CN117463576A - Glue amount compensation device, glue amount compensation method thereof and die bonder - Google Patents
Glue amount compensation device, glue amount compensation method thereof and die bonder Download PDFInfo
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- CN117463576A CN117463576A CN202311821722.9A CN202311821722A CN117463576A CN 117463576 A CN117463576 A CN 117463576A CN 202311821722 A CN202311821722 A CN 202311821722A CN 117463576 A CN117463576 A CN 117463576A
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- 239000003292 glue Substances 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000005259 measurement Methods 0.000 claims abstract description 32
- 230000007246 mechanism Effects 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 abstract description 13
- 238000009825 accumulation Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 238000006073 displacement reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1005—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material already applied to the surface, e.g. coating thickness, weight or pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
The application relates to a glue amount compensation device and a glue amount compensation method thereof, and a die bonder, wherein the glue amount compensation device comprises: the machine base is provided with a workbench runner; the vacuum base is arranged on the workbench runner and used for adsorbing a workpiece to be dispensed; the dispensing module is arranged above the vacuum base; the height measurement mechanism is arranged on the machine base and comprises a laser sensing head, the laser sensing head faces to the workpiece to be dispensed, and the laser sensing head is used for measuring the horizontal height of each layer of dispensing side of the workpiece to be dispensed and the horizontal height of a dispensing nozzle of the dispensing module; and the calibration module is used for acquiring calibration data, and the dispensing module is electrically connected with the calibration module so as to dispense the workpiece to be dispensed according to the calibration data. The glue outlet amount of the glue dispensing module is adjusted according to the difference between the horizontal height difference and the standard height difference, so that the glue thickness of each layer of packaging structure can be controlled within the standard range, error accumulation is avoided, the connection reliability is ensured, and the yield of packaged products is improved.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to a glue amount compensation device, a glue amount compensation method and a die bonder.
Background
With the rapid development of the semiconductor packaging industry and the arrival of industry 4.0, the requirements of various large semiconductor packaging factories and clients on the quality of products are more and more severe, and the requirements on cost reduction are more and more high. The Die Bonding (Die Bonding) process plays a very important role in semiconductor packaging, and a Die bonder has very important application, and can be used for fixing point connection parts between a chip (Die) and a packaging substrate together to ensure reliable point connection and normal and stable operation of a wafer.
When the wafer is packaged, the mechanical arm places the wafer material box (substrate/frame) to be packaged into the workbench flow channel, the transmission mechanical arm grabs the wafer material box to be packaged onto the workbench flow channel, so that the wafer material box to be packaged is transmitted to the lower part of the dispensing module for dispensing, when dispensing, the dispensing agent is required to be coated on a specific area (dispensing area) of the wafer material box to be packaged, namely the area for placing chips, and after dispensing is completed, the workbench flow channel transmits the wafer material box to be packaged to the lower part of the welding head module for die bonding.
In the process, the glue thickness can directly influence the die bonding quality, in the prior art, the glue thickness can be controlled by image recognition and controlling the welding height and pressure, but the control method is mostly suitable for the situation that the glue thickness of the glue is smaller than 25 mu m, but for laminated chips, the glue thickness is generally controlled to be 25-100 mu m, and when the glue thickness on a certain layer is too large or too small, the accuracy of chip mounting in the subsequent process can be directly influenced, so that the yield of packaged products is influenced.
Disclosure of Invention
The application provides a glue amount compensation device, a glue amount compensation method thereof and a die bonder, so as to solve the technical problem that the chip mounting precision is low and the yield of packaged products is affected due to the fact that glue thickness cannot be effectively controlled in the glue dispensing process.
