CN218163372U - Heating system, control device and refrigeration equipment - Google Patents

Abstract

The application provides a heating system, controlling means and refrigeration plant, heating system includes heat preservation module, semiconductor chip, the module that looses cold, heat dissipation module and heating module, heat preservation module has relative first side and the second side that sets up, heat preservation module sets up the conduction mouth that link up first side and second side, semiconductor chip locates in the conduction mouth, semiconductor chip exposes in the outer two relative surface formation refrigeration end and the end of generating heat of heat preservation module, the module that looses cold locates first side, and connect in refrigeration end, heat dissipation module locates the second side, and connect in the end of generating heat, heating module includes the heat conductor, the heat conductor is located on the heat dissipation module and is stretched out heat dissipation module, the tip that heat dissipation module was kept away from to the heat conductor is the heating end, the heating end has the face of accepting, the face of accepting is used for accepting the heat to treat, through increase heating module on refrigeration plant's heat dissipation module, the heat dissipation capacity that has utilized refrigeration plant itself heats the object, refrigeration plant's heating function has been realized.

Description

Heating system, control device and refrigeration equipment

Technical Field

The application relates to the technical field of household appliances, in particular to a heating system, a control device and refrigeration equipment.

Background

In the prior art, refrigeration equipment such as a refrigerator has a single function, and the main function of the refrigeration equipment is used for refrigeration, so that objects and food can be better preserved and kept fresh. However, many times we take objects and food from the refrigerator too low temperature to use or eat directly. For example, some foods such as milk or fruits need to be heated to a proper temperature for eating so as not to stimulate intestines and stomach; and some cosmetics such as facial masks are not suitable for being directly applied to the face under the condition of low temperature. Therefore, when the situation is met, heating equipment needs to be searched additionally to reheat the electric heating equipment, so that people can finish the whole set of operation and need different equipment, the purchase cost is increased, the storage space is occupied, and the use is troublesome. Therefore, the refrigeration equipment in the prior art does not have a heating function, which is a technical problem to be solved urgently at present.

SUMMERY OF THE UTILITY MODEL

The application provides a heating system, controlling means and refrigeration plant do not possess the technical problem of heating function in order to solve refrigeration plant.

In order to solve the above technical problem, the present application provides a heating system, including:

the heat insulation module is provided with a first side and a second side which are oppositely arranged, and the heat insulation module is provided with a conduction port penetrating through the first side and the second side;

the semiconductor chip is arranged in the conduction port, and the two opposite surfaces of the semiconductor chip exposed outside the heat preservation module form a refrigerating end and a heating end;

the cold dissipation module is arranged on the first side and connected to the refrigerating end;

the heat dissipation module is arranged on the second side and connected to the heating end;

the heating module comprises a heat conductor, the heat conductor is arranged on the heat dissipation module and extends out of the heat dissipation module, the end part, far away from the heat dissipation module, of the heat conductor is a heating end, the heating end is provided with a bearing surface, and the bearing surface is used for bearing an object to be heated.

The heat dissipation module comprises a radiator and a heat dissipation fan, and an air inlet surface of the heat dissipation fan faces the radiator.

Wherein the heating end is located at one side of the semiconductor chip.

The radiator comprises a bottom plate and radiating fins fixed on or integrally formed on one side of the bottom plate, and the heat conductor is connected with the bottom plate in a heat conduction mode.

The heat-conducting body is fixed in the through hole, and the heat-conducting body is matched with the heat-conducting body to form the heat-conducting body.

The heat radiating module is connected between the heating end and the heat radiating module in a heat conducting mode.

Wherein the heat conductor is a heat pipe.

Wherein, heating system includes: the water receiving tank is at least partially arranged on the bottom sides of the cold radiating module and the heat radiating module and is used for containing condensed water dripped by the cold radiating module;

the water absorbing piece is arranged in the water receiving tank and used for absorbing condensed water and evaporating the condensed water by utilizing the heat dissipation module.

The cooling module is attached to the refrigerating end or attached to the refrigerating end through a heat conducting medium, the heat dissipation module is attached to the heat conducting module or attached to the heat conducting module through the heat conducting medium, the heat conducting module is attached to the heating end or attached to the heating end through the heat conducting medium, and the heat conductor is attached to the heat dissipation module or attached to the heat conducting medium.

Wherein, the heating end comprises a heat transfer tray, and the bearing surface is positioned on the heat transfer tray.

The present application provides a control device for controlling a heating system as described above, comprising:

the induction module is used for inducing whether an object to be heated is placed at the heating end;

and the control module is connected with the induction module and used for starting a heating mode to heat the object to be heated when the object to be heated is detected to be placed at the heating end.

The present application also provides a refrigeration device comprising a heating system as described above or a control device as described above.

Different from the prior art, the beneficial effects of the embodiment of the application are that: the application provides a heating system, controlling means and refrigeration plant, heating system includes heat preservation module, semiconductor chip, the module that looses, radiating module and heating module, the heat preservation module has relative first side and the second side that sets up, the heat preservation module has seted up and has been link up the first side with the switch-on of second side, semiconductor chip locates in the switch-on, semiconductor chip exposes in two relative surface formation system cold end and the end that generates heat outside the heat preservation module, the module that looses locates first side, and connect in system cold end, radiating module locates the second side, and connect in the end that generates heat, heating module includes the heat conductor, the heat conductor is located on the radiating module and stretch out radiating module, the heat conductor is kept away from radiating module's tip is the heating end, the heating end has the face of accepting, the face of accepting is used for accepting the thing, through increased heating module on refrigeration plant's radiating module, has utilized the heat dissipation heat of refrigeration plant itself to carry out the heating to the object, has realized refrigeration plant's heating function.

