RU2803722C2 - Bone conduction speaker - Google Patents

Abstract

FIELD: acoustic equipment.

SUBSTANCE: magnetic circuit assembly may generate the first magnetic field. The magnetic circuit assembly may include the first magnetic element, and the first magnetic element may generate the second magnetic field. The magnetic circuit contains two elements guiding the magnetic flux. The said at least one second magnetic element may be configured to surround the first magnetic element, and a magnetic gap may be formed between the second magnetic element and the first magnetic element. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. The internal angle between the direction of magnetization of the said at least one second magnetic element and the direction of magnetization of the first magnetic element is in the range of 45 degrees to 135 degrees or in the range of 45 degrees to 90 degrees.

EFFECT: increased output power level of sound signals.

9 cl, 19 dwg

Description

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] The present invention claims priority to international application PCT/CN2018/071751, filed January 8, 2018, the contents of which are incorporated herein by reference in their entirety.

FIELD OF THE INVENTION

[0002] The present invention relates to bone conduction repeaters and, in particular, relates to magnetic circuit assemblies of bone conduction repeaters.

BACKGROUND OF THE INVENTION

[0003] The bone conduction speaker can convert electrical signals into mechanical vibration signals and transmit mechanical vibration signals to the cochlea through human tissue and bone, so that the user can hear sound. Unlike air conduction loudspeakers, which generate sound based on air vibration generated by vibrating membranes, bone conduction loudspeakers must generate vibrations in the user's soft tissue and bones, which increases the required mechanical power. Increasing the sensitivity of the bone conduction transmitter allows for greater efficiency in converting electrical energy into mechanical energy, resulting in higher mechanical power output. Increasing sensitivity is especially important for bone conduction reproducers, which have increased power requirements.

SUMMARY OF THE INVENTION

[0004] The present invention relates to a magnetic circuit assembly of a bone conduction repeater. The magnetic circuit assembly may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element generating a second magnetic field; a first magnetic guide element and at least one second magnetic element. Said at least one second magnetic element may be configured to surround the first magnetic element, and a magnetic gap may be formed between the second magnetic element and the first magnetic element. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap.

[0005] According to some embodiments of the present invention, the magnetic circuit assembly may further include a second magnetic guide element and at least one third magnetic element. Said at least one third magnetic element may be connected to the second magnetic guide element and said at least one second magnetic element.

[0006] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element located below the magnetic gap. Said at least one fourth magnetic element may be connected to the first magnetic element and the second magnetic guide element.

[0007] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fifth magnetic element coupled to the top surface of the first magnetic guide element.

[0008] According to some embodiments of the present invention, the magnetic circuit assembly may further include a third magnetic guide element coupled to the top surface of the fifth magnetic element. The third magnetic guide element may be configured to suppress leakage of the first magnetic field strength.

[0009] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one conductive element coupled to the first magnetic element, the first magnetic guide element, or at least one of the second magnetic guide elements.

[0010] The present invention also relates to a bone conduction repeater magnetic circuit assembly. The magnetic component may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element generating a second magnetic field; a first magnetic guide element; second magnetic guide element. The second magnetic guide element may be configured to surround the first magnetic element, and a magnetic gap may be formed between the second magnetic guide element and the first magnetic element. Said at least one second magnetic element may be located below the magnetic gap. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap.

[0011] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one third magnetic element. Said at least one third magnetic element may be connected to the second magnetic guide element.

[0012] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element. Said at least one fourth magnetic element may be located between the second magnetic guide element and said at least one third magnetic element.

[0013] According to some embodiments of the present invention, the magnetic circuit assembly may further include a magnetic shield. The magnetic shield may be configured to surround the first magnetic element, the first magnetic guide element, the second magnetic guide element, and the second magnetic element.

[0014] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one conductive element. Said at least one conductive element may be connected to the first magnetic element, the first magnetic guide element or at least one element of the second magnetic element.

[0015] The present invention relates to a bone conduction repeater magnetic circuit assembly. The magnetic component may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element, and the first magnetic element may generate a second magnetic field; a first magnetic guide element; a second magnetic guide element, wherein at least a portion of the second magnetic guide element may be configured to surround the first magnetic element, and a magnetic gap may be formed between the second magnetic guide element and the first magnetic element. The at least one second magnetic element may be connected to the upper surface of the first magnetic guide element, and the strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap.

[0016] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one third magnetic element. Said at least one third magnetic element may surround said at least one second magnetic element.

[0017] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element. Said at least one fourth magnetic element may be connected to the second magnetic guide element and said at least one third magnetic element.

[0018] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fifth magnetic element located below the magnetic gap. Said at least one fifth magnetic element may be connected to the first magnetic element and the second magnetic guide element.

[0019] According to some embodiments of the present invention, the magnetic circuit assembly may further include a third magnetic guide element coupled to the at least one second magnetic element.

[0020] The present invention relates to a magnetic circuit assembly of a bone conduction repeater. The magnetic circuit assembly may include a first magnetic element generating a second magnetic field; first magnetic guide element. Said at least one second magnetic element may be configured to surround the first magnetic element, and a magnetic gap may be formed between the second magnetic element and the first magnetic element. The second magnetic element may generate a second magnetic field, and the second magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0021] According to some embodiments of the present invention, the magnetic circuit assembly may further include a second magnetic guide element and at least one third magnetic element coupled to the second magnetic guide element and the at least one second magnetic element. The at least one third magnetic element may generate a third magnetic field, and the third magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0022] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element located below the magnetic gap. Said at least one fourth magnetic element may be connected to the first magnetic element and the second magnetic guide element. Said at least one fourth magnetic element can generate a fourth magnetic field. The fourth magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0023] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fifth magnetic element coupled to the top surface of the first magnetic guide element. The at least one fifth magnetic element may generate a fifth magnetic field, and the fifth magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0024] According to some embodiments of the present invention, the magnetic circuit assembly may further include a third magnetic guide element coupled to the top surface of the fifth magnetic element. The third magnetic guide member may be configured to suppress leakage of the strength of the first magnetic field and the second magnetic field.

[0025] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one conductive element. Said at least one conductive element may be connected to the first magnetic element, the first magnetic guide element or at least one of the second magnetic guide elements.

[0026] The present invention relates to a bone conduction repeater magnetic circuit assembly. The magnetic circuit assembly may include a first magnetic element generating a first magnetic field; a first magnetic guide element; a second magnetic guide element configured to surround the first magnetic element, wherein a magnetic gap is provided between the at least one second magnetic element and the first magnetic element. Said at least one second magnetic element may be located below the magnetic gap, said at least one second magnetic element may generate a second magnetic field, and the second magnetic field may increase the magnitude of the magnetic induction of the first magnetic field in the magnetic gap.

[0027] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one third magnetic element coupled to the second magnetic guide element. The at least one third magnetic element may generate a third magnetic field, and the third magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0028] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element located between the second magnetic guide element and the at least one third magnetic element.

[0029] According to some embodiments of the present invention, the magnetic circuit assembly may further include a magnetic shield. The magnetic shield may be configured to surround the first magnetic element, the first magnetic guide element, the second magnetic guide element, and the second magnetic element.

[0030] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fifth magnetic element coupled to the top surface of the first magnetic guide element, and the at least one fifth magnetic element may generate a fifth magnetic field. The fifth magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0031] According to some embodiments of the present invention, the magnetic circuit assembly may further include a third magnetic guide element coupled to the top surface of the fifth magnetic element. The third magnetic guide member may be configured to suppress leakage of the strength of the first magnetic field and the second magnetic field.

[0032] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one conductive element coupled to the first magnetic element, the first magnetic guide element, or at least one element of the second magnetic element.

[0033] The present invention relates to a bone conduction repeater magnetic circuit assembly. The magnetic circuit assembly may include a first magnetic element generating a second magnetic field; a first magnetic guide member; a second magnetic guide element, wherein at least a portion of the second magnetic guide element is configured to surround the first magnetic element, and a magnetic gap is provided between the at least one second magnetic element and the first magnetic element. Said at least one second magnetic element may be connected to an upper surface of the first magnetic guide element. The at least one second magnetic element may generate a second magnetic field, and the second magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0034] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one third magnetic element, and said at least one third magnetic element may be configured to surround said at least one second magnetic element.

