CN117476512B - Etching device applied to semiconductor chip production - Google Patents
Etching device applied to semiconductor chip production Download PDFInfo
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- CN117476512B CN117476512B CN202311826487.4A CN202311826487A CN117476512B CN 117476512 B CN117476512 B CN 117476512B CN 202311826487 A CN202311826487 A CN 202311826487A CN 117476512 B CN117476512 B CN 117476512B
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- 238000005530 etching Methods 0.000 title claims abstract description 164
- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 59
- 238000001914 filtration Methods 0.000 claims abstract description 39
- 238000005192 partition Methods 0.000 claims abstract description 9
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 238000005096 rolling process Methods 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 abstract description 8
- 239000007921 spray Substances 0.000 abstract description 8
- 238000003756 stirring Methods 0.000 abstract description 3
- 239000012535 impurity Substances 0.000 description 13
- 230000033001 locomotion Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/88—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor having feed or discharge devices
- B01D29/94—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor having feed or discharge devices for discharging the filter cake, e.g. chutes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/96—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor in which the filtering elements are moved between filtering operations; Particular measures for removing or replacing the filtering elements; Transport systems for filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Weting (AREA)
Abstract
The invention discloses an etching device applied to semiconductor chip production, which comprises an etching box main body, wherein the etching box main body is divided into an etching chamber and a filtering chamber by a partition board arranged in the etching box main body, a liquid level difference circulation groove is formed in one side of the partition board in a penetrating way and used for communicating the etching chamber with the filtering chamber, a filter screen frame is arranged in the filtering chamber, a hand-operated traction assembly for traction is arranged at the top of the filter screen frame, and the hand-operated traction assembly is fixedly arranged on the outer wall of the filtering chamber; according to the invention, the etching liquid sprayed out through the spray head can stir the etching liquid in the etching cavity, at the moment, the pressure of the etching liquid at the bottom of the grid plate is higher than the pressure at the top, and the semiconductor chip on the grid plate can be separated from the grid plate to float under the action of the pressure, so that the situation that the semiconductor chip cannot be completely etched due to stacking can be avoided.
Description
Technical Field
The invention relates to the technical field related to chip production, in particular to an etching device applied to semiconductor chip production.
Background
Semiconductor chips are etched and wired on semiconductor sheets to form semiconductor devices capable of achieving certain functions, the semiconductor chips are generally placed into an etching device to be in contact with etching liquid to achieve etching in the etching process, but the semiconductor chips are submerged in the etching device and stacked in the etching device, so that some semiconductor chips cannot be completely etched, the etching liquid floats on the surfaces of the semiconductor chips after multiple uses, and if the semiconductor chips cannot be cleaned timely, the suspended impurities can be attached to the surfaces of the semiconductor chips, and further cleaning is needed for the semiconductor chips later, so that the labor amount of workers is increased.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides an etching device applied to the production of semiconductor chips.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention relates to an etching device applied to semiconductor chip production, which comprises an etching box main body, wherein the etching box main body is divided into an etching chamber and a filtering chamber by a partition board arranged in the etching box main body, a liquid level difference circulation groove is formed in one side of the partition board in a penetrating way, the liquid level difference circulation groove is used for communicating the etching chamber with the filtering chamber, a filter screen frame is arranged in the filtering chamber, a hand-operated traction assembly for traction of the filter screen frame is arranged at the top of the filter screen frame, and the hand-operated traction assembly is fixedly arranged on the outer wall of the filtering chamber;
a circulating pump assembly for circulating etching liquid is arranged at the bottom of the outer wall of the filtering chamber, and one end of the circulating pump assembly penetrates through the etching chamber and is positioned at the bottom of the etching chamber;
a grid plate is arranged at the top of the circulating pump assembly in the etching chamber, an inverted T-shaped pad plate for pad arrangement is fixedly arranged at the bottom of the grid plate, and an elastic cover plate assembly which is used for closing the etching chamber and can vibrate is arranged at the top of the grid plate;
the top of the elastic cover plate component is provided with a driving component, the driving component can be used for moving the position height of the elastic cover plate component, and the driving component can also be used for driving the elastic cover plate component to vibrate.
As a preferable technical scheme of the invention, the hand-operated traction assembly comprises two longitudinal slide bars and four rolling wheels, wherein the two longitudinal slide bars are both in sliding connection with a frame at one end of the filter screen frame, the four rolling wheels are respectively and rotatably arranged in rotating grooves formed in two sides of the filter screen frame, and the wheel edges of the rolling wheels are attached to the inner wall of the filter chamber;
the hand-operated traction assembly further comprises a wire wheel box body, the wire wheel box body is fixedly arranged on the outer wall of the filtering cavity, a wire wheel is arranged in the wire wheel box body, a connecting shaft is fixedly arranged at the axis of the wire wheel, two ends of the connecting shaft are rotationally connected with the wire wheel box body, a worm wheel is fixedly arranged on one side of the wire wheel outside the connecting shaft, a worm is arranged at the bottom of the worm wheel in a matched mode, a crank is fixedly arranged at one end of the worm, and the crank is rotationally connected with the wire wheel box body and located on the outer side of the wire wheel box body.
