangement, since the patterned layer 10 has a stepped structure, the adhesive layer 30 disposed on the lower surface 12 thereof can be adhered to cover the adhesion surface 201 having the height difference on the members to be sealed 200, thereby sealing the gap 300 between the upper end surfaces 2011 having the height difference on the adjacent two members to be sealed 200. Thereby expanding the applicable range of the hydrophobic patterned adhesive tape 100. Meanwhile, the problem that the sealing effect of the adhesive tape with the flat belt structure on the gap 300 between two parts to be sealed 200 with the height difference in the related art is poor is solved.
It should be noted that, the bonding surface 201 in the present application is a step surface (bonding surface 201), and includes an upper end surface 2011 of two adjacent members to be sealed 200 and a side surface 2012 of a portion of the member to be sealed 200 having a higher height than the other member to be sealed 200. The stepped structure in the hydrophobic patterned tape 100 is designed to mate exactly with the stepped surface to meet the high fit requirements of the adhesive surface 201 to the tape.
Under the condition that the requirement on the flatness is low or the flatness meets the requirement, the hydrophobic patterned adhesive tape 100 only needs to be enlarged by 10-20% according to the required bonding gap 300 or hole area.
Specifically, as shown in fig. 1 and 2, the stepped plate structure may include a first plate body, a second plate body, and a third plate body. One end of the second plate body is connected with the first plate body in a bending way, and the other end of the third plate body is connected with the second plate body in a bending way. The first plate body and the third plate body are arranged in parallel and are respectively positioned at two sides of the second plate body which are oppositely arranged.
Of course, in an alternative embodiment not shown in the drawings of the present application, the adhesive layer is a stepped plate structure, and the stepped plate structure includes a first plate body and a second plate body, where the second plate body is parallel to the first plate body, and the second plate body is staggered with the first plate body in a first direction (vertical direction in fig. 1 and 2). The first plate body and the second plate body are respectively arranged on the lower surface of the patterning layer.
Specifically, as shown in fig. 1 and 2, the lower surface 12 of the patterned layer 10 includes a first surface, a second surface, and a third surface, the first surface is parallel to the third surface, the second surface is perpendicularly connected to the first surface and the third surface, the first plate is disposed on the first surface, the second plate is disposed on the second surface, and the third plate is disposed on the third surface.
Example 1
Specifically, as shown in fig. 1, in one embodiment, patterned layer 10 includes a patterned bulk layer 14.
In the above arrangement, the patterned main body layer 14 can enable the adhesive layer 30 disposed on the lower surface thereof to adhere and seal the gap 300 between the upper end surfaces of the adjacent two members to be sealed 200 having a height difference, and can also enhance the overall strength of the hydrophobic patterned adhesive tape 100. Thereby ensuring good applicability and strong sealing ability of the hydrophobic patterned adhesive tape 100.
Specifically, as shown in fig. 4a and 4b, in one embodiment, the hydrophobic protective layer 50 is provided with a first positioning hole 60, and the first positioning hole 60 is used for adhesion positioning of the hydrophobic patterned adhesive tape 100 and the member to be sealed 200.
In the above arrangement, the first positioning holes 60 provided on the hydrophobic protection layer 50 can be aligned with the positioning structures on the members to be sealed 200, thereby ensuring that the adhesive layer 30 provided on the patterned layer 10 can cover the stepped surfaces formed on the members to be sealed 200, thereby ensuring that the hydrophobic patterned adhesive tape 100 can adhesively seal the gap 300 between the upper end surfaces having the height difference on the adjacent two members to be sealed 200.
Example two
The second embodiment has the following differences from the first embodiment:
specifically, as shown in fig. 2, in one embodiment, the patterned layer 10 includes a planar bulk layer 17 and a patterned film layer 13 disposed on the planar bulk layer 17.
In the above arrangement, the planar main body layer 17 and the patterned film layer 13 can enable the adhesive layer 30 disposed on the lower surface thereof to adhere and seal the gap 300 between the upper end surfaces of the adjacent two members to be sealed 200 having a height difference, and can also enhance the overall strength of the hydrophobic patterned adhesive tape 100. Thereby ensuring good applicability and strong sealing ability of the hydrophobic patterned adhesive tape 100.
The second embodiment has the same structure as the first embodiment, and will not be described here again.
