CN117520251A - Computer motherboard and computer device of dual processor architecture - Google Patents
Computer motherboard and computer device of dual processor architecture Download PDFInfo
- Publication number
- CN117520251A CN117520251A CN202410015547.2A CN202410015547A CN117520251A CN 117520251 A CN117520251 A CN 117520251A CN 202410015547 A CN202410015547 A CN 202410015547A CN 117520251 A CN117520251 A CN 117520251A
- Authority
- CN
- China
- Prior art keywords
- processor
- interface
- slot
- external
- interfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009977 dual effect Effects 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000000463 material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The embodiment of the invention provides a computer motherboard with a dual-processor architecture and computer equipment, and relates to the technical field of computers. The computer motherboard of the dual processor architecture comprises a substrate, a processor and a cross-over board; the substrate is provided with a first processor slot position, a second processor slot position, a first pair of external interfaces and a second pair of external interfaces; the processor is arranged on the first processor slot position, and the bridging plate is arranged on the second processor slot position; the processor's external interface is connected with first external interface through the external interface of first processor slot, and the interconnection interface of processor loops through the interconnection interface of first processor slot, the interconnection interface of second processor slot and the interconnection interface connection of cross bar, and the external interface of cross bar passes through the external interface of second processor slot and is connected with second external interface. The embodiment of the invention can maximally utilize the computer motherboard resources of the dual-processor architecture under the condition that only one processor is arranged on the computer motherboard of the dual-processor architecture.
Description
Technical Field
The present invention relates to the field of computer technology, and in particular, to a computer motherboard and a computer device with a dual processor architecture.
Background
Currently, computer boards of dual processor architecture are widely used in various computer devices. When designing the computer device, if the requirement of the client on the execution performance of the computer device is higher, two processors can be arranged on the computer motherboard of the dual-processor architecture, and if the requirement of the client on the execution performance of the computer device is lower, only one processor can be arranged on the computer motherboard of the dual-processor architecture.
However, for a computer motherboard of a dual processor architecture, bus resources are used for communication between two processors, and when only one processor is disposed on the computer motherboard of the dual processor architecture, some bus resources for communication between the two processors cannot be used, resulting in resource waste.
Disclosure of Invention
An objective of the embodiments of the present invention is to provide a computer motherboard and a computer device with a dual-processor architecture, so as to maximize the technical effect of using the computer motherboard resources of the dual-processor architecture when only one processor is disposed on the computer motherboard with the dual-processor architecture.
In a first aspect, an embodiment of the present invention provides a computer motherboard of a dual processor architecture, including a substrate, a processor, and a cross board; the substrate is provided with a first processor slot position, a second processor slot position, a first pair of external interfaces and a second pair of external interfaces;
the processor is arranged on the first processor slot position, and the bridging plate is arranged on the second processor slot position;
the processor is characterized in that the external interface of the processor is connected with the first external interface through the external interface of the first processor slot, the interconnection interface of the processor is connected with the interconnection interface of the second processor slot through the interconnection interface of the first processor slot, the interconnection interface of the bridging plate is connected with the interconnection interface of the second processor slot, and the external interface of the bridging plate is connected with the second external interface through the external interface of the second processor slot.
In the implementation process, the bridging plate is arranged on the empty processor slot position of the substrate, and the interconnection bus between the processor slot positions on the substrate is led out by utilizing the bridging plate, so that the computer main board resource of the dual-processor architecture can be utilized to the maximum under the condition that only one processor is arranged on the computer main board of the dual-processor architecture.
Further, the external interfaces of the first processor slot are in one-to-one correspondence with the first pair of external interfaces, the interconnection interfaces of the first processor slot are in one-to-one correspondence with the interconnection interfaces of the second processor slot, and the external interfaces of the second processor slot are in one-to-one correspondence with the second pair of external interfaces.