As a preferable technical scheme of the invention, a traction rope is wound outside the reel, a conveying line wheel is fixedly arranged at the top of the outer wall of the filter chamber, a guide line wheel is arranged on the inner wall of the filter chamber corresponding to the conveying line wheel, the guide line wheel is fixedly arranged in a fixed groove formed in the inner wall of the filter chamber, the movable end of the traction rope sequentially bypasses the conveying line wheel and the guide line wheel to form a fixed lug, and the fixed lug is fixedly arranged at the top end of the frame of the filter screen frame and is positioned between the two longitudinal sliding rods.
As a preferable technical scheme of the invention, the circulating pump assembly comprises a circulating pump body, the circulating pump body is fixedly connected with the outer wall of the filtering chamber, a water inlet of the circulating pump body is connected with a water inlet pipe, one end of the water inlet pipe is communicated with the bottom of the filtering chamber, a water outlet of the circulating pump body is connected with a water outlet pipe, and one end of the water outlet pipe penetrates through the etching chamber and is arranged at the bottom of the etching chamber;
the utility model discloses a shower nozzle, including outlet pipe, sealing connection spare, main pipeline, outlet pipe top, sealing connection spare, the both sides homogeneous phase intercommunication on outlet pipe top is provided with communicating pipe, the top of communicating pipe is provided with the main pipeline through sealing connection spare intercommunication, the outside at main pipeline both ends all is provided with carries out spacing fixed mounting to its position, and two equidistance between the main pipeline and the intercommunication is provided with a plurality of to the branch pipeline, the top equidistance of branch pipeline is provided with a plurality of shower nozzle.
As a preferable technical scheme of the invention, the sealing connecting piece comprises an inverted T-shaped connecting pipeline, one end of the connecting pipeline is communicated with the main pipeline, a sinking groove is formed in the other end of the connecting pipeline, a plurality of spring grooves are formed in the bottom end of the sinking groove at equal intervals along the circumferential direction, spring blocks are fixedly arranged in the spring grooves, one ends of the spring blocks are fixedly connected with the same sliding ring, the sliding ring is arranged in the sinking groove in a matched sliding manner, a sealing gasket is fixedly arranged on the outer side of the sliding ring, and one end of the communicating pipe is abutted against the sealing gasket.
As a preferable technical scheme of the invention, the fixing piece comprises a fixing seat, the fixing seat is fixedly connected with the inner wall of the etching chamber, an arc-shaped placing groove is formed in the top end of the fixing seat, an arc-shaped limiting ring is arranged at the top of the arc-shaped placing groove, one end of the arc-shaped limiting ring is rotationally connected with the fixing seat, the other end of the arc-shaped limiting ring is fixedly connected with the fixing seat through a fixing bolt, a screwing bolt is in threaded connection with the top of the arc-shaped limiting ring, and a propping piece is rotationally arranged at the bottom end of the screwing bolt.
As a preferable technical scheme of the invention, the elastic cover plate assembly comprises a movable cover plate body matched with the top wall of the etching chamber, a sliding table matched with the inner cavity of the etching chamber is slidably arranged in the middle of the movable cover plate body, and a pushing plate is fixedly arranged at the top end of the sliding table;
four corners of the pushing plate are provided with sliding columns in a sliding mode, the bottom ends of the sliding columns are fixedly connected with the movable cover plate body, the top ends of the sliding columns are fixedly provided with baffle plates, reset springs are sleeved outside the sliding columns, and two ends of each reset spring are fixedly connected with the pushing plate and the baffle plates respectively.
As a preferable technical scheme of the invention, the bottom end of the sliding table is obliquely downwards provided with a plurality of diversion trenches, and four corners of the bottom end of the sliding table are fixedly provided with connecting columns, and the bottom ends of the connecting columns are fixedly connected with the grid plate.
As a preferable technical scheme of the invention, the driving assembly comprises a fixed top plate, wherein four corners of the bottom end of the fixed top plate are fixedly provided with fixed columns, the fixed columns are fixedly connected with the outer wall of the etching chamber through connecting seats fixedly arranged at the bottom end, two sides of the top end of the fixed top plate are fixedly provided with air cylinders, and the output ends of the air cylinders penetrate through perforations formed in the pushing plate and are fixedly connected with the movable cover plate body;
the top of fixed roof is located the fixed driving motor that is provided with in one side at middle part between two cylinders, driving motor's output is fixed to be provided with the driving pulley, driving pulley's bottom is provided with driven pulley, driving pulley and driven pulley pass through belt drive and connect, just run through on the fixed roof and set up the fluting that is used for the belt to pass.
As a preferable technical scheme of the invention, a rotating shaft is fixedly arranged at the axle center of the driven belt wheel, two connecting bases are rotatably arranged at the outer part of one end of the rotating shaft, the connecting bases are fixedly connected with a fixed top plate, an eccentric wheel is fixedly arranged between the two connecting bases on the rotating shaft, the eccentric wheel is positioned right above a pushing plate, and a rubber pad is embedded at the bottom of the eccentric wheel on the pushing plate.
The beneficial effects of the invention are as follows:
1. the etching device for semiconductor chip production is characterized in that etching liquid is added into an etching chamber and a filtering chamber, the liquid level in the etching chamber is higher than the liquid level in the filtering chamber and is close to a liquid level difference circulation groove, then the circulating pump body works to pump the etching liquid in the filtering chamber into a main pipeline, then the etching liquid is sprayed out through a spray head on a branch pipeline, the etching liquid in the etching chamber is stirred by the spray head, at the moment, the pressure of the etching liquid at the bottom of a grid plate is higher than the pressure at the top, and the semiconductor chip on the grid plate is separated from the grid plate to float under the action of the pressure, so that the situation that the semiconductor chip cannot be completely etched due to stacking can be avoided.
