CN117444215B - Ultrasonic atomization deposition metal particle device and application method thereof - Google Patents
Ultrasonic atomization deposition metal particle device and application method thereof Download PDFInfo
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- CN117444215B CN117444215B CN202311127868.3A CN202311127868A CN117444215B CN 117444215 B CN117444215 B CN 117444215B CN 202311127868 A CN202311127868 A CN 202311127868A CN 117444215 B CN117444215 B CN 117444215B
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- 239000002923 metal particle Substances 0.000 title claims abstract description 93
- 238000000889 atomisation Methods 0.000 title claims abstract description 57
- 230000008021 deposition Effects 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 238000000151 deposition Methods 0.000 claims abstract description 65
- 239000000243 solution Substances 0.000 claims abstract description 53
- 238000002347 injection Methods 0.000 claims abstract description 49
- 239000007924 injection Substances 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 17
- 238000001802 infusion Methods 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 9
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 230000009467 reduction Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 4
- 239000007888 film coating Substances 0.000 abstract 1
- 238000009501 film coating Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000002041 carbon nanotube Substances 0.000 description 5
- 229910021393 carbon nanotube Inorganic materials 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000001755 magnetron sputter deposition Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Special Spraying Apparatus (AREA)
Abstract
The invention discloses a device for depositing metal particles by ultrasonic atomization and a use method thereof. Relates to the technical field of ultrasonic atomization, wherein, the device of ultrasonic atomization deposit metal particles includes: the top of the box body is provided with a through hole, a substrate on which metal particles are to be deposited is arranged on the sample placing table, and the substrate is positioned right below the through hole; the rotatable setting of rotary positioner is at the top of box, is provided with contact ultrasonic transducer and injection device on the rotary positioner, and ultrasonic atomization deposits metal particle's device still includes non-contact ultrasonic transducer, and non-contact ultrasonic transducer sets up two, and two non-contact ultrasonic transducer set up the both sides in the box respectively. According to the invention, the metal solution required by depositing the metal particles on the substrate is crushed and atomized by the contact type ultrasonic transducer or the non-contact type ultrasonic transducer, so that the uniform deposition of the metal particles on the substrate is realized, and the problems of increased defect degree, nonuniform deposition and the like of the substrate in the traditional film coating method are effectively avoided.
Description
Technical Field
The invention relates to the technical field of ultrasonic atomization methods, in particular to a device for depositing metal particles by ultrasonic atomization and a use method thereof.
Background
The existing ultrasonic atomization method is used as a novel atomization technology, and liquid is broken into small liquid drops by utilizing ultrasonic energy. According to the different principles of ultrasonic atomization, the method is divided into contact ultrasonic atomization and non-contact ultrasonic atomization, wherein liquid is directly contacted with a tool head, namely contact ultrasonic atomization, and is directly conveyed to the surface of the tool head of an ultrasonic transducer to form a thin liquid layer, surface tension waves are excited under the action of ultrasonic vibration, and when the amplitude of liquid drops on the surface layer of the liquid exceeds the amplitude of the tool head, the liquid drops fly out and are atomized into small liquid drops. The non-contact ultrasonic atomization is to utilize mutual interference between ultrasonic waves to form an ultrasonic standing wave field, input liquid to be atomized to the vicinity of a sound pressure node through a liquid guide tube, and the liquid drops are converted into an annular small liquid piece parallel to the plane of a tool head of an ultrasonic transducer by the mechanical action of the ultrasonic standing wave, so that the liquid drops start to be atomized from the edge of the liquid piece. With the increase of ultrasonic frequency and amplitude, the particle size of atomized liquid drops is reduced, and the two atomization methods can respectively obtain small liquid drops with the particle sizes distributed in a concentrated way of about 20 mu m and about 10 mu m. Compared with water atomization, gas atomization and other atomization methods, ultrasonic atomization has the remarkable advantages of small atomization particle size, simple process and high controllability.
The current method for plating metal film on the surface mainly comprises magnetron sputtering, chemical plating, electroplating and the like. The magnetron sputtering method is to make use of the collision of electrons and working gas to ionize and generate positive ions, and the positive ions bombard the target surface with high energy under the action of an electric field to sputter the target material, so that the sputtered neutral target atoms deposit on the substrate to form a film. Although the method has the advantages of high deposition speed, low temperature rise of the base material and the like, the magnetron sputtering coating of the material with the nano array structure can increase the array defect degree, and simultaneously, a large amount of metal atoms are deposited on the surface and the side surface of the array, so that the deposition amount in the array is small. In addition, a widely used method such as electroless plating or electroplating is also called wet chemical method, and is a technique of depositing a thin film on a substrate surface by a chemical method such as chemical reaction or electrochemical reaction in a solution. In the process, the substrate needs to be immersed in a solution environment until the film plating is completed, and the nano material has large specific surface area and higher surface energy, is easy to generate agglomeration phenomenon in the solution, damages the material structure and influences the film plating uniformity.
Therefore, how to provide an ultrasonic atomization deposition device for metal particles and a use method thereof, which can solve the problems of increased substrate defect, uneven deposition, structural damage and the like of the metal plating film by the magnetron sputtering method and the wet chemical method at present, are needed to be solved by the technicians in the field.
Disclosure of Invention
In view of the above, the present invention provides an apparatus for ultrasonic atomization deposition of metal particles and a method for using the same, which aims to solve one of the problems in the prior art, and solve the problems of increased substrate defect, uneven deposition, structural damage, etc. of the existing magnetron sputtering method and wet chemical method for plating metal films.
