CN117641740A - PCB back drilling manufacturing method convenient for Stub detection - Google Patents
PCB back drilling manufacturing method convenient for Stub detection Download PDFInfo
- Publication number
- CN117641740A CN117641740A CN202311664386.1A CN202311664386A CN117641740A CN 117641740 A CN117641740 A CN 117641740A CN 202311664386 A CN202311664386 A CN 202311664386A CN 117641740 A CN117641740 A CN 117641740A
- Authority
- CN
- China
- Prior art keywords
- copper
- hole
- test
- stub
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005553 drilling Methods 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000001514 detection method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 171
- 229910052802 copper Inorganic materials 0.000 claims abstract description 168
- 239000010949 copper Substances 0.000 claims abstract description 168
- 238000012360 testing method Methods 0.000 claims abstract description 109
- 238000007747 plating Methods 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims description 14
- 239000000523 sample Substances 0.000 claims description 6
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 6
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a PCB back drilling manufacturing method convenient for detecting a Stub, which comprises the following steps: step S1: preparing a test PCB, wherein a test embedded block is arranged on the board edge of the test PCB; the test embedded block is respectively provided with a copper plating test through hole, a first copper plating ground hole and a second copper plating ground hole; step S2: drilling a test back drilling hole in the back of the test PCB; step S3: detecting the electrical on-off conditions of the copper hole wall of the copper guide hole wall and the copper hole wall of the first copper plating ground hole and the copper hole wall of the copper guide hole wall and the copper hole wall of the second copper plating ground hole by using a universal meter; step S4: judging whether the Stub of the test back drilling hole passes or not according to the detection condition of the universal meter, and carrying out back drilling manufacture on the finished PCB according to the test back drilling hole. The invention can realize quick detection of the Stub, save the detection time of the Stub, avoid slicing, improve the production efficiency, save raw materials and save the production cost.
Description
Technical Field
The invention relates to the field of PCB back drilling manufacturing methods, in particular to a PCB back drilling manufacturing method convenient for detecting a Stub.
Background
Along with the continuous development of technology, high-speed signal PCB boards are widely used. In order to avoid reflection, scattering, delay and the like of high-speed signal transmission, a back drilling mode is generally adopted in the PCB manufacturing process to shorten the via stub, improve the integrity of signal transmission and reduce noise interference.
For etching back drills, whether the back drill Stub passes or not is detected for the PCB in the industry, a back drill test coupler is designed on the panel side of the PCB, when the back drill is processed, the front board back drill is firstly tested on the panel side, slicing is carried out after the back drill is tested, whether the slicing back drill Stub passes or not is observed by using a metallographic microscope, if the back drill drills through a reference Layer and does not drill through a signal Layer (Extended Power or GND Plane), the reference Layer (Single Layer) is the existing Layer of the PCB, the back drill Stub passes, and if the back drill Stub passes the PCB, the back drill is manufactured in a graph on the finished PCB, and the processed back drill meets the requirements of customers. Because the PCB back drilling manufacturing method needs to carry out slicing manufacturing, equipment needs to wait in the slicing manufacturing process, so that the slicing manufacturing process consumes longer time, and the production efficiency is affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a PCB back drilling manufacturing method convenient for detecting a Stub, which can save the detection time of the Stub and improve the production efficiency.