In addition, the heat wasted by dissipating the heat in the air is utilized, and the power consumption utilization rate of the whole machine is improved; and PTC heating devices do not need to be added, so that the production cost is reduced. For a user, the heating can be completed only by using the additional function of the refrigeration equipment without purchasing an additional heating device for heating, so that the heating is more convenient and faster. In addition, because the temperature of the object to be heated is low, the temperature of the heat dissipation module can be reduced and the heat dissipation efficiency of the heat dissipation module is accelerated due to the connection of the heat conductor and the heat dissipation module; when the object to be heated is not heated, the heat conductor can conduct heat rapidly, the heat dissipation efficiency of the heat dissipation module can be enhanced by utilizing self natural convection, and the refrigeration efficiency of the refrigeration equipment is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:

FIG. 1 is a schematic block diagram of one embodiment of a heating system provided herein;

FIG. 2 is a schematic view of the heating system of the embodiment shown in FIG. 1 from another perspective;

FIG. 3 is a schematic flow chart diagram of a first embodiment of a control method provided herein;

FIG. 4 is a schematic flow chart diagram of a second embodiment of the control method provided in the present application;

FIG. 5 is a schematic flow chart diagram of a third embodiment of the control method provided herein;

FIG. 6 is a schematic flow chart diagram of a fourth embodiment of the control method provided herein;

FIG. 7 is a schematic flow chart diagram illustrating a fifth embodiment of a control method provided herein;

FIG. 8 is a schematic structural diagram of one embodiment of a control device provided herein;

FIG. 9 is a schematic structural diagram of another embodiment of a control device provided herein;

FIG. 10 is a schematic block diagram of one embodiment of a control system provided herein;

FIG. 11 is a schematic block diagram of another embodiment of a control system provided herein;

fig. 12 is a schematic structural diagram of a refrigeration apparatus provided by the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The semiconductor chip refrigeration is selected for use by the refrigeration equipment provided by the application, no refrigerant is needed, the refrigeration equipment can continuously work, no pollution source and no rotating part exist, and no rotation effect is generated. The semiconductor chip refrigeration uses the Peltier effect of the semiconductor, which means that when two different conductors are connected and connected with a DC power supply to form a loop, the phenomenon of heat absorption or heat release occurs at the junction of the two conductors, so that temperature difference is formed at the two ends to realize refrigeration, thus realizing high-precision temperature control by controlling input current, and being easy to realize remote control, program control and computer control by adding temperature detection and control means, thus being convenient to form an automatic control system.

Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of an embodiment of a heating system provided in the present application, and fig. 2 is a schematic structural diagram of the heating system in the embodiment shown in fig. 1 from another perspective.

As shown in fig. 1-2, a heating system 10 is provided herein. The heating system 10 is for a refrigeration appliance. The heating system 10 includes a temperature maintenance module 100 and a semiconductor chip 200. The middle of the heat preservation module 100 is provided with a conduction port penetrating through the left side and the right side. The semiconductor chip 200 is disposed in the via hole 413 and is accommodated in the thermal insulation module 100. The thermal module 100 is made of a material with a low thermal conductivity coefficient, and has the functions of building structural support and temperature isolation. As shown in fig. 1, the left side of the thermal module 100 is a first side forming a cooling space, and the right side is a second side forming a heat dissipation space, where the first side and the second side are opposite to each other. The surface of the semiconductor chip 200 exposed to the first side forms a cooling terminal 210, and the surface exposed to the second side forms a heating terminal 220. The heating system 10 further includes a cooling module 300 and a heat dissipation module 400. The cooling module 300 is disposed on the first side and connected to the refrigerating end 210. The cooling end 210 of the semiconductor chip 200 is connected to the cooling module 300 to gradually absorb heat in the space, so that the temperature in the cooling space is continuously reduced. The heat sink module 400 is disposed on the second side and connected to the heat-generating end 220. The heat-generating end 220 transfers the heat of the refrigerating end 210 to the heat-dissipating module 400, and the heat-dissipating module 400 continuously dissipates the heat to the outside.

In some embodiments, the cooling module 300 and the heat dissipation module 400 are fixedly connected to the thermal module 100 while being connected to the semiconductor chip 200, so as to assemble the components. The fixed connection mode includes but is not limited to riveting, welding, bonding, bolt connection, pin key connection, snap connection, magnetic adsorption and other connection modes.

In the prior art, the purpose of refrigeration is achieved by absorbing heat at the refrigeration end 210 of the semiconductor chip 200, and the heat emitted at the heating end 220 cannot be directly lost in the air, which results in great waste of power consumption of the refrigeration equipment. Thus, in some embodiments provided herein, the heating system 10 further comprises a heating module 500, wherein the heating module 500 comprises a heat conductor 510, and the heat conductor 510 is disposed on the heat dissipation module 400 and extends out of the heat dissipation module 400. The heat conductor 510 increases the heat conduction path on the basis of the heat dissipation module 400, and enhances the heat dissipation efficiency of the heat dissipation module 400 by using the natural convection thereof. Meanwhile, the end of the heat conductor 510 away from the heat dissipation module 400 is a heating end 511, and the heating end 511 has a receiving surface for receiving an object to be heated. The heat to be dissipated by the heat dissipating module 400 itself is used to heat the object, so that the heating function of the refrigeration device is realized, and meanwhile, the PTC heating device does not need to be added, thereby reducing the production cost. In addition, since the temperature of the object to be heated placed on the heating end 511 is low, the temperature of the heat dissipation module 400 can be lowered while the object to be heated is heated by the heating end 511, and the heat dissipation efficiency of the heat dissipation module 400 can be increased; when the object to be heated is not heated, the heat conductor 510 can transfer heat rapidly, so that the heat dissipation efficiency of the heat dissipation module 400 can be enhanced by utilizing the natural convection of the heat conductor, and the refrigeration efficiency of the refrigeration device 1 can be improved.

In some embodiments of the present application, the heat dissipation module 400 includes a heat sink 410 and a heat dissipation fan 420. The air intake surface of the heat dissipation fan 420 faces the heat sink 410. When the cooling fan 420 rotates, the air inlet surface can rapidly absorb the heat of the heat sink 410 and distribute the heat away from the heat sink 410, so as to accelerate the cooling efficiency and further improve the overall cooling efficiency of the cooling device 1.

In some embodiments of the present application, the heat sink 410 includes a base plate 411 and a plurality of heat dissipation fins 412 fixed on one side of the base plate 411. The heat dissipation fins 412 are rectangular or trapezoidal fins. The heat sink 410 is made of a metal material having a high heat transfer coefficient. A plurality of heat dissipating fins 412 may be equidistantly fixed in parallel to the bottom plate 411. The channels formed between the heat dissipation fins 412 are heat dissipation channels. The heat dissipation fan 420 is located on a side of the heat sink 410 away from the semiconductor chip 200, and an air inlet surface of the heat dissipation fan 420 is disposed toward the heat dissipation channel to increase a flowing heat dissipation speed of the heat.

In some embodiments of the present application, a plurality of heat dissipation fins 412 may also be integrally formed on one side of the bottom plate 411, increasing structural stability.