To achieve the above object, in one aspect, the present invention provides an apparatus for ultrasonic atomization deposition of metal particles, comprising:
the metal particle deposition device comprises a box body, wherein a through hole is formed in the top of the box body, a substrate on which metal particles are to be deposited is arranged at the bottom of the box body, and the substrate is positioned right below the through hole;
The rotary positioner is rotatably arranged at the top of the box body, a contact type ultrasonic transducer and an injection device are arranged on the rotary positioner, and the rotary positioner rotates relative to the box body so as to enable the contact type ultrasonic transducer or the injection device to be aligned to the through hole, and an infusion device is arranged on the contact type ultrasonic transducer;
When the contact type ultrasonic transducer is aligned to the through hole, the infusion device is used for spraying a metal solution required by depositing metal particles on a substrate onto the contact type ultrasonic transducer in the box body, and the contact type ultrasonic transducer is used for atomizing the metal solution required by depositing the metal particles on the substrate sprayed by the infusion device so as to realize atomization of the substrate at the bottom of the box body for depositing the metal particles;
when the injection device is aligned to the through hole of the box body and sprays the metal solution required by the metal particles deposited on the substrate in the box body, the device for ultrasonic atomization and metal particle deposition further comprises two non-contact ultrasonic transducers, the two non-contact ultrasonic transducers are respectively arranged on two sides of the box body, and the non-contact ultrasonic transducers are used for atomizing the metal solution required by the metal particles deposited on the substrate in the box body sprayed by the injection device so as to realize atomization and metal particle deposition on the substrate at the bottom of the box body.
Further, the contact ultrasonic transducer comprises a distance adjusting shell, a transducer rear cover, a transducer front cover and an amplitude transformer, wherein the distance adjusting shell is fixedly arranged on the rotary positioner, the transducer rear cover is arranged in the distance adjusting shell, the transducer front cover is also arranged in the distance adjusting shell, the bottom of the transducer front cover exceeds the distance adjusting shell, the amplitude transformer is arranged in the transducer front cover, the bottom of the transducer rear cover narrows and extends to the top of the amplitude transformer, a piezoelectric ceramic pile is arranged between the transducer front cover and the amplitude transformer, the piezoelectric ceramic pile surrounds the bottom of the transducer rear cover, a tool head is arranged at the position, exceeding the bottom of the transducer front cover, of the bottom of the amplitude transformer, and the tool head is arranged to be opposite to the substrate.
Further, two sides of the transducer rear cover, which are close to the distance-adjusting shell, are respectively provided with a liquid guide hole, two liquid guide holes are communicated with the infusion device, the two liquid guide holes extend from two sides of the transducer front cover and are contacted with two sides of the amplitude transformer, the side surface of the distance-adjusting shell is provided with a positioning bolt, and one side of the transducer rear cover, which is close to the positioning bolt, is also provided with a wire guide hole.
Further, each non-contact ultrasonic transducer comprises a non-contact distance adjusting shell, a non-contact transducer rear cover, a non-contact transducer front cover and a non-contact amplitude transformer, wherein the non-contact distance adjusting shell is horizontally arranged on the side face of the box body, the non-contact transducer rear cover is arranged in the non-contact distance adjusting shell, the non-contact transducer front cover is also arranged in the non-contact distance adjusting shell, the bottom of the non-contact transducer front cover exceeds the non-contact distance adjusting shell, a non-contact piezoelectric ceramic pile is arranged between the non-contact transducer front cover and the non-contact transducer rear cover, the non-contact piezoelectric ceramic pile is arranged around the bottom of the non-contact transducer rear cover, the non-contact amplitude transformer is arranged at the bottom of the non-contact transducer front cover, a non-contact tool head is arranged at the bottom of the non-contact amplitude transformer, a non-contact positioning bolt is arranged at the side face of the non-contact distance adjusting shell, and a non-contact wire hole is arranged at one side of the non-contact transducer rear cover, which is close to the non-contact positioning bolt.
Further, the rotary positioner comprises a fixed shell and a rotary cover, the fixed shell is arranged at the top of the box, the rotary cover is rotatably arranged on the fixed shell, the rotary cover and the connecting position of the fixed shell are provided with steel balls, the steel balls are uniformly distributed at the top of the side wall of the fixed shell in circumference, the top of the rotary cover is provided with a positioning hole and a placement hole, the injection device is placed in the placement hole, the positioning hole is placed in the contact type ultrasonic transducer, two positioning pin holes are formed in the periphery of the placement hole, a limit post is arranged at the bottom of the fixed shell in an upward protruding mode, a limit groove is formed in the bottom of the rotary cover in a downward protruding mode, a bearing is arranged between the limit groove and the limit post, a handle is arranged at the top of the fixed shell, a penetrating hole is formed in the bottom of the fixed shell, and the penetrating hole is communicated with the through hole.
Further, two positioning rods are oppositely arranged at the bottom of the rotary cover, a spring piece is arranged on the inner wall of the fixed shell, and the positioning rods are in contact with the spring piece to complete rotation limiting of the rotary cover.
Further, the injection device comprises a split type injection pump, positioning pins, clamping pieces and an injector, wherein the two positioning pins are arranged, the two positioning pins are respectively arranged on two sides of the split type injection pump, the positioning pins are in fit connection with the positioning pin holes, the clamping pieces are arranged on the side walls of the split type injection pump, and the injector is arranged on the clamping pieces.
Further, the device also comprises a residual material collecting box, wherein the residual material collecting box is slidably arranged at the bottom of the box body, and a sample placing table is arranged in the residual material collecting box.
Further, still include guiding device, guiding device sets up two, two guiding device sets up respectively the both sides of box, and two guiding device sets up two non-contact ultrasonic transducer's below, every guiding device all includes spiral air outlet and honeycomb duct, the honeycomb duct sets up the lateral wall at the box, the honeycomb duct with the inside intercommunication of box, the spiral air outlet sets up the honeycomb duct is kept away from the one end of box, guiding device is used for with the required metal solution of substrate deposit metal particle after contact ultrasonic transducer or non-contact ultrasonic transducer atomizing is directed to on the substrate.