In the implementation process, through selecting the substrate with the external interfaces of the first processor slot position in one-to-one correspondence with the first pair of external interfaces, the interconnection interfaces of the first processor slot position in one-to-one correspondence with the interconnection interfaces of the second processor slot position, and the external interfaces of the second processor slot position in one-to-one correspondence with the second pair of external interfaces, the wiring operation of the subsequent processor and the bridging plate on the substrate can be simplified, and the wiring accuracy of the processor and the bridging plate on the substrate is ensured.
Further, the external interfaces of the cross-over plate are in one-to-one correspondence with the external interfaces of the processor, and the interconnection interfaces of the cross-over plate are in one-to-one correspondence with the interconnection interfaces of the processor.
In the implementation process, through designing the bridging plates of which the external interfaces are in one-to-one correspondence with the external interfaces of the processor and the interconnection interfaces are in one-to-one correspondence with the interconnection interfaces of the processor, the interconnection buses between the processor slots on the substrate can be completely led out externally by using the bridging plates.
Further, the material of the cross plate is the same as the material of the base plate.
In the implementation process, the cross-over plate is designed by selecting the same material as the substrate, so that the interconnection bus between the processor slots on the substrate can be further ensured to be completely led out by the cross-over plate.
Further, a first fixing device is arranged on the first processor slot position;
the processor is mounted on the first processor slot through the first fixing device.
In the implementation process, the first fixing device is additionally arranged on the first processor slot position of the substrate, and the processor is fixedly arranged on the first processor slot position of the substrate by utilizing the first fixing device, so that the wiring stability of the processor on the substrate can be effectively improved.
Further, a second fixing device is arranged on the second processor slot position;
the jumper plate is mounted to the second processor bay by the second securing device.
In the implementation process, the second fixing device is additionally arranged on the second processor slot position of the substrate, and the bridging plate is fixedly arranged on the second processor slot position of the substrate by utilizing the second fixing device, so that the wiring stability of the bridging plate on the substrate can be effectively improved.
Further, the interconnection interfaces of the first processor slot and the interconnection interfaces of the second processor slot are PCIE interfaces.
In the implementation process, the PCIE interface is selected for the interconnection interface of the first processor slot and the interconnection interface of the second processor slot on the substrate, so that the computer motherboard resource of the dual-processor architecture can be maximally and most efficiently utilized under the condition that only one processor is disposed on the computer motherboard of the dual-processor architecture.
Further, the first external interface and the second external interface each comprise at least one of a USB interface, a PCIE interface, an LPC interface, and a SATA interface.
In the implementation process, at least one of a USB interface, a PCIE interface, an LPC interface and a SATA interface is selected for the first pair of external interfaces and the second pair of external interfaces on the substrate, so that the types of external devices can be enriched, and multiple types of external devices can be supported to use computer motherboard resources of a dual processor architecture.
Further, the processor is a Feiteng processor.
In the implementation process, the execution performance of the computer main board of the dual-processor architecture can be effectively ensured by selecting the Feiteng processor to design the computer main board of the dual-processor architecture.
In a second aspect, an embodiment of the present invention provides a computer device including a computer motherboard of a dual processor architecture as described above.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments of the present invention will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and should not be considered as limiting the scope, and other related drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a computer motherboard with a dual processor architecture according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a computer motherboard with a dual processor architecture according to the prior art;
FIG. 3 is a schematic diagram of a computer motherboard of another dual processor architecture in the prior art;
FIG. 4 is a schematic diagram of a computer motherboard with dual processor architecture according to an alternative embodiment of the present invention;
wherein reference numerals in fig. 1, 4 are as follows:
1: a substrate; 11: a first processor slot; 12: a second processor slot; 13: a first pair of external interfaces; 14: a second external interface; 2: a processor; 3: and a cross-over plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention.