[0035] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element. Said at least one fourth magnetic element may be connected to the second magnetic guide element and said at least one third magnetic element.

[0036] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fifth magnetic element located below the magnetic gap. Said at least one fifth magnetic element may be connected to the first magnetic element and the second magnetic guide element.

[0037] According to some embodiments of the present invention, the magnetic circuit assembly may further include a third magnetic guide element coupled to the at least one second magnetic element.

[0038] The present invention relates to a bone conduction repeater magnetic circuit assembly. The magnetic circuit assembly may include a first magnetic element that generates a second magnetic field; a first magnetic guide element; a second magnetic guide member that includes a support plate and a side wall, and the support plate of the second magnetic guide member is connected to the first magnetic member; at least one second magnetic element, wherein said at least one second magnetic element is connected to a side wall of the second magnetic guide element, and a magnetic gap and at least one third magnetic element are formed with the first magnetic element. Said at least one third magnetic element may be connected to the support plate and the side wall of the second magnetic guide element. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap.

[0039] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fourth magnetic element. Said at least one fourth magnetic element may be connected to a top surface of said at least one second magnetic element and a side wall of the second magnetic guide element.

[0040] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one fifth magnetic element coupled to the top surface of the first magnetic guide element.

[0041] According to some embodiments of the present invention, the magnetic circuit assembly may further include a third magnetic guide element coupled to the top surface of the fifth magnetic element. The third magnetic guide element may be configured to suppress leakage of the first magnetic field strength.

[0042] According to some embodiments of the present invention, the magnetic circuit assembly may further include at least one conductive element. Said at least one conductive element may be connected to the first magnetic element, the first magnetic guide element or at least one element of the second magnetic guide element.

[0043] The present invention relates to a bone conduction reproducer. The bone conduction speaker may include a vibration assembly including a voice coil and at least one vibration plate; a magnetic circuit assembly including a first magnetic element that generates a first magnetic field; the first magnetic guide element and the at least one second magnetic element may be configured to surround the first magnetic element, and a magnetic gap may be formed between the second magnetic element and the first magnetic element. The voice coil may be located in the magnetic gap, the at least one second magnetic element may generate a second magnetic field, and the first magnetic field and the second magnetic field may increase the strength of the first magnetic field on the voice coil.

[0044] Certain additional features of the present invention may be explained in the following description. Some of the additional features of the present invention will be apparent to those skilled in the art from a review of the following description and related drawings, or an understanding of the manufacture or operation of the embodiments. The features disclosed in the present invention can be implemented and achieved through practice or use of various methods, means and combinations of the specific embodiments described below.

BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The drawings described herein are used to provide a better understanding of the present invention and form part of this specification. The exemplary embodiments and descriptions of the present invention are for illustrative purposes only and are not intended to limit the scope of the present invention. In the drawings, like reference numerals denote like structures.

[0046] FIG. 1 is a block diagram showing a bone conduction generator according to some embodiments of the present invention;

[0047] FIG. 2 is a diagram showing a longitudinal sectional view of a bone conduction generator according to some embodiments of the present invention;

[0048] FIG. 3A is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0049] FIG. 3B is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0050] FIG. 3C is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0051] FIG. 3D is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0052] FIG. 3E is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0053] FIG. 3F is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0054] FIG. 3G is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0055] FIG. 4A is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0056] FIG. 4B is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0057] FIG. 4C is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0058] FIG. 4D is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0059] FIG. 4E is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0060] FIG. 4F is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0061] FIG. 4G is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0062] FIG. 4H is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0063] FIG. 4M is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0064] FIG. 5A is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0065] FIG. 5B is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0066] FIG. 5C is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0067] FIG. 5D is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0068] FIG. 5E is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0069] FIG. 5F is a diagram showing a longitudinal sectional view of a magnetic circuit assembly according to some embodiments of the present invention;

[0070] FIG. 6A is a diagram showing a cross section of a magnetic element according to some embodiments of the present invention;

[0071] FIG. 6B is a diagram showing a magnetic element according to some embodiments of the present invention;

[0072] FIG. 6C is a diagram showing the direction of magnetization of a magnetic element in a magnetic circuit assembly according to some embodiments of the present invention;

[0073] FIG. 6D is a diagram showing magnetic flux lines of a magnetic element in a magnetic circuit assembly according to some embodiments of the present invention;

[0074] FIG. 7A is a diagram showing a magnetic circuit assembly according to some embodiments of the present invention;

[0075] FIG. 7B to 7E are graphs showing relationship curves between the voice coil driving force coefficient and the parameters of the magnetic circuit assembly in FIG. 7A according to some embodiments of the present invention;

[0076] FIG. 8A is a block diagram showing a magnetic circuit assembly according to some embodiments of the present invention;

[0077] FIG. 8B - 8E are relationship curves between the driving force coefficient of a voice coil shown in accordance with some embodiments of the present invention and the parameters of the magnetic circuit assembly shown in FIG. 8A;

[0078] FIG. 9A is a diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly according to some embodiments of the present invention;

[0079] FIG. 9B is a graph showing the relationship curve between the amount of magnetic induction across a voice coil and the thickness of one or more components in the magnetic circuit assembly of FIG. 9A according to some embodiments of the present invention;

[0080] FIG. 10A is a diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly according to some embodiments of the present invention;

[0081] FIG. 10B is a curve showing the relationship between the amount of magnetic induction on a voice coil and the thickness of each element in the magnetic circuit assembly of FIG. 10A according to some embodiments of the present invention;

[0082] FIG. 11A is a diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly according to some embodiments of the present invention;

[0083] FIG. 11B is a curve showing the relationship between the magnitude of magnetic induction and the thickness of the magnetic element of the magnetic circuit assembly in FIG. 9A, FIG. 10A and FIG. 11A according to some embodiments of the present invention;

[0084] FIG. 11C is a curve showing the relationship between the amount of magnetic flux density at the voice coil and the thickness of each component in the magnetic circuit assembly of FIG. 11A according to some embodiments of the present invention;

[0085] FIG. 12A is a block diagram showing a magnetic circuit assembly according to some embodiments of the present invention;

[0086] FIG. 12B is a curve showing the relationship between the inductive reactance of a voice coil and a conductive element in the magnetic circuit assembly shown in FIG. 12A according to some embodiments of the present invention;

[0087] FIG. 13A is a block diagram showing a magnetic circuit assembly according to some embodiments of the present invention;

[0088] FIG. 13B is a curve showing the relationship between the inductive reactance of the voice coil and the conductive element in the magnetic circuit assembly of FIG. 13A according to some embodiments of the present invention;

[0089] FIG. 14A is a block diagram showing a magnetic circuit assembly according to some embodiments of the present invention;

[0090] FIG. 14B is a curve showing the relationship between the inductive reactance of a voice coil and the number of conductive elements in the magnetic circuit assembly shown in FIG. 14A according to some embodiments of the present invention;

[0091] FIG. 15A is a block diagram showing a magnetic circuit assembly according to some embodiments of the present invention;

[0092] FIG. 15B is a curve showing the relationship between the Ampere force on a voice coil and the thickness of each element in the magnetic circuit assembly shown in FIG. 15A according to some embodiments of the present invention;

[0093] FIG. 16 is a block diagram showing a bone conduction generator according to some embodiments of the present invention;

[0094] FIG. 17 is a block diagram showing a bone conduction generator according to some embodiments of the present invention;

[0095] FIG. 18 is a block diagram showing a bone conduction generator according to some embodiments of the present invention; And

[0096] FIG. 19 is a block diagram showing a bone conduction reproducer according to some embodiments of the present invention.

DETAILED DESCRIPTION

[0097] To illustrate the technical solutions associated with the embodiments of the present invention, the following is a brief introduction to the description of the embodiments based on the drawings. Obviously, the drawings described below are only some examples or embodiments of the present invention. Without further creative effort, one skilled in the art can apply the present invention to other similar scenarios according to these drawings. It should be understood that the illustrative embodiments are provided only to better understand and apply the present invention to those skilled in the art, and are not intended to limit the scope of the present invention. Unless clearly evident from the context or the context demonstrates otherwise, the same reference number in the drawings denotes the same structure or operation.