In another aspect, the present invention provides a method for depositing metal particles by ultrasonic atomization, which is an apparatus for depositing metal particles by ultrasonic atomization, comprising:
Step one: configuring a metal solution required by a substrate to deposit metal particles;
step two: cleaning the box body, and placing a substrate on which metal particles are to be deposited in the center of the bottom of the box body;
step three: selecting a contact type ultrasonic transducer or a non-contact type ultrasonic transducer;
If a contact type ultrasonic transducer is selected, the rotary positioner rotates to enable the contact type ultrasonic transducer to be aligned with a through hole at the top of the box body, a transfusion device arranged on the contact type ultrasonic transducer is utilized to spray a metal solution required by depositing metal particles on a substrate into the box body, and the contact type ultrasonic transducer is utilized to atomize the metal solution required by depositing the metal particles on the substrate and cover the substrate;
if a non-contact ultrasonic transducer is selected, the two non-contact ultrasonic transducers are adjusted to be communicated with the inside of the box body, the rotary positioner is rotated to enable the injection device to be aligned with the through hole at the top of the box body, the injection device sprays the metal solution required by the metal particles deposited on the substrate into the box body, and the non-contact ultrasonic transducer atomizes the metal solution required by the metal particles deposited on the substrate sprayed by the injection device and covers the substrate;
Step four: and after atomization is finished, the substrate is moved out of the box body, and microwave-assisted reduction or drying post-treatment is carried out on the substrate to finish the deposition of metal particles.
Compared with the prior art, the invention discloses a device for depositing metal particles by ultrasonic atomization and a use method thereof, wherein the ultrasonic atomization method is completed by arranging a contact ultrasonic transducer and a non-contact ultrasonic transducer, the ultrasonic atomization method can effectively reduce the size of atomized liquid drops, and the atomized liquid drops with small size can more easily enter the inside of complex structures such as carbon nano tube arrays, graphene nano sheets, carbon fibers and the like, so that uniform adsorption in the inside and on the surface of a substrate is realized; atomized liquid drops generated in the method using the device are slowly contacted with the substrate, so that the acting force on the substrate is small, and the substrate structure is not damaged; the method for depositing the metal particles by the ultrasonic atomization method provided by the invention has the advantages that the time required for deposition is short, the non-contact ultrasonic transducer can completely crush and atomize the liquid drops near the sound pressure node only by 5-20ms, and the deposition efficiency is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an ultrasonic atomization apparatus for depositing metal particles according to the present invention;
FIG. 2 is a cross-sectional view of an apparatus for depositing metal particles by ultrasonic atomization provided by the present invention;
fig. 3 is a schematic structural diagram of a contact ultrasonic transducer provided by the present invention;
fig. 4 is a schematic structural diagram of a non-contact ultrasonic transducer according to the present invention;
FIG. 5 is a schematic view of an injection device according to the present invention;
FIG. 6 is a schematic diagram of a rotary positioner according to the present invention;
FIG. 7 is an internal block diagram of a rotary positioner provided by the present invention;
fig. 8 is a schematic structural diagram of a flow guiding device provided by the present invention.
Wherein: 1 is a box body; 2 is a through hole; 3 is a rotary positioner; 31 is a fixed housing; 32 is a rotary cap; 321 is a positioning hole; 322 is a placement hole; 323 is a locating pin hole; 33 is a steel ball; 34 is a limit column; 35 is a limiting groove; 36 is a bearing; 37 is a handle; 38 is a positioning rod; 39 is a spring plate; 4 is a contact type ultrasonic transducer; 41 is a distance-adjusting housing; 42 is the transducer back cover; 43 is the transducer front cover; 44 is an amplitude transformer; 45 is a piezoelectric ceramic stack; 46 is a tool head; 47 is a liquid guiding hole; 48 is a positioning bolt; 49 is a wire guide; 5 is an injection device; 51 is a split syringe pump; 52 is a locating pin; 53 is a clamping member; 54 is a syringe; 6 is a non-contact ultrasonic transducer; reference numeral 61 denotes a noncontact distance adjusting housing; 62 is the non-contact transducer back cover; 63 is a non-contact transducer front cover; 64 is a non-contact horn; 65 is a non-contact piezoelectric ceramic stack; 66 is a non-contact tool head; 67 is a non-contact positioning bolt; 68 is a non-contact wire guide; 7 is a residue collecting box; 71 is a sample placement stage; 8 is a flow guiding device; 81 is an air outlet; 82 is a draft tube.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, an embodiment of the present invention discloses an apparatus for ultrasonic atomization deposition of metal particles, comprising:
the device comprises a box body 1, wherein a through hole 2 is formed in the top of the box body 1, a substrate on which metal particles are to be deposited is arranged at the bottom of the box body 1, and the substrate is positioned right below the through hole 2;
The rotary positioner 3 is rotatably arranged at the top of the box body 1, the rotary positioner 3 is provided with a contact type ultrasonic transducer 4 and an injection device 5, the rotary positioner 3 rotates relative to the box body 1 so as to enable the contact type ultrasonic transducer 4 or the injection device 5 to be aligned with the through hole 2, and the contact type ultrasonic transducer 4 is provided with an infusion device; the working positions of the contact ultrasonic transducer 4 and the injection device 5 are rotationally adjusted by arranging the rotary positioner 3, and the metal solution required by the metal particles deposited on the substrate can be injected into the box body 1 by arranging the injection device 5;
When the contact type ultrasonic transducer 4 is aligned with the through hole 2, the infusion device is used for spraying a metal solution required by the metal particles deposited on the substrate onto the contact type ultrasonic transducer 4 in the box body 1, and the contact type ultrasonic transducer 4 is used for atomizing the metal solution required by the metal particles deposited on the substrate sprayed by the infusion device so as to realize atomization deposition of the metal particles on the substrate at the bottom of the box body 1;
