CN117395572A - Bone conduction loudspeaker - Google Patents

Bone conduction loudspeaker Download PDF

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Publication number
CN117395572A
CN117395572A CN202311242898.9A CN202311242898A CN117395572A CN 117395572 A CN117395572 A CN 117395572A CN 202311242898 A CN202311242898 A CN 202311242898A CN 117395572 A CN117395572 A CN 117395572A
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CN
China
Prior art keywords
magnetic
magnetic element
circuit assembly
bone conduction
magnetization direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311242898.9A
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Chinese (zh)
Inventor
张磊
廖风云
齐心
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Shenzhen Voxtech Co Ltd
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Shenzhen Voxtech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Voxtech Co Ltd filed Critical Shenzhen Voxtech Co Ltd
Priority to CN202311242898.9A priority Critical patent/CN117395572A/en
Publication of CN117395572A publication Critical patent/CN117395572A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Abstract

The application discloses bone conduction speaker, this bone conduction speaker's magnetic circuit subassembly includes: a first magnetic element that generates a first magnetic field; a first magnetic conductive element; the second magnetic conduction element at least partially surrounds the first magnetic element and forms a magnetic gap with the first magnetic element; and the at least one second magnetic element is connected with the upper surface of the first magnetic conduction element, the at least one second magnetic element generates a second magnetic field, the first magnetic element is connected with the lower surface of the first magnetic conduction element, and the magnetization directions of the first magnetic element and the at least one second magnetic element are opposite.

Description

Bone conduction loudspeaker
The present application is a divisional application of chinese patent application No. 201810015448.9, entitled "bone conduction speaker", filed on 2018, 01, and 08.
Technical Field
The present application relates to the field of bone conduction technology, and in particular to a magnetic circuit assembly in a bone conduction speaker.
Background
The bone conduction speaker can convert the electric signal into a mechanical vibration signal and conduct the vibration signal into the cochlea through human tissues and bones, so that the user can hear the sound. Compared with an air conduction loudspeaker, the air conduction loudspeaker drives air to vibrate through the vibrating diaphragm to generate sound, and the bone conduction vibration loudspeaker needs to drive soft tissues and bones of a user to vibrate, so that the required mechanical power is high. Increasing the sensitivity of bone conduction speakers can result in higher efficiency in the conversion of electrical energy to mechanical energy and thus greater mechanical power output. Increasing sensitivity is more important for bone conduction speakers with higher power requirements.
Disclosure of Invention
The application relates to a magnetic circuit assembly of a bone conduction speaker. The magnetic circuit assembly may include a first magnetic element that generates a first magnetic field; a first magnetic conductive element; the second magnetic conduction element surrounds the first magnetic element and forms a magnetic gap with the first magnetic element; and at least one second magnetic element connected to the upper surface of the first magnetic conductive element, the at least one second magnetic element generating a second magnetic field that increases the magnetic field strength of the first magnetic field within the magnetic gap.
According to some embodiments of the present application, the angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is between 150 degrees and 180 degrees.
According to some embodiments of the present application, the ratio of the thickness of the first magnetic element to the sum of the thicknesses of the first magnetic element, the at least one second magnetic element, and the first magnetically permeable element ranges from 0.4 to 0.6.
According to some embodiments of the application, the thickness of the at least one second magnetic element is equal to the thickness of the first magnetic element.
According to some embodiments of the present application, the thickness of the at least one second magnetic element is less than the thickness of the first magnetic element.
According to some embodiments of the present application, the magnetic circuit assembly further comprises at least one third magnetic element surrounding the at least one second magnetic element.
According to some embodiments of the present application, an angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.
According to some embodiments of the present application, an angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is not less than 90 degrees.
According to some embodiments of the present application, the magnetic circuit assembly further comprises at least one fourth magnetic element, wherein the at least one fourth magnetic element connects the second magnetically permeable element and the at least one third magnetic element.
According to some embodiments of the present application, an angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.
According to some embodiments of the present application, an angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is not less than 90 degrees.
According to some embodiments of the present application, the magnetic circuit assembly further comprises at least one fifth magnetic element, wherein the at least one fifth magnetic element is located below the magnetic gap and connects the first magnetic element and the second magnetic conductive element.
According to some embodiments of the present application, an angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.
According to some embodiments of the present application, an angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is no greater than 90 degrees.
According to some embodiments of the present application, the magnetic circuit assembly further comprises a third magnetically permeable element, the third magnetically permeable element being connected to the at least one second magnetic element.
Additional features of the present application will be set forth in part in the description which follows. Additional features of part of this application will be readily apparent to those skilled in the art from a review of the following description and the corresponding drawings, or from a study of the manufacture or operation of the embodiments. The features disclosed in this application may be implemented or realized in the practice or use of the various methods, instrumentalities and combinations of the specific embodiments described below.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not limit the application. Like reference symbols in the various drawings indicate like elements.
Fig. 1 is a block diagram of a bone conduction speaker according to some embodiments of the present application;
fig. 2 is a schematic longitudinal section of a bone conduction speaker according to some embodiments of the present application;
FIG. 3A is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;
FIG. 3B is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;
FIG. 3C is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;
FIG. 3D is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;
FIG. 3E is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;
FIG. 3F is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;
FIG. 4A is a schematic cross-sectional view of a magnetic element according to some embodiments of the present application;
FIG. 4B is a schematic diagram of a magnetic element according to some embodiments of the present application;
FIG. 4C is a schematic illustration of the magnetization direction of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application;
FIG. 4D is a magnetic induction profile of a magnetic element in a magnetic assembly according to some embodiments of the present application;
fig. 5 is a schematic diagram of a bone conduction speaker according to some embodiments of the present application;
fig. 6 is a schematic diagram of a bone conduction speaker according to some embodiments of the present application.
Detailed Description
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present application, and it is obvious to those skilled in the art that the present application may be applied to other similar situations according to the drawings without inventive effort. It should be understood that these exemplary embodiments are presented merely to enable those skilled in the relevant art to better understand and practice the invention and are not intended to limit the scope of the invention in any way. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.