[0098] The use of singular forms in the description of the invention and the following claims does not exclude the possibility of having multiple copies, unless the content directly states otherwise. In general, the terms “comprise” and “include” are intended only to include steps and elements that have been clearly identified, and these steps and elements do not constitute an exhaustive list. Methods or devices may also include other steps or elements. The term "based on" means "at least partially based on." The term “one embodiment” means “at least one embodiment”; the term “another embodiment” means “at least one other embodiment.” Related definitions of other terms are provided in the description below. Hereinafter, without loss of generality, the description of “bone conduction repeater” or “bone conduction headset” will be used when describing the bone conduction technologies of the present invention. Only a special case of the use of bone conduction is described here. One skilled in the art may also replace "repeater" or "headset" with other similar words, such as "recorder", "hearing aid", etc. In fact, various implementations in the present invention can be easily applied to other listening devices other than loudspeakers. For example, one skilled in the art, having understood the basic principle of the bone conduction reproducer, can make various modifications and changes regarding the shape and details of specific means and implementation steps of the bone conduction reproducer without going beyond this principle. In particular, the function of detecting and processing external sound can be added to the bone conduction speaker, so that the bone conduction speaker can realize the function of a hearing aid. For example, recorders, including microphones, can record sound in the user/wearer's environment and, according to some algorithm, send the processed sound (or generated electrical signal) to a bone conduction speaker, i.e. The bone conduction speaker can be modified to include an external sound detection function, and after some signal processing, the sound is transmitted to the user/wearer through the bone conduction speaker, allowing the function of a bone conduction hearing aid to be realized. For example, the algorithm mentioned herein may include a noise reduction algorithm, an automatic gain control algorithm, an acoustic feedback suppression algorithm, a wide dynamic range compression algorithm, an active environment recognition algorithm, an active noise reduction algorithm, a directional processing algorithm, a tinnitus processing algorithm, an multi-channel wide dynamic range compression, active nonlinear distortion suppression algorithm, volume control algorithm, etc., or any combination thereof.

[0099] The present invention provides a highly sensitive bone conduction reproducer. In some embodiments, the bone conduction reproducer may include a magnetic circuit assembly. The magnetic circuit assembly may generate a first magnetic field. The magnetic circuit assembly may include a first magnetic element, a first magnetic guide element, a second magnetic guide element, and one or more second magnetic elements. The first magnetic element may generate a second magnetic field, and one or more second magnetic elements may be configured to surround the first magnetic element, and a magnetic gap may be formed between the one or more second magnetic elements and the first magnetic element. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. The configuration of one or more second magnetic elements in a magnetic circuit assembly surrounding the first magnetic element can reduce the volume and weight of the magnetic circuit assembly, increase the efficiency of the bone conduction speaker, and increase the service life of the bone conduction speaker when the magnetic field strength in the magnetic gap and the sensitivity of the speaker increases bone conduction.

[0100] The bone conduction speaker may have small size, light weight, high efficiency, high sensitivity, long service life, etc., which is convenient for combining the bone conduction speaker with a wearable smart device, allowing multiple functions of a single device to be achieved, improving and optimizing the user experience. A wearable smart device may include, but is not limited to, smart headphones, smart glasses, smart headbands, smart helmets, smart watches, smart gloves, smart shoes, smart cameras, and the like. The bone conduction reproducer can be further combined with smart materials to integrate the bone conduction reproducer into the production of clothing materials, gloves, hats, shoes, etc. user. The bone conduction repeater can optionally be implanted into the human body and interact with a chip implanted in the human body or an external processor to provide a more personalized function.

[0101] In FIG. 1 is a block diagram illustrating a bone conduction reproducer 100 according to some embodiments of the present invention. As shown, the bone conduction speaker 100 may include a magnetic circuit assembly 102, a vibration assembly 104, a support assembly 106, and a storage assembly 108.

[0102] Magnetic circuit assembly 102 may provide a magnetic field. A magnetic field can be used to convert a signal containing audio information into a vibration signal. In some embodiments, the audio information may include a video and/or audio file having a particular data format, or data or files that can be converted into audio in some manner. The audio signal may come from the storage assembly 108 of the bone conduction speaker 100 itself or from an information generation, storage, or transmission system other than the bone conduction speaker 100. The sound signal may include an electrical signal, an optical signal, a magnetic signal, a mechanical signal, and the like. or any combination thereof. The audio signal may come from a signal source or a plurality of signal sources. Multiple signal sources may or may not be associated. In some embodiments, the bone conduction speaker 100 may receive the audio signal in a variety of ways. Signal reception can be wired or wireless and can be real-time or delayed. For example, bone conduction speaker 100 may receive an electrical audio signal wired or wirelessly, or may receive data directly from a storage medium (eg, storage unit 108) to generate an audio signal. As another example, a bone conduction hearing aid may include a sound collection component. The mechanical vibration of sound can be converted into an electrical signal by detecting the sound in the environment, and an electrical signal that meets specific requirements can be obtained after processing by an amplifier. In some embodiments, the wired connection may include the use of a metallic cable, an optical cable, or a hybrid metal-optical cable, such as a coaxial cable, a communications cable, a flexible cable, a coiled cable, a non-metallic braided cable, a metallic braided cable, a stranded cable, twisted pair cable, ribbon cable, shielded cable, telecommunications cable, two-wire line, etc., or any combination thereof. The above examples are provided for convenience of explanation only. The wire connection media may also be other types, such as other electrical or optical signal transmission media.

[0103] Wireless communication may include radio communication, optical communication in empty space, acoustic communication and electromagnetic induction, and the like. The radio communication may include IEEE 1002.11 standard, IEEE 1002.15 standard (for example, Bluetooth method and Zigbee method, etc.), the first mobile generation method, the second mobile generation method (for example, FDMA, TDMA, SDMA, CDMA and SSMA etc.), general wireless packet service method, third mobile generation method (such as CDMA2000, WCDMA, TD-SCDMA and WiMAX, etc.), fourth mobile generation method (such as TD-LTE and FDD-LTE, etc.), satellite communications (e.g. GPS technology, etc.), near field communication (NFC) and other methods operating in the ISM band (e.g. 2.4 GHz, etc. ); optical communication in empty space may include the use of visible light, infrared signal, etc.; acoustic communication may include the use of a sound wave, an ultrasonic signal, etc.; electromagnetic induction may include near-field communication method, etc. The above examples are for illustration purposes only. Wireless communication media may be other types, such as Z-wave, other civil radio frequency bands, military radio frequency bands, etc. For example, bone conduction speaker 100 can receive audio from other devices via Bluetooth.

[0104] The vibration assembly 104 may generate mechanical vibration. The generation of mechanical vibration can be accompanied by energy conversion. The bone conduction speaker 100 may use a particular magnetic circuit assembly 102 and a vibration assembly 104 to convert the audio signal into mechanical vibration. The transformation process may involve the coexistence and transformation of many different types of energy. For example, an electrical sound signal can be directly converted into mechanical vibration by a transducer to generate sound. By way of another example, audio information may be included in an optical signal, and a particular transducer may convert the optical signal to a vibration signal. Other types of energy that may coexist and be converted during operation of the converter may include thermal energy, magnetic field energy, etc. According to the energy conversion method, the converter may include moving coil type, electrostatic type, piezoelectric type, moving core type, pneumatic type, electromagnetic type, etc. The vibration assembly 104 may affect the frequency response range and sound quality of the bone conduction speaker 100 . For example, in a moving coil type transducer, the vibrating assembly 104 may include a cylindrical coil and a vibrator (eg, a vibrating plate). The cylindrical coil, excited by the signal current, can cause the vibrator to vibrate in the magnetic field provided by the magnetic circuit assembly 102 and produce a sound. The sound quality of the bone conduction speaker 100 may be affected by expansion and contraction, deformation, size, shape, fixed average, etc. vibrator, and the magnetic flux density of the permanent magnet in the magnetic circuit assembly 102. The vibrator in the vibration assembly 104 may have a mirror-symmetrical design, a centrally symmetrical design, or an asymmetrical design. The vibrator can be provided with multiple holes so that the vibrator can have a greater displacement, which provides higher sensitivity and increases the vibration and sound output for the bone conduction speaker. The vibrator can be made in the form of one or more coaxial annular bodies. Multiple support rods, which may converge toward a center, may be located in each of one or more coaxial annular bodies. There can be two or more support rods.

