CN117589693A - Modularized flexible chip test system based on visual recognition - Google Patents
Modularized flexible chip test system based on visual recognition Download PDFInfo
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- CN117589693A CN117589693A CN202410069541.3A CN202410069541A CN117589693A CN 117589693 A CN117589693 A CN 117589693A CN 202410069541 A CN202410069541 A CN 202410069541A CN 117589693 A CN117589693 A CN 117589693A
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- 238000012360 testing method Methods 0.000 title claims abstract description 18
- 230000000007 visual effect Effects 0.000 title claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 40
- 230000005284 excitation Effects 0.000 claims abstract description 33
- 230000007547 defect Effects 0.000 claims abstract description 15
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000013095 identification testing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
- G01N29/0654—Imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
- G01N2021/1706—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids in solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides a modularized flexible chip testing system based on visual recognition, which comprises a stretching module, a testing module and a testing module, wherein the stretching module is configured to fix a detected piece and apply stretching force; the attaching module is configured to attach the reflecting medium layer to the detection surface; the light emitting module is configured to set at least one group of first emitted light and at least one group of second emitted light, the first emitted light and the second emitted light are respectively arranged along two groups of opposite side directions of the detection surface, and the first emitted light and the second emitted light are emitted to the detection surface at preset incidence angles; an excitation module configured to provide vibrations of at least one excitation vibration source to the inspected piece; a light acquisition module configured to acquire reflected light and convert an optical signal into an electrical signal; the data processing module is configured to acquire the electric signals provided by the light acquisition module, and determine a deformation defect area and a deformation qualified area after processing the electric signals; and the control module is configured to receive signals of the modules and transmit control signals in response to the signals of the modules.
Description
Technical Field
The invention belongs to the technical field of visual identification testing, and particularly relates to a modularized flexible chip testing system based on visual identification.
Background
With the rapid development of the electronic industry, semiconductor chips are widely used in various fields, and performance detection is required in the chip manufacturing process to control product quality and ensure normal operation of subsequent production links.
For the flexible chip, the flexible vibration capability is generally tested in a vibration mode, and the traditional vibration detection can only detect the whole amplitude of the flexible chip, and can not determine the defect position and the specific deformation defect degree according to the flexible part.
In view of this, there is a need to propose a modular flexible chip test system based on visual recognition.
Disclosure of Invention
Therefore, the invention provides a modularized flexible chip testing system based on visual recognition, and deformation detection and deformation defect determination of a flexible chip are provided.
An aspect of the present invention provides a modular chip testing system based on visual recognition, comprising:
a stretching module configured to fix a detected member and apply stretching forces to two sets of opposite side directions of the same plane of the detected member, respectively;
the attaching module is configured to attach a reflecting medium layer to the detection surface, wherein a first wall and a second wall of the reflecting medium layer are light-permeable layers, and the first wall is attached to the detection surface;
the light emitting module is configured to set at least one group of first emitted light and at least one group of second emitted light, the first emitted light and the second emitted light are respectively arranged along two groups of opposite side directions of the detection surface, and the first emitted light and the second emitted light are emitted to the detection surface at preset incidence angles;
an excitation module configured to provide vibrations of at least one excitation vibration source to the inspected piece;
a light acquisition module configured to acquire reflected light and convert an optical signal into an electrical signal;
a data processing module configured to acquire the electric signal provided by the light acquisition module, and to determine a deformation defect area and a deformation qualified area after processing the electric signal;
and the control module is configured to receive signals of the modules and transmit control signals in response to the signals of the modules.
Further, the control module is specifically configured to:
sending a stretch signal to the stretch module,
responding to the feedback of a preset stretching signal of the stretching module, and sending a pasting signal to the pasting module;
the coating signal feedback corresponds to the coating module, and sends an optical emission signal to the optical emission module;
and responding to the light emission signal feedback of the light emission module, and sending an excitation signal to the excitation module.
Further, the light acquisition module, for both the first emitted light and the second emitted light, is configured to:
acquiring first reflected light from a detection surface, acquiring second reflected light from a first wall, and acquiring interference light;
the first reflected light, the second reflected light, and the disturbing light are converted into an electrical signal.
Further, the excitation module is configured to provide vibration with a center point of the detection surface as a first excitation point, and simultaneously provide vibration to a plurality of second excitation points arranged outside a preset distance of the first excitation point.
Further, the data processing module is configured to perform the steps of:
further, a gas detector is included and configured to acquire the composition of the gas and determine the refractive index of the gas.
Further, the light emitting module is further configured to move toward two sets of opposite sides of the detection surface.
Further, the stretch module is configured to move in a first direction and a second direction, and the first direction and the second direction pass through the first emitted light and the second emitted light, respectively.
Compared with the prior art, the technical scheme provided by the invention has the following advantages:
the invention is configured to set at least one group of first emission light and at least one group of second emission light through the light emission module, wherein the first emission light and the second emission light are respectively arranged along two groups of opposite side directions of the detection surface, and the first emission light and the second emission light are emitted to the detection surface at preset incidence angles; and the excitation module is configured to provide vibration of at least one excitation vibration source to the detected piece, and perform optical sampling based on the vibration frequency while vibrating to determine a deformation defect area.
Drawings
FIG. 1 is a block diagram of a system according to a first embodiment of the present invention;
Detailed Description
So that the manner in which the features and techniques of the disclosed embodiments can be understood in more detail, a more particular description of the embodiments of the disclosure, briefly summarized below, may be had by reference to the appended drawings, which are not intended to be limiting of the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may still be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawing.
The embodiment of the disclosure provides a modularized flexible chip test system based on visual identification, the structural block diagram of which is shown in fig. 1, comprising:
a stretching module configured to fix a detected member and apply stretching forces to two sets of opposite side directions of the same plane of the detected member, respectively;
the attaching module is configured to attach a reflective medium layer to the detection surface, the reflective medium layer is of a layered structure with a first wall and a second wall, the first wall and the second wall are light-permeable layers, and the first wall is attached to the detection surface. In the embodiment of the disclosure, the function of the reflective medium layer firstly provides protection for the detection surface, after the stretching module stretches the detected piece into a plane, the direct lamination of the reflective medium layer and the detected piece can determine whether a concave area exists, under the condition of preset stretching force, in order not to damage the flexible chip, the stretching force is limited, if the detected piece has deformation defects, the part cannot be stretched, and bubbles or bulges can be generated when the reflective medium layer is laminated with the reflective medium layer.
The light emitting module is configured to set at least one group of first emitted light and at least one group of second emitted light, the first emitted light and the second emitted light are respectively arranged along two groups of opposite side directions of the detection surface, and the first emitted light and the second emitted light are emitted to the detection surface at preset incident angles.
In the embodiment of the disclosure, the reflective medium layer is used as a part of optical filtering, and because the reflective medium layer has a preset refractive index, light rays respectively generate multiple groups of refractive light after passing through the reflective medium layer, other light interference reflected by the detection surface when the light rays are directly irradiated to the detection surface can be eliminated by incorporating the refractive index into calculation of the reflection angle in advance, and meanwhile, the light attenuation value can be determined by the reflected light between the two walls of the reflective medium layer, so that the data detected by the detection surface when the light rays are irradiated to the detection surface is data of interest, and the data which do not accord with the data region of interest is interference light.
An excitation module configured to provide vibrations of at least one excitation vibration source to the inspected piece;
a light acquisition module configured to acquire reflected light and convert an optical signal into an electrical signal;
a data processing module configured to acquire the electric signal provided by the light acquisition module, and to determine a deformation defect area and a deformation qualified area after processing the electric signal;
and the control module is configured to receive signals of the modules and transmit control signals in response to the signals of the modules.
Further, the control module is specifically configured to:
sending a stretch signal to the stretch module,
responding to the feedback of a preset stretching signal of the stretching module, and sending a pasting signal to the pasting module;
the coating signal feedback corresponds to the coating module, and sends an optical emission signal to the optical emission module;
and responding to the light emission signal feedback of the light emission module, and sending an excitation signal to the excitation module.
Further, the light acquisition module, for both the first emitted light and the second emitted light, is configured to:
acquiring first reflected light from a detection surface, acquiring second reflected light from a first wall, and acquiring interference light;
the first reflected light, the second reflected light and the disturbing light are converted into an electrical signal, and the disturbing light is reflected light from the second wall for calculating light attenuation.
Further, the excitation module is configured to provide vibration with a center point of the detection surface as a first excitation point, and simultaneously provide vibration to a plurality of second excitation points arranged outside a preset distance of the first excitation point. The data obtained by vibration generated by the same excitation source is one-sided, so that the accuracy of the data is ensured by converting the excitation vibration mode through multiple points.