It should be noted that: in the description of the present invention, the terms "first," "second," and the like are used merely to distinguish between descriptions and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a computer motherboard with a dual processor architecture according to a first embodiment of the present invention. The first embodiment of the invention provides a computer motherboard of a dual-processor architecture, which comprises a substrate 1, a processor 2 and a bridging board 3; the substrate 1 is provided with a first processor slot 11, a second processor slot 12, a first pair of external interfaces 13 and a second pair of external interfaces 14; the processor 2 is arranged on the first processor slot 11, and the bridging plate 3 is arranged on the second processor slot 12; the external interface of the processor 2 is connected with the first external interface 13 through the external interface of the first processor slot 11, the interconnection interface of the processor 2 is connected with the interconnection interface of the second processor slot 12 through the interconnection interface of the first processor slot 11, the interconnection interface of the bridging plate 3 is connected with the interconnection interface of the second processor slot 12, and the external interface of the bridging plate 3 is connected with the second external interface 14 through the external interface of the second processor slot 12.
It should be noted that in the prior art, two or one processor is selected according to the execution performance requirement of the computer device, and then, according to the selected processor, a substrate of a dual-processor architecture adapted to the processor is selected, and two processor slots and two groups of external interfaces are arranged on the substrate.
When two processors are selected, two processors are mounted on the two processor slots of the substrate, and a computer motherboard of a dual processor architecture as shown in fig. 2 is designed. When one processor is selected, the processor is installed on any processor slot of the substrate, so that the other processor slot of the substrate is empty, and the computer motherboard of the dual-processor architecture shown in fig. 3 is designed.
As an example, for the case of selecting one processor, according to the execution performance requirement of the computer device, one bridging board 3 is designed, and further, according to the selected processor 2 and the designed bridging board 3, the substrate 1 of the dual-processor architecture adapted to the processor 2 and the bridging board 3 is selected, and the substrate 1 is provided with a first processor slot 11, a second processor slot 12, a first external interface 13 and a second external interface 14.
The processor 2 is installed on the first processor slot 11, the cross-over board 3 is installed on the second processor slot 12, the external interface of the processor 2 is connected with the first external interface 13 through the external interface of the first processor slot 11, the interconnection interface of the processor 2 is connected with the interconnection interface of the second processor slot 12 through the interconnection interface of the first processor slot 11, the interconnection interface of the cross-over board 3 is connected with the interconnection interface of the second processor slot 12, the external interface of the cross-over board 3 is connected with the second external interface 14 through the external interface of the second processor slot 12, and the computer motherboard of the dual processor architecture shown in fig. 1 is designed.
With the dual processor architecture computer motherboard shown in fig. 1, the interconnection interface of the non-empty processor slot (i.e., the first processor slot 11) on the substrate 1 may be connected to the external interface (i.e., the second external interface 14) corresponding to the empty processor slot by using the bridging board 3, so as to be used by an external device.
According to the embodiment of the invention, the cross-over plate 3 is arranged on the empty processor slot position of the substrate 1, and the cross-over plate 3 is utilized to externally lead out the interconnection bus between the processor slots on the substrate 1, so that the computer main board resource of the dual-processor architecture can be utilized to the maximum under the condition that only one processor is arranged on the computer main board of the dual-processor architecture.
In an alternative embodiment, the external interfaces of the first processor slot 11 are in one-to-one correspondence with the first external interfaces 13, the interconnection interfaces of the first processor slot 11 are in one-to-one correspondence with the interconnection interfaces of the second processor slot 12, and the external interfaces of the second processor slot 12 are in one-to-one correspondence with the second external interfaces 14.
The first external interface 13, the external interface of the first processor slot 11, the interconnection interface of the second processor slot 12, the external interface of the second processor slot 12, and the second external interface 14 on the substrate 1 are all a set of interfaces.
As an example, when selecting the substrate 1, the substrate 1 should satisfy: the external interfaces of the first processor slot 11 are in one-to-one correspondence with the first external interfaces 13, the interconnection interfaces of the first processor slot 11 are in one-to-one correspondence with the interconnection interfaces of the second processor slot 12, and the external interfaces of the second processor slot 12 are in one-to-one correspondence with the second external interfaces 14.