[0105] The support assembly 106 may support the magnetic circuit assembly 102 , the vibration assembly 104 , and/or the storage assembly 108 . The support assembly 106 may include one or more housings and one or more connectors. One or more housings may define a gap in which a magnetic circuit assembly 102, a vibration assembly 104, and/or a storage assembly 108 may be located. One or more connectors may connect the housings to the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108.

[0106] The storage unit 108 may store audio signals. In some embodiments, storage node 108 may include one or more storage devices. The one or more storage devices may include storage devices in a storage system (eg, direct attached drive, network attached drive, and storage area network, etc.). The one or more storage devices may include various types of storage devices, for example, a solid-state storage device (e.g., a solid-state hard disk, a solid-state hybrid hard disk, etc.), a mechanical hard disk, a USB flash memory, a circuit memory, memory card (such as CF, SD, etc.), other drives (such as CD, DVD, HD DVD, Blu-ray, etc.), random access memory (RAM) and read-only memory (ROM) . RAM may include dekatron, selectron, delay line memory, Williams tubes, dynamic random access memory (DRAM), static random access memory (SRAM), thyristor random access memory (T-RAM), zero capacitor random access memory (Z-RAM) etc. ROM may include DMD memory, twistor memory, film memory, cylindrical magnetic tape memory, magnetic core memory, drum memory, CD-ROM, hard disk, tape, non-volatile random access memory (NVRAM), phase change memory , magnetoresistive RAM, ferroelectric RAM, non-volatile SRAM, flash memory, electrically erasable programmable read only memory, erasable programmable read only memory, programmable read only memory, mask ROM, floating gate RAM, nano RAM, running memory, resistive RAM memory, programmable metallization cell, etc. The above memory device/storage unit is a list of some examples. The storage device/storage unit may use a storage device that is not limited to this.

[0107] The above description of a bone conduction reproducer may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, those skilled in the art, having understood the basic principle of the bone conduction reproducer, can make various modifications and changes regarding the shape and details of specific means and stages of implementation of the bone conduction reproducer, without going beyond this principle, but these modifications and changes are still in the volume described above. For example, bone conduction speaker 100 may include one or more processors, which one or more processors may execute one or more algorithms for processing audio signals. Algorithms for processing audio signals can modify or amplify the audio signal. For example, noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment sensing, active noise reduction, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active harmonic reduction, volume control or other similar or any combination of the above processing may be performed on the audio signals. These adjustments and changes remain within the scope of the present invention. By way of another example, bone conduction transmitter 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a speed sensor, a displacement sensor, and the like. The sensor can collect information about the user or information about the environment.

[0108] In FIG. 2 is a diagram showing a vertical cross-section of a bone conduction speaker 200 according to some embodiments of the present invention. As shown, the bone conduction speaker 200 may include a first magnetic element 202, a first magnetic guide element 204, a second magnetic guide element 206, a first vibration plate 208, a voice coil 210, a second vibration plate 212, and a vibration panel 214.

[0109] As used herein, the term “magnetic element” described in the present invention means an element that can generate a magnetic field, such as a magnet. The magnetic element may have a magnetization direction, and the magnetization direction may refer to the direction of the magnetic field within the magnetic element. The first magnetic element 202 may include one or more magnets. In some embodiments, the magnet may include a magnet made of a metal alloy, ferrite, or the like. The metal alloy for the magnet may include neodymium-iron-boron, samarium-cobalt, aluminum-nickel-cobalt, iron-chromium-cobalt, aluminum-iron-boron, iron-carbon-aluminum, etc., or a combination thereof . The ferrite may include barium ferrite, ferritic steel, manganese ferrite, lithium manganese ferrite, and the like, or a combination thereof.

[0110] A lower surface of the first magnetic guide member 204 may be coupled to an upper surface of the first magnetic member 202. A second magnetic guide member 206 may be coupled to the first magnetic member 202. It should be noted that the magnetic guide member used herein may also be referred to as a magnetic field concentrator or iron core. The magnetic guide element can adjust the distribution of a magnetic field (eg, a magnetic field generated by the first magnetic element 202). The magnetic guide element can be made of a soft magnetic material. In some embodiments, the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, and the like, such as iron, iron-silicon alloy, iron-aluminum alloy, iron-nickel alloy, iron-cobalt alloy, low-carbon steel, sheet transformer steel, ferrite, etc. In some embodiments, the magnetic guide member may be manufactured by casting, plastic processing, cutting, powder metallurgy, or the like. or any combination thereof. Casting may include sand casting, lost wax casting, injection molding, centrifuge casting, etc. Plastic processing may include rolling, casting, forging, stamping, extrusion, drawing, etc., or any combination thereof. Machining may include turning, milling, planing, grinding, etc. In some embodiments, the magnetic guide element processing means may include a 3D printer, CNC machine, or the like. The connection means between the first magnetic guide member 204, the second magnetic guide member 206, and the first magnetic member 202 may include bonding, clamping, welding, riveting, bolting, or the like, or any combination thereof. In some embodiments, the first magnetic element 202, the first magnetic guide element 204, the second magnetic guide element 206 may be configured as an axisymmetric structure. The axisymmetric structure may be a ring structure, a columnar structure, or other axisymmetric structures.

[0111] In some embodiments, a magnetic gap may be formed between the first magnetic element 202 and the second magnetic guide element 206. The voice coil 210 may be located in the magnetic gap. The voice coil 210 may be coupled to the first vibration plate 208. The first vibration plate 208 may be coupled to the second vibration plate 212, and the second vibration plate 212 may be coupled to the vibration plate 214. When current flows through the voice coil 210, the voice coil 210 may be located in a magnetic field formed by the first magnetic element 202, the first magnetic guide element 214 and the second magnetic guide element 206, and is subjected to the action of an Ampere force generated in the magnetic field. Ampere force may cause the voice coil 210 to vibrate, and the vibration of the voice coil 210 may cause the first vibration plate 208, the second vibration plate 212, and the vibration panel 214 to vibrate. The vibration panel 214 may transmit vibration to the auditory nerve through tissue and bone, thereby allowing a person to hear sound. The vibration panel 214 may directly contact the human skin or may contact the skin through a vibration transmission layer composed of a specific material.

[0112] In some embodiments, for some bone conduction loudspeakers with a single magnetic element, the magnetic induction lines passing through the voice coil may be non-uniform and divergent. At the same time, magnetic leakage may exist in the magnetic circuit. More lines of magnetic induction can pass outside the magnetic gap and past the voice coil, causing the amount of magnetic induction (or magnetic field strength) at the voice coil position to be reduced, which affects the sensitivity of the bone conduction speaker. Thus, the bone conduction speaker 200 may further include at least one second magnetic element and/or at least one third magnetic guiding element (not shown). Said at least one second magnetic element and/or said at least one third magnetic guide element can suppress leakage of magnetic induction lines and limit the shape of magnetic induction lines passing through the voice coil, whereby more magnetic lines pass through the voice coil horizontally and as tightly as possible, to increase the magnetic induction (or magnetic field strength) at the voice coil position, which increases the sensitivity and mechanical conversion efficiency of the bone conduction speaker 200 (for example, the efficiency of converting the electrical energy supplied to the bone conduction speaker 200 into mechanical vibration energy of the sound coils). Additional descriptions of said at least one second magnetic element can be found elsewhere herein (eg, with reference to FIGS. 3A - 3G, FIGS. 4A - 4M, and/or FIGS. 5A - 5F).

[0113] The above description of the bone conduction reproducer 200 may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, those skilled in the art, having understood the basic principle of the bone conduction reproducer, can make various modifications and changes regarding the shape and details of specific means and stages of implementation of the bone conduction reproducer, without going beyond this principle, but these modifications and changes are still in the volume described above. For example, the bone conduction speaker 200 may include a housing, a connector, or the like. The connector may connect the vibration panel 214 and the housing. As another example, the bone conduction speaker 200 may include a second magnetic element, and the second magnetic element may be coupled to the first magnetic guide element 204. As another example, the bone conduction speaker 200 may further include one or more ring magnetic elements, the ring magnetic elements may be connected to the second magnetic guide element 206.