In some embodiments of the present application, the heat conductor 510 is disposed on the bottom plate 411. In order to increase the contact area between the heat conductor 510 and the heat dissipation module 400 and effectively transfer heat, the present embodiment provides a connection manner between the heat conductor 510 and the heat dissipation module 400. The side of the bottom plate 411 having the heat dissipation fins 412 is defined as a first side, and the other side of the bottom plate 411 away from the heat dissipation fins 412 is defined as a second side. The second side face is provided with a first groove, one side of the heat preservation module 100, which is attached to the bottom plate 411, is provided with a second groove corresponding to the first groove, the first groove and the second groove are matched to form a through hole, and the heat conductor 510 is fixed in the through hole, so that the heat conductor 510, the heat preservation module 100, the heat dissipation module 400 and the heat dissipation module 400 are tightly attached to each other, the heat conduction efficiency of the heat conductor 510 is improved, and the heat conductor 510, the heat dissipation module 400 and the heat preservation module 100 are more conveniently detached in the connection mode. A plurality of heat conductors 510 can be fixed on the bottom plate 411, and a plurality of through holes need to be correspondingly formed, and the plurality of heat conductors 510 can be fixed on the bottom plate 411 in parallel at equal intervals, so that the heat conduction effect is more uniform, and the heat dissipation rate of the heat sink is improved; and the heating effect of the bearing surface formed in the way can be more uniform.

In some embodiments, another connection of the heat conductor 510 and the heat dissipation module 400 may be used. If the side of the bottom plate 411 having the heat dissipation fins 412 is set as a first side, and the other side of the bottom plate 411 away from the heat dissipation fins 412 is set as a second side, a third side, a fourth side, a fifth side and a sixth side are adjacent to the first side and the second side and connected end to end, the third side and the fifth side are disposed opposite to each other, and the fourth side are disposed opposite to each other. A through hole penetrating through to a fifth side surface may be opened on the third side surface or a through hole penetrating through to a sixth side surface may be opened on the fourth side surface. The heat conductor 510 is fixed in the through hole, so that the heat conductor 510 and the heat dissipation module 400 are tightly attached. The bottom plate 411 may be formed with a plurality of parallel and equidistant through holes for fixing a plurality of heat conductors 510, thereby increasing the heat dissipation rate of the heat sink, and the heating effect of the receiving surface formed in this way can be more uniform.

It should be noted that, the specific implementation manner of the connection manner of the heat conductor 510 and the heat dissipation module 400 is not limited to the above two, and all other embodiments obtained by a person having ordinary skill in the art without making creative efforts based on the embodiments in the present application belong to the protection scope of the present application.

In some embodiments of the present application, since the heat transfer has directionality, generally the heat is transferred from bottom to top, and the cold is transferred from top to bottom, as shown in fig. 1, the heating end 511 is spatially disposed at a position above the semiconductor chip 200, and the heat of the heating end 511 can be more concentrated, so as to obtain a better heating effect.

In some embodiments of the present application, the heating system 10 further includes a heat conducting module 600, and the heat conducting module 600 is thermally connected between the heat emitting end 220 and the heat dissipating module 400 for more efficiently conducting heat of the semiconductor chip 200 to the heat dissipating module 400. Specifically, the heat conducting module 600 may be a metal block with high heat conductivity. The cross-sectional area of the heat conducting module 600 may be greater than or equal to the cross-sectional area of the semiconductor chip 200, so that the heat generating end 220 of the semiconductor chip 200 is attached to the heat conducting module 600, the heat of the heat generating end 220 is conducted to the heat conducting module 600, and the heat conduction efficiency of the heat conducting module 600 is improved.

In some embodiments of the present application, the heat conducting body 510 may be a heat pipe, and the heat pipe is a phase change process that utilizes a medium to be condensed at a cold end after being evaporated at a hot end, so that heat is rapidly conducted. The heat pipe consists of a pipe shell, a liquid absorption core and an end cover. The interior of the heat pipe is pumped into a negative pressure state and filled with proper volatile liquid with a low boiling point. The tube wall has a wick, which is constructed of a capillary porous material. When one end of the heat pipe is heated, the liquid in the capillary tube is quickly vaporized, the vapor flows to the other end under the power of heat diffusion, and is condensed at the cold end to release heat, and the liquid flows back to the evaporation end along the porous material by the capillary action, so that the circulation is not stopped until the temperatures of the two ends of the heat pipe are equal, and the heat conduction by utilizing the heat pipe is quick and has high efficiency. The heat conductor 510 may be made of other materials with a thermal conductivity similar to that of the heat pipe.

In some embodiments of the present application, when the cooling module 300 cools a specific space, moisture in the space may condense on the surface of the cooling module 300 to form condensed water due to the low temperature of the cooling module 300. As the more the condensed water is accumulated, the condensed water can be condensed into larger water drops or converged into water flow to slide down. In order to prevent the condensed water from dripping to affect the user experience, the heating system 10 further includes a water receiving tank 700, and at least a portion of the water receiving tank 700 is disposed at the bottom side of the cold dissipation module 300 and is used for receiving the condensed water dripping from the cold dissipation module 300. As shown in fig. 1, in an embodiment provided by the present application, the water receiving groove 700 is disposed at a bottom side of the cold dissipation module 300, the thermal insulation module 100, and the heat dissipation module 400, the thermal insulation module 100 abuts against a bottom wall of the water receiving groove 700, the thermal insulation module 100 can divide the water receiving groove 700 into a first area and a second area, the first area is located at a first side of the thermal insulation module 100 and is used for receiving condensed water dropped from the cold dissipation module 300, and the second area is located at a second side of the thermal insulation module 100. The water receiving tank 700 may include a first tank body and a second tank body, which are integrally formed, the first tank body forming a first region, and the second tank body forming a second region. The first trough body is at least partially arranged at the bottom side of the cold dissipating module 300 and used for containing condensed water dropped by the cold dissipating module 300, and the second trough body is at least partially arranged at the bottom side of the heat dissipating module 400 and used for containing the condensed water conveyed from the first trough body.

In some embodiments of the present disclosure, to prevent bacteria from growing due to the condensed water accumulating in the water receiving tank 700, the heating system 10 further includes a water absorbing member 800. The water absorbing member 800 is disposed in the water receiving tank 700 and connected to the bottom wall of the heat insulation module 100 for absorbing condensed water. The absorbent member 800 may be a cotton wool fabric such as sponge or wet ball gauze, absorbent cotton core, hair product, or other absorbent material product, and the absorbent cotton core is taken as an example for illustration in this embodiment. During the use of the refrigerating apparatus 1, it is possible to prevent the growth of bacteria by periodically replacing the water absorbing member 800.

In addition, the condensed water drops and simultaneously carries away part of the cold energy of the cooling module 300. That is, during the cooling operation of the refrigeration apparatus 1, the dropping of the condensed water causes a loss of cooling capacity, resulting in a decrease in cooling efficiency. In order to reduce the waste of the cooling capacity, in some embodiments of the present application, the water absorbing member 800 is configured to extend from the first area to the second area of the water pan, so as to transport the condensed water absorbed by the first area to the second area, and the condensed water transported to the second area can be used to improve the heat dissipation efficiency of the heat dissipation module 400, thereby improving the heat exchange efficiency of the refrigeration apparatus 1.

