CN117650089B - Substrate Carrier - Google Patents
Substrate Carrier Download PDFInfo
- Publication number
- CN117650089B CN117650089B CN202311759249.6A CN202311759249A CN117650089B CN 117650089 B CN117650089 B CN 117650089B CN 202311759249 A CN202311759249 A CN 202311759249A CN 117650089 B CN117650089 B CN 117650089B
- Authority
- CN
- China
- Prior art keywords
- upper cover
- positioning
- substrate carrier
- pressing plates
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 40
- 238000003825 pressing Methods 0.000 claims abstract description 26
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a base plate carrier, includes download board, upper cover, presses respectively a plurality of clamp plates of base plate in the corresponding constant head tank and is in under the magnetic force effect of magnet carry out spacing locating part of top of clamp plate, the upper surface of download board has a plurality of constant head tanks that are used for placing the base plate, and the lower surface is equipped with magnet, the download board has the first location structure that is used for installing the upper cover, the upper cover have with the second location structure of first location structure adaptation, the quantity of clamp plate with the quantity of constant head tank is the same, the upper cover has a plurality of through-holes that supply a plurality of clamp plates contact the base plate that corresponds, a plurality of through-holes with a plurality of constant head tanks upper and lower one-to-one, a plurality of clamp plates inlay in the through-hole that corresponds, the locating part is fixed in the upper cover. According to the substrate carrier, the substrates corresponding to the substrates are pressed by the pressing plates one by one through magnetic force, so that the stability and the precision of the carrier are improved, and the product yield is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor processing, and particularly relates to a substrate carrier.
Background
In the semiconductor industry, a substrate carrier is used for supporting, protecting and positioning a substrate in the processes of chip mounting, reflow, cleaning, detecting, packaging and the like, so that a semiconductor chip or other semiconductor devices perform packaging operation on the substrate, and stability and precision of the substrate in the processes of processing, testing and packaging are ensured in the semiconductor manufacturing process.
The existing substrate carrier consists of a downloading plate and an upper cover, and the working principle is as follows: after one or more substrates are placed on the downloading plate for positioning, the upper cover compresses the substrates through the magnetic force of the magnet embedded in the back of the downloading plate, so that the substrates are positioned and fastened on the carrier.
However, in practical applications, when the precision of the carrier or the precision of the substrate itself is affected, a gap is generated between a part of the substrate and the upper cover, so that the situation of loose pressing occurs, and finally defective products are caused.
Disclosure of Invention
In view of the above, a substrate carrier is provided.
The technical scheme adopted by the invention is as follows:
The utility model provides a base plate carrier, includes download board and upper cover, the upper surface of download board has a plurality of constant head tanks that are used for placing the base plate, and the lower surface is equipped with magnet, the download board has the first location structure that is used for installing the upper cover, the upper cover have with the second location structure of first location structure adaptation, its characterized in that still includes respectively under the magnetic force effect of magnet push down a plurality of clamp plates of base plate in the corresponding constant head tank and carry out spacing locating part in the top of clamp plate, the quantity of clamp plate with the quantity of constant head tank is the same, the upper cover has a plurality of through-holes that supply a plurality of clamp plates contact the base plate that corresponds, a plurality of through-holes with a plurality of constant head tanks upper and lower one-to-one, a plurality of clamp plates inlay in the through-hole that corresponds, the locating part is fixed in on the upper cover.
According to the substrate carrier, the substrate is not pressed by the single upper cover through magnetic force as in the prior art, but is pressed by the plurality of pressing plates through magnetic force, so that the condition of loose pressing caused by the fact that part of the substrate is not attached to the upper cover in the prior art is avoided, the stability and the precision of the carrier are improved, and the product yield is improved.
Drawings
The invention is described in detail below with reference to the attached drawings and detailed description:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is a vertical cross-sectional view of the present invention.
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. The embodiments described in the present specification are not intended to be exhaustive or to represent the only embodiments of the present invention. The following examples are presented for clarity of illustration of the invention of the present patent and are not intended to limit the embodiments thereof. It will be apparent to those skilled in the art that various changes and modifications can be made in the embodiment described, and that all the obvious changes or modifications which come within the spirit and scope of the invention are deemed to be within the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a substrate carrier, which includes a downloading plate 110, an upper cover 120, a plurality of pressing plates 130 and a limiting member 140.
As shown in fig. 2, the upper surface of the download plate 110 has a plurality of positioning grooves 111 for placing the substrate 2, and the lower surface is provided with a magnet 112, see fig. 3.
As shown in fig. 2, the downloading plate 110 has a first positioning structure 113 for mounting the upper cover 120, the upper cover 120 has a second positioning structure 121 adapted to the first positioning structure 113, and illustratively, the first positioning structure 113 may be a plurality of positioning pins and are uniformly distributed on the edge of the downloading plate 110, and the second positioning structure 121 may be positioning holes, the number and positions of which correspond to the positioning pins.
As shown in fig. 2, the upper cover 120 has a plurality of through holes 122, and the plurality of through holes 122 are vertically in one-to-one correspondence with the plurality of positioning grooves 111.
The number of the pressing plates 130 is the same as that of the positioning grooves 111, as shown in fig. 1, a plurality of pressing plates 130 are embedded in the corresponding through holes 122, for example, a circle of limiting steps 122a are formed on the inner wall of the through hole 122, edges 131 matched with the limiting steps 122a are formed on the periphery of the pressing plates 130, and the pressing plates 130 are embedded in the corresponding through holes 122 through the edges 131 and the limiting steps 122a, see fig. 3.
As shown in fig. 3, after the substrate 2 is placed in the positioning slot 111, the upper surface of the substrate is slightly higher than the positioning slot 111, the pressing plates 130 are made of magnetic metal, and the plurality of pressing plates 130 can respectively contact with the substrate 2 in the corresponding positioning slot 111 through the plurality of through holes 122 and respectively press the corresponding substrate 2 under the action of the magnetic force of the magnet 112.
In this embodiment, the through holes 122 are coincident with the center lines of the corresponding positioning slots 111, the pressing plates 130 are in a shape of a Chinese character 'hui', the inner ring of which is smaller than the size of the positioning slots 111 (the length and width of the inner ring are smaller than the length and width of the positioning slots 111 respectively), the outer ring of which is larger than the size of the positioning slots 111 (the length and width of the outer ring are larger than the length and width of the positioning slots 111 respectively), the number of the magnets 112 is plural, and the plural magnets are embedded in the lower surface of the downloading plate 110 in a shape of Chinese character 'hui' corresponding to each pressing plate 130, see fig. 3.
As shown in fig. 1 and 2, the limiting member 140 is used for limiting above the pressing plate 130, and is fixed to the upper cover 120. In the present embodiment, the limiting member 140 includes a plurality of limiting bars 141, and the plurality of limiting bars 141 are located above the edges of the plurality of pressing plates 130 and are fixed to the upper cover 120 by bolts 142.
Illustratively, the plurality of positioning slots 4*2 are arranged in a matrix, the plurality of pressing plates 130 are also arranged in a matrix 4*2, the number of the limit bars 141 is 3, and the 3 limit bars 141 are respectively arranged above the left and right edges of the two rows of pressing plates and are fixed with the upper cover 120 through a plurality of uniformly distributed bolts 142.
As can be seen from the above, the substrate carrier provided in the embodiment of the invention does not compress the substrate by a single upper cover through magnetic force as in the prior art, but compresses the substrate corresponding to the substrate one by one through magnetic force by a plurality of pressing plates respectively, so that the condition of loose compression caused by the fact that part of the substrate is not attached to the upper cover in the prior art is avoided, the stability and the precision of the carrier are improved, and the product yield is improved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (6)
1. The substrate carrier comprises a downloading plate and an upper cover, wherein the upper surface of the downloading plate is provided with a plurality of positioning grooves for placing substrates, the lower surface of the downloading plate is provided with a magnet, the downloading plate is provided with a first positioning structure for installing the upper cover, and the upper cover is provided with a second positioning structure matched with the first positioning structure;
the pressing plates are made of magnetic metal, the magnets are arranged in a shape like a Chinese character 'hui', and the pressing plates can be respectively contacted with the substrates in the corresponding positioning grooves through the through holes and respectively press the corresponding substrates under the action of magnetic force of the magnets.
2. The substrate carrier of claim 1, wherein the plurality of positioning slots are arranged in a matrix.
3. The substrate carrier of claim 1, wherein the first positioning structure is a positioning pin and the second positioning structure is a positioning hole.
4. The substrate carrier of claim 1, wherein the inner wall of the through hole forms a circle of limiting step, and the periphery of the pressing plate forms an edge adapted to the limiting step.
5. The substrate carrier of claim 1, wherein the through holes are coincident with the center lines of the corresponding positioning grooves, the pressing plates are in a shape of a Chinese character 'hui', the inner ring size of the pressing plates is smaller than the size of the positioning grooves, the outer ring size of the pressing plates is larger than the size of the positioning grooves, the number of the magnets is multiple, and the magnets are arranged in a shape of a Chinese character 'hui' corresponding to each pressing plate.
6. The substrate carrier of claim 1, wherein the limiting member comprises a plurality of limiting bars, the plurality of limiting bars are located above edges of the plurality of pressing plates and are fixed with the upper cover by bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311759249.6A CN117650089B (en) | 2023-12-20 | 2023-12-20 | Substrate Carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311759249.6A CN117650089B (en) | 2023-12-20 | 2023-12-20 | Substrate Carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117650089A CN117650089A (en) | 2024-03-05 |
| CN117650089B true CN117650089B (en) | 2024-07-12 |
Family
ID=90043309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311759249.6A Active CN117650089B (en) | 2023-12-20 | 2023-12-20 | Substrate Carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117650089B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106148908A (en) * | 2015-03-27 | 2016-11-23 | 明兴光电股份有限公司 | Carrier tool |
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130134209A1 (en) * | 2011-11-29 | 2013-05-30 | Cheng Uei Precision Industry Co., Ltd. | Carrier for circuit board |
| CN208352267U (en) * | 2018-07-05 | 2019-01-08 | 上海世禹精密机械有限公司 | The smooth carrier of semiconductor substrate |
| TWI760143B (en) * | 2021-03-12 | 2022-04-01 | 元啓精密科技股份有限公司 | Storage damping device for semiconductor automated logistics conveying system |
| TWM621524U (en) * | 2021-09-01 | 2021-12-21 | 豪傑長宏科技有限公司 | Compound closed-type metal lid for semiconductor chip package |
| KR102693487B1 (en) * | 2021-11-17 | 2024-08-08 | 주식회사 에이치앤이루자 | Carrier Module for Inline Deposition Apparatus |
| CN220121817U (en) * | 2023-06-30 | 2023-12-01 | 苏州通富超威半导体有限公司 | Substrate magnetic carrier and semiconductor manufacturing equipment |
-
2023
- 2023-12-20 CN CN202311759249.6A patent/CN117650089B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106148908A (en) * | 2015-03-27 | 2016-11-23 | 明兴光电股份有限公司 | Carrier tool |
| CN116364563A (en) * | 2023-03-17 | 2023-06-30 | 无锡美科微电子技术有限公司 | Display screen substrate covering method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117650089A (en) | 2024-03-05 |
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