CN117516210A - Condensed water heat exchange system and storage device - Google Patents

Abstract

The invention discloses a condensed water heat exchange system and storage equipment, which are used in the technical field of heat exchange, wherein the condensed water heat exchange system comprises a cold end heat exchanger, a water box, a hot end heat exchanger and a water pipe; the periphery of the cold end heat exchanger is provided with a condensation water cavity for accommodating condensed water generated by the cold end heat exchanger; the hot end heat exchanger is used for heating condensed water in the water box; the water pipe is used for conveying condensed water in the condensed water cavity where the cold-end heat exchanger is positioned to the water box. In the condensate water heat transfer system that this application provided, the comdenstion water of condensation water cavity flows into the water box through the water pipe, because the comdenstion water in the water box can be through hot junction heat exchanger heating, and then makes the comdenstion water in the water box evaporate soon, and then reduces the condition that storage facilities leaked.

Description

Condensed water heat exchange system and storage device

Technical Field

The invention relates to the technical field of heat exchange, in particular to a condensed water heat exchange system. The invention also relates to a storage device comprising the condensed water heat exchange system.

Background

In the refrigerating/heating process of the storage device, the temperature of the cold-end heat exchanger reaches the dew point temperature, and condensed water is separated out. If the temperature is continuously reduced, frosting can be formed on the surface of the heat exchanger, the frosting can increase the heat resistance of the heat exchanger, the heat exchange efficiency is reduced, reverse heating is needed, the frosting is melted, and more condensed water can be generated.

When a vapor compression refrigeration system is generally utilized, condensed water is discharged into a water receiving disc through a drain hole for temporary storage, so that the condensed water accumulated in the water receiving disc disappears by natural evaporation. However, if the amount of condensed water is large and the humidity of the air in the room is large, the condensed water in the water receiving tray overflows, so that the equipment leaks.

Therefore, how to reduce the water leakage of the storage device is a technical problem to be solved by those skilled in the art.

Disclosure of Invention

The invention aims to provide a condensed water heat exchange system so as to reduce the water leakage of storage equipment. Another object of the present invention is to provide a storage device comprising the above condensed water heat exchange system.

To achieve the above object, the present invention provides a condensed water heat exchange system, comprising:

the periphery of the cold end heat exchanger is provided with a condensation water cavity for accommodating the generated condensed water;

a water box;

the hot end heat exchanger is used for heating condensed water in the water box;

and the water pipe is used for conveying condensed water in the condensed water cavity where the cold-end heat exchanger is positioned to the water box.

Preferably, the water inlet of the same water pipe is higher than the water outlet of the water box.

Preferably, the water box is mounted on the upper surface of the hot end heat exchanger.

Preferably, the water box further comprises a first intermediate phase change heat exchanger connecting the hot end heat exchanger side and the water box side.

Preferably, the water box is isolated from the hot end heat exchanger, and is connected with the hot end heat exchanger through a second intermediate phase change heat exchanger, and is positioned above the hot end heat exchanger.

Preferably, the heat exchange device further comprises a storage and a heat exchange module, wherein a storage cavity for accommodating devices and a heat dissipation air channel isolated from the storage cavity are arranged on the storage, the heat exchange module comprises a semiconductor refrigerator, a first phase-change heat exchanger and a second phase-change heat exchanger, the first phase-change heat exchanger and the second phase-change heat exchanger are respectively arranged at two opposite ends of a cold end and a hot end of the semiconductor refrigerator, the second phase-change heat exchanger is arranged in the storage cavity, the first phase-change heat exchanger is arranged in the heat dissipation air channel, when the first phase-change heat exchanger is a hot end heat exchanger, the second phase-change heat exchanger is a cold end heat exchanger, and the water box comprises a first water box arranged at the top end of the first phase-change heat exchanger.

Preferably, when the first phase-change heat exchanger is a cold-end heat exchanger and the second phase-change heat exchanger is a hot-end heat exchanger, the first phase-change heat exchanger is used as the cold-end heat exchanger, the electric device in the heat dissipation air duct is the hot-end heat exchanger, the heat dissipation air duct in which the first phase-change heat exchanger is located is used as the condensation water cavity, and the water box comprises a second water box arranged at the top end of the electric device.