It can be understood that after the corresponding relationship between the first pair of external interfaces 13 on the substrate 1, the external interface of the first processor slot 11, the interconnection interface of the second processor slot 12, the external interface of the second processor slot 12, and the second pair of external interfaces 14 is determined, the subsequent fast and accurate access of the processor 2 and the jumper board 3 to the substrate 1 can be facilitated.
According to the embodiment of the invention, the substrate 1 with the external interfaces of the first processor slot 11 in one-to-one correspondence with the first external interfaces 13, the interconnection interfaces of the first processor slot 11 in one-to-one correspondence with the interconnection interfaces of the second processor slot 12 and the external interfaces of the second processor slot 12 in one-to-one correspondence with the second external interfaces 14 is selected, so that the wiring operation of the subsequent processor 2 and the bridging plate 3 on the substrate 1 can be simplified, and the wiring accuracy of the processor 2 and the bridging plate 3 on the substrate 1 is ensured.
In an alternative embodiment, the external interfaces of the bridging board 3 are in one-to-one correspondence with the external interfaces of the processor 2, and the interconnection interfaces of the bridging board 3 are in one-to-one correspondence with the interconnection interfaces of the processor 2.
As an example, in designing the crossover plate 3, the crossover plate 3 should satisfy: the external interfaces of the bridging plate 3 are in one-to-one correspondence with the external interfaces of the processor 2, and the interconnection interfaces of the bridging plate 3 are in one-to-one correspondence with the interconnection interfaces of the processor 2.
It can be understood that, referring to the external interface and the interconnection interface of the processor 2, the external interface and the interconnection interface of the bridging board 3 are designed, so that the bridging board 3 and the processor 2 have the same and corresponding interfaces, the interconnection interface of the non-empty processor slot on the substrate 1 can be conveniently, quickly and accurately connected to the external interface corresponding to the empty processor slot across the empty processor slot, and the interconnection bus between the processor slots on the substrate 1 is completely led out externally.
According to the embodiment of the invention, the bridging plates 3 which are in one-to-one correspondence with the external interfaces of the processor 2 and the interconnection interfaces of the processor 2 are designed, so that the interconnection buses among the processor slots on the substrate 1 can be completely led out from the outside by using the bridging plates 3.
In an alternative embodiment, the material of the crossover plate 3 is the same as the material of the base plate 1.
Illustratively, after the substrate 1 is selected, the material of the substrate 1, such as an FR-4 grade material, is determined and the same material as the substrate 1 is selected to design the crossover plate 3.
It can be understood that the same material as the substrate 1 is selected to design the bridging plate 3, so that the electrical characteristics of the accessed bridging plate 3 and the substrate 1 can be kept consistent, parameters such as impedance, standing wave and the like of the whole wiring link on the substrate 1 are not changed, and the interconnection bus between processing slots on the substrate 1 is further ensured to be completely led out from the outside by using the bridging plate 3.
According to the embodiment of the invention, the cross-over plate 3 is designed by selecting the same material as the substrate 1, so that the interconnection bus between the processor slots on the substrate 1 can be further ensured to be completely led out from the outside by using the cross-over plate 3.
In an alternative embodiment, the first processor slot 11 is provided with first fixing means; the processor 2 is mounted on the first processor socket 11 by means of a first fixture.
As an example, the first processor socket 11 on the substrate 1 is generally designed as a socket structure, and the processor 2 may be mounted on the first processor socket 11 by inserting pins of the processor 2 into the first processor socket 11 or soldering pins of the processor 2 on the first processor socket 11 according to a socket indication direction.
In practical applications, after the computer motherboard is assembled into the computer device, the computer motherboard moves along with the movement of the computer device. In order to avoid the problem that the processor 2 loosens on the substrate 1 to break the wiring in the moving process of the computer equipment, a first fixing device is additionally arranged on the first processor slot 11 of the substrate 1, and the processor 2 is fixedly arranged on the first processor slot 11 by using the first fixing device.
The first fixing device may be a bolt fixing device, a buckle fixing device, or other devices for reinforcing the processor 2 on the mounting substrate 1.