As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not specific to the singular, but may include the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". Related definitions of other terms will be given in the description below. Hereinafter, without loss of generality, in describing the bone conduction related art in the present invention, a description of "bone conduction speaker" or "bone conduction earphone" will be employed. The description is only one form of bone conduction application, and it will be appreciated by those of ordinary skill in the art that the "speaker" or "earpiece" may be replaced by other similar terms, such as "player", "hearing aid", etc. Indeed, various implementations of the invention may be readily applied to other non-speaker-like hearing devices. For example, it will be apparent to those skilled in the art that various modifications and changes in form and details of the specific manner and procedure of implementing the bone conduction speaker, and in particular the addition of ambient sound pick-up and processing functions to the bone conduction speaker, may be made without departing from the basic principles of the bone conduction speaker, thereby enabling the speaker to function as a hearing aid. For example, a microphone such as a microphone may pick up sound from the user/wearer's surroundings and, under certain algorithms, transmit the sound processed (or generated electrical signals) to the bone conduction speaker portion. That is, the bone conduction speaker can be modified to have a function of picking up environmental sound, and transmit the sound to the user/wearer through the bone conduction speaker portion after a certain signal processing, thereby realizing the function of the bone conduction hearing aid. By way of example, the algorithms described herein may include one or more combinations of noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active noise immunity, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, and the like.
The invention provides a bone conduction speaker with high sensitivity. In some embodiments, the bone conduction speaker may include a magnetic circuit assembly. The magnetic circuit assembly may include a first magnetic element, a first magnetically permeable element, a second magnetically permeable element, and one or more second magnetic elements. The first magnetic element may generate a first magnetic field, and the one or more second magnetic elements surround the first magnetic element and form a magnetic gap with the first magnetic element. The one or more second magnetic elements generate a second magnetic field that increases the magnetic field strength of the first magnetic field within the magnetic gap. The second magnetic elements in the magnetic circuit assembly encircle the first magnetic elements, so that the volume and the weight of the magnetic circuit assembly are reduced, the efficiency of the bone conduction speaker is improved, and the service life of the bone conduction speaker is prolonged under the conditions of improving the magnetic field strength of a magnetic gap and improving the sensitivity of the bone conduction speaker.
The bone conduction speaker has the characteristics of small size, light weight, high efficiency, high sensitivity, long service life and the like, and is convenient to combine with the wearable intelligent device, so that the multifunctionalization of single device is realized, and the user experience is improved and optimized. The wearable smart devices include, but are not limited to, smart headphones, smart glasses, smart headbands, smart helmets, smart watches, smart gloves, smart shoes, smart cameras, smart video cameras, and the like. The bone conduction speaker may further be combined with smart materials, integrating bone conduction speakers in the manufacturing materials of the user's clothing, gloves, hats, shoes, etc. The bone conduction speaker can be further implanted into a human body, and can realize more personalized functions in cooperation with a human body implanted chip or an external processor.
Fig. 1 is a block diagram of a bone conduction speaker 100 according to some embodiments of the present application. As illustrated, bone conduction speaker 100 may include a magnetic circuit assembly 102, a vibration assembly 104, a support assembly 106, and a storage assembly 108.
The magnetic circuit assembly 102 may provide a magnetic field. The magnetic field may be used to convert a signal containing acoustic information into a vibration signal. In some embodiments, the sound information may include video, audio files having a particular data format, or data or files that may be converted to sound by a particular means. The signal containing the audio information may be from the memory component 108 of the bone conduction speaker 100 itself, or from a system other than the bone conduction speaker 100 for generating, storing, or transmitting information. The signal containing the acoustic information may include one or more combinations of electrical signals, optical signals, magnetic signals, mechanical signals, and the like. The signal containing the sound information may come from one signal source or a plurality of signal sources. The plurality of signal sources may or may not be correlated. In some embodiments, bone conduction speaker 100 may acquire the signal containing the acoustic information in a number of different ways, either wired or wireless, and may be real-time or delayed. For example, bone conduction speaker 100 may receive electrical signals containing audio information via wired or wireless means, or may obtain data directly from a storage medium (e.g., storage component 108) to generate an audio signal. As another example, a bone conduction hearing aid may include components with sound collection capabilities that convert mechanical vibrations of sound into electrical signals by picking up the sound in the environment, and then processing the signals with an amplifier to obtain electrical signals that meet specific requirements. In some embodiments, the wired connection may include a metallic cable, an optical cable, or a hybrid metallic and optical cable, such as, for example, a coaxial cable, a communications cable, a flex cable, a spiral cable, a nonmetallic sheath cable, a metallic sheath cable, a multi-core cable, a twisted pair cable, a ribbon cable, a shielded cable, a telecommunications cable, a twinax cable, parallel twinax wires, twisted pair wires, or the like. The above described examples are for convenience of illustration only, and the medium of the wired connection may be of other types, such as other transmission carriers of electrical or optical signals, etc.
The wireless connection may include radio communication, free space optical communication, acoustic communication, electromagnetic induction, and the like. Wherein the radio communication may include IEEE802.11 series standards, IEEE802.15 series standards (e.g., bluetooth technology, zigbee technology, etc.), first generation mobile communication technologies, second generation mobile communication technologies (e.g., FDMA, TDMA, SDMA, CDMA, SSMA, etc.), general packet radio service technologies, third generation mobile communication technologies (e.g., CDMA2000, WCDMA, TD-SCDMA, wiMAX, etc.), fourth generation mobile communication technologies (e.g., TD-LTE, FDD-LTE, etc.), satellite communication (e.g., GPS technology, etc.), near Field Communication (NFC), and other technologies operating in the ISM band (e.g., 2.4GHz, etc.); free space optical communications may include visible light, infrared signals, and the like; the acoustic communication may include acoustic waves, ultrasonic signals, etc.; electromagnetic induction may include near field communication techniques, and the like. The above described examples are for convenience of illustration only and the medium of the wireless connection may also be of other types, e.g. Z-wave technology, other charged civilian and military radio bands, etc. For example, as some application scenarios of the present technology, bone conduction speaker 100 may obtain signals containing sound information from other devices through bluetooth technology.
