CN117423488A - Layered composite conductive material, and preparation method and application thereof - Google Patents
Layered composite conductive material, and preparation method and application thereof Download PDFInfo
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- CN117423488A CN117423488A CN202311512583.1A CN202311512583A CN117423488A CN 117423488 A CN117423488 A CN 117423488A CN 202311512583 A CN202311512583 A CN 202311512583A CN 117423488 A CN117423488 A CN 117423488A
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- 239000002131 composite material Substances 0.000 title claims abstract description 87
- 239000004020 conductor Substances 0.000 title claims abstract description 80
- 238000002360 preparation method Methods 0.000 title abstract description 14
- 239000000843 powder Substances 0.000 claims abstract description 80
- 239000002952 polymeric resin Substances 0.000 claims abstract description 31
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 31
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000006247 magnetic powder Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 69
- 239000000463 material Substances 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 17
- 239000000376 reactant Substances 0.000 claims description 15
- 229920002379 silicone rubber Polymers 0.000 claims description 12
- 238000004100 electronic packaging Methods 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229910000531 Co alloy Inorganic materials 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- -1 iron-silicon-aluminum Chemical compound 0.000 claims description 5
- 230000001788 irregular Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000009849 vacuum degassing Methods 0.000 claims description 5
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000005007 epoxy-phenolic resin Substances 0.000 claims description 4
- 239000000696 magnetic material Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 4
- 150000002910 rare earth metals Chemical class 0.000 claims description 4
- 230000003068 static effect Effects 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910000676 Si alloy Inorganic materials 0.000 claims description 3
- QVYYOKWPCQYKEY-UHFFFAOYSA-N [Fe].[Co] Chemical compound [Fe].[Co] QVYYOKWPCQYKEY-UHFFFAOYSA-N 0.000 claims description 3
- KCZFLPPCFOHPNI-UHFFFAOYSA-N alumane;iron Chemical compound [AlH3].[Fe] KCZFLPPCFOHPNI-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- QJVKUMXDEUEQLH-UHFFFAOYSA-N [B].[Fe].[Nd] Chemical compound [B].[Fe].[Nd] QJVKUMXDEUEQLH-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229910001172 neodymium magnet Inorganic materials 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 230000005415 magnetization Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000007792 addition Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
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- 238000004220 aggregation Methods 0.000 description 3
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- 230000008569 process Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
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- 229910001339 C alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229910000756 V alloy Inorganic materials 0.000 description 1
- VDGMIGHRDCJLMN-UHFFFAOYSA-N [Cu].[Co].[Ni] Chemical compound [Cu].[Co].[Ni] VDGMIGHRDCJLMN-UHFFFAOYSA-N 0.000 description 1
- WBWJXRJARNTNBL-UHFFFAOYSA-N [Fe].[Cr].[Co] Chemical compound [Fe].[Cr].[Co] WBWJXRJARNTNBL-UHFFFAOYSA-N 0.000 description 1
- ABEXMJLMICYACI-UHFFFAOYSA-N [V].[Co].[Fe] Chemical compound [V].[Co].[Fe] ABEXMJLMICYACI-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KPLQYGBQNPPQGA-UHFFFAOYSA-N cobalt samarium Chemical compound [Co].[Sm] KPLQYGBQNPPQGA-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- GOECOOJIPSGIIV-UHFFFAOYSA-N copper iron nickel Chemical compound [Fe].[Ni].[Cu] GOECOOJIPSGIIV-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- XMNVMZIXNKZAJB-UHFFFAOYSA-N iron(3+);lead(2+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Fe+3].[Fe+3].[Pb+2].[Pb+2] XMNVMZIXNKZAJB-UHFFFAOYSA-N 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/0027—Thick magnetic films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
- H01F1/04—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys
- H01F1/06—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/08—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/083—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together in a bonding agent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
- H01F1/09—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials mixtures of metallic and non-metallic particles; metallic particles having oxide skin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present disclosure provides a layered composite conductive material, wherein the layered composite conductive material is prepared from the following components in volume ratio: soft magnetic conductive powder accounting for 0.2 to 30 percent of the total volume fraction, hard magnetic powder accounting for 0 to 3 percent of the total volume fraction, and polymer resin accounting for 67 to 99.8 percent of the total volume fraction and a corresponding curing agent thereof; wherein the mass ratio of the polymer resin to the curing agent is 100-1000%. The disclosure also provides a preparation method and application of the layered composite conductive material based on the rotating magnetic field method.
