CN116031183A - Etching equipment for semiconductor chip production - Google Patents
Etching equipment for semiconductor chip production Download PDFInfo
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- CN116031183A CN116031183A CN202310326219.XA CN202310326219A CN116031183A CN 116031183 A CN116031183 A CN 116031183A CN 202310326219 A CN202310326219 A CN 202310326219A CN 116031183 A CN116031183 A CN 116031183A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses etching equipment for producing a semiconductor chip, which comprises a containing box, an etching box, a supporting column, a top mounting plate, an extrusion rust-proof type height adjusting component and a shrinkage expansion type magnetic driving component. The invention belongs to the technical field of semiconductor chip production, a winding anti-corrosion rope can take a semiconductor chip out of etching liquid, and meanwhile, when the winding anti-corrosion rope passes through absorbing cotton, the etching liquid adhered on the winding anti-corrosion rope can be absorbed by the absorbing cotton, so that the etching liquid is prevented from being adhered on the winding anti-corrosion rope for a long time, and meanwhile, the etching liquid in the absorbing cotton can flow into a collecting box through seepage capillary holes by utilizing the seepage effect of the liquid, so that the water absorption of the absorbing cotton is greatly increased.
Description
Technical Field
The invention belongs to the technical field of semiconductor chip production, and particularly relates to etching equipment for semiconductor chip production.
Background
The semiconductor chip is required to be etched when being produced, the semiconductor chip is generally directly placed into an etching device in the etching process at present, and then the semiconductor chip is manually taken out by a worker, so that the efficiency is low, the etching liquid is generally acidic, the skin of the worker is easy to be stimulated and damaged by the etching liquid, even if the semiconductor chip is taken out by adopting a clamping tool, the clamping tool is difficult to timely remove the etching liquid adhered on the clamping tool, the clamping tool is easy to be damaged due to the influence of the etching liquid after long-time use, and meanwhile, the etching liquid is often remained in the etching device when the etching liquid is discharged, so that the cleaning of the etching device is very inconvenient, and therefore, the etching equipment for producing the semiconductor chip is urgently needed to solve the problems.
Disclosure of Invention
In view of the above, the present invention provides an etching apparatus for semiconductor chip production to solve the problems set forth in the background art.
The technical scheme adopted by the invention is as follows: the invention provides etching equipment for producing semiconductor chips, which comprises a containing box and an etching box, wherein the etching box is arranged on the top wall of the containing box; the support columns are symmetrically arranged on two sides of the etching box; the side walls at two sides of the top mounting plate are fixedly connected with the tops of the support columns; the extrusion rust-proof type height adjusting component is arranged on the top mounting plate; the contraction-expansion type magnetic driving assembly is arranged in the accommodating box; the extrusion rust-proof height adjusting component comprises an L-shaped hanging plate, a collecting box, absorbent cotton and seepage capillary holes, wherein the top of the L-shaped hanging plate is fixedly connected with the bottom wall of the top mounting plate, the collecting box is arranged on the L-shaped hanging plate, the absorbent cotton is arranged on one side wall of the collecting box, the seepage capillary holes penetrate through one side wall of the collecting box, and the absorbent cotton is arranged opposite to the seepage capillary holes.
As a preferable technical scheme of the invention, a liquid discharge pipe is arranged on one side wall of the etching box, a liquid discharge valve is connected to the liquid discharge pipe, an elastic anti-corrosion layer is arranged at the bottom of the etching box, and the bottom wall of the elastic anti-corrosion layer is provided with fluctuation permanent magnets which are arranged in a matrix shape.
As a preferable technical scheme of the invention, the extrusion rust-proof height adjusting assembly further comprises an installation side plate, a winding roller, a limiting plate, a winding motor, a winding anti-corrosion rope, a placement bushing, a collecting pipe and a collecting pump, wherein the installation side plate is symmetrically arranged on the top installation plate, two ends of the winding roller are rotationally connected with the installation side plates on two sides, the limiting plate is arranged on the winding roller, four groups of limiting plates are arranged on the single winding roller, the limiting plates are symmetrically arranged along the center of the winding roller, the winding motor is arranged on the installation side plates, the winding roller is rotationally connected with the winding motor, the winding anti-corrosion rope is wound on the winding roller, the winding part of the winding anti-corrosion rope is positioned between the limiting plates on two sides, one end of the winding anti-corrosion rope penetrates through the top installation plate, one end of the winding anti-corrosion rope is fixedly connected with the placement bushing, the collecting pump is arranged on the top wall of the accommodating box, one end of the collecting pipe is connected with the collecting pump, and the other end of the collecting pipe is connected with the side wall of the collecting box.
