CN117644526A - Semiconductor packaging grabbing manipulator - Google Patents
Semiconductor packaging grabbing manipulator Download PDFInfo
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- CN117644526A CN117644526A CN202410109359.6A CN202410109359A CN117644526A CN 117644526 A CN117644526 A CN 117644526A CN 202410109359 A CN202410109359 A CN 202410109359A CN 117644526 A CN117644526 A CN 117644526A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 84
- 238000004806 packaging method and process Methods 0.000 title abstract description 10
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 238000009423 ventilation Methods 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 19
- 238000005192 partition Methods 0.000 claims description 11
- 238000009434 installation Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention relates to the technical field of semiconductor packaging and discloses a semiconductor packaging grabbing manipulator which comprises a base, wherein the top of the base is provided with a positioning mechanism, the positioning mechanism comprises a second swing arm, the top of the second swing arm is rotationally connected with a mounting frame, the top of the positioning mechanism is provided with a vacuum pump, the vacuum pump is fixedly arranged at the top of the mounting frame, the output end of the vacuum pump is fixedly connected with an air cavity shell, the inside of the air cavity shell is provided with a driving mechanism, the driving mechanism comprises a driving pipe which is slidingly connected inside the air cavity shell, one side of the driving pipe is provided with a suction mechanism, the semiconductor packaging manipulator can suck semiconductors more accurately by arranging the mechanisms, and a suction cylinder which is not used can be separated, so that the suction force of suction is improved, and the suction of the semiconductor is more stable.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging grabbing manipulator.
Background
A manipulator is an automatic operating device that mimics certain motion functions of a human hand and arm for grasping, handling objects or operating tools in a fixed program. The method is characterized in that various expected operations can be completed through programming, the structure and the performance of the method have the advantages of people and a mechanical hand device, and the mechanical hand is an industrial robot which appears earliest and a modern robot which appears earliest, can replace heavy labor of people to realize mechanization and automation of production, can operate under harmful environments to protect personal safety, and is widely applied to departments of mechanical manufacture, metallurgy, electronics, light industry, atomic energy and the like.
Through mass search, it is found that the prior art publication number is CN102569148A, a semiconductor packaging equipment grabbing manipulator system is disclosed, including mechanical tongs device, snatch cylinder device and clamp plate buffer device mechanical tongs device includes guide arm fixed block, claw, guide arm, first spring, tongs fixed block, snatch cylinder device includes gas claw, slide rail fixed block and slide rail, clamp plate buffer device includes base plate, guiding axle, third spring, guiding axle fixed plate, stop piece, linear bearing, clamp plate and clamp plate are fixed, make simple structure, do not occupy the space, can adapt to the semiconductor product of certain width and thickness, do not need doing any change and adjustment when processing the product of different varieties but in actual use, although can adapt to the semiconductor product of certain width and thickness, but can't follow the semiconductor size and change, and can not carry out accurate placement with the semiconductor, so we propose a semiconductor packaging grabbing manipulator.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a semiconductor packaging grabbing manipulator which has the advantages of and the like and solves the series of problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a semiconductor package snatchs manipulator, includes the base, the top of base is provided with positioning mechanism, positioning mechanism includes the second swing arm, the top of second swing arm rotates and is connected with the mounting bracket, positioning mechanism's top is provided with the vacuum pump, vacuum pump fixed mounting is at the top of mounting bracket, the output fixedly connected with air cavity shell of vacuum pump, the inside of air cavity shell is provided with actuating mechanism, actuating mechanism includes the actuating tube of sliding connection in the inside of air cavity shell, one side of actuating tube is provided with suction mechanism;
the utility model discloses a suction mechanism, including being linked together at the go-between of actuating tube one end, the one end of go-between is linked together has the collar, the inside of collar is provided with and absorbs the ring, it is provided with a plurality of to absorb the ring, and a plurality of absorbs the ring and slide in proper order and cup joint, the inside of actuating tube is provided with the sliding shell, the sliding shell is provided with the three, and is the circumference and arranges, the inside of three sliding shell all sliding connection has the spring leaf, the one end fixed connection of three spring leaf is in a department, the equal fixedly connected with spacing in top of a plurality of absorption rings, the outside at corresponding three spring leaf of a plurality of equal sliding connection of a plurality of spacing, a plurality of mounting holes have all been seted up to the bottom of a plurality of absorption rings, a plurality of mounting holes are the circumference and are arranged, a plurality of mounting holes all communicate with the actuating tube mutually, and the inside of a plurality of mounting holes all is provided with the suction cylinder.