[0114] In FIG. 3A is a diagram showing a longitudinal cross-section of a magnetic circuit assembly 3100 according to some embodiments of the present invention. As shown in FIG. 3A, magnetic circuit assembly 3100 may include a first magnetic element 302, a first magnetic guide element 304, a second magnetic guide element 306, and a second magnetic element 308. In some embodiments, the first magnetic element 302 and/or the second magnetic element 308 may include itself one or more magnets as described in the present invention. In some embodiments, the first magnetic element 302 may include a first magnet, and the second magnetic element 308 may include a second magnet. The first magnet may be identical to or different in type from the second magnet. The first magnetic guide element 304 and/or the second magnetic guide element 306 may include one or more magnetically permeable materials as described in the present invention. The first magnetic guide element 304 and/or the second magnetic guide element 306 may be manufactured using any one or more processing means as described in the present invention. In some embodiments, the first magnetic element 302 and/or the first magnetic guide element 304 may be axisymmetric. For example, the first magnetic element 302 and/or the first magnetic guide element 304 may be shaped like a cylinder, a cuboid, or a hollow ring (eg, the cross-section is shaped like a monorail). In some embodiments, the first magnetic element 302 and the first magnetic guide element 304 may be coaxial cylinders of the same or different diameters. In some embodiments, the second magnetic guide 306 may be of a groove type design. The groove type design may include a U-shaped cross section (as shown in FIG. 3A). The second magnetic guide member 306 of a groove type structure may include a support plate and a side wall. In some embodiments, the base plate and side wall may be formed as a single unit. For example, the side wall may be formed by expanding the support plate in a direction perpendicular to the support plate. In some embodiments, the support plate may be connected to the side wall through any one or more connecting means as described in the present invention. The second magnetic element 308 may be provided in a ring form or a sheet form. Additional descriptions regarding the shape of the second magnetic element 308 can be found elsewhere in the description of the invention (eg, with reference to Fig. 5A and Fig. 5B). In some embodiments, the second magnetic element 308 may be coaxial with the first magnetic element 302 and/or the first magnetic guide element 304.

[0115] The top surface of the first magnetic element 302 may be connected to the bottom surface of the first magnetic guide element 304. The bottom surface of the first magnetic element 302 may be connected to the support plate of the second magnetic guide element 306. The bottom surface of the second magnetic element 308 may be connected to the side the wall of the second magnetic guide element 306. The connecting means between the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306 and/or the second magnetic element 308 may include bonding, snapping, welding, riveting, bolting, etc. etc., or any combination thereof.

[0116] A magnetic gap may be formed between the first magnetic element 302 and/or the first magnetic guide element 304 and the inner ring of the second magnetic element 308. The voice coil 328 may be located in the magnetic gap. In some embodiments, the heights of the second magnetic element 308 and the voice coil 328 relative to the support plate of the second magnetic guide element 306 may be equal. In some embodiments, the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, and the second magnetic element 308 may form a magnetic path (or return magnetic path). In some embodiments, magnetic circuit assembly 3100 may generate a first magnetic field (also referred to as total magnetic field or total magnetic field), and first magnetic element 302 may generate a second magnetic field. The first magnetic field may be jointly formed by magnetic fields generated by all components (eg, first magnetic element 302, first magnetic guide element 304, second magnetic guide element 306, and second magnetic element 308) in magnetic circuit assembly 3100. The magnetic field strength (also referred to as magnetic induction value or magnetic flux density) of the second magnetic field in the magnetic gap may exceed the strength of the first magnetic field in the magnetic gap. As used herein, the term magnetic field strength in a magnetic gap can mean the average value of the magnetic field strength at different locations in the magnetic gap or the value of the magnetic field strength at a specific location in the magnetic gap. In some embodiments, the second magnetic element 308 may generate a third magnetic field. The third magnetic field can increase the magnetic field strength of the aggregate magnetic field in the magnetic gap. The third magnetic field mentioned herein increasing the strength of the first magnetic field may mean that the first magnetic field generated by the magnetic circuit assembly 3100 including the second magnetic element 308 (i.e., when the third magnetic field exists) has a magnetic field strength greater than that of the first magnetic field generated by the magnetic circuit assembly 3100 not including the second magnetic element 308 (ie, when the second magnetic field does not exist). In other embodiments in this specification, unless otherwise indicated, a magnetic circuit assembly is a structure including all magnetic elements and magnetic guide elements. The first magnetic field represents the total magnetic field generated by the magnetic circuit assembly as a whole. The second magnetic field, the third magnetic field, ..., and the Nth magnetic field represent the magnetic fields generated by the corresponding magnetic elements, respectively. In different embodiments, the magnetic element that generates the second magnetic field (or third magnetic field, ..., Nth magnetic field) may be the same or may be different.

[0117] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 302 and the magnetizing direction of the second magnetic element 308 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 302 and the magnetizing direction of the second magnetic element 308 may be greater than or equal to 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 may be perpendicular to the bottom surface or the top surface of the first magnetic element 302 and be the vertically upward direction indicated by arrow a in FIG. 3A). The magnetization direction of the second magnetic element 308 may be oriented from the inner ring of the second magnetic element 308 to the outer ring (the direction indicated by arrow b in FIG. 3A). On the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deviated by 90 degrees in the clockwise direction.

[0118] In some embodiments, at the position of the second magnetic element 308, the internal angle between the direction of the combined magnetic field and the magnetization direction of the second magnetic element 308 may not exceed 90 degrees. In some embodiments, at the position of the second magnetic element 308, the internal angle between the direction of the first magnetic field generated by the first magnetic element 302 and the magnetization direction of the second magnetic element 308 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees , 20 degrees, etc.

[0119] Compared to a magnetic circuit assembly including a single magnetic element, the second magnetic element 308 can increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3100, thereby increasing the amount of magnetic induction in the magnetic gap. In addition, under the action of the second magnetic element 308, the magnetic flux lines that initially diverge may converge toward the position of the magnetic gap, further increasing the amount of magnetic flux in the magnetic gap.

[0120] The above description of magnetic circuit assembly 3100 may be a specific example only, and should not be construed as the only feasible implementation. Obviously, one skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 3100 without going beyond this principle, but these modifications and changes - are still in the above-described volume. For example, the second magnetic guide member 306 may be a ring structure or a sheet structure. As another example, the magnetic circuit assembly 3100 may further include a magnetic shield, the magnetic shield may be configured to surround the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, and the second magnetic element 308.

[0121] In FIG. 3B is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 3200 according to some embodiments of the present invention. As shown in FIG. 3B, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3200 may further include a third magnetic element 310.

[0122] An upper surface of the third magnetic element 310 may be connected to a second magnetic element 308, and a lower surface may be connected to a side wall of the second magnetic guide element 306. A magnetic gap may be formed between the first magnetic element 302, the first magnetic guide element 304, a second magnetic element 308 and/or a third magnetic element 310. The voice coil 328 may be located in the magnetic gap. In some embodiments, the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, the second magnetic element 308, and the third magnetic element 310 may form a magnetic circuit. In some embodiments, the direction of magnetization of the second magnetic element 308 may be as detailed in FIGS. 3A of the present invention.

[0123] In some embodiments, magnetic circuit assembly 3200 may generate an aggregate magnetic field, and first magnetic element 302 may generate a first magnetic field. The magnetic field strength of the total magnetic field in the magnetic gap may exceed the strength of the first magnetic field in the magnetic gap. In some embodiments, the third magnetic element 310 may generate a third magnetic field, and the third magnetic field may increase the strength of the first magnetic field in the magnetic gap.

[0124] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be greater than or equal to 90 degrees. In some embodiments, the direction of magnetization of the first magnetic element 302 may be perpendicular to the bottom surface or the top surface of the first magnetic element 302 vertically upward (the direction indicated by arrow a in FIG. 3B). The magnetization direction of the third magnetic element 310 may be oriented from the upper surface of the third magnetic element 310 to the lower surface (the direction indicated by arrow c in FIG. 3B). On the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deviated by 180 degrees in the clockwise direction.