According to the embodiment of the invention, the first fixing device is additionally arranged on the first processor slot 11 of the substrate 1, and the processor 2 is fixedly arranged on the first processor slot 11 of the substrate 1 by utilizing the first fixing device, so that the wiring stability of the processor 2 on the substrate 1 can be effectively improved.
In an alternative embodiment, the second processor slot 12 is provided with second securing means; the cross plate 3 is mounted on the second processor socket 12 by means of a second fixing means.
As an example, the second processor socket 12 on the substrate 1 is also generally designed as a socket structure, and the jumper board 3 may be mounted on the second processor socket 12 by inserting the pins of the jumper board 3 into the second processor socket 12 or soldering the pins of the jumper board 3 on the second processor socket 12 according to the direction indicated by the socket.
In practical applications, after the computer motherboard is assembled into the computer device, the computer motherboard moves along with the movement of the computer device. In order to avoid the problem that the connection is broken due to loosening of the bridging plate 3 on the substrate 1 in the moving process of the computer equipment, a second fixing device is additionally arranged on the second processor slot 12 of the substrate 1, and the bridging plate 3 is fixedly arranged on the second processor slot 12 by using the second fixing device.
The second fixing device may be a bolt fixing device, a buckle fixing device, or other devices for reinforcing the bridging plate 3 on the mounting substrate 1.
According to the embodiment of the invention, the second fixing device is additionally arranged on the second processor slot 12 of the substrate 1, and the bridging plate 3 is fixedly arranged on the second processor slot 12 of the substrate 1 by using the second fixing device, so that the wiring stability of the bridging plate 3 on the substrate 1 can be effectively improved.
In an alternative embodiment, the interconnect interface of the first processor slot 11 and the interconnect interface of the second processor slot 12 are PCIE interfaces.
Illustratively, PCI-Express (peripheral component interconnect Express, PCIE) is a high-speed serial computer expansion bus standard, and its main advantage is high data transmission rate.
For example, the interconnect interface of the first processor slot 11 and the interconnect interface of the second processor slot 12 are pcie×4 interfaces.
According to the embodiment of the invention, the PCIE interface is selected for the interconnection interface of the first processor slot 11 and the interconnection interface of the second processor slot 12 on the substrate 1, so that the computer main board resource of the dual-processor architecture can be utilized maximally and most efficiently under the condition that only one processor is arranged on the computer main board of the dual-processor architecture.
In an alternative embodiment, the first pair of external interfaces 13 and the second pair of external interfaces 14 each include at least one of a USB interface, a PCIE interface, an LPC interface, and a SATA interface.
As an example, USB (Universal Serial Bus ) is a serial bus standard, and is also a technical specification of an input/output interface, and is widely used in information communication products such as personal computers and mobile devices, and is extended to other related fields such as photographic equipment, digital televisions (set top boxes), game machines, and the like.
PCIE belongs to high-speed serial point-to-point dual-channel high-bandwidth transmission, and connected equipment allocates single-shared channel bandwidth without sharing bus bandwidth and mainly supports functions of active power management, error reporting, end-to-end reliability transmission, hot plug, quality of service (QOS) and the like.
The LPC bus (Low pin count Bus) is used in IBM PC compatible machines to connect low bandwidth devices and "old" to the CPU (Central Processing Unit ). Those common low speed devices are: BIOS (Basic Input Output System ), serial port, parallel port, PS/2 (an input device interface) keyboard and mouse, floppy disk controller, and more recent devices have trusted platform modules.
SATA (Serial ATA) is a computer bus, and is mainly used for data transmission between a motherboard and a large number of storage devices such as a hard disk and an optical disk drive.
In selecting the substrate 1, the substrate 1 should satisfy: the first pair of external interfaces 13 and the second pair of external interfaces 14 each include at least one of a USB interface, a PCIE interface, an LPC interface, and a SATA interface.