The vibration assembly 104 may generate mechanical vibrations. The generation of the vibrations is accompanied by energy conversion, and bone conduction speaker 100 may use specific magnetic circuit assembly 102 and vibration assembly 104 to effect conversion of signals containing acoustic information into mechanical vibrations. The process of conversion may involve the coexistence and conversion of a variety of different types of energy. For example, the electrical signal may be directly converted into mechanical vibrations by a transducer means, producing sound. For another example, sound information may be included in the optical signal and a particular transducer device may perform the conversion from the optical signal to a vibration signal. Other types of energy that may coexist and be converted during operation of the transducer include thermal energy, magnetic field energy, and the like. The energy conversion modes of the energy conversion device can comprise moving coil type, electrostatic type, piezoelectric type, moving iron type, pneumatic type, electromagnetic type and the like. The frequency response range and sound quality of bone conduction speaker 100 may be affected by vibration assembly 104. For example, in the moving coil transducer device, the vibration assembly 104 includes a wound columnar coil and a vibrator (e.g., a vibrating reed), and the columnar coil driven by the signal current drives the vibrator to vibrate in the magnetic field to generate sound, so that the stretching and shrinking of the material of the vibrator, the deformation, the size, the shape and the fixing manner of the wrinkles, the magnetic density of the permanent magnet, etc. have a great influence on the sound quality of the bone conduction speaker 100. The vibrating body in the vibrating assembly 104 may be a mirror symmetrical structure, a center symmetrical structure, or an asymmetrical structure; the vibration body can be provided with a discontinuous hole-shaped structure, so that the vibration body generates larger displacement, the bone conduction loudspeaker realizes higher sensitivity, and the output power of vibration and sound is improved; the vibrator may be a ring body structure, and a plurality of struts which are converged toward the center are arranged in the ring body, and the number of struts may be two or more.
The support assembly 106 may support the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108. The support assembly 106 may include one or more housings, one or more connectors. The one or more housings may form an accommodation space for accommodating the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108. The one or more connectors may connect the housing with the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108.
The storage component 108 can store signals containing audio information. In some embodiments, the storage component 108 may include one or more storage devices. The storage devices may include storage devices on storage systems such as direct attached storage (Direct Attached Storage), network attached storage (Network Attached Storage), and storage area networks (Storage Area Network). The storage devices may include various types of storage devices such as solid state storage devices (solid state drives, solid state hybrid drives, etc.), mechanical hard drives, USB flash memory, memory sticks, memory cards (e.g., CF, SD, etc.), other drives (e.g., CD, DVD, HDDVD, blu-ray, etc.), random Access Memory (RAM), and Read Only Memory (ROM). Wherein RAM may include a decimal counter, a selector, a delay line memory, a williams tube, a Dynamic Random Access Memory (DRAM), a Static Random Access Memory (SRAM), a thyristor random access memory (T-RAM), a zero capacitance random access memory (Z-RAM), and the like; ROM may include bubble memory, button wire memory, thin film memory plating line memory, magnetic core memory, magnetic drum memory, optical disk drive, hard disk magnetic tape, early NVRAM (nonvolatile memory), phase change memory, magnetoresistive RAM, ferroelectric RAM, nonvolatile SRAM flash memory, EEPROM, PROM, shielded heap read memory, floating gate RAM, nanometer RAM, racetrack memory, variable resistance memory, programmable metallization cell, etc. The above-mentioned storage devices/storage units are examples, and storage devices that can be used for the storage devices/storage units are not limited thereto.
The above description of bone conduction speaker structures is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific manner and steps of implementing the bone conduction speaker may be made without departing from this principle, but remain within the scope of the above description. For example, bone conduction speaker 100 may include one or more processors that may execute one or more sound signal processing algorithms. The sound signal processing algorithm may modify or enhance the sound signal. Such as noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active noise immunity, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or the like, or any combination thereof, while remaining within the scope of the claimed invention. As another example, bone conduction speaker 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, and the like. The sensor may collect user information or environmental information.
Fig. 2 is a schematic longitudinal section of a bone conduction speaker 200 according to some embodiments of the present application. As shown, bone conduction speaker 200 may include a first magnetic element 202, a first magnetically permeable element 204, a second magnetically permeable element 206, a first diaphragm 208, a voice coil 210, a second diaphragm 212, and a vibration panel 214.
The magnetic element described in the present application refers to an element that can generate a magnetic field, such as a magnet or the like. The magnetic element may have a magnetization direction, which refers to a direction of a magnetic field inside the magnetic element. The first magnetic element 202 may include one or more magnets. In some embodiments, the magnets may include metal alloy magnets, ferrites, and the like. The metal alloy magnets may include neodymium iron boron, samarium cobalt, alnico, iron chromium cobalt, alfeb, iron carbon aluminum, or the like, or combinations thereof. The ferrite may include barium ferrite, steel ferrite, manganese ferrite, lithium manganese ferrite, or the like, or various combinations thereof.
The lower surface of the first magnetically permeable element 204 may be coupled to the upper surface of the first magnetic element 202. The second magnetically permeable element 206 may be coupled to the first magnetic element 202. It should be noted that the magnetizer referred to herein may also be referred to as a magnetic field concentrator or core. The magnetizer can adjust the distribution of a magnetic field (e.g., the magnetic field generated by the first magnetic element 202). The magnetic conductor may comprise an element machined from a soft magnetic material. In some embodiments, the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, or the like, such as iron, a ferrosilicon-based alloy, a ferroaluminum-based alloy, a nickel-iron-based alloy, a ferrocobalt-based alloy, a low carbon steel, a silicon steel sheet, ferrite, or the like. In some embodiments, the magnetic conductor may be machined by one or more combination of casting, plastic working, cutting, powder metallurgy, and the like. Casting may include sand casting, investment casting, pressure casting, centrifugal casting, and the like; plastic working may include one or more combinations of rolling, casting, forging, stamping, extruding, drawing, etc.; the cutting process may include turning, milling, planing, grinding, and the like. In some embodiments, the method of machining the magnetizer may include 3D printing, numerically controlled machine tools, and the like. The connection between the first magnetically permeable element 204, the second magnetically permeable element 206, and the first magnetic element 202 may include one or more of bonding, clamping, welding, riveting, bolting, etc. In some embodiments, the first magnetic element 202, the first magnetic conductive element 204, and the second magnetic conductive element 206 may be disposed in an axisymmetric configuration. The axisymmetric structure may be a ring structure, a column structure, or other structures having axisymmetry.
In some embodiments, a magnetic gap may be formed between the first magnetic element 202 and the second magnetic conductive element 206. Voice coil 210 may be disposed in the magnetic gap. The voice coil 210 may be connected to the first diaphragm 208. The first vibration plate 208 may be connected to the second vibration plate 212, and the second vibration plate 212 may be connected to the vibration panel 214. When a current is applied to the voice coil 210, the voice coil 210 is positioned in a magnetic field formed by the first magnetic element 202, the first magnetic conductive element 214 and the second magnetic conductive element 206, and is subjected to an ampere force, and the ampere force drives the voice coil 210 to vibrate, so that the vibration of the voice coil 210 drives the vibration of the first vibration plate 208, the second vibration plate 212 and the vibration panel 214. The vibration panel 214 transmits the vibrations through tissue and bone to the auditory nerve, thereby allowing the person to hear the sound. The vibration panel 214 may be in direct contact with the skin of the human body or may be in contact with the skin through a vibration transmission layer composed of a specific material.