In some embodiments, the water absorbing member 800 can be set to abut against the top wall of the bottom wall of the heat dissipating module 400, the heat dissipating module 400 and the water absorbing member 800 which are arranged on the second side of the heat insulating module 100 can increase the evaporation rate of the condensed water in the second groove body, so that the condensed water is prevented from accumulating and causing bacterial growth, meanwhile, the temperature of the region where the condensed water is located can be reduced, the heat exchange efficiency of the refrigeration device 1 is further improved, and the waste of cold energy is reduced.

In some embodiments of the present application, in order to improve the refrigeration efficiency and the heat dissipation efficiency of the refrigeration apparatus 1, the cold dissipation module 300 and the refrigeration end 210 are closely attached or attached through a heat conducting medium, the surface of the heat conducting module 600 close to the semiconductor chip 200 is closely attached to the heating end 220 or attached through a heat conducting medium, the surface of the heat conducting module 600 far away from the semiconductor chip 200 is closely attached to the bottom plate 411 of the heat sink 410 or attached through a heat conducting medium, and the surfaces of the heat conductor 510 and the bottom plate 411 are closely attached to the surface of the heat preservation module 100 or attached through a heat conducting medium. The heat-conducting medium can be products with high heat-conducting coefficients such as heat-conducting silicone grease, heat-conducting glue, heat-conducting paste and the like.

Contact surfaces among the cooling module 300, the refrigerating end 210, the heating end 220, the heat conducting module 600, the heat dissipating module 400 and the heat conductor 510 are smooth planes without burrs, so that the end surfaces can be tightly attached to each other, and the working efficiency of the refrigerating device 1 and the heating system 10 can be improved.

In some embodiments of the present application, the heating end 511 includes a heat transfer tray, and the heat transfer tray can make the heat of the heating end 511 more uniform, so that the receiving surface is located on the heat transfer tray, and when an object to be heated is placed on the heat transfer tray, the heating effect is better.

Referring to fig. 3, a first control method for controlling the heating system 10 is provided. For ease of understanding, reference is also made to FIG. 11. The control method comprises the following steps:

step B11: it is detected that an object to be heated is placed at the heating end 511.

In some embodiments, the inductive switch 303 can be used to detect whether an object to be heated is placed on the heating tip 511, and when the inductive switch 303 detects that an object to be heated is placed on the heating tip 511, it triggers and sends a signal to the processor 301. The inductive switch can be a photoresistor, a pressure sensor, an infrared sensor, a microswitch and the like.

Step B12: and starting a heating mode to heat the object to be heated.

In some embodiments, receiving the signal sent by the inductive switch 303, a command to turn on the heating mode may be sent to the integrated circuit and the fan governor to turn on the heating mode to heat the object to be heated.

Specifically, the heating mode is as follows: the power of the semiconductor chip 200 is adjusted to a first predetermined power and/or the rotation speed of the heat dissipation fan 420 is adjusted to a first predetermined rotation speed. After receiving the signal of the inductive switch 303, the processor 301 directly controls the semiconductor chip 200 and/or the heat dissipation fan 420 to start the heating mode, or the processor 301 sends a command to the integrated circuit 307 and/or the fan governor 305 to start the heating mode. The processor 301 or the integrated circuit 307 controls and adjusts the power of the semiconductor chip 200 to the first preset power, so as to increase the heat at the heat-emitting end 220, thereby increasing the heat of the heat-dissipating module 400, increasing the heat at the heating end 511, and improving the heating efficiency of the object to be heated. The processor 301 or the fan speed controller 305 controls and adjusts the rotation speed of the heat dissipation fan 420 from the first preset rotation speed, and reduces the speed of heat dissipation from the heat dissipation module 400 to the outside, so that the heat can be quickly conducted from the self-heating end 220 to the heat dissipation module 400 and the heating end 511, thereby quickly improving the heating efficiency of the heating end 511.

In some embodiments, the heating mode is: the power of the semiconductor chip 200 is increased to a first predetermined power and/or the rotation speed of the heat dissipation fan 420 is decreased to a first predetermined rotation speed. After receiving the signal of the inductive switch 303, the processor 301 directly controls the semiconductor chip 200 and/or the heat dissipation fan 420 to start the heating mode, or the processor 301 sends a command to the integrated circuit 307 and the fan governor 305 to start the heating mode. The processor 301 or the integrated circuit 307 controls to increase the power of the semiconductor chip 200 to the first predetermined power, and further increases the voltage and the current of the heat-emitting terminal 220, that is, the heat at the heat-emitting terminal 220 can be increased, so that the heat of the heat-dissipating module 400 is increased, the heat at the heat-emitting terminal 511 is increased, and the heating efficiency of the object to be heated is improved. Since the radiator fan 420 is initially rotated at a high speed when the heating mode is not turned on, the heat of the radiator module 400 can be rapidly taken away, and thus the heat of the heating terminal 511 is not sufficient to heat the object to be heated to the preset target temperature. Therefore, the processor 301 or the fan speed controller 305 controls and adjusts the rotation speed of the heat dissipation fan 420 from the initial high rotation speed to the low rotation speed at the first predetermined power, so as to reduce the speed of the heat dissipation module 400 for dissipating heat outwards, so that the heat can be quickly conducted from the heat dissipation terminal 220 to the heat dissipation module 400 and the heating terminal 511, thereby quickly improving the heating efficiency of the heating terminal 511.

Referring to fig. 4, in the second control method provided in the present application, after step B12, the control method further includes the following steps:

step B13: the surface temperature of the object to be heated is detected every first preset time.

Specifically, the surface temperature of the object to be heated is detected every first preset time by the temperature sensor 304, and the obtained signal is transmitted to the processor 301. The surface temperature of the object to be heated is timely monitored by the temperature sensor 304 by setting the first preset time, so that the problem that the object to be heated is damaged due to overhigh surface temperature is avoided.

Step B14: judging whether the surface temperature of the object to be heated reaches a preset temperature, if not, returning to the step B12 to start a heating mode to heat the object to be heated; if yes, go on to step B15.

Specifically, the processor 301 receives a signal of the surface temperature of the object to be heated measured by the temperature sensor 304, the processor 301 compares the surface temperature of the object to be heated with a stored preset temperature, and determines whether the surface temperature of the object to be heated reaches the preset temperature, and if the surface temperature of the object to be heated does not reach the preset temperature, the processor 301 sends an instruction to the integrated circuit 307 and the fan speed regulator 305 to continue to return to the heating mode to heat the object to be heated; if the preset temperature is reached, it means that the object to be heated does not need to be heated by the heating end 511 in the continuous heating mode, and the process proceeds to step B15.