It can be understood that at least one of a USB interface, a PCIE interface, an LPC interface, and a SATA interface is selected for the first external interface 13 and the second external interface 14 on the substrate 1, so that multiple types of external devices can be supported to use computer motherboard resources of the dual processor architecture.
According to the embodiment of the invention, the type of the external equipment can be enriched by selecting at least one of the USB interface, the PCIE interface, the LPC interface and the SATA interface for the first external interface 13 and the second external interface 14 on the substrate 1, and the computer main board resources of a dual processor architecture are supported by various types of external equipment.
In an alternative embodiment, processor 2 is a Feiteng processor.
Illustratively, the processor 2 is a Feiteng processor, such as Feiteng E2000 processor.
In practical applications, the processor 2 may alternatively be a processor.
Assuming that processor 2 is a Feiteng E2000 processor, the Feiteng E2000 processor is installed on the first processor slot 11, and the cross-over board 3 is installed on the second processor slot 12, so that the external interfaces AA0, AA1, AA2, AA3, AA4, AA5, AA6, AA7 of the Feiteng E2000 processor correspond to the external interfaces AA0, AA1, AA2, AA3, AA4, AA5, AA6, AA7 passing through the first processor slot 11 and are connected with the first external interfaces 13AA0, AA1, AA2, AA3, AA4, AA5, AA6, AA7, the interconnection interfaces AE0, AE1, AE2, AE3, AE4, AE5, AE6, AE7 of the Feiteng E2000 processor correspond to the interconnection interfaces AE0, AE1, AE2, AE3, AE4, AE5, AE6, AE7 passing through the first processor slot 11 and are connected with the interconnection interfaces AE0, AE1, AE2, AE3, AE4, AE6, AE7 of the second processor slot 12, the interconnection interfaces AE0, AE1, AE2, AE3, AE4, AE5, AE6, AE7 of the cross board 3 are correspondingly connected with the interconnection interfaces AE0, AE1, AE2, AE3, AE4, AE5, AE6, AE7 of the second processor slot 12, and the external interfaces AA0, AA1, AA2, AA3, AA4, AA5, AA6, AA7 of the cross board 3 are correspondingly connected with the external interfaces AA0, AA1, AA2, AA3, AA4, AA5, AA6, AA7 of the second processor slot 12, so as to design a computer motherboard of the dual processor architecture as shown in fig. 4.
According to the embodiment of the invention, the Feiteng processor is selected to design the computer main board of the double-processor architecture, so that the execution performance of the computer main board of the double-processor architecture can be effectively ensured.
The second embodiment of the present invention provides a computer device, which includes a computer motherboard of the dual processor architecture according to the first embodiment of the present invention, and can achieve the same advantages as the first embodiment.
In summary, the embodiment of the present invention provides a computer motherboard and a computer device with a dual-processor architecture, where the computer motherboard with the dual-processor architecture includes a substrate 1, a processor 2, and a jumper board 3; the substrate 1 is provided with a first processor slot 11, a second processor slot 12, a first pair of external interfaces 13 and a second pair of external interfaces 14; the processor 2 is arranged on the first processor slot 11, and the bridging plate 3 is arranged on the second processor slot 12; the external interface of the processor 2 is connected with the first external interface 13 through the external interface of the first processor slot 11, the interconnection interface of the processor 2 is connected with the interconnection interface of the second processor slot 12 through the interconnection interface of the first processor slot 11, the interconnection interface of the bridging plate 3 is connected with the interconnection interface of the second processor slot 12, and the external interface of the bridging plate 3 is connected with the second external interface 14 through the external interface of the second processor slot 12. According to the embodiment of the invention, the cross-over plate 3 is arranged on the empty processor slot position of the substrate 1, and the cross-over plate 3 is utilized to externally lead out the interconnection bus between the processor slots on the substrate 1, so that the computer main board resource of the dual-processor architecture can be utilized to the maximum under the condition that only one processor is arranged on the computer main board of the dual-processor architecture.