[0125] In some embodiments, at the position of the third magnetic element 310, the internal angle between the direction of the combined magnetic field and the magnetization direction of the third magnetic element 310 may not exceed 90 degrees. In some embodiments, at the position of the third magnetic element 310, the internal angle between the direction of the first magnetic field generated by the first magnetic element 302 and the magnetization direction of the third magnetic element 310 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees , 20 degrees, etc.

[0126] Compared to the magnetic circuit assembly 3100, a third magnetic element 310 may be added to the magnetic circuit assembly 3200. The third magnetic element 310 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3200, thereby further increasing the amount of magnetic flux density in the magnetic gap. In addition, under the action of the third magnetic element 310, the magnetic flux lines will further converge towards the position of the magnetic gap, further increasing the amount of magnetic flux in the magnetic gap.

[0127] The above description of magnetic circuit assembly 3200 may only be a specific example, and should not be construed as the only feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 3200 without going beyond the scope of this principle, but these modifications and changes are still pending to the extent described above. For example, the second magnetic guide member 306 may have a ring structure or a sheet structure. As another example, the magnetic circuit assembly 3200 may not include a second magnetic guide element 306. As another example, the at least one magnetic element may be added to the magnetic circuit assembly 3200. In some embodiments, the bottom surface of the additionally added magnetic element may be coupled to the top surface of the second magnetic element 308. The direction of magnetization of the additionally added magnetic element may be opposite to the direction of magnetization of the third magnetic element 312. In some embodiments, the additionally added magnetic element may be coupled to the side the wall of the first magnetic element 302 and the second magnetic guide element 306. The direction of magnetization of the further added magnetic element may be opposite to the direction of magnetization of the second magnetic element 308.

[0128] In FIG. 3C is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 3300 according to some embodiments of the present invention. As shown in FIG. 3C, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3300 may further include a fourth magnetic element 312.

[0129] The fourth magnetic element 312 may be connected to the side wall of the first magnetic element 302 and the second magnetic guide element 306 by bonding, snapping, welding, riveting, bolting, or the like. or any combination thereof. In some embodiments, a magnetic gap may be formed between the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, the second magnetic element 308, and the fourth magnetic element 312. In some embodiments, the magnetization direction of the second magnetic element 308 may correspond to detailed descriptions in Fig. 3A of the present invention.

[0130] In some embodiments, magnetic circuit assembly 3300 may generate a first magnetic field, and first magnetic element 302 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the fourth magnetic element 312 may generate a fourth magnetic field, and the fourth magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0131] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may not exceed 90 degrees. In some embodiments, the direction of magnetization of the first magnetic element 302 may be perpendicular to the bottom surface or the top surface of the first magnetic element 302 vertically upward (the direction indicated by arrow a in FIG. 3C). The magnetization direction of the fourth magnetic element 312 may be oriented from the outer ring of the fourth magnetic element 312 to the inner ring (the direction indicated by arrow d in FIG. 3C). On the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deviated 270 degrees clockwise.

[0132] In some embodiments, at the position of the fourth magnetic element 312, the internal angle between the direction of the first magnetic field and the magnetization direction of the fourth magnetic element 312 may not exceed 90 degrees. In some embodiments, at the position of the fourth magnetic element 312, the internal angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the fourth magnetic element 312 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0133] Compared to the magnetic circuit assembly 3100, a fourth magnetic element 312 may be added to the magnetic circuit assembly 3300. The fourth magnetic element 312 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 3300, thereby increasing the amount of magnetic flux density in the magnetic gap. In addition, under the action of the fourth magnetic element 312, the magnetic flux lines will further converge towards the position of the magnetic gap, further increasing the amount of magnetic flux in the magnetic gap.

[0134] The above description of magnetic circuit assembly 3300 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, one skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 3300 without going beyond this principle, but these modifications and changes are are still in the scope described above. For example, the second magnetic guide member 306 may have a ring structure or a sheet structure. As another example, the magnetic circuit assembly 3300 may not include a second magnetic element 308. As another example, the at least one magnetic element may be added to the magnetic circuit assembly 3300. In some embodiments, the bottom surface of the additionally added magnetic element may be connected to the top surface of the second magnetic element 308. The direction of magnetization of the additionally added magnetic element may be the same as the direction of magnetization of the first magnetic element 302. In some embodiments, the top surface of the additionally added magnetic element may be connected with the bottom surface of the second magnetic element 308. The direction of magnetization of the magnetic element may be opposite to the direction of magnetization of the first magnetic element 302.

[0135] In FIG. 3D is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 3400 according to some embodiments of the present invention. As shown in FIG. 3D, unlike the magnetic circuit assembly 3100, the magnetic circuit assembly 3400 may further include a fifth magnetic element 314. The fifth magnetic element 314 may include any of the magnetic materials described in the present invention. In some embodiments, the fifth magnetic element 314 may be configured as an axisymmetric structure. For example, the fifth magnetic element 314 may be a cylinder, a cuboid, or a hollow ring (eg, the cross-section is shaped like a monorail). In some embodiments, the first magnetic element 302, the first magnetic guide element 304, and/or the fifth magnetic element 314 may be coaxial cylinders of the same or different diameters. The fifth magnetic element 314 may have the same thickness as the first magnetic element 302 or a different thickness. The fifth magnetic element 314 may be coupled to the first magnetic guide element 304.

[0136] In some embodiments, the internal angle between the magnetization direction of the fifth magnetic element 314 and the magnetization direction of the first magnetic element 302 may be in the range of 90 degrees to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the fifth magnetic element 314 and the magnetization direction of the first magnetic element 302 may be in the range of 150 degrees to 180 degrees. In some embodiments, the direction of magnetization of the fifth magnetic element 314 may be opposite to the direction of magnetization of the first magnetic element 302 (as shown, in direction a and in direction e).

[0137] Compared to the magnetic circuit assembly 3100, a fifth magnetic element 314 may be added to the magnetic circuit assembly 3400. The fifth magnetic element 314 can suppress magnetic leakage of the first magnetic element 302 in the magnetization direction in the magnetic circuit assembly 3400, whereby the magnetic field generated by the first magnetic element 302 can be pressed into the magnetic gap, thereby increasing the amount of magnetic flux density in the magnetic gap.

[0138] The above description of magnetic circuit assembly 3400 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of specific means and implementation steps of the magnetic circuit assembly 3400 without going beyond the scope of this principle, but these modifications and changes are still pending to the extent described above. For example, the second magnetic guide member 306 may have a ring structure or a sheet structure. As another example, the magnetic circuit assembly 3400 may not include a second magnetic element 308. As another example, the at least one magnetic element may be added to the magnetic circuit assembly 3400. In some embodiments, the bottom surface of the additionally added magnetic element may be connected to the top surface of the second magnetic element 308. The direction of magnetization of the additionally added magnetic element may be the same as the direction of magnetization of the first magnetic element 302. In some embodiments, the top surface of the additionally added magnetic element may be connected with the bottom surface of the second magnetic element 308. The direction of magnetization of the additionally added magnetic element may be opposite to the direction of magnetization of the first magnetic element 302. In some embodiments, the additionally added magnetic element may be coupled to the first magnetic element 302 and the second magnetic guide element 306, and the direction of magnetization the additionally added magnetic element may be opposite to the direction of magnetization of the second magnetic element 308.

[0139] In FIG. 3E is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 3500 according to some embodiments of the present invention. As shown in FIG. 3E, unlike the magnetic circuit assembly 3400, the magnetic circuit assembly 3500 may further include a third magnetic guide element 316. In some embodiments, the third magnetic guide element 316 may include any one or more magnetically conductive materials described in the present invention. The magnetically conductive materials included in the first magnetic guide member 304, the second magnetic guide member 306, and/or the third magnetic guide member 316 may be the same or different. In some embodiments, the third magnetic guide element 316 may be configured as a symmetrical design. For example, the third magnetic guide element 316 may be cylindrical in shape. In some embodiments, the first magnetic element 302, the first magnetic guide element 304, the fifth magnetic element 314 and/or the third magnetic guide element 316 may be coaxial cylinders of the same or different diameters. The third magnetic guide element 316 may be connected to the fifth magnetic element 314. In some embodiments, the third magnetic guide element 316 may be coupled to the fifth magnetic element 314 and the second magnetic element 308. The third magnetic guide element 316, the second magnetic guide element 306 and the second magnetic element 308 may form a cavity. The cavity may include a first magnetic element 302, a fifth magnetic element 314, and a first magnetic guide element 304.