Step B15: the heating mode is turned off.

Specifically, if the processor 301 determines that the object to be heated has reached the preset temperature, and the object to be heated does not need to be heated, the processor 301 sends an instruction to the integrated circuit 307 and the fan speed regulator 305, and turns off the heating mode. When the integrated circuit 307 receives the instruction, it triggers the control to adjust the power of the semiconductor chip 200 to the initial power, i.e., the heat at the heat-emitting end 220 is reduced to the initial heat, so that the heat at the heat-dissipating module 400 is reduced to reduce the heat at the heating end 511, and the heat at the heating end 511 is not enough to heat the object to be heated. When the fan speed controller 305 receives the instruction, the fan speed controller 305 triggers and controls the radiator fan 420, adjusts the rotating speed of the radiator fan 420 to return from the low rotating speed in the heating mode to the initial high rotating speed, and increases the speed of the heat dissipation module 400 dissipating heat outwards, so that the heat of the radiator module 400 can be dissipated outwards as soon as possible, and the heat of the heating end 511 is no longer concentrated, and the heat of the heating end 511 cannot be used for heating the object to be heated continuously.

Referring to fig. 5, in a third control method provided in the present application, a third control method is different from the second control method in step B15, and step B15 of the third control method is:

and displaying reminding information, closing a heating mode and starting a heat preservation mode.

Specifically, the processor 301 determines that the object to be heated has reached the preset temperature, and then does not need to continue to heat the object to be heated, and in order to enable the object to be heated, which has been heated to the preset temperature, to be used by the user in time and prevent the temperature of the object to be heated from dropping because the object to be heated is not taken away for a long time and is no longer heated, the processor 301 further sends an instruction to the display 306, and the display 306 can display a reminding message to remind the user that the heating operation is completed and the object to be heated is taken away in time. At the same time, the processor 301 sends commands to the integrated circuit 307 and the fan governor 305 to turn off the heating mode and turn on the keep warm mode.

Specifically, the heat preservation mode has a plurality of embodiments according to the heating mode, specifically:

the first method is as follows: when the heating mode is to adjust the power of the semiconductor chip 200 to the first preset power, the heat preservation mode is to adjust the power of the semiconductor chip 200 to the second preset power, and the second preset power is smaller than the first preset power. The processor 301 or the integrated circuit 307 controls to decrease the power of the semiconductor chip 200, so that the power of the semiconductor chip 200 is decreased from the first predetermined power to the second predetermined power, thereby decreasing the voltage and the current at the two ends of the heat-emitting end 220, i.e. decreasing the heat at the heat-emitting end 220, and decreasing the heating efficiency at the heating end 511 compared with the heating mode, so as to maintain the surface temperature of the object to be heated at the predetermined temperature.

The second method comprises the following steps: when the heating mode is to adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the rotation speed of the cooling fan 420 to a second preset rotation speed, and the second preset rotation speed is greater than the first preset rotation speed. The processor 301 or the fan speed regulator 305 controls to increase the rotation speed of the heat dissipation fan 420, so that the rotation speed of the heat dissipation fan 420 is increased from the first preset rotation speed to the second preset rotation speed, and the speed of heat dissipation from the heat dissipation module 400 is increased compared with the heating mode, so that the heating efficiency at the heating end 511 is reduced compared with the heating mode, and the surface temperature of the object to be heated is maintained at the preset temperature.

The third method comprises the following steps: when the heating mode is to adjust the power of the semiconductor chip 200 to a first preset power and adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the power of the semiconductor chip 200 to a second preset power, the second preset power is smaller than the first preset power, and the rotation speed of the cooling fan 420 is maintained to be the first preset rotation speed. The processor 301 or the integrated circuit 307 controls to decrease the power of the semiconductor chip 200, so as to decrease the voltage and current at the heating terminal 220, i.e. decrease the heat at the heating terminal 220, so that the heating efficiency at the heating terminal 511 is lower than that in the heating mode, so as to maintain the surface temperature of the object to be heated at the preset temperature.

The method is as follows: when the heating mode is to adjust the power of the semiconductor chip 200 to a first preset power and adjust the rotation speed of the heat dissipation fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the rotation speed of the heat dissipation fan 420 to a second preset rotation speed, the second preset rotation speed is greater than the first preset rotation speed, and the power of the semiconductor chip 200 is maintained to be the first preset power. The processor 301 or the fan governor 305 controls to increase the rotation speed of the heat dissipation fan 420, and increase the speed at which the heat dissipation module 400 radiates heat outward compared to the heating mode, so that the heating efficiency at the heating end 511 is decreased compared to the heating mode, so that the surface temperature of the object to be heated is maintained at the preset temperature.

The fifth mode is as follows: when the heating mode is to adjust the power of the semiconductor chip 200 to a first preset power and adjust the rotation speed of the cooling fan 420 to a first preset rotation speed, the heat preservation mode is to adjust the power of the semiconductor chip 200 to a second preset power and adjust the rotation speed of the cooling fan 420 to a second preset rotation speed, the second preset power is smaller than the first preset power, and the second preset rotation speed is greater than the first preset rotation speed. The processor 301 or the integrated circuit 307 controls the power of the semiconductor chip 200 to be reduced, so as to reduce the voltage and current across the heat-emitting terminal 220, i.e. reduce the heat at the heat-emitting terminal 220, thereby reducing the heat obtained by the heat-receiving terminal 511. The processor 301 or the fan governor 305 controls to increase the rotation speed of the heat dissipation fan 420, and increases the speed of the heat dissipation module 400 for dissipating heat outwards compared with the heating mode. By the adjustment of the semiconductor chip 200 and the heat dissipation fan 420, the heating efficiency at the heating end 511 is lowered compared to that in the heating mode, so that the surface temperature of the object to be heated is maintained at the preset temperature.

Referring to fig. 6, in a fourth control method provided in the present application, after step B15, the control method further includes the following steps:

b16: detecting whether an object to be heated is placed at the heating end 511 every second preset time, if not, continuing the step B17; if yes, returning to the step B15 to display the reminding information, closing the heating mode and opening the heat preservation mode.