When the injection device 5 is aligned with the through hole 2 of the box body 1 and sprays the metal solution required by the substrate deposition metal particles into the box body 1, the device for ultrasonic atomization deposition metal particles further comprises two non-contact ultrasonic transducers 6, the two non-contact ultrasonic transducers 6 are respectively arranged at two sides of the box body 1, and the non-contact ultrasonic transducers 6 are used for atomizing the metal solution required by the substrate deposition metal particles sprayed into the box body 1 by the injection device 5 so as to realize atomization deposition metal particles on the substrate at the bottom of the box body 1; the non-contact ultrasonic transducer 6 is arranged, so that the liquid drops near the sound pressure node can be completely crushed and atomized only for 5-20ms, and the deposition efficiency is effectively improved; by arranging the contact ultrasonic transducer 4 and the non-contact ultrasonic transducer 6, the metal solution required by the metal particles deposited on the substrate is crushed and atomized, atomized liquid drops are uniformly dispersed in the box body 1 under the action of the air flow of the flow guiding device 8, and simultaneously move directionally towards the direction of the sample placing table 71, and micron-sized atomized liquid drops are contacted with the substrate material and are attached to the surface of the substrate under the action of capillary force;
In this embodiment, the contact ultrasonic transducer 4 includes a distance adjusting housing 41, a transducer rear cover 42, a transducer front cover 43 and an amplitude transformer 44, the distance adjusting housing 41 is fixedly disposed on the rotary positioner 3, the transducer rear cover 42 is disposed in the distance adjusting housing 41, the transducer front cover 43 is also disposed in the distance adjusting housing 41, the bottom of the transducer front cover 43 exceeds the distance adjusting housing 41, the amplitude transformer 44 is disposed in the transducer front cover 43, the bottom of the transducer rear cover 42 narrows and extends to the top of the amplitude transformer 44, a piezoelectric ceramic stack 45 is disposed between the transducer front cover 43 and the amplitude transformer 44, the piezoelectric ceramic stack 45 is disposed around the bottom of the transducer rear cover 42, a tool head 46 is disposed at a portion of the bottom of the amplitude transformer 44 exceeding the bottom of the transducer front cover 43, and the tool head 46 is disposed opposite to the substrate.
In the embodiment, two sides of the transducer rear cover 42, which are close to the distance-adjusting shell 41, are respectively provided with a liquid guide hole 47, the two liquid guide holes 47 are communicated with the infusion device, the two liquid guide holes 47 extend from two sides of the transducer front cover 43 and are contacted with two sides of the amplitude transformer 44, the side surface of the distance-adjusting shell 41 is provided with a positioning bolt 48, one side of the transducer rear cover 42, which is close to the positioning bolt 48, is also provided with a wire guide hole 49, and the wire guide hole 49 is positioned between the two liquid guide holes 47; the infusion device injects the metal solution required by the metal particles deposited on the substrate into the box body 1 through the two liquid guide holes 47, and contacts the tool head 46 for atomization, thereby completing the metal deposition on the substrate.
In this embodiment, each of the non-contact ultrasonic transducers 6 includes a non-contact distance adjusting housing 61, a non-contact transducer rear cover 62, a non-contact transducer front cover 63 and a non-contact horn 64, the non-contact distance adjusting housing 61 is horizontally disposed on the side of the box 1, the non-contact transducer rear cover 62 is disposed in the non-contact distance adjusting housing 61, the non-contact transducer front cover 63 is also disposed in the non-contact distance adjusting housing 61, the bottom of the non-contact transducer front cover 63 is disposed beyond the non-contact distance adjusting housing 61, a non-contact piezoelectric ceramic stack 65 is disposed between the non-contact transducer front cover 63 and the non-contact transducer rear cover 62, the non-contact piezoelectric ceramic stack 65 is disposed around the bottom of the non-contact transducer rear cover 62, the non-contact horn 64 is disposed at the bottom of the non-contact transducer front cover 63, the bottom of the non-contact horn 64 is provided with a non-contact tool head 66, the side of the non-contact distance adjusting housing 61 is provided with a non-contact positioning bolt 67, and the non-contact transducer rear cover 62 is provided with a non-contact wire hole 68 on the side close to the non-contact positioning bolt 67.
In this embodiment, rotary positioner 3 includes fixed casing 31 and rotatory lid 32, fixed casing 31 sets up the top at box 1, rotatory lid 32 rotatable setting is on fixed casing 31, rotatory lid 32 sets up steel ball 33 with the hookup location of fixed casing 31, steel ball 33 is circumference equipartition at fixed casing 31's lateral wall top, rotatory lid 32's top is equipped with locating hole 321 and places hole 322, place injection device 5 in the hole 322, contact ultrasonic transducer 4 is placed to locating hole 321, the week side of placing hole 322 is equipped with two locating pin holes 323, fixed casing 31 bottom upwards protruding sets up spacing post 34, rotatory lid 32's bottom downwards protruding is equipped with spacing groove 35, be equipped with bearing 36 between spacing groove 35 and the spacing post 34, fixed casing 31's top is equipped with handle 37, fixed casing 31's bottom is equipped with wears to establish the hole, wear to establish hole and through-hole 2 intercommunication, realize fixed casing 31's inside and box 1's inside intercommunication.
In the present embodiment, two positioning rods 38 are oppositely arranged at the bottom of the rotary cover 32, a spring piece 39 is arranged on the inner wall of the fixed housing 31, and the positioning rods 38 contact with the spring piece 39 to complete the rotation limiting of the rotary cover 32; the contact type ultrasonic transducer 4 performs position conversion through the rotary positioner 3, the contact type ultrasonic transducer 4 is fixed in the positioning hole through the distance-adjusting shell 41, and the rotary cover 32 is connected in the fixed shell 31 through a bearing; the rotary cover 32 rotates relative to the fixed shell 31 through the arrangement of the steel ball 33, the handle 37 and the bearing 36, and the contact type ultrasonic transducer 4 or the injection device 5 is driven to rotate to the position of the through hole 2; when the handle 37 is rotated anticlockwise and the rotary cover 32 is rotated, when the positioning rod 38 contacts the inclined surface of the spring piece 39, the spring piece 39 starts to deform and bend until the spherical surface below the positioning rod 38 rotates into the groove on the spring piece 39 to realize positioning, and at this time, the contact ultrasonic transducer 4 or the injection device 5 has been rotated to the position of the through hole 2.