[0140] Compared to the magnetic circuit assembly 3400, the third magnetic guide element 316 may add a magnetic guide element to the magnetic circuit assembly 3500. The third magnetic guide element 316 can suppress magnetic leakage of the fifth magnetic element 314 in the magnetization direction in the magnetic circuit assembly 3500, whereby the magnetic field generated by the fifth magnetic element 314 can be pressed into the magnetic gap, thereby increasing the amount of magnetic flux density in the magnetic gap .

[0141] The above description of magnetic circuit assembly 3500 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 3500 without going beyond the scope of this principle, but these modifications and changes are still pending to the extent described above. For example, the second magnetic guide member 306 may have a ring structure or a sheet structure. As another example, the magnetic circuit assembly 3500 may not include a second magnetic element 308. As another example, the at least one magnetic element may be added to the magnetic circuit assembly 3500. In some embodiments, the bottom surface of the additionally added magnetic element may be connected to the top surface of the second magnetic element 308. The direction of magnetization of the additionally added magnetic element may be the same as the direction of magnetization of the first magnetic element 302. In some embodiments, the top surface of the additionally added magnetic element may be connected with the bottom surface of the second magnetic element 308. The direction of magnetization of the additionally added magnetic element may be opposite to the direction of magnetization of the first magnetic element 302. In some embodiments, the additionally added magnetic element may be coupled to the first magnetic element 302 and the second magnetic guide element 306, and the direction of magnetization the additionally added magnetic element may be opposite to the direction of magnetization of the second magnetic element 308.

[0142] In FIG. 3F is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 3600 according to some embodiments of the present invention. As shown in FIG. 3F, unlike magnetic circuit assembly 3100, magnetic circuit assembly 3600 may further include one or more conductive elements (eg, first conductive element 318, second conductive element 320, and third conductive element 322).

[0143] The conductive element may include a metallic material, a metal alloy material, an inorganic nonmetallic material, or other conductive materials. The metal material may include gold, silver, copper, aluminum, etc. The metal alloy material may include iron alloy, aluminum alloy, copper alloy, zinc alloy, etc. The inorganic non-metallic material may include graphite, etc. The conductive element may be formed into a sheet shape, a ring shape, a mesh shape, or the like. The first conductive element 318 may be located on the top surface of the first magnetic guide element 304. The second conductive element 320 may be connected to the first magnetic element 302 and the second magnetic guide element 306. The third conductive element 322 may be connected to the side wall of the first magnetic element 302. In some embodiments, the first magnetic guide element 304 may protrude from the first magnetic element 302 to form a first concave portion, and a third conductive element 322 may be provided in the first concave portion. In some embodiments, a first conductive element 318, a second conductive element 320, and a third conductive element 322 may include the same or different conductive materials. The first conductive element 318, the second conductive element 320, and the third conductive element 322 may be respectively coupled to the first magnetic guide element 304, the second magnetic guide element 306, and/or the first magnetic element 302 through one or more connecting means, as described elsewhere herein. applications.

[0144] A magnetic gap may be formed between the first magnetic element 302, the first magnetic guide element 304, and the inner ring of the second magnetic element 308. The voice coil 328 may be located in the magnetic gap. The first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306 and the second magnetic element 308 may form a magnetic circuit. In some embodiments, one or more conductive elements may reduce the inductive reactance of the voice coil 328. For example, if a first alternating current flows into the voice coil 328, a first alternating magnetic field may be generated in the vicinity of the voice coil 328. Under the influence of a magnetic field in the magnetic circuit, the first alternating magnetic field may be generated in the vicinity of the voice coil 328. the inductive magnetic field allows the voice coil 328 to create inductive resistance and inhibit the movement of the voice coil 328. When one or more conductive elements (for example, the first conductive element 318, the second conductive element 320 and the third conductive element 322) are provided in the vicinity of the voice coil 328, under the influence of the first alternating induction magnetic field, the conductive elements can induce a second alternating current. The third alternating current in the conductive elements may generate a second alternating induced magnetic field in the vicinity of the conductive elements. The direction of the second alternating magnetic field may be opposite to the direction of the first alternating induction magnetic field, and the first alternating induction magnetic field may be weakened, thereby reducing the inductive reactance of the voice coil 328, increasing the current in the voice coil, and increasing the sensitivity of the bone conduction speaker.

[0145] The above description of magnetic circuit assembly 3600 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 3600 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, the second magnetic guide member 306 may have a ring structure or a sheet structure. As another example, the magnetic circuit assembly 3600 may not include a second magnetic element 308. As another example, the at least one magnetic element may be added to the magnetic circuit assembly 3500. In some embodiments, the bottom surface of the added magnetic element may be coupled to the top surface of the second magnetic element 308. The direction of magnetization of the added magnetic element may be the same as the direction of magnetization of the first magnetic element 302.

[0146] In FIG. 3G is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 3900 according to some embodiments of the present invention. As shown in FIG. 3G, unlike the magnetic circuit assembly 3500, the magnetic circuit assembly 3900 may further include a third magnetic element 310, a fourth magnetic element 312, a fifth magnetic element 314, a third magnetic guide element 316, a sixth magnetic element 324, and a seventh magnetic element 326. The third magnetic element 310, the fourth magnetic element 312, the fifth magnetic element 314, the third magnetic guide element 316 and/or the sixth magnetic element 324 and the seventh magnetic element 326 can be made in the form of coaxial circular cylinders.

[0147] In some embodiments, the upper surface of the second magnetic element 308 may be coupled to the seventh magnetic element 326, and the lower surface of the second magnetic element 308 may be coupled to the third magnetic element 310. The third magnetic element 310 may be coupled to the second magnetic guide element 306. The top surface of the seventh magnetic element 326 may be connected to the third magnetic guide element 316. The fourth magnetic element 312 may be connected to the second magnetic guide element 306 and the first magnetic element 302. The sixth magnetic element 324 may be connected to the fifth magnetic element 314. a third magnetic guide element 316 and a seventh magnetic element 326. In some embodiments, a first magnetic element 302, a first magnetic guide element 304, a second magnetic guide element 306, a second magnetic element 308, a third magnetic element 310, a fourth magnetic element 312, a fifth magnetic element 314, the third magnetic guide member 316, the sixth magnetic member 324, and the seventh magnetic member 326 may form a magnetic circuit and a magnetic gap.

[0148] In some embodiments, the magnetization direction of the second magnetic element 308 can be found in FIG. 3A of the present invention. The magnetization direction of the third magnetic element 310 can be found in FIG. 3B of the present invention. The magnetization direction of the fourth magnetic element 312 can be found in FIG. 3C of the present invention.

[0149] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 302 and the magnetizing direction of the sixth magnetic element 324 may not exceed 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 may be perpendicular to the bottom surface or the top surface of the first magnetic element 302 vertically upward (the direction indicated by arrow a in FIG. 3C). The magnetization direction of the sixth magnetic element 324 may be oriented from the outer ring of the sixth magnetic element 324 to the inner ring (the direction indicated by arrow g in FIG. 3C). On the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deviated by 270 degrees in the clockwise direction. In some embodiments, in the same vertical direction, the direction of magnetization of the sixth magnetic element 324 may be the same as the direction of magnetization of the fourth magnetic element 312.

[0150] In some embodiments, at some positions of the sixth magnetic element 324, the internal angle between the direction of the magnetic field generated by the magnetic circuit assembly 3900 and the magnetization direction of the sixth magnetic element 324 may not exceed 90 degrees. In some embodiments, at the position of the sixth magnetic element 324, the internal angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the sixth magnetic element 324 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees , 20 degrees, etc.

[0151] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 302 and the magnetizing direction of the seventh magnetic element 326 may not exceed 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 302 may be perpendicular to the bottom surface or the top surface of the first magnetic element 302 vertically upward (the direction indicated by arrow a in FIG. 3G). The magnetization direction of the seventh magnetic element 326 may be oriented from the bottom surface of the seventh magnetic element 326 to the top surface (the direction indicated by arrow f in FIG. 3G). On the right side of the first magnetic element 302, the magnetization direction of the first magnetic element 302 is deflected 360 degrees in a clockwise direction. In some embodiments, the direction of magnetization of the seventh magnetic element 326 may be opposite to the direction of magnetization of the third magnetic element 310.

