CN117433244A

CN117433244A - Heating system, control method, device, medium, control system and refrigeration equipment

Info

Publication number: CN117433244A
Application number: CN202210827477.1A
Authority: CN
Inventors: 申孟亮
Original assignee: Hefei Hualing Co Ltd; Midea Group Co Ltd; Hefei Midea Refrigerator Co Ltd
Current assignee: Hefei Hualing Co Ltd; Midea Group Co Ltd; Hefei Midea Refrigerator Co Ltd
Priority date: 2022-07-13
Filing date: 2022-07-13
Publication date: 2024-01-23

Abstract

The application provides a heating system, control method, device, medium, control system and refrigeration plant, heating system includes heat preservation module, semiconductor chip, cooling module and heat dissipation module, heat preservation module has relative first side and the second side that sets up, and heat preservation module has been seted up and has been link up first side with the switch-on of second side, semiconductor chip locates in the switch-on, semiconductor chip expose in two relative surfaces outside the heat preservation module form refrigeration end and generate heat the end, cooling module locates first side, and connect in the refrigeration end, cooling module locates the second side, and connect in the heating end, the heating tank has been seted up to cooling module, the heating tank has the portion of accepting, the portion of accepting is used for accepting to wait to heat the thing, through set up the heating tank on cooling module of refrigeration plant, utilized the heat of refrigeration plant itself to carry out the heating to the object, realized the heating function of refrigeration plant.

Description

Heating system, control method, device, medium, control system and refrigeration equipment

Technical Field

The application relates to the technical field of household appliances, in particular to a heating system, a control method, a device, a medium, a control system and refrigeration equipment.

Background

In the prior art, the refrigeration equipment such as a refrigerator and the like has single function, and the main function is used for refrigeration, so that objects and foods can be better preserved and fresh-kept. However, many times we take the object or food out of the refrigerator because the temperature is too low to use or eat it directly. For example, some foods such as milk or fruit need to be heated to a suitable temperature to eat so as not to irritate the intestines and stomach; and some cosmetics such as facial masks are not suitable for being directly applied to the face under the condition of low temperature. Therefore, when the situation is met, the heating equipment is needed to be searched for reheating, so that people need different equipment for completing the whole operation, the purchase cost is increased, the storage space is occupied, and the operation is troublesome. Therefore, the refrigeration equipment in the prior art does not have a heating function, which is a technical problem to be solved urgently.

Disclosure of Invention

The application provides refrigeration equipment and a heating system, a control method, a control device, a medium and a control system thereof, so as to solve the technical problem that the refrigeration equipment does not have a heating function.

To solve the above technical problem, the present application provides a heating system, which is used for a refrigeration device, including:

the heat preservation module is provided with a first side and a second side which are oppositely arranged, and a conducting port penetrating through the first side and the second side is formed in the heat preservation module;

the semiconductor chip is arranged in the conducting port, and two opposite surfaces of the semiconductor chip exposed out of the heat preservation module form a refrigeration end and a heating end;

the cooling module is arranged on the first side and connected with the refrigeration end;

the heat dissipation module is arranged on the second side and connected with the heating end, the heat dissipation module is provided with a heating groove, the heating groove is provided with a bearing part, and the bearing part is used for bearing an object to be heated.

The heat dissipation module comprises a radiator and a heat dissipation fan, and the air inlet surface of the heat dissipation fan faces the radiator.

The radiator comprises a bottom plate and radiating fins fixed on one side of the bottom plate or integrally formed on one side of the bottom plate, and the heating grooves are formed in the radiating fins.

Wherein the heat dissipation fin comprises a first fin, a second fin and a plurality of third fins arranged between the first fin and the second fin, the first fin, the third fin and the second fin are arranged along a first direction, wherein,

The first fins and at least part of the third fins which are sequentially arranged are provided with a plurality of through holes along the first direction, and the through holes form the heating groove; and/or

And the second fins and at least part of the third fins which are arranged in sequence are provided with a plurality of through holes along the direction opposite to the first direction, and the through holes form the heating groove.

The heat dissipation fins are arranged in a first direction, each heat dissipation fin is provided with a first surface and a second surface which are oppositely arranged, gaps penetrating through the first surfaces and the second surfaces are formed in the heat dissipation fins in a part of continuous and adjacent mode along the first direction, and the gaps form the heating grooves.

The heat-conducting module is connected between the heating end and the heat-radiating module in a heat conducting mode.

The present application provides a control method for controlling a heating system as described above, the control method comprising:

detecting that an object to be heated is placed in the heating tank;

and starting a heating mode to heat the object to be heated.

After the step of heating the object to be heated, the method further comprises the following steps:

detecting the surface temperature of an object to be heated at intervals of a first preset time;

Judging whether the surface temperature of the object to be heated reaches a preset temperature, if not, returning to execute the heating mode, and heating the object to be heated; if yes, the heating mode is turned off.

The method comprises the steps of judging whether the surface temperature of an object to be heated reaches a preset temperature, and if not, returning to execute the heating starting mode to heat the object to be heated; if yes, displaying reminding information, closing the heating mode and opening the heat preservation mode.

The method comprises the steps of judging whether the surface temperature of an object to be heated reaches a preset temperature, and if not, returning to execute the heating starting mode to heat the object to be heated; if yes, displaying reminding information, closing a heating mode, and after the step of starting a heat preservation mode, further comprising the following steps:

detecting whether an object to be heated is placed in the heating tank or not every second preset time, if not, closing the heat preservation mode; if yes, returning to execute the step of displaying the reminding information, closing the heating mode and opening the heat preservation mode.

Wherein, before the step of detecting that the object to be heated is placed in the heating tank, the method further comprises the following steps:

the door opening action of the refrigeration equipment is detected.

The heating mode is to adjust the power of the semiconductor chip to a first preset power and/or adjust the rotation speed of the cooling fan to a first preset rotation speed.

When the heating mode is to adjust the power of the semiconductor chip to a first preset power, the heat preservation mode is to adjust the power of the semiconductor chip to a second preset power, and the second preset power is smaller than the first preset power.

When the heating mode is to adjust the rotation speed of the cooling fan to a first preset rotation speed, the heat preservation mode is to adjust the rotation speed of the cooling fan to a second preset rotation speed, and the second preset rotation speed is larger than the first preset rotation speed.

When the heating mode is to adjust the power of the semiconductor chip to a first preset power and adjust the rotating speed of the cooling fan to a first preset rotating speed, the heat preservation mode is to adjust the power of the semiconductor chip to a second preset power and/or adjust the rotating speed of the cooling fan to a second preset rotating speed, the second preset power is smaller than the first preset power, and the second preset rotating speed is larger than the first preset rotating speed.