2. This kind of etching device for semiconductor chip production pumps into the etching chamber through the etching in with the filter chamber, and the liquid level in the etching chamber can overflow the liquid level difference circulation groove at this moment, flows into in the filter chamber, and the impurity of suspending in the etching chamber then can flow into the filter chamber along etching liquid one by one at this moment, can realize quick timely clear up the suspended impurity in the etching chamber, and does not need artifical clearance, reduces staff's amount of labour.
3. This kind of etching device for semiconductor chip production rotates the crank and drives the worm and rotate, the worm rotates and drives and rotate rather than complex worm wheel, the worm wheel rotates and can drive the connecting axle and rotate, the connecting axle rotates and then can realize driving the reel and rotate, then carry out the rolling through the reel to the haulage rope, can give filter screen frame ascending effort when the haulage rope is rolling, at this moment the filter screen frame can upward movement, until remove the filter screen frame to being higher than the liquid level in the filter chamber, at this moment impurity in the filter chamber then all can concentrate in the filter screen frame, at this moment it can to get the clearance with impurity clamp in the filter screen frame through outside clamp device.
4. This kind of etching device who is applied to semiconductor chip production through the setting of vertical slide bar, can improve the stationarity of position when the filter screen frame removes, and through the roll round of setting, can reduce the frictional force between filter screen frame and the filtration cavity, and then can make the more smooth and easy of filter screen frame removal.
5. This kind of etching device for semiconductor chip production inserts two communicating pipes respectively to two connecting lines in, then presses main pipeline to arc standing groove downwards, and it is fixed with the fixing base to rotate arc spacing ring again and through fixing bolt, then twists the screw bolt again and drives and support tight piece downstream, can support the fastening through the position of supporting tight piece to main pipeline and fix, and communicating pipe and sealed pad contact this moment, and the spring block atress is in compressed state, through the elastic action of spring block, can promote sealed pad and communicating pipe in close contact, and then can improve the sealed effect of being connected between communicating pipe and the connecting line.
6. This kind of etching device who is applied to semiconductor chip production, the cylinder during operation can promote the removal apron body down motion, until remove the removal apron body to inconsistent with the etching cavity, at this moment can be closed the etching cavity through the cooperation of slip table with the removal apron body, and can promote the grid plate to the etching cavity in place to fill up on the board simultaneously, can drive the removal apron body and slip table up motion when the cylinder is retracted, open the etching cavity, and the grid plate can rise to the top of etching liquid and the etching liquid separates this moment.
7. The etching device applied to semiconductor chip production is characterized in that the driving motor works to drive the eccentric wheel to rotate, the grid plate can vibrate through the cooperation of the eccentric wheel and the reset spring, and etching liquid on the grid plate and the etched semiconductor chip can vibrate and fall into the etching cavity through the vibration of the grid plate.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a front side elevational view of an etching apparatus for semiconductor chip production according to the present invention;
fig. 2 is a side perspective view of an etching apparatus applied to the production of semiconductor chips according to the present invention;
FIG. 3 is a schematic diagram of a connection structure between a screen frame and a hand-operated traction assembly of an etching apparatus for semiconductor chip production according to the present invention;
FIG. 4 is a schematic diagram of a hand-operated pulling assembly of an etching apparatus for semiconductor chip production according to the present invention;
FIG. 5 is a schematic view showing the position of a grid plate and circulating pump assembly of an etching apparatus applied to semiconductor chip production according to the present invention;
FIG. 6 is a schematic view showing a circulation pump assembly of an etching apparatus applied to the production of semiconductor chips according to the present invention;
FIG. 7 is a schematic view showing the position structure of a connecting pipe and a sealing connection member of an etching apparatus applied to the production of semiconductor chips according to the present invention;
fig. 8 is a schematic view showing a sealing connection structure of an etching apparatus applied to semiconductor chip production according to the present invention;
fig. 9 is a schematic view showing a structure of a fixing member of an etching apparatus applied to the production of semiconductor chips according to the present invention;
FIG. 10 is a schematic view showing the position structure of an elastic cover plate assembly and a driving assembly of an etching apparatus applied to semiconductor chip production according to the present invention;
FIG. 11 is a schematic view showing the structure of an elastic cover plate assembly of an etching apparatus applied to the production of semiconductor chips according to the present invention;
fig. 12 is a partial enlarged view a of an etching apparatus applied to the production of semiconductor chips according to the present invention;
fig. 13 is a partial enlarged view B of an etching apparatus applied to the production of semiconductor chips according to the present invention.