In this embodiment, the injection device 5 includes a split type injection pump 51, positioning pins 52, clamping members 53 and an injector 54, the positioning pins 52 are provided in two, the two positioning pins 52 are provided on both sides of the split type injection pump 51, the positioning pins 52 are connected with the positioning pin holes 323 in an fit manner, the clamping members 53 are provided on the side walls of the split type injection pump 51, and the injector 54 is provided on the clamping members 53.
In this embodiment, the sample collection device further comprises a residue collection box 7, wherein the residue collection box 7 is slidably arranged at the bottom of the box body 1, and a sample placement table 71 is arranged in the residue collection box 7.
In this embodiment, still include guiding device 8, guiding device 8 sets up two, two guiding device 8 set up in the both sides of box 1 respectively, and two guiding device 8 set up in the below of two non-contact ultrasonic transducer 6, every guiding device 8 all includes spiral air outlet 81 and honeycomb duct 82, honeycomb duct 82 sets up the lateral wall at box 1, honeycomb duct 82 and the inside intercommunication of box 1, spiral air outlet 81 sets up the one end of keeping away from box 1 at honeycomb duct 82, guiding device 8 is used for guiding the required metal solution of the substrate deposit metal particle after contact ultrasonic transducer 4 or non-contact ultrasonic transducer 6 atomizing to the substrate.
In another aspect, the present invention provides a method for depositing metal particles by ultrasonic atomization, an apparatus for depositing metal particles by ultrasonic atomization, comprising:
Step one: configuring a metal solution required by a substrate to deposit metal particles;
step two: cleaning the box body 1, and placing a substrate on which metal particles are to be deposited in the center of the bottom of the box body 1;
step three: selecting a contact type ultrasonic transducer 4 or a non-contact type ultrasonic transducer 6;
If a contact type ultrasonic transducer 4 is selected, the rotary positioner 3 rotates so that the contact type ultrasonic transducer 4 is aligned with the through hole 2 at the top of the box body 1, a transfusion device arranged on the contact type ultrasonic transducer 4 is utilized to spray a metal solution required by depositing metal particles on a substrate from the contact type ultrasonic transducer 4 into the box body 1, and the contact type ultrasonic transducer 4 atomizes the metal solution required by depositing the metal particles on the substrate and covers the substrate;
if a non-contact ultrasonic transducer 6 is selected, two non-contact ultrasonic transducers 6 are adjusted to be communicated with the inside of the box body 1, the rotary positioner 3 is rotated so that the injection device 5 is aligned with the through hole 2 at the top of the box body 1, the injection device 5 sprays the metal solution required by the metal particles deposited on the substrate into the box body 1, and the non-contact ultrasonic transducer 6 atomizes the metal solution required by the metal particles deposited on the substrate sprayed by the injection device 5 and covers the substrate;
Step four: after atomization is completed, the substrate is moved out of the box body 1, and microwave-assisted reduction or drying post-treatment is carried out on the substrate, so that the deposition of metal particles is completed.
In addition, in the present embodiment, the top of the transducer rear cover 42 of the contact type ultrasonic transducer 4 and the top of the non-contact type transducer rear cover 62 of the non-contact type ultrasonic transducer 6 are both provided with end face knobs, and the axial positions of the contact type ultrasonic transducer 4 and the non-contact type ultrasonic transducer 6 can be adjusted by the end face knobs so as to adjust the positions of the tool heads 46; the transducer rear cover 42 of the contact type ultrasonic transducer 4 is connected with the distance adjusting housing 41 through threads, and the non-contact type transducer rear cover 62 of the non-contact type ultrasonic transducer 6 is also connected with the non-contact type distance adjusting housing 61 through threads;
The distance-adjusting shell 41 is fixed on the top of the box body 1, the end face knob is rotated to realize the axial movement of the rear cover 42 of the transducer and the internal structure in the distance-adjusting shell 41, so that the position of the tool head 46 is adjusted, and the positioning bolt 48 is screwed for fixation after the position is determined;
The non-contact distance-adjusting shell 61 is fixed on the side wall of the box body 1, and the rotation end face knob realizes the axial movement of the non-contact transducer rear cover 62 and the internal structure in the non-contact distance-adjusting shell 61, so that the position of the non-contact tool head 66 is adjusted, and the non-contact positioning bolt 67 is screwed for fixing after the position is determined.
The working principle of the contact type ultrasonic transducer 4 is as follows:
The electrode lead of the external signal generator is connected with the piezoelectric ceramic pile through the lead hole 49, when the piezoelectric ceramic pile 45 starts to work, the piezoelectric ceramic pile is excited by an external signal source to generate high-frequency vibration, the signal is amplified by the amplitude transformer 44, the tool head 46 shows the high-frequency vibration with increased amplitude, the metal solution required by the metal particle deposition of the substrate is conveyed to the surface of the tool head 46 through the two liquid guide holes 47, and the metal solution is atomized under the action of ultrasonic vibration.
The non-contact ultrasonic transducer 6 operates according to the following principle:
The electrode wire is connected with an external signal generator through a non-contact wire hole 68, and two non-contact ultrasonic transducers 6 which are oppositely arranged are externally connected with the same external signal generator, and in operation, an ultrasonic standing wave field is formed between the two non-contact tool heads 66, and a metal solution required by depositing metal particles on a substrate is input into the vicinity of a sound pressure node by an injector 54 arranged on the injection device 5 for crushing and atomizing.