As a preferable technical scheme of the invention, the contraction and expansion type magnetic force driving component comprises a driving gear, a first driven gear, a second driven gear, a first long rod, a second long rod, a first short rod, a second short rod, a limiting shaft, a limiting ball, a limiting sliding groove and an electromagnet, wherein the driving gear is rotationally connected to the inner wall of the bottom of the accommodating box, the first driven gear is in meshed connection with the driving gear, the second driven gear is in meshed connection with the first driven gear, the first long rod and the second long rod are in crossed arrangement, the middle section of the first long rod is in rotational connection with the middle section of the second long rod, two groups of the first long rod and the second long rod are respectively arranged, the first long rod and the second long rod are in linear array arrangement, one end of the first long rod on one side is in rotational connection with the first driven gear, the other end of the first long rod on one side is rotationally connected with the second long rod, one end of the second long rod on one side is rotationally connected with the second driven gear, the other end of the second long rod on one side is rotationally connected with the first long rod, the first long rod on the other side is rotationally connected with the first short rod, the second long rod on the other side is rotationally connected with the second short rod, the limiting shaft penetrates through the joint of the first short rod and the second short rod, the limiting shaft is rotationally connected with the first short rod and the second short rod, the limiting ball is rotationally connected to the bottom wall of the limiting shaft, the limiting ball is arranged in the limiting sliding groove, the limiting sliding groove is arranged on the inner wall of the bottom of the accommodating box, and the electromagnet is arranged on the top wall of the first long rod, the second long rod, the first short rod and the second short rod.
As a preferable technical scheme of the invention, the winding rollers are provided with two groups.
As a preferable technical scheme of the invention, the absorbent cotton and the collecting box are symmetrically arranged on two sides of the winding anti-corrosion rope.
As a preferable technical scheme of the invention, a driving motor is arranged on the top wall of the accommodating box, and the driving motor is rotationally connected with the driving gear.
As a preferable technical scheme of the invention, four groups of winding anti-corrosion ropes are arranged.
As a preferable technical scheme of the invention, the winding anti-corrosion rope is attached to the absorbent cotton at two sides.
As a preferable technical scheme of the invention, the collecting pipes are arranged at two sides of the collecting box.
Preferably, a central controller is arranged on the accommodating box and assists in realizing the functions of etching and the like of the semiconductor chip, and the type of the central controller is AT89C51.
The etching equipment for producing the semiconductor chip has the following beneficial effects:
(1) The winding anti-corrosion rope can take the semiconductor chip out of the etching liquid, meanwhile, when the winding anti-corrosion rope passes through the absorbing cotton, the etching liquid adhered on the winding anti-corrosion rope can be absorbed by the absorbing cotton, so that the etching liquid is prevented from being adhered on the winding anti-corrosion rope for a long time, meanwhile, the etching liquid in the absorbing cotton can flow into the collecting box through the seepage capillary holes by utilizing the seepage effect of the liquid, and the water absorption of the absorbing cotton is greatly increased.
(2) When excessive etching liquid in the absorbent cotton cannot be transferred in time, negative pressure can be formed in the collecting box by utilizing the collecting pump, so that the flow speed of the etching liquid in the absorbent cotton is enhanced, and meanwhile, the collecting pump can also convey the etching liquid into an external container, so that a large amount of etching liquid is prevented from being accumulated in the collecting box.
(3) After the electromagnet is electrified to generate an induction magnetic field, the fluctuation permanent magnet can move upwards after receiving the repulsive force, so that the elastic anti-corrosion layer is protruded, and the residual etching liquid on the elastic anti-corrosion layer is converted into a flowing state from a static state, so that the residual etching liquid is rapidly discharged through the liquid discharge pipe.
(4) When the first driven gear and the first driven gear rotate, the first long rod and the second long rod can be driven to repeatedly fold and unfold, so that the position of the electromagnet is continuously changed, and different positions of the elastic anti-corrosion layer are continuously raised.
(5) The friction force between the limiting shaft and the inner wall of the accommodating box can be reduced by the limiting balls below the limiting shaft.