In the several embodiments provided in the present invention, it should be understood that the disclosed apparatus and method may be implemented in other manners. The apparatus embodiments described above are merely illustrative, for example, flow diagrams and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
In addition, functional modules in the embodiments of the present invention may be integrated together to form a single part, or each module may exist alone, or two or more modules may be integrated to form a single part.
The functions, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily appreciate variations or alternatives within the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. The computer motherboard of the dual-processor architecture is characterized by comprising a substrate, a processor and a cross-over board; the substrate is provided with a first processor slot position, a second processor slot position, a first pair of external interfaces and a second pair of external interfaces;
the processor is arranged on the first processor slot position, and the bridging plate is arranged on the second processor slot position;
the processor is characterized in that the external interface of the processor is connected with the first external interface through the external interface of the first processor slot, the interconnection interface of the processor is connected with the interconnection interface of the second processor slot through the interconnection interface of the first processor slot, the interconnection interface of the bridging plate is connected with the interconnection interface of the second processor slot, and the external interface of the bridging plate is connected with the second external interface through the external interface of the second processor slot.
2. The dual processor architecture computer motherboard of claim 1, wherein the external interfaces of the first processor slot are in one-to-one correspondence with the first pair of external interfaces, the interconnect interfaces of the first processor slot are in one-to-one correspondence with the interconnect interfaces of the second processor slot, and the external interfaces of the second processor slot are in one-to-one correspondence with the second pair of external interfaces.
3. The dual processor architecture computer motherboard of claim 1, wherein the external interfaces of the cross board are in one-to-one correspondence with the external interfaces of the processor, and the interconnect interfaces of the cross board are in one-to-one correspondence with the interconnect interfaces of the processor.
4. The dual processor architecture computer motherboard of claim 1, wherein the material of the cross-over board is the same as the material of the substrate.
5. The dual processor architecture computer motherboard of claim 1, wherein the first processor slot is provided with a first fixture;
the processor is mounted on the first processor slot through the first fixing device.
6. The dual processor architecture computer motherboard of claim 1, wherein a second fixture is disposed on the second processor slot;
the jumper plate is mounted to the second processor bay by the second securing device.
7. The dual processor architecture computer motherboard of claim 1, wherein the interconnect interface of the first processor slot and the interconnect interface of the second processor slot are PCIE interfaces.
8. The dual processor architecture computer motherboard of claim 1, wherein the first pair of external interfaces and the second pair of external interfaces each comprise at least one of a USB interface, a PCIE interface, an LPC interface, a SATA interface.
9. The dual processor architecture computer motherboard of claim 1, wherein the processor is a Feiteng processor.
10. A computer device comprising a computer motherboard of a dual processor architecture according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410015547.2A CN117520251A (en) | 2024-01-05 | 2024-01-05 | Computer motherboard and computer device of dual processor architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410015547.2A CN117520251A (en) | 2024-01-05 | 2024-01-05 | Computer motherboard and computer device of dual processor architecture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117520251A true CN117520251A (en) | 2024-02-06 |
Family