The specific use method of the device comprises the following steps:
step one: configuring a metal solution required by a substrate to deposit metal particles;
Step two: after cleaning the remainder collecting box 7 and the sample placing table 71, placing the substrate in the center of the sample placing table 71;
Step three: the contact ultrasonic transducer 4 or the non-contact ultrasonic transducer 6 is selected, the tool head 46 is adjusted into the box body 1, and the metal solution required for depositing the metal particles on the substrate is introduced into the box body 1:
If the contact type ultrasonic transducer 4 is selected, after the contact type ultrasonic transducer 4 is rotated to the position of the through hole 2 through the rotary positioner 3, the tool head 46 is rotated into the box body 1 through the rotary transducer rear cover 42, and the transfusion device arranged on the contact type ultrasonic transducer 4 can input a metal solution required by depositing metal particles on the substrate into the box body 1 from the outside through the liquid guide hole 47;
if the non-contact ultrasonic transducer 6 is selected, the non-contact tool heads 66 are turned into the box body 1 by rotating the non-contact transducer rear covers 62 of the two non-contact ultrasonic transducers 6, the split type injection pump is rotated to the position of the through hole 2 by the rotary positioner 3, after the injector 54 is taken down and added with the metal solution required by the metal particles deposited on the substrate, the injector 54 is communicated with the inside of the box body 1 through the through hole 2, then the clamping position of the injector 54 in the clamping piece 53 is changed, the position of the needle head of the injector 54 in the box body 1 is regulated, and the split type injection pump 51 can input the metal solution required by the metal particles deposited on the substrate in the injector 54 into the box body 1 from the outside through the liquid guide hole 47;
Step four: turning on an external signal generator, and atomizing a metal solution required by depositing metal particles on a substrate through a contact type ultrasonic transducer 4 or a non-contact type ultrasonic transducer 6;
Step five: introducing air flow through the guide pipe 82, forming spiral downward air flow through the spiral air outlet 81, and guiding the metal solution required by the metal particles deposited on the substrate after the contact type ultrasonic transducer 4 or the non-contact type ultrasonic transducer 6 is atomized to the substrate;
Step six: after atomization, the residual material collecting box 7 and the sample placing table 71 are removed, the substrate is removed from the device, and microwave-assisted reduction or drying post-treatment is carried out on the substrate to finish the deposition of metal particles.
In addition, in the present embodiment, the top of the transducer rear cover 42 of the contact type ultrasonic transducer 4 and the top of the non-contact type transducer rear cover 62 of the non-contact type ultrasonic transducer 6 are both provided with end face knobs, and the axial positions of the contact type ultrasonic transducer 4 and the non-contact type ultrasonic transducer 6 can be adjusted by the end face knobs so as to adjust the positions of the tool heads 46; the transducer rear cover 42 of the contact type ultrasonic transducer 4 is connected with the distance adjusting shell 41 through threads, and the non-contact type transducer rear cover 62 of the non-contact type ultrasonic transducer 6 is connected with the non-contact type distance adjusting shell 61 through threads;
The distance-adjusting shell 41 is fixed on the top of the box body 1, the end face knob is rotated to realize the axial movement of the rear cover 42 of the transducer and the internal structure in the distance-adjusting shell 41, so that the position of the tool head 46 is adjusted, and the positioning bolt 48 is screwed for fixation after the position is determined;
The non-contact distance-adjusting shell 61 is fixed on the side wall of the box body 1, and the rotation end face knob realizes the axial movement of the non-contact transducer rear cover 62 and the internal structure in the non-contact distance-adjusting shell 61, so that the position of the non-contact tool head 66 is adjusted, and the non-contact positioning bolt 67 is screwed for fixing after the position is determined.
Taking the non-contact ultrasonic transducer 6 to ultrasonically atomize the nano gold solution, depositing nano gold on the surface of the carbon nanotube array as an example, further explanation is provided:
step one: preparing a nano gold solution required by the substrate to deposit metal particles.
Step two: after cleaning the remainder collecting device 7 and the sample placing stage 71, the carbon nanotube array is placed in the center of the sample placing stage 71.
Step three: rotating the rotary positioner 3 anticlockwise, rotating the injection device 5 to the position of the through hole 2, taking out the injector 54, adding the nano gold solution, adjusting the needle of the injector 54 to be positioned above the through hole 2 by changing the clamping position, extending the injector 54 into the box body 1 from the through hole 2, and setting the flow rate of the split type injection pump 51.
Step four: the end face knob is turned to realize that the rear cover 62 of the non-contact transducer and the internal structure axially move in the non-contact distance-adjusting shell 61, so that the position of the non-contact ultrasonic transducer 6 is adjusted, the non-contact tool head 66 is adjusted into the box body 1, and the non-contact positioning bolt 67 is screwed for fixing after the position is determined.
Step five: the flow of air is introduced through the flow guide pipe 82, so that the metal solution required by the metal particles deposited on the substrate after the atomization of the non-contact ultrasonic transducer 6 is guided onto the substrate.
Step six: the external signal generator was turned on, and after 2 minutes, the switch of the split syringe pump 51 was turned on to deliver the solution to the vicinity of the sound pressure node to start atomization.