Drawings
FIG. 1 is a schematic diagram showing the overall structure of an etching apparatus for producing semiconductor chips according to the present invention;
fig. 2 is a perspective view of an etching apparatus for producing semiconductor chips according to the present invention;
FIG. 3 is a schematic view of the overall structure of the extrusion rust-proof height adjustment assembly according to the present invention;
FIG. 4 is a cross-sectional view of a collection box according to the present invention;
FIG. 5 is a perspective view of an etching chamber and a receiving chamber according to the present invention;
FIG. 6 is a cross-sectional view of the etching chamber and the holding chamber according to the present invention;
FIG. 7 is an enlarged partial view of portion A of FIG. 6;
FIG. 8 is a schematic view of the overall structure of the retractable magnetic drive assembly according to the present invention;
FIG. 9 is a schematic block diagram of an etching apparatus for semiconductor chip production according to the present invention;
fig. 10 is a block circuit diagram of an etching apparatus for semiconductor chip production according to the present invention;
fig. 11 is a control circuit diagram of an electromagnet according to the present invention.
Wherein, 1, a containing box, 2, an etching box, 201, a liquid discharge pipe, 202, a liquid discharge valve, 203, an elastic anti-corrosion layer, 204, a fluctuation permanent magnet, 3, a support column, 4, a top mounting plate, 5, an extrusion anti-rust type height adjusting component, 501, a mounting side plate, 502, a winding roller, 503, a limiting plate, 504, a winding motor, 505, a winding anti-corrosion rope, 506, a placing bushing, 507, an L-shaped hanging plate, 508 and a collecting box, 509, absorbent cotton, 510, seepage capillary holes, 511, collecting pipes, 512, a collecting pump, 6, a shrinkage-expansion magnetic driving component, 601, a driving gear, 602, a first driven gear, 603, a second driven gear, 604, a first long rod, 605, a second long rod, 606, a first short rod, 607, a second short rod, 608, a limiting shaft, 609, a limiting ball, 610, a limiting chute, 611, an electromagnet, 7 and a driving motor.
In the circuit diagram of the central controller in fig. 10, +5v is the power supply of the circuit, C1 and C2 are the starting capacitors of the crystal oscillator, Y is the crystal oscillator, S is the switch, C3 is the polar capacitor, and R1 is the resistor; in the circuit diagram of fig. 11, R2-R6 are resistors, RZ7899 is a driving chip, VD is a diode, C4 is a capacitor, D is a regulator tube, VT is a triode, and YA is an electromagnet.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As a new embodiment of the present invention, as shown in fig. 1 to 8, the present invention proposes an etching apparatus for semiconductor chip production, comprising a housing box 1, and further comprising an etching box 2, the etching box 2 being mounted on a top wall of the housing box 1; the support columns 3 are symmetrically arranged on two sides of the etching box 2; the top mounting plate 4, the side walls of the two sides of the top mounting plate 4 are fixedly connected with the top of the support column 3; an extrusion rust-proof height adjusting component 5, wherein the extrusion rust-proof height adjusting component 5 is arranged on the top mounting plate 4; a contraction-expansion type magnetic driving component 6, wherein the contraction-expansion type magnetic driving component 6 is arranged in the accommodating box 1; the extrusion rust-proof height adjusting component 5 comprises an L-shaped hanging plate 507, a collecting box 508, absorbent cottons 509 and seepage capillary holes 510, wherein the top of the L-shaped hanging plate 507 is fixedly connected with the bottom wall of the top mounting plate 4, the collecting box 508 is arranged on the L-shaped hanging plate 507, the absorbent cottons 509 are arranged on one side wall of the collecting box 508, the seepage capillary holes 510 penetrate through one side wall of the collecting box 508, and the absorbent cottons 509 are arranged opposite to the seepage capillary holes 510.
As shown in fig. 6, a drain pipe 201 is mounted on one side wall of the etching tank 2, a drain valve 202 is connected to the drain pipe 201, an elastic corrosion prevention layer 203 is mounted on the bottom of the etching tank 2, and a wave permanent magnet 204 is provided on the bottom wall of the elastic corrosion prevention layer 203, and the wave permanent magnets 204 are arranged in a matrix.
As shown in fig. 3 and 4, the extrusion rust-proof height adjusting component 5 further includes a mounting side plate 501, a winding roller 502, a limiting plate 503, a winding motor 504, a winding anti-corrosion rope 505, a placement bushing 506, a collecting pipe 511 and a collecting pump 512, wherein the mounting side plate 501 is symmetrically arranged on the top mounting plate 4, two ends of the winding roller 502 are rotatably connected with the mounting side plates 501 on two sides, the limiting plate 503 is arranged on the winding roller 502, four groups of limiting plates 503 on a single winding roller 502 are arranged, the limiting plates 503 are symmetrically arranged along the center of the winding roller 502, the winding motor 504 is arranged on the mounting side plate 501, the winding roller 502 is rotatably connected with the winding motor 504, the winding part of the winding anti-corrosion rope 505 is positioned between the limiting plates 503 on two sides, one end of the winding anti-corrosion rope 505 passes through the top mounting plate 4, one end of the winding anti-corrosion rope 505 is fixedly connected with the placement bushing 506, the collecting pump 512 is arranged on the top wall of the containing box 1, one end of the collecting pipe 511 is connected with the collecting pump 512, and one end of the collecting pipe 511 is connected with the side wall of the collecting box 508.
As shown in fig. 6 to 8, the shrink-expansion type magnetic force driving assembly 6 comprises a driving gear 601, a first driven gear 602, a second driven gear 603, a first long rod 604, a second long rod 605, a first short rod 606, a second short rod 607, a limiting shaft 608, a limiting ball 609, a limiting sliding groove 610 and an electromagnet 611, wherein the driving gear 601 is rotatably connected on the inner wall of the bottom of the accommodating box 1, the first driven gear 602 is in meshed connection with the driving gear 601, the second driven gear 603 is in meshed connection with the first driven gear 602, the first long rod 604 and the second long rod 605 are in crossed arrangement, the middle section of the first long rod 604 is in rotary connection with the middle section of the second long rod 605, the first long rod 604 and the second long rod 605 are respectively provided with two groups, the first long rod 604 and the second long rod 605 are in linear array arrangement, one end of the first long rod 604 on one side is in rotary connection with the first driven gear 602, the other end of the first long rod 604 on one side is rotationally connected with the second long rod 605, one end of the second long rod 605 on one side is rotationally connected with the second driven gear 603, the other end of the second long rod 605 on one side is rotationally connected with the first long rod 604, the first long rod 604 on the other side is rotationally connected with the first short rod 606, the second long rod 605 on the other side is rotationally connected with the second short rod 607, the limiting shaft 608 passes through the joint of the first short rod 606 and the second short rod 607, the limiting shaft 608 is rotationally connected with the first short rod 606 and the second short rod 607, the limiting ball 609 is rotationally connected with the bottom wall of the limiting shaft 608, the limiting ball 609 is arranged in the limiting chute 610, the limiting chute 610 is arranged on the inner wall of the bottom of the accommodating box 1, the electromagnet 611 is arranged on the first long rod 604, the second long rod 605, A first stub 606 and a second stub 607.
As shown in fig. 3, the wind-up rolls 502 are provided in two sets.
As shown in fig. 4, absorbent cotton 509 and collection box 508 are symmetrically disposed on both sides of winding anti-corrosion string 505.
As shown in fig. 5 and 6, a driving motor 7 is mounted on the top wall of the housing case 1, and the driving motor 7 is rotatably connected to a driving gear 601.
As shown in fig. 3, the winding anti-corrosion rope 505 is provided with four sets.
As shown in fig. 4, the wound-up preservative string 505 remains attached to the absorbent cotton 509 on both sides.
As shown in fig. 3, the collection pipes 511 are provided on both sides of the collection box 508.
Preferably, the accommodating box 1 is provided with a central controller, and the type of the central controller is AT89C51, so that the functions of etching the semiconductor chip and the like are assisted.
When the semiconductor chip is used, a user places the semiconductor chip on the placing bushing 506, the winding motor 504 is started, the winding motor 504 drives the winding roller 502 to rotate, the winding anti-corrosion rope 505 drives the placing bushing 506 to descend, after the placing bushing 506 falls into the etching box 2, the winding motor 504 is suspended, etching liquid is poured into the etching box 2, the etching liquid etches the semiconductor chip, after etching is finished, the winding motor 504 is started again, the winding motor 504 is inverted to drive the placing bushing 506 to ascend, in the process, when the winding anti-corrosion rope 505 with etching liquid adhered to the surface passes through the absorption cotton 509, the etching liquid adhered to the winding anti-corrosion rope 505 can be absorbed by the absorption cotton 509, the etching liquid is prevented from adhering to the winding anti-corrosion rope 505 for a long time, meanwhile, the etching liquid in the absorption cotton 509 can flow into the collection box 508 through the seepage capillary 510, the water absorption of the absorption cotton 509 is greatly increased, when the etching liquid in the absorption cotton 509 cannot be transferred in time, the collection box 512 can be formed by utilizing the collection pump 512, and the collection box 508 can be prevented from flowing at the same time, and the collection container 512 can be prevented from being conveyed to the collection container; after the semiconductor chip is taken out, the liquid discharge pipe 201 is in butt joint with an external pipeline, the liquid discharge valve 202 is opened, etching liquid in the etching box 2 flows out through the liquid discharge pipe 201, when the etching liquid is remained at the bottom of the etching box 2, the electromagnet 611 is electrified to generate an induction magnetic field, the fluctuation permanent magnet 204 moves upwards after being subjected to repulsive force, so that the elastic corrosion prevention layer 203 is raised, the remained etching liquid on the elastic corrosion prevention layer 203 is converted into a flowing state from a static state, the remained etching liquid is rapidly discharged through the liquid discharge pipe 201, in the process, the driving motor 7 is started, the driving motor 7 drives the driving gear 601 to rotate, the driving gear 601 drives the first driven gear 602 to rotate, the first driven gear 602 drives the second driven gear 603 to rotate, and the first driven gear 602 and the first long rod 604 and the second long rod 605 can be repeatedly folded and unfolded, and the positions of the electromagnet 611 are continuously changed, so that the remained etching liquid in various areas at the bottom of the elastic corrosion prevention layer 203 can be conveniently and rapidly discharged through the liquid discharge device, and the manual cleaning process can be completed in the following steps.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The invention and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the invention as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present invention.
Claims (10)
1. Etching equipment for semiconductor chip production, including holding case (1), its characterized in that: also included is a method of manufacturing a semiconductor device,
an etching box (2), wherein the etching box (2) is arranged on the top wall of the accommodating box (1);
the support columns (3) are symmetrically arranged on two sides of the etching box (2);
the two side walls of the top mounting plate (4) are fixedly connected with the tops of the support columns (3);
an extrusion rust-proof height adjusting assembly (5), the extrusion rust-proof height adjusting assembly (5) being mounted on the top mounting plate (4);
a contraction-expansion type magnetic driving assembly (6), wherein the contraction-expansion type magnetic driving assembly (6) is arranged in the accommodating box (1);
the extrusion rust-proof height adjusting component (5) comprises an L-shaped hanging plate (507), a collecting box (508), absorbing cotton (509) and seepage capillary holes (510), wherein the top of the L-shaped hanging plate (507) is fixedly connected with the bottom wall of the top mounting plate (4), the collecting box (508) is mounted on the L-shaped hanging plate (507), the absorbing cotton (509) is arranged on one side wall of the collecting box (508), the seepage capillary holes (510) penetrate through one side wall of the collecting box (508), and the absorbing cotton (509) is just opposite to the seepage capillary holes (510).
2. The etching apparatus for semiconductor chip production according to claim 1, wherein: a drain pipe (201) is arranged on one side wall of the etching box (2), a drain valve (202) is connected to the drain pipe (201), an elastic anti-corrosion layer (203) is arranged at the bottom of the etching box (2), a fluctuation permanent magnet (204) is arranged on the bottom wall of the elastic anti-corrosion layer (203), and the fluctuation permanent magnets (204) are arranged in a matrix shape.
3. The etching apparatus for semiconductor chip production according to claim 2, wherein: the extrusion rust-proof height adjusting component (5) further comprises mounting side plates (501), winding rollers (502), limiting plates (503), winding motors (504), winding anti-corrosion ropes (505), a placement bushing (506), collecting pipes (511) and collecting pumps (512), wherein the mounting side plates (501) are symmetrically arranged on the top mounting plate (4), two ends of the winding rollers (502) are rotationally connected with the mounting side plates (501) on two sides, the limiting plates (503) are arranged on the winding rollers (502), four groups of limiting plates (503) are arranged on the winding rollers (502), the limiting plates (503) are symmetrically arranged along the centers of the winding rollers (502), the winding motors (504) are mounted on the mounting side plates (501), the winding rollers (502) are rotationally connected with the winding motors (504), the winding anti-corrosion ropes (505) are wound on the winding rollers (502), the winding parts of the winding ropes (505) are located between the limiting plates (503) on two sides, one ends of the winding ropes (505) penetrate through the top wall (506) and penetrate through the top wall (506) to be fixedly connected with the top wall (506) of the winding box (1) and the top wall (506) which is fixedly arranged, one end of the collecting pipe (511) is connected with the collecting pump (512), and the other end of the collecting pipe (511) is connected with the side wall of the collecting box (508).