The present application provides a control device for controlling a heating system as described above, comprising:

The induction module is used for inducing whether an object to be heated is placed in the heating groove or not;

and the control module is connected with the induction module and is used for starting a heating mode when detecting that the object to be heated is placed in the heating tank, and heating the object to be heated.

The present application provides a medium having stored therein a plurality of instructions adapted to be loaded by a processor to perform a control method as described above.

The present application provides a control system comprising:

a memory for storing instructions and data; and

a processor for executing the control method as described above.

Wherein the control system further comprises:

the induction switch is used for sensing whether an object to be heated is placed in the heating groove or not and transmitting a signal to the processor;

and the temperature sensor is used for detecting the surface temperature of the object to be heated and transmitting a signal to the processor.

The present application provides a refrigeration appliance comprising a heating system as described above or a control system as described above.

Compared with the prior art, the beneficial effects of the embodiment of the application are as follows: the application provides a heating system, control method, device, medium, control system and refrigeration plant, heating system includes heat preservation module, semiconductor chip, cooling module and heat dissipation module, heat preservation module has relative first side and the second side that sets up, heat preservation module has been seted up and has been link up first side with the conduction mouth of second side, semiconductor chip locates in the conduction mouth, semiconductor chip expose in two relative surfaces outside the heat preservation module form refrigeration end and generate heat the end, cooling module locates first side, and connect in the refrigeration end, cooling module locates the second side, and connect in the heat end, the heating tank has been seted up to cooling module, the heating tank has the adapting part, adapting part is used for adapting to wait to heat the thing, through set up the heating tank on cooling module of refrigeration plant, has utilized the heat dissipation heat of refrigeration plant itself to carry out the heating to the heating function of refrigeration plant to the object, has realized the heating function of refrigeration plant.

In addition, the heat wasted by radiating the heat in the air is utilized, so that the power consumption utilization rate of the whole machine is improved; and the other parts or heating devices are not required to be added, so that the structural stability is high, and the production cost is reduced. For a user, the user does not need to purchase an additional heating device to heat, and the user can complete heating by only using the additional function of the refrigeration equipment, so that the heating device is more convenient and faster. In addition, the temperature of the heating object is lower, so that the temperature of the heat dissipation module can be reduced, the heat dissipation efficiency of the heat dissipation module is accelerated, and the refrigeration efficiency of the refrigeration equipment is improved.

Drawings

For a clearer description of the technical solutions in the embodiments of the present application, the following description of the drawings that are needed for the description of the embodiments will be given with the understanding that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, in which:

FIG. 1 is a schematic diagram of one embodiment of a heating system provided herein;

FIG. 2 is a schematic view of the heating system of the embodiment of FIG. 1 from another perspective;

FIG. 3 is a schematic structural view of another embodiment of a heating system provided herein;

FIG. 4 is a schematic view of the heating system of the embodiment of FIG. 3 from another perspective;

FIG. 5 is a flow chart of a first embodiment of the control method provided herein;

FIG. 6 is a flow chart of a second embodiment of the control method provided herein;

FIG. 7 is a flow chart of a third embodiment of a control method provided herein;

FIG. 8 is a flow chart of a fourth embodiment of a control method provided herein;

FIG. 9 is a flow chart of a fifth embodiment of a control method provided herein;

FIG. 10 is a schematic diagram of an embodiment of a control device provided herein;

FIG. 11 is a schematic view of another embodiment of a control device provided herein;

FIG. 12 is a schematic diagram of an embodiment of a control system provided herein;

FIG. 13 is a schematic structural view of another embodiment of a control system provided herein;

fig. 14 is a schematic structural view of a refrigeration apparatus provided herein.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

The semiconductor chip is selected for refrigeration, any refrigerant is not needed, the refrigeration equipment can continuously work, a pollution source and a rotating part are not generated, and a turning effect is not generated. The semiconductor chip refrigeration is realized by utilizing the Peltier effect of a semiconductor, namely when two different conductors are connected and are connected with a direct current power supply to form a loop, the phenomenon of heat absorption or heat release occurs at the junction of the two conductors, so that the temperature difference is formed at two ends to realize refrigeration, and therefore, the high-precision temperature control can be realized by controlling the input current, and the remote control, program control and computer control can be realized easily by adding a temperature detection and control means, so that an automatic control system is convenient to form.

Referring to fig. 1 to 4, fig. 1 is a schematic structural view of an embodiment of a heating system provided in the present application, and fig. 2 is a schematic structural view of the heating system in the embodiment shown in fig. 1 at another view angle; fig. 3 is a schematic structural view of another embodiment of the heating system provided in the present application, and fig. 4 is a schematic structural view of the heating system in another view angle in the embodiment shown in fig. 3.

As shown in fig. 1-4, a heating system 10 is provided herein. The heating system 10 is for a refrigeration appliance. The heating system 10 includes a thermal insulation module 100 and a semiconductor chip 200. The middle part of the heat preservation module 100 is provided with a through opening which penetrates through the left side and the right side. The semiconductor chip 200 is disposed in the via 413 for being accommodated in the thermal insulation module 100. The thermal insulation module 100 is made of a material with low heat conductivity coefficient, and has the functions of building structural support and temperature isolation. As shown in fig. 1, the left side of the heat preservation module 100 is a first side forming a refrigerating space, the right side is a second side forming a heat dissipation space, and the first side is opposite to the second side. The surface of the semiconductor chip 200 exposed to the first side forms a cooling end 210 and the surface exposed to the second side forms a heating end 220. The heating system 10 also includes a heat dissipation module 300 and a heat dissipation module 400. The cooling module 300 is disposed on the first side and connected to the cooling end 210. The cooling end 210 of the semiconductor chip 200 is connected to the cooling module 300 to gradually absorb heat in the space, so that the temperature in the cooling space is continuously reduced. The heat dissipation module 400 is disposed on the second side and connected to the heat generating end 220. The heating end 220 transfers the heat of the cooling end 210 to the heat radiation module 400, and the heat radiation module 400 continuously radiates the heat outwards.

In some embodiments, the heat dissipation module 300 and the heat dissipation module 400 are fixed to the heat preservation module 100 while being connected to the semiconductor chip 200, so as to achieve assembly of the respective components. The fixed connection mode includes but is not limited to riveting, welding, bonding, bolting, pin-key connection, snap-in connection, magnetic adsorption and other connection modes.