Specifically, in order to prevent the heat to be heated from being taken away, but the heat preservation mode is still turned on, which causes the heat of the heat-emitting end 220 to be continuously increased, and the heat-dissipating fan 420 cannot dissipate the heat in time, so that the heat is accumulated in the heat-dissipating module 400, and further the cooling efficiency of the cooling end 210 is affected, which causes a problem of low cooling efficiency. The setting induction switch 303 thus detects whether an object to be heated is placed at the heating tip 511 every second preset time, and sends the obtained signal to the processor 301. When the processor 301 receives the signal from the inductive switch 303, it makes a decision and sends a command to the display 306, the integrated circuit 307, and the fan governor 305. When the signal obtained by the processor 301 indicates that the object to be heated is still at the heating end 511, the display 306 continues to display the reminding message to prompt the user to take the object to be heated away in time, and simultaneously the integrated circuit 307 and the fan speed regulator 305 control the semiconductor chip 200 and the heat dissipation fan 420 to continue to maintain the heat preservation mode and maintain the surface temperature of the object to be heated at the preset temperature. When the processor 301 obtains a signal that the object to be heated has been removed and is not at the heating tip 511, it sends a command to the integrated circuit 307 and the fan governor 305 to continue with step 17.

B17: and closing the heat preservation mode.

Specifically, when the processor 301 obtains the information that the heating end 511 does not have the object to be heated, it is not necessary to continuously provide heat to the heating end 511, and it is necessary to turn off the heat preservation mode, and restore the power of the semiconductor chip 200 and the rotation speed of the cooling fan 420 to the initial state, so that heat is effectively dissipated, thereby preventing the problem that the cooling efficiency of the cooling end 210 is affected by heat accumulated in the cooling module 400, and saving power consumption. The processor 301 sends commands to the integrated circuit 307 and the fan governor 305. When receiving the instruction sent by the processor 301, the integrated circuit 307 triggers and controls to reduce the power of the semiconductor chip 200, and then reduces the voltage and current of the heat-emitting terminal 220, that is, the heat at the heat-emitting terminal 220 can be reduced, so that the heat at the heat-dissipating module 400 is reduced, and the heat at the heating terminal 511 is reduced, so that the heat at the heating terminal 511 is not enough to heat the object to be heated. When receiving the instruction sent by the processor 301, the fan speed controller 305 triggers and adjusts the lower rotation speed of the cooling fan 420 in the self-heat-preservation mode to return to the initial high rotation speed, and increases the speed of the heat dissipation module 400 for dissipating heat outwards, so that the heat of the cooling module 400 can be dissipated outwards as soon as possible, and the heat of the heating end 511 is no longer concentrated, and the heat of the heating end 511 cannot be used for heating the object to be heated continuously.

Referring to fig. 7, in a fifth control method provided in the present application, before step B11, the control method further includes the following steps:

b10: the door opening action of the refrigeration equipment 1 is detected.

Specifically, in some embodiments, the sensing switch 303 needs to be turned on to perform the sensing detection on the heating terminal 511, and the sensing switch 303 needs to be powered on all the time, which is more power consuming. The present application provides a specific embodiment, and the inductive switch 303 is set to be powered on and activated when receiving an instruction sent by the processor 301. When the refrigeration device 1 is opened, a signal is sent to the processor 301, the processor 301 receives the signal and sends an instruction to the inductive switch 303, and the inductive switch 303 is activated and turned on. When the sensing switch 303 does not detect that the object to be heated is placed at the heating end 511 for a while, the sensing switch 303 is powered off again, and enters a standby state. This way the power consumption of the refrigeration device 1 can be saved.

Referring to fig. 8, the present application further provides a control device 20, where the control device 20 includes a sensing module 201 and a control module 202. For ease of understanding, reference is also made to FIG. 11.

Wherein the sensing module 201 is used for sensing and detecting the object to be heated of the heating end 511.

Specifically, the inductive switch 303 may be used to detect whether an object to be heated is placed at the heating end 511, and when the inductive switch 303 detects that an object to be heated is placed at the heating end 511, it triggers and sends a signal to the processor 301. The temperature sensor 304 can also be used for detecting the surface temperature of the object to be heated at intervals of a first preset time, and transmitting the obtained signal to the processor 301, so as to monitor the surface temperature of the object to be heated in time, and avoid the problem that the surface temperature of the object to be heated is too high and is damaged because the heating end 511 continuously heats the object to be heated.

Referring to fig. 9, in some embodiments of the present application, the control module 202 further includes a fan module 2021, a timing module 2022, a reminder module 2023, and a semiconductor module 2024.

The fan module 2021 is used for adjusting the rotation speed of the heat dissipation fan 420.

Specifically, the processor 301 may be used to control and adjust the rotational speed of the heat dissipation fan 420 or the fan governor 305 may be used to control the rotational speed of the heat dissipation fan 420. When in the heating mode, the processor 301 or the fan governor 305 adjusts the cooling fan 420 to a low speed, and reduces the speed of the heat dissipation to the outside, thereby rapidly increasing the heat of the heat dissipation module 400 and the heating terminal 511. When in the heat-preservation mode, the processor 301 or the fan speed controller 305 adjusts the cooling fan 420 to a lower rotation speed, and slowly reduces the outward cooling speed, so as to maintain the heat of the cooling module 400 and the heating terminal 511 at a predetermined level. When the heating mode is turned off or the heat-preserving mode is turned off, the processor 301 or the fan governor 305 adjusts the heat dissipation fan 420 to a high rotation speed, and increases the speed at which heat is dissipated outward, thereby rapidly reducing the heat of the heat dissipation module 400 and the heat of the heating terminal 511, which cannot function to heat an object.

The reminding module 2023 is used for displaying reminding information.

Specifically, the display 306 may be used to display a warning message to prompt the user to take away the object to be heated in time. On one hand, the user can know the completion condition of the heating work in time and take the object to be heated in time; on the other hand, when the user knows that the heating operation is completed and then takes away the object to be heated in time, the inductive switch 303 can detect the situation that the object to be heated is taken out from the heating terminal 511 in time, and then sends a signal to the processor 301, and the processor 301 sends an instruction to adjust the power of the semiconductor chip 200 and the rotating speed of the cooling fan 420 to close the heating mode or close the heat preservation mode in time, so that the power consumption of the refrigeration device 1 is saved. The display 306 may provide a reminder effect through voice prompts and/or visual prompts.

The semiconductor module 2024 is used to control the heat at the heat emitting end 220.