Description
Technical Field
The present disclosure relates to a layered composite conductive material and a method for preparing the same, and more particularly, to a layered composite conductive material and a method for preparing the same, which can be used in the fields of electrical interconnection and electronic packaging of flexible flat cables.
Background
The electronic packaging material is a substrate material for carrying electronic components and interconnection lines thereof, has the functions of mechanical support, environmental protection, heat dissipation of the electronic components and the like, has good electrical insulation, and is a sealing body of an integrated circuit.
With the development of electronic product precision and portability and the increasing requirements of industrial application on electronic interconnection technology, the conventional tin-lead welding process is more difficult to meet the requirements of small space or micro-space interconnection, and the favored anisotropic conductive adhesive is considered as the most promising novel packaging material. The anisotropic conductive adhesive is conductive adhesive for packaging electronic components, and has the functions of vertical conduction, parallel non-conduction, conduction and gluing fixation.
In the related art, a plurality of anisotropic conductive adhesive films are obtained by controlling the volume fraction of conductive filler or simply physically stacking conductive and insulating materials, and the anisotropic conductive adhesive films are cured at a specific time and temperature in practical application, so that the materials have a series of defects of poor conductive performance, unstable storage, complex production process, high cost and the like.
Therefore, from a new mechanism, developing the anisotropic conductive material with high performance and practicability has great significance and wide application prospect.
Disclosure of Invention
In view of this, in order to solve at least one technical problem in the related art and other aspects, the present disclosure proposes a layered composite conductive material, wherein the layered composite conductive material is prepared from the following components in volume ratio: soft magnetic conductive powder accounting for 0.2 to 30 percent of the total volume fraction, hard magnetic powder accounting for 0 to 3 percent of the total volume fraction, and polymer resin accounting for 67 to 99.8 percent of the total volume fraction and a corresponding curing agent thereof; wherein the mass ratio of the polymer resin to the curing agent is 100-1000%.
According to an embodiment of the present disclosure, a structure of a layered composite conductive material includes a conductive layer whose composition includes the soft magnetic conductive powder and the hard magnetic powder, and an insulating layer whose composition includes the polymer resin and the curing agent. Wherein the soft magnetic conductive powder and the hard magnetic powder are bonded by a polymer resin.
According to embodiments of the present disclosure, the interlayer spacing of the conductive layer ranges from 0.025mm to 2mm.
According to an embodiment of the present disclosure, the soft magnetic conductive powder includes any one of iron, cobalt, nickel, iron-silicon alloy, iron-aluminum alloy, iron-silicon-aluminum alloy, iron-cobalt alloy, nickel-iron alloy, and soft magnetic ferrite with or without a plating layer;
according to an embodiment of the present disclosure, the hard magnetic conductive powder includes any one of rare earth hard magnetic material, metal hard magnet, hard magnetic ferrite with or without plating;
according to an embodiment of the present disclosure, the high polymer resin includes any one of silicone rubber, polyurethane, epoxy resin, phenolic resin, and vinyl resin.
According to embodiments of the present disclosure, the plating material includes gold, silver, copper, nickel, aluminum.
According to an embodiment of the present disclosure, the shape of the soft magnetic conductive powder is one of a sphere, an irregular shape, and a sheet.
The disclosure also provides a preparation method of the layered composite conductive material based on the rotating magnetic field method, which comprises the following steps:
uniformly mixing high polymer resin and a curing agent according to a proportion, then adding soft magnetic conductive powder and hard magnetic conductive powder, uniformly mixing to obtain a reactant, vacuum degassing the reactant, and sealing;
and placing the sealed reactant in a rotating magnetic field, and curing to obtain the layered composite conductive material.
According to embodiments of the present disclosure, the rotating magnetic field is generated by electromagnet or magnet rotation, or is equivalently obtained by rotation of the reactants in a static magnetic field.
According to the embodiment of the disclosure, the rotating speed of the rotating magnetic field is 30-1200 rpm, and the magnetic field size of the rotating magnetic field is 50-1000 mT.