In some embodiments, for bone conduction speakers with a single magnetic element, the magnetic induction lines through the voice coil are not uniform, diverging. Meanwhile, magnetic leakage can be formed in the magnetic circuit, namely more magnetic induction wires leak out of the magnetic gap and cannot pass through the voice coil, so that the magnetic induction intensity (or magnetic field intensity) at the position of the voice coil is reduced, and the sensitivity of the bone conduction loudspeaker is affected. Accordingly, bone conduction speaker 200 may further include at least one second magnetic element and/or at least one third magnetic conductive element (not shown). The at least one second magnetic element and/or the at least one third magnetic element may inhibit leakage of the magnetic induction lines, restrict the form of the magnetic induction lines passing through the voice coil, so that more magnetic induction lines pass through the voice coil as horizontally and densely as possible, and enhance magnetic induction (or magnetic field strength) at the position of the voice coil, thereby improving sensitivity of the bone conduction speaker 200 and further improving mechanical conversion efficiency of the bone conduction speaker 200 (i.e., efficiency of converting electric energy input into the bone conduction speaker 200 into mechanical energy of vibration of the voice coil). For a further description of the at least one second magnetic element, see fig. 3A-3F.
The above description of the structure of bone conduction speaker 200 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and detail of the specific manner and steps of implementing the bone conduction speaker may be made without departing from this principle, but remain within the scope of the above description. For example, bone conduction speaker 200 may include a housing, a connector, and the like. The connector may connect the vibration panel 214 with the housing. For another example, bone conduction speaker 200 may include a second magnetic element that may be coupled to first magnetically permeable element 204. For another example, bone conduction speaker 200 may further include one or more annular magnetic elements that may be coupled to second magnetically permeable element 206.
Fig. 3A is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3100, according to some embodiments of the present application. As shown in fig. 3A, magnetic circuit assembly 3100 may include a first magnetic element 302, a first magnetically permeable element 304, a second magnetically permeable element 306, and a second magnetic element 308.
In some embodiments, the first magnetic element 302 and/or the second magnetic element 308 may include any one or more of the magnets described herein. In some embodiments, the first magnetic element 302 may include a first magnet and the second magnetic element 308 may include a second magnet, which may be the same or different from the first magnet. The first magnetically permeable element 304 and/or the second magnetically permeable element 306 may comprise any one or more of the magnetically permeable materials described herein. The method of machining the first magnetically permeable element 304 and/or the second magnetically permeable element 306 may include any one or more of the methods described herein. In some embodiments, the first magnetic element 302, the first magnetically permeable element 304, and/or the second magnetic element 308 may be disposed in an axisymmetric configuration. For example, the first magnetic element 302, the first magnetic element 304, and/or the second magnetic element 308 may be cylinders. In some embodiments, the first magnetic element 302, the first magnetically permeable element 304, and/or the second magnetic element 308 may be coaxial cylinders containing the same or different diameters. The thickness of the first magnetic element 302 may be greater than or equal to the thickness of the second magnetic element 308. In some embodiments, the ratio of the thickness of the first magnetic element 302 to the sum of the thicknesses of the first magnetic element 302, the second magnetic element 308, and the first magnetically permeable element 304 ranges from 0.4 to 0.6. In some embodiments, the second magnetically permeable element 306 may be a groove-type structure. The groove-type structure may comprise a U-shaped cross-section (as shown in fig. 3A). The second magnetically permeable element 306 may include a bottom plate and a side wall. In some embodiments, the base plate and the side walls may be integrally formed, for example, the side walls may be formed from the base plate extending in a direction perpendicular to the base plate. In some embodiments, the bottom panel may be connected to the side walls by any one or more of the connections described herein. The second magnetic element 308 may be configured in a ring or a sheet. In some embodiments, the second magnetic element 308 may be coaxial with the first magnetic element 302 and/or the first magnetically permeable element 304.
The upper surface of the first magnetic element 302 may be connected to the lower surface of the first magnetic element 304. The lower surface of the first magnetic element 302 may be connected to the bottom plate of the second magnetic element 306. The lower surface of the second magnetic element 308 is connected to the upper surface of the first magnetic conductive element 304. The connection between the first magnetic element 302, the first magnetic element 304, the second magnetic element 306, and/or the second magnetic element 308 may include one or more combinations of bonding, clamping, welding, riveting, bolting, etc.
A magnetic gap is formed between the sidewalls of the first magnetic element 302, the first magnetic conductive element 304, and/or the second magnetic element 308, and the second magnetic conductive element 306. Voice coil 320 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 302, the first magnetically permeable element 304, the second magnetically permeable element 306, and the second magnetic element 308 may form a magnetic circuit.
In some embodiments, magnetic circuit assembly 3100 may generate a first full magnetic field (which may also be referred to as a "total magnetic field of the magnetic circuit assembly"), and first magnetic element 302 may generate a second magnetic field. The first full magnetic field is formed by magnetic fields generated by all components (e.g., first magnetic element 302, first magnetic element 304, second magnetic element 306, and second magnetic element 308) in magnetic circuit assembly 3100. The magnetic field strength (which may also be referred to as magnetic induction or magnetic flux density) of the first full magnetic field within the magnetic gap is greater than the magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the second magnetic element 308 may generate a third magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap. In other embodiments in this specification, unless otherwise specified, the magnetic circuit assembly represents a structure including all magnetic elements and magnetically conductive elements, the first full magnetic field represents the magnetic field generated by the magnetic circuit assembly as a whole, and the second, third, … …, and nth magnetic fields represent the magnetic fields generated by the respective magnetic elements, respectively. In different embodiments, the magnetic elements that generate the second magnetic field (or third magnetic field, … …, nth magnetic field) may be the same or different.
In some embodiments, the angle between the magnetization direction of the second magnetic element 308 and the magnetization direction of the first magnetic element 302 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the second magnetic element 308 and the magnetization direction of the first magnetic element 302 is between 150 degrees and 180 degrees. In some embodiments, the magnetization direction of the second magnetic element 308 is opposite to the magnetization direction of the first magnetic element 302 (as shown, the a-direction and the b-direction).