4. A semiconductor chip production etching apparatus according to claim 3, wherein: the shrinkage-expansion magnetic force driving assembly (6) comprises a driving gear (601), a first driven gear (602), a second driven gear (603), a first long rod (604), a second long rod (605), a first short rod (606), a second short rod (607), a limiting shaft (608), a limiting ball (609), a limiting sliding groove (610) and an electromagnet (611), wherein the driving gear (601) is rotatably connected on the inner wall of the bottom of the accommodating box (1), the first driven gear (602) is in meshed connection with the driving gear (601), the second driven gear (603) is in meshed connection with the first driven gear (602), the first long rod (604) is in crossed arrangement with the second long rod (605), the middle section of the first long rod (604) is in rotary connection with the middle section of the second long rod (605), the first long rod (604) and the second long rod (605) are respectively provided with two groups, the first long rod (604) and the second long rod (605) are in linear arrangement, the first long rod (604) and the second long rod (605) are in rotary connection with the first driven gear (602) and the second long rod (605) are in rotary connection with the first long rod (602) and the second long rod (605) on one side, one side the other end of second stock (605) keeps rotating with first stock (604) to be connected, the opposite side first stock (604) keeps rotating with first quarter butt (606) to be connected, the opposite side second stock (605) keeps rotating with second quarter butt (607) to be connected, spacing axle (608) pass the junction of first quarter butt (606) and second quarter butt (607), spacing axle (608) keeps rotating with first quarter butt (606) and second quarter butt (607) to be connected, spacing ball (609) roll connection locates on the diapire of spacing axle (608), spacing ball (609) locate in spacing spout (610), spacing spout (610) are located on the bottom inner wall of holding case (1), electro-magnet (611) are installed on the roof of first stock (604), second stock (605), first quarter butt (606) and second quarter butt (607).
5. The etching apparatus for semiconductor chip production according to claim 4, wherein: the wind-up roller (502) is provided with two groups.
6. The etching apparatus for semiconductor chip production according to claim 5, wherein: the absorbing cotton (509) and the collecting box (508) are symmetrically arranged on two sides of the winding anti-corrosion rope (505).
7. The etching apparatus for semiconductor chip production according to claim 6, wherein: a driving motor (7) is arranged on the top wall of the accommodating box (1), and the driving motor (7) is in rotary connection with the driving gear (601).
8. The etching apparatus for semiconductor chip production according to claim 7, wherein: the winding anti-corrosion rope (505) is provided with four groups.
9. The etching apparatus for semiconductor chip production according to claim 8, wherein: the winding anti-corrosion rope (505) is attached to the absorbent cotton (509) on the two sides.
10. The etching apparatus for semiconductor chip production according to claim 9, wherein: the collecting pipes (511) are arranged on two sides of the collecting box (508).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310326219.XA CN116031183B (en) | 2023-03-30 | 2023-03-30 | Etching equipment for semiconductor chip production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310326219.XA CN116031183B (en) | 2023-03-30 | 2023-03-30 | Etching equipment for semiconductor chip production |
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| CN116031183A true CN116031183A (en) | 2023-04-28 |
| CN116031183B CN116031183B (en) | 2023-08-04 |
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| CN117476512A (en) * | 2023-12-28 | 2024-01-30 | 深圳市沃德芯科技有限公司 | Etching device applied to semiconductor chip production |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117476512A (en) * | 2023-12-28 | 2024-01-30 | 深圳市沃德芯科技有限公司 | Etching device applied to semiconductor chip production |
| CN117476512B (en) * | 2023-12-28 | 2024-03-19 | 深圳市沃德芯科技有限公司 | Etching device applied to semiconductor chip production |
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| Publication number | Publication date |
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| CN116031183B (en) | 2023-08-04 |
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