Example III
The invention also provides a tape manufacturing method for manufacturing the hydrophobic patterned tape 100 in the first embodiment. The adhesive tape manufacturing method comprises the following steps:
first, a patterning layer 10 is manufactured;
second, the double-sided roughening of the patterned layer 10;
third, the upper surface 11 of the patterned layer 10 is subjected to a hydrophobic treatment to form a hydrophobic film layer 20;
fourth, a hydrophobic protective layer 50 is attached to the hydrophobic surface of the hydrophobic film layer 20;
fifth, the lower surface 12 of the patterned layer 10 is adhered with glue to form a glue layer 30;
in the sixth step, a release film is attached to the adhesive surface of the adhesive layer 30 to form a release film layer 40.
Specifically, in one embodiment, fabricating the patterned layer includes the following steps (see fig. 5 a-5 f):
first, coating a photoresist layer 500 on a silicon wafer 15 (refer to fig. 5 b);
secondly, placing the prepared mask 400 in a shielding area for ultraviolet exposure (refer to fig. 5 c);
thirdly, a patterned photoresist layer 500 is left on the developed silicon wafer;
fourth, the template solution is inverted on the patterned photoresist layer 500 and ultraviolet exposure is performed;
fifth, the template solution is crosslinked and cured to form a template 600 (refer to fig. 5 d);
sixth, tearing off the template 600, and applying a solution of the patterned body layer 14 on the template 600 (refer to fig. 5e, after the solution application is completed, the template 600 is inverted again on the patterned photoresist layer 500);
seventh, the template 600 is removed after the solution of the patterned body layer 14 is cured, resulting in the patterned body layer 14 (see fig. 5 f).
Wherein the pattern on the mask 400 is opposite to the target pattern.
Example IV
The invention also provides a manufacturing method of the adhesive tape, which is used for manufacturing the hydrophobic patterned adhesive tape in the second embodiment. The adhesive tape manufacturing method comprises the following steps:
first, a patterning layer 10 is manufactured;
second, the double-sided roughening of the patterned layer 10;
third, the upper surface of the patterned layer 10 is hydrophobized to form a hydrophobic film layer 20;
fourth, a hydrophobic protective layer 50 is attached to the hydrophobic surface of the hydrophobic film layer 20;
fifth, the lower surface 12 of the patterned layer 10 is adhered with glue to form a glue layer 30;
in the sixth step, a release film is attached to the adhesive surface of the adhesive layer 30 to form a release film layer 40.
Specifically, in one embodiment, fabricating patterned layer 10 includes the following steps (see fig. 6 a-6 g):
first, a photoresist layer 500 is coated on the surface of the body layer 16 (refer to fig. 6 b);
secondly, placing the prepared mask 400 in a shielding area for first ultraviolet exposure (refer to fig. 6 c);
third, a patterned photoresist layer 500 is left after the first development (see FIG. 6 d);
fourth, performing a second ultraviolet exposure on the patterned photoresist layer 500 (refer to fig. 6 e);
fifth, a film 700 is deposited on the patterned photoresist layer 500 and the surface of the body layer after the second uv exposure (refer to fig. 6 f);
a sixth step of leaving the body layer 16 and the patterned film layer 13 after the second development (refer to fig. 6 g);
wherein the pattern on the mask 400 is opposite to the target pattern.
Specifically, in one embodiment, in the step of depositing a film layer on the patterned photoresist layer 500 and the surface of the bulk layer after the second uv exposure, a vacuum coating method is used to deposit a film layer on the patterned photoresist layer 500 and the surface of the bulk layer.
The body layer 16 in the fourth embodiment is the planar body layer 17 in the second embodiment.
Example five
The invention also provides a tape using method, which comprises the following steps:
first, removing the release film 40 of the hydrophobic patterned adhesive tape 100;
second, positioning the hydrophobic patterned adhesive tape 100 and the member to be sealed 200;
thirdly, adhering the hydrophobic patterned adhesive tape 100 to the member to be sealed 200;
fourth, the hydrophobic protective layer 50 of the hydrophobic patterned adhesive tape 100 is removed.
Specifically, in one embodiment, the to-be-sealed member 200 is provided with the second positioning hole 202, and positioning the hydrophobic patterned adhesive tape 100 and the to-be-sealed member 200 includes the following steps:
first, aligning the first positioning hole 60 and the second positioning hole 202 on the hydrophobic patterned adhesive tape;
in the second step, a positioning pin is inserted into the second positioning hole 202 and the first positioning hole 60.