In the figure: 10. etching the box main body; 11. a partition plate; 12. etching the chamber; 13. a filtration chamber; 14. a liquid level difference flow channel; 15. a filter screen frame; 16. a grid plate; 17. a pad plate; 20. a hand-operated traction assembly; 21. a longitudinal slide bar; 22. a rolling wheel; 23. a rotating groove; 24. a reel case; 25. a reel; 26. a connecting shaft; 27. a worm wheel; 28. a worm; 29. a crank; 210. a traction rope; 211. a conveyor line wheel; 212. a guide wire wheel; 213. a fixing groove; 214. a fixed ear; 30. a circulation pump assembly; 31. a circulation pump body; 32. a water inlet pipe; 33. a water outlet pipe; 34. a communicating pipe; 35. sealing the connection member; 351. a connecting pipeline; 352. sinking grooves; 353. a spring groove; 354. a spring block; 355. a slip ring; 356. a sealing gasket; 36. a main pipeline; 37. a fixing member; 371. a fixing seat; 372. an arc-shaped placing groove; 373. an arc-shaped limiting ring; 374. screwing the bolt; 375. a tightening piece; 38. a spray head; 39. a branch pipeline; 40. an elastic cover plate assembly; 41. moving the cover plate body; 42. a sliding table; 43. a pushing plate; 44. a spool; 45. a baffle; 46. a return spring; 47. a diversion trench; 48. a connecting column; 50. a drive assembly; 51. fixing the top plate; 52. fixing the column; 53. a connecting seat; 54. a cylinder; 55. a driving motor; 56. a driving pulley; 57. a driven pulley; 58. a belt; 59. the base is connected; 510. an eccentric wheel; 511. and (3) rotating the shaft.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Examples: as shown in fig. 1 and 2, the etching device applied to semiconductor chip production of the present invention comprises an etching box main body 10, wherein the etching box main body 10 is divided into an etching chamber 12 and a filtering chamber 13 by a partition 11 arranged inside, a liquid level difference circulation groove 14 is arranged on one side of the partition 11 in a penetrating way, the liquid level difference circulation groove 14 is used for communicating the etching chamber 12 and the filtering chamber 13, a filter screen frame 15 is arranged in the filtering chamber 13, a hand-operated traction assembly 20 for traction is arranged at the top of the filter screen frame 15, and the hand-operated traction assembly 20 is fixedly arranged on the outer wall of the filtering chamber 13;
a circulating pump assembly 30 for circulating the etching liquid is arranged at the bottom of the outer wall of the filtering chamber 13, and one end of the circulating pump assembly 30 penetrates through the etching chamber 12 and is positioned at the bottom of the etching chamber 12;
a grid plate 16 is arranged at the top of the circulating pump assembly 30 in the etching chamber 12, an inverted T-shaped pad plate 17 for pad arrangement is fixedly arranged at the bottom of the grid plate 16, and an elastic cover plate assembly 40 for closing the etching chamber 12 and vibrating is arranged at the top of the grid plate 16;
the driving assembly 50 is disposed on the top of the elastic cover assembly 40, the driving assembly 50 can be used for moving the position height of the elastic cover assembly 40, and the driving assembly 50 can also be used for driving the elastic cover assembly 40 to vibrate.
As shown in fig. 2, 3 and 4, the hand-operated traction assembly 20 includes two longitudinal sliding rods 21 and four rolling wheels 22, the two longitudinal sliding rods 21 are both slidably connected with a frame at one end of the filter screen frame 15, the four rolling wheels 22 are respectively rotatably arranged in rotating grooves 23 formed at two sides of the filter screen frame 15, and wheel edges of the rolling wheels 22 are attached to the inner wall of the filter chamber 13; the hand-operated traction assembly 20 further comprises a wire wheel box body 24, the wire wheel box body 24 is fixedly arranged on the outer wall of the filtering cavity 13, a wire wheel 25 is arranged in the wire wheel box body 24, a connecting shaft 26 is fixedly arranged at the axis of the wire wheel 25, two ends of the connecting shaft 26 are rotatably connected with the wire wheel box body 24, a worm wheel 27 is fixedly arranged on one side of the wire wheel 25 outside the connecting shaft 26, a worm 28 is matched with the bottom of the worm wheel 27, a crank 29 is fixedly arranged at one end of the worm 28, and the crank 29 is rotatably connected with the wire wheel box body 24 and is positioned on the outer side of the wire wheel box body 24; the outside of reel 25 is convoluteed there is haulage rope 210, and the top of filter cavity 13 outer wall is fixed to be provided with transfer chain wheel 211, and the inner wall of filter cavity 13 is provided with direction wire wheel 212 corresponding with transfer chain wheel 211, and direction wire wheel 212 is fixed to be set up in the fixed slot 213 of seting up on filter cavity 13 inner wall, and the expansion end of haulage rope 210 walks around transfer chain wheel 211 and direction wire wheel 212 in proper order and is tied to have fixed ear 214, and fixed ear 214 is fixed to be set up on the top of filter screen frame 15 frame and is located between two vertical slide bars 21.
When the suspended impurities in the filter chamber 13 need to be cleaned, the crank 29 can be rotated to drive the worm 28 to rotate, the worm 28 is rotated to drive the worm wheel 27 matched with the worm 28 to rotate, the worm wheel 27 can drive the connecting shaft 26 to rotate, the connecting shaft 26 rotates to further drive the reel 25 to rotate, then the traction rope 210 is wound through the reel 25, an upward acting force is applied to the filter screen frame 15 when the traction rope 210 is wound, at this moment, the filter screen frame 15 moves upwards until the filter screen frame 15 moves to be higher than the liquid level in the filter chamber 13, at this moment, impurities in the filter chamber 13 are all concentrated in the filter screen frame 15, at this moment, the impurities in the filter screen frame 15 are clamped and cleaned through an external clamping device, through the arrangement of the longitudinal sliding rod 21, the position stability of the filter screen frame 15 can be improved, and through the arranged rolling wheel 22, the friction force between the filter screen frame 15 and the filter screen chamber 13 can be reduced, and the filter screen frame 15 can be moved more smoothly.