The present disclosure also proposes a field of application of the above layered composite conductive material, including electrical interconnects or electronic packaging.
According to the embodiment of the disclosure, the layered composite conductive material is formed by a rotating magnetic field method, and the proper components of the layered composite conductive material are formed to enable internal magnetic conductive powder to be gathered in a layered manner, so that the layered composite conductive material shows a clear macroscopic appearance in which conductive layers and insulating layers alternately appear. The internal structure enables the layered composite conductive material to have ultrahigh anisotropic electric conductivity, heat conductivity and excellent electromagnetic shielding performance.
Drawings
FIG. 1 is a flow chart of a method of preparing a layered composite conductive material in an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a rotating magnetic field device in an embodiment of the present disclosure;
FIG. 3 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 1 of the present disclosure;
FIG. 4 is a conductivity histogram of the XYZ axes of the layered composite conductive material in example 1 of the present disclosure;
FIG. 5 is a diagram of an experimental apparatus for applying a layered composite conductive material to the field of chip mounting in example 1 of the present disclosure;
FIG. 6 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 2 of the present disclosure;
FIG. 7 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 3 of the present disclosure;
FIG. 8 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 4 of the present disclosure;
FIG. 9 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 5 of the present disclosure;
FIG. 10 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 6 of the present disclosure;
FIG. 11 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 7 of the present disclosure;
FIG. 12 is an optical photograph of a Z-axis cross section of a layered composite conductive material of example 8 of the present disclosure, wherein FIG. a is a physical drawing of the Z-axis cross section of the layered composite conductive material, and FIG. b is a partial enlarged view of the Z-axis cross section of the layered composite conductive material;
fig. 13 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 9 of the present disclosure.
Detailed Description
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
The endpoints of the ranges and any values disclosed in this disclosure are not limited to the precise range or value, and such range or value should be understood to encompass values approaching those range or value. For numerical ranges, one or more new numerical ranges may be obtained in combination with each other between the endpoints of each range, between the endpoint of each range and the individual point value, and between the individual point value, and are to be considered as specifically disclosed in this disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The terms "comprises," "comprising," and/or the like, as used herein, specify the presence of stated features, steps, operations, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, or components.
All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. It should be noted that the terms used herein should be construed to have meanings consistent with the context of the present specification and should not be construed in an idealized or overly formal manner.
Like elements are denoted by like or similar reference numerals throughout the drawings. Conventional structures or constructions will be omitted when they may obscure the understanding of this disclosure. And the shape, size and position relation of each component in the figure do not reflect the actual size, proportion and actual position relation. In addition, in the present disclosure, any reference signs placed between parentheses shall not be construed as limiting the disclosure.
Similarly, in the foregoing description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. The description of the reference to the terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The traditional laminar conductive composite material needs to carry out deposition or growth process on each layer respectively, which makes the preparation process complex, the production period long and the process precision requirement on each layer of the material high. In the method, the magnetic powder is layered in the magnetic field by a rotating magnetic field method, so that the operation is simple and convenient, and the anisotropic conductive performance of the material is excellent. The soft magnetic conductive powder can reach magnetization saturation in a very small magnetic field, and the same rotation speed is difficult to ensure with the magnetic field in a rotating magnetic field, so that layering aggregation occurs; the hard magnetic powder will reach saturation in a larger magnetic field, and its magnetization is higher than that of the soft magnetic powder, so that it will be locked by the magnetic field and will rotate at the same speed as the magnetic field.
The present disclosure provides a layered composite conductive material, wherein the layered composite conductive material is prepared from the following components in volume ratio: soft magnetic conductive powder accounting for 0.2 to 30 percent of the total volume fraction, hard magnetic powder accounting for 0 to 3 percent of the total volume fraction, and polymer resin accounting for 67 to 99.8 percent of the total volume fraction and a corresponding curing agent thereof; wherein the mass ratio of the polymer resin to the curing agent is 100-1000%.
According to the embodiments of the present disclosure, the volume fractions of the soft magnetic conductive powder and the hard magnetic conductive powder need to be limited to a given range, otherwise it is difficult to obtain a conductive polymer composite material of a layered structure.
According to the embodiment of the disclosure, the layered composite conductive material has ultra-high anisotropic conductive performance and excellent electromagnetic shielding performance, and the conductivity is as high as 5×10 4 S/m。
According to the embodiment of the disclosure, the layered composite conductive material is formed by a rotating magnetic field method, and the proper components of the layered composite conductive material are formed to enable internal magnetic conductive powder to be gathered in a layered manner, so that the layered composite conductive material shows a clear macroscopic appearance in which conductive layers and insulating layers alternately appear. The internal structure enables the layered composite conductive material to have ultrahigh anisotropic electric conductivity, heat conductivity and excellent electromagnetic shielding performance.
According to an embodiment of the present disclosure, a structure of a layered composite conductive material includes a conductive layer and an insulating layer, a component of the conductive layer includes soft magnetic conductive powder and hard magnetic powder, and a component of the insulating layer includes a high molecular resin and a curing agent. Wherein the soft magnetic conductive powder and the hard magnetic powder are bonded by a polymer resin.
According to the embodiment of the disclosure, the layered conductive polymer composite material has a special layered structure, the conductive layers and the insulating layers are uniformly dispersed and arranged in the layered composite conductive material, the conductive layers formed by the magnetic conductive powder and the insulating layers formed by the polymer resin alternately appear, and the distance between the conductive layers is basically consistent and the size is adjustable.
According to embodiments of the present disclosure, the interlayer spacing of the conductive layer ranges from 0.025mm to 2mm.
According to an embodiment of the present disclosure, the soft magnetic conductive powder includes any one of iron, cobalt, nickel, iron-silicon alloy, iron-aluminum alloy, iron-silicon-aluminum alloy, iron-cobalt alloy, nickel-iron alloy, and soft magnetic ferrite with or without a plating layer.
According to the embodiment of the disclosure, the soft magnetic conductive powder has the characteristics of low coercive force, high magnetic permeability and high saturation magnetization, the magnetic characteristics influence the stress condition of the soft magnetic conductive powder in a rotating magnetic field, the volume shape of the soft magnetic conductive powder can change the resistance of the soft magnetic conductive powder when the soft magnetic conductive powder moves in the high polymer resin, and further the soft magnetic conductive powder can influence the layering aggregation of the soft magnetic conductive powder in the high polymer resin, and the result is that the interval between conductive layers is changed and the conductive layers are in contact with each other or not.
According to an embodiment of the present disclosure, the shape of the soft magnetic conductive powder is one of a sphere, an irregular shape, and a sheet.
According to an embodiment of the present disclosure, the soft magnetic conductive powder comprises 0.2% to 30%, preferably 3% to 20%, and most preferably 3% to 15% of the total volume fraction.
According to the embodiment of the disclosure, when the magnetization intensity of the soft magnetic conductive powder is larger under the magnetic field with the same intensity, the interval between formed conductive layers is larger. When the soft magnetic conductive powder is spherical or irregular, the movement resistance in the polymer resin is small, the interval between the formed conductive layers is large, and the opposite is the case of flaky powder. When the volume of the soft magnetic conductive powder with the same material and shape is larger, the attraction between magnetized particles is larger, and the distance between conductive layers is larger. Spherical and irregularly shaped soft magnetic conductive powders, the size of which should be 20nm to 150 μm, and the size of flaky soft magnetic conductive powders should be 20nm to 40 μm. The material, shape and volume of the soft magnetic powder are selected according to the conductive layer structure formed after the soft magnetic powder is solidified, so that macroscopic morphology of alternating occurrence of the conductive layer and the insulating layer is realized, the distance between the conductive layers is ensured to be basically consistent, and the size is adjustable.
According to an embodiment of the present disclosure, the hard magnetic conductive powder includes any one of rare earth hard magnetic material, metal hard magnet, hard magnetic ferrite with or without plating.
According to the embodiment of the disclosure, the hard magnetic conductive powder has the characteristics of high coercivity, high remanence and high saturation magnetization, wherein the rare earth hard magnetic material can be selected from neodymium-iron-boron alloy and samarium-cobalt alloy; the metal hard magnet can be selected from aluminum nickel cobalt alloy, iron chromium cobalt alloy, iron cobalt vanadium alloy, platinum alloy, manganese aluminum carbon alloy, copper nickel iron alloy and copper nickel cobalt alloy; the hard magnetic ferrite can be selected from barium ferrite, strontium ferrite and lead ferrite.
In some specific embodiments, the hard magnetic conductive powder comprises 0% to 3%, preferably 0% to 1%, and most preferably 0% to 0.5% of the total volume fraction.
In some specific embodiments, the volume ratio of the hard magnetic conductive powder to the polymer resin may be 0.1%,0.3%,0.5%.
According to the embodiment of the present disclosure, the addition amount of the soft and hard magnetic conductive powder needs to be ensured within the scope defined by the present disclosure, as shown in fig. 6 and 7, too much addition may make the lamellar feature unclear, and the conductive anisotropy value of the material is reduced; small or no additions can cause the lamellar features of the material to be staggered or the spacing of the conductive layers to be different, as shown in fig. 10, which is detrimental to practical applications.
According to embodiments of the present disclosure, the volume ratio of the magnetic conductive powder to the polymer resin may be 5%,10%,15%.
According to embodiments of the present disclosure, the plating material includes gold, silver, copper, nickel, aluminum.
According to embodiments of the present disclosure, the electrical conductivity of the soft magnetic conductive powder and the hard magnetic conductive powder comes from either itself, or the metal plating of the powder surface.
According to an embodiment of the present disclosure, the high polymer resin includes any one of silicone rubber, polyurethane, epoxy resin, phenolic resin, and vinyl resin.
According to embodiments of the present disclosure, the polymeric resin is selected from the group consisting of silicone rubber, polyurethane, epoxy resin, phenolic resin, and vinyl resin, and corresponding curing agents thereof.
According to the embodiment of the present disclosure, the viscosity of the polymer resin is required not to be excessively large, and the viscosity of the polymer resin affects the mobile aggregation of the magnetic conductive powder, and the initial viscosity is preferably 2000mpa·s to 30000mpa·s, and most preferably 2000mpa·s to 10000mpa·s.
According to the embodiment of the disclosure, the curing speed of the matrix resin has a certain influence on the formation of the high-regularity layer structure, and the macroscopic appearance of the conductive layer and the insulating layer alternately appears can be realized under the condition of improving the production efficiency by reasonably controlling the curing speed, and the preferable curing time is 10 min-120 min, and most preferably 60min.
Fig. 1 is a flow chart of a method of preparing a layered composite conductive material in an embodiment of the present disclosure.
The disclosure also provides a preparation method of the layered composite conductive material based on the rotating magnetic field method, as shown in fig. 1, comprising the following steps S1 to S2:
step S1: uniformly mixing high polymer resin and a curing agent according to a proportion, then adding soft magnetic conductive powder and hard magnetic conductive powder, uniformly mixing to obtain a reactant, vacuum degassing the reactant, and sealing;
step S2: and (3) placing the sealed reactant in a rotating magnetic field, and curing to obtain the layered composite conductive material.
According to the embodiment of the disclosure, the magnetic conductive powder with proper proportion and volume fraction is used, under the proper curing time and high polymer resin viscosity, the internal magnetic conductive powder can be gathered in a layered manner under the action of a rotating magnetic field to form a macroscopic morphology of alternately appearing conductive layers and insulating layers, and the distance between the conductive layers is basically consistent and the size is adjustable. The special lamellar structure enables the material to have ultrahigh anisotropy and good conductivity, and can be applied to various electronic packaging fields. Meanwhile, the preparation method based on the rotating magnetic field method is simple and quick, the raw materials are safe and cheap, the equipment is simple, and the preparation method can be used for quick mass production.
Fig. 2 is a schematic structural diagram of a rotating magnetic field device in an embodiment of the present disclosure.
As shown in fig. 2, the reactant is placed in the mold and fixed on the bracket, and the two ends of the bracket are provided with magnets to generate a magnetic field, so that the reaction device rotates by an external motor, thereby generating a rotating magnetic field.
According to embodiments of the present disclosure, the rotating magnetic field is generated by electromagnet or magnet rotation, or is equivalently obtained by rotation of the reactants in a static magnetic field.
According to the embodiment of the disclosure, the rotating magnetic field method makes the direction of the magnetic field periodically change through the rotating motion of the magnetic field so as to magnetize the material, and the magnetic field of the non-magnetic field and the static magnetic field does not change, as shown in fig. 8 and 9, so that the composite conductive material with clear laminar characteristics cannot be prepared.
According to the embodiment of the present disclosure, the rotation speed of the rotating magnetic field is 30 to 1200rpm, for example, 30rpm, 80rpm, 100rpm, 300rpm, 600rpm, 900rpm, 1200rpm, etc., and the magnetic field size of the rotating magnetic field is 50 to 1000mT, for example, 50mT, 100mT, 200mT, 400mT, 600mT, 800mT, 1000mT, etc.
According to embodiments of the present disclosure, the magnetic field rotational speed or magnetic field strength increases, and the conductive layer spacing increases slightly, but the change in magnetic field conditions has less effect on the layered structure than the magnetic conductive filler.
The present disclosure also proposes a field of application of the above layered composite conductive material, including electrical interconnects or electronic packaging.
According to embodiments of the present disclosure, the layered composite conductive material of the present disclosure has ultra-high anisotropic conductive properties and excellent electromagnetic shielding properties, with electrical conductivity up to 5×10 4 S/m. The layered conductive structure has potential application in the fields of electrical interconnection of flexible flat cables, electronic packaging and the like, is suitable for various electronic packaging scenes, and has important research significance and practical value.
It should be noted that the described embodiments are only some embodiments of the present disclosure, and not all embodiments. Based on the embodiments in this disclosure, other embodiments that may be obtained by one of ordinary skill in the art without making any inventive effort are within the scope of the present disclosure.
Example 1
Step S1: the organic silicon rubber is used as high polymer resin, the matched curing agent is adopted, spherical silver-coated nickel powder is used as soft magnetic conductive powder, and neodymium-iron-boron powder is used as hard magnetic conductive powder.
Uniformly mixing 0.5g of organic silicon rubber and 0.05g of curing agent in a mold, then adding 0.517g of spherical silver-coated nickel powder (particle size of 5-25 mu m) and 0.0044g of neodymium-iron-boron powder (particle size of 10 mu m) into the mixture, and uniformly mixing;
step S2: and after vacuum degassing, sealing the die, and placing the die in a rotating magnetic field for curing to obtain the layered composite conductive material. Wherein, the rotating magnetic field rotation speed is 300rpm, the size is 500mT, the curing time is 60min, fig. 2 is a schematic diagram of the structure of the rotating magnetic field device in the embodiment of the disclosure, and the schematic diagram of the structure of the rotating magnetic field device is shown in fig. 2.
Fig. 3 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 1 of the present disclosure, wherein the Z-axis is the direction perpendicular to the plane of the layers.
As shown in fig. 3, the spherical silver-coated nickel powder is layered and aggregated to form conductive layers, the conductive layers and the insulating layers formed by the organic silicon rubber are alternately arranged, and the intervals between the conductive layers are basically consistent. The layered structure enables X, Y axis of the composite material to conduct electricity and Z axis to insulate, wherein X, Y axis is parallel to the direction of the layered plane, so that ultra-high anisotropism and good conductivity are obtained.
Test example 1
The conductivity of the obtained layered conductive polymer composite material is tested, and the testing method refers to GB/T15662-1995 conductive and antistatic plastic volume resistivity testing method.
Fig. 4 is a conductivity histogram of XYZ axes of the layered composite conductive material in example 1 of the present disclosure.
As shown in FIG. 4, the composite materials have conductivity of 5.01X10 in the X, Y axial direction, respectively 4 And 4.65X10 4 S/m, while Z-axis is insulating, it is seen that it is uniformly good in conductivity in the direction of the lamellar plane, while it is non-conductive in terms of perpendicular to the lamellar plane.
Fig. 5 is a diagram of an experimental apparatus for applying the layered composite conductive material in the field of chip mounting in example 1 of the present disclosure.
The radar sensing module shown in fig. 5 is utilized to verify the potential application of the radar sensing module in the field of chip mounting.
On the premise that the distance between the conductive layers is smaller than the width of the pins of the chip, the pins are kept parallel to the conductive layers of the layered composite conductive material, so that the composite material can ensure the electrical connection between each pin of the chip and the PCB without mutual interference and short circuit phenomenon. As shown in fig. 5, the layered conductive polymer composite material replaces the conventional solder to connect the pins of the chip with the PCB, and the chip works normally, and when an object moves nearby, the LED bulb above will automatically light up.
In example 1 of the present invention, if other conditions are not changed, only the spherical silver-coated nickel powder is changed to other soft magnetic powder, and the layered composite conductive material with different conductive layer spacing can be obtained.
In example 1 of the present invention, if other conditions are not changed, only the neodymium iron boron powder is changed to other hard magnetic powder, and a layered composite conductive material having different conductive layer pitches can be obtained.
In example 1 of the present invention, the volume fraction of the magnetic conductive powder was changed within a limited range, and a layered composite conductive material having different conductive layer pitches was obtained.
Example 2
The same preparation method as in example 1 was used, except that in this example, the soft magnetic conductive powder was 40% of the total volume fraction.
FIG. 6 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 2 of the present disclosure
As shown in fig. 6, the soft magnetic conductive powder is excessively added so that conductive layers are interlaced with each other, lamellar features are unclear, and the material conductivity anisotropy value is reduced.
Example 3
The same preparation method as in example 1 was used, except that in this example, the hard magnetic conductive powder was 4% of the total volume fraction.
Fig. 7 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 3 of the present disclosure.
As shown in fig. 7, the hard magnetic conductive powder is excessively added, so that the conductive layers are bent and staggered, the layered characteristics are irregular, and the conductive anisotropy value of the material is reduced.
Example 4
The same preparation method as in example 1 was used, except that in this example, no additional magnetic field was applied, and the reactants were left to stand to cure to prepare a material.
Fig. 8 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 4 of the present disclosure.
As shown in fig. 8, the cured material is in a powder mixed cured state, and has no special alignment structure, and cannot be used as a conductive packaging material.
Example 5
The same preparation method as in example 1 was used, except that in this example, a stationary magnetic field was added and the reactants were kept stationary to prepare a material by curing.
Fig. 9 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 5 of the present disclosure.
As shown in fig. 9, the cured material has a loose and disordered pore structure formed therein, and no special alignment structure is formed, so that the cured material cannot be used as a conductive packaging material.
Example 6
The same preparation method as in example 1 was used, except that in this example, no hard magnetic conductive powder was added.
Fig. 10 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 6 of the present disclosure.
As shown in fig. 10, in comparison with the composite material added with the hard magnetic conductive powder, the conductive layers of the material in this embodiment are partially staggered, and the pitches of the conductive layers are different, which is not beneficial to the application in the field of electronic packaging.
Example 7
Step S1: the organic silicon rubber is used as high polymer resin, the matched curing agent is adopted, the irregular-shaped iron-silicon-chromium powder is used as soft magnetic conductive powder, and the neodymium-iron-boron powder is used as hard magnetic conductive powder.
Uniformly mixing 0.5g of organic silicon rubber and 0.05g of curing agent in a mold, adding 0.467g of irregular-shape iron-silicon-chromium powder (particle size of 25 mu m) and 0.012g of neodymium-iron-boron powder (particle size of 10 mu m), and uniformly mixing;
step S2: and after vacuum degassing, sealing the die, and placing the die in a rotating magnetic field for curing to obtain the layered composite conductive material. Wherein, the rotating magnetic field has the rotating speed of 300rpm and the size of 500mT, and the curing time is 60min.
Fig. 11 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 7 of the present disclosure.
As shown in fig. 11, the above-mentioned mixture containing the magnetic conductive powder can be layered and aggregated under the action of the rotating magnetic field to form conductive layers, the distance between the conductive layers is 0.78mm, and the insulating layers formed by the conductive layers and the organic silicon rubber alternately and clearly appear, so as to obtain the layered composite conductive material prepared based on the rotating magnetic field.
Example 8
The same as the production method in example 1, except that in this example, 0.495g of spherical iron powder was used as the soft magnetic conductive powder, wherein the particle diameter of the spherical iron powder was 1 μm.
Fig. 12 is an optical photograph of a Z-axis cross section of a layered composite conductive material of example 8 of the present disclosure, wherein fig. a is a physical drawing of the Z-axis cross section of the layered composite conductive material, and fig. b is a partial enlarged view of the Z-axis cross section of the layered composite conductive material.
As shown in fig. 12, the above-mentioned mixture containing the magnetic conductive powder can be layered and aggregated under the action of the rotating magnetic field to form conductive layers, the distance between the conductive layers is 0.025mm, and the insulating layers formed by the conductive layers and the organic silicon rubber are alternately arranged, so as to obtain the layered composite conductive material prepared based on the rotating magnetic field.
Example 9
The same preparation method as in example 1 was conducted, except that in this example, 0.524g of a flaky silver-coated nickel powder having a flake diameter of 40 μm and a thickness of 2 μm was used as the soft magnetic conductive powder.
Fig. 13 is a Z-axis cross-sectional photomicrograph of a layered composite conductive material of example 9 of the present disclosure.
As shown in fig. 13, the mixture containing the magnetic conductive powder can be layered and aggregated under the action of the rotating magnetic field to form conductive layers, the distance between the conductive layers is 0.26mm, the conductive layers and the insulating layers formed by the organic silicon rubber are alternately arranged, the layered characteristic is obvious, and the layered composite conductive material prepared based on the rotating magnetic field is obtained.
While the foregoing is directed to embodiments of the present disclosure, other and further details of the invention may be had by the present application, it is to be understood that the foregoing description is merely exemplary of the present disclosure and that no limitations are intended to the scope of the disclosure, except insofar as modifications, equivalents, improvements or modifications may be made without departing from the spirit and principles of the present disclosure.
Claims (10)
1. The layered composite conductive material is prepared from the following components in percentage by volume: soft magnetic conductive powder accounting for 0.2 to 30 percent of the total volume fraction, hard magnetic powder accounting for 0 to 3 percent of the total volume fraction, high polymer resin accounting for 67 to 99.8 percent of the total volume fraction and a corresponding curing agent thereof; wherein the mass ratio of the polymer resin to the curing agent is 100-1000%.
2. The layered composite conductive material according to claim 1, wherein a structure of the layered composite conductive material includes a conductive layer and an insulating layer, a component of the conductive layer includes the soft magnetic conductive powder and the hard magnetic powder, and a component of the insulating layer includes the polymer resin and the curing agent; wherein,
the soft magnetic conductive powder and the hard magnetic powder are bonded by a polymer resin.
3. The layered composite conductive material according to claim 2, wherein the conductive layer has an interlayer spacing ranging from 0.025mm to 2mm.
4. The layered composite conductive material of claim 1, wherein,
the soft magnetic conductive powder comprises any one of iron, cobalt, nickel, iron-silicon alloy, iron-aluminum alloy, iron-silicon-aluminum alloy, iron-cobalt alloy, nickel-iron alloy and soft magnetic ferrite with or without a coating;
the hard magnetic conductive powder comprises any one of rare earth hard magnetic material, metal hard magnet and hard magnetic ferrite with or without a coating;
the high polymer resin comprises any one of organic silicon rubber, polyurethane, epoxy resin, phenolic resin and vinyl resin.
5. The layered composite conductive material of claim 4, wherein the plating material comprises gold, silver, copper, nickel, aluminum.
6. The layered composite conductive material according to claim 4, wherein the shape of the soft magnetic conductive powder is one of spherical, irregular, and flaky.
7. A method of preparing the layered composite conductive material of any one of claims 1 to 6, comprising:
uniformly mixing high polymer resin and a curing agent according to a proportion, then adding soft magnetic conductive powder and hard magnetic conductive powder, uniformly mixing to obtain a reactant, vacuum degassing the reactant, and sealing;
and placing the sealed reactant in a rotating magnetic field, and curing to obtain the layered composite conductive material.
8. The method of claim 7, wherein the rotating magnetic field is generated by electromagnet or magnet rotation, or is equivalently obtained by rotation of the reactant in a static magnetic field.
9. The production method according to claim 7, wherein the rotation speed of the rotating magnetic field is 30 to 1200rpm, and the magnetic field size of the rotating magnetic field is 50 to 1000mT.
10. Use of a layered composite conductive material according to any of claims 1 to 6, wherein the field of application comprises electrical interconnects or electronic packaging.
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