In the prior art, the refrigeration purpose is achieved by absorbing heat by the refrigeration end 210 of the semiconductor chip 200, but the heat emitted by the heating end 220 is not utilized and is directly lost in the environment, so that the power consumption of the refrigeration equipment is greatly wasted. Therefore, in some embodiments provided herein, a heating groove 401 is formed on the heat dissipation module 400 of the heating system 10, where the heating groove 401 has a receiving portion for receiving an object to be heated. The object is heated by utilizing the heat needing to be emitted by the heat radiation module 400, so that the heating function of the refrigeration equipment is realized, and meanwhile, other parts are not required to be additionally arranged, so that the structural stability of the system is improved. In addition, because the temperature of the object to be heated placed in the heating tank 401 is low, when the heating tank 401 heats the object to be heated, the heat dissipation module 400 can be accelerated by directly contacting the object to be heated with low temperature, so that the refrigeration efficiency of the refrigeration system of the refrigeration equipment 1 is improved.

In some embodiments of the present application, the heat dissipation module 400 includes a heat sink 410 and a heat dissipation fan 420. The air inlet surface of the heat radiation fan 420 faces the heat sink 410. When the cooling fan 420 rotates, the air inlet surface can quickly absorb the heat of the radiator 410 and radiate the heat away from the radiator 410, so as to accelerate the heat radiation efficiency and further improve the overall refrigeration efficiency of the refrigeration equipment 1.

In some embodiments of the present application, the heat sink 410 includes a base plate 411 and a plurality of heat dissipating fins 412 fixed on one side of the base plate 411. The heat dissipation fins 412 are rectangular or trapezoidal fins. The heat sink 410 is made of a metal material having a high heat transfer coefficient. A plurality of heat dissipation fins 412 may be fixed on the bottom plate 411 in parallel at equal intervals. The channels formed between the heat radiating fins 412 are heat radiating channels. The heat dissipation fan 420 is located at a side of the heat sink 410 away from the semiconductor chip 200, and an air inlet surface of the heat dissipation fan 420 is disposed towards the heat dissipation channel to enhance the heat flow and dissipation speed. The heating groove 401 is formed on the heat dissipation fin 412, so that the stability of the heat sink 410 is not damaged, the contact area of the heat dissipation fin 412 can be increased, and the heat dissipation efficiency is improved.

In some embodiments of the present application, a plurality of heat dissipating fins 412 may be integrally formed on one side of the bottom plate 411, thereby increasing structural stability.

In particular, the present application provides two specific embodiments of the heating tank 401, please refer to fig. 1 to 4, and it should be noted that the specific embodiments of the heating tank 401 are not limited to the above two embodiments, and all other embodiments obtained by a person of ordinary skill in the art without making any creative effort based on the embodiments in the present application are all within the scope of protection of the present application.

Referring to fig. 1 and 2, a specific opening of a heating tank 401 is shown for one embodiment of a heating system 10 provided herein. The heat dissipation fin 412 includes a first fin 412a, a second fin 412b, and a plurality of third fins 412c located between the first fin 412a and the second fin 412b. The first fin 412a, the third fin 412c, and the second fin 412b are aligned in the first direction. The edges of the heat dissipation fins 412 may be flush with the edges of the bottom plate 411, fixed at equal intervals, or integrally formed on one side of the bottom plate 411. The uniform arrangement of the heat dissipation fins 412 can maintain the stability of the structure of the heat sink 410 and the uniformity of heat dissipation.

In fig. 1 and 2, a through hole 413 is formed in the middle of the first fin 412 a. In some embodiments, the through hole 413 formed in the middle of the first fin 412a may be the first through hole 413a, along the first direction. The third fins 412c adjacent to the first fins 412a and arranged in sequence are provided with through holes 413 having the same positions and the same sizes as the first through holes 413a, and the other third fins 412c and/or the second fins 412b are not provided with through holes 413. The opening of the heating groove 401 is a first through hole 413a, and the bottom surface of the heating groove 401 is a third fin 412c and/or a second fin 412b with no through hole 413 along the first direction. These through holes 413 form the heating tank 401. The cross-sectional area of the heating groove 401 is the cross-sectional area of the through hole 413, the depth of the heating groove 401 is the distance between the first fin 412a and the third fin 412c and/or the second fin 412b, which are/is not provided with the through hole 413, along the first direction, and the object to be heated can be placed in the heating groove 401.

In some embodiments, a through hole 413 (not shown) may be formed in the middle of the second fin 412b in a direction opposite to the first direction. In some embodiments, the through hole 413 formed in the middle of the second fin 412b may be the first through hole 413a, and may be in the opposite direction of the first direction. The third fins 412c adjacent to the second fins 412b and arranged in sequence are provided with through holes 413 having the same positions and the same sizes as the first through holes 413a, and the other third fins 412c and/or the first fins 412a are not provided with through holes 413. The opening of the heating groove 401 is the first through hole 413a, and the bottom surface of the heating groove 401 is the third fin 412c and/or the first fin 412a, which are not provided with the through hole 413, of the first block along the opposite direction of the first direction. The through holes 413 form a heating groove 401, the cross-sectional area of the heating groove 401 is the cross-sectional area of the through hole 413, and the depth of the heating groove 401 is the distance between the second fin 412b and the third fin 412c and/or the first fin 412a, which are not provided with the through hole 413, of the first block in the opposite direction of the first direction. The contact surface between the heating tank 401 and the object to be heated is a receiving portion, and the receiving portion is used for receiving the object to be heated.

Referring to fig. 3 and 4, another embodiment of the heating system 10 provided herein illustrates another embodiment of the heating tank 401. The edges of the plurality of heat dissipation fins 412 may be flush with the edges of the bottom plate 411. In some embodiments, several heat dissipating fins 412 may be fixed or integrally formed on one side of the bottom plate 411 at equal intervals, parallel along the first direction. Each fin 412 has oppositely disposed first and second faces. As shown in fig. 3, the heat dissipation fins 412 that are continuous and adjacent to each other are provided with notches 414 that penetrate the first surface and the second surface. The notches 414 may be the same size and consistent in location. A number of continuous indentations 414 form the heating channel 401. The cross-sectional area of the heating groove 401 is the rectangular area formed by the openings of the continuous notch 414, and the depth of the heating groove 401 is the depth of the notch 414. The contact surface between the heating tank 401 and the object to be heated is a receiving portion, and the receiving portion is used for receiving the object to be heated.

In some embodiments, the specific shape and size of the heating tank 401 may be designed according to the shape and size of the object to be heated, without specific limitation. For example, the heating tank 401 is used for heating a plurality of masks, the opening length of the heating tank 401 is larger than the width of the masks, the opening height is larger than the thickness of the plurality of masks, and the depth of the heating tank 401 is larger than the length of the masks, so that the masks can be fully placed in the heating tank 401 for heating. A plurality of heating slots 401 may be formed on the heat dissipation fins 412 as required for heating a plurality of objects to be heated simultaneously.