Step seven: after 60s, the switch of the injection device 5 and the external signal generator are closed, the flow guiding device 8 is closed, the carbon nano tube array is taken out and moved to the oven for drying treatment, and the nano gold particles are uniformly deposited on the surface and the inside of the carbon nano tube array.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. An apparatus for ultrasonic atomization deposition of metal particles, comprising:
the metal particle deposition device comprises a box body, wherein a through hole is formed in the top of the box body, a substrate on which metal particles are to be deposited is arranged at the bottom of the box body, and the substrate is positioned right below the through hole;
The rotary positioner is rotatably arranged at the top of the box body, a contact type ultrasonic transducer and an injection device are arranged on the rotary positioner, and the rotary positioner rotates relative to the box body so as to enable the contact type ultrasonic transducer or the injection device to be aligned to the through hole, and an infusion device is arranged on the contact type ultrasonic transducer;
When the contact type ultrasonic transducer is aligned to the through hole, the infusion device is used for spraying a metal solution required by depositing metal particles on a substrate onto the contact type ultrasonic transducer in the box body, and the contact type ultrasonic transducer is used for atomizing the metal solution required by depositing the metal particles on the substrate sprayed by the infusion device so as to realize atomization of the substrate at the bottom of the box body for depositing the metal particles;
The contact type ultrasonic transducer comprises a distance adjusting shell, a transducer rear cover, a transducer front cover and a variable amplitude rod, wherein the distance adjusting shell is fixedly arranged on the rotary positioner, the transducer rear cover is arranged in the distance adjusting shell, the transducer front cover is also arranged in the distance adjusting shell, the bottom of the transducer front cover exceeds the distance adjusting shell, the variable amplitude rod is arranged in the transducer front cover, the bottom of the transducer rear cover is narrowed and extends to the top of the variable amplitude rod, a piezoelectric ceramic pile is arranged between the transducer front cover and the variable amplitude rod, the piezoelectric ceramic pile is arranged around the bottom of the transducer rear cover, a tool head is arranged at the position, exceeding the bottom of the transducer front cover, of the bottom of the variable amplitude rod, and the tool head is arranged right against the substrate;
The two sides of the transducer rear cover, which are close to the distance-adjusting shell, are respectively provided with a liquid guide hole, the two liquid guide holes are communicated with the infusion device, the two liquid guide holes extend from the two sides of the transducer front cover and are contacted with the two sides of the amplitude transformer, the side surface of the distance-adjusting shell is provided with a positioning bolt, and one side of the transducer rear cover, which is close to the positioning bolt, is also provided with a wire guide hole;
The ultrasonic atomization metal particle deposition device further comprises two non-contact ultrasonic transducers, when the injection device is aligned to the through holes of the box body and sprays metal solution required by the metal particles deposited on the substrate in the box body, the two non-contact ultrasonic transducers are respectively arranged on two sides of the box body, and the non-contact ultrasonic transducers are used for atomizing the metal solution required by the metal particles deposited on the substrate sprayed into the box body by the injection device so as to realize atomization metal particle deposition on the substrate at the bottom of the box body;
Each non-contact ultrasonic transducer comprises a non-contact distance adjusting shell, a non-contact transducer rear cover, a non-contact transducer front cover and a non-contact amplitude transformer, wherein the non-contact distance adjusting shell is horizontally arranged on the side face of the box body, the non-contact transducer rear cover is arranged in the non-contact distance adjusting shell, the non-contact transducer front cover is also arranged in the non-contact distance adjusting shell, the bottom of the non-contact transducer front cover exceeds the non-contact distance adjusting shell, a non-contact piezoelectric ceramic pile is arranged between the non-contact transducer front cover and the non-contact transducer rear cover, the non-contact piezoelectric ceramic pile is arranged around the bottom of the non-contact transducer rear cover, the non-contact amplitude transformer is arranged at the bottom of the non-contact transducer front cover, a non-contact tool head is arranged at the bottom of the non-contact amplitude transformer, a non-contact positioning bolt is arranged at the side face of the non-contact distance adjusting shell, and a non-contact wire hole is arranged at one side of the non-contact transducer rear cover close to the non-contact positioning bolt;
The top of the transducer rear cover of the contact type ultrasonic transducer and the top of the non-contact type ultrasonic transducer rear cover of the non-contact type ultrasonic transducer are respectively provided with an end face knob, and the axial positions of the contact type ultrasonic transducer and the non-contact type ultrasonic transducer can be adjusted through the end face knobs so as to adjust the positions of the tool head and the non-contact type tool head; the rear transducer cover of the contact type ultrasonic transducer is connected with the distance-adjusting shell through threads, and the rear non-contact type transducer cover of the non-contact type ultrasonic transducer is also connected with the non-contact distance-adjusting shell through threads.
2. The device for ultrasonic atomization deposition of metal particles according to claim 1, wherein the rotary positioner comprises a fixed shell and a rotary cover, the fixed shell is arranged at the top of the box, the rotary cover is rotatably arranged on the fixed shell, steel balls are arranged at the connection positions of the rotary cover and the fixed shell, the steel balls are circumferentially and uniformly distributed at the top of the side wall of the fixed shell, a positioning hole and a placement hole are formed in the top of the rotary cover, the injection device is placed in the placement hole, the positioning hole is used for placing the contact type ultrasonic transducer, two positioning pin holes are formed in the periphery of the placement hole, a limiting post is arranged at the bottom of the fixed shell in an upward protruding mode, a limiting groove is formed in the bottom of the rotary cover in a downward protruding mode, a bearing is arranged between the limiting groove and the limiting post, a handle is arranged at the top of the fixed shell, and a penetrating hole is formed in the bottom of the fixed shell and communicated with the through hole.
3. The device for ultrasonic atomization deposition of metal particles according to claim 2, wherein two positioning rods are oppositely arranged at the bottom of the rotary cover, a spring piece is arranged on the inner wall of the fixed shell, and the positioning rods are in contact with the spring piece to complete rotation limiting of the rotary cover.
4. The device for ultrasonic atomization deposition of metal particles according to claim 3, wherein the injection device comprises a split type injection pump, two positioning pins, clamping pieces and an injector, wherein the two positioning pins are respectively arranged on two sides of the split type injection pump, the positioning pins are in fit connection with the positioning pin holes, the clamping pieces are arranged on the side walls of the split type injection pump, and the injector is arranged on the clamping pieces.
5. The apparatus for ultrasonic atomization deposition of metal particles according to claim 1, further comprising a remainder collection box slidably disposed at the bottom of the case, wherein a sample placement table is disposed in the remainder collection box.
6. The device for ultrasonic atomization deposition of metal particles according to claim 1, further comprising two flow guiding devices, wherein the two flow guiding devices are respectively arranged at two sides of the box body, the two flow guiding devices are arranged below the two non-contact ultrasonic transducers, each flow guiding device comprises a spiral air outlet and a flow guiding pipe, the flow guiding pipe is arranged on the side wall of the box body and communicated with the inside of the box body, the spiral air outlet is arranged at one end of the flow guiding pipe far away from the box body, and the flow guiding devices are used for guiding metal solution required by the substrate atomized by the contact ultrasonic transducers or the non-contact ultrasonic transducers to the substrate.