As shown in fig. 5 and 6, the circulating pump assembly 30 includes a circulating pump body 31, the circulating pump body 31 is fixedly connected with the outer wall of the filtering chamber 13, a water inlet of the circulating pump body 31 is connected with a water inlet pipe 32, one end of the water inlet pipe 32 is communicated with the bottom of the filtering chamber 13, a water outlet of the circulating pump body 31 is connected with a water outlet pipe 33, and one end of the water outlet pipe 33 passes through the etching chamber 12 and is arranged at the bottom of the etching chamber 12; the both sides homogeneous phase intercommunication on outlet pipe 33 top is provided with communicating pipe 34, and communicating pipe 34's top is provided with main pipeline 36 through sealing connection 35 intercommunication, and the outside at main pipeline 36 both ends all is provided with the mounting 37 that carries out spacing fixed to its position, and equidistant and the intercommunication is provided with a plurality of to branch pipeline 39 between two main pipeline 36, and the top equidistance of branch pipeline 39 is provided with a plurality of shower nozzle 38.
The etching chamber 12 and the filtering chamber 13 are both filled with etching liquid, the liquid level in the etching chamber 12 is higher than the liquid level in the filtering chamber 13 and is close to the liquid level difference circulation groove 14, then the circulating pump body 31 works to pump the etching liquid in the filtering chamber 13 into the main pipeline 36, then the etching liquid is sprayed out through the spray head 38 on the branch pipeline 39, the etching liquid sprayed out through the spray head 38 can stir the etching liquid in the etching chamber 12, at the moment, the etching liquid pressure at the bottom of the grid plate 16 is higher than the pressure at the top, the semiconductor chips on the grid plate 16 are separated from the grid plate 16 and float under the action of the pressure, so that the situation that the semiconductor chips cannot be completely etched due to stacking can be avoided, and the liquid level in the etching chamber 12 flows through the liquid level difference circulation groove 14 and flows into the filtering chamber 13, at the moment, the suspended impurities in the etching chamber 12 can flow into the filtering chamber 13 along the etching liquid, the etching liquid can quickly flow into the filtering chamber 13, the situation can be realized, the suspended impurities in the etching chamber 12 can be separated from the grid plate 16 under the action, the action of the pressure can be removed, the condition that the suspended impurities can be cleaned by manpower is not needed, and the personnel can be cleaned in time.
As shown in fig. 7, fig. 8 and fig. 9, the sealing connection piece 35 includes a connection pipeline 351 with an inverted T shape, one end of the connection pipeline 351 is connected with the main pipeline 36, a sinking groove 352 is provided at the other end of the connection pipeline 351, a plurality of spring grooves 353 are provided at the bottom end of the interior of the sinking groove 352 along the circumference direction at equal intervals, spring blocks 354 are fixedly provided in the spring grooves 353, one end of the plurality of spring blocks 354 is fixedly connected with a same sliding ring 355, the sliding ring 355 is slidably arranged in the sinking groove 352 in a matched manner, a sealing gasket 356 is fixedly provided at the outer side of the sliding ring 355, one end of the communicating pipe 34 is abutted against the sealing gasket 356, the fixing piece 37 includes a fixing seat 371, the fixing seat 371 is fixedly connected with the inner wall of the etching chamber 12, an arc-shaped placing groove 372 is provided at the top end of the fixing seat 371, an arc-shaped limiting ring 373 is rotatably connected with the fixing seat 371, the other end of the arc-shaped limiting ring 373 is fixedly connected with the fixing seat 371 through a fixing bolt, a top thread of the arc-shaped limiting ring is connected with a screwing bolt 374, and a tightening piece 375 is rotatably provided at the bottom end of the screwing bolt 374.
The two communicating pipes 34 are respectively inserted into the two connecting pipelines 351, then the main pipeline 36 is pressed downwards into the arc-shaped placing groove 372, the arc-shaped limiting ring 373 is rotated and fixed with the fixed seat 371 through the fixing bolt, then the screwing bolt 374 is screwed to drive the abutting piece 375 to move downwards, the position of the main pipeline 36 can be abutted and fixed through the abutting piece 375, the communicating pipe 34 is in contact with the sealing gasket 356 at the moment, the spring block 354 is stressed to be in a compressed state, the sealing gasket 356 can be pushed to be in close contact with the communicating pipe 34 through the elastic action of the spring block 354, and then the sealing effect of connection between the communicating pipe 34 and the connecting pipelines 351 can be improved.
As shown in fig. 10, 11 and 12, the elastic cover plate assembly 40 includes a movable cover plate body 41 adapted to the top wall of the etching chamber 12, a sliding table 42 adapted to the inner cavity of the etching chamber 12 is slidably disposed in the middle of the movable cover plate body 41, and a pushing plate 43 is fixedly disposed at the top end of the sliding table 42; the four corners of the pushing plate 43 are respectively provided with a sliding column 44 in a sliding manner, the bottom end of the sliding column 44 is fixedly connected with the movable cover plate body 41, the top end of the sliding column 44 is fixedly provided with a baffle 45, the outside of the sliding column 44 is sleeved with a return spring 46, and two ends of the return spring 46 are respectively fixedly connected with the pushing plate 43 and the baffle 45; the bottom slope of slip table 42 has offered a plurality of guiding gutter 47 downwards, and four corners of slip table 42 bottom all are fixed and are provided with spliced pole 48, and the bottom and the grid 16 fixed connection of spliced pole 48.