In some embodiments of the present application, the heating system 10 of the refrigeration appliance also includes a thermally conductive module 600. The heat conducting module 600 is thermally connected between the heat generating end 220 and the heat dissipating module 400, and is used for conducting the heat of the semiconductor chip 200 to the heat dissipating module 400 more efficiently. Specifically, the heat conduction module 600 may be a metal block with a high heat conductivity coefficient. The cross-sectional area of the heat conduction module 600 may be greater than or equal to the cross-sectional area of the semiconductor chip 200, so that the heating end 220 of the semiconductor chip 200 is attached to the heat conduction module 600, and heat of the heating end 220 is conducted to the heat conduction module 600, thereby improving heat conduction efficiency of the heat conduction module 600.

In some embodiments of the present application, to improve the refrigeration efficiency and the heat dissipation efficiency of the refrigeration device 1, the heat dissipation module 300 and the refrigeration end 210 are tightly attached or attached by a heat conducting medium, the surface of the heat conduction module 600 close to the semiconductor chip 200 is tightly attached or attached by a heat conducting medium to the heat generating end 220, and the surface of the heat conduction module 600 far away from the semiconductor chip 200 is tightly attached or attached by a heat conducting medium to the side of the bottom plate 411 of the heat sink 410 far away from the heat dissipation fins 412. The heat conducting medium can be heat conducting silicone grease, heat conducting glue, heat conducting paste and other products with high heat conductivity coefficient.

The contact surfaces among the cooling module 300, the cooling end 210, the heating end 220, the heat conduction module 600, the cooling module 400 and the heat conductor are smooth planes without burrs, which is beneficial to the close fitting of the end surfaces, so as to improve the working efficiency of the cooling device 1 and the heating system 10 of the cooling device.

Referring to fig. 5, a first control method is provided for controlling the heating system 10 as described above. Please refer to fig. 13 for convenience of understanding. The control method comprises the following steps:

step B11: it is detected that the object to be heated is placed in the heating tank 401.

In some embodiments, the inductive switch 303 may be used to detect whether an object to be heated is placed in the heating tank 401, and when the inductive switch 303 detects that the object to be heated is placed in the heating tank 401, a signal is triggered and sent to the processor 301. The inductive switch can be a photoresistor, a pressure sensor, an infrared sensor, a micro switch and the like.

Step B12: and starting a heating mode to heat the object to be heated.

In some embodiments, the signal sent by the inductive switch 303 is received, and an instruction for starting the heating mode can be sent to the integrated circuit and the fan speed regulator, so that the heating mode is started to heat the object to be heated.

Specifically, the heating mode is: the power of the semiconductor chip 200 is adjusted to a first preset power and/or the rotational speed of the cooling fan 420 is adjusted to a first preset rotational speed. After receiving the signal from the inductive switch 303, the processor 301 directly controls the semiconductor chip 200 and/or the cooling fan 420 to turn on the heating mode, or the processor 301 sends a command to the integrated circuit 307 and/or the fan speed regulator 305 to turn on the heating mode. The processor 301 or the integrated circuit 307 controls and adjusts the power of the semiconductor chip 200 to the first preset power, so as to increase the heat at the heating end 220, thereby increasing the heat of the heat dissipation module 400, increasing the heat in the heating tank 401, and improving the heating efficiency of the object to be heated. The processor 301 or the fan speed regulator 305 controls and adjusts the rotation speed of the cooling fan 420 from the first preset rotation speed, and reduces the speed of the heat dissipation module 400 to dissipate heat outwards, so that the heat from the heat-generating end 220 can be quickly conducted to the heat dissipation module 400 and the heating tank 401, thereby quickly improving the heating efficiency of the heating tank 401.

In some embodiments, the heating mode is: increasing the power of the semiconductor chip 200 to the first preset power and/or decreasing the rotational speed of the cooling fan 420 to the first preset rotational speed. After receiving the signal from the inductive switch 303, the processor 301 directly controls the semiconductor chip 200 and/or the cooling fan 420 to turn on the heating mode, or the processor 301 sends a command to the integrated circuit 307 and the fan speed regulator 305 to turn on the heating mode. The processor 301 or the integrated circuit 307 controls to increase the power of the semiconductor chip 200 to the first preset power, and further increases the voltage and current of the heating end 220, that is, the heat at the heating end 220 can be increased, so that the heat of the heat dissipation module 400 is increased, the heat in the heating tank 401 is increased, and the heating efficiency of the object to be heated is improved. Since the heat dissipating fan 420 has an initial high rotation speed when the heating mode is not turned on, the heat of the heat dissipating module 400 can be rapidly taken away, and thus the heat of the heating tank 401 is insufficient to heat the object to be heated to the preset target temperature. Therefore, the processor 301 or the fan speed regulator 305 controls and adjusts the rotation speed of the cooling fan 420 from the initial high rotation speed to the low rotation speed when the first preset power is applied, so as to reduce the speed of the heat dissipation module 400 to dissipate heat outwards, so that the heat from the heat dissipation module 400 and the heating tank 401 can be quickly conducted to the heat dissipation module 220, and thus the heating efficiency of the heating tank 401 can be quickly improved.

Referring to fig. 6, the second control method provided in the present application further includes the following steps after step B12:

step B13: detecting the surface temperature of the object to be heated at intervals of a first preset time.

Specifically, the temperature sensor 304 detects the surface temperature of the object to be heated at intervals of a first preset time, and transmits the obtained signal to the processor 301. The temperature sensor 304 is utilized to timely monitor the surface temperature of the object to be heated by setting the first preset time, so that the problem that the surface temperature of the object to be heated is too high to cause damage to the object to be heated is avoided.

Step B14: judging whether the surface temperature of the object to be heated reaches the preset temperature, if not, returning to the step B12 to start the heating mode, and heating the object to be heated; if yes, go on to step B15.

Specifically, the processor 301 receives a signal of the surface temperature of the object to be heated measured by the temperature sensor 304, the processor 301 compares the surface temperature of the object to be heated with a stored preset temperature to determine whether the surface temperature of the object to be heated reaches the preset temperature, if not, a command is sent to the integrated circuit 307 and the fan speed regulator 305 to continue to return to the heating mode, and the object to be heated is heated; if the preset temperature is reached, it is indicated that the object to be heated does not need to be heated in the heating tank 401 in the continuous heating mode, and step B15 is continued.

Step B15: the heating mode is turned off.