The magnetic circuit assembly 3100 adds a second magnetic element 308 as compared to a single magnetic element magnetic circuit assembly. The magnetization direction of the second magnetic element 308 is opposite to that of the first magnetic element 302, so that magnetic leakage of the first magnetic element 302 in the magnetization direction can be suppressed, and the magnetic field generated by the first magnetic element 302 can be more compressed into the magnetic gap, so that the magnetic induction intensity in the magnetic gap is improved.
The above description of the structure of magnetic circuit assembly 3100 is merely a specific example and should not be considered the only viable embodiment. It will be apparent to those skilled in the art, after having appreciated the basic principles of the bone magnetic circuit assembly, that various modifications and changes in form and detail of the specific manner and steps of implementing the magnetic circuit assembly 3100 may be made without departing from such principles, but such modifications and changes remain within the scope of the foregoing description. For example, the second magnetically permeable element 306 may be a ring-shaped structure or a sheet-like structure. For another example, magnetic circuit assembly 3100 may further include an electrically conductive member that may connect first magnetic member 302, first magnetically permeable member 304, second magnetically permeable member 306, and second magnetic member 308.
Fig. 3B is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3200, according to some embodiments of the present disclosure. As shown in fig. 3B, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3200 may further include a third magnetic element 310.
The lower surface of the third magnetic element 310 is connected to the sidewall of the second magnetic element 306. A magnetic gap may be formed between the first magnetic element 302, the first magnetically permeable element 304, the second magnetic element 308, and/or the third magnetic element 310. Voice coil 320 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 302, the first magnetic conductive element 304, the second magnetic conductive element 306, the second magnetic element 308, and the third magnetic element 310 may form a magnetic circuit.
In some embodiments, magnetic circuit assembly 3200 may generate a first full magnetic field and first magnetic element 302 may generate a second magnetic field, the first full magnetic field having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the third magnetic element 310 may generate a third magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.
In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (direction shown as a in the figure) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the third magnetic element 310 is directed from the inner ring to the outer ring of the third magnetic element 310 (direction shown as c in the figure, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 90 degrees in a clockwise direction).
In some embodiments, the angle between the direction of the first full magnetic field and the magnetization direction of the third magnetic element 310 is no more than 90 degrees at the location of the third magnetic element 310. In some embodiments, at the location of the third magnetic element 310, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the direction of magnetization of the third magnetic element 310 may be less than or equal to 90 degrees, 0 degrees, 10 degrees, 20 degrees, etc.
Magnetic circuit assembly 3200 further adds third magnetic element 310 as compared to magnetic circuit assembly 3100. Third magnetic element 310 may further increase the total magnetic flux within the magnetic gap in magnetic circuit assembly 3200, thereby increasing the magnetic induction in the magnetic gap. Under the action of the third magnetic element 310, the magnetic induction line further converges toward the position of the magnetic gap, and the magnetic induction intensity in the magnetic gap is further increased.
Fig. 3C is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3300, according to some embodiments of the present application. As shown in fig. 3C, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3300 can further include fourth magnetic element 312.
The fourth magnetic element 312 may be attached to the sidewalls of the first magnetic element 302 and the second magnetic element 306 by one or more combinations of bonding, clamping, welding, riveting, bolting, etc. In some embodiments, the first magnetic element 302, the first magnetic conductive element 304, the second magnetic conductive element 306, the second magnetic element 308, and the fourth magnetic element 312 may form a magnetic gap. In some embodiments, the magnetization direction of the second magnetic element 308 may be as described in detail with reference to fig. 3A of the present application.
In some embodiments, magnetic circuit assembly 3200 may generate a first full magnetic field and first magnetic element 302 may generate a second magnetic field, the first full magnetic field having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the fourth magnetic element 312 may generate a fourth magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.
In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 is no greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the fourth magnetic element 312 is directed from the outer ring of the fourth magnetic element 312 to the inner ring (as shown in the direction of e, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees in the clockwise direction).
In some embodiments, at the location of the fourth magnetic element 312, the angle between the direction of the first full magnetic field and the magnetization direction of the fourth magnetic element 312 is no more than 90 degrees. In some embodiments, at the location of the fourth magnetic element 312, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.
Magnetic circuit assembly 3300 further adds fourth magnetic element 312 as compared to magnetic circuit assembly 3200. Fourth magnetic element 312 may further increase the total magnetic flux within the magnetic gap in magnetic circuit assembly 3300, thereby increasing the magnetic induction in the magnetic gap. Under the action of the fourth magnetic element 312, the magnetic induction line further converges toward the position of the magnetic gap, and the magnetic induction intensity in the magnetic gap is further increased.
Fig. 3D is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3400, according to some embodiments of the present application. As shown in fig. 3D, unlike magnetic circuit assembly 3200, magnetic circuit assembly 3400 may further include fifth magnetic element 314.
The lower surface of the third magnetic element 310 is connected to the fifth magnetic element 314, and the lower surface of the fifth magnetic element 314 is connected to the sidewall of the second magnetic conductive element 306. A magnetic gap may be formed between the first magnetic element 302, the first magnetically permeable element 304, the second magnetic element 308, and/or the third magnetic element 310. Voice coil 320 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 302, the first magnetic conductive element 304, the second magnetic conductive element 306, the second magnetic element 308, the third magnetic element 310, and the fifth magnetic element 314 may form a magnetic circuit. In some embodiments, the magnetization direction of the second magnetic element 308 and the third magnetic element 310 may be described in detail with reference to fig. 3A and 3B of the present application.
In some embodiments, the magnetic circuit assembly 3400 may generate a first full magnetic field and the first magnetic element 302 may generate a second magnetic field, the first full magnetic field having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, fifth magnetic element 314 may generate a fifth magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.
In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fifth magnetic element 314 is between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fifth magnetic element 314 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fifth magnetic element 314 is equal to or greater than 90 degrees.
In some embodiments, the angle between the direction of the first full magnetic field and the magnetization direction of the fifth magnetic element 314 is no more than 90 degrees at the location of the fifth magnetic element 314. In some embodiments, at the location of the fifth magnetic element 314, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the direction of magnetization of the fifth magnetic element 314 may be less than or equal to 90 degrees, 0 degrees, 10 degrees, 20 degrees, etc. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the fifth magnetic element 314 is directed from the upper surface of the fifth magnetic element 314 to the lower surface (as shown in the direction of d, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 180 degrees in a clockwise direction).