In a first aspect, the present application provides a method for compensating a glue amount of a die bonder, including: the machine base is provided with a workbench runner; the vacuum base is arranged on the workbench runner and used for adsorbing a workpiece to be dispensed; the dispensing module is arranged above the vacuum base and is used for dispensing the workpiece to be dispensed; the height measurement mechanism is arranged on the machine base and comprises a laser sensing head, the laser sensing head faces to the workpiece to be dispensed, and the laser sensing head is used for measuring the horizontal height of each layer of dispensing side of the workpiece to be dispensed and the horizontal height of a dispensing nozzle of the dispensing module; the calibration module is used for acquiring calibration data, and the dispensing module is electrically connected with the calibration module so as to dispense the workpiece to be dispensed according to the calibration data; the calibration data are standard height difference and standard glue outlet amount, and when the horizontal height difference between each layer of glue dispensing side of the glue dispensing workpiece and the glue dispensing nozzle of the glue dispensing module is the standard height difference, the glue outlet amount of the glue dispensing module is the standard glue outlet amount; when the horizontal height difference between the dispensing side of each layer of the dispensing workpiece and the dispensing nozzle of the dispensing module is different from the standard height difference, the dispensing quantity of the dispensing module is adjusted according to the difference between the dispensing side and the dispensing nozzle.
In one possible implementation mode, the device further comprises a welding module arranged above the workbench runner and used for baking and curing the workpiece after dispensing.
In one possible implementation mode, the height measurement mechanism further comprises a height measurement base arranged on the base, the height measurement base is provided with a connecting seat in a sliding mode along a first direction, and the height measurement base is provided with a first driving mechanism for driving the connecting seat to slide back and forth along the first direction; the laser sensing head is arranged on the connecting seat in a sliding manner along a second direction, a second driving mechanism for driving the laser sensing head to slide in a reciprocating manner along the second direction is arranged on the connecting seat, and the second direction is intersected with the first direction.
In one possible implementation mode, the first driving mechanism comprises a first motor and a first guide rail, wherein the first motor and the first guide rail are fixedly arranged on the height measurement base, the length direction of the first guide rail is set along a first direction, a first motor is in transmission connection with a first screw rod, first bearing seats are respectively arranged at two ends of the first screw rod, a first sliding block is in transmission connection with the first screw rod, and the first sliding block is in sliding connection with the first guide rail and is fixedly connected with the bottom of the connecting seat.
In one possible implementation mode, the second driving mechanism comprises a second motor and a second guide rail which are fixedly arranged on the connecting seat, the length direction of the second guide rail is set along a second direction, a second motor is in transmission connection with a second screw rod, two ends of the second screw rod are respectively provided with a second bearing seat, a second sliding seat connected with the laser sensing head is in transmission connection with the second screw rod, and the second sliding seat is in sliding connection with the second guide rail.
In one possible embodiment, the laser sensor head is connected to the second slide by a height-adjusting screw, and the second slide is provided with an adjusting hole for receiving the height-adjusting screw.
In one possible implementation, the height measurement base is provided with a first limit switch; the connecting seat is provided with a second limit switch.
In a second aspect, the present application further provides a glue amount compensation method of the glue amount compensation device as described above, including: obtaining the model and calibration data of a workpiece to be dispensed, wherein the calibration data comprise standard height difference and standard glue output; placing a workpiece to be dispensed on a reference side of a vacuum base, and measuring the horizontal height difference between the i-th layer dispensing side of the workpiece to be dispensed and a dispensing nozzle of a dispensing module, wherein i is an integer greater than 0; judging whether the horizontal height difference is a standard height difference, and if so, controlling the glue outlet amount of the glue dispensing module to be the standard glue outlet amount; otherwise, the glue outlet amount of the glue dispensing module is adjusted according to the difference value of the horizontal height difference and the standard height difference.
In one possible implementation manner, the glue amount compensation device further comprises a welding module arranged above the workbench runner, and the glue amount compensation method further comprises: acquiring the calibration level of the ith layer of dispensing side of the workpiece to be calibrated and the calibration level of the dispensing nozzle of the dispensing module, and recording the calibration level difference between the ith layer of dispensing side of the workpiece to be calibrated and the dispensing nozzle of the dispensing module; sequentially dispensing, mounting chips, baking and curing the workpiece to be calibrated, and recording the glue outlet amount of a glue dispensing module to obtain a cured workpiece; obtaining the coating thickness of the ith layer of adhesive of the cured workpiece; judging whether the coating thickness of the dispensing agent is qualified or not, if so, calibrating the horizontal height difference to serve as a standard height difference, and taking the dispensing amount of the dispensing module as a standard dispensing amount.