Specifically, if the processor 301 determines that the object to be heated has reached the preset temperature, it is not necessary to continue heating the object to be heated, and the processor 301 will send a command to the integrated circuit 307 and the fan speed regulator 305 to turn off the heating mode. When the integrated circuit 307 receives the instruction, the control is triggered to adjust the power of the semiconductor chip 200 to the initial power, that is, the heat at the heating end 220 can be reduced to the initial heat, so that the heat of the heat dissipation module 400 is reduced, and the heat in the heating tank 401 is reduced, so that the heat in the heating tank 401 is insufficient to continue heating the object to be heated. When the fan speed regulator 305 receives the instruction, it triggers and controls the cooling fan 420, adjusts the rotation speed of the cooling fan 420 to recover from the low rotation speed in the heating mode to the initial high rotation speed, and increases the speed of the heat dissipation module 400 to dissipate heat outwards, so that the heat of the heat dissipation module 400 can be dissipated outwards as soon as possible, and the heat in the heating tank 401 is not concentrated any more, so that the object to be heated cannot be heated continuously by using the heat of the heating tank 401.

Referring to fig. 7, a third control method provided in the present application is different from the second control method in step B15, and step B15 of the third control method is:

And displaying reminding information, closing the heating mode and opening the heat preservation mode.

Specifically, the processor 301 determines that the object to be heated has reached the preset temperature, and does not need to continuously heat the object to be heated, so that the object to be heated which has been heated to the preset temperature can be used by a user in time, and the temperature of the object to be heated is not reduced due to the fact that the object to be heated is not taken away for a long time, the processor 301 also sends an instruction to the display 306, the display 306 can display reminding information, and the user is reminded of completing the heating work and taking away the object to be heated in time. At the same time, the processor 301 sends instructions to the integrated circuit 307 and fan speed regulator 305 to turn off the heating mode and turn on the keep warm mode.

Specifically, the heat preservation mode has various embodiments according to the heating mode:

mode one: when the heating mode is to adjust the power of the semiconductor chip 200 to the first preset power, the heat preservation mode is to adjust the power of the semiconductor chip 200 to the second preset power, and the second preset power is smaller than the first preset power. The processor 301 or the integrated circuit 307 controls to reduce the power of the semiconductor chip 200, so that the power of the semiconductor chip 200 is reduced from the first preset power to the second preset power, thereby reducing the voltage and the current at the two ends of the heat-emitting end 220, i.e. reducing the heat at the heat-emitting end 220, so that the heating efficiency at the heating tank 401 is reduced compared with that in the heating mode, and the surface temperature of the object to be heated is maintained at the preset temperature.

Mode two: when the heating mode is to adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the rotation speed of the cooling fan 420 to a second preset rotation speed, and the second preset rotation speed is greater than the first preset rotation speed. The processor 301 or the fan speed regulator 305 controls to increase the rotation speed of the cooling fan 420, so that the rotation speed of the cooling fan 420 is increased from the first preset rotation speed to the second preset rotation speed, and the speed of the heat dissipation module 400 to dissipate heat is increased compared with the speed of the heat dissipation module 400 in the heating mode, so that the heating efficiency at the heating tank 401 is reduced compared with the heating mode, and the surface temperature of the object to be heated is maintained at the preset temperature.

Mode three: when the heating mode is to adjust the power of the semiconductor chip 200 to a first preset power and adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the power of the semiconductor chip 200 to a second preset power, the second preset power is smaller than the first preset power, and the rotation speed of the cooling fan 420 is maintained to be the first preset rotation speed. The processor 301 or the integrated circuit 307 controls to reduce the power of the semiconductor chip 200, thereby reducing the voltage and current across the heating end 220, i.e. reducing the heat at the heating end 220, so that the heating efficiency at the heating tank 401 is reduced compared with that in the heating mode, and the surface temperature of the object to be heated is maintained at the preset temperature.

Mode four: when the heating mode is to adjust the power of the semiconductor chip 200 to a first preset power and adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the rotation speed of the cooling fan 420 to a second preset rotation speed, the second preset rotation speed is greater than the first preset rotation speed, and the power of the semiconductor chip 200 is maintained to be the first preset power. The processor 301 or the fan speed regulator 305 controls to increase the rotation speed of the heat dissipating fan 420, and increases the speed of the heat dissipating module 400 to dissipate heat in comparison with the heating mode, so that the heating efficiency in the heating tank 401 is reduced in comparison with the heating mode, and the surface temperature of the object to be heated is maintained at the preset temperature.

Mode five: when the heating mode is to adjust the power of the semiconductor chip 200 to a first preset power and adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the power of the semiconductor chip 200 to a second preset power and adjust the rotation speed of the cooling fan 420 to a second preset rotation speed, the second preset power is smaller than the first preset power, and the second preset rotation speed is larger than the first preset rotation speed. The processor 301 or the integrated circuit 307 controls the power of the semiconductor chip 200 to be reduced, thereby reducing the voltage and current across the heating tip 220, i.e., reducing the heat at the heating tip 220, thereby reducing the heat obtained by the heating bath 401. The processor 301 or the fan speed regulator 305 controls to increase the rotation speed of the heat dissipation fan 420, and increases the speed of the heat dissipation module 400 to dissipate heat more than in the heating mode. Through the common adjustment of the semiconductor chip 200 and the heat dissipation fan 420, the heating efficiency at the heating tank 401 is reduced compared with that in the heating mode, so that the surface temperature of the object to be heated is maintained at the preset temperature.

Referring to fig. 8, the fourth control method provided in the present application further includes the following steps after step B15:

and B16: detecting whether an object to be heated is placed in the heating tank 401 every second preset time, if not, continuing to step B17; if yes, returning to the step B15 to display reminding information, closing the heating mode and opening the heat preservation mode.

Specifically, in order to prevent the object to be heated from being removed, the heat preservation mode is still turned on, so that the heat of the heating end 220 is continuously increased, and the heat dissipation fan 420 cannot timely dissipate the heat, so that the heat is accumulated in the heat dissipation module 400, and thus the refrigeration end 210 is affected, and the problem of low refrigeration efficiency is solved. The induction switch 303 is thus set to detect whether or not the object to be heated is placed in the heating tank 401 every second preset time, and the obtained signal is sent to the processor 301. When the processor 301 receives the signal sent by the inductive switch 303, it determines that it will send a command to the display 306, the integrated circuit 307 and the fan speed regulator 305. When the signal obtained by the processor 301 is that the object to be heated is still in the heating tank 401, the display 306 continues to display the reminding information to prompt the user to take away the object to be heated in time, and meanwhile, the integrated circuit 307 and the fan speed regulator 305 control the semiconductor chip 200 and the cooling fan 420 to continue to keep the heat preservation mode and maintain the surface temperature of the object to be heated at the preset temperature. When the signal obtained by the processor 301 indicates that the object to be heated has been removed and is not in the heating tank 401, a command is sent to the integrated circuit 307 and the fan speed controller 305 to continue step 17.