The invention adopts the following technical scheme:
a PCB back drilling manufacturing method convenient for detecting a Stub comprises the following steps:
step S1: preparing a test PCB, wherein a test embedded block is arranged on the board edge of the test PCB, and each layer of structure of the test embedded block corresponds to each layer of structure of the test PCB; the test embedded block is respectively provided with a copper plating test through hole, a first copper plating ground hole and a second copper plating ground hole; the first copper plated ground hole extends towards the bottom layer of the test embedded block, and the copper hole wall of the first copper plated ground hole is connected with the copper body of the reference layer of the test embedded block; the second copper plated ground hole extends towards the bottom layer of the test embedded block, and the copper hole wall of the second copper plated ground hole is connected with the copper body of the signal layer of the test embedded block;
step S2: drilling a test back drilling hole at the position of the test embedded block of the test PCB corresponding to the copper plating test through hole; the copper-plated test through hole is subjected to back drilling test, and the remained copper hole wall is formed into a copper guide hole wall;
step S3: detecting the electrical on-off condition of the copper hole wall of the copper hole and the copper hole wall of the first copper-plated ground hole by using a universal meter, and detecting the electrical on-off condition of the copper hole wall of the second copper-plated ground hole by using the universal meter;
step S4: judging whether the Stub of the test back drilling hole passes or not according to the detection condition of the universal meter, and carrying out back drilling manufacturing on the finished PCB according to the test back drilling hole under the condition that the Stub of the test back drilling hole passes.
In step S1, a board edge of the test PCB board is provided with a mounting hole, and the test mounting block is mounted in the mounting hole.
In the step S4, whether the Stub of the test back drilling hole passes or not is judged according to the detection condition of the multimeter, if the test is performed by the multimeter, the copper guide hole wall and the copper hole wall of the first copper plating ground hole are in an electrical disconnection state, and the copper guide hole wall and the copper hole wall of the second copper plating ground hole are in an electrical connection state, then the Stub of the test back drilling hole passes or not, otherwise, the Stub of the test back drilling hole passes or not.
In step S3, two probes of the multimeter are respectively and correspondingly electrically contacted with the copper hole wall of the copper hole and the copper hole wall of the first copper-plated ground hole, so as to detect the electrical on-off condition of the copper hole wall and the copper hole wall of the first copper-plated ground hole by using the multimeter.
In step S3, two probes of the multimeter are respectively and correspondingly electrically contacted with the copper hole wall of the copper hole and the copper hole wall of the second copper-plated ground hole, so as to detect the electrical on-off condition of the copper hole wall of the copper hole and the copper hole wall of the second copper-plated ground hole by using the multimeter.
In step S4, if the Stub of the back drill is tested for fail, steps S1-S4 are repeated until the Stub of the back drill is tested for fail.
The first copper plated ground hole and the second copper plated ground hole are respectively arranged at two sides of the copper plated test through hole.
Compared with the prior art, the invention has the beneficial effects that:
the invention provides a PCB back drilling manufacturing method convenient for detecting a Stub, which comprises the steps of adopting the steps S1-S4, detecting the electrical on-off condition of a copper hole wall of a copper hole and a copper hole wall of a first copper plating ground hole by using a universal meter, and detecting the electrical on-off condition of the copper hole wall of the copper hole and a copper hole wall of a second copper plating ground hole by using the universal meter in the step S3; meanwhile, in the step S4, whether the test back drilling Stub passes or not is judged according to the detection condition of the universal meter, so that the quick detection of the Stub can be realized, the detection time of the Stub can be saved, the slicing manufacture is avoided, the production efficiency can be improved, the raw materials can be saved, and the production cost can be saved.