It should be noted that, the hydrophobic patterned adhesive tape 100 is prepared by a simple method (the preparation method in the third and fourth embodiments), and the patterned main material (the patterned layer 10) and the hydrophobic treatment of the surface realize the compensation effect on the height difference between the connecting parts (the two adjacent parts to be sealed 200), prevent external impurities such as particles, moisture and the like from entering the inside of the parts, avoid the leakage of liquid from the adjacent interfaces, and have application potential in the sealing and waterproof fields of the parts.
It should be noted that, the hydrophobic patterned adhesive tape 100 in the present application is used for sealing the gaps 300 between different components or the holes on the upper surfaces of the components, and the height difference between the different components (the height difference existing between the upper end surfaces 2011 of two adjacent components 200 to be sealed) can be compensated by the patterned design.
It should be noted that, the patterning design of the hydrophobic patterned tape 100 may be that a patterned film 13 is deposited on the host material (the patterned host layer 14 in the second embodiment) by photolithography, electroplating, vapor deposition, and the like (the method in the fourth embodiment). Patterned host material preparation may also be achieved by a template method (method in example three). The patterned body material (patterned body layer 14 in the first embodiment) and the shape of the bonding site form a complementary shape to compensate for the height difference of the bonding surfaces at different heights, thereby achieving an improvement in the flatness of the surface. The host material (patterned host layer 14) is prepared by spraying, vapor deposition, magnetron sputtering and other process methods to form a hydrophobic film layer 20 on the surface, and the hydrophobic film layer 20 is a composite film of polysiloxane, fluoroalkyl siloxane, fluoropolymer and nano particles thereof with low surface energy, and the thickness is from tens of nanometers to hundreds of nanometers. In order to avoid the hydrophobic surface from being damaged by external surfaces and from being polluted by particles, the hydrophobic surface is often covered with a thin transparent protective film. The other side of the patterned body layer 14 is covered with a layer of stable and highly adhesive glue 30 for the attachment of the tape. In addition, a release film layer 40 is further attached to the surface of the adhesive layer 30, so that the hydrophobic patterned adhesive tape 100 is easier to be detached and attached.
The prepared hydrophobic patterned adhesive tape 100 can be aligned and attached with the second positioning hole 202 of the bonded part (the part to be sealed 200) through the first positioning hole 60. As shown in fig. 3, there is a gap 300 between the bonded parts and there is a certain height difference. The pattern of the patterned main body layer 14 of the hydrophobic patterned adhesive tape 100 is designed according to the component gaps 300 or holes to be adhered, and the raised areas of the hydrophobic patterned adhesive tape 100 and the recessed areas of the bonding component are complemented, so that the two components are aligned and adhered through the positioning holes (the first positioning hole 60 and the second positioning hole 202), the release film layer 40 and the hydrophobic protective layer 50 are removed to tightly bond the hydrophobic patterned adhesive tape 100 on the component 200 to be sealed, and the surface with hydrophobic surface and higher flatness can be obtained.
The hydrophobic patterned adhesive tape 100 in the present application can solve the following technical problems:
1. the hydrophobic patterned adhesive tape 100 has hydrophobicity, a contact angle is larger than 90 degrees, and the problem that the surface is wetted by water is solved;
2. the hydrophobic patterned adhesive tape 100 can fill the hole defect on the surface of a single component, and solves the problem of leakage of liquid drops on the plane of the component;
3. the hydrophobic patterned adhesive tape 100 can realize the sealing between the components, and solves the problem of plane water leakage formed by two or more components;
4. the surface roughness value of the hydrophobic working table is very small, the surface height difference is required to be not more than 20um, and the patterning treatment of the hydrophobic patterned adhesive tape 100 can compensate for the small height difference.
In the description of the present invention, it should be understood that the terms "upper," "lower," "bottom," "top," "front," "rear," "inner," "outer," "left," "right," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways other than as described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.
Claims (10)
1. A hydrophobic patterned tape comprising:
a patterning layer having an upper surface and a lower surface, the patterning layer having a stepped structure; and
a hydrophobic film layer disposed on an upper surface of the patterned layer; and
a glue layer disposed on a lower surface of the patterned layer; and
the release film layer is arranged on the adhesive layer; and
and the hydrophobic protective layer is arranged on the hydrophobic film layer.
2. The hydrophobic patterned tape of claim 1, wherein the patterned layer comprises a patterned bulk layer.
3. The hydrophobic patterned tape of claim 1, wherein the patterned layer comprises a planar bulk layer and a patterned film layer disposed on the planar bulk layer.
4. A hydrophobic patterned adhesive tape according to any one of claims 1 to 3, wherein a first positioning hole is provided on the hydrophobic patterned adhesive tape, the first positioning hole penetrating through the hydrophobic protective layer, the first positioning hole being used for adhesive positioning of the hydrophobic patterned adhesive tape and a member to be sealed.