B17: and closing the heat preservation mode.

Specifically, when the processor 301 obtains the information that the heating tank 401 has no object to be heated, the heat preservation mode is required to be turned off without continuously providing heat to the heating tank 401, so that the power of the semiconductor chip 200 and the rotation speed of the cooling fan 420 are restored to the initial state, and the heat is effectively dissipated, so that the problem that the cooling efficiency of the cooling end 210 is affected due to the accumulation of the heat in the cooling module 400 is prevented, and meanwhile, the power consumption is saved. The processor 301 sends instructions to the integrated circuit 307 and the fan speed regulator 305. The integrated circuit 307 receives the instruction sent by the processor 301, and triggers the control to reduce the power of the semiconductor chip 200, and then reduces the voltage and current of the heating end 220, that is, the heat at the heating end 220 can be reduced, so that the heat of the heat dissipation module 400 is reduced, and the heat in the heating tank 401 is reduced, so that the heat in the heating tank 401 is insufficient to continue heating the object to be heated. The fan speed regulator 305 receives the instruction sent by the processor 301, and triggers and adjusts the lower rotation speed of the cooling fan 420 in the self-heat-preserving mode to restore to the initial high rotation speed, so as to increase the speed of the heat dissipation module 400 to dissipate heat outwards, so that the heat of the heat dissipation module 400 can be dissipated outwards as soon as possible, and the heat in the heating tank 401 is not concentrated any more, so that the object to be heated cannot be continuously heated by the heat of the heating tank 401.

Referring to fig. 9, the fifth control method provided in the present application further includes the following steps before step B11:

b10: it is detected that the refrigeration appliance 1 is operating to open the door.

Specifically, in some embodiments, the inductive switch 303 needs to be in an on state all the time to perform inductive detection on the heating tank 401, and the inductive switch 303 needs to be powered all the time, so that power is consumed. In one embodiment, the inductive switch 303 is configured to be activated when receiving an instruction sent by the processor 301. When the refrigeration equipment 1 performs the door opening action, a signal is sent to the processor 301, and when the processor 301 receives the signal, an instruction is sent to the induction switch 303, and the induction switch 303 is activated to be opened. When the inductive switch 303 does not detect that the object to be heated is placed in the heating tank 401 for a while, the inductive switch 303 is powered off again, and enters a standby state. This way, the power consumption of the refrigeration appliance 1 can be saved.

Referring to fig. 10, the present application further provides a control device 20, where the control device 20 includes a sensing module 201 and a control module 202. Please refer to fig. 13 for convenience of understanding.

The sensing module 201 is used for sensing and detecting the object to be heated in the heating tank 401.

Specifically, the inductive switch 303 may be used to detect whether an object to be heated is placed in the heating tank 401, and when the inductive switch 303 detects that the object to be heated is placed in the heating tank 401, a signal is triggered and sent to the processor 301. The temperature sensor 304 can also detect the surface temperature of the object to be heated at intervals of a first preset time, and transmit the obtained signal to the processor 301, so as to monitor the surface temperature of the object to be heated in time, and avoid the problem that the surface temperature of the object to be heated is damaged due to the fact that the heating tank 401 continuously heats the object to be heated.

Referring to fig. 11, in some embodiments of the present application, the control module 202 further includes a fan module 2021, a timing module 2022, a reminding module 2023, and a semiconductor module 2024.

The fan module 2021 is configured to adjust a rotation speed of the cooling fan 420.

Specifically, the processor 301 may be used to control and adjust the rotational speed of the cooling fan 420 or the fan speed governor 305 may be used to control the rotational speed of the cooling fan 420. When in the heating mode, the processor 301 or the fan speed regulator 305 adjusts the cooling fan 420 to a low rotation speed, and reduces the speed of the heat dissipation to be dissipated outwards, so as to rapidly increase the heat of the heat dissipation module 400 and the heating tank 401. When in the heat preservation mode, the processor 301 or the fan speed regulator 305 adjusts the cooling fan 420 to a lower rotation speed, and slowly reduces the outward radiating speed of the heat dissipation capacity, so as to maintain the heat of the heat dissipation module 400 and the heating tank 401 at a preset level. When the heating mode is turned off or the heat preservation mode is turned off, the processor 301 or the fan speed regulator 305 adjusts the cooling fan 420 to a high rotation speed to increase the outward heat dissipation speed, thereby rapidly reducing the heat of the cooling module 400 and the heat of the heating tank 401, and failing to heat the object.

The reminding module 2023 is used for displaying reminding information.

Specifically, the display 306 may be used to display a reminder to prompt the user to take away the object to be heated in time. On one hand, a user can know the completion condition of heating work in time and take the object to be heated in time; on the other hand, when the user knows that the heating operation is completed and then takes away the object to be heated, the inductive switch 303 can timely detect the situation that the object to be heated is taken out from the heating tank 401, and then send a signal to the processor 301, and the processor 301 sends an instruction to adjust the power of the semiconductor chip 200 and the rotation speed of the cooling fan 420 to timely turn off the heating mode or turn off the heat preservation mode, so that the power consumption of the refrigeration device 1 is saved. The display 306 may be provided with a reminder effect via voice prompts and/or visual prompts.

The semiconductor module 2024 is used to control the heat at the heat generating end 220.

Specifically, the integrated circuit 307 may control the power of the semiconductor chip 200 to adjust the heat at the heating end 220, and when in the heating mode, the integrated circuit 307 controls to increase the power of the semiconductor chip 200, and then increase the voltage and current at two ends of the heating end 220, so as to increase the heat at the heating end 220, thereby increasing the heat of the heat dissipation module 400, increasing the heat in the heating tank 401, and improving the heating efficiency of the object to be heated. When in the heat-preserving mode, the integrated circuit 307 controls to slightly increase the power of the semiconductor chip 200, so that the heat added by the heat-generating end 220 is less than the heat added by the heat-generating end 220 in the heating mode, thereby maintaining the heat in the heating tank 401 at a preset level. When the heating mode is turned off or the heat preservation mode is turned off, the integrated circuit 307 controls to decrease the power of the semiconductor chip 200 to the initial power, and continuously decreases the heat at the heating end 220, so that the heat of the heat dissipation module 400 is decreased, so that the heat in the heating tank 401 is decreased, and the heat in the heating tank 401 is insufficient to continue heating the object to be heated.

The timing module 2022 is configured to time the first preset time and the second preset time.