Drawings
Fig. 1 is a schematic structural diagram of a test PCB board of the present invention;
fig. 2 is a cross-sectional view of a test PCB of the present invention;
FIG. 3 is another directional cross-sectional view of the test PCB of the present invention;
FIG. 4 is a partial schematic view of a test PCB;
10, testing a PCB; 20. copper plating test through holes; 30. a first copper plated ground hole; 40. a second copper plated ground hole; 50. testing the embedded block; 51. a reference layer; 52. a signal layer; 61. a first electroplated copper ring; 62. a first substrate spacer ring; 63. a second electroplated copper ring; 64. a second substrate spacer ring; 65. a third electroplated copper ring; 66. a third substrate spacer ring; 70. testing back drilling holes; 71. and the wall of the copper guide hole.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
Referring to fig. 1-4, a method for fabricating a back hole of a PCB board for facilitating detection of a Stub includes the steps of:
step S1: preparing a test PCB 10, wherein a test embedded block 50 is arranged on the board edge of the test PCB 10, and each layer of structure of the test embedded block 50 corresponds to each layer of structure of the test PCB 10; the test insert 50 is provided with a copper plating test through hole 20, a first copper plating ground hole 30 and a second copper plating ground hole 40, respectively; the first copper plated hole 30 extends towards the bottom layer of the test block 50, and the copper hole wall of the first copper plated hole 30 is connected with the copper body of the reference layer 51 of the test block 50; the second copper plated hole 40 extends towards the bottom layer of the test block 50, and the copper hole wall of the second copper plated hole 40 is connected with the copper body of the signal layer 52 of the test block 50;
step S2: back drilling a test back drilling hole 70 at a position of the test insert 50 of the test PCB 10 corresponding to the copper plating test through hole 20; the copper-plated test through hole 20 is formed into a copper-guiding hole wall 71 through the copper hole wall left after the back drilling test back drilling 70;
step S3: detecting the electrical on-off condition of the copper hole wall 71 and the copper hole wall of the first copper plated ground hole 30 by using a multimeter, and detecting the electrical on-off condition of the copper hole wall 71 and the copper hole wall of the second copper plated ground hole 40 by using the multimeter;
step S4: judging whether the Stub of the test back drilling hole 70 passes or not according to the detection condition of the universal meter, and carrying out back drilling manufacture on the finished PCB according to the test back drilling hole 70 under the condition that the Stub of the test back drilling hole 70 passes.
The invention provides a PCB back drilling manufacturing method convenient for detecting a Stub, which comprises the steps of adopting a step S1 to a step S4, and detecting the electrical on-off condition of a copper hole wall 71 and a copper hole wall of a first copper plating ground hole 30 by using a multimeter in the step S3, and detecting the electrical on-off condition of the copper hole wall 71 and a copper hole wall of a second copper plating ground hole 40 by using the multimeter; meanwhile, in step S4, whether the Stub of the test back drilling 70 passes or not is judged according to the detection condition of the multimeter, so that the quick detection of the Stub can be realized, the detection time of the Stub can be saved, the slicing production is avoided, the production efficiency can be improved, the raw materials can be saved, and the production cost can be saved.
Specifically, the reference layer 51 of the test block 50 is located between the bottom layer and the signal layer 52.
Specifically, in step S1, a board edge of the test PCB 10 is provided with a mounting hole, and the test mounting block 50 is mounted in the mounting hole.
In the step S4, it is determined whether the Stub of the test back drilling hole 70 passes or not according to the detection condition of the multimeter, if the copper hole wall 71 is in an electrical disconnection state with the copper hole wall of the first copper plating ground hole 30 and the copper hole wall 71 is in an electrical connection state with the copper hole wall of the second copper plating ground hole 40, the Stub of the test back drilling hole 70 passes or not, otherwise, the Stub of the test back drilling hole 70 does not pass. By adopting the above arrangement, it is convenient to judge whether the Stub of the test back drilling 70 passes or not according to the detection condition of the multimeter.
In step S3, two probes of the multimeter are respectively and correspondingly electrically contacted with the copper hole wall 71 and the copper hole wall of the first copper plated ground hole 30, so as to detect the electrical on-off condition of the copper hole wall 71 and the copper hole wall of the first copper plated ground hole 30 by using the multimeter. In step S3, two probes of the multimeter are respectively and correspondingly electrically contacted with the copper hole wall 71 and the copper hole wall of the second copper plated ground hole 40, so as to detect the electrical on-off condition of the copper hole wall 71 and the copper hole wall of the second copper plated ground hole 40 by using the multimeter. By adopting the above arrangement, the electrical on-off condition of the copper hole wall 71 and the copper hole wall of the first copper plating ground hole 30 can be conveniently detected by using the multimeter, and the electrical on-off condition of the copper hole wall 71 and the copper hole wall of the second copper plating ground hole 40 can be conveniently detected by using the multimeter.