7. A method of using ultrasonic atomization to deposit metal particles, characterized in that an apparatus for ultrasonic atomization to deposit metal particles as defined in any one of claims 1 to 6 is used, comprising:
Step one: configuring a metal solution required by a substrate to deposit metal particles;
step two: cleaning the box body, and placing a substrate on which metal particles are to be deposited in the center of the bottom of the box body;
step three: selecting a contact type ultrasonic transducer or a non-contact type ultrasonic transducer;
if a contact type ultrasonic transducer is selected, the rotary positioner rotates to enable the contact type ultrasonic transducer to be aligned with a through hole at the top of the box body, a transfusion device arranged on the contact type ultrasonic transducer is utilized to spray a metal solution required by depositing metal particles on a substrate into the box body from the contact type ultrasonic transducer, and the contact type ultrasonic transducer atomizes the metal solution required by depositing the metal particles on the substrate and covers the substrate;
if a non-contact ultrasonic transducer is selected, the two non-contact ultrasonic transducers are adjusted to be communicated with the inside of the box body, the rotary positioner is rotated to enable the injection device to be aligned with the through hole at the top of the box body, the injection device sprays the metal solution required by the metal particles deposited on the substrate into the box body, and the non-contact ultrasonic transducer atomizes the metal solution required by the metal particles deposited on the substrate sprayed by the injection device and covers the substrate;
Step four: and after atomization is finished, the substrate is moved out of the box body, and microwave-assisted reduction or drying post-treatment is carried out on the substrate to finish the deposition of metal particles.
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3517984A1 (en) * | 1985-05-18 | 1986-11-20 | Max 4600 Dortmund Flötenmeyer | Process and apparatus for depositing mirror coatings |
| CN88103399A (en) * | 1987-06-04 | 1988-12-21 | 东亚燃料工业株式会社 | Form the method and apparatus of superconducting thin film |
| US6471782B1 (en) * | 1999-11-23 | 2002-10-29 | Tokyo Electronic Limited | Precursor deposition using ultrasonic nebulizer |
| KR20070069839A (en) * | 2005-12-28 | 2007-07-03 | 한국생산기술연구원 | Concurrent manufacturing technology and facility for wide area ultrasonic coating and spin coating |
| CN101563170A (en) * | 2006-10-19 | 2009-10-21 | 纳米技术有限公司 | Methods and apparatus for making coatings using ultrasonic spray deposition |
| CN101593794A (en) * | 2009-06-26 | 2009-12-02 | 常州日月机械有限公司 | The spray equipment of transparent conductive film for depositing large-area solar cell |
| CN101791604A (en) * | 2010-03-18 | 2010-08-04 | 清华大学 | Device and method for spraying liquid material film based on ultrasonic vibration table |
| JP2011178635A (en) * | 2010-03-03 | 2011-09-15 | Tokyo Electron Ltd | Film deposition apparatus, system and film deposition method |
| DE102013222199A1 (en) * | 2013-10-31 | 2015-04-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Low and medium pressure plasma process for surface coating by means of percursor feed without carrier gas |
| CN109622980A (en) * | 2019-01-28 | 2019-04-16 | 哈尔滨工业大学 | A kind of contactless powder by atomization device and method of molten metal ultrasonic standing wave |
| CN109706433A (en) * | 2018-12-04 | 2019-05-03 | 南京工业大学 | A kind of ullrasonic spraying thin film deposition device and method |
| CN115463777A (en) * | 2022-08-24 | 2022-12-13 | 兰州大学 | Ultrasonic spray pyrolysis rotary film coating machine and film coating method thereof |
-
2023
- 2023-09-02 CN CN202311127868.3A patent/CN117444215B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3517984A1 (en) * | 1985-05-18 | 1986-11-20 | Max 4600 Dortmund Flötenmeyer | Process and apparatus for depositing mirror coatings |
| CN88103399A (en) * | 1987-06-04 | 1988-12-21 | 东亚燃料工业株式会社 | Form the method and apparatus of superconducting thin film |
| US6471782B1 (en) * | 1999-11-23 | 2002-10-29 | Tokyo Electronic Limited | Precursor deposition using ultrasonic nebulizer |
| KR20070069839A (en) * | 2005-12-28 | 2007-07-03 | 한국생산기술연구원 | Concurrent manufacturing technology and facility for wide area ultrasonic coating and spin coating |
| CN101563170A (en) * | 2006-10-19 | 2009-10-21 | 纳米技术有限公司 | Methods and apparatus for making coatings using ultrasonic spray deposition |
| CN101593794A (en) * | 2009-06-26 | 2009-12-02 | 常州日月机械有限公司 | The spray equipment of transparent conductive film for depositing large-area solar cell |
| JP2011178635A (en) * | 2010-03-03 | 2011-09-15 | Tokyo Electron Ltd | Film deposition apparatus, system and film deposition method |
| CN101791604A (en) * | 2010-03-18 | 2010-08-04 | 清华大学 | Device and method for spraying liquid material film based on ultrasonic vibration table |
| DE102013222199A1 (en) * | 2013-10-31 | 2015-04-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Low and medium pressure plasma process for surface coating by means of percursor feed without carrier gas |
| CN109706433A (en) * | 2018-12-04 | 2019-05-03 | 南京工业大学 | A kind of ullrasonic spraying thin film deposition device and method |
| CN109622980A (en) * | 2019-01-28 | 2019-04-16 | 哈尔滨工业大学 | A kind of contactless powder by atomization device and method of molten metal ultrasonic standing wave |
| CN115463777A (en) * | 2022-08-24 | 2022-12-13 | 兰州大学 | Ultrasonic spray pyrolysis rotary film coating machine and film coating method thereof |
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