CN117528943A - Manufacturing process of circuit board - Google Patents
Manufacturing process of circuit board Download PDFInfo
- Publication number
- CN117528943A CN117528943A CN202311483453.XA CN202311483453A CN117528943A CN 117528943 A CN117528943 A CN 117528943A CN 202311483453 A CN202311483453 A CN 202311483453A CN 117528943 A CN117528943 A CN 117528943A
- Authority
- CN
- China
- Prior art keywords
- insulating substrate
- conductive film
- ink pattern
- ink
- blank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 174
- 238000010586 diagram Methods 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 238000001704 evaporation Methods 0.000 claims abstract description 20
- 238000004544 sputter deposition Methods 0.000 claims abstract description 20
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 239000011247 coating layer Substances 0.000 claims abstract description 9
- 239000006082 mold release agent Substances 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000007888 film coating Substances 0.000 claims description 7
- 238000009501 film coating Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 abstract description 18
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000005530 etching Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Abstract
The invention discloses a manufacturing process of a circuit board, which comprises the following steps: s1, taking an insulating substrate, and printing ink patterns on the upper surface of the insulating substrate; s2, sputtering or evaporating the coating film on the blank positions of the upper surface of the ink pattern and the upper surface of the insulating substrate, so that a conductive film is formed on the blank positions of the upper surface of the ink pattern and the upper surface of the insulating substrate; s3, cleaning the ink pattern on the upper surface of the insulating substrate by using a mold release agent, so that the ink pattern on the upper surface of the insulating substrate and a coating layer on the surface of the ink pattern are separated from the insulating substrate, and a conductive film at a blank position on the upper surface of the insulating substrate is reserved and a circuit diagram is formed; s4, forming a circuit diagram after adding a copper layer on the surface of the conductive film through electroplating. The method has the advantages that copper foil does not need to be manufactured, the production cost is low, no pollution is caused, the combination between the conductive film and the insulating substrate is compact, the conductive film formed by sputtering coating or evaporation coating can be made to be very thin, and the height of the copper layer on the surface of the conductive film can be formulated according to the needs.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing process of a circuit board.
Background
The current circuit board manufacturing process comprises the steps of attaching a copper foil on the surface of an insulating substrate, compounding a dry film on the surface of the copper foil, attaching a film on the surface of the dry film, exposing, condensing the dry film of the exposed part and the copper foil together, developing, etching the copper foil by an etching technology, cleaning the dry film on the surface of the unetched copper foil, and finally forming the circuit board; the process needs to manufacture the copper foil, pollution can be generated in the production of the copper foil, the copper foil is very thin and very thin, the copper foil and the insulating matrix need to be compounded, the process is not environment-friendly, pollution can be generated in the etching of the copper foil, and the copper foil is wasted. The copper foil is also attached to the surface of the insulating substrate, the printing ink is coated, then the printing ink is etched and cleaned, and finally the circuit board is formed, so that the process is not environment-friendly, pollution is generated when the copper foil is etched, and the copper foil is wasted; when the circuit board is required to be manufactured on the upper surface and the lower surface of the insulating substrate, in order to conduct the circuit board on the upper surface and the lower surface of the insulating substrate, a through hole is required to be drilled on the surface of the insulating substrate, and then copper foil is compounded on the surface of the perforated insulating substrate.
Disclosure of Invention
The technical problem to be solved by the application is to provide a manufacturing process of a circuit board aiming at the defects of the prior art.
In order to solve the technical problems, the following technical scheme is adopted.
A manufacturing process of a circuit board comprises the following steps:
s1, taking an insulating substrate, and printing ink patterns on the upper surface of the insulating substrate;
s2, sputtering, evaporating or chemically plating the film on the blank positions of the upper surface of the ink pattern and the upper surface of the insulating substrate so as to form a conductive film on the blank positions of the upper surface of the ink pattern and the upper surface of the insulating substrate;
s3, cleaning the ink pattern on the upper surface of the insulating substrate by using a mold release agent, so that the ink pattern on the upper surface of the insulating substrate and a coating layer on the surface of the ink pattern are separated from the insulating substrate, and a conductive film at a blank position on the upper surface of the insulating substrate is reserved and a circuit diagram is formed;
s4, forming a circuit diagram after adding a copper layer on the surface of the conductive film through electroplating.