Through the cooperation of being connected of slide column 44 and reset spring 46, can be with moving the apron body 41 and be connected with slip table 42, through the guiding gutter 47 of seting up, can carry out the water conservancy diversion again to the etching liquid that sputters on slip table 42 and flow into etching cavity 12 like, through the spliced pole 48 that is equipped with, can carry out fixed connection between slip table 42 and the grid plate 16.
As shown in fig. 10 and 13, the driving assembly 50 includes a fixed top plate 51, four corners at the bottom end of the fixed top plate 51 are fixedly provided with fixed columns 52, the fixed columns 52 are fixedly connected with the outer wall of the etching chamber 12 through connecting seats 53 fixedly arranged at the bottom end, two sides at the top end of the fixed top plate 51 are fixedly provided with air cylinders 54, and an output end of each air cylinder 54 passes through a through hole formed in the pushing plate 43 to be fixedly connected with the movable cover plate body 41; a driving motor 55 is fixedly arranged on one side, located in the middle between the two air cylinders 54, of the top end of the fixed top plate 51, a driving belt pulley 56 is fixedly arranged at the output end of the driving motor 55, a driven belt pulley 57 is arranged at the bottom of the driving belt pulley 56, the driving belt pulley 56 and the driven belt pulley 57 are in transmission connection through a belt 58, and a slot for the belt 58 to pass through is formed in the fixed top plate 51 in a penetrating manner; the axle center department of driven pulley 57 is fixed and is provided with axis of rotation 511, and the outside rotation of axis of rotation 511 one end is provided with two connection bases 59, connects base 59 and fixed roof 51 fixed connection, and is located the fixed eccentric wheel 510 that is provided with between two connection bases 59 on the axis of rotation 511, and the eccentric wheel 510 is located the pushing plate 43 directly over, and the bottom that is located the eccentric wheel 510 on the pushing plate 43 inlays and is equipped with the rubber pad.
The two cylinders 54 are connected with an external air station, when the cylinders 54 work, the movable cover plate 41 can be pushed to move downwards until the movable cover plate 41 is moved to be in contact with the etching chamber 12, at the moment, the etching chamber 12 can be closed through the matching of the sliding table 42 and the movable cover plate 41, and meanwhile, the grid plate 16 can be pushed to the etching chamber 12 and placed on the pad plate 17, when the cylinders 54 retract, the movable cover plate 41 and the sliding table 42 can be driven to move upwards, the etching chamber 12 is opened, at the moment, the grid plate 16 can be lifted to the top of etching liquid to be separated from the etching liquid, then the driving motor 55 is operated to drive the driving pulley 56 to rotate, the driven pulley 57 can be driven to rotate through the transmission of the belt 58, the driven pulley 57 is driven to rotate the rotating shaft 511, the rotating shaft 511 drives the eccentric wheel 510 to rotate, the pushing plate 43 is pushed to move downwards after the eccentric wheel 510 is contacted with the pushing plate 43, the sliding table 42 and the grid plate 16 are driven, the reset spring 46 is stressed to be in a stretching state, when the eccentric wheel 510 rotates and the sliding plate 43 is separated from the sliding table 42, the semiconductor chip can be driven to vibrate under the sliding table 16, and the chip can be kept in place, and the chip can be vibrated to be removed from the cavity 16, and the semiconductor chip can be vibrated to be kept in the cavity 16.
Working principle:
placing the semiconductor chip to be etched on the grid plate 16, and operating the air cylinder 54 to push the grid plate 16 to move downwards to the pad plate 17, wherein the etching chamber 12 is closed by the cooperation of the movable cover plate body 41 and the sliding table 42, and the semiconductor chip can be etched in the etching chamber 12;
then the circulating pump body 31 works to pump the etching liquid in the filter chamber 13 into the main pipeline 36, then the etching liquid is sprayed out through the spray head 38 on the branch pipeline 39, the etching liquid sprayed out through the spray head 38 can stir the etching liquid in the etching chamber 12, at the moment, the etching liquid pressure at the bottom of the grid plate 16 can be larger than the pressure at the top, the semiconductor chips on the grid plate 16 can be separated from the grid plate 16 to float under the action of the pressure, so that the situation that the semiconductor chips cannot be completely etched due to stacking can be avoided, and the liquid level in the etching chamber 12 can overflow the liquid level difference circulation groove 14 through pumping the etching liquid in the filter chamber 13 into the filter chamber 13, at the moment, suspended impurities in the etching chamber 12 can flow into the filter chamber 13 along the etching liquid, and the suspended impurities in the etching chamber 12 can be cleaned rapidly and timely;
after the etching of the semiconductor chip is completed, the cylinder 54 is retracted to drive the movable cover plate 41 and the sliding table 42 to move upwards to open the etching chamber 12, meanwhile, the grid plate 16 also rises to the top of the etching liquid together, then the driving motor 55 is operated to drive the eccentric wheel 510 to rotate, the grid plate 16 can vibrate through the cooperation of the eccentric wheel 510 and the reset spring 46, and the etching liquid on the grid plate 16 and the etched semiconductor chip can vibrate and fall into the etching chamber 12 through the vibration of the grid plate 16.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The etching device for producing the semiconductor chips is characterized by comprising an etching box main body (10), wherein the etching box main body (10) is divided into an etching chamber (12) and a filtering chamber (13) through a partition plate (11) arranged in the etching box main body, a liquid level difference circulation groove (14) is formed in one side of the partition plate (11) in a penetrating manner, the liquid level difference circulation groove (14) is used for communicating the etching chamber (12) with the filtering chamber (13), a filter screen frame (15) is arranged in the filtering chamber (13), a hand-operated traction assembly (20) for traction is arranged at the top of the filter screen frame (15), and the hand-operated traction assembly (20) is fixedly arranged on the outer wall of the filtering chamber (13);
a circulating pump assembly (30) for circulating etching liquid is arranged at the bottom of the outer wall of the filtering chamber (13), and one end of the circulating pump assembly (30) penetrates through the etching chamber (12) and is positioned at the bottom of the etching chamber (12);
a grid plate (16) is arranged at the top of the circulating pump assembly (30) in the etching chamber (12), a reverse T-shaped pad plate (17) for pad arrangement is fixedly arranged at the bottom of the grid plate (16), and an elastic cover plate assembly (40) for closing the etching chamber (12) and vibrating is arranged at the top of the grid plate (16);
the top of the elastic cover plate assembly (40) is provided with a driving assembly (50), the driving assembly (50) can be used for moving the position height of the elastic cover plate assembly (40), and the driving assembly (50) can also be used for driving the elastic cover plate assembly (40) to vibrate.