Preferably, the plurality of suction barrels are all in sliding connection in the interiors of corresponding mounting holes, the mounting grooves are all formed in the interiors of the plurality of mounting holes, and the interiors of the plurality of mounting grooves are all in sliding connection with two sealing baffles.
Preferably, the inside of a plurality of mounting grooves all is provided with two sealing springs, and the one end homogeneous phase intercommunication of a plurality of suction drums has first ventilation piece, and the one end of a plurality of first ventilation pieces is the toper and arranges.
Preferably, one end of each of the three spring pieces is fixedly connected with the same connecting rod, one end of each connecting rod is fixedly connected with a ventilation partition, and a plurality of first ventilation holes are formed in the top of each ventilation partition.
Preferably, the ventilation barrier is slidably connected to the inside of the driving tube, and three second ventilation holes are formed in the outside of the mounting ring.
Preferably, the driving mechanism further comprises a first gear ring fixedly and rotatably connected to one side of the air cavity shell, and the driving pipe is in threaded connection with the inside of the first gear ring.
Preferably, a first driving motor is fixedly arranged outside the air cavity shell, and the output end of the first driving motor is fixedly connected with a first gear.
Preferably, the positioning mechanism further comprises a first swing arm, the first swing arm is rotatably connected to the top of the base, and the second swing arm is rotatably connected to the top of the first swing arm.
Compared with the prior art, the invention provides the semiconductor package grabbing manipulator which has the following beneficial effects:
1. this manipulator is snatched in semiconductor encapsulation through the suction means and the actuating mechanism that set up for can absorb more accurate semiconductor, and select suitable absorption size can encapsulate more accurate semiconductor, separate the suction tube that does not use simultaneously, improve the suction of suction, make the absorption of semiconductor more stable.
2. This manipulator is snatched to semiconductor encapsulation through position sensor, third gas vent, second driving motor, second gear and the second ring gear of setting for can control the suction that the semiconductor was taken, make can use suitable suction to absorb the semiconductor, prevent to cause the damage because of the too big semiconductor of suction, prevent simultaneously because of the too little in-process that makes the semiconductor drop of suction in carrying.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of a mounting bracket portion of the present invention;
FIG. 3 is a schematic view of the internal structure of the air cavity shell portion of the present invention;
FIG. 4 is a schematic view of a spacing block according to the present invention;
FIG. 5 is an enlarged schematic view of portion A of FIG. 3;
FIG. 6 is a schematic view of the structure of the suction barrel portion of the present invention;
FIG. 7 is a schematic view of the construction of a second ring gear portion of the present invention;
FIG. 8 is a schematic view of the structure of the suction spring portion of the present invention;
FIG. 9 is a schematic view of the structure of the retainer plate portion of the present invention;
FIG. 10 is an enlarged schematic view of portion A of FIG. 8;
fig. 11 is a schematic structural view of a second air block portion of the present invention.
In the figure: 1. a base; 2. a first swing arm; 3. a second swing arm; 4. a mounting frame; 5. a vacuum pump; 6. an air cavity case; 7. a driving tube; 8. a connecting ring; 9. a mounting ring; 10. a suction ring; 11. a sliding housing; 12. a spring piece; 13. a limiting frame; 14. a mounting hole; 15. a suction tube; 16. a sliding groove; 17. a sliding block; 18. a chute; 19. a slide block; 20. a mounting groove; 21. a sealing baffle; 22. a seal spring; 23. a first ventilation block; 24. a connecting rod; 25. ventilation partition; 26. a first vent hole; 27. a second vent hole; 28. a first ring gear; 29. an arc groove; 30. arc blocks; 31. a first driving motor; 32. a first gear; 33. a limiting ring plate; 34. sucking a spring; 35. a second ventilation block; 36. a position sensor; 37. a third vent hole; 38. an avoidance groove; 39. a second driving motor; 40. a second gear; 41. and a second ring gear.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As described in the background art, the present application provides a semiconductor package grabbing manipulator for solving the above technical problems.