In one possible embodiment, the method further comprises: acquiring a first contour image of an ith layer of dispensing area of a workpiece to be dispensed and a second contour image of the ith layer of dispensing area of the workpiece after dispensing; judging whether the first contour image and the second contour image are matched or not, and if so, judging that the dispensing is qualified; otherwise, the dispensing is judged to be unqualified.
In a third aspect, the present application further provides a die bonder, including the foregoing glue amount compensation device.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
according to the glue quantity compensation device, the glue quantity compensation method and the die bonder, the laser height measurement principle of the laser sensing head is utilized, the horizontal height of the reference side of the vacuum base, the horizontal height of the glue dispensing nozzle of the glue dispensing module, the horizontal height of the glue dispensing side of a workpiece to be glued and the horizontal height of the glue dispensing side of each layer of chip after the chip is mounted can be measured, the difference of the horizontal heights between the glue dispensing side of the workpiece to be glued and the glue dispensing nozzle of the glue dispensing module is calculated, the glue outlet quantity of the glue dispensing module is adjusted according to the difference between the difference of the horizontal heights and the difference of the standard heights, so that the coating thickness of the glue dispensing agent is controlled within the standard range, the connection reliability between a substrate/frame and the chip or between the chip and the chip is guaranteed, and the yield of packaged products is improved. Because the level of the dispensing side of each layer of chip can be measured in the dispensing process, the corresponding dispensing quantity is matched, and the error accumulation after the multi-layer chip is attached can be avoided, thereby accurately controlling the coating thickness of each layer of dispensing agent.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.
FIG. 1 is a schematic diagram of a stacked 3D package;
fig. 2 is a schematic structural diagram of a glue amount compensation device according to an embodiment of the present application;
fig. 3 is a flowchart of a glue amount compensation method of a glue amount compensation device according to an embodiment of the present application.
Reference numerals illustrate:
1. a glue amount compensation device; 11. a base; 111. a workbench flow passage; 12. a vacuum base; 13. a height measuring mechanism; 131. a laser sensing head; 132. height measurement base; 133. a connecting seat; 134. a first driving mechanism; 1341. a first screw rod; 1342. a first bearing seat; 1343. a first limit switch; 135. a second driving mechanism; 1351. a second motor; 1352. a second screw rod; 1353. a second bearing seat; 1354. a second slider; 1355. an adjustment aperture; 1356. a second limit switch;
2. packaging the product; 21. a substrate/frame; 22. a chip; 23. dispensing agent.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
The following disclosure provides many different embodiments, or examples, for implementing different structures of the application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
For ease of description, spatially relative terms, such as "inner," "outer," "lower," "upper," "above," "front," "rear," and the like, may be used herein to describe one element's or feature's relative positional relationship or movement to another element's or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figure experiences a position flip or a change in attitude or a change in state of motion, then the indications of these directivities correspondingly change, for example: an element described as "under" or "beneath" another element or feature would then be oriented "over" or "above" the other element or feature. Thus, the example term "below … …" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein interpreted accordingly.
In Die Bonding (Die Bonding) process, stacked 3D packaging refers to a packaging technology for stacking two or more chips in a vertical direction in one package without changing the size of the package, as shown in fig. 1, which is a schematic structural diagram of stacked 3D packaging product 2, specifically, after applying a dispensing agent 23 in a dispensing area of a substrate/frame 21, using chips 22 for stacked packaging.
The glue thickness of the laminated packaging is generally controlled to be 25-100 mu m, and the current die bonding equipment is not provided with an automatic glue thickness compensation device, so that the yield of packaged products is lower. The application provides a glue amount compensation device, a glue amount compensation method thereof and a die bonder, which can accurately control glue amount, thereby ensuring that the glue thickness of each layer of packaging structure is controlled within a standard range, ensuring the connection reliability between a substrate/frame 21 and a chip 22 or between the chip 22 and the chip 22, improving the yield of packaged products, avoiding error accumulation and accurately controlling the coating thickness of each layer of dispensing agent 23.
Fig. 2 is a schematic diagram of a glue amount compensation device 1 according to an embodiment of the present application, including a base 11, a vacuum base 12, a height measurement mechanism 13, a glue dispensing module (not shown in the drawing) and a calibration module (not shown in the drawing), where a workbench flow channel 111 is disposed on the base 11; the vacuum base 12 is arranged on the workbench flow channel 111 and is used for adsorbing a workpiece to be dispensed; the dispensing module is arranged above the vacuum base 12 and is used for dispensing the workpiece to be dispensed; the height measurement mechanism 13 is arranged on the base 11, the height measurement mechanism 13 comprises a laser sensing head 131, the laser sensing head 131 faces towards the workpiece to be dispensed, and the laser sensing head 131 is used for measuring the horizontal height of each layer of dispensing side of the workpiece to be dispensed and the horizontal height of a dispensing nozzle of the dispensing module; the calibration module is used for acquiring calibration data, and the dispensing module is electrically connected with the calibration module so as to dispense the workpiece to be dispensed according to the calibration data; the calibration data are standard height difference and standard glue outlet amount, and when the horizontal height difference between each layer of glue dispensing side of the glue dispensing workpiece and the glue dispensing nozzle of the glue dispensing module is the standard height difference, the glue outlet amount of the glue dispensing module is the standard glue outlet amount; when the horizontal height difference between the dispensing side of each layer of the dispensing workpiece and the dispensing nozzle of the dispensing module is different from the standard height difference, the dispensing quantity of the dispensing module is adjusted according to the difference between the dispensing side and the dispensing nozzle.
For convenience of understanding, a side of the vacuum base 12 facing the workpiece to be dispensed is a reference side, and a side of the workpiece to be dispensed facing away from the vacuum base 12 is a dispensing side. It can be appreciated that after the workpiece to be dispensed is transferred onto the vacuum base 12 by the mechanical arm, the vacuum base 12 adsorbs the side of the workpiece to be dispensed, so as to avoid errors caused by gaps between the vacuum base 12 and the workpiece to be dispensed. The laser height measurement principle of the laser sensing head 131 is utilized to measure the level of the reference side of the vacuum base 12, the level of the dispensing nozzle of the dispensing module, the level of the dispensing side of the substrate/frame 21 and the level of the dispensing side of each layer of chips 22 after the chips 22 are mounted, the level difference between the dispensing side of the workpiece to be dispensed and the dispensing nozzle of the dispensing module is calculated, and the dispensing amount of the dispensing module is adjusted according to the difference between the level difference and the standard level difference so as to ensure that the coating thickness of the dispensing agent 23 is within the standard range, thereby ensuring the connection reliability between the substrate/frame 21 and the chips (die) 22 or between two adjacent chips 22 and improving the yield of products. Because the level of the dispensing side of each layer of chips 22 can be measured in the dispensing process, and the corresponding dispensing amount is matched, the error accumulation after the multi-layer chips 22 are attached can be avoided, and the coating thickness of the dispensing agent 23 of each layer can be accurately controlled. Meanwhile, the laser sensing head 131 can also acquire a first contour image of the workpiece dispensing area to be dispensed and a second contour image of the workpiece dispensing area after dispensing, and determine the dispensing quality by comparing whether the first contour image and the second contour image are matched, so that the yield of products is controlled.
Optionally, the workpiece to be dispensed may be a frame, substrate, metal, glass, etc. to improve compatibility of the glue amount compensation device 1, meet requirements of controlling coating thickness of the glue dispensing agent 23 of various products, and ensure more efficient product quality requirements. It should be noted that the dispensing module may be a dispensing module in the prior art, and the structure and the working principle thereof are the prior art and are not described herein.
In some embodiments, the glue amount compensation device 1 further includes a welding module disposed above the working platform flow channel 111, for baking and curing the workpiece after the glue dispensing. It should be noted that the welding module may be a welding module in the prior art, and the structure and the working principle thereof are the prior art and are not described herein.
Before the final dispensing of the product, the workpieces of different types and different models can be calibrated, and the workpiece after the curing is obtained through dispensing, chip mounting, baking and curing in sequence. And (3) obtaining the coating thickness of the adhesive dispensing agent of the cured workpiece, and if the coating thickness of the adhesive dispensing agent is qualified, taking the calibration level difference between the adhesive dispensing side of the workpiece to be calibrated and the adhesive dispensing nozzle of the adhesive dispensing module as a standard level difference, and taking the adhesive outlet amount of the adhesive dispensing module as a standard adhesive outlet amount.
In some embodiments, the height measurement mechanism 13 further includes a height measurement base 132 disposed on the base 11, a connecting seat 133 is slidably disposed on the height measurement base 132 along a first direction, and a first driving mechanism 134 for driving the connecting seat 133 to slide back and forth along the first direction is disposed on the height measurement base 132; the laser sensing head 131 is slidably disposed on the connecting seat 133 along a second direction, and a second driving mechanism 135 for driving the laser sensing head 131 to slide reciprocally along the second direction is disposed on the connecting seat 133, and the second direction intersects the first direction.
Optionally, the first direction is the X-axis shown in the figure and the second direction is the Y-axis shown in the figure. By adjusting the displacement of the laser sensing head 131 in the first direction and the displacement of the laser sensing head 131 in the second direction, the to-be-dispensed workpieces of different types and different models can be adapted, so that the compatibility of the adhesive quantity compensation device 1 is improved, and the coating thickness control requirements of adhesive dispensing agents of various products are met.
In some embodiments, the first driving mechanism 134 includes a first motor and a first guide rail fixed on the height measurement base 132, the length direction of the first guide rail is set along a first direction, the first motor is in transmission connection with a first screw rod 1341, two ends of the first screw rod 1341 in the length direction are respectively provided with a first bearing seat 1342, a first slider is in transmission connection with the first screw rod 1341, the first slider is in sliding connection with the first guide rail, and the first slider is in fixed connection with the bottom of the connection seat 133.
The first motor drives the first screw rod 1341 to rotate, and under the transmission action of the first screw rod 1341 and the first sliding block, the connecting seat 133 is driven to reciprocate along the first guide rail, so that the displacement of the laser sensing head 131 in the first direction is adjusted, and the height measurement requirements of different types and different types of workpieces to be glued are met.
In some embodiments, the second driving mechanism 135 includes a second motor 1351 and a second guide rail fixed on the connecting seat 133, the length direction of the second guide rail is set along the second direction, the second motor 1351 is in transmission connection with a second lead screw 1352, two ends of the second lead screw 1352 in the length direction are respectively provided with a second bearing seat 1353, a second sliding seat 1354 connected with the laser sensing head 131 is in transmission connection with the second lead screw 1352, and the second sliding seat 1354 is in sliding connection with the second guide rail.
The second motor 1351 drives the second screw rod 1352 to rotate, and under the transmission effect of the second screw rod 1352 and the second sliding seat 1354, the laser sensing head 131 is driven to reciprocate along the second guide rail, so that the displacement of the laser sensing head 131 in the second direction is adjusted, and the height measurement requirements of different types and different models of workpieces to be dispensed are met.
In some embodiments, the laser sensing head 131 is connected to the second slide 1354 through a height adjusting bolt, and the second slide 1354 is provided with an adjusting hole 1355 for accommodating the height adjusting bolt. The height adjusting bolt in the prior art can be adopted, and the structure and the working principle of the height adjusting bolt are the prior art and are not described in detail herein.
Through setting up the height-adjusting bolt, can adjust the displacement of laser sensing head 131 in the third direction, and the third direction is the Z axle that shows in the figure, adjusts the horizontal height of laser sensing head 131 promptly to adapt to the height measurement demand of the work piece of waiting to glue of different types and different models.
In some embodiments, the height measurement base 132 is provided with a first limit switch 1343, and the first limit switch 1343 is electrically connected to the first motor.
The first limit switch 1343 may be a mechanical or limit type induction switch in the prior art to detect the operation position of the connecting seat 133, so that the first motor accurately controls the displacement of the connecting seat 133 in the first direction.
In some embodiments, the connecting base 133 is provided with a second limit switch 1356.
The second limit switch 1356 may be a mechanical or limit-type sensing switch in the prior art, so as to detect the operation position of the second slide 1354, so that the first motor accurately controls the displacement of the second slide 1354 in the second direction.
As shown in fig. 3, the present application further provides a glue amount compensation method of the glue amount compensation device 1, which includes the following steps:
s101, obtaining model and calibration data of a workpiece to be dispensed, wherein the calibration data comprise standard height differences and standard glue output.
S102, placing the workpiece to be dispensed on the reference side of the vacuum base 12, and measuring the level difference H between the ith layer dispensing side of the workpiece to be dispensed and the dispensing nozzle of the dispensing module i I is an integer greater than 0. Taking stacked 3D package (stacking process) as an example, the bottom layer is a package substrate/frame 21, and the level difference includes a level difference between the dispensing side of the package substrate/frame 21 and the dispensing nozzle of the dispensing module, and a level difference between the dispensing side of each layer of chips 22 and the dispensing nozzle of the dispensing module after the chips 22 are soldered.
S103, judging whether the horizontal height difference is a standard height difference, and if so, controlling the glue outlet amount of the glue dispensing module to be a standard glue outlet amount; otherwise, the glue outlet amount of the glue dispensing module is adjusted according to the difference value of the horizontal height difference and the standard height difference. Specifically, if the horizontal height difference is smaller than the standard height difference, controlling the glue outlet amount of the glue dispensing module to be smaller than the standard glue outlet amount; if the horizontal height difference is larger than the standard height difference, controlling the glue outlet amount of the glue dispensing module to be larger than the standard glue outlet amount.
The horizontal height of the dispensing nozzle of the dispensing module, the horizontal height of the dispensing side of the substrate/frame 21 and the horizontal height of the dispensing side of each layer of chips 22 after the chips 22 are welded are measured, the horizontal height difference between the dispensing side of the workpiece to be dispensed and the dispensing nozzle of the dispensing module is calculated, and the dispensing quantity of the dispensing module is adjusted according to the difference between the horizontal height difference and the standard height difference, so that the coating thickness of the dispensing agent 23 is ensured to be enough, the connection reliability between the substrate/frame 21 and the chips 22 or between two adjacent chips 22 is ensured, and the yield of products is improved. Meanwhile, the horizontal height of the dispensing side of each layer of the workpiece to be dispensed can be measured in the dispensing process, and the corresponding dispensing quantity is matched, so that error accumulation after the multi-layer chip 22 is packaged can be avoided, and the coating thickness of the dispensing agent 23 of each layer can be accurately controlled.
Further, before the model and calibration data of the workpiece to be dispensed are obtained, the method further comprises the following steps:
obtaining the calibration level of the reference side of the vacuum base 12 (as a measurement reference), the calibration level of the dispensing side of the workpiece to be calibrated and the calibration level of the dispensing nozzle of the dispensing module, and recording the calibration level difference H between the i-th layer dispensing side of the workpiece to be calibrated and the dispensing nozzle of the dispensing module i0 。
Sequentially dispensing, mounting chips, baking and solidifying the workpiece to be calibrated, and recording the glue outlet quantity V of a glue dispensing module 0 And obtaining the cured workpiece.
The coating thickness of the i-th layer of the adhesive dispensing agent 23 of the cured work piece, that is, the height difference between the dispensing side of the substrate/frame 21 and the chips 22 or the height difference between the adjacent two chips 22 is obtained.
Judging whether the coating thickness of the adhesive dispensing agent 23 is qualified or not, if so, determining the calibration level height difference H between the adhesive dispensing side of the workpiece to be calibrated and the adhesive dispensing nozzle of the adhesive dispensing module i0 As standard height difference, the glue outlet quantity V of the glue dispensing module i0 As a standard glue yield.
Then, the difference between the level difference and the standard height difference in step S103 is:
ΔH=H i -H i0 。
alternatively, taking stacked 3D packaging (stacked die process) as an example, each layer of the paste 23 is coated to a thickness of 25 μm or more.
Through the calibration process, products of different types and different models are classified and calibrated, repeated debugging times of the spot gluing welding process can be reduced, so that the efficiency of debugging the products by engineering personnel is improved, and the labor and material cost is reduced.
Further, the method can further comprise the following steps:
and acquiring a first contour image of the ith layer of dispensing area of the workpiece to be dispensed and a second contour image of the ith layer of dispensing area of the workpiece after dispensing.
Judging whether the first contour image and the second contour image are matched or not, and if so, judging that the dispensing is qualified; otherwise, the dispensing is judged to be unqualified. The principle of contour matching is that the contour features of the object in the image are calculated, then compared with a pre-stored template, and then whether the object is matched or not is judged, and the working principle is the prior art and is not described herein.
Thus, the dispensing quality of each layer of laminated 3D package can be recorded so as to control the yield of the product.
The embodiment of the application also provides a die bonder, which comprises the glue amount compensation device 1, so that the connection reliability between the substrate/frame 21 and the chips 22 or between two adjacent chips 22 can be ensured, and the yield of products can be improved. Because the level of the dispensing side of each layer of chips 22 can be measured in the dispensing process, and the corresponding dispensing amount is matched, the error accumulation after the multi-layer chips 22 are attached can be avoided, and the coating thickness of each layer of dispensing agent 23 can be accurately controlled.
It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is explicitly stated. It should also be appreciated that additional or alternative steps may be used.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
The foregoing is merely a specific embodiment of the application to enable one skilled in the art to understand or practice the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (11)
1. The utility model provides a glue volume compensation arrangement which characterized in that includes:
the machine seat (11) is provided with a workbench runner (111);
the vacuum base (12) is arranged on the workbench flow channel (111) and used for adsorbing a workpiece to be glued;
the dispensing module is arranged above the vacuum base (12) and is used for dispensing the workpiece to be dispensed;
the height measurement mechanism (13) is arranged on the base (11), the height measurement mechanism (13) comprises a laser sensing head (131), the laser sensing head (131) faces the workpiece to be glued, and the laser sensing head (131) is used for measuring the horizontal height of each layer of glue dispensing side of the workpiece to be glued and the horizontal height of a glue dispensing nozzle of the glue dispensing module; and
the calibration module is used for acquiring calibration data, and the dispensing module is electrically connected with the calibration module so as to dispense the workpiece to be dispensed according to the calibration data;
the calibration data are standard height differences and standard glue outlet amounts, and when the horizontal height difference between each layer of glue dispensing side of the workpiece to be glued and the glue dispensing nozzle of the glue dispensing module is the standard height difference, the glue outlet amount of the glue dispensing module is the standard glue outlet amount; when the horizontal height difference between each layer of dispensing side of the workpiece to be dispensed and the dispensing nozzle of the dispensing module is different from the standard height difference, the dispensing quantity of the dispensing module is adjusted according to the difference value of the two.
2. The glue amount compensation device according to claim 1, further comprising a welding module arranged above the workbench runner (111) for baking and curing the glued workpiece.
3. The glue amount compensation device according to claim 1, wherein the height measurement mechanism (13) further comprises a height measurement base (132) arranged on the base (11), a connecting seat (133) is slidably arranged on the height measurement base (132) along a first direction, and a first driving mechanism (134) for driving the connecting seat (133) to slide back and forth along the first direction is arranged on the height measurement base (132);
the laser sensing head (131) is arranged on the connecting seat (133) in a sliding mode along a second direction, a second driving mechanism (135) used for driving the laser sensing head (131) to slide in a reciprocating mode along the second direction is arranged on the connecting seat (133), and the second direction is intersected with the first direction.