5. The hydrophobic patterned adhesive tape of claim 2, wherein the adhesive layer is a stepped plate structure comprising:
a first plate body;
one end of the second plate body is connected with the first plate body in a bending way; and
the third plate body is bent and connected with the other end of the second plate body; and
the first plate body and the third plate body are arranged in parallel and are respectively positioned at two sides of the second plate body which are oppositely arranged.
6. The hydrophobic patterned adhesive tape of claim 2, wherein the adhesive layer is a stepped plate structure comprising:
a first plate body; and
the second plate body is arranged in parallel with the first plate body, and the second plate body and the first plate body are staggered in the first direction.
7. A tape making method for making a hydrophobic patterned tape, the tape making method comprising:
manufacturing a patterning layer;
double-sided roughening of the patterned layer;
hydrophobizing the upper surface of the patterned layer to form a hydrophobic film layer;
a hydrophobic protective layer is attached to the hydrophobic surface of the hydrophobic film layer;
the lower surface of the patterning layer is adhered with glue to form a glue layer;
and a release film is attached to the adhesive surface of the adhesive layer to form a release film layer.
8. The method of manufacturing a tape according to claim 7, wherein manufacturing the patterned layer comprises the steps of:
coating a photoresist layer on the surface of the main body layer;
placing the prepared mask plate in a shielding area for first ultraviolet exposure;
leaving a patterned photoresist layer after the first development;
performing a second ultraviolet exposure on the patterned photoresist layer;
depositing a film layer on the surfaces of the patterned photoresist layer and the main body layer after the second ultraviolet exposure;
the bulk layer and the patterned film layer remain after the second development.
9. The method of claim 8, wherein in the step of depositing a film on the patterned photoresist layer and the surface of the main body layer after the second uv exposure, a vacuum coating method is used to deposit a film.
10. The method of manufacturing a tape according to claim 7, wherein manufacturing the patterned layer comprises the steps of:
coating a photoresist layer on a silicon wafer;
placing the prepared mask plate in a shielding area for ultraviolet exposure;
leaving a patterned photoresist layer on the developed silicon wafer;
inverting the template solution on the patterned photoresist layer and performing ultraviolet exposure;
the template solution is crosslinked and solidified to form a template;
tearing off the template and coating the solution of the patterning main body layer on the template;
and after the solution of the patterning main body layer is solidified, removing the template to obtain the patterning main body layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211030999.5A CN117659878A (en) | 2022-08-26 | 2022-08-26 | Hydrophobic patterned adhesive tape and manufacturing method thereof |
| PCT/CN2022/115895 WO2024040627A1 (en) | 2022-08-26 | 2022-08-30 | Hydrophobic patterned adhesive tape and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211030999.5A CN117659878A (en) | 2022-08-26 | 2022-08-26 | Hydrophobic patterned adhesive tape and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117659878A true CN117659878A (en) | 2024-03-08 |
Family
ID=90012250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211030999.5A Pending CN117659878A (en) | 2022-08-26 | 2022-08-26 | Hydrophobic patterned adhesive tape and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117659878A (en) |
| WO (1) | WO2024040627A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101474896B (en) * | 2009-01-21 | 2012-01-25 | 重庆大学 | Ultra-hydrophobic film of compound structure |
| JP6572018B2 (en) * | 2015-06-30 | 2019-09-04 | 東洋アルミエコープロダクツ株式会社 | Water-repellent adhesive laminate and adhesive tape using the same |
| CN109843391A (en) * | 2016-10-18 | 2019-06-04 | 3M创新有限公司 | Intumescent back-fire relief band construction |
| CN109957345B (en) * | 2017-12-26 | 2020-09-25 | 清华大学 | Hydrophobic membrane |
| CN211199097U (en) * | 2019-07-31 | 2020-08-07 | 江苏皇冠新材料科技有限公司 | Patterned adhesive tape |
| CN111410921A (en) * | 2020-05-02 | 2020-07-14 | 冯亿生 | Composite protective film |
| KR102392001B1 (en) * | 2020-05-29 | 2022-04-28 | 주식회사 영우 | Waterproof tape having improved stepped adhesion |
-
2022
- 2022-08-26 CN CN202211030999.5A patent/CN117659878A/en active Pending
- 2022-08-30 WO PCT/CN2022/115895 patent/WO2024040627A1/en unknown
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| WO2024040627A1 (en) | 2024-02-29 |
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