Example 1: as shown in fig. 1-3, a semiconductor package grabbing mechanical arm comprises a base 1, the top of the base 1 is provided with a positioning mechanism for accurately positioning a semiconductor, the positioning mechanism comprises a first swing arm 2, the first swing arm 2 is rotationally connected to the top of the base 1, the top of the first swing arm 2 is rotationally connected with a second swing arm 3, the top of the second swing arm 3 is rotationally connected with a mounting rack 4, the top of the positioning mechanism is provided with a kinetic energy equipment vacuum pump 5 for sucking the semiconductor, the vacuum pump 5 is fixedly arranged at the top of the mounting rack 4, the movement direction and the position of the vacuum pump 5 can be controlled through the positioning mechanism, the accurate control of the semiconductor position is facilitated, the output end of the vacuum pump 5 is fixedly connected with an air cavity shell 6, the inside of the air cavity shell 6 is provided with a driving mechanism for controlling the semiconductor sucking range according to the size of the semiconductor, the driving mechanism comprises a driving pipe 7 which is slidingly connected to the inside of the air cavity shell 6, in particular, four sliding grooves 18 are formed in the inside of the air cavity shell 6, the four sliding grooves 18 are fixedly connected with four sliding blocks 19, the four sliding blocks 19 are circumferentially arranged on the outside of the driving pipe 7, and the four sliding blocks 19 are circumferentially arranged, and the four sliding grooves 19 are circumferentially arranged on the driving pipe 19 are circumferentially arranged and are circumferentially connected to the driving pipe corresponding to the driving pipe 18 and are respectively and can suck the semiconductor;
the suction mechanism comprises a connecting ring 8 communicated with one end of a driving pipe 7, one end of the connecting ring 8 is communicated with a mounting ring 9, suction rings 10 are arranged in the mounting ring 9, a plurality of suction rings 10 are arranged, the suction rings 10 are sequentially and slidably sleeved, sliding shells 11 are arranged in the driving pipe 7, the sliding shells 11 are arranged in three and are circumferentially arranged, spring pieces 12 are slidably connected in the three sliding shells 11, in particular, the suction rings 10 can be fixed through the three arranged spring pieces 12, the suction rings 10 are mutually sleeved and are in conical arrangement, one ends of the three spring pieces 12 are fixedly connected at one position, the tops of the suction rings 10 are fixedly connected with limiting frames 13, the limiting frames 13 are slidably connected outside the corresponding three spring pieces 12, so that the plurality of suction rings 10 can be indirectly controlled to sequentially move through bending of the three spring pieces 12, as shown in fig. 5, the bottoms of the plurality of suction rings 10 are respectively provided with a plurality of mounting holes 14, the plurality of mounting holes 14 are circumferentially arranged, the plurality of mounting holes 14 are respectively communicated with the driving tube 7, suction drums 15 are respectively arranged inside the plurality of mounting holes 14, when a semiconductor is required to be sucked, the suction ring 10 on one side is firstly contacted with the surface of the semiconductor, when a single semiconductor with a large area is sucked, the driving tube 7 moves downwards, as one end of the suction ring 10 is contacted with the semiconductor, and one end of the suction ring 10 is slidingly connected with the outside of the corresponding spring piece 12, at the moment, the three spring pieces 12 are bent, and the three spring pieces 12 are slidingly connected inside the corresponding sliding shell 11, so that the plurality of suction rings 10 are sequentially slidingly arranged inside the corresponding suction ring 10, one end of the plurality of suction drums 15 is contacted with the surface of the single semiconductor with a large area, so that the large-area conductor can be sucked, and the situation that the semiconductor is broken and damaged when the large-area semiconductor is sucked due to the small suction area is avoided.
The plurality of suction drums 15 are all connected in a sliding way in the corresponding mounting holes 14, the sliding grooves 16 are formed in the inner parts of the specific mounting holes 14, the sliding grooves 16 are formed in two and are circumferentially arranged, the sliding blocks 17 are fixedly connected to the outer parts of the suction drums 15, the sliding blocks 17 are arranged in two and are circumferentially arranged, the two sliding blocks 17 are all connected in the inner parts of the corresponding sliding grooves 16 in a sliding way, the mounting grooves 20 are all formed in the inner parts of the mounting holes 14, the two sealing baffles 21 are all connected in a sliding way in the inner parts of the mounting grooves 20, the opposite sides of the two sealing baffles 21 are particularly arranged in an arc way, more particularly, the two sealing baffles 21 separate the inner parts of the mounting holes 14 into two separated chambers, so that gas of the two chambers does not flow mutually, the two sealing springs 22 are all arranged in the inner parts of the mounting grooves 20, one ends of the two sealing springs 22 are all fixedly connected to the two sides of the mounting grooves 20, the other ends of the two sealing springs 22 are fixedly connected to one side of the corresponding sealing baffle plates 21, so that the two sealing baffle plates 21 are in a tight state under the action of no external force, one ends of the plurality of suction cylinders 15 are communicated with the first ventilation blocks 23, one ends of the plurality of first ventilation blocks 23 are arranged in a conical shape, so that when a semiconductor is sucked, the driving tube 7 moves to move one side of the plurality of suction rings 10 to the top of the semiconductor, one end of the suction cylinder 15 in the corresponding suction ring 10 is contacted with the surface of the semiconductor, the driving tube 7 continues to move downwards due to the thickness of the semiconductor, the suction cylinder 15 slides in the mounting hole 14 and is arranged in a conical shape through the first ventilation blocks 23, the opposite sides of the two sealing baffle plates 21 are arranged in an arc shape, the first ventilation blocks 23 jack the two sealing baffle plates 21 open, the internal chamber of the suction tube 15 in contact with the semiconductor is made to communicate with the internal chamber of the drive tube 7, so that the semiconductor of different shapes can be sucked by starting the vacuum pump 5, and the unused suction tube 15 is blocked from the chamber of the drive tube 7, so that the suction force of the chamber is increased.