2. The etching device applied to the production of semiconductor chips according to claim 1, wherein the hand-operated traction assembly (20) comprises two longitudinal sliding rods (21) and four rolling wheels (22), the two longitudinal sliding rods (21) are both in sliding connection with a frame at one end of the filter screen frame (15), the four rolling wheels (22) are respectively arranged in rotating grooves (23) formed in two sides of the filter screen frame (15) in a rotating mode, and the wheel edges of the rolling wheels (22) are attached to the inner wall of the filter chamber (13);
the hand-operated traction assembly (20) further comprises a wire wheel box body (24), the wire wheel box body (24) is fixedly arranged on the outer wall of the filtering cavity (13), a wire reel (25) is arranged in the wire wheel box body (24), a connecting shaft (26) is fixedly arranged at the axle center of the wire reel (25), two ends of the connecting shaft (26) are rotationally connected with the wire wheel box body (24), a worm wheel (27) is fixedly arranged on one side of the wire reel (25) outside the connecting shaft (26), a worm (28) is matched with the bottom of the worm wheel (27), a crank (29) is fixedly arranged at one end of the worm (28), and the crank (29) is rotationally connected with the wire wheel box body (24) and is located on the outer side of the wire wheel box body (24).
3. The etching device applied to semiconductor chip production according to claim 2, wherein a traction rope (210) is wound outside the reel (25), a conveyor line wheel (211) is fixedly arranged at the top of the outer wall of the filter chamber (13), a guide line wheel (212) is arranged on the inner wall of the filter chamber (13) corresponding to the conveyor line wheel (211), the guide line wheel (212) is fixedly arranged in a fixed groove (213) formed in the inner wall of the filter chamber (13), the movable end of the traction rope (210) sequentially bypasses the conveyor line wheel (211) and the guide line wheel (212) to be tied with a fixed lug (214), and the fixed lug (214) is fixedly arranged at the top end of the frame of the filter screen frame (15) and is positioned between the two longitudinal sliding rods (21).
4. The etching device applied to the production of the semiconductor chips according to claim 1, wherein the circulating pump assembly (30) comprises a circulating pump body (31), the circulating pump body (31) is fixedly connected with the outer wall of the filtering chamber (13), a water inlet of the circulating pump body (31) is connected with a water inlet pipe (32), one end of the water inlet pipe (32) is communicated with the bottom of the filtering chamber (13), a water outlet of the circulating pump body (31) is connected with a water outlet pipe (33), and one end of the water outlet pipe (33) penetrates through the etching chamber (12) to be placed at the bottom of the etching chamber (12);
both sides on outlet pipe (33) top all communicate and are provided with communicating pipe (34), the top of communicating pipe (34) is provided with main pipeline (36) through sealing connection spare (35) intercommunication, the outside at main pipeline (36) both ends all is provided with carries out spacing fixed mounting (37) to its position, and two equidistance and the intercommunication are provided with a plurality of to branch pipeline (39) between main pipeline (36), the top equidistance of branch pipeline (39) is provided with a plurality of shower nozzle (38).
5. The etching device applied to semiconductor chip production according to claim 4, wherein the sealing connecting piece (35) comprises an inverted-T-shaped connecting pipeline (351), one end of the connecting pipeline (351) is communicated with the main pipeline (36), a sinking groove (352) is formed in the other end of the connecting pipeline (351), a plurality of spring grooves (353) are formed in the bottom end of the inside of the sinking groove (352) at equal intervals along the circumferential direction, a spring block (354) is fixedly arranged in the spring groove (353), one end of the spring block (354) is fixedly connected with the same sliding ring (355), the sliding ring (355) is arranged in the sinking groove (352) in a matched sliding mode, a sealing gasket (356) is fixedly arranged on the outer side of the sliding ring (355), and one end of the communicating pipe (34) is abutted against the sealing gasket (356).
6. The etching device applied to semiconductor chip production according to claim 4, wherein the fixing piece (37) comprises a fixing seat (371), the fixing seat (371) is fixedly connected with the inner wall of the etching chamber (12), an arc-shaped placing groove (372) is formed in the top end of the fixing seat (371), an arc-shaped limiting ring (373) is arranged at the top of the arc-shaped placing groove (372), one end of the arc-shaped limiting ring (373) is rotationally connected with the fixing seat (371), the other end of the arc-shaped limiting ring (373) is fixedly connected with the fixing seat (371) through a fixing bolt, a screwing bolt (374) is connected with the top thread of the arc-shaped limiting ring (373), and a propping piece (375) is rotationally arranged at the bottom end of the screwing bolt (374).