The insulating substrate is penetrated with a through hole,
s1, printing ink patterns on the lower surface of the insulating matrix;
s2, sputtering or evaporating the film coating on the lower surface of the ink pattern and the blank of the lower surface of the insulating substrate, so that a conductive film is formed in the through hole of the insulating substrate, the lower surface of the ink pattern and the blank of the lower surface of the insulating substrate;
s3, cleaning the ink pattern on the lower surface of the insulating substrate by using a mold release agent, so that the ink pattern on the lower surface of the insulating substrate and a coating layer on the surface of the ink pattern are separated from the insulating substrate, and a conductive film at a blank position on the lower surface of the insulating substrate is reserved to form a circuit diagram, and the circuit diagram on the upper surface of the insulating substrate is connected with the circuit diagram on the lower surface of the insulating substrate through the conductive film in the through hole.
Also included between S2 and S3 are S21 and S22:
s21, punching a through hole at the conductive film at the blank part of the upper surface of the insulating substrate, so that the through hole penetrates through the conductive film and the insulating substrate;
s22, printing ink patterns on the lower surface of the insulating substrate, sputtering or evaporating the coating film on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, so that conductive films are formed in the through holes of the insulating substrate, on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, cleaning the ink patterns on the lower surface of the insulating substrate by using a release agent, enabling the ink patterns on the lower surface of the insulating substrate and the coating film layer on the surface of the ink patterns to be separated from the insulating substrate, keeping and forming a circuit diagram on the conductive films on the blank of the lower surface of the insulating substrate, and connecting the circuit diagram on the upper surface of the insulating substrate with the circuit diagram on the lower surface of the insulating substrate through the conductive films in the through holes.
Also included between S3 and S4 are S31 and S32:
s31, punching a through hole at the conductive film at the blank part of the upper surface of the insulating substrate, so that the through hole penetrates through the conductive film and the insulating substrate;
s32, printing ink patterns on the lower surface of the insulating substrate, sputtering or evaporating the coating film on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, so that conductive films are formed in the through holes of the insulating substrate, on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, cleaning the ink patterns on the lower surface of the insulating substrate by using a release agent, enabling the ink patterns on the lower surface of the insulating substrate and the coating film layer on the surface of the ink patterns to be separated from the insulating substrate, keeping and forming a circuit diagram on the conductive films on the blank of the lower surface of the insulating substrate, and connecting the circuit diagram on the upper surface of the insulating substrate with the circuit diagram on the lower surface of the insulating substrate through the conductive films in the through holes.
One preferred embodiment is that the thickness of the ink pattern is greater than the thickness of the conductive film.
One preferred embodiment is that the insulating substrate is a sheet or a roll.
One preferred embodiment is to destroy the conductive film on the upper surface of the ink pattern after forming the conductive film on the upper surface of the ink pattern and the space on the upper surface of the insulating substrate so that the ink pattern on the upper surface of the insulating substrate is exposed.
The conductive films damage the upper and lower surfaces of the ink pattern so that the ink pattern of the upper and lower surfaces of the insulating substrate is exposed.
One preferred embodiment is that the insulating matrix is made of PI or PET material.
One preferable scheme is that the sputtering coating or the evaporation coating is carried out, so that a copper conductive film is formed on the upper surface of the ink pattern and the blank of the upper surface of the insulating substrate.
The invention has the beneficial effects that: the copper foil does not need to be manufactured, the production cost is low, no pollution is caused, the conductive film and the insulating substrate are tightly combined, the conductive film formed by sputtering coating or evaporating coating can be made to be very thin, and the height of the copper layer on the surface of the conductive film can be formulated according to the requirement, so that an etching process is not needed.
The foregoing description is only an overview of the technical solutions of the present application, and may be implemented according to the content of the specification, so that the foregoing and other objects, features and advantages of the present application can be more clearly understood, and the following detailed description of the preferred embodiments will be given with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of an insulating substrate according to the present invention;
FIG. 2 is a schematic illustration of an insulating substrate surface printed with an ink pattern in accordance with the present invention;
FIG. 3 is a schematic view of a through hole in the insulating substrate in the present invention;
FIG. 4 is a schematic illustration of the formation of a conductive film in the gaps on the surface of an ink pattern and the surface of an insulating substrate according to the present invention;
FIG. 5 is a schematic illustration of the insulating substrate surface of the present invention with the ink pattern removed;
FIG. 6 is a schematic diagram of a circuit diagram formed by adding a copper layer to the surface of a conductive film according to the present invention.