As shown in fig. 3, one end of three spring pieces 12 is fixedly connected with the same connecting rod 24, one end of the connecting rod 24 is fixedly connected with a ventilation partition 25, specifically, the ventilation partition 25 divides the inner part of 7 into two chambers, the ventilation partition 25 is slidably connected in the driving tube 7, a plurality of first ventilation holes 26 are formed in the top of the ventilation partition 25, three second ventilation holes 27 are formed in the outer part of the mounting ring 9, the three second ventilation holes 27 are circumferentially arranged, so that the vacuum pump 5 is started, part of air flow enters one side of the ventilation partition 25 through the second ventilation holes 27 and enters the vacuum pump 5 through the first ventilation holes 26, the air pressures at two sides of the ventilation partition 25 are different through the air flow, bending forces of the three spring pieces 12 can be attenuated through the ventilation partition 25, and damage to semiconductors in the suction process due to overlarge bending moment force of one end caused by bending of the three spring pieces 12 from one end is avoided.
The driving mechanism further comprises a first gear ring 28 fixedly and rotatably connected to one side of the air cavity shell 6, specifically, an arc groove 29 is formed in one side of the driving tube 7, an arc block 30 is fixedly connected to one side of the first gear ring 28, the arc block 30 is rotatably connected to the inside of the arc groove 29, the driving tube 7 is in threaded connection with the inside of the first gear ring 28, the first gear ring 28 is enabled to rotate to drive the driving tube 7 to slide, a first driving motor 31 is fixedly arranged on the outside of the air cavity shell 6, the output end of the first driving motor 31 is fixedly connected with a first gear 32, the first gear 32 is meshed with the first gear ring 28, the driving tube 7 can be driven to slide in the air cavity shell 6 by starting the first driving motor 31, and the sucking mechanism can be indirectly controlled to suck semiconductors with different sizes.
Example 2: as shown in fig. 7 and 8, the basis of the combination embodiment 1 is different in that one sides of the plurality of suction rings 10 are fixedly connected with the limiting ring plate 33, the bottoms of the plurality of limiting ring plates 33 are fixedly connected with the suction springs 34, the bottoms of the plurality of suction springs 34 are fixedly connected with the tops of the corresponding suction rings 10, specifically, the elastic potential energy of the plurality of suction springs 34 is gradually increased from one side, so that when the semiconductor is sucked, the plurality of suction springs 34 are gradually compressed in sequence, so that semiconductors with different sizes can be sucked, and due to the fact that the packaged semiconductor housing is smaller, the proper suction area is selected, and the accuracy of the package can be improved.
The outside of collar 9 has seted up the third gas vent 37, dodge groove 38 has been seted up to one side of go-between 8, dodge the inside fixed mounting in groove 38 has second driving motor 39, the output fixedly connected with second gear 40 of second driving motor 39, the outside rotation of collar 9 is connected with second ring gear 41, second ring gear 41 meshes with second gear 40 mutually, second ring gear 41 and third gas vent 37 looks adaptation, make through driving second driving motor 39, second gear 40 drives second ring gear 41 rotation, thereby can increase or reduce the suction of a plurality of suction drums 15 semiconductor of control, avoid damaging because of the too big semiconductor of suction, avoid simultaneously because of the suction is too little to lead to the semiconductor to drop.
As shown in fig. 10 and 11, one end of the suction tube 15 is connected to the second vent block 35, the second vent block 35 slides inside the mounting hole 14, the position sensor 36 is fixedly mounted on the top of the suction ring 10 on one side, the position sensor 36 is specifically used for detecting the portion of the second vent block 35 extending out of the inside of the mounting hole 14, when the semiconductor of any size is sucked, the second vent block 35 is firstly moved from one side of the suction ring 10, so that one end of the suction tube 15 is in contact with the semiconductor, the suction tube 15 slides inside the mounting hole 14, the second vent block 35 extends outside the suction ring 10, at this time, the position sensor 36 is turned on, the second vent block 35 is detected, and the suction tube 15 is not directly separated from the semiconductor when the suction force is small in the process of sucking the semiconductor, because the suction tube 15 is not enough to slide inside the mounting hole 14, at this time, the position sensor 36 detects the second vent block 35 to move downwards, the second drive motor 39 is started, the second gear ring 41 rotates to reduce the gas flow, so that the semiconductor is prevented from dropping off during the process, and damage to the semiconductor is prevented from being caused by the suction force due to the suction.
The working principle of the invention is as follows: when the semiconductor is required to be sucked and packaged, as shown in fig. 1, the positioning mechanism is started first, so that the suction mechanism is vertical and is close to the upper surface of the semiconductor, as shown in fig. 2, at this time, the first driving motor 31 is started, the output end of the first driving motor 31 drives the first gear 32 to rotate, the first gear 32 rotates to drive the first gear ring 28 to rotate, and as the first gear ring 28 is in threaded connection with the driving tube 7, and the driving tube 7 is in sliding connection with the inside of the air cavity shell 6 to limit the driving tube 7, so that the first gear ring 28 rotates to drive the driving tube 7 to slide, the driving tube 7 slides to drive the suction mechanism to gradually approach the semiconductor, at this time, one end of the suction tube 15 in the suction ring 10 at the forefront end is contacted with the semiconductor, as shown in fig. 5, so that the suction tube 15 slides in the inside of the mounting hole 14, and simultaneously two sliding blocks 17 outside the suction tube 15 slide in the corresponding sliding grooves 16, limiting the suction tube 15, when the suction tube 15 slides to one side of the mounting hole 14, since one side of the first ventilation block 23 is arranged in a conical shape and the opposite sides of the two sealing baffles 21 are arranged in an arc shape, the first ventilation block 23 pushes the two sealing baffles 21 open, so that the two sealing springs 22 are compressed, the two sealing baffles 21 slide in the mounting groove 20, at the moment, the inner cavity of the suction tube 15 is communicated with the inner cavity of the driving tube 7, and when the large semiconductor is sucked, the semiconductor is broken and damaged only by one suction tube 15 because the semiconductor is fragile and thin, as shown in fig. 3, at the moment, the driving tube 7 continues to move to bend the three spring pieces 12, so that the suction ring 10 sleeved outside the suction ring 10 moves downwards to suck the large semiconductor, one end of the three spring pieces 12 slides in the corresponding sliding shell 11 in the bending process of the three spring pieces 12, the movement potential energy of the three spring pieces 12 after bending is relieved, one side of the three spring pieces 12 is diffused all around, the suction rings 10 are supported, and the limiting frame 13 at the top of the corresponding suction ring 10 slides downwards due to the diffusion of the three spring pieces 12 around, so that more suction cylinders 15 are in contact with the surface of the large semiconductor, when the required suction quantity and area are reached, the vacuum pump 5 is started, so that air in the driving pipe 7 is extracted, the large semiconductor is sucked, the suction cylinders 15 are not contacted with the semiconductor in the suction process, the semiconductor does not slide in the installation holes 14, the suction cylinders 15 are not communicated with the driving pipe 7, the suction cylinders 15 which are not contacted with the semiconductor are isolated from the driving pipe 7 through the sealing baffle 21 when the air in the driving pipe 7 is extracted, the suction cylinders 15 which are contacted with the semiconductor are reduced, the suction volume of the driving pipe 7 is increased, meanwhile, the two-way air flow into the two sides 25 through the first through the driving pipe 27 is prevented from entering the suction holes 25, the suction holes 25 are prevented from being damaged, and the negative pressure 25 is prevented from entering the other side 25 through the suction holes 25, and the suction force is reduced, and the negative pressure is prevented from entering the other side 25 through the suction holes 25.