4. The glue amount compensation device according to claim 3, wherein the first driving mechanism (134) comprises a first motor and a first guide rail fixedly arranged on the height measurement base (132), the length direction of the first guide rail is set along the first direction, a first screw rod (1341) is connected with the first motor in a transmission manner, first bearing seats (1342) are respectively arranged at two ends of the first screw rod (1341), a first sliding block is connected with the first guide rail in a transmission manner on the first screw rod (1341), and the first sliding block is fixedly connected with the bottom of the connecting seat (133).
5. A glue amount compensation device according to claim 3, wherein the second driving mechanism (135) comprises a second motor (1351) and a second guide rail which are fixedly arranged on the connecting seat (133), the length direction of the second guide rail is set along the second direction, the second motor (1351) is in transmission connection with a second screw rod (1352), two ends of the second screw rod (1352) are respectively provided with a second bearing seat (1353), a second sliding seat (1354) connected with the laser sensing head (131) is in transmission connection with the second screw rod (1352), and the second sliding seat (1354) is in sliding connection with the second guide rail.
6. Glue quantity compensation device according to claim 5, characterized in that the laser sensing head (131) and the second slide (1354) are connected by means of a height-adjusting bolt, and that the second slide (1354) is provided with an adjusting hole (1355) for accommodating the height-adjusting bolt.
7. A glue quantity compensation device according to claim 3, characterized in that the height measurement base (132) is provided with a first limit switch (1343); a second limit switch (1356) is arranged on the connecting seat (133).
8. A glue amount compensation method of a glue amount compensation device according to any one of claims 1 to 7, comprising:
obtaining model and calibration data of a workpiece to be dispensed, wherein the calibration data comprise standard height difference and standard glue output;
placing the workpiece to be dispensed on a reference side of a vacuum base (12), and measuring the horizontal height difference between the i-th layer dispensing side of the workpiece to be dispensed and a dispensing nozzle of a dispensing module, wherein i is an integer greater than 0;
judging whether the horizontal height difference is the standard height difference, and if so, controlling the glue outlet amount of the glue dispensing module to be the standard glue outlet amount; otherwise, the glue outlet amount of the glue dispensing module is adjusted according to the difference value of the horizontal height difference and the standard height difference.
9. The glue amount compensation method of claim 8, wherein the glue amount compensation device further comprises a welding module arranged above the worktable flow channel, and the glue amount compensation method further comprises:
acquiring a calibration level of an ith layer of dispensing side of a workpiece to be calibrated and a calibration level of a dispensing nozzle of a dispensing module, and recording a calibration level difference between the ith layer of dispensing side of the workpiece to be calibrated and the dispensing nozzle of the dispensing module;
sequentially dispensing, mounting a chip, baking and curing the workpiece to be calibrated, and recording the glue outlet amount of the glue dispensing module to obtain a cured workpiece;
acquiring the coating thickness of the ith layer of adhesive of the cured workpiece;
and judging whether the coating thickness of the dispensing agent is qualified or not, if so, using the calibrated horizontal height difference as a standard height difference, and using the glue outlet quantity of the dispensing module as a standard glue outlet quantity.
10. The glue quantity compensation method of claim 8, further comprising:
acquiring a first contour image of an ith layer of dispensing area of a workpiece to be dispensed and a second contour image of the ith layer of dispensing area of the workpiece after dispensing;
judging whether the first contour image and the second contour image are matched or not, and if so, judging that the dispensing is qualified; otherwise, the dispensing is judged to be unqualified.
11. A die bonder, characterized by comprising a glue amount compensation device (1) according to any one of claims 1 to 7.
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| CN202311821722.9A CN117463576B (en) | 2023-12-27 | 2023-12-27 | Glue amount compensation device, glue amount compensation method thereof and die bonder |
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| CN202311821722.9A CN117463576B (en) | 2023-12-27 | 2023-12-27 | Glue amount compensation device, glue amount compensation method thereof and die bonder |
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| CN117463576B CN117463576B (en) | 2024-05-03 |
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| CN117463576B (en) | 2024-05-03 |
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