Preferably, the heat dissipation air duct comprises an air inlet, an air outlet and an intermediate heat dissipation air duct connected with the air inlet and the air outlet, the first phase-change heat exchanger is positioned in the intermediate heat dissipation air duct, the number of the heat exchange modules and the number of the intermediate heat dissipation air duct are multiple, the plurality of the intermediate heat dissipation air ducts are arranged in parallel, and the heat exchange modules are in one-to-one correspondence with the intermediate heat dissipation air duct;

the number of the storage cavities is multiple, the storage cavities are sequentially arranged from top to bottom, and the storage cavities above are used as condensation water cavities and are connected with the water boxes arranged on the outer sides of the storage cavities below through the water pipes.

Preferably, the storage cavity at the bottommost end is used as a condensation water cavity and is connected with the water box arranged above the hot end heat exchanger through the water pipe and an electric device below the storage cavity and positioned in the heat dissipation air duct.

A storage device comprising a storage device as claimed in any preceding claim.

In the technical scheme, the condensed water heat exchange system provided by the invention comprises a cold end heat exchanger, a water box, a hot end heat exchanger and a water pipe; the periphery of the cold end heat exchanger is provided with a condensation water cavity for accommodating the generated condensation water; the hot end heat exchanger is used for heating condensed water in the water box; the water pipe is used for conveying condensed water in the condensed water cavity where the cold-end heat exchanger is positioned to the water box.

According to the above description, in the condensed water heat exchange system provided by the application, condensed water in the condensed water cavity flows into the water box through the water pipe, and as the condensed water in the water box can be heated through the hot end heat exchanger, the condensed water in the water box is quickly evaporated, and the water leakage condition of the storage device is reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is an exploded view of a heat exchange module according to an embodiment of the present invention;

FIG. 2 is a side view of a condensate heat exchange system according to an embodiment of the present invention;

FIG. 3 is a rear view of a condensate heat exchange system according to an embodiment of the present invention;

fig. 4 is a three-dimensional structure diagram of a condensate water heat exchange system provided by an embodiment of the present invention;

FIG. 5 is a schematic view of a heat dissipation structure of a water tank according to an embodiment of the present invention;

fig. 6 is a schematic view of another heat dissipation structure of a water tank according to an embodiment of the present invention.

Wherein in fig. 1-6:

1. a semiconductor refrigerator;

2. a second phase shift converter; 2-1, a second phase shift converter; 2-2, a second phase shift converter;

3. a first phase change heat exchanger; 3-1, a first phase change heat exchanger; 3-2, a first phase change heat exchanger;

4. a drain hole; 5. a water pipe;

6. a water box; 6-1, a water box; 6-2, a water box; 6-3, a water box;

7. a thermal insulation layer; 8. an intermediate heat dissipation air duct;

9-1, condensing water cavity; 9-2, condensing the water cavity;

10. a heat exchange module; 10-1, a heat exchange module; 10-2, a heat exchange module; 10-3, a heat exchange module;

11. an air inlet; 12. an intermediate blower; 13. an air inlet split-flow air duct; 14. an air outlet fan; 15. an air outlet; 16. an air outlet converging air duct; 17. a first intermediate phase change heat exchanger; 18. a second intermediate phase change heat exchanger; 19. and an electric control box.

Detailed Description

The core of the invention is to provide a condensed water heat exchange system so as to reduce the water leakage of storage equipment. Another core of the present invention is to provide a storage device comprising the above condensed water heat exchange system.

The present invention will be described in further detail below with reference to the drawings and embodiments, so that those skilled in the art can better understand the technical solutions of the present invention.

Please refer to fig. 1 to 6.

In a specific embodiment, the cold end heat exchanger, the water box 6, the hot end heat exchanger and the water pipe 5 of the condensed water heat exchange system provided by the specific embodiment of the invention; the periphery of the cold end heat exchanger is provided with a condensation water cavity for accommodating the generated condensation water. The hot end heat exchanger is used for heating condensed water in the water box 6; the water pipe 5 is used for conveying condensed water in the condensed water cavity where the cold-end heat exchanger is positioned to the water box 6.

According to the above description, in the condensed water heat exchange system provided by the specific embodiment of the application, condensed water in the condensed water cavity flows into the water box 6 through the water pipe 5, and as the condensed water in the water box 6 can be heated through the hot end heat exchanger, the condensed water in the water box 6 is quickly evaporated, and the water leakage condition of the storage device is reduced.

In order to facilitate the smooth discharge of the condensed water, it is preferable that the water inlet of the same water pipe 5 is higher than the water outlet of the water box 6.

In order to facilitate the rapid evaporation of the condensed water in the water box 6, it is preferable that the water box 6 is installed on the upper surface of the hot side heat exchanger. Specifically, the water box 6 can be directly placed on the upper surface of the hot-end heat exchanger, preferably, the upper surface of the hot-end heat exchanger is provided with a placing groove for accommodating the water box 6, so that the placing stability of the water box 6 is improved.

As shown in fig. 5, in order to further increase the evaporation rate of the condensed water, it is preferable that the condensed water heat exchanging system further includes a first intermediate phase change heat exchanger 17 connecting the hot side heat exchanger side and the water box 6 side. Specifically, the side surfaces of the water box 6 and the hot end heat exchanger are both abutted against the first intermediate phase change heat exchanger 17, and more preferably, the connection surfaces of the water box 6 and the hot end heat exchanger and the first intermediate phase change heat exchanger 17 are provided with heat conducting layers.

In another embodiment, the water box 6 is isolated from the hot side heat exchanger, the water box 6 is connected to the hot side heat exchanger through a second intermediate phase change heat exchanger 18, and the water box 6 is located above the hot side heat exchanger. In particular, the second intermediate phase change heat exchanger 18 may be arranged in a zigzag manner. Preferably, the junction surfaces of the water box 6 and the hot end heat exchanger and the second intermediate phase change heat exchanger 18 are provided with heat conducting layers. The first intermediate phase-change heat exchanger 17 and the second intermediate phase-change heat exchanger 18 rapidly transfer the hot-side heat exchanger to the water box 6 using the gravity heat pipe principle.

In a specific embodiment, the condensed water heat exchange system further comprises a storage and a heat exchange module 10, wherein a storage cavity for accommodating devices and a heat dissipation air duct isolated from the storage cavity are arranged on the storage.

The heat exchange module 10 includes a semiconductor refrigerator 1 (TEC), a first phase change heat exchanger 3, and a second phase change heat exchanger 2. The first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 are respectively arranged at two opposite ends of the cold and hot end of the semiconductor refrigerator 1, the second phase-change heat exchanger 2 is positioned in the storage cavity, and the first phase-change heat exchanger 3 is positioned in the heat dissipation air duct.

When the first phase change heat exchanger 3 is a hot end heat exchanger and the second phase change heat exchanger 2 is a cold end heat exchanger, the first phase change heat exchanger 3 is used as the hot end heat exchanger, the second phase change heat exchanger 2 is used as the cold end heat exchanger, and the water box 6 comprises first water boxes 6-1 and 6-2 which are arranged at the top end of the first phase change heat exchanger 3.

Specifically, the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 are attached to the semiconductor refrigerator 1. In a specific embodiment, the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 are arranged in a fitting manner with the semiconductor refrigerator 1. Specifically, the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 may be symmetrically disposed at opposite sides of the semiconductor refrigerator 1.

The first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 in the heat exchange module 10 quickly separate the cold and heat quantity generated at the cold and hot ends of the semiconductor refrigerator 1 into the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 by utilizing the gravity type heat pipe principle.

In order to further improve the heat exchange efficiency, fins are arranged on the surface, away from the semiconductor refrigerator 1, of at least one of the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2, wherein the arrangement direction of the fins is determined according to actual needs, and preferably, the fins on the first phase-change heat exchanger 3 are arranged along the direction perpendicular to the air flow in the heat dissipation air duct.

Preferably, the fins of the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 are uniformly distributed, and in particular, the fins can be adhered or welded on the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2.

Specifically, the heat dissipation air duct can be independently arranged relative to the memory, and the heat dissipation air duct is installed at a corresponding position of the memory after the heat dissipation module is installed.

Specifically, when the first phase change heat exchanger 3 is a cold end heat exchanger and the second phase change heat exchanger 2 is a hot end heat exchanger, the first phase change heat exchanger 3 is used as the cold end heat exchanger, the electric device in the heat dissipation air duct is the hot end heat exchanger, and the heat dissipation air duct in which the first phase change heat exchanger 3 is located is used as the condensation water cavity. The water box 6 includes a second water box 6-3 provided at the top end of the electric device.

The heat dissipation wind channel includes air intake 11, air outlet 15 and connects air intake 11 and air outlet 15's middle heat dissipation wind channel 8, and first phase change heat exchanger 3 is located middle heat dissipation wind channel 8, and heat transfer module 10 and middle heat dissipation wind channel 8's number is a plurality of, and a plurality of middle heat dissipation wind channels 8 parallelly connected settings, heat transfer module 10 and middle heat dissipation wind channel 8 one-to-one. Preferably, all the intermediate heat dissipation air ducts 8 are arranged in parallel.

As shown in fig. 2, two heat exchange modules 10 are arranged, the second phase change heat exchanger 2-1 of the upper heat exchange module 10 is located above the side end of the semiconductor refrigerator 1, the first phase change heat exchanger 3-1 is located above the side end of the semiconductor refrigerator 1, the second phase change heat exchanger 2-2 of the lower heat exchange module 10 is located above the side end of the semiconductor refrigerator 1, and the first phase change heat exchanger 3-2 is located above the side end of the semiconductor refrigerator 1.

The number of the storage cavities is multiple, and the storage cavities are sequentially arranged from top to bottom, and the upper storage cavity is used as a condensation water cavity and is connected with a water box 6 arranged outside the lower storage cavity through a water pipe 5. So that the condensed water automatically flows into the lower water box 6 under the action of self gravity.

In another embodiment, when the air inlet 11 is located at the top end of the storage, the air outlet 15 is located at the bottom end of the storage. Preferably, the heat dissipation air duct is located at the back of the memory.

The air outlet 15 is positioned at the front part of the top end of the storage, and the air outlet 15 is positioned at the rear part or the lower surface of the bottom end of the storage, so that the hot air of the air outlet 15 is prevented from interfering with the air inlet.

In order to facilitate the air outlet, the air outlet 15 is preferably formed to be outwardly expanded along the air flow.

The heat exchange modules 10 are multiple, and at least one first phase-change heat exchanger 3 is arranged in each intermediate heat dissipation air duct 8. Preferably, the heat exchange modules 10 are in one-to-one correspondence with the intermediate heat dissipation air channels 8, i.e. one first phase change heat exchanger 3 is arranged in each intermediate heat dissipation air channel 8.

Specifically, the number of the intermediate heat dissipation air channels 8 is at least two, and the plurality of intermediate heat dissipation air channels 8 are arranged in parallel, and the distances between the first phase-change heat exchangers 3 in the two adjacent intermediate heat dissipation air channels 8 and the air inlet 11 are different. As shown in fig. 3, the number of the intermediate heat exchange air channels is three. At this time, the number of the heat exchange modules 10 is preferably three, namely, the heat exchange module 10-1, the heat exchange module 10-2 and the heat exchange module 10-3, which are respectively in one-to-one correspondence with the three middle heat exchange air channels. At this time, the number of the water boxes 6 is three, and the first water box 6-1, the first water box 6-2 and the second water box 6-3 are respectively positioned above the middle heat exchange module 10-2, the bottom heat exchange module 10-3 and the bottommost electric control box 19.

In order to improve the heat exchange efficiency, the heat exchange device preferably further comprises an intermediate fan 12 in the intermediate heat dissipation air duct 8. Preferably, the intermediate blower 12 may be disposed at an inlet position of the intermediate heat dissipation duct 8.

In order to facilitate uniform heat dissipation of the storage cavities, preferably, the number of the storage cavities and the number of the intermediate heat dissipation air channels 8 are multiple, and the back of each storage cavity corresponds to one independent intermediate heat dissipation air channel 8, or the intermediate heat dissipation air channels 8 are sequentially distributed along the vertical and storage cavity distribution directions.

In a specific embodiment, the number of the intermediate heat dissipation air channels 8 is at least two, and the plurality of intermediate heat dissipation air channels 8 are arranged in parallel, the air inlet ends of all the intermediate heat dissipation air channels 8 are communicated with the air inlet 11 through the air inlet split air channel 13, and all the intermediate heat dissipation air channels 8 are communicated with the air outlet 15 through the air outlet converging air channel 16.

Preferably, the air inlet split air duct 13 and the air outlet converging air duct 16 are located at opposite ends of the middle heat dissipation air duct 8, and specifically, the air inlet split air duct 13 and the air outlet converging air duct 16 are located at left and right ends of the middle heat dissipation air duct 8 respectively.

Or the air inlet split-flow air duct 13 and the air outlet converging air duct 16 are respectively positioned at the upper end and the lower end of the middle heat dissipation air duct 8.

When the air conditioner works, normal-temperature air enters the air inlet split air duct 13 from the air inlet 11, then enters the middle heat dissipation air duct 8 in multiple ways, and after air cooling and heat dissipation are respectively carried out on the electric control box 19 and the first phase-change heat exchanger 3 corresponding to different storage areas, the air is converged to the air outlet converging air duct 16, and finally is discharged to the environment through the air outlet 15.

Preferably, the semiconductor refrigerator 1 is embedded in the plate body of the memory, and the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 are isolated by the heat insulating layer 7. In particular, the insulating layer 7 may be the rear wall of the reservoir.

The condensed water heat exchange system also comprises an air inlet fan arranged at the air inlet 11, and also comprises an air outlet fan 14 provided with an air outlet 15. The number of the air inlet fans and the air outlet fans 14 can be one or at least two, and preferably, the heat exchange efficiency is improved by arranging a plurality of air inlet fans and a plurality of air outlet fans 14.

In a specific embodiment, the hot end of the semiconductor refrigerator 1 is connected with the bottom end of the side wall of the first phase-change heat exchanger 3, and the cold end of the semiconductor refrigerator 1 is connected with the top end of the side wall of the second phase-change heat exchanger 2.

When the heat exchange device performs refrigeration, the second phase change heat exchanger 2 at the cold end of the semiconductor refrigerator 1 in the heat exchange module 10 is arranged in the storage cavity, and the second phase change heat exchanger 2 is arranged in the back heat dissipation air duct. The storage cavity can adopt direct cooling/air cooling, and the temperature of the storage cavity is reduced by using the second phase-change heat exchanger 2; the heat of the hot end cools the heat exchanger by introducing ambient air.

Preferably, the heat dissipation air channel where the electric control box 19 is located in the heat dissipation air channel is arranged in parallel with the middle heat dissipation air channel. Specifically, the heat dissipation air channel that automatically controlled box 19 is located is automatically controlled heat dissipation air channel, and automatically controlled heat dissipation air channel can be located the top or the bottom in middle heat dissipation air channel, specifically, according to the mounted position of automatically controlled box 19, in order to improve radiating efficiency, preferably, is equipped with the radiator fan in the automatically controlled heat dissipation air channel.

In order to improve the heat dissipation efficiency, preferably, the middle heat dissipation air duct 8 is provided with a middle fan 12 with smaller power, and the positions of the air inlet 11 and the air outlet 15 are respectively provided with an air inlet fan and an air outlet fan 14 with larger power, so that the air can effectively take away heat through the first phase-change heat exchanger 3. The air having an increased temperature is discharged to the outside environment from the air outlet 15 under pressure or the above-mentioned fan driving.

When heating, the current direction of the semiconductor refrigerator 1 is changed, namely the replaceable storage cavity is a hot end, and the radiating cavity is a cold end, so that the working mode is similar.

In a specific embodiment, the storage cavity at the bottommost end is used as a condensation water cavity and is connected with a water box 6 arranged above the hot end heat exchanger below an electric device in the heat dissipation air duct through the water pipe 5.

And when the storage equipment is in a refrigerating working condition, cooling the storage cavity by utilizing the cold quantity of the cold-end heat exchanger. When the device is in heating working condition, the heat of the hot end heat exchanger is utilized to heat the storage cavity

The following describes the refrigerating and heating operation of the storage device by taking the heat exchange module 10 including the semiconductor refrigerator 1, the first phase-change heat exchanger 3 and the second phase-change heat exchanger 2 as an example:

when refrigerating: the cold end heat exchanger (the first phase change heat exchanger 2) is arranged in the storage area to cool the storage area, the first phase change heat exchanger 3/the electric control box 19 is arranged in the air duct, and the fan is used for cooling the air duct. During refrigeration operation, condensed water is generated in the second phase-change heat exchanger 2 positioned in the storage cavity, and a drain hole 4 is arranged below the storage cavity, wherein the condensed water passes through the drain hole 4, the water pipe 5 and the water box 6. The water box 6 is arranged above the first phase change heat exchanger 3/the electric control box 19, and the water box 6 is positioned in the heat dissipation air duct.

Condensed water collected by the second phase change heat exchanger 2 is drained to the water box 6, and the water box 6 is arranged on the upper part of the hot end heat exchanger (the first phase change heat exchanger 3/the electric control box 19) and is attached to the hot end heat exchanger, so that the water box 6 exchanges heat with the hot end heat exchanger. And the same water management box 6 collects condensed water of the cold-end heat exchanger, and is attached to the hot-end heat exchanger for heat exchange, and the like, the lowest water box 6 is attached to the electric control box 19, and the condensed water is evaporated by utilizing heat generated by electric control work.

The method utilizes the low temperature of the condensed water to cool the hot end heat exchanger as much as possible; the heat of the hot side heat exchanger and the electric control box 19 can enable condensed water to evaporate rapidly. The water box 6 is placed in the heat dissipation air duct, and the fan in the heat dissipation air duct is used for accelerating evaporation by forced convection and can rapidly take away water.

When heating, the storage cavity side is a hot end heat exchanger, a cold end heat exchanger is arranged in the air duct, the lower part of the cold end corresponds to the drain hole 4, and the condensed water is collected and then exchanges heat with the electric control box 19.

The heat of the electric control box 19 and the hot end heat exchanger is utilized to accelerate the evaporation of the condensed water, meanwhile, the low-temperature condensed water is effectively utilized to cool the hot end heat exchanger and the electric control, forced convection is utilized to accelerate the evaporation of the condensed water, and the moisture is taken away in real time through the air duct.

Besides the thermoelectric refrigeration systems mentioned above, the present invention is equally applicable to vapor compression refrigeration systems (i.e., the evaporator is a cold side heat exchanger/the condenser is a hot side heat exchanger) and the like … …, and is not limited by way of example.

Sometimes limited by installation space and position, in order to strengthen heat exchange, the heat exchange performance between the hot end heat exchanger and the water box 6 can be improved through the second intermediate phase-change heat exchanger 18, and the second intermediate phase-change heat exchanger 18 utilizes the heat pipe principle, so that the heat conductivity is high, and the temperature uniformity is good.

The storage device comprises any one of the storage devices. The foregoing describes a specific structure of a storage device, and the present application includes the storage device, which also has the technical effects described above.

It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.

As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not specific to the singular, but may include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The inclusion of an element defined by the phrase "comprising one … …" does not exclude the presence of additional identical elements in a process, method, article, or apparatus that comprises an element.

Wherein, in the description of the embodiments of the present application, "/" means or is meant unless otherwise indicated, for example, a/B may represent a or B; "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In addition, in the description of the embodiments of the present application, "plurality" means two or more than two.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the core concepts of the invention. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.

Claims (10)

1. A condensate heat exchange system, comprising:

the periphery of the cold end heat exchanger is provided with a condensation water cavity for accommodating the generated condensed water;

a water box (6);

the hot end heat exchanger is used for heating condensed water in the water box (6);

and a water pipe (5) for conveying condensed water in the condensed water cavity where the cold-end heat exchanger is positioned to the water box (6).

2. The condensed water heat exchange system according to claim 1, wherein the condensed water cavity of the water inlet in the same water pipe (5) is higher than the water box (6) of the water outlet.

3. The condensate heat system as claimed in claim 1, wherein the water box (6) is mounted on the upper surface of the hot side heat exchanger.

4. A condensate heat system as claimed in claim 3, further comprising a first intermediate phase change heat exchanger (17) connecting the warm side heat exchanger and the water box (6) side.

5. The condensate heat system as claimed in claim 1, wherein the water box (6) is arranged separately from the hot side heat exchanger, the water box (6) being connected to the hot side heat exchanger by a second intermediate phase change heat exchanger (18), the water box (6) being located above the hot side heat exchanger.

6. The condensed water heat exchange system according to claim 1, further comprising a storage and a heat exchange module (10), wherein the storage is provided with a storage cavity for accommodating devices and a heat dissipation air duct isolated from the storage cavity, the heat exchange module (10) comprises a semiconductor refrigerator (1), a first phase-change heat exchanger (3) and a second phase-change heat exchanger (2), the first phase-change heat exchanger (3) and the second phase-change heat exchanger (2) are respectively installed at two opposite ends of a cold end of the semiconductor refrigerator (1), the second phase-change heat exchanger (2) is located in the storage cavity, the first phase-change heat exchanger (3) is located in the heat dissipation air duct, and when the first phase-change heat exchanger (3) is a hot end heat exchanger and the second phase-change heat exchanger (2) is a cold end heat exchanger, the first phase-change heat exchanger (3) is used as a hot end heat exchanger, the second phase-change heat exchanger (2) is used as a cold end heat exchanger, and the water box (6) comprises first phase-change boxes (6-1) and (6-6) installed at the top end of the first phase-change heat exchanger (3).

7. The condensed water heat exchange system according to claim 6, wherein when the first phase-change heat exchanger (3) is a cold-end heat exchanger and the second phase-change heat exchanger (2) is a hot-end heat exchanger, the first phase-change heat exchanger (3) is used as the cold-end heat exchanger, the electric device in the heat dissipation air duct is the hot-end heat exchanger, the heat dissipation air duct in which the first phase-change heat exchanger (3) is located is used as the condensation water cavity, and the water box (6) comprises a second water box (6-3) arranged at the top end of the electric device.

8. The condensed water heat exchange system according to claim 6, wherein the heat dissipation air duct comprises an air inlet (11), an air outlet (15) and an intermediate heat dissipation air duct (8) connecting the air inlet (11) and the air outlet (15), the first phase-change heat exchanger (3) is positioned in the intermediate heat dissipation air duct (8), the number of the heat exchange modules (10) and the number of the intermediate heat dissipation air duct (8) are multiple, the plurality of the intermediate heat dissipation air ducts (8) are arranged in parallel, and the heat exchange modules (10) are in one-to-one correspondence with the intermediate heat dissipation air duct (8);

the number of the storage cavities is multiple, the storage cavities are sequentially arranged from top to bottom, and the storage cavities above are used as condensation water cavities and are connected with the water boxes (6) arranged below the outer sides of the storage cavities through the water pipes (5).

9. The condensed water heat exchange system according to claim 8, wherein the storage chamber at the bottommost end is connected as a condensed water chamber with the water box (6) arranged above the hot end heat exchanger through the water pipe (5) and an electric device below the water box and positioned in the heat dissipation air duct.

10. A storage device comprising a storage device as claimed in any one of claims 1 to 9.