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a manipulator is snatched in semiconductor package, includes base (1), its characterized in that: the top of base (1) is provided with positioning mechanism, positioning mechanism includes second swing arm (3), the top of second swing arm (3) rotates and is connected with mounting bracket (4), positioning mechanism's top is provided with vacuum pump (5), vacuum pump (5) fixed mounting is at the top of mounting bracket (4), the output fixedly connected with air cavity shell (6) of vacuum pump (5), the inside of air cavity shell (6) is provided with actuating mechanism, actuating mechanism includes drive tube (7) of sliding connection in air cavity shell (6) inside, one side of drive tube (7) is provided with suction mechanism;
the utility model provides a suction means is including being linked together go-between (8) in drive tube (7) one end, the one end of go-between (8) is linked together there is collar (9), the inside of collar (9) is provided with suction ring (10), suction ring (10) are provided with a plurality of, and a plurality of suction ring (10) slide in proper order and cup joint, the inside of drive tube (7) is provided with sliding shell (11), sliding shell (11) are provided with three, and are circumference arrangement, the inside of three sliding shell (11) all sliding connection has spring piece (12), the one end fixed connection of three spring piece (12) is in a department, the equal fixedly connected with spacing (13) in top of a plurality of suction ring (10), the outside at corresponding three spring piece (12) of a plurality of equal sliding connection of spacing (13), a plurality of mounting holes (14) have all been seted up to the bottom of a plurality of suction ring (10), a plurality of mounting holes (14) are circumference arrangement, a plurality of mounting holes (14) all are linked together with drive tube (7), the inside of a plurality of mounting holes (14) all is provided with suction cylinder (15).
2. The semiconductor package gripping robot of claim 1, wherein: the plurality of suction drums (15) are all connected in a sliding manner in the corresponding installation holes (14), the installation grooves (20) are all formed in the installation holes (14), and two sealing baffles (21) are all connected in the installation grooves (20) in a sliding manner.
3. The semiconductor package gripping robot of claim 2, wherein: the inside of a plurality of mounting grooves (20) all is provided with two seal springs (22), and the one end homogeneous phase of a plurality of suction drums (15) is linked together has first ventilation piece (23), and the one end of a plurality of first ventilation pieces (23) all is the toper and arranges.
4. The semiconductor package gripping robot of claim 1, wherein: one end fixedly connected with same connecting rod (24) of three spring leaf (12), the one end fixedly connected with of connecting rod (24) is ventilated and is separated (25), a plurality of first air vents (26) have been seted up at the top that ventilates separates (25).
5. The semiconductor package gripping robot of claim 4, wherein: the ventilation partition (25) is slidably connected to the inside of the driving pipe (7), and three second ventilation holes (27) are formed in the outside of the mounting ring (9).
6. The semiconductor package gripping robot of claim 1, wherein: the driving mechanism further comprises a first gear ring (28) fixedly and rotatably connected to one side of the air cavity shell (6), and the driving tube (7) is in threaded connection with the inside of the first gear ring (28).
7. The semiconductor package gripping robot of claim 6, wherein: the air cavity shell (6) is fixedly provided with a first driving motor (31), and the output end of the first driving motor (31) is fixedly connected with a first gear (32).
8. The semiconductor package gripping robot of claim 1, wherein: the positioning mechanism further comprises a first swing arm (2), the first swing arm (2) is rotationally connected to the top of the base (1), and the second swing arm (3) is rotationally connected to the top of the first swing arm (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202410109359.6A CN117644526B (en) | 2024-01-26 | 2024-01-26 | Semiconductor packaging grabbing manipulator |
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| CN202410109359.6A CN117644526B (en) | 2024-01-26 | 2024-01-26 | Semiconductor packaging grabbing manipulator |
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| CN117644526B CN117644526B (en) | 2024-04-05 |
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| CN113487795A (en) * | 2021-07-02 | 2021-10-08 | 武汉诺得佳科技有限公司 | Automatic unmanned retail equipment based on intelligent robot |
| CN217263195U (en) * | 2021-12-28 | 2022-08-23 | 东莞市博一家具有限公司 | Negative pressure adjustable sucking disc formula manipulator tool |
| CN114589726A (en) * | 2022-04-26 | 2022-06-07 | 深圳市康润机电技术开发有限公司 | Negative pressure adsorption type grabbing structure and industrial robot |
| CN117001629A (en) * | 2023-07-17 | 2023-11-07 | 江西省江科智能制造创新研究院 | Intelligent robot for carrying laboratory hazardous waste |
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