Detailed Description
For the purpose of illustrating the concepts and objects of the invention, the invention is further described in connection with the drawings and detailed description that follow.
The present application is described in more detail below with reference to the accompanying drawings and examples.
As shown in fig. 1 to 6, a first embodiment of the present application discloses a manufacturing process of a circuit board, including:
s1, taking an insulating substrate 1, and printing an ink pattern 2 on the upper surface of the insulating substrate 1;
s2, sputtering, evaporating or chemically plating the film on the upper surface of the ink pattern 2 and the blank on the upper surface of the insulating substrate 1, so that a conductive film 3 is formed on the upper surface of the ink pattern 2 and the blank on the upper surface of the insulating substrate 1;
s3, cleaning the ink pattern 2 on the upper surface of the insulating substrate 1 by using a mold release agent, so that the ink pattern 2 on the upper surface of the insulating substrate 1 and a coating layer on the surface of the ink pattern 2 are separated from the insulating substrate 1, and a conductive film is formed at a blank position on the upper surface of the insulating substrate 1;
and S4, forming a circuit diagram by electroplating to increase the copper layer 4 on the surface of the conductive film 3. The conductive film 3 is a copper film.
As shown in fig. 1 to 6, the insulating base 1 is made of PI or PET material.
As shown in fig. 1 to 6, the copper conductive film 3 is formed on the upper surface of the ink pattern 2 and the space on the upper surface of the insulating base 1 by sputtering or evaporation.
As shown in fig. 1 to 6, the electroless plating film may be PTH.
As shown in fig. 1 to 6, an ink pattern 2 is printed on the upper surface of an insulating substrate 1, the other places on the upper surface of the insulating substrate 1 are blank, and sputtering or evaporating coating is performed on the blank positions on the upper surface of the ink pattern 2 and the upper surface of the insulating substrate 1, so that a conductive film 3 is formed on the upper surface of the ink pattern 2 and the blank positions on the upper surface of the insulating substrate 1; the ink pattern 2 on the upper surface of the insulating substrate 1 is cleaned by a mold release agent, so that the ink pattern 2 on the upper surface of the insulating substrate 1 and a coating layer on the surface of the ink pattern 2 are separated from the insulating substrate 1, and a conductive film 3 at a blank part on the upper surface of the insulating substrate 1 is reserved and forms a circuit diagram; a copper layer 4 is added on the surface of the conductive film 3 by an electroplating process. The copper foil is not required to be manufactured, the production cost is low, no pollution is caused, the combination between the conductive film 3 and the insulating substrate 1 is compact, the conductive film 3 formed by sputtering coating or evaporation coating can be made to be very thin, and the height of the copper layer 4 on the surface of the conductive film 3 can be formulated according to the requirement. An etching process is not required.
In a second embodiment, as shown in fig. 1 to 6, the insulating base 1 is perforated with a through hole 5,
s1, printing an ink pattern 2 on the lower surface of the insulating substrate 1;
s2, sputtering or evaporating the film coating on the lower surface of the ink pattern 2 and the blank of the lower surface of the insulating substrate 1, so that a conductive film 3 is formed in the through hole 5 of the insulating substrate 1, the lower surface of the ink pattern 2 and the blank of the lower surface of the insulating substrate 1;
s3, cleaning the ink pattern 2 on the lower surface of the insulating substrate 1 by using a mold release agent, so that the ink pattern 2 on the lower surface of the insulating substrate 1 and a coating layer on the surface of the ink pattern 2 are separated from the insulating substrate 1, a conductive film 3 at a blank part on the lower surface of the insulating substrate 1 is reserved and forms a circuit diagram, and the circuit diagram on the upper surface of the insulating substrate 1 and the circuit diagram on the lower surface are connected through the conductive film 3 in the through hole 5.