ID=89766858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410015547.2A Pending CN117520251A (en) | 2024-01-05 | 2024-01-05 | Computer motherboard and computer device of dual processor architecture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117520251A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102073612A (en) * | 2009-11-20 | 2011-05-25 | 英业达股份有限公司 | Architecture for converting CPU (Central Processing Unit) socket into low-speed bus |
| CN102081587A (en) * | 2009-11-26 | 2011-06-01 | 英业达股份有限公司 | Bus adaptor card structure arranged on CPU (Central Processing Unit) |
| TW201142576A (en) * | 2010-05-31 | 2011-12-01 | Hon Hai Prec Ind Co Ltd | Motherboard |
| CN108762819A (en) * | 2018-06-11 | 2018-11-06 | 山东超越数控电子股份有限公司 | A kind of implementation method of two-way server mainboard on backboard |
| CN110007721A (en) * | 2018-01-05 | 2019-07-12 | 联想企业解决方案(新加坡)有限公司 | Computer server and mainboard assembly |
| CN212569635U (en) * | 2020-06-15 | 2021-02-19 | 中科长城海洋信息系统有限公司 | VPX computer motherboard based on processor chip flies to ten |
| WO2023020451A1 (en) * | 2021-08-20 | 2023-02-23 | 华为技术有限公司 | Motherboard and computing device |
| CN116662244A (en) * | 2023-06-16 | 2023-08-29 | 海光信息技术股份有限公司 | Main board of multipath server, server and power-on control method |
-
2024
- 2024-01-05 CN CN202410015547.2A patent/CN117520251A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102073612A (en) * | 2009-11-20 | 2011-05-25 | 英业达股份有限公司 | Architecture for converting CPU (Central Processing Unit) socket into low-speed bus |
| CN102081587A (en) * | 2009-11-26 | 2011-06-01 | 英业达股份有限公司 | Bus adaptor card structure arranged on CPU (Central Processing Unit) |
| TW201142576A (en) * | 2010-05-31 | 2011-12-01 | Hon Hai Prec Ind Co Ltd | Motherboard |
| CN110007721A (en) * | 2018-01-05 | 2019-07-12 | 联想企业解决方案(新加坡)有限公司 | Computer server and mainboard assembly |
| CN108762819A (en) * | 2018-06-11 | 2018-11-06 | 山东超越数控电子股份有限公司 | A kind of implementation method of two-way server mainboard on backboard |
| CN212569635U (en) * | 2020-06-15 | 2021-02-19 | 中科长城海洋信息系统有限公司 | VPX computer motherboard based on processor chip flies to ten |
| WO2023020451A1 (en) * | 2021-08-20 | 2023-02-23 | 华为技术有限公司 | Motherboard and computing device |
| CN116662244A (en) * | 2023-06-16 | 2023-08-29 | 海光信息技术股份有限公司 | Main board of multipath server, server and power-on control method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106063396B (en) | Cableless connection apparatus and method for communication between pedestals | |
| CN106126448B (en) | Storage system | |
| US7711886B2 (en) | Dynamically allocating communication lanes for a plurality of input/output (‘I/O’) adapter sockets in a point-to-point, serial I/O expansion subsystem of a computing system | |
| US9141152B2 (en) | Interface card mount | |
| US20080126597A1 (en) | Alternative Local Card, Central Management Module and System Management Architecture For Multi-Mainboard System | |
| US11199890B2 (en) | Peripheral device expansion card system | |
| EP1204924A1 (en) | Diagnostic caged mode for testing redundant system controllers | |
| US20180165244A1 (en) | CONFIGURABLE PCIe BANDWIDTH UTILIZATION BETWEEN PCI RISER AND OTHER INTERNAL FUNCTIONS | |
| US11163660B2 (en) | Link downgrade detection system | |
| US20180145869A1 (en) | Debugging method of switches | |
| CN100541387C (en) | A kind of server system based on the Opteron processor | |
| CN100414526C (en) | Method and device for automatically adjusting bus width | |
| CN117520251A (en) | Computer motherboard and computer device of dual processor architecture | |
| US20230334155A1 (en) | Data center security control module and control method thereof | |
| CN213276462U (en) | Two-way server mainboard and two-way server | |
| CN214011980U (en) | Server with RAS (remote server system) characteristic | |
| CN204189089U (en) | A kind of server | |
| US9626326B2 (en) | Data storage expanding apparatus | |
| CN114116564A (en) | PCIE (peripheral component interface express) bandwidth resource expansion method and device for bridging PCIE bus and Raid card | |
| US11093431B2 (en) | Automated device discovery system | |
| CN112000189A (en) | Server mainboard based on S2500 processor | |
| CN107122268B (en) | NUMA-based multi-physical-layer partition processing system | |
| CN111563058A (en) | Device for switching PCIE Gen4 in server | |
| CN111737174A (en) | Tri-mode RAID function compatible hard disk backplane and design method thereof | |
| CN216352292U (en) | Server mainboard and server |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |