CN117457572A - 一种用于真空反应腔的晶圆交换装置及方法 - Google Patents

一种用于真空反应腔的晶圆交换装置及方法 Download PDF

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CN117457572A
CN117457572A CN202311785837.7A CN202311785837A CN117457572A CN 117457572 A CN117457572 A CN 117457572A CN 202311785837 A CN202311785837 A CN 202311785837A CN 117457572 A CN117457572 A CN 117457572A
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CN117457572B (zh
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邱勇
梁洁
涂乐义
王兆祥
张朋兵
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Shanghai Nippon Semiconductor Equipment Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Abstract

本发明公开了一种用于真空反应腔的晶圆交换装置及方法，晶圆交换装置包括顶针机构Ⅰ、顶针机构Ⅱ、真空机械手及驱动装置；顶针机构Ⅰ、顶针机构Ⅱ同心设置，且顶针机构Ⅱ位于顶针机构Ⅰ外围，待加工晶圆、已加工晶圆分别与顶针机构Ⅰ、顶针机构Ⅱ配合，顶针机构Ⅰ、顶针机构Ⅱ交替升降，真空机械手设有分离型手指，分离型手指张开用于避让顶针机构Ⅰ的升降运动，驱动装置驱动真空机械手一次伸出、缩回动作完成待加工晶圆、已加工晶圆的抓取及搬运。本发明通过顶针机构Ⅰ、顶针机构Ⅱ交替升降，实现待加工晶圆、已加工晶圆的交换及搬运，大大提高了晶圆传输效率。

Description

一种用于真空反应腔的晶圆交换装置及方法
技术领域
本发明涉及半导体设备技术领域，具体涉及一种用于真空反应腔的晶圆交换装置及方法。
背景技术
常见的真空晶圆加工传输系统结构如图1所示，晶圆盒被放置在装载台9上，装载台9完成晶圆盒开盒工作，真空传输平台3与真空锁5之间的真空门阀2关闭，隔绝真空传输平台3和真空锁5，真空锁5充气到大气环境。真空传输平台3常用于真空晶圆加工系统中晶圆搬运，真空锁5主要用于实现真空和大气切换，使得真空传输平台3和真空反应腔Ⅰ1一直维持在真空环境内。
大气门阀6打开，大气机械手7将晶圆盒中的晶圆10搬运到真空锁5中，大气门阀6关闭后将真空锁5抽气到真空环境。真空锁5侧真空门阀2打开，真空传输平台3中的真空机械手Ⅰ4将真空锁5中晶圆10取出，打开真空反应腔Ⅰ1侧的真空门阀2，并将晶圆10放置在真空反应腔Ⅰ1中完成加工。
如图2所示，现有的真空反应腔Ⅰ1内设有顶针系统，顶针11在气缸13带动下将晶圆10抬升脱离真空机械手Ⅰ4，真空机械手Ⅰ4缩回，顶针11下落将晶圆10放置在晶圆载台Ⅰ12上。由此可见，晶圆10的搬运由真空机械手Ⅰ4完成，真空机械手Ⅰ4完成一次伸出、缩回动作仅实现一片晶圆10的搬运，效率低下。
发明内容
有鉴于此，本发明提供了一种用于真空反应腔的晶圆交换装置及方法，能够提高晶圆传输效率。
本发明采用的技术方案如下：
一种用于真空反应腔的晶圆交换装置，包括顶针机构Ⅰ、顶针机构Ⅱ、真空机械手及驱动装置；
所述顶针机构Ⅰ、顶针机构Ⅱ同心设置，且所述顶针机构Ⅱ位于顶针机构Ⅰ外围，待加工晶圆、已加工晶圆分别与所述顶针机构Ⅰ、顶针机构Ⅱ配合，所述顶针机构Ⅰ、顶针机构Ⅱ交替升降，所述真空机械手设有分离型手指，所述分离型手指张开用于避让顶针机构Ⅰ的升降运动，所述驱动装置驱动所述真空机械手一次伸出、缩回动作完成待加工晶圆、已加工晶圆的抓取及搬运。
本发明还提供了一种用于真空反应腔的晶圆交换方法，采用上述的用于真空反应腔的晶圆交换装置，真空反应腔内完成加工后，顶针机构Ⅱ带动已加工晶圆升起，真空机械手将待加工晶圆传输到已加工晶圆下方、晶圆载台上方，顶针机构Ⅰ升起将待加工晶圆顶起脱离真空机械手；所述真空机械手设有分离型手指，分离型手指在驱动装置驱动下张开避让顶针机构Ⅰ，顶针机构Ⅰ带动待加工晶圆降落在晶圆载台上，真空机械手复位，顶针机构Ⅱ下降将已加工晶圆放置到真空机械手上，真空机械手缩回。
有益效果：
1、本发明设置顶针机构Ⅰ、顶针机构Ⅱ分别与待加工晶圆、已加工晶圆配合，顶针机构Ⅰ、顶针机构Ⅱ交替升降，真空机械手设有分离型手指，分离型手指张开能够避让顶针机构Ⅰ的升降运动，真空机械手一次伸出、缩回动作能够实现待加工晶圆、已加工晶圆的交换及搬运，大大提高了晶圆传输效率。
2、本发明顶针机构Ⅱ结构简单、易于实现。
3、本发明的晶圆交换方法能够实现真空机械手一次伸出、缩回动作完成待加工晶圆、已加工晶圆的交换及搬运，大大提高了晶圆传输效率。
附图说明
图1为现有的真空晶圆加工传输系统结构示意图。
图2为现有的真空反应腔顶针系统结构示意图。
图3为本发明晶圆交换装置布设的结构剖视图。
图4为本发明晶圆交换装置布设的结构俯视图。
其中，1-真空反应腔Ⅰ，2-真空门阀，3-真空传输平台，4-真空机械手Ⅰ，5-真空锁，6-大气门阀，7-大气机械手，8-晶圆前端装置，9-装载台，10-晶圆，11-顶针，12-晶圆载台Ⅰ，13-气缸，14-顶针机构Ⅰ，15-顶针机构Ⅱ，16-真空机械手Ⅱ，17-分离型手指，18-直线驱动装置。
具体实施方式
下面结合附图并举实施例，对本发明进行详细描述。
本发明提供了一种用于真空反应腔的晶圆交换装置，包括顶针机构Ⅰ14、顶针机构Ⅱ15、真空机械手Ⅱ16及直线驱动装置18。
如图3所示，顶针机构Ⅰ14、顶针机构Ⅱ15同心设置，顶针机构Ⅰ14设置在真空反应腔Ⅱ内的晶圆载台Ⅱ上，顶针机构Ⅱ15位于晶圆载台Ⅱ外围，待加工晶圆、已加工晶圆分别与顶针机构Ⅰ14、顶针机构Ⅱ15配合，顶针机构Ⅰ14、顶针机构Ⅱ15交替升降，直线驱动装置18用于驱动真空机械手Ⅱ16一次伸出、缩回动作完成待加工晶圆、已加工晶圆的抓取及搬运。
具体地，顶针机构Ⅱ15包括“7”型顶针杆、顶针连杆及真空密封件，三个“7”型顶针杆竖直均布在晶圆载台Ⅱ外围，“7”型顶针杆下端穿过真空反应腔Ⅱ底面，穿设部分与真空反应腔Ⅱ之间设有真空密封件，相邻两个“7”型顶针杆底端通过顶针连杆固连。“7”型顶针杆搭载晶圆下落至晶圆载台Ⅱ上时，“7”型顶针杆上端水平部有一部分与晶圆载台Ⅱ上表面搭接，晶圆载台Ⅱ于搭接处设置凹槽，该凹槽用于容纳部分“7”型顶针杆水平部。
在另一实施例中，顶针机构Ⅱ15也设置在真空反应腔Ⅱ内的晶圆载台Ⅱ上、且顶针机构Ⅱ位于顶针机构Ⅰ外围。
真空机械手Ⅱ16设置在真空锁内，真空机械手Ⅱ16设有分离型手指17呈剪刀手，直线驱动装置18驱动分离型手指17张开用于避让顶针机构Ⅰ14的升降运动。直线驱动装置18设置在分离型手指17的两根手指之间，用于驱动两根手指运动，实现张开或闭合，直线驱动装置18为气缸或电机。如图4所示，展示了分离型手指17张开和闭合的两种状态。
此外，本实施例还提供一种用于真空反应腔的晶圆交换方法，真空反应腔Ⅱ内完成加工后，顶针机构Ⅱ15带动已加工晶圆升起，真空机械手Ⅱ16穿过顶针机构Ⅱ15的相邻两个“7”型顶针杆将待加工晶圆传输到已加工晶圆下方、晶圆载台Ⅱ上方，顶针机构Ⅰ14升起将待加工晶圆顶起脱离真空机械手Ⅱ16；直线驱动装置18驱动分离型手指17张开避让顶针机构Ⅰ14，顶针机构Ⅰ14下降带动待加工晶圆降落在晶圆载台Ⅱ上，真空机械手Ⅱ16闭合（复位），顶针机构Ⅱ15下降将已加工晶圆放置到真空机械手Ⅱ16上，真空机械手Ⅱ16缩回。
综上所述，以上仅为本发明的较佳实施例而已，并非用于限定本发明的保护范围。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (5)