Further, the data processing module is configured to perform the steps of:
after the coated reflective medium layer is obtained, a first image formed by the reflected light signal,
judging whether a gap between the reflective medium layer and the detection surface exists in the reflected light image, marking the area as a first area, and the first area is a deformation defect area;
after each vibration, determining a second image and a third image corresponding to the wave crest and the wave trough of the vibration;
determining curvatures in the second image and the third image;
if the curvature of the second image is within the first curvature threshold value, the curvature of the third image is within the second curvature threshold value, and the curvature difference value of the second image and the third image is within the third curvature threshold value, marking the area as a second area, otherwise, the area as a third area;
determining a fourth area according to the first area, the second area and the third area, wherein the fourth area is an area which does not deform;
repeating the steps after changing the position of the excitation source to obtain new region division, and determining a new fourth region;
if the proportion of the reflected images returned by the second area and the third area at the position of the excitation source is within a preset value, the reflected images are deformation qualified areas, otherwise, the reflected images are deformation defect areas;
if the total area ratio of the fourth areas is larger than a preset value and/or the area ratio of the deformation defect areas is larger than a preset value, the whole mark is unqualified.
Further, a gas detector is included and configured to obtain the composition of the gas and determine the refractive index of the gas, in the embodiment of the present disclosure, if there is a gap between the reflective medium layer and the detection surface, the refractive index of the gas needs to be determined, and in some special flexible chips, the detection needs to be performed under the condition of a specific gas atmosphere, so that the actual refractive index of the atmosphere needs to be calibrated in advance to obtain a more accurate reflection result.
Further, the light emitting module is further configured to move toward two sets of opposite sides of the detection surface. Alternatively, the stretching module is configured to move in a first direction and a second direction, and the first direction and the second direction pass through incident paths of the first emitted light and the second emitted light, respectively. In the embodiment of the present disclosure, the curvature change of the detection surface is calculated by the position of the reflected light, and thus the change of the position of the emitted light or the change of the position of the detection surface is adaptively selected to obtain a complete reflected curvature image.
The above description and the drawings illustrate embodiments of the disclosure sufficiently to enable those skilled in the art to practice them. Other embodiments may involve structural, logical, electrical, process, and other changes. The embodiments represent only possible variations. Individual components and acts are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in, or substituted for, those of others. Moreover, the terminology used in the present application is for the purpose of describing embodiments only and is not intended to limit the claims. As used in the description of the embodiments and the claims, the singular forms "a," "an," and "the" (the) are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, when used in this application, the terms "comprises," "comprising," and/or "includes," and variations thereof, mean that the stated features, integers, steps, operations, elements, and/or components are present, but that the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof is not precluded. Without further limitation, an element defined by the phrase "comprising one …" does not exclude the presence of other like elements in a process, method or apparatus comprising such elements. In this context, each embodiment may be described with emphasis on the differences from the other embodiments, and the same similar parts between the various embodiments may be referred to each other. For the methods, products, etc. disclosed in the embodiments, if they correspond to the method sections disclosed in the embodiments, the description of the method sections may be referred to for relevance.
Claims (8)
1. A modular flexible chip test system based on visual recognition, comprising:
a stretching module configured to fix a detected member and apply stretching forces to two sets of opposite side directions of the same plane of the detected member, respectively;
the attaching module is configured to attach a reflecting medium layer to the detection surface, wherein a first wall and a second wall of the reflecting medium layer are light-permeable layers, and the first wall is attached to the detection surface;
the light emitting module is configured to set at least one group of first emitted light and at least one group of second emitted light, the first emitted light and the second emitted light are respectively arranged along two groups of opposite side directions of the detection surface, and the first emitted light and the second emitted light are emitted to the detection surface at preset incidence angles;
an excitation module configured to provide vibrations of at least one excitation vibration source to the inspected piece;
a light acquisition module configured to acquire reflected light and convert an optical signal into an electrical signal;
a data processing module configured to acquire the electric signal provided by the light acquisition module, and to determine a deformation defect area and a deformation qualified area after processing the electric signal;
and the control module is configured to receive signals of the modules and transmit control signals in response to the signals of the modules.
2. The visual identification-based modular flexible chip test system of claim 1, wherein the control module is specifically configured to:
sending a stretch signal to the stretch module,
responding to the feedback of a preset stretching signal of the stretching module, and sending a pasting signal to the pasting module;
transmitting an optical emission signal to the optical emission module in response to the overlay signal feedback of the overlay module;
and responding to the light emission signal feedback of the light emission module, and sending an excitation signal to the excitation module.
3. The visual recognition-based modular flexible chip test system of claim 1, wherein the light acquisition module, for both the first emitted light and the second emitted light, is configured to:
acquiring first reflected light from a detection surface, acquiring second reflected light from a first wall, and acquiring interference light;
the first reflected light, the second reflected light, and the disturbing light are converted into an electrical signal.
4. The visual recognition-based modular flexible chip test system of claim 1, wherein the excitation module is configured to provide vibration with a first excitation point at a center point of the detection surface and simultaneously provide vibration to a plurality of second excitation points outside a preset distance from the first excitation point.
5. The visual recognition-based modular flexible chip test system of claim 1, wherein the data processing module is configured to perform the steps of:
after the coated reflective medium layer is obtained, a first image formed by the reflected light signal,
judging whether a gap between the reflective medium layer and the detection surface exists in the reflected light image, marking the area as a first area, and the first area is a deformation defect area;
after each vibration, determining a second image and a third image corresponding to the wave crest and the wave trough of the vibration;
determining curvatures in the second image and the third image;
if the curvature of the second image is within the first curvature threshold value, the curvature of the third image is within the second curvature threshold value, and the curvature difference value of the second image and the third image is within the third curvature threshold value, marking the area as a second area, and marking the area as a third area;
determining a fourth area according to the first area, the second area and the third area, wherein the fourth area is an area which does not deform;
repeating the steps after changing the position of the excitation source to obtain new region division, and determining a new fourth region;
if the proportion of the reflected images returned by the second area and the third area at the position of the vibration source is within a preset value, the reflected images are deformation qualified areas, otherwise, the reflected images are deformation defect areas;
if the total area ratio of the fourth areas is larger than a preset value and/or the area ratio of the deformation defect areas is larger than a preset value, the whole mark is unqualified.
6. The visual recognition-based modular flexible chip testing system of any of claims 1-5, further comprising a gas detector configured to capture a composition of the gas and determine a refractive index of the gas.
7. The visual recognition-based modular flexible chip testing system of claim 6, wherein the light emitting module is further configured to move in two sets of opposite directions to the detection face.
8. The visual recognition-based modular flexible chip test system of claim 6, wherein the stretch module is configured to move in a first direction and a second direction, and the first direction and the second direction pass through a first emitted light and a second emitted light, respectively.
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|---|---|---|---|---|
| GB0327755D0 (en) * | 2003-12-01 | 2003-12-31 | Elliott Stephen R | Optical-sensor chip |
| CN1589457A (en) * | 2001-12-21 | 2005-03-02 | 德国捷德有限公司 | Sheet material and devices and methods for the production and treatment of the sheet material |
| CN102679882A (en) * | 2012-04-27 | 2012-09-19 | 夏豪杰 | Phase modulation grating sensor and method for realizing measurement |
| CN108981991A (en) * | 2018-08-29 | 2018-12-11 | 上海海事大学 | Optical fiber type photoelectric sensor ship shaft power measuring instrument and measurement method |
| CN113180618A (en) * | 2021-04-20 | 2021-07-30 | 华中科技大学 | Skin-attached health detection system and preparation method thereof |
-
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- 2024-01-18 CN CN202410069541.3A patent/CN117589693B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1589457A (en) * | 2001-12-21 | 2005-03-02 | 德国捷德有限公司 | Sheet material and devices and methods for the production and treatment of the sheet material |
| GB0327755D0 (en) * | 2003-12-01 | 2003-12-31 | Elliott Stephen R | Optical-sensor chip |
| CN102679882A (en) * | 2012-04-27 | 2012-09-19 | 夏豪杰 | Phase modulation grating sensor and method for realizing measurement |
| CN108981991A (en) * | 2018-08-29 | 2018-12-11 | 上海海事大学 | Optical fiber type photoelectric sensor ship shaft power measuring instrument and measurement method |
| CN113180618A (en) * | 2021-04-20 | 2021-07-30 | 华中科技大学 | Skin-attached health detection system and preparation method thereof |
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