Magnetic circuit assembly 3400 further adds fifth magnetic element 314 as compared to magnetic circuit assembly 3200. Fifth magnetic element 314 may further increase the total magnetic flux within the magnetic gap in magnetic circuit assembly 3400, thereby increasing the magnetic induction in the magnetic gap. Under the action of the fourth magnetic element 314, the magnetic induction line further converges toward the position of the magnetic gap, and the magnetic induction intensity in the magnetic gap is further increased.
Fig. 3E is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3500 shown in accordance with some embodiments of the present application. As shown in fig. 3E, unlike magnetic circuit assembly 3300, magnetic circuit assembly 3500 may further include a sixth magnetic element 316.
The sixth magnetic element 316 may be attached to the second magnetic element 308 and the sidewall of the second magnetic element 306 by one or more combinations of bonding, clamping, welding, riveting, bolting, etc. In some embodiments, the first magnetic element 302, the first magnetic conductive element 304, the second magnetic conductive element 306, the second magnetic element 308, the fourth magnetic element 312, and the sixth magnetic element 316 may form a magnetic gap. In some embodiments, the magnetization directions of the second magnetic element 308 and the fourth magnetic element 312 may be described in detail with reference to fig. 3A and 3C of the present application.
In some embodiments, magnetic circuit assembly 3500 may generate a first full magnetic field, first magnetic element 302 may generate a second magnetic field, the magnetic field strength of the first full magnetic field within the magnetic gap being greater than the magnetic field strength of the second magnetic field within the magnetic gap. In some embodiments, the sixth magnetic element 316 may generate a sixth magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.
In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 316 is between 0 degrees and 180 degrees. In some embodiments, the included angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 316 is between 45 degrees and 135 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 316 is no greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 is vertically upward (as shown in the direction of fig. a) perpendicular to the lower or upper surface of the first magnetic element 302, and the magnetization direction of the sixth magnetic element 316 is directed from the outer ring of the sixth magnetic element 316 to the inner ring (as shown in the direction f, on the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 270 degrees in the clockwise direction).
In some embodiments, the angle between the direction of the first full magnetic field and the magnetization direction of the sixth magnetic element 316 is no more than 90 degrees at the location of the sixth magnetic element 316. In some embodiments, at the location of the sixth magnetic element 316, the angle between the direction of the magnetic field generated by the first magnetic element 302 and the direction of magnetization of the sixth magnetic element 316 may be greater than 90 degrees, 110 degrees, 120 degrees, etc.
The magnetic circuit assembly 3500 further adds fourth magnetic element 312 and sixth magnetic element 316 as compared to magnetic circuit assembly 3100. Fourth magnetic element 312 and sixth magnetic element 316 may increase the total magnetic flux in the magnetic gap in magnetic circuit assembly 3500, increase the magnetic induction at the magnetic gap, and thus increase the sensitivity of the bone conduction speaker.
Fig. 3F is a schematic longitudinal cross-sectional view of a magnetic circuit assembly 3400 according to some embodiments of the present application. As shown in fig. 3F, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3400 may further include a third magnetically permeable element 318.
In some embodiments, third magnetically permeable element 318 may comprise any one or more of the magnetically permeable materials described herein. The magnetically permeable materials included in the first magnetically permeable element 304, the second magnetically permeable element 306, and/or the third magnetically permeable element 318 may be the same or different. In some embodiments, the third magnetically permeable element 318 may be provided in a symmetrical configuration. For example, third magnetically permeable element 318 may be a cylinder. In some embodiments, the first magnetic element 302, the first magnetic conductive element 304, the second magnetic conductive element 308, and/or the third magnetic conductive element 318 may be coaxial cylinders containing the same or different diameters. The third magnetically permeable element 318 may be coupled to the second magnetic element 308. In some embodiments, the third magnetically permeable element 318 may connect the second magnetic element 308 and the second magnetically permeable element 306 such that the third magnetically permeable element 318 and the second magnetically permeable element 306 form a cavity that may contain the first magnetic element 302, the second magnetic element 308, and the first magnetically permeable element 304.
The magnetic circuit assembly 3400 further adds a third magnetically permeable element 318 as compared to the magnetic circuit assembly 3100. The third magnetic conductive element 318 can inhibit the magnetic leakage of the second magnetic element 308 in the magnetic circuit assembly 3400 in the magnetization direction, so that the magnetic field generated by the second magnetic element 308 can be more compressed into the magnetic gap, thereby improving the magnetic induction intensity in the magnetic gap.
Fig. 4A is a schematic cross-sectional view of a magnetic element structure, according to some embodiments of the present application. The magnetic element 400 may be adapted for use in any of the magnetic circuit assemblies of the present application (e.g., the magnetic circuit assemblies shown in fig. 3A-3F). As shown, the magnetic element 400 may be annular. The magnetic element 400 may include an inner ring 402 and an outer ring 404. In some embodiments, the shape of the inner ring 402 and/or the outer ring 404 may be circular, elliptical, triangular, quadrilateral, or any other polygon.
Fig. 4B is a schematic diagram of a magnetic element structure, according to some embodiments of the present application. The magnetic element may be adapted for use in any of the magnetic circuit assemblies of the present application (e.g., the magnetic circuit assemblies shown in fig. 3A-3F). As shown, the magnetic element may be comprised of a plurality of magnet arrangements. The two ends of any one of the magnets may be connected to the two ends of the adjacent magnets or may have a certain distance. The spacing between the plurality of magnets may be the same or different. In some embodiments, the magnetic element may be comprised of 2 or 3 plate-like magnets (e.g., magnets 408-2, 408-4, and 408-6) arranged equidistantly. The shape of the sheet-like magnet may be a sector, a quadrangle, or the like.
Fig. 4C is a schematic diagram illustrating the magnetization direction of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application. As illustrated, the magnetic circuit assembly may include a first magnetic element 401, a second magnetic element 403, and a third magnetic element 405. The magnetization direction of the first magnetic element 401 may be directed from the lower surface of the first magnetic element 401 to the upper surface (i.e., a direction out of the page perpendicular to the page). The second magnetic element 403 may be disposed around the first magnetic element 401. A magnetic gap may be formed between the inner ring of the second magnetic element 403 and the inner ring of the first magnetic element 401. The magnetization direction of the second magnetic element 403 may be directed from the inner ring to the outer ring of the second magnetic element 403. The inner ring of the third magnetic element 405 may be connected to the outer ring of the first magnetic element 401 and the outer ring of the third magnetic element 405 may be connected to the inner ring of the second magnetic element 403. The magnetization direction of the third magnetic element 405 may be directed from the outer ring of the third magnetic element 403 to the inner ring.