In step S4, if the Stub of the test back borehole 70 fails, steps S1-S4 are repeated until the Stub of the test back borehole 70 fails.
In step S4, in the case of the Stub and the grid of the test back drilling hole 70, the finished PCB board is back drilled according to the test back drilling hole 70, and the back drilling hole with the corresponding depth is drilled on the back of the finished PCB board according to the depth of the test back drilling hole 70.
The first copper plated ground hole 30 and the second copper plated ground hole 40 are disposed at both sides of the copper plated test through hole 20 to facilitate the arrangement of the first copper plated ground hole 30 and the second copper plated ground hole 40.
Specifically, the periphery of the end of the copper plating test through hole 20 is formed with a first copper plating ring 61, the periphery of the first copper plating ring 61 is formed with a first substrate isolating ring 62, the outer diameter of the first copper plating ring 61 is larger than the aperture of the copper plating test through hole 20, the periphery of the end of the first copper plating ground hole 30 is formed with a second copper plating ring 63, the periphery of the second copper plating ring 63 is formed with a second substrate isolating ring 64, the outer diameter of the second copper plating ring 63 is larger than the aperture of the first copper plating ground hole 30, the periphery of the end of the second copper plating ground hole 40 is formed with a third copper plating ring 65, the periphery of the third copper plating ring 65 is formed with a third substrate isolating ring 66, and the outer diameter of the third copper plating ring 65 is larger than the aperture of the second copper plating ground hole 40.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (7)
1. A PCB back drilling manufacturing method convenient for detecting a Stub is characterized by comprising the following steps of: the method comprises the following steps:
step S1: preparing a test PCB, wherein a test embedded block is arranged on the board edge of the test PCB, and each layer of structure of the test embedded block corresponds to each layer of structure of the test PCB; the test embedded block is respectively provided with a copper plating test through hole, a first copper plating ground hole and a second copper plating ground hole; the first copper plated ground hole extends towards the bottom layer of the test embedded block, and the copper hole wall of the first copper plated ground hole is connected with the copper body of the reference layer of the test embedded block; the second copper plated ground hole extends towards the bottom layer of the test embedded block, and the copper hole wall of the second copper plated ground hole is connected with the copper body of the signal layer of the test embedded block;
step S2: drilling a test back drilling hole at the position of the test embedded block of the test PCB corresponding to the copper plating test through hole; the copper-plated test through hole is subjected to back drilling test, and the remained copper hole wall is formed into a copper guide hole wall;
step S3: detecting the electrical on-off condition of the copper hole wall of the copper hole and the copper hole wall of the first copper-plated ground hole by using a universal meter, and detecting the electrical on-off condition of the copper hole wall of the second copper-plated ground hole by using the universal meter;
step S4: judging whether the Stub of the test back drilling hole passes or not according to the detection condition of the universal meter, and carrying out back drilling manufacturing on the finished PCB according to the test back drilling hole under the condition that the Stub of the test back drilling hole passes.
2. The method for manufacturing the back drilling of the PCB for conveniently detecting the Stub according to claim 1, wherein the method comprises the following steps: in step S1, a board edge of the test PCB board is provided with a mounting hole, and the test mounting block is mounted in the mounting hole.
3. The method for manufacturing the back drilling of the PCB for conveniently detecting the Stub according to claim 1, wherein the method comprises the following steps: in the step S4, whether the Stub of the test back drilling hole passes or not is judged according to the detection condition of the multimeter, if the test is performed by the multimeter, the copper guide hole wall and the copper hole wall of the first copper plating ground hole are in an electrical disconnection state, and the copper guide hole wall and the copper hole wall of the second copper plating ground hole are in an electrical connection state, then the Stub of the test back drilling hole passes or not, otherwise, the Stub of the test back drilling hole passes or not.
4. The method for manufacturing the back drilling of the PCB for conveniently detecting the Stub according to claim 1, wherein the method comprises the following steps: in step S3, two probes of the multimeter are respectively and correspondingly electrically contacted with the copper hole wall of the copper hole and the copper hole wall of the first copper-plated ground hole, so as to detect the electrical on-off condition of the copper hole wall and the copper hole wall of the first copper-plated ground hole by using the multimeter.
5. The method for manufacturing the back drilling of the PCB for conveniently detecting the Stub according to claim 1, wherein the method comprises the following steps: in step S3, two probes of the multimeter are respectively and correspondingly electrically contacted with the copper hole wall of the copper hole and the copper hole wall of the second copper-plated ground hole, so as to detect the electrical on-off condition of the copper hole wall of the copper hole and the copper hole wall of the second copper-plated ground hole by using the multimeter.
6. The method for manufacturing the back drilling of the PCB for conveniently detecting the Stub according to claim 1, wherein the method comprises the following steps: in step S4, if the Stub of the back drill is tested for fail, steps S1-S4 are repeated until the Stub of the back drill is tested for fail.
7. The method for manufacturing the back drilling of the PCB for conveniently detecting the Stub according to claim 1, wherein the method comprises the following steps: the first copper plated ground hole and the second copper plated ground hole are respectively arranged at two sides of the copper plated test through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311664386.1A CN117641740A (en) | 2023-12-04 | 2023-12-04 | PCB back drilling manufacturing method convenient for Stub detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311664386.1A CN117641740A (en) | 2023-12-04 | 2023-12-04 | PCB back drilling manufacturing method convenient for Stub detection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117641740A true CN117641740A (en) | 2024-03-01 |
Family
ID=90030269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311664386.1A Pending CN117641740A (en) | 2023-12-04 | 2023-12-04 | PCB back drilling manufacturing method convenient for Stub detection |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117641740A (en) |
-
2023
- 2023-12-04 CN CN202311664386.1A patent/CN117641740A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080217052A1 (en) | Wiring board and method of manufacturing wiring board | |
| CN101876687B (en) | Test method for back drilling depth of PCB plate | |
| CN111356290B (en) | Detection method capable of detecting back drilling depth | |
| CN101666854B (en) | Detecting method for back drilling and missed drilling | |
| CN106132115B (en) | A method of control back drill depth | |
| CN110475432B (en) | PCB and manufacturing and back drilling method thereof | |
| CN103376402B (en) | Multilayer circuit board drilling depth method of testing | |
| CN104582288A (en) | PCB back drilling plate back drilling depth detecting method | |
| CN104567611A (en) | Method for detecting backdrilling depth | |
| CN103743991A (en) | Method and apparatus for testing conductive-hole electrical property of PCB plate | |
| CN105517349B (en) | Back drill detection method | |
| CN103517556B (en) | A kind of circuit board depth control type drilling depth determining method and circuit board | |
| CN117641740A (en) | PCB back drilling manufacturing method convenient for Stub detection | |
| CN104582238A (en) | PCB (printed circuit board) and manufacturing method thereof | |
| CN205408277U (en) | Be convenient for PCB board that detects of back drilling defect | |
| CN201788164U (en) | PCB quality detecting device based on micro-resistance test | |
| CN111256578A (en) | Method for detecting depth of back drilling plate | |
| CN105115415A (en) | Circuit board blind hole depth test structure and test method thereof | |
| US11204242B2 (en) | Measurement system | |
| CN218099485U (en) | Testing device for circuit board | |
| CN112797887B (en) | Depth test structure and method for back drilling hole layer of high-rise multilayer board | |
| CN205192420U (en) | Test piece that squints within a definite time layer upon layer in control multilayer printed circuit board | |
| CN1959410A (en) | Method for estimating technical capability of plasma etching | |
| CN217637181U (en) | Measuring device for PCB back drilling stub | |
| CN212721539U (en) | Multifunctional FPC test jig |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |