CN117484702A

CN117484702A - Silicon wafer production line

Info

Publication number: CN117484702A
Application number: CN202311731626.5A
Authority: CN
Inventors: 周传国; 杜伟; 王先亮; 赵文强; 马骏; 陈宣达; 郑华朋; 王超
Original assignee: Yancheng Houze Jinye Technology Co ltd
Current assignee: Yancheng Houze Jinye Technology Co ltd
Priority date: 2023-12-14
Filing date: 2023-12-14
Publication date: 2024-02-02

Abstract

The invention discloses a silicon wafer production line, wherein a cut silicon wafer and a crystal support are put into a material frame together at a cutting station, and the material frame is transported to a degumming station by a transportation trolley; separating the wafer support from the silicon wafer at the degumming station; the material frame horizontal conveying station is provided with a material frame conveying module for horizontally conveying the material frame to the slicing overturning station; the slicing and overturning station is provided with a slicing module and an overturning and conveying module, the slicing module is used for slicing the silicon wafers in the material frame and conveying the sliced silicon wafers upwards in a vertical posture one by one, and the overturning and conveying module is used for overturning the silicon wafers from the vertical posture to a horizontal posture; the horizontal conveying module is arranged on the horizontal conveying station of the silicon wafer and is used for conveying the silicon wafer to the inserting station in a horizontal posture; the wafer inserting station is used for inserting wafers; the cleaning and drying station is used for cleaning and drying the silicon wafer after the inserting sheet. The production line realizes the automation of the whole process of silicon wafer transfer, and improves the reliability and efficiency of silicon wafer transfer.

Description

Silicon wafer production line

Technical Field

The invention relates to the technical field of photovoltaics, in particular to a silicon wafer production line.

Background

In the production process of the silicon wafer, firstly, a silicon rod is cut into the silicon wafer through a wire cutting machine, the silicon wafer is stuck on a crystal support through a resin plate, then the crystal support and the cut silicon wafer are put into a material frame together, the crystal support and the silicon wafer are transported to a degumming station together through the material frame, the crystal support and the silicon wafer are degummed and separated through the degumping machine, and then the silicon wafer is sequentially conveyed to subsequent inserting sheet stations, cleaning stations, drying stations and the like.

In the prior art, the material frame clamps and limits the silicon wafers integrally, when the silicon wafers in the material frame are subjected to slice feeding before inserting, the material frame releases clamping on all the silicon wafers, then the silicon wafers vertically placed in the material frame are taken out manually, the silicon wafers are turned over by 90 degrees manually and then horizontally placed in a small material holder, and then subsequent feeding operation is performed. Because all silicon wafers are released from limit during feeding, the silicon wafers which are not fed yet are easy to obliquely squeeze in a material frame, so that the silicon wafers are cracked or hidden to be cracked, and the quality of the silicon wafers is seriously damaged. In addition, in the whole silicon wafer circulation process, operations such as slicing and the like are needed to be carried out on the silicon wafer manually, and the silicon wafer is transported among different stations, so that the reliability is low and the efficiency is low.

The above information disclosed in this background section is only for enhancement of understanding of the background section of the application and therefore it may not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

Aiming at the problems pointed out in the background technology, the invention provides a silicon wafer production line, which realizes the automation of the whole process of silicon wafer transfer and improves the reliability and efficiency of silicon wafer transfer.

In order to achieve the aim of the invention, the invention is realized by adopting the following technical scheme:

The invention provides a silicon wafer production line, which comprises the following steps:

the material frame is used for accommodating the cut silicon wafers;

the cutting station is provided with a slicing device which is used for cutting the silicon rod into silicon wafers, the cut silicon wafers are placed into a material frame together with a crystal support, and the material frame is transported to the degumming station by a transport trolley;

the degumming station is provided with degumming equipment and is used for separating the crystal support from the silicon wafer;

the material frame horizontal conveying station is provided with a material frame conveying module which is used for horizontally conveying the material frame to the slicing overturning station;

the slicing and overturning station is provided with a slicing module and an overturning and conveying module, the slicing module is used for slicing the silicon wafers in the material frame and conveying the sliced silicon wafers upwards in a vertical posture one by one, and the overturning and conveying module is used for receiving the vertical posture silicon wafers conveyed by the slicing module and overturning the silicon wafers from the vertical posture to a horizontal posture;

the silicon wafer horizontal conveying station is provided with a horizontal conveying module which is used for receiving the horizontal posture silicon wafer conveyed by the overturning conveying module and conveying the silicon wafer to the inserting sheet station in a horizontal posture;

the inserting station is provided with a flower basket for inserting the silicon wafers conveyed by the horizontal conveying module;

The cleaning and drying station is used for cleaning and drying the silicon wafer after the inserting sheet;

the material frame horizontal conveying station, the slicing overturning station, the silicon wafer horizontal conveying station and the inserting sheet station are sequentially arranged along the same straight line.

In some embodiments, a containing space for containing silicon wafers is formed in the material frame, and a plurality of silicon wafers in the material frame are divided into a plurality of silicon wafer groups;

the material frame is provided with a clamping component and an unlocking trigger part;

the clamping assembly comprises a movable plate, the movable plate extends along the length direction of the containing space, a plurality of clamping parts which are sequentially arranged are arranged on the movable plate along the length direction of the movable plate, the clamping parts are in one-to-one correspondence with the silicon wafer groups so as to clamp the corresponding silicon wafer groups, each clamping part moves in the direction away from the silicon wafer so as to release the clamping of the corresponding silicon wafer group, and the unlocking triggering part is connected with the movable plate;

the transfer trolley is provided with an unlocking part, the unlocking part triggers the unlocking triggering part to act after the material frame is placed on the transfer trolley, the movable plate moves towards a direction away from the containing space under the action of the unlocking triggering part, and the movable plate drives a plurality of clamping parts arranged on the movable plate to synchronously move towards a direction away from the containing space;

And the material frame is taken down from the transfer trolley, the unlocking part is separated from the unlocking triggering part, and the clamping part moves towards the direction close to the silicon wafer under the action of the resetting piece so as to clamp the silicon wafer.

In some embodiments, when the cut silicon wafer is transported, the material frame is firstly placed on the transport trolley, the unlocking part triggers the unlocking triggering part to act, and all the clamping parts synchronously move in a direction away from the containing space under the drive of the movable plate, so that the silicon wafer is conveniently loaded into the containing space from top to bottom;

after the transfer trolley transfers the material frame to the degumming station, the material frame is taken down from the transfer trolley, the unlocking part is separated from the unlocking triggering part, and the clamping part moves towards the direction close to the silicon wafer under the action of the resetting piece so as to clamp the silicon wafer.

In some embodiments, an unlocking device is arranged on the horizontal conveying station of the material frame, when the material frame conveying module drives the material frame to move along the horizontal direction, the material frame and the unlocking device generate relative movement, the clamping parts sequentially contact with the unlocking device along with the relative movement between the material frame and the unlocking device, and the unlocking device applies external force to the clamping parts so that the clamping parts are far away from the corresponding silicon wafer groups.

In some embodiments, the clamping portion includes a second pin, the second pin passes through the material frame and the movable plate, a unlocking block is arranged at a first end of the second pin, a clamping block is arranged at a second end of the second pin, a spring is sleeved on the second pin, and the spring is located between the clamping block and the material frame;

when the movable plate moves in a direction away from the containing space, the movable plate pushes all unlocking blocks to synchronously move in a direction away from the containing space, so that all clamping blocks are away from the containing space;

the clamping block moves towards the direction close to the silicon wafer under the action of the reset force of the spring so as to clamp the corresponding silicon wafer group;

and the unlocking device applies external force to the unlocking block so as to enable the corresponding clamping part to be far away from the corresponding silicon wafer group.

In some embodiments, the unlocking block comprises a transverse portion for abutting against the mobile plate and a vertical portion for acting with the unlocking means;

a certain distance is reserved between the vertical part and the movable plate, an inclined surface is arranged on one side of the vertical part facing the movable plate, and the distance between the inclined surface and the movable plate is firstly reduced and then increased along the discharging direction of the silicon wafer;

The unlocking device comprises a first roller, when the material frame and the unlocking device generate relative motion, the first roller moves to the position between the inclined surface and the movable plate and contacts with the inclined surface, and the second pin shaft moves in the direction away from the silicon wafer through relative displacement between the first roller and the inclined surface.

In some embodiments, the material frame comprises an upper frame and a lower frame, the upper frame is detachably arranged above the lower frame, a limiting structure for limiting the crystal support is arranged on the upper frame, and the clamping assembly is arranged on the lower frame;

the material frame is placed on the degumming station, the lower frame is lifted away from the upper frame so that the crystal support is separated from the silicon wafer, and the material frame conveying module conveys the lower frame in the horizontal direction.

In some embodiments, the slicing module comprises a water spraying part and a vertical conveying part, the water spraying part is used for spraying water to the unlocked silicon wafer group in the material frame, slicing the silicon wafers in the silicon wafer group, and the vertical conveying part is used for conveying the sliced silicon wafers upwards to the overturning conveying module in a vertical posture one by one.

In some embodiments, the vertical conveying part comprises a first mounting frame, an adsorption part and a vertical conveying belt are arranged on the first mounting frame, the adsorption part is used for adsorbing the separated silicon wafer onto the vertical conveying belt, and the vertical conveying belt drives the silicon wafer to move upwards in a vertical posture.

In some embodiments, the overturning and conveying module comprises an overturning auxiliary part and a glue-coating rolling wheel, the overturning auxiliary part comprises a second mounting frame, a blowing part is arranged on the second mounting frame and is positioned above the vertical conveying part, the blowing part is used for blowing air to the vertical silicon wafer conveyed upwards by the vertical conveying part so that the silicon wafer is dumped onto the glue-coating rolling wheel, and the glue-coating rolling wheel drives the silicon wafer to move to a horizontal posture.

Compared with the prior art, the invention has the advantages and positive effects that:

in the silicon wafer production line disclosed by the application, the cutting station is used for cutting the silicon rod, the degumming station is used for finishing degumming separation of the crystal support and the silicon wafer, the material frame horizontal conveying station is used for realizing material frame horizontal conveying, the slicing overturning station is used for finishing slicing and vertical feeding conveying, the silicon wafer horizontal conveying station is used for finishing silicon wafer horizontal conveying, the inserting piece station is used for finishing silicon wafer inserting, and the cleaning and drying station is used for cleaning and drying the silicon wafer. The silicon wafer production line realizes the full-flow circulation automation of the silicon wafers, and improves the reliability and efficiency of the operations such as silicon wafer conveying, slicing, feeding, inserting sheets and the like.

Other features and advantages of the present invention will become apparent upon review of the detailed description of the invention in conjunction with the drawings.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it will be obvious that the drawings in the following description are some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.

FIG. 1 is a simplified structural layout of a silicon wafer production line according to an embodiment;

FIG. 2 is a schematic diagram of a frame and frame transfer module according to an embodiment;

FIG. 3 is a schematic view of a frame transfer module according to an embodiment;

FIG. 4 is a schematic diagram of a dicing module according to an embodiment;

fig. 5 is a schematic structural view of the inversion assisting portion according to the embodiment;

fig. 6 is a schematic structural view of a dicing module, a flip auxiliary portion according to an embodiment;

FIG. 7 is a schematic diagram of the structure of a dicing module, a flip-over conveying module, a horizontal conveying module according to an embodiment;

fig. 8 is a schematic structural view of a cleaning part according to an embodiment;

FIG. 9 is a schematic diagram of the relative positions of the cleaning portion and the adhesive coated rolling wheel according to an embodiment;

FIG. 10 is a schematic diagram of a structure of a silicon wafer detection module according to an embodiment;

FIG. 11 is a schematic diagram of a frame and a transfer cart according to an embodiment;

FIG. 12 is a second schematic view of a frame and a transfer cart according to an embodiment;

FIG. 13 is an enlarged view of portion A of FIG. 12;

FIG. 14 is a schematic diagram of a frame and a silicon wafer unit according to an embodiment;

fig. 15 is a schematic structural view of an upper frame according to an embodiment;

fig. 16 is a schematic structural view of a lower frame according to an embodiment;

FIG. 17 is a schematic view of a clamp assembly and lower frame according to an embodiment;

FIG. 18 is a schematic structural view of a clamping assembly according to an embodiment;

FIG. 19 is a cross-sectional view taken along line A-A of FIG. 18;

FIG. 20 is a cross-sectional view taken along B-B in FIG. 18;

FIG. 21 is a schematic structural view of a clamping portion according to an embodiment;

FIG. 22 is an enlarged view of portion B of FIG. 14;

fig. 23 is a schematic structural view of an unlocking device according to an embodiment;

FIG. 24 is a schematic structural view of an anti-toppling assembly according to an embodiment;

FIG. 25 is a schematic structural view of a transfer trolley according to an embodiment;

FIG. 26 is a cross-sectional view of a transfer trolley according to an embodiment;

Fig. 27 is a schematic structural view of a silicon wafer unit according to an embodiment.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

The embodiment discloses a silicon wafer production line, referring to fig. 1, which comprises the working procedures of silicon wafer cutting, degumming, wafer separation, feeding, cleaning, drying and the like.

The silicon wafer production line comprises a cutting station 11, a degumming station 17, a material frame horizontal conveying station 12, a slicing overturning station 13, a silicon wafer horizontal conveying station 14, an inserting station 15 and a cleaning and drying station 16.

The cutting station 11 is used for cutting silicon rods, the degumming station 17 is used for degumming and separating crystal supports and silicon wafers, the horizontal conveying station 12 for material frames is used for realizing horizontal conveying of material frames, the slicing and overturning station 13 is used for slicing and vertical feeding conveying, the horizontal conveying station 14 for silicon wafers is used for horizontal conveying of silicon wafers, the inserting piece station 16 is used for inserting pieces of silicon wafers, and the cleaning and drying station 16 is used for cleaning and drying silicon wafers.

The material frame horizontal conveying station 12, the slicing overturning station 13, the silicon wafer horizontal conveying station 14 and the inserting sheet station 15 are sequentially arranged along the same straight line and integrated into an integrated machine structure, so that automatic conveying of the silicon wafer is realized.

The cutting station 11 is provided with a slicing device, such as a wire saw, for cutting the silicon rod into silicon wafers. After the silicon rod is cut, the silicon wafer 120 is stuck to the wafer support 110 through a resin plate, which is called a silicon wafer unit 100, and as shown in fig. 27, the plurality of silicon wafers 120 are divided into a plurality of silicon wafer groups 121. In fig. 27, two adjacent wafer groups 121 are separated by a broken line. The wafer support 110 is loaded into a frame along with the silicon wafer 120, and the frame is transported by a transport cart to the degum station 17.

The degumming station 17 is provided with degumming equipment for degumming and separating the crystal support from the silicon wafer, the silicon wafer is kept in the material frame, and the material frame conveys the silicon wafer to the next working procedure.

The material frame horizontal conveying station 12 is provided with a material frame conveying module 20 for horizontally conveying the material frame to the slicing overturning station 13, namely conveying the degummed silicon wafer to the next station.

The slicing overturning station 13 is provided with a slicing module 30 and an overturning and conveying module 40. The slicing module 30 is used for slicing the silicon wafers in the material frame and conveying the sliced silicon wafers upwards in a vertical posture one by one. The turnover conveying module 40 is used for receiving the vertical posture silicon wafer conveyed by the slicing module 30 and turning the silicon wafer from the vertical posture to the horizontal posture.

The horizontal conveying module 50 is disposed on the horizontal conveying station 14 for receiving the horizontal posture silicon wafer conveyed by the overturning conveying module 40 and conveying the silicon wafer to the inserting station 15 in the horizontal posture.

The wafer inserting station 15 is provided with a basket for inserting the silicon wafers conveyed by the horizontal conveying module 50.

The cleaning and drying station 16 is provided with cleaning and drying equipment for cleaning and drying the silicon wafer after the inserting sheet.

The silicon wafer production line realizes the full-flow circulation automation of the silicon wafers, and improves the reliability and efficiency of the operations such as silicon wafer conveying, slicing, feeding, inserting sheets and the like.

Referring to fig. 1 to 7, a material frame horizontal conveying station 12, a slice overturning station 13, a silicon slice horizontal conveying station 14 and an inserting sheet station 15 are sequentially arranged along the same straight line, and are integrated into an integrated machine structure, namely a silicon slice feeding conveying device 1, and the integrated machine structure comprises a frame 10, a material frame conveying module 20, a slice module 30, an overturning conveying module 40, a horizontal conveying module 50, an inserting sheet module 60 and the like.

The frame 10 forms the frame of the whole feeding conveyor and serves as a mounting carrier for other functional modules. The frame transfer module 20, the separation module 30, the flip transfer module 40, the horizontal transfer module 50, and the tab module 60 are sequentially arranged along the length direction of the frame 10. The linear arrangement of the functional modules is convenient for the transmission of the silicon chip among the modules.

The frame 10 is internally provided with a water tank with an open top, and the frame 10 is also used as a water container for receiving liquid dripping from the silicon wafer on one hand and providing a water source for functional modules such as the turnover conveying module 40 and the like needing water on the other hand.

As shown in fig. 17, the structure of the material frame 200 is that a plurality of silicon wafers in the material frame 200 are divided into a plurality of silicon wafer groups 121, and a discharge port 214 for discharging the silicon wafers 120 is arranged at one end of the material frame 200.

The frame transfer module 20 is configured as shown in fig. 2 and 3, and the frame transfer module 20 is configured to transfer the frame 200 to the dicing module 30. After the silicon rod is cut on the slicing device, as shown in fig. 27, the silicon wafer 120 and the crystal support 110 are put into the material frame 200 together, the material frame 200 is transported to the degumming station 17 from the cutting station 11 by the transportation device (such as a transportation trolley), the crystal support is separated from the silicon wafer on the degumming station 17, the silicon wafer is left in the material frame, the material frame 200 is transported into the material frame transporting module 20 by the auxiliary device such as a manipulator, and the material frame transporting module 20 automatically transports the material frame 200 to the downstream slicing module 30 so as to slice the silicon wafer in the material frame 200, thereby facilitating the feeding operation of the subsequent silicon wafer.

As shown in fig. 4, the slicing module 30 has a structure in which the slicing module 30 includes a water spraying portion 31 and a vertical conveying portion 32, the water spraying portion 31 is configured to spray water from the silicon wafer group 121 to the silicon wafer 120 in the material frame 200, slice the plurality of silicon wafers in the silicon wafer group 121, and the vertical conveying portion 32 is configured to convey the sliced silicon wafers upward in a vertical posture one by one.

The overturning and conveying module 40 is structured as shown in fig. 5 to 7, and the overturning and conveying module 40 is used for receiving the vertical posture silicon wafer conveyed by the vertical conveying part 32 and overturning the silicon wafer from the vertical posture to the horizontal posture.

Referring to fig. 7, the horizontal transfer module 50 is for receiving the horizontal posture silicon wafer transferred from the flipping and transferring module 40 and transferring the silicon wafer to the wafer insertion module 60 in the horizontal posture.

The wafer insertion module 60 is used for inserting wafers conveyed by the horizontal conveying module 50.

In the silicon wafer feeding and conveying device 1 in this embodiment, the material frame conveying module 20, the slicing module 30, the overturning and conveying module 40, the horizontal conveying module 50 and the inserting sheet module 60 are arranged in a straight shape, so that the silicon wafer can be automatically conveyed among the modules. The feeding conveying device integrates the functions into a whole, is novel and compact in structure, realizes automatic slicing, overturning and inserting of the silicon wafer, greatly improves the working efficiency, and improves the quality reliability of the silicon wafer in the operation process.

For the specific structure of the frame transfer module 20, in some embodiments, referring to fig. 2 and 3, the frame transfer module 20 includes a transfer rail 21, a moving rack 22, and a drive mechanism 23. The conveying track 21 is arranged at the bottom of the water tank and extends along the length direction of the water tank, and the driving mechanism 23 is used for driving the movable frame 22 to move along the length direction of the water tank, and the movable frame 22 is connected with the material frame 200 so as to drive the material frame 200 to synchronously move.

The material frame 200 is located on the conveying track 21, the driving mechanism 23 is started, the movable frame 22 is driven to move along the length direction of the water tank, and the movable frame 22 drives the material frame to synchronously move along with the material frame.

Further, the conveying tracks 21 are provided with two conveying tracks 21, the two conveying tracks 21 are oppositely arranged, each conveying track 21 comprises a transverse bearing portion 2101 and a vertical limiting portion 2102, the material frame 200 is located on the transverse bearing portion 2101, the material frame 200 moves along the transverse bearing portion 2101, the vertical limiting portions 2102 are located at the sides of the material frame 200, the material frame 200 is limited, and the material frame 200 is prevented from falling off from the transverse bearing portion 2101.

Further, the transverse bearing part 2101 is provided with a roller 2103, and the roller 2103 is in rolling contact with the bottom of the material frame 200, so that the moving friction force of the material frame 200 is reduced.

Further, the distance between the two vertical limiting portions 2102 can be adjusted to accommodate different width sizes of the material frames 200.

For the adjustment structure between the two vertical limiting portions 2102, common mechanical structures such as a screw and a bolt can be adopted, and the embodiment is not particularly limited.

Further, the driving mechanism 23 includes a driving motor 2301, the driving motor 2301 drives a transmission shaft 2303 to rotate through a first transmission belt 2302, the transmission shaft 2303 drives a second transmission belt 2304 to rotate, the second transmission belt 2304 extends along the length direction of the water tank, and the moving frame 22 is connected to the second transmission belt 2304.

The driving motor 2301 is started, the driving motor 2301 drives the first transmission belt 2302 to rotate, the first transmission belt 2302 drives the transmission shaft 2303 to rotate, the transmission shaft 2303 drives the second transmission belt 2304 to rotate, the second transmission belt 2304 drives the movable frame 22 to synchronously move, and then the movable frame 22 drives the material frame 200 to synchronously move.

Further, there are two second belts 2304, each second belt 2304 being provided on top of the corresponding side of the frame 10. The movable frame 22 is of a U-shaped frame structure and comprises a movable transverse portion 2201 and a movable vertical portion 2202, the movable vertical portion 2202 is respectively arranged at two ends of the movable transverse portion 2201, and the top of the movable vertical portion 2202 is fixedly connected with the second driving belt 2304 at the corresponding side.

As can be seen from fig. 2, the driving motor 2301, the first driving belt 2302, the driving shaft 2303 and the second driving belt 2304 are located outside the frame 10, and do not occupy the internal space of the frame 10, and do not occupy the placing space of the material frame 200, and the moving frame 22 is located inside the frame 10, so as to be connected with the material frame 200 to drive the material frame to move synchronously.

Further, a limiting structure for limiting the material frame 200 is provided on the movable transverse portion 2201. Through the detachable connection between limit structure and the material frame 200, on the one hand, be convenient for be connected between material frame 200 and the limit structure so that material frame 200 moves along with removal frame 22 synchronization, on the other hand, also be convenient for break away from between material frame 200 and the limit structure.

In a specific embodiment, referring to fig. 3, the limiting structure is a protruding upright 2203 disposed on the moving transverse portion 2201, and correspondingly, referring to fig. 14, a mating hole is disposed at an outer side of one end of the material frame, the material frame is placed into the frame 10 from top to bottom, and the protruding upright 2203 is inserted into the mating hole 216, so as to achieve connection and mating between the material frame 200 and the moving frame 22.

With respect to the specific structure of the dicing module 30, referring to fig. 4, the vertical transfer section 32 includes a first mount 3201, an adsorption section for adsorbing the diced silicon wafer onto the vertical transfer belt 3202 and a vertical transfer belt 3202 are provided on the first mount 3201, and the vertical transfer belt 3202 drives the silicon wafer to move upward in a vertical posture.

The silicon wafers 120 which are sliced in the material frame 200 are adsorbed by the adsorption part and are sent to the vertical conveying belt 3202, the vertical conveying belt 3202 drives the silicon wafers 120 to move upwards, and the adsorption part and the vertical conveying belt 3202 are matched with each other, so that the silicon wafers in the material frame 200 are conveyed upwards one by one.

Further, the adsorption part includes an adsorption region 3203 and an auxiliary conveying region 3204, the auxiliary conveying region 3204 is disposed above and below the adsorption region 3203, the adsorption region 3203 is used for providing adsorption force to the silicon wafer to adsorb the silicon wafer onto the vertical conveyor belt 3202, and the auxiliary conveying region 3204 is in rolling contact with the silicon wafer to assist the silicon wafer to move upwards in the vertical posture.

The adsorption area 3203 is opposite to the silicon wafer, so that the silicon wafer in the material frame 200 is smoothly adsorbed onto the vertical conveyor belt 3202, and the auxiliary conveying areas 3204 which are arranged vertically at intervals are in rolling contact with the upper part and the lower part of the silicon wafer, so that the vertical upward movement of the silicon wafer is assisted.

Further, the adsorption area 3203 is a water absorbing plate 3205, a plurality of water absorbing holes 3206 are arranged on the water absorbing plate 3205 at intervals, the water absorbing plate 3205 is connected with a water absorbing waterway (not shown), liquid on the silicon wafer is absorbed into the water absorbing waterway through the water absorbing holes 3206 under the suction force of the water absorbing waterway, and the silicon wafer is adsorbed onto the surface of the vertical conveyor belt 3202.

Further, vertical transfer belt 3202 is positioned opposite suction area 3203, so that the silicon wafer is directly sucked onto the surface of vertical transfer belt 3202 by suction area 3203.

Further, the auxiliary delivery area 3204 includes a plurality of follower rollers 3207, and the follower rollers 3207 are in rolling contact with the silicon wafer.

Further, vertical transfer belt 3202 is driven by drive mechanism 23, drive mechanism 23 includes a motor 3208, a timing belt 3209, and a rotating shaft 3210, timing belt 3209 is connected between a power output end of motor 3208 and rotating shaft 3210, and rotating shaft 3210 is connected with vertical transfer belt 3202 to drive vertical transfer belt 3202 to rotate.

The motor 3208 and the timing belt 3209 are located beside the adsorption area 3203 and the auxiliary conveying area 3204, and do not interfere with upward transportation of the silicon wafer.

Further, the vertical transfer belts 3202 have a plurality of, for example, two, the plurality of vertical transfer belts 3202 are arranged at intervals in the width direction of the suction portion, and the plurality of vertical transfer belts 3202 are driven by the same rotation shaft 3210, so that the movement consistency of the plurality of vertical transfer belts 3202 is ensured. The spaced arrangement of the plurality of vertical carousels 3202 helps to improve the reliability of upward transport of the silicon wafer.

Further, the first mounting frame 3201 is provided with a water spraying part 31, the water spraying part 31 is located at two opposite sides of the vertical conveying part 32, water is sprayed from two sides of the silicon wafer at the same time, and the reliability of silicon wafer slicing is improved.

Further, two water spraying parts 31 are arranged on each side of the vertical conveying part 32 at intervals up and down, and water is sprayed to the upper part and the lower part of the silicon wafer, so that the slicing reliability of the silicon wafer is further improved.

For the specific structure of the inverting conveyance module 40, in some embodiments, referring to fig. 5 to 7, the inverting conveyance module 40 includes an inverting assist 41 and an adhesive-coated rolling wheel 42.

The turning auxiliary portion 41 is shown in fig. 5, and includes a second mounting frame 4101, a blowing portion 4102 is disposed on the second mounting frame 4101, and in combination with fig. 6, the blowing portion 4102 is located above the vertical conveying portion 32, and the blowing portion 4102 is used for blowing air to the vertical silicon wafer conveyed upward by the vertical conveying portion 32, so that the silicon wafer is poured onto the glue-coated rolling wheel 42, and the glue-coated rolling wheel 42 drives the silicon wafer to move to a horizontal posture.

The vertically upward-transported silicon wafer is converted into horizontal transport by the cooperation of the air blowing portion 4102 and the glue-coated rolling wheel 42. The air blowing part 4102 is arranged to enable the silicon wafer to be dumped onto the glue coating rolling wheel 42, and the inclined silicon wafer is driven to a horizontal posture by utilizing the rotation of the glue coating rolling wheel 42.

The rubber covered rolling wheel 42 can be a metal wheel rubber coating structure, and can also be a metal rolling wheel and nonmetal rolling wheel nested circular rubber sleeve.

Further, the second mounting frame 4101 is further provided with a sub-frame 4105, the sub-frame 4105 is provided with a pressing wheel 4106, and the pressing wheel 4106 is located in front of the vertical conveying part 32 and is used for pressing the silicon wafer onto the vertical conveying part 32, preventing the silicon wafer from reversely tilting, and ensuring that the silicon wafer reliably tilts onto the glue-coated rolling wheel 42.

Further, the sub-frame 4105 is rotatably connected with the mounting frame, and the pressing wheel 4106 is in a floating wheel form, so as to prevent the pressing wheel 4106 from crushing the silicon wafer.

Further, the plurality of pressing wheels 4106 are provided, and the plurality of pressing wheels 4106 are arranged at intervals along the horizontal direction to apply uniform acting force to the silicon wafer.

Further, the air blowing portion 4102 includes an air blowing plate 4103, a plurality of air blowing holes 4104 are provided on the air blowing plate 4103 and arranged at intervals, and the air blowing plate 4103 is connected to an air blowing path (not shown).

Further, the turnover conveying module 40 further includes a cleaning part 43, and the cleaning part 43 is used for cleaning the adhesive-coated rolling wheel 42 periodically. Referring to fig. 8 and 9, the cleaning portion 43 is disposed behind the glue roller 42 and below the horizontal conveying module 50 in the horizontal conveying direction of the silicon wafer.

The cleaning portion 43 includes a cylinder 4303, a cleaning frame 4302, and a sponge block 4301, the cleaning frame 4302 being provided at a power output end of the cylinder 4303, the sponge block 4301 being provided on the cleaning frame 4302. When the glue-coated rolling wheel 42 needs to be cleaned, the air cylinder 4303 is started to drive the cleaning frame 4302 to move towards the direction close to the glue-coated rolling wheel 42 until the sponge block 430 contacts the glue-coated rolling wheel 42, and along with the rotation of the glue-coated rolling wheel 42, the full circumferential cleaning of the glue-coated rolling wheel 42 by the sponge block 4301 is realized. After cleaning is completed, the sponge block 4301 is retracted away from the glue roll wheel 42.

With respect to the specific structure of the horizontal transport module 50, in some embodiments, referring to fig. 7, the horizontal transport module 50 includes a horizontal transport belt group 51, the driving mechanism 23 of the horizontal transport belt group 51 is not shown, the silicon wafer in the horizontal posture transported by the glue rolling wheel 42 moves onto the horizontal transport belt group 51, and the silicon wafer is carried by the horizontal transport belt group 51 to continue to be transported in the horizontal posture to the subsequent wafer insertion station.

The glue-coated rolling wheel 42 is provided with an annular groove 4201 along the circumferential direction thereof, and the horizontal conveyor belt group 51 is provided with a part extending into the groove 4201 to receive the silicon wafer in the horizontal posture conveyed by the glue-coated rolling wheel 42, so that the smooth conveying of the silicon wafer between the glue-coated rolling wheel 42 and the horizontal conveyor belt group 51 is realized.

Further, with continued reference to fig. 7, the horizontal conveying module 50 further includes two opposite baffles 52, where the baffles 52 extend along the horizontal conveying direction of the silicon wafer, and one end of the baffles 52 is located beside the glue-coated rolling wheel 42, so as to play a left-right limiting role on the horizontal conveying of the silicon wafer.

In some embodiments, the silicon wafer loading and conveying device 1 further includes a silicon wafer detection module 70, as shown in fig. 10, which includes a lifting frame 71, a roll-over frame 72, and a lifting driving portion 75, where the lifting driving portion 75 drives the lifting frame 71 to move up and down, the roll-over frame 72 is rotationally connected with the lifting frame 71, a rolling wheel 73 is disposed at the bottom of the roll-over frame 72, and a sensor 74, such as a photoelectric sensor, is disposed on the lifting frame 71.

The silicon wafer detection module 70 is arranged in front of the slicing module 30, the material frame conveying module 20 horizontally conveys the material frame 200 towards the direction close to the slicing module 30, the silicon wafer in the material frame 200 touches the rolling wheel 73 on the silicon wafer detection module 70, the turnover frame 72 turns over along with the continuous advancing of the material frame 200, the sensor 74 detects the turnover action of the turnover frame 72, the system knows that the silicon wafer is conveyed in place, the lifting driving part 75 drives the lifting frame 71 to lift, the lifting frame 71 drives the turnover frame 72 and the rolling wheel 73 to synchronously lift up together to the upper side of the silicon wafer, the subsequent slicing and feeding operation of the silicon wafer is not affected, the slicing module 30 is started, and water spraying and vertical conveying are carried out on the silicon wafer.

With respect to the specific structure of the material frame 200, in some embodiments, referring to fig. 14 to 17, the frame 210 of the material frame 200 includes an upper frame 211 and a lower frame 212, and the upper frame 211 is detachably connected with the lower frame 212. Fig. 15 shows the upper frame 211, fig. 16 shows the lower frame 212, and fig. 17 shows a structure in which the clamping assembly 220 and the anti-toppling assembly 240 are provided on the lower frame 212.

The lower frame 212 is internally provided with a containing space 213 for containing the silicon wafer 120, the top of the containing space 213 is open, and one end of the lower frame 212 is provided with a discharge hole 214 communicated with the containing space 213.

The upper frame 211 can be detached and arranged at the top of the lower frame 212, an opening 2113 which is vertically opposite to the containing space 213 is formed in the upper frame 211, the silicon wafer unit 100 is filled into the containing space 213 below through the opening 2113, a limiting structure for limiting the crystal support 110 is arranged on the upper frame 211, and the placement stability of the silicon wafer unit 100 in the material frame 200 is guaranteed. The lower frame 212 is provided with a clamping assembly 220 for limiting the silicon wafer 120.

The upper frame 211 is moved away from the lower frame 212 to separate the wafer carrier 110 from the silicon wafer 120, the silicon wafer 120 remains in the lower frame 212, and the frame transfer module 20 transfers the lower frame 212 to the dicing module 30. Specifically, after the material frame 200 reaches the degumming station 17, the upper frame 211 is moved away from the lower frame 212 by the degumming device, and because the upper frame 211 and the wafer support 110 have a limiting connection relationship, and the silicon wafer 120 below is clamped by the clamping assembly 220, when the upper frame 211 is moved away from the lower frame 212, the upper frame 211 is separated from the silicon wafer 120 together with the wafer support 110, so that the degumming separation of the wafer support 110 and the silicon wafer 120 is realized.

In this embodiment, through the upper and lower split structure of the material frame 200, the clamping assembly 220 in the lower frame 212 is combined to clamp the silicon wafer 120, and the upper frame 211 is used to limit and fix the wafer support 110, so that the separation of the wafer support 110 and the silicon wafer 120 can be realized through the separation of the upper frame 211 and the lower frame 212.

Further, referring to fig. 14, 15 and 27, the front and rear ends of the crystal support 110 unit are respectively provided with an extension portion 111, the upper frame 211 is provided with two protruding portions 2115 arranged at intervals on the corresponding side, and the extension portion 111 is clamped between the two protruding portions 2115, so as to realize limiting fixation of the crystal support 110.

Further, the upper frame 211 includes two oppositely disposed upper frame first brackets 2111 and two oppositely disposed upper frame second brackets 2112, the upper frame first brackets 2111 extending along the length direction L of the stock frame 200, and the upper frame second brackets 2112 extending along the width direction W of the stock frame 200. Two supporting frames 2114 are arranged between the two upper frame first brackets 2111 at intervals, and a certain distance is reserved between the supporting frames 2114 and the upper frame second brackets 2112 on the corresponding sides. The support bracket 2114 is provided with a boss 2115.

Further, the lower frame 212 includes two oppositely disposed lower frame first supports 2121 and two oppositely disposed lower frame second supports 2122, the lower frame second supports 2122 include lower frame transverse frames 2123, opposite ends of the lower frame transverse frames 2123 are respectively provided with lower frame vertical frames 2124, the lower frame first supports 2121 extend along a length direction K of the material frame 200, the lower frame transverse frames 2123 extend along a width direction W of the material frame 200, and the lower frame vertical frames 2124 extend along a height direction of the material frame 200.

The bottom of the upper frame 211 is detachably connected to the top of the lower frame upright 2124 to achieve a detachable connection between the upper frame 211 and the lower frame 212.

Further, referring to fig. 14 to 16, an upper stopper 2116 is provided at the bottom of the upper frame 211, a lower stopper 2126 is provided at the top of the lower frame vertical frame 2124, and the upper stopper 2116 and the lower stopper 2126 are adapted by a concave-convex structure, so that the upper frame 211 and the lower frame 212 are matched. For example, the upper limiting block 2116 is provided with a concave shape, and the lower limiting block 2126 is provided with a convex shape, and the concave shape is matched with the convex shape.

In other embodiments, the upper frame 211 and the lower frame 212 may be detachably connected by bolts, pins, or the like.

Further, referring to fig. 15, an outer side portion of the upper frame 211 is provided with an upper grip portion 2117, and the upper grip portion 2117 is gripped by an external force to separate the upper frame 211 from the lower frame 212.

Referring to fig. 16, the outer side of the lower frame 212 is provided with a lower grip 2127, and the lower grip 2127 is gripped by an external force to transfer the material frame 200.

Further, the bottom of the lower frame 212 is provided with support rollers 215, the support rollers 215 are arranged at intervals along the width direction W of the material frame 200, and the support rollers 215 are in abutting contact with the bottom of the silicon wafer 120.

The gap between two adjacent support rollers 215 facilitates the downward dripping of water on the silicon wafer 120.

In some embodiments, referring to fig. 14, 17 and 18, the clamping assembly 220 is used to clamp the silicon wafer unit 100, in one aspect, the clamping assembly 220 is capable of clamping the entire silicon wafer unit 100 simultaneously; on the other hand, the clamping assembly 220 is capable of independently unlocking each wafer stack 121.

The clamping assembly 220 has two clamping members located at opposite sides of the receiving space 213 to clamp opposite sides of the wafer unit 100.

The clamping assembly 220 includes a plurality of clamping portions 222 sequentially arranged along the length direction of the accommodating space 213 (i.e., the length direction L of the material frame 200), and the plurality of clamping portions 222 are in one-to-one correspondence with the plurality of silicon wafer groups 121 to clamp the corresponding silicon wafer groups 121. Each clamping portion 222 moves in a direction away from the silicon wafer 120 to unclamp the corresponding silicon wafer stack 121.

That is, each wafer group 121 is clamped by the corresponding clamping portion 222. When all the clamping portions 222 clamp the corresponding wafer group 121, the entire wafer unit 100 is clamped. When the silicon wafer unit 100 needs to be subjected to wafer loading by taking the silicon wafer group 121 as a unit, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121, and when the unlocked silicon wafer group 121 is subjected to wafer loading, the rest of the silicon wafer groups 121 are still clamped by the corresponding clamping parts 222, so that the placement stability of the rest of the silicon wafer groups 121 which are not loaded in the material frame 200 can be ensured, the silicon wafers 120 are prevented from being toppled over or mutually extruded, the silicon wafers 120 are prevented from being damaged, and the quality of the silicon wafers 120 is ensured.

Unlocking of the wafer stack 121 by the clamping portion 222 is achieved by the action between the unlocking device 300 and the clamping portion 222. Specifically, the unlocking device 300 is disposed on the inner sidewall of the frame 10, the unlocking device 300 is disposed near the slicing module 30, and when the material frame conveying module 20 conveys the lower frame 212 along the horizontal direction toward the direction near the unlocking device 300, the plurality of clamping portions 222 sequentially contact with the unlocking device 300 along with the relative movement between the material frame 200 and the unlocking device 300, and the unlocking device 300 is used for applying an external force to the clamping portions 222, so that the clamping portions 222 are far away from the corresponding silicon wafer groups 121, that is, the clamping of the silicon wafer groups 121 is released.

In the material frame 200 in this embodiment, the corresponding silicon wafer groups 121 are clamped simultaneously by the plurality of clamping portions 222 on the clamping assembly 220, so as to achieve clamping of all silicon wafers, meanwhile, unlocking of each clamping portion 222 on the silicon wafer groups 121 is mutually independent, and unlocking of each clamping portion 222 is sequentially performed by the unlocking device 300, that is, unlocking of each silicon wafer group 121 is mutually independent, so that when the silicon wafer units 100 need to be subjected to wafer-slicing feeding by taking the silicon wafer groups 121 as a unit, the clamping portions 222 release the clamping of the corresponding silicon wafer groups 121, and when the unlocked silicon wafer groups 121 are subjected to wafer-slicing feeding, the rest silicon wafer groups 121 are still clamped by the corresponding clamping portions 222, so that placement stability of the rest silicon wafer groups 121 in the material frame 200 can be guaranteed, the silicon wafers 120 are prevented from being poured or mutually extruded, breakage of the silicon wafers 120 is avoided, and quality of the silicon wafers 120 is guaranteed.

In some embodiments, referring to fig. 20, the clamping portion 222 includes a second pin 2221, the second pin 2221 passes through the frame 210, the second pin 2221 is capable of moving along a direction passing through the frame 210, an unlocking block 2223 is disposed on a first end of the second pin 2221, a clamping block 2222 is disposed on a second end of the second pin 2221, a spring 2229 is sleeved on the second pin 2221, and the spring 2229 is located between the clamping block 2222 and the frame 210.

Each unlocking block 2223 moves in a direction away from the silicon wafer unit 100 under the action of the unlocking device 300, and drives the corresponding clamping block 2222 to be away from the corresponding silicon wafer group 121 so as to unlock the corresponding silicon wafer group 121.

The clamping block 2222 moves in a direction approaching the silicon wafer unit 100 under the restoring force of the spring 2229 to clamp the corresponding silicon wafer group 121.

In some embodiments, the mating structure between the unlocking device 300 and the clamping portion 222 is as follows, referring to fig. 20 to 23:

the unlocking block 2223 includes a lateral portion 2225 and a vertical portion 2226 of an integral structure, the lateral portion 2225 being configured to abut against the movable plate 221, and the vertical portion 2226 being configured to function with the unlocking device 300. Specifically, one end of the lateral portion 2225 is connected to the second pin 2221, a step portion 2228 is formed between the lateral portion 2225 and the second pin 2221, and the other end of the lateral portion 2225 is connected to the vertical portion 2226.

The vertical portion 2226 is spaced from the movable plate 221 by a certain distance, and the vertical portion 2226 is provided with an inclined surface 2227 on a side facing the frame 210, and the distance between the inclined surface 2227 and the movable plate 221 is decreased and then increased in the discharging direction of the silicon wafer 120.

The unlocking device 300 comprises a first roller 320, when the material frame 200 and the unlocking device 300 generate relative movement, the first roller 320 moves between the inclined surface 2227 and the frame 210 and contacts with the inclined surface 2227, and the second pin shaft 2221 moves in a direction away from the silicon wafer 120 through the relative displacement between the first roller 320 and the inclined surface 2227.

Specifically, the unlocking device 300 is disposed on the horizontal conveying station 12 of the material frame, specifically, is fixed on the inner side wall of the frame 10, and two clamping assemblies 220 are disposed on the corresponding material frame 200, so that two unlocking devices 300 are also disposed, and each unlocking device 300 is used for acting with the corresponding clamping assembly 220 on the corresponding side. When the silicon wafer 120 in the material frame 200 needs to be sliced by taking the silicon wafer group 121 as a unit, the material frame 200 moves along the horizontal direction under the action of the material frame conveying module 20, relative movement is generated between the material frame 200 and the unlocking device 300, each clamping part 222 is contacted with the unlocking device 300 one by one along the movement direction of the material frame 200, the first roller 320 moves between the inclined surface 2227 and the frame 210 and is contacted with the inclined surface 2227, the second pin shaft 2221 moves towards the direction far away from the silicon wafer 120 through the relative displacement between the first roller 320 and the inclined surface 2227, the clamping block 2222 is driven to be far away from the silicon wafer 120, namely, the clamping of the corresponding silicon wafer group 121 is released, and the device on the subsequent station is convenient for slicing operation on the unlocked silicon wafer group 121.

Further, the vertical portion 2226 is provided with two inclined surfaces 2227, one inclined surface 2227 being located above the lateral portion 2225, and the other inclined surface 2227 being located below the lateral portion 2225. The unlocking device 300 further includes a first mounting bracket 310 having a U-shaped structure, and first rollers 320 are respectively provided on upper and lower walls of the first mounting bracket 310, and the first rollers 320 are in contact with inclined surfaces 2227 of the corresponding sides. In this way, the unlocking action of the unlocking device 300 on the clamp portion 222 is improved, and the unlocking reliability is improved.

In some embodiments, the clamping assembly 220 further includes a movable plate 221, the movable plate 221 extending along a length direction of the accommodating space 213, and a plurality of clamping portions 222 sequentially arranged along the length direction of the movable plate 221.

When the movable plate 221 moves away from the accommodating space 213 under the action of external force, the movable plate 221 drives all the clamping parts 222 arranged on the movable plate to synchronously move away from the accommodating space 213, so that the distance between the two clamping assemblies 220 is increased, and the silicon wafer is conveniently filled into the accommodating space 213 from top to bottom.

Further, the movable plate 221 is located at an outer side of the frame 210, and specifically, referring to fig. 16 and 20, the lower frame 212 includes two opposite lateral frames 2125, the lateral frames 2125 extend along a length direction of the accommodating space 213, the movable plate 221 is located at an outer side of the lateral frames 2125, and the second pin shaft 2221 passes through the lateral frames 2125 and the movable plate 221. When the movable plate 221 moves away from the accommodating space 213 under the action of an external force, the movable plate 221 pushes all the unlocking blocks 2223 to synchronously move away from the accommodating space 213, so that all the clamping blocks 2222 are away from the accommodating space 213. Specifically, a step portion 2228 is formed between the unlocking block 2223 and the second pin 2221, when the movable plate 221 moves in a direction away from the accommodating space 213, the movable plate 221 abuts against the step portion 2228 to push the unlocking block 2223 to move synchronously, the unlocking block 2223 drives the second pin 2221 and the clamping block 2222 to move synchronously in a direction away from the accommodating space 213, and the spring 2229 is compressed.

After the external force applied by the movable plate 221 is removed, the clamping block 2222 moves towards the direction approaching the silicon wafer 120 under the action of the restoring force of the spring 2229, so as to clamp the corresponding silicon wafer group 121.

Further, a second limiting shaft 223 is arranged on the transverse frame 2125, a second strip through hole 2224 is arranged on the second pin shaft 2221, and the second limiting shaft 223 is arranged in the second strip through hole 2224 in a penetrating mode, so that an anti-rotation effect is achieved on the second pin shaft 2221.

In some embodiments, referring to fig. 14 and 24, the bezel 200 further includes an anti-toppling assembly 240 for resting against the support silicon wafer 120. The anti-toppling component 240 is disposed at one end far away from the discharge port 214, when the transfer trolley 400 pushes the material frame 200 to move forward, the silicon wafer 120 has a tendency to topple backward (i.e. the direction opposite to the movement direction of the material frame 200), and the silicon wafer 120 is prevented from toppling through the abutment of the anti-toppling component 240 and the silicon wafer 120.

The anti-toppling component 240 comprises a second mounting frame 241 and a second roller 242 arranged on the second mounting frame 241, wherein the second mounting frame 241 is arranged on the frame 210, and the second roller 242 is used for abutting against the silicon wafer 120. The second rollers 242 are arranged at intervals along the vertical direction, for example, two rollers are in contact with the silicon wafer 120 at a plurality of positions in the vertical height direction, so that anti-toppling reliability is improved.

Further, the second mounting frame 241 includes a fixed frame 2411 and a movable frame 2412, the fixed frame 2411 is fixedly disposed on the frame 210, the movable frame 2412 is rotatably connected with the fixed frame 2411, a torsion spring 2413 is disposed between the movable frame 2412 and the fixed frame 2411, and the second roller 242 is disposed on the movable frame 2412. The second roller 242 is prevented from rigidly extruding the silicon wafer 120 by the rotation of the movable frame 2412 relative to the fixed frame 2411 to accommodate jolt of the material frame 200 during transportation.

In some embodiments, the material frame 200 further includes an unlocking trigger portion 230, the unlocking trigger portion 230 includes a first pin shaft 231, the first pin shaft 231 passes through the transverse frame 2125, a first end of the first pin shaft 231 is fixedly connected with the movable plate 221, and a second end of the first pin shaft 231 is used for receiving an external force, so that the first pin shaft 231 moves along a penetrating direction of the first pin shaft in the transverse frame 2125 to drive the movable plate 221 to synchronously move towards a direction away from the containing space 213, and the movable plate 221 then drives all the clamping portions 222 to synchronously move towards a direction away from the containing space 213, so that a distance between the two oppositely arranged clamping assemblies 220 is increased, and the silicon wafer unit 100 is conveniently placed into the material frame 200 from top to bottom.

In some embodiments, the frame 200 is transported between the cutting station 11 and the degelling station 17 by a transport trolley 400. Referring to fig. 11 and 12, the frame 200 is first placed on the transfer cart 400, and then the cut silicon wafer units 100 are placed into the frame 200, and the frame 200 is transferred to the degumming station 17 by the transfer cart 400.

Structure of transfer cart 400 referring to fig. 25 and 26, transfer cart 400 has functions of storage, limiting, transportation, etc. for material frame 200.

The transfer trolley 400 is provided with an unlocking part 410, and the unlocking part 410 is used for interacting with the unlocking trigger part 230 on the material frame 200 to provide external force for the unlocking trigger part 230. Specifically, after the material frame 200 is placed on the transfer trolley 400, the unlocking portion 410 contacts with the unlocking triggering portion 230, the unlocking portion 410 triggers the unlocking triggering portion 230 to act, the movable plate 221 moves in a direction away from the accommodating space 213 under the action of the unlocking triggering portion 230, and the movable plate 221 drives the plurality of clamping portions 222 disposed thereon to move synchronously in a direction away from the accommodating space 213.

During application, before placing the silicon wafer unit 100 in the material frame 200, the material frame 200 is placed on the transfer trolley 400, and at this time, the unlocking portion 410 contacts with the unlocking trigger portion 230, so that the movable plate 221 moves in a direction away from the accommodating space 213 under the action of the unlocking trigger portion 230, and the movable plate 221 drives the plurality of clamping portions 222 disposed thereon to synchronously move in a direction away from the accommodating space 213, that is, the distance between the two opposite clamping assemblies 220 increases, so that the silicon wafer unit 100 is conveniently placed in the accommodating space 213 from top to bottom.

The material frame 200 is provided with a limiting structure for limiting the crystal support 110, and the silicon wafer unit 100 is ensured to be placed stably in the material frame 200 through the limitation of the material frame 200 to the crystal support 110, so that the silicon wafer 120 is prevented from toppling or shifting.

After the silicon wafer unit 100 is placed in the material frame 200, the material frame 200 is transported to a next working station, specifically, a degumming station by the transport trolley 400. After reaching the degumming station, the material frame 200 is taken down from the transfer trolley 400 by a mechanical arm and other devices, at this time, the unlocking part 410 is separated from the unlocking triggering part 230, and the clamping assembly 220 automatically moves towards the direction close to the silicon wafer unit 100 under the action of the reset force of the reset piece, so as to clamp the silicon wafer unit 100. After the silicon wafer unit 100 is clamped, the silicon wafer unit 100 is convenient to degum on the degumming station, and at the moment, the silicon wafer 120 is clamped by the clamping assembly 220, so that the wafer support 110 and the silicon wafer 120 are convenient to separate smoothly.

After the silicon wafer unit 100 is degummed, the silicon wafer unit is transported to a next working station by the material frame 200, the silicon wafer 120 is sliced by taking the silicon wafer group 121 as a unit, and the sliced silicon wafer 120 is convenient for carrying out subsequent inserting operation. When the silicon wafer 120 is sliced by taking the silicon wafer group 121 as a unit, the clamping part 222 releases the clamping of the corresponding silicon wafer group 121, and when the unlocked silicon wafer group 121 is sliced and fed, the rest silicon wafer groups 121 are still clamped by the corresponding clamping parts 222. In this process, the unlocking of the wafer stack 121 by the clamping portion 222 is achieved by the action between the unlocking device 300 and the clamping portion 222.

According to the silicon wafer production flow, the use method of the silicon wafer transfer device consisting of the material frame and the transfer trolley is as follows:

when transferring the cut silicon wafer units 100, firstly placing the material frame 200 on the transfer trolley 400, enabling the unlocking part 410 to be in contact with the unlocking triggering part 230, enabling the unlocking part 410 to trigger the unlocking triggering part 230 to act, enabling all the clamping parts 222 to synchronously move in a direction away from the containing space 213 under the drive of the movable plate 221, so that the silicon wafer units 100 can be conveniently loaded into the containing space 213 from top to bottom, and at the moment, the clamping assembly 220 does not clamp the silicon wafer 120;

a limiting structure for limiting the crystal support 110 is arranged on the material frame 200, so that the placement stability of the silicon wafer unit 100 in the material frame 200 is ensured;

after the transfer trolley 400 transfers the material frame 200 to the next operation station, the material frame 200 is taken down from the transfer trolley 400, the unlocking part 410 is separated from the unlocking triggering part 230, and all the clamping parts 222 move towards the direction close to the silicon wafer unit 100 under the action of the resetting piece so as to clamp the silicon wafer 120, so that the crystal support 110 is convenient to separate from the silicon wafer 120 in a degumming way;

the material frame 200 transfers the silicon wafer 120 to the next working station, slices the silicon wafer 120 in the material frame 200 by taking the silicon wafer group 121 as a unit, at this time, relative motion is generated between the material frame 200 and the unlocking device 300, the plurality of clamping parts 222 sequentially contact with the unlocking device 300 along with the relative motion between the material frame 200 and the unlocking device 300, and the unlocking device 300 applies external force to the clamping parts 222 so as to enable the clamping parts 222 to be far away from the corresponding silicon wafer group 121, and the clamping of the silicon wafer group 121 is released.

According to the embodiment, through the matching structure between the transfer trolley 400 and the material frame 200, the clamping mechanism on the material frame 200 is triggered, on one hand, when the material frame 200 is matched with the transfer trolley 400, the clamping mechanism is in an unlocking state so that the silicon wafers 120 are placed in the material frame 200, on the other hand, when the material frame 200 is separated from the transfer trolley 400, the clamping mechanism is used for automatically clamping the whole silicon wafers 120, the placement reliability of the silicon wafers 120 in the transfer process is improved, the subsequent degumming and separation of the crystal support 110 and the silicon wafers 120 are also facilitated, and when the silicon wafers 120 are subjected to slicing and feeding, the material frame 200 can independently release the clamping of each silicon wafer group 121 through the unlocking device 300, so that the silicon wafers 120 are prevented from being damaged, manual intervention is reduced, and the operation efficiency is improved.

In some embodiments, a roller (denoted as a third roller 232) is provided at a second end of the first pin 231. Referring to fig. 13, 25 and 26 again, the unlocking portion 410 is a stand column disposed on the transferring trolley 400, the upper end of one side of the stand column facing the third roller 232 is provided with a guiding contact surface 411, when the material frame 200 is placed on the transferring trolley 400 from top to bottom, the third roller 232 moves from top to bottom along the guiding contact surface 411 to drive the first pin 231 to move in a direction away from the containing space 213, and as the first pin 231 is fixedly connected with the movable plate 221, the movable plate 221 is driven to synchronously move in a direction away from the containing space 213.

Further, referring to fig. 26, the guiding contact surface 411 includes, from top to bottom, a contact surface first segment 4111, a contact surface second segment 4112, and a contact surface third segment 4113, the contact surface second segment 4112 extends in a vertical direction, the contact surface first segment 4111 extends obliquely from the top of the contact surface second segment 4112 in a direction away from the third roller 232, and the contact surface third segment 4113 extends obliquely from the bottom of the contact surface second segment 4112 in a direction toward the third roller 232.

When the material frame 200 is placed on the transfer trolley 400 from top to bottom, the third roller 232 is firstly contacted with the first contact surface section 4111, the inclined first contact surface section 4111 plays a primary positioning role in placing the material frame 200, as the material frame 200 continues to be placed down, the third roller 232 gradually pushes the first pin shaft 231 to a direction far away from the containing space 213 in the moving process of the inclined first contact surface section 4111 until the third roller 232 moves onto the second contact surface section 4112, after the first pin shaft 231 moves outwards, as the material frame 200 continues to be placed down, the third roller 232 moves onto the lower end of the second contact surface section 4112, the third contact surface section 4113 plays a movement stop for the third roller 232, and the material frame 200 is placed in place.

Further, two unlocking trigger parts 230 are configured on each movable plate 221, two unlocking trigger parts 230 are disposed at opposite ends of the movable plate 221, that is, four unlocking trigger parts 230 are configured on each material frame 200, and four unlocking parts 410 are disposed on the transfer trolley 400 correspondingly, as shown in fig. 25. The four unlocking parts 410 are used for contacting with the corresponding unlocking triggering parts 230 on one hand and playing a role in guiding and pre-positioning for placing the material frame 200 on the other hand.

Further, a first limiting shaft 233 is arranged on the transverse frame 2125, a first long through hole 234 is formed in the first pin shaft 231, and the first limiting shaft 233 penetrates through the first long through hole 234 and plays a role in preventing rotation of the first pin shaft 231.

In some embodiments, referring to fig. 25 and 26, a limiting portion 420 is provided on a vehicle body of the transfer trolley 400, the limiting portion 420 is a limiting protrusion arranged on a peripheral side of the material frame 200, and the limiting portion 420 is used for limiting the material frame 200, so as to ensure placement stability of the material frame 200 on the transfer trolley 400.

Further, the transfer trolley 400 is provided with a liquid collecting tank 430, the liquid collecting tank 430 is located below the material frame 200, and the liquid collecting tank 430 is used for containing liquid dropped on the silicon wafer 120. A drain port 440 and a drain valve 450 are provided at a lower position of the sump 430 to facilitate drain.

Further, a positioning part 460 is provided at the moving front end of the transfer cart 400, and the positioning part 460 is used for positioning when the transfer cart 400 moves to a designated position.

In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. A silicon wafer production line, comprising:

the material frame is used for accommodating the cut silicon wafers;

2. A silicon wafer production line according to claim 1, wherein,

a containing space for containing silicon wafers is formed in the material frame, and a plurality of silicon wafers in the material frame are divided into a plurality of silicon wafer groups;

3. A silicon wafer production line according to claim 2, wherein,

when the cut silicon wafer is transported, firstly, the material frame is placed on the transport trolley, the unlocking part triggers the unlocking triggering part to act, and all the clamping parts synchronously move in a direction away from the containing space under the drive of the movable plate, so that the silicon wafer is conveniently loaded into the containing space from top to bottom;

4. A silicon wafer production line according to claim 2, wherein,

the material frame horizontal conveying station is provided with an unlocking device, when the material frame conveying module drives the material frame to move along the horizontal direction, the material frame and the unlocking device generate relative movement, the clamping parts sequentially contact with the unlocking device along with the relative movement between the material frame and the unlocking device, and the unlocking device applies external force to the clamping parts so that the clamping parts are far away from the corresponding silicon wafer groups.

5. A silicon wafer production line according to claim 4, wherein,

the clamping part comprises a second pin shaft, the second pin shaft penetrates through the material frame and the movable plate, an unlocking block is arranged at the first end of the second pin shaft, a clamping block is arranged at the second end of the second pin shaft, a spring is sleeved on the second pin shaft, and the spring is located between the clamping block and the material frame;

6. A silicon wafer production line according to claim 5, wherein,

the unlocking block comprises a transverse part and a vertical part, the transverse part is used for abutting against the movable plate, and the vertical part is used for acting with the unlocking device;

7. A silicon wafer production line according to claim 2, wherein,

the material frame comprises an upper frame and a lower frame, the upper frame is detachably arranged above the lower frame, a limiting structure for limiting the crystal support is arranged on the upper frame, and the clamping assembly is arranged on the lower frame;

8. A silicon wafer production line according to any one of claims 1 to 7, wherein,

the slicing module comprises a water spraying part and a vertical conveying part, wherein the water spraying part is used for spraying water to the unlocked silicon wafer group in the material frame, slicing a plurality of silicon wafers in the silicon wafer group, and the vertical conveying part is used for conveying the sliced silicon wafers upwards to the overturning conveying module in a vertical posture one by one.

9. A silicon wafer production line according to claim 8, wherein,

the vertical conveying part comprises a first mounting frame, an adsorption part and a vertical conveying belt are arranged on the first mounting frame, the adsorption part is used for adsorbing the separated silicon wafers onto the vertical conveying belt, and the vertical conveying belt drives the silicon wafers to move upwards in a vertical posture.

10. A silicon wafer production line according to claim 8, wherein,

the turnover conveying module comprises a turnover auxiliary part and a glue-coating rolling wheel, the turnover auxiliary part comprises a second mounting frame, a blowing part is arranged on the second mounting frame and is positioned above the vertical conveying part, the blowing part is used for blowing air to the vertical silicon wafer conveyed upwards by the vertical conveying part so that the silicon wafer is poured onto the glue-coating rolling wheel, and the glue-coating rolling wheel drives the silicon wafer to move to a horizontal posture.