In the third embodiment, as shown in fig. 1 to 6, S21 and S22 are further included between S2 and S3:
s21, punching a through hole 5 at the conductive film 3 at the blank part of the upper surface of the insulating substrate 1, so that the through hole 5 penetrates through the conductive film 3 and the insulating substrate 1;
s22, printing an ink pattern 2 on the lower surface of the insulating substrate 1, sputtering or evaporating the film coating on the lower surface of the ink pattern 2 and the blank of the lower surface of the insulating substrate 1, so that a conductive film 3 is formed in the through hole 5 of the insulating substrate 1, on the lower surface of the ink pattern 2 and the blank of the lower surface of the insulating substrate 1, cleaning the ink pattern 2 on the lower surface of the insulating substrate 1 by using a release agent, separating the ink pattern 2 on the lower surface of the insulating substrate 1 and the film coating layer on the surface of the ink pattern 2 from the insulating substrate 1, and keeping and forming a circuit diagram on the conductive film 3 on the blank of the lower surface of the insulating substrate 1, wherein the circuit diagram on the upper surface of the insulating substrate 1 and the circuit diagram on the lower surface of the insulating substrate are connected through the conductive film 3 in the through hole 5.
Also included between S3 and S4 are S31 and S32:
s31, punching a through hole 5 at the conductive film 3 at the blank part of the upper surface of the insulating substrate 1, so that the through hole 5 penetrates through the conductive film 3 and the insulating substrate 1;
s32, printing an ink pattern 2 on the lower surface of the insulating substrate 1, sputtering or evaporating the film coating on the lower surface of the ink pattern 2 and the blank of the lower surface of the insulating substrate 1, so that a conductive film 3 is formed in the through hole 5 of the insulating substrate 1, on the lower surface of the ink pattern 2 and the blank of the lower surface of the insulating substrate 1, cleaning the ink pattern 2 on the lower surface of the insulating substrate 1 by using a release agent, separating the ink pattern 2 on the lower surface of the insulating substrate 1 and the film coating layer on the surface of the ink pattern 2 from the insulating substrate 1, and keeping and forming a circuit diagram on the conductive film 3 on the blank of the lower surface of the insulating substrate 1, wherein the circuit diagram on the upper surface of the insulating substrate 1 and the circuit diagram on the lower surface of the insulating substrate are connected through the conductive film 3 in the through hole 5.
As shown in fig. 1 to 6, the thickness of the ink pattern 2 is greater than the thickness of the conductive film 3.
As shown in fig. 1 to 6, the insulating base 1 is a soft base material or a hard base material. The insulating substrate 1 may be fiberglass cloth, epoxy, polyimide or PET.
As shown in fig. 1 to 6, the insulating base 1 is a sheet or a roll.
As shown in fig. 1 to 6, in the fourth embodiment, after forming the conductive film 3 in the space on the upper surface of the ink pattern 2 and the upper surface of the insulating base 1, the conductive film 3 on the upper surface of the ink pattern 2 is broken so that the ink pattern 2 on the upper surface of the insulating base 1 is exposed. The ink pattern 2 is exposed to the outside, facilitating the cleaning of the ink pattern 2. The conductive film 3 on the upper surface of the ink pattern 2 can be scratched or scraped, or the conductive film 3 on the upper surface of the ink pattern 2 is polished to form micropores on the surface of the conductive film 3, and then the ink pattern 2 on the upper surface of the insulating substrate 1 is cleaned by using a release agent to separate the ink pattern 2 on the upper surface of the insulating substrate 1 and a coating layer on the surface of the ink pattern 2 from the insulating substrate 1, so that the conductive film is formed at a blank part on the upper surface of the insulating substrate 1.
As shown in fig. 1 to 6, the conductive film 3 breaks the upper and lower surfaces of the ink pattern 2 so that the ink pattern 2 of the upper and lower surfaces of the insulating substrate 1 is exposed. The ink pattern 2 is exposed to the outside, facilitating the cleaning of the ink pattern 2.
The foregoing is a specific embodiment of the invention, it will be appreciated by those skilled in the art that modifications and variations may be made without departing from the principles of the invention, and such modifications and variations are to be regarded as being within the scope of the invention.
Claims (10)
1. The manufacturing process of the circuit board is characterized by comprising the following steps of:
s1, taking an insulating substrate, and printing ink patterns on the upper surface of the insulating substrate;
s2, sputtering, evaporating or chemically plating the blank on the upper surface of the ink pattern and the upper surface of the insulating substrate to form a conductive film on the blank on the upper surface of the ink pattern and the upper surface of the insulating substrate;
s3, cleaning the ink pattern on the upper surface of the insulating substrate by using a mold release agent, so that the ink pattern on the upper surface of the insulating substrate and a coating layer on the surface of the ink pattern are separated from the insulating substrate, and a conductive film is formed at a blank position on the upper surface of the insulating substrate;
s4, forming a circuit diagram after adding a copper layer on the surface of the conductive film through electroplating.