Specifically, the timer 308 may be configured to time the first preset time and the second preset time. When the heating mode is started, the processor 301 sends an instruction to the timer 308 to start counting the first preset time, and when counting is completed, the timer 308 sends a signal to the processor 301, and the processor 301 sends an instruction to the temperature sensor 304 to start detecting the surface temperature of the object to be heated. When the heating mode is off and the thermal insulation mode is on, the processor 301 sends an instruction to the timer 308 to start the second preset time, and when the time counting is completed, the timer 308 sends a signal to the processor 301, and the processor 301 sends an instruction to the inductive switch 303 to detect whether the object to be heated is placed in the heating tank 401.

The application also provides a medium. The medium has stored therein a plurality of instructions adapted to be loaded by the processor 301 to perform the control method as described above.

Referring to fig. 12, the present application further provides a control system 30, where the control system 30 includes a processor 301 and a memory 302.

The processor 301 is a control center of the control system 30, connects respective parts of the entire control system 30 using various interfaces and lines, and performs various functions of the control system 30 and processes data by running or loading application programs stored in the memory 302 and calling the data stored in the memory 302, thereby performing overall monitoring of the control system 30.

In this embodiment, the processor 301 in the control system 30 loads instructions corresponding to the processes of one or more application programs into the memory 302 according to the following steps, and the processor 301 executes the application programs stored in the memory 302, so as to implement various functions:

it is detected that the object to be heated is placed in the heating tank 401;

and starting a heating mode to heat the object to be heated.

In some embodiments, after the step of heating the object to be heated, the processor 301 may further perform:

In some embodiments, when the processor 301 determines whether the surface temperature of the object to be heated reaches the preset temperature, the processor 301 may further execute:

In some embodiments, after judging whether the surface temperature of the object to be heated reaches the preset temperature, if not, returning to execute the heating mode to heat the object to be heated; if yes, displaying a reminding message, turning off the heating mode, and after the step of turning on the heat preservation mode, the processor 301 may further execute:

Detecting whether an object to be heated is placed in the heating tank 401 every second preset time, if not, closing the heat preservation mode; if yes, returning to execute the display reminding information, closing the heating mode and opening the heat preservation mode.

In some embodiments, the processor 301 may further perform, prior to detecting the placement of the object to be heated within the heating tank 401:

it is detected that the refrigeration appliance 1 is operating to open the door.

The memory 302 may be used to store applications and data. The memory 302 stores a program including instructions executable by the processor 301. The program may constitute various functional modules. The processor 301 executes programs stored in the memory 302 to perform various functional applications and data processing.

Referring to fig. 13, the control system 30 further includes an inductive switch 303. The inductive switch 303 is used for detecting whether an object to be heated is placed in the placement tank 401, and transmitting the obtained signal to the processor 301. The inductive switch 303 may be disposed on a heat sink 410. The inductive switch 303 may be a photoresistor, when the object to be heated is placed in the heating tank 401, the photoresistor detects that the optical fiber is suddenly changed, and the resistance of the photoresistor is correspondingly suddenly changed, so that a signal can be output to the processor 301. The inductive switch 303 may also be a micro switch, and the object to be heated is placed in the heating tank 401, and the micro switch is turned, so that a signal is transmitted to the processor 301. The inductive switch 303 may also be replaced by a pressure sensor, an infrared sensor, or other switch that can trigger a signal.

The control system 30 also includes a temperature sensor 304. The temperature sensor 304 is used for detecting the temperature of the surface of the object to be heated, and transmitting the obtained signal to the processor 301. The temperature sensor 304 may be an infrared temperature sensing probe, and is disposed on the heat sink 410, and the infrared temperature sensing probe receives the instruction of the processor 301 every a first preset time to execute the command of detecting the temperature of the surface of the object to be heated.

The control system 30 also includes a display 306. The display 306 is used for displaying reminding information to remind a user of completing heating work and timely taking away the object to be heated. The display 306 may employ visual cues, such as using a display screen to display a reminder text message, or using a signal light to communicate a reminder message. The display 306 may also use an audible prompt, for example, a speaker to send out a prompt message, so that the user can also receive the prompt message in time when the user is not near the refrigeration device, and the user can be prevented from forgetting to hold the object to be heated in the heating tank 401, so as to prompt the user to take the object to be heated in time when the user is convenient to take the object to be heated.

The control system 30 also includes a timer 308. The timer 308 is configured to time the first preset time and the second preset time. The timer 308 starts the timing operation when receiving the timing instruction sent by the processor 301, and transmits a signal to the processor 301 in time after the timing operation is completed. In some embodiments, the first preset time and the second preset time may also be timed in the internet via a wired network or a wireless network, or other associated devices.

The control system 30 also includes a fan governor 305. The fan speed regulator 305 is used for regulating the rotation speed of the cooling fan 420. When the heating mode is on, the fan speed regulator 305 controls to reduce the rotation speed of the cooling fan 420 from a high rotation speed to a low rotation speed; when the heat preservation mode is started, the fan speed regulator 305 controls the rotation speed of the heat radiation fan 420 to be increased from a low rotation speed to a lower rotation speed; when the heating mode is off and the heat-preserving mode is off, the fan speed regulator 305 controls to increase the rotation speed of the cooling fan 420 from a lower rotation speed to a higher rotation speed. The heat radiation efficiency of the heat radiation module 400 is controlled by adjusting the rotation speed of the heat radiation fan 420.

The control system 30 further comprises an integrated circuit 307. The integrated circuit 307 is used for controlling and adjusting the power of the semiconductor chip 200. When the heating mode is on, the integrated circuit 307 controls the voltage and current of the heating terminal 220 of the semiconductor chip 200 to increase, i.e. the heat at the heating terminal 220 can be increased; when the heat preservation mode is on, the integrated circuit 307 controls the power of the semiconductor chip 200 to be reduced compared with the heating mode, so that the heat at the heating end 220 can be maintained at a preset level; when the heating mode is off and the heat-preserving mode is off, the integrated circuit 307 controls to reduce the power of the semiconductor chip 200 to an initial state.

In this application, the memory 302 stores a value of a preset temperature, and then the processor 301 compares the obtained surface temperature of the object to be heated with the preset temperature to determine to execute the next instruction. The preset temperature can be adjusted in a self-defined manner according to the needs of a user, and is generally set to be 40 ℃ by default under the condition of no self-definition.

In this application, the memory 302 stores the set value of the first preset time and the set value of the second preset time, and the processor 301 sends an instruction to the timer 308 according to the set first preset time and second preset time of the memory 302. In order to prevent the surface temperature of the object to be heated from being higher than the preset temperature due to the overlong on time of the heating mode, the first preset time is generally set to be 5 seconds. In order to avoid that the object is removed, but the heating mode/the heat preservation mode is turned on, heat is accumulated in the heat dissipation module 400, and the refrigerating effect of the refrigerating side 210 is affected, a second preset time is generally set to 5 seconds.