Specifically, the power of the semiconductor chip 200 may be controlled by the integrated circuit 307 to adjust the heat at the heat-emitting end 220, and when the heat-emitting end is in the heating mode, the integrated circuit 307 controls to increase the power of the semiconductor chip 200, and then increases the voltage and the current at the two ends of the heat-emitting end 220, that is, the heat at the heat-emitting end 220 may be increased, so that the heat of the heat-dissipating module 400 is increased to increase the heat at the heating end 511, and the heating efficiency of the object to be heated is improved. When in the heat-preservation mode, the integrated circuit 307 controls to slightly increase the power of the semiconductor chip 200, so that the heat-emitting end 220 increases less heat than the heat-emitting end 220 in the heating mode, thereby maintaining the heat of the heating end 511 at a preset level. When the heating mode or the heat preservation mode is turned off, the integrated circuit 307 controls to reduce the power of the semiconductor chip 200 to the initial power, and continues to reduce the heat at the heat emitting end 220, so that the heat of the heat dissipation module 400 is reduced, so that the heat at the heating end 511 is reduced, and the heat at the heating end 511 is not enough to continue to heat the object to be heated.

The timing module 2022 is configured to time the first preset time and the second preset time.

Specifically, the first preset time and the second preset time may be counted by a timer 308. After the heating mode is started, the processor 301 sends an instruction to the timer 308 to start timing for a first preset time, when the timing is completed, the timer 308 sends a signal to the processor 301, and the processor 301 sends an instruction to the temperature sensor 304 to start detecting the surface temperature of the object to be heated. When the heating mode is turned off and the heat preservation mode is turned on, the processor 301 sends an instruction to the timer 308 to start timing for a second preset time, when the timing is completed, the timer 308 sends a signal to the processor 301, and the processor 301 sends an instruction to the inductive switch 303 to detect whether an object to be heated is placed at the heating end 511.

The present application also provides a medium. Stored on the medium are a plurality of instructions adapted to be loaded by the processor 301 to perform the control method as previously described.

Referring to fig. 10, the present application further provides a control system 30, where the control system 30 includes a processor 301 and a memory 302.

The processor 301 is a control center of the control system 30, connects various parts of the entire control system 30 by using various interfaces and lines, and performs various functions of the control system 30 and processes data by running or loading an application program stored in the memory 302 and calling data stored in the memory 302, thereby performing overall monitoring of the control system 30.

In this embodiment, the processor 301 in the control system 30 loads instructions corresponding to processes of one or more application programs into the memory 302 according to the following steps, and the processor 301 runs the application programs stored in the memory 302, so as to implement various functions:

it is detected that the object to be heated is placed at the heating end 511;

and starting a heating mode to heat the object to be heated.

In some embodiments, after the step of turning on the heating mode to heat the object to be heated, the processor 301 may further perform:

detecting the surface temperature of an object to be heated every first preset time;

judging whether the surface temperature of the object to be heated reaches a preset temperature, if not, returning to the step of executing the starting heating mode to heat the object to be heated; if so, the heating mode is turned off.

In some embodiments, when the processor 301 determines whether the surface temperature of the object to be heated reaches the preset temperature, and the result is yes, the processor 301 may further perform:

and displaying reminding information, closing a heating mode and starting a heat preservation mode.

In some embodiments, after judging whether the surface temperature of the object to be heated reaches a preset temperature, if not, returning to the step of executing the starting heating mode to heat the object to be heated; if yes, displaying a reminding message, turning off the heating mode, and after turning on the heat preservation mode, the processor 301 may further perform:

detecting whether an object to be heated is placed at the heating end 511 every second preset time, and if not, closing the heat preservation mode; if yes, returning to execute the display reminding information, closing the heating mode and starting the heat preservation mode.

In some embodiments, before the step of detecting that an object to be heated is placed at the heating end 511, the processor 301 may further perform:

the door opening action of the refrigeration equipment 1 is detected.

The memory 302 may be used to store applications and data. The memory 302 stores programs containing instructions executable in the processor 301. The programs may constitute various functional modules. The processor 301 executes various functional applications and data processing by executing programs stored in the memory 302.

Referring to fig. 11, the control system 30 further includes a sensing switch 303. The inductive switch 303 is used to detect whether an object to be heated is placed in the placement groove 401 and transmit the obtained signal to the processor 301. The inductive switch 303 may be disposed on the heat sink 410. The inductive switch 303 may be a photo-resistor, and when the object to be heated is placed at the heating end 511, the photo-resistor detects that the optical fiber has a sudden change, and the resistance of the optical fiber has a corresponding sudden change, and then a signal can be output to the processor 301. The inductive switch 303 may also be a micro switch, and an object to be heated is placed on the heating end 511, and the micro switch is toggled, so as to transmit a signal to the processor 301. The inductive switch 303 may be replaced by a pressure sensor, an infrared sensor, or other switch that can trigger the signal.

The control system 30 also includes a temperature sensor 304. The temperature sensor 304 is used to detect the temperature of the surface of the object to be heated and to transmit the obtained signal to the processor 301. The temperature sensor 304 may be an infrared temperature sensing probe, which is disposed on the heat sink 410, and executes a command for detecting the temperature of the surface of the object to be heated when receiving a command from the processor 301 every first preset time.

The control system 30 also includes a display 306. The display 306 is used for displaying reminding information to remind a user that the heating work is finished and the object to be heated is taken away in time. The display 306 may use visual cues, such as a display screen to display reminder text, or a signal light to convey reminder information. The display 306 can also use auditory cue, for example, a loudspeaker is used for sending out reminding information, so that the user can receive the reminding information in time when not near the refrigeration equipment, the user can be prevented from forgetting the object to be heated so that the object to be heated is retained at the heating end 511, and the user can be reminded to take away the object to be heated in time when the user is convenient to take the object.

The control system 30 also includes a timer 308. The timer 308 is configured to time a first preset time and a second preset time. The timer 308 starts the timing operation when receiving the timing instruction sent by the processor 301, and transmits a signal to the processor 301 in time after the timing operation is completed. In some embodiments, the first preset time and the second preset time may also be counted in the internet through a wired network or a wireless network, or other associated devices.

The control system 30 also includes a fan governor 305. The fan governor 305 is used to adjust the rotational speed of the heat dissipation fan 420. When the heating mode is on, the fan governor 305 controls to decrease the rotation speed of the heat dissipation fan 420 from a high rotation speed to a low rotation speed; when the heat preservation mode is started, the fan speed controller 305 controls to increase the rotating speed of the heat dissipation fan 420 from a low rotating speed to a lower rotating speed; when the heating mode is off and the keeping warm mode is off, the fan governor 305 controls to increase the rotation speed of the radiator fan 420 from a low rotation speed to a high rotation speed. The heat dissipation efficiency of the heat dissipation module 400 is controlled by adjusting the rotation speed of the heat dissipation fan 420.

The control system 30 further comprises an integrated circuit 307. The integrated circuit 307 is used for controlling and regulating the power of the semiconductor chip 200. When the heating mode is turned on, the integrated circuit 307 controls to increase the voltage and current of the heating terminal 220 of the semiconductor chip 200, i.e. the heat at the heating terminal 220 is increased; when the heat preservation mode is started, the integrated circuit 307 controls to reduce the power of the semiconductor chip 200 when compared with the heating mode, that is, the heat at the heat-emitting end 220 can be maintained at a preset level; when the heating mode is off and the holding mode is off, the integrated circuit 307 controls to reduce the power of the semiconductor chip 200 to the initial state.

In the present application, the memory 302 stores a value of a preset temperature that is set, and the processor 301 compares the obtained surface temperature of the object to be heated with the preset temperature to determine to execute the next instruction. The preset temperature can be adjusted by user according to the user's needs, and generally, the default setting of the preset temperature is 40 ℃ under the condition that the preset temperature is not customized.

In this application, the memory 302 stores a value of the first preset time and a value of the second preset time, and the processor 301 sends an instruction to the timer 308 according to the first preset time and the second preset time set by the memory 302. In order to prevent the surface temperature of the object to be heated from being higher than the preset temperature due to the fact that the heating mode is opened for too long time, the first preset time is generally set to be 5 seconds. In order to avoid the situation that the object is removed, but the heating mode/the heat preservation mode is switched on, so that heat is accumulated in the heat dissipation module 400, and the cooling effect of the cooling end 210 is affected, the second preset time is generally set to be 5 seconds.

Referring to fig. 12, the present application further provides a refrigeration apparatus 1. The refrigeration appliance 1 comprises a heating system 10 as described above or a control device 20 as described above.

Specifically, the refrigeration device 1 further includes a housing 40, the housing 40 is enclosed to form an accommodating cavity 50, and the heating system 10 may be installed on any one side plate of the housing 40, so that the heat dissipation module 400 is installed on the housing 40 and the cold dissipation module 300 is installed in the accommodating cavity 50, thereby ensuring the refrigeration function and the heat dissipation function of the refrigeration device 1. The refrigeration device 1 further comprises a control system 30 as previously described. Wherein, the housing 40 may be made of heat insulating material or provided with heat insulating layer. In some embodiments, the thermal module 100 may be part of the housing 40.

In some embodiments, the refrigeration device 1 is a refrigerator, and the upper surface of the exterior of the refrigerator may be directly connected to the heating end 511, and the upper surface of the refrigerator may be used as a receiving surface. When the object to be heated is taken out of the refrigerator, the object to be heated can be directly placed on the upper surface of the refrigerator, i.e., the object to be heated can be heated by the heating tip 511.

The application provides a heating system, controlling means and refrigeration plant, through increased heating module on refrigeration plant's heat dissipation module, has realized refrigeration plant's heating function. The heat dissipation heat of the refrigeration equipment is utilized to heat the object, the heat wasted by dissipating the heat in the air is utilized, and the power consumption utilization rate of the whole machine is improved; and PTC heating devices do not need to be added, so that the production cost is reduced. For a user, the heating can be completed only by using the additional function of the refrigeration equipment without purchasing an additional heating device for heating, so that the heating is more convenient and faster. In addition, because the temperature of the object to be heated is low, the temperature of the heat dissipation module can be reduced and the heat dissipation efficiency of the heat dissipation module is accelerated due to the connection of the heat conductor and the heat dissipation module; when the object to be heated is not heated, the heat conductor can conduct heat rapidly, and natural convection of the heat conductor can be utilized to enhance the heat dissipation efficiency of the heat dissipation module, so that the refrigeration efficiency of the refrigeration equipment is improved.

The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes performed by the content of the present specification and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (12)

1. A heating system for a refrigeration appliance, characterized by: comprises that

The heat insulation module is provided with a first side and a second side which are oppositely arranged, and the heat insulation module is provided with a conduction port penetrating through the first side and the second side;

the semiconductor chip is arranged in the conduction port, and the two opposite surfaces of the semiconductor chip exposed outside the heat preservation module form a refrigerating end and a heating end;

the cold dissipation module is arranged on the first side and connected to the refrigerating end;

the heat dissipation module is arranged on the second side and connected to the heating end;

the heating module comprises a heat conductor, the heat conductor is arranged on the heat dissipation module and extends out of the heat dissipation module, the end part, far away from the heat dissipation module, of the heat conductor is a heating end, the heating end is provided with a bearing surface, and the bearing surface is used for bearing an object to be heated.

2. The heating system of claim 1, wherein the heat dissipation module comprises a heat sink and a heat dissipation fan, and an air inlet surface of the heat dissipation fan faces the heat sink.

3. The heating system of claim 1, wherein the heating tip is located on a side of the semiconductor chip.

4. The heating system of claim 2, wherein the heat sink comprises a base plate and a heat dissipating fin secured to or integrally formed on one side of the base plate, the heat conductor being thermally coupled to the base plate.

5. The heating system of claim 4, wherein a first groove is formed on a side of the bottom plate away from the heat dissipation fins, a second groove corresponding to the first groove is formed on the heat preservation module, the first groove and the second groove cooperate to form a through hole, and the heat conductor is fixed in the through hole.

6. The heating system of claim 1, further comprising a heat conducting module thermally coupled between the heat generating end and the heat dissipating module.

7. The heating system of claim 1, wherein the heat conductor is a heat pipe.

8. The heating system of claim 1, comprising:

the water receiving tank is at least partially arranged at the bottom sides of the cold dissipation module and the heat dissipation module and is used for containing condensed water dripped by the cold dissipation module;

the water absorbing piece is arranged in the water receiving tank and used for absorbing condensed water and evaporating the condensed water by utilizing the heat dissipation module.

9. The heating system of claim 6, wherein the cooling module is attached to the cooling end or attached to the cooling end through a heat conducting medium, the heat dissipating module is attached to the heat conducting module or attached to the heat conducting end through a heat conducting medium, the heat conducting module is attached to the heat generating end or attached to the heat conducting end through a heat conducting medium, and the heat conductor is attached to the heat dissipating module or attached to the heat conducting end through a heat conducting medium.

10. The heating system of claim 1, wherein said heating end includes a heat transfer tray, said receiving surface being located on said heat transfer tray.

11. A control device for controlling a heating system according to any one of claims 1-10, comprising:

the induction module is used for inducing whether an object to be heated is placed at the heating end;

and the control module is connected with the induction module and used for starting a heating mode to heat the object to be heated when the object to be heated is detected to be placed at the heating end.

12. A refrigeration device comprising a heating system as claimed in any one of claims 1 to 10 or a control as claimed in claim 11.

Images