2. The process for manufacturing a circuit board according to claim 1, wherein the insulating substrate is provided with a through hole therethrough,
s1, printing ink patterns on the lower surface of the insulating substrate, wherein the ink patterns on the upper surface and the lower surface of the insulating substrate are staggered with the through holes;
s2, sputtering or evaporating the film coating on the lower surface of the ink pattern and the blank of the lower surface of the insulating substrate, so that a conductive film is formed in the through hole of the insulating substrate, the lower surface of the ink pattern and the blank of the lower surface of the insulating substrate;
s3, cleaning the ink pattern on the lower surface of the insulating substrate by using a mold release agent, so that the ink pattern on the lower surface of the insulating substrate and a coating layer on the surface of the ink pattern are separated from the insulating substrate, and a conductive film at a blank position on the lower surface of the insulating substrate is reserved to form a circuit diagram, and the circuit diagram on the upper surface of the insulating substrate is connected with the circuit diagram on the lower surface of the insulating substrate through the conductive film in the through hole.
3. The process for manufacturing a circuit board according to claim 1, further comprising S21 and S22 between S2 and S3:
s21, punching a through hole at the conductive film at the blank part of the upper surface of the insulating substrate, so that the through hole penetrates through the conductive film and the insulating substrate;
s22, printing ink patterns on the lower surface of the insulating substrate, sputtering or evaporating the coating film on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, so that conductive films are formed in the through holes of the insulating substrate, on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, cleaning the ink patterns on the lower surface of the insulating substrate by using a release agent, enabling the ink patterns on the lower surface of the insulating substrate and the coating film layer on the surface of the ink patterns to be separated from the insulating substrate, keeping and forming a circuit diagram on the conductive films on the blank of the lower surface of the insulating substrate, and connecting the circuit diagram on the upper surface of the insulating substrate with the circuit diagram on the lower surface of the insulating substrate through the conductive films in the through holes.
4. The process for manufacturing a circuit board according to claim 1, further comprising S31 and S32 between S3 and S4:
s31, punching a through hole at the conductive film at the blank part of the upper surface of the insulating substrate, so that the through hole penetrates through the conductive film and the insulating substrate;
s32, printing ink patterns on the lower surface of the insulating substrate, sputtering or evaporating the coating film on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, so that conductive films are formed in the through holes of the insulating substrate, on the lower surface of the ink patterns and the blank of the lower surface of the insulating substrate, cleaning the ink patterns on the lower surface of the insulating substrate by using a release agent, enabling the ink patterns on the lower surface of the insulating substrate and the coating film layer on the surface of the ink patterns to be separated from the insulating substrate, keeping and forming a circuit diagram on the conductive films on the blank of the lower surface of the insulating substrate, and connecting the circuit diagram on the upper surface of the insulating substrate with the circuit diagram on the lower surface of the insulating substrate through the conductive films in the through holes.
5. The process of any one of claims 1 to 4, wherein the thickness of the ink pattern is greater than the thickness of the conductive film.
6. The process for manufacturing a circuit board according to claim 1, wherein the insulating substrate is a sheet or a roll.
7. The process of any one of claims 1 to 4, wherein after the conductive film is formed on the upper surface of the ink pattern and the space on the upper surface of the insulating substrate, the conductive film on the upper surface of the ink pattern is broken to expose the ink pattern on the upper surface of the insulating substrate.
8. A process for manufacturing a wiring board according to claim 2 or 3, wherein the conductive films of the upper and lower surfaces of the ink pattern are broken so that the ink pattern of the upper and lower surfaces of the insulating substrate is exposed.
9. The process for manufacturing a circuit board according to claim 1, wherein the insulating substrate is made of PI or PET material.
10. The process of claim 1, wherein the sputtering or evaporating coating is performed to form a copper conductive film on the upper surface of the ink pattern and the space on the upper surface of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311483453.XA CN117528943A (en) | 2023-11-08 | 2023-11-08 | Manufacturing process of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311483453.XA CN117528943A (en) | 2023-11-08 | 2023-11-08 | Manufacturing process of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117528943A true CN117528943A (en) | 2024-02-06 |
Family
ID=89741197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311483453.XA Pending CN117528943A (en) | 2023-11-08 | 2023-11-08 | Manufacturing process of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117528943A (en) |
-
2023
- 2023-11-08 CN CN202311483453.XA patent/CN117528943A/en active Pending
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