7. The etching device applied to the production of the semiconductor chips according to claim 1, wherein the elastic cover plate assembly (40) comprises a movable cover plate body (41) matched with the top wall of the etching chamber (12), a sliding table (42) matched with the inner cavity of the etching chamber (12) is slidably arranged in the middle of the movable cover plate body (41), and a pushing plate (43) is fixedly arranged at the top end of the sliding table (42);
four corners of the pushing plate (43) are provided with sliding columns (44) in a sliding mode, the bottom ends of the sliding columns (44) are fixedly connected with the movable cover plate body (41), the top ends of the sliding columns (44) are fixedly provided with baffle plates (45), reset springs (46) are sleeved outside the sliding columns (44), and two ends of each reset spring (46) are fixedly connected with the pushing plate (43) and the baffle plates (45) respectively.
8. The etching device applied to the production of the semiconductor chips according to claim 7, wherein a plurality of diversion trenches (47) are obliquely arranged at the bottom end of the sliding table (42) downwards, connecting columns (48) are fixedly arranged at four corners of the bottom end of the sliding table (42), and the bottom ends of the connecting columns (48) are fixedly connected with the grid plate (16).
9. The etching device applied to the production of the semiconductor chips according to claim 7, wherein the driving assembly (50) comprises a fixed top plate (51), four corners of the bottom end of the fixed top plate (51) are fixedly provided with fixed columns (52), the fixed columns (52) are fixedly connected with the outer wall of the etching chamber (12) through connecting seats (53) fixedly arranged at the bottom end, two sides of the top end of the fixed top plate (51) are fixedly provided with air cylinders (54), and the output ends of the air cylinders (54) penetrate through perforations formed in the pushing plate (43) to be fixedly connected with the movable cover plate body (41);
one side of the top end of the fixed top plate (51) positioned in the middle between the two cylinders (54) is fixedly provided with a driving motor (55), the output end of the driving motor (55) is fixedly provided with a driving belt pulley (56), the bottom of the driving belt pulley (56) is provided with a driven belt pulley (57), the driving belt pulley (56) and the driven belt pulley (57) are in transmission connection through a belt (58), and a slot for the belt (58) to pass through is formed in the fixed top plate (51).
10. The etching device applied to semiconductor chip production according to claim 9, wherein a rotating shaft (511) is fixedly arranged at the axis of the driven pulley (57), two connecting bases (59) are rotatably arranged at the outer part of one end of the rotating shaft (511), the connecting bases (59) are fixedly connected with the fixed top plate (51), an eccentric wheel (510) is fixedly arranged between the two connecting bases (59) on the rotating shaft (511), the eccentric wheel (510) is arranged right above the pushing plate (43), and a rubber pad is embedded at the bottom of the eccentric wheel (510) on the pushing plate (43).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311826487.4A CN117476512B (en) | 2023-12-28 | 2023-12-28 | Etching device applied to semiconductor chip production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311826487.4A CN117476512B (en) | 2023-12-28 | 2023-12-28 | Etching device applied to semiconductor chip production |
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| CN117476512B true CN117476512B (en) | 2024-03-19 |
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| KR20000021721A (en) * | 1998-09-30 | 2000-04-25 | 윤종용 | Circulation system of process solution in wet station |
| KR20030037899A (en) * | 2001-11-07 | 2003-05-16 | 삼성전자주식회사 | A bath for semiconductor fabrication |
| US6630052B1 (en) * | 1996-06-26 | 2003-10-07 | Lg. Philips Lcd Co., Ltd. | Apparatus for etching glass substrate |
| CN114999969A (en) * | 2022-07-06 | 2022-09-02 | 江苏晟驰微电子有限公司 | Etching system for producing semiconductor device |
| CN115582340A (en) * | 2022-08-20 | 2023-01-10 | 浙江艾科半导体设备有限公司 | Silicon chip cleaning machine sprays water firing equipment |
| CN116031183A (en) * | 2023-03-30 | 2023-04-28 | 芯洲科技(北京)股份有限公司 | Etching equipment for semiconductor chip production |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI240763B (en) * | 2001-05-16 | 2005-10-01 | Ind Tech Res Inst | Liquid phase deposition production method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6630052B1 (en) * | 1996-06-26 | 2003-10-07 | Lg. Philips Lcd Co., Ltd. | Apparatus for etching glass substrate |
| KR20000021721A (en) * | 1998-09-30 | 2000-04-25 | 윤종용 | Circulation system of process solution in wet station |
| KR20030037899A (en) * | 2001-11-07 | 2003-05-16 | 삼성전자주식회사 | A bath for semiconductor fabrication |
| CN114999969A (en) * | 2022-07-06 | 2022-09-02 | 江苏晟驰微电子有限公司 | Etching system for producing semiconductor device |
| CN115582340A (en) * | 2022-08-20 | 2023-01-10 | 浙江艾科半导体设备有限公司 | Silicon chip cleaning machine sprays water firing equipment |
| CN116031183A (en) * | 2023-03-30 | 2023-04-28 | 芯洲科技(北京)股份有限公司 | Etching equipment for semiconductor chip production |
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| CN117476512A (en) | 2024-01-30 |
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