Referring to fig. 14, the present application further provides a refrigeration apparatus 1. The refrigeration appliance 1 comprises a heating system 10 as described above or a control system 30 as described above.

Specifically, the refrigeration device 1 further includes a housing 40, the housing 40 encloses to form a containing cavity 50, and the heating system 10 of the refrigeration device can be installed on any side plate of the housing 40, so that the heat dissipation module 400 is disposed in the housing 40 and the heat dissipation module 300 is disposed in the containing cavity 50, so as to ensure the refrigeration function and the heat dissipation function of the refrigeration device 1. The housing 40 may be made of a thermal insulation material or provided with a thermal insulation layer. In some embodiments, the insulation module 100 may be part of the housing 40.

In some embodiments, the refrigeration device 1 is a refrigerator, the heat dissipation module 400 can be combined with the surface of the refrigerator, the outer surface of the refrigerator can be directly connected with the heating tank 401, and when the object to be heated is taken out from the refrigerator, the object to be heated can be directly placed in the heating tank 401 communicated with the outer surface of the refrigerator to be heated.

The application provides a heating system, a control method, a device, a medium, a control system and refrigeration equipment, wherein a heating groove is formed in a heat dissipation module of the refrigeration equipment, so that the heating function of the refrigeration equipment is realized. The heat dissipation of the refrigeration equipment is utilized to heat objects, so that the heat wasted by the heat dissipation of the refrigeration equipment in the air is utilized, and the power consumption utilization rate of the whole machine is improved; and the other parts or heating devices are not required to be added, so that the structural stability is high, and the production cost is reduced. For a user, the user does not need to purchase an additional heating device for heating, and the user can finish heating only by using the additional function of the refrigeration equipment, so that the purchase cost is saved and the use is more convenient. In addition, the temperature of the heating object is lower, so that the temperature of the heat dissipation module can be reduced, the heat dissipation efficiency of the heat dissipation module is accelerated, and the refrigeration efficiency of the refrigeration equipment is improved.

In addition, the heating system of the refrigerating equipment is controlled by using the control method of the heating system of the refrigerating equipment, so that the object to be heated can be heated to the preset temperature quickly and the user is informed of taking the heated object in time under the condition of saving power consumption, the phenomenon that the object to be heated is damaged due to the fact that the surface temperature of the object to be heated is too high due to the fact that the heating temperature exceeds the preset temperature can be effectively avoided, in addition, when the user cannot take the object to be heated in time, the object to be heated can be kept warm, the situation that the object to be heated is cooled and needs to be reheated when the user takes the object to be heated, time and electricity are wasted is prevented, and therefore experience of the user is enhanced, and the method is worry-saving and labor-saving.

The foregoing description is only the embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims

1. A heating system for a refrigeration appliance, the heating system characterized by: comprising

2. The heating system of claim 1, wherein the heat dissipating module comprises a heat sink and a heat dissipating fan, an air intake surface of the heat dissipating fan facing the heat sink.

3. The heating system of claim 2, wherein the heat sink comprises a base plate and a heat radiating fin fixed to or integrally formed with one side of the base plate, and the heat radiating fin is provided with the heating groove.

4. The heating system of claim 3, wherein the heat dissipating fin comprises a first fin, a second fin, and a plurality of third fins positioned between the first fin and the second fin, the first fin, the third fin, and the second fin being aligned in a first direction, wherein,

5. A heating system as claimed in claim 3, wherein a plurality of said heat dissipating fins are arranged in a first direction, said heat dissipating fins have a first face and a second face disposed opposite each other, and a plurality of said notches are formed in said heat dissipating fins which are partially continuous and adjacent to each other and extend through said first face and said second face in the first direction.

6. The heating system of claim 1, further comprising a thermally conductive module thermally coupled between the heating tip and the heat dissipating module.

7. A control method for controlling the heating system according to any one of claims 1 to 6, the control method comprising:

detecting that an object to be heated is placed in the heating tank;

and starting a heating mode to heat the object to be heated.

8. The control method according to claim 7, wherein the step of turning on the heating mode and heating the object to be heated further comprises the steps of:

9. The control method according to claim 8, wherein the step of determining whether the surface temperature of the object to be heated reaches a preset temperature, and if not, returning to the step of executing the heating mode to heat the object to be heated; if yes, displaying reminding information, closing the heating mode and opening the heat preservation mode.

10. The control method according to claim 9, wherein the step of determining whether the surface temperature of the object to be heated reaches a preset temperature, and if not, returning to the step of executing the heating mode to heat the object to be heated; if yes, displaying reminding information, closing a heating mode, and after the step of starting a heat preservation mode, further comprising the following steps:

11. The control method of claim 10, wherein the step of detecting that the object to be heated is placed in the heating tank is preceded by the step of:

the door opening action of the refrigeration equipment is detected.

12. The control method according to claim 11, wherein the heating mode is to adjust power of the semiconductor chip to a first preset power and/or adjust a rotational speed of the heat dissipation fan to a first preset rotational speed.

13. The control method of claim 12, wherein when the heating mode is to adjust the power of the semiconductor chip to a first preset power, the holding mode is to adjust the power of the semiconductor chip to a second preset power, the second preset power being smaller than the first preset power.

14. The control method of claim 12, wherein when the heating mode is to adjust the rotation speed of the cooling fan to a first preset rotation speed, the heat preservation mode is to adjust the rotation speed of the cooling fan to a second preset rotation speed, and the second preset rotation speed is greater than the first preset rotation speed.

15. The control method according to claim 12, wherein when the heating mode is to adjust the power of the semiconductor chip to a first preset power and adjust the rotational speed of the heat dissipation fan to a first preset rotational speed, the heat preservation mode is to adjust the power of the semiconductor chip to a second preset power and/or adjust the rotational speed of the heat dissipation fan to a second preset rotational speed, the second preset power being smaller than the first preset power, the second preset rotational speed being larger than the second preset rotational speed.

16. A control device for controlling a heating system according to any one of claims 1 to 6, comprising:

17. A medium having stored therein a plurality of instructions adapted to be loaded by a processor to perform the control method of any of claims 7-15.

18. A control system, comprising:

a memory for storing instructions and data; and

a processor for performing the control method according to any one of claims 7-15.

19. The control system of claim 18, further comprising:

20. A refrigeration device comprising a heating system as claimed in any one of claims 1 to 6 or a control system as claimed in any one of claims 18 to 19.