1.一种用于真空反应腔的晶圆交换装置，其特征在于，包括顶针机构Ⅰ、顶针机构Ⅱ、真空机械手及驱动装置；
所述顶针机构Ⅰ、顶针机构Ⅱ同心设置，且所述顶针机构Ⅱ位于顶针机构Ⅰ外围，待加工晶圆、已加工晶圆分别与所述顶针机构Ⅰ、顶针机构Ⅱ配合，所述顶针机构Ⅰ、顶针机构Ⅱ交替升降，所述真空机械手设有分离型手指，所述分离型手指张开用于避让顶针机构Ⅰ的升降运动，所述驱动装置驱动所述真空机械手一次伸出、缩回动作完成待加工晶圆、已加工晶圆的抓取及搬运。
2.如权利要求1所述的用于真空反应腔的晶圆交换装置，其特征在于，所述驱动装置为直线驱动，设置在分离型手指之间，采用气缸或电机。
3.如权利要求1或2所述的用于真空反应腔的晶圆交换装置，其特征在于，所述顶针机构Ⅱ位于晶圆载台外围。
4.如权利要求3所述的用于真空反应腔的晶圆交换装置，其特征在于，所述顶针机构Ⅱ包括“7”型顶针杆、顶针连杆及真空密封件，三个“7”型顶针杆竖直均布在晶圆载台外围，“7”型顶针杆下端穿过真空反应腔底面，穿设部分与真空反应腔之间设有真空密封件，相邻两个“7”型顶针杆底端通过顶针连杆固连；“7”型顶针杆搭载晶圆下落至晶圆载台上时，“7”型顶针杆上端水平部有一部分与晶圆载台上表面搭接，晶圆载台于搭接处设置容纳凹槽。
5.一种用于真空反应腔的晶圆交换方法，其特征在于，采用如权利要求1所述的用于真空反应腔的晶圆交换装置，真空反应腔内完成加工后，顶针机构Ⅱ带动已加工晶圆升起，真空机械手将待加工晶圆传输到已加工晶圆下方、晶圆载台上方，顶针机构Ⅰ升起将待加工晶圆顶起脱离真空机械手；所述真空机械手设有分离型手指，分离型手指在驱动装置驱动下张开避让顶针机构Ⅰ，顶针机构Ⅰ带动待加工晶圆降落在晶圆载台上，真空机械手复位，顶针机构Ⅱ下降将已加工晶圆放置到真空机械手上，真空机械手缩回。
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