Fig. 4D is a schematic diagram of magnetic induction lines of a magnetic element in a magnetic circuit assembly according to some embodiments of the present application. As shown, a magnetic circuit assembly 400 (e.g., as shown in fig. 3A-3F) may include a first magnetic element 402 and a second magnetic element 404. The magnetization direction of the first magnetic element 402 may be such that the lower surface of the first magnetic element 402 is directed toward the upper surface (as indicated by arrow a). The first magnetic element 402 may generate a second magnetic field, which may be represented by lines of magnetic induction (solid lines in the figure represent the distribution of the second magnetic field in the absence of the second magnetic element 404), the magnetic field direction of the second magnetic field at a point being the tangential direction of the point on the lines of magnetic induction. The magnetization direction of the second magnetic element 404 may be such that the inner ring of the second magnetic element 404 points toward the outer ring (as indicated by arrow b). The second magnetic element 404 may generate a third magnetic field. The third magnetic field may also be represented by lines of magnetic induction (the dashed lines in the figure represent the distribution of the third magnetic field in the absence of the first magnetic element 402), the magnetic field direction of the third magnetic field at a point being the tangential direction of the point on the third lines of magnetic induction. The magnetic circuit assembly 400 may generate a first full magnetic field under the interaction of the second magnetic field and the third magnetic field. The magnetic field strength of the first full magnetic field at voice coil 406 is greater than the magnetic field strength of the second magnetic field or the third magnetic field at voice coil 406. As shown, the angle between the direction of the magnetic field of the second magnetic field at the voice coil 406 and the magnetization direction of the second magnetic element 404 is less than or equal to 90 degrees.
Fig. 5 is a schematic diagram of a bone conduction speaker 5000 according to some embodiments of the present application. As shown, bone conduction speaker 5000 may include first magnetic element 502, first magnetic conductive element 504, second magnetic conductive element 506, second magnetic conductive element 508, voice coil 510, third magnetic conductive element 512, bracket 514, and connection 516. First magnetic element 502, first magnetic element 504, second magnetic element 506, second magnetic element 508, voice coil 510, and/or third magnetic element 512 may be referred to in the relevant description of other figures herein.
The upper surface of the first magnetic element 502 may be connected to the lower surface of the first magnetic element 504. The lower surface of the second magnetic element 508 may be connected to the upper surface of the first magnetically permeable element 504. The second magnetically permeable element 506 may include a first bottom plate and a first side wall. The lower surface of the first magnetic element 502 may be connected to the upper surface of the first base plate. The sidewalls of the second magnetically permeable element 506 form a magnetic gap with the sidewalls of the first magnetic element 502, the first magnetically permeable element 504, and/or the second magnetic element 508. The bracket 514 may include a second floor and a second sidewall. After bracket 514 is coupled to voice coil 510, voice coil 510 may be disposed in the magnetic gap. A voice coil 510 may be coupled to the second sidewall. A side seam may be formed between the upper surface of the voice coil 510 and the second base plate. When the voice coil 510 is disposed in the magnetic gap, the third magnetic conductive element 512 may be connected to the upper surface of the second magnetic conductive element 508 and the first side wall of the second magnetic conductive element 506 through the side slot, so that the third magnetic conductive element 512 and the second magnetic conductive element 506 form a closed cavity. The connection between the first magnetic element 502, the first magnetic element 504, the second magnetic element 506, the second magnetic element 508, the voice coil 510, and/or the third magnetic element 512 may be by any one or more of the connection methods described herein. In some embodiments, one or more hole-like structures (e.g., pin holes, threaded holes, etc.) may be provided on the first magnetic element 502, the first magnetic conductive element 504, the second magnetic conductive element 506, the second magnetic conductive element 508, the third magnetic conductive element 512, and/or the bracket 514. The aperture-like structures may be disposed in a central, peripheral, or other location of the first magnetic element 502, the first magnetic conductive element 504, the second magnetic conductive element 506, the second magnetic conductive element 508, the third magnetic conductive element 512, and/or the bracket 514. The connecting member 516 may extend through the aperture-like structure and connect the various elements. For example, the connection 516 may be a pipe pin. The pin 516 may be press deformed through the bracket 514 using a press head to secure the various components in the bone conduction speaker 5000.
The above description of the structure of bone conduction speaker 5000 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and details of the specific manner and steps of implementing bone conduction speaker 5000 may be made without departing from this principle, while still being within the scope of the foregoing description, after understanding the basic principles of the magnetic circuit assembly. For example, bone conduction speaker 5000 may include one or more conductive elements disposed on the inner side wall, outer side wall, top and/or bottom of voice coil 510. For another example, bone conduction speaker 5000 may further include one or more annular magnetic elements that may be attached to an upper surface of a sidewall of second magnetic conductive element 506 or fixed in a magnetic gap.
Fig. 6 is a schematic diagram of a bone conduction speaker 6000 according to some embodiments of the present application. As shown, bone conduction speaker 6000 may include first magnetic element 602, first magnetic conductive element 604, second magnetic conductive element 606, second magnetic conductive element 608, voice coil 610, third magnetic conductive element 612, bracket 614, connector 616, bracket link 618, and gasket 620. The upper surface of first magnetic element 602 may be coupled to the lower surface of first magnetic element 606. The lower surface of the second magnetic element 608 may be connected to the upper surface of the first magnetic element 606. The second magnetically permeable element 606 may include a first bottom plate and a first sidewall, where the first sidewall may be formed by the bottom plate extending in a direction perpendicular to the bottom plate. The lower surface of the first magnetic element 602 may be coupled to the upper surface of the bottom plate of the second magnetic element 606. The sidewalls of the second magnetically permeable element 606 form a magnetic gap with the sidewalls of the first magnetic element 602, the first magnetically permeable element 604, and/or the second magnetic element 608. One or more rod-like structures may be provided around the bracket link 618. Voice coil 610 may be coupled to a spider link 618. After the bracket link 618 is connected to the voice coil 610, the voice coil 610 may be disposed in the magnetic gap. The third magnetic conductive element 612 may include a second bottom plate and a second side wall, where the second side wall may be formed by extending the second bottom plate, and the second side wall may be provided with one or more first hole structures, where the first hole structures correspond to the rod-shaped structures of the bracket link 618, and the rod-shaped structures of the bracket link 618 may penetrate through the first hole structures of the third magnetic conductive element 612. When the voice coil 610 is disposed in the magnetic gap, the second side wall of the third magnetic conductive element 612 may be connected to the rod-shaped structure of the bracket link 618 through the first hole-shaped structure, and the second bottom plate may be connected to the upper surface of the second magnetic element 608. The connection between the first magnetic element 602, the first magnetic element 604, the second magnetic element 606, the second magnetic element 608, the voice coil 610, and/or the third magnetic element 612 may be by any one or more of the connection methods described herein. In some embodiments, the first magnetic element 602, the first magnetic conductive element 604, the second magnetic conductive element 606, the second magnetic conductive element 608, the third magnetic conductive element 612, and/or the support 614 may be provided with a second aperture-like structure at a center, around, or other location. The connecting member 616 may extend through the aperture-like structure and connect the various elements. For example, the connecting member 616 may be a pipe pin. The pin 616 may be punched and deformed through the frame 614 using a punch to secure the first magnetic element 602, the first magnetic element 604, the second magnetic element 606, the second magnetic element 608, and the third magnetic element 612. The support 614 may be connected to a support rail 618, and the gasket 620 may further connect the second side wall of the third magnetically permeable element 612 and the first side wall of the second magnetically permeable element 606, thereby further securing the second magnetically permeable element 606 and the third magnetically permeable element 612. In some embodiments, the gasket 620 may be coupled to the frame 614 via a vibrating plate.
The above description of the structure of bone conduction speaker 6000 is merely a specific example and should not be considered as the only viable embodiment. It will be apparent to those skilled in the art that various modifications and changes in form and details of the specific manner and steps of implementing bone conduction speaker 6900 may be made without departing from this principle, but still remain within the scope of the foregoing description. For example, bone conduction speaker 6000 may include one or more conductive elements disposed on the inner side wall, outer side wall, top and/or bottom of voice coil 610. For another example, bone conduction speaker 6000 may further include one or more annular magnetic elements that may be attached to an upper surface of a sidewall of second magnetic conductive element 606 or fixed in a magnetic gap.
While the basic concepts have been described above, it will be apparent to those skilled in the art that the above disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations of the present application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this application, and are therefore within the spirit and scope of the exemplary embodiments of this application.
Meanwhile, the present application uses specific words to describe embodiments of the present application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present application. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present application may be combined as suitable.
Furthermore, those skilled in the art will appreciate that the various aspects of the invention are illustrated and described in terms of several patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the present application may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.) or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the present application may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.
Furthermore, the order in which the elements and sequences are processed, the use of numerical letters, or other designations are used herein is not intended to limit the order in which the processes and methods of the present application are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present application. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.
Likewise, it should be noted that in order to simplify the presentation disclosed herein and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure, however, is not intended to imply that more features than are presented in the claims are required for the subject application. Indeed, less than all of the features of a single embodiment disclosed above.
In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments, in some examples, are modified with the modifier "about," "approximately," or "substantially," etc. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical data used in the specification and claims is approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical data should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and data used in some embodiments of the present application to determine the breadth of their ranges are approximations, in particular embodiments, the settings of such numerical values are as precise as possible.
Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of this application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the present application may be considered in keeping with the teachings of the present application. Accordingly, embodiments of the present application are not limited to only the embodiments explicitly described and depicted herein.

Claims (10)

1. A magnetic circuit assembly for a bone conduction speaker, the magnetic circuit assembly comprising:
a first magnetic element that generates a first magnetic field;
a first magnetic conductive element;
a second magnetically permeable element surrounding the first magnetic element at least partially and forming a magnetic gap with the first magnetic element; and
the at least one second magnetic element is connected with the upper surface of the first magnetic conduction element, the at least one second magnetic element generates a second magnetic field, the first magnetic element is connected with the lower surface of the first magnetic conduction element, and the magnetization directions of the first magnetic element and the at least one second magnetic element are opposite.
2. The magnetic circuit assembly of claim 1, wherein an upper surface of the first magnetic element is connected to the first magnetic element and a lower surface of the at least one second magnetic element is connected to an upper surface of the first magnetically permeable element; in the arrangement direction of the first magnetic element and the at least one second magnetic element, the magnetization directions of the first magnetic element and the at least one second magnetic element are opposite.
3. The magnetic circuit assembly of claim 1, wherein the magnetization direction of the first magnetic element is vertically upward perpendicular to the lower or upper surface of the first magnetic element.
4. The magnetic circuit assembly of claim 1, wherein a ratio of a thickness of the first magnetic element to a sum of thicknesses of the first magnetic element, the at least one second magnetic element, and the first magnetically permeable element ranges from 0.4 to 0.6.
5. The magnetic circuit assembly of claim 1, wherein the thickness of the at least one second magnetic element is equal to the thickness of the first magnetic element; alternatively, the thickness of the at least one second magnetic element is less than the thickness of the first magnetic element.
6. The magnetic circuit assembly of claim 1, further comprising at least one third magnetic element surrounding the at least one second magnetic element.
7. The magnetic circuit assembly of claim 6, wherein an included angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is between 45 degrees and 135 degrees.
8. The magnetic circuit assembly of claim 7, wherein an included angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is not less than 90 degrees.
9. The magnetic circuit assembly of claim 6, wherein the second magnetically permeable element is a recessed structure comprising a bottom plate and a side wall, the upper surface of the first magnetic element being connected to the lower surface of the first magnetic element, the lower surface of the first magnetic element being connected to the bottom plate of the second magnetic element, the lower surface of the second magnetic element being connected to the upper surface of the first magnetic element; the lower surface of the third magnetic element is connected with the side wall of the second magnetic conduction element; a magnetic gap is formed among the first magnetic element, the first magnetic conduction element, the second magnetic conduction element and/or the third magnetic element, and a voice coil is arranged in the magnetic gap; the third magnetic element, the first magnetically permeable element, the second magnetic element, and the third magnetic element form a magnetic circuit.
10. A bone conduction speaker, the bone conduction speaker comprising: a vibration assembly including a voice coil and at least one vibration plate; and a magnetic circuit assembly as claimed in any one of claims 1 to 9.
CN202311242898.9A 2018-01-08 2018-01-08 Bone conduction loudspeaker Pending CN117395572A (en)

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CN202311242898.9A CN117395572A (en) 2018-01-08 2018-01-08 Bone conduction loudspeaker

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CN201810015448.9A CN107948881A (en) 2018-01-08 2018-01-08 A kind of bone-conduction speaker
CN202311242898.9A CN117395572A (en) 2018-01-08 2018-01-08 Bone conduction loudspeaker

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