[0152] In some embodiments, at a certain seventh magnetic element 326, the internal angle between the direction of the magnetic field generated by the magnetic circuit assembly 3900 and the magnetization direction of the seventh magnetic element 326 may not exceed 90 degrees. In some embodiments, at the position of the seventh magnetic element 326, the internal angle between the direction of the magnetic field generated by the first magnetic element 302 and the magnetization direction of the seventh magnetic element 326 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees , 20 degrees, etc.

[0153] In the magnetic circuit node 3900, the third magnetic guide member 316 can complete the magnetic circuit generated by the magnetic circuit node 3900, thereby further concentrating the magnetic induction lines in the magnetic gap, which provides the effects of suppressing magnetic leakage, increasing the amount of magnetic induction in the magnetic gap and increasing the sensitivity of the bone conduction reproducer. The above description of magnetic circuit assembly 3900 may be a specific example only, and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 3900 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, the second magnetic guide member 306 may have a ring structure or a sheet structure. As another example, magnetic circuit assembly 3900 may not include a second magnetic element 308. As another example, magnetic circuit assembly 3900 may further include at least one conductive element. The conductive element may be coupled to the first magnetic element 302, the fifth magnetic element 314, the first magnetic guide element 304, the second magnetic guide element 306, and/or the third magnetic guide element 316. In some embodiments, at least one conductive element may be added to the assembly 3900 magnetic circuit. The further added conductive element may be coupled to at least one of a second magnetic element 308, a third magnetic element 310, a fourth magnetic element 312, a sixth magnetic element 324, and a seventh magnetic element 326.

[0154] In FIG. 4A is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4100 according to some embodiments of the present invention. As shown in FIG. 4A, magnetic circuit assembly 4100 may include a first magnetic element 402, a first magnetic guide element 404, a first magnetic field varying element 406, and a second magnetic element 408. In some embodiments, the first magnetic element 402 and/or the second magnetic element 408 may include including any one or more magnets described in the present invention. The first magnetic element 402 may include a first magnet, and the second magnetic element 408 may include a second magnet. The first magnet and the second magnet may be the same or different. The first magnetic guide element 404 may include any one or more magnetically conductive materials described in the present invention, such as mild steel, transformer steel sheet, transformer steel sheet, ferrite, and the like. In some embodiments, the first magnetic element 402 and/or the first magnetic guide element 404 may be configured as an axisymmetric structure. The first magnetic element 402 and/or the first magnetic guide element 404 may be cylindrical in shape. In some embodiments, the first magnetic element 402 and the first magnetic guide element 404 may be coaxial cylinders of the same or different diameters. In some embodiments, the first magnetic field changing element 406 may be any of a magnetic element and a magnetic guide element. The first magnetic field changing element 406 and/or the second magnetic element 408 may be in a ring shape or a sheet shape. A description of the first magnetic field changing element 406 and the second magnetic element 408 can be found elsewhere in the description of the invention (eg, with reference to Fig. 5A and Fig. 5B). In some embodiments, the second magnetic element 408 and the annular cylinder coaxial with the first magnetic element 402, the first magnetic guide element 404 and/or the first complete magnetic field changing element 406 may include inner and/or outer rings of the same or different diameters. The processing means for the first magnetic guide element 404 and/or the first magnetic field changing element 406 may include any one or more processing means as described elsewhere herein.

[0155] An upper surface of the first magnetic element 402 may be connected to a lower surface of the first magnetic guide element 404, and a second magnetic element 408 may be connected to the first magnetic element 402 and the first magnetic field changing element 406. The connecting means between the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406 and/or the second magnetic element 408 may be based on any one or more connecting means as described elsewhere herein. In some embodiments, the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, and/or the second magnetic element 408 may form a magnetic circuit and a magnetic gap.

[0156] In some embodiments, magnetic circuit assembly 4100 may generate a first magnetic field, and first magnetic element 402 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the second magnetic element 408 may generate a third magnetic field, and the third magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0157] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the second magnetic element 408 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 402 and the magnetizing direction of the second magnetic element 408 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the direction of magnetization of the first magnetic element 402 and the direction of magnetization of the second magnetic element 408 may not exceed 90 degrees.

[0158] In some embodiments, at some locations of the second magnetic element 408, the internal angle between the direction of the first magnetic field and the magnetization direction of the second magnetic element 408 may not exceed 90 degrees. In some embodiments, at the position of the second magnetic element 408, the internal angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the second magnetic element 408 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc. As another example, the magnetization direction of the first magnetic element 402 may be perpendicular to the bottom surface or the top surface of the first magnetic element 402 vertically upward (the direction indicated by arrow a in FIG. 4A). The magnetization direction of the second magnetic element 408 may be oriented from the outer ring of the second magnetic element 408 to the inner ring (the direction indicated by arrow c in FIG. 4A). On the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deflected 270 degrees in a clockwise direction.

[0159] Compared with the magnetic circuit assembly of a single magnetic element, the first magnetic field changing element 406 in the magnetic circuit assembly 4100 can increase the total magnetic flux in the magnetic gap, thereby increasing the amount of magnetic induction in the magnetic gap. In addition, under the action of the first magnetic field changing element 406, the magnetic flux lines that initially diverge may converge to the position of the magnetic gap, further increasing the amount of magnetic flux in the magnetic gap.

[0160] The above description of the magnetic circuit assembly 4100 may only be a specific example, and is to be considered only as a feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4100 without going beyond this principle, but these modifications and changes are are still in the scope described above. For example, the magnetic circuit assembly 4100 may further include a magnetic shield, the magnetic shield may be configured to surround the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, and the second magnetic element 408.

[0161] In FIG. 4B is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4200 according to some embodiments of the present invention. As shown in FIG. 4B, unlike magnetic circuit assembly 4100, magnetic circuit assembly 4200 may further include a third magnetic element 410.

[0162] The lower surface of the third magnetic element 410 may be connected to the first magnetic field changing element 406. The connection means between the third magnetic element 410 and the first magnetic field changing element 406 may be based on any one or more connection means as described elsewhere herein. In some embodiments, a magnetic gap may be formed between the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, the second magnetic element 408, and/or the third magnetic element 410. In some embodiments, the magnetic circuit assembly 4200 may generate a first magnetic field, and the first magnetic element 402 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the third magnetic element 410 may generate a third magnetic field, and the third magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0163] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the third magnetic element 410 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the third magnetic element 410 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 402 and the magnetizing direction of the third magnetic element 410 may be greater than or equal to 90 degrees. In some embodiments, the direction of magnetization of the first magnetic element 402 may be perpendicular to the bottom surface or the top surface of the first magnetic element 402 vertically upward (the direction indicated by arrow a in FIG. 4B). The magnetization direction of the third magnetic element 410 may be oriented from the inner ring of the third magnetic element 410 to the outer ring (the direction indicated by arrow b in FIG. 4B). On the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is 90 degrees clockwise.

[0164] In some embodiments, at the position of the third magnetic element 410, the internal angle between the direction of the first magnetic field and the magnetization direction of the second magnetic element 408 may not exceed 90 degrees. In some embodiments, at the position of the third magnetic element 410, the internal angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the third magnetic element 410 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0165] Compared to the magnetic circuit assembly 4100, a third magnetic element 410 may be added to the magnetic circuit assembly 4200. The third magnetic element 410 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 4200, thereby increasing the amount of magnetic flux density in the magnetic gap. In addition, under the action of the third magnetic element 410, the magnetic flux lines will further converge towards the position of the magnetic gap, thereby increasing the amount of magnetic flux in the magnetic gap.

[0166] The above description of magnetic circuit assembly 4200 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4200 without going beyond the scope of this principle, but these modifications and changes are are still in the scope described above. For example, magnetic circuit assembly 4200 may further include a magnetic shield. The magnetic shield may be configured to surround the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, the second magnetic element 408, and the third magnetic element 410.

[0167] In FIG. 4C is a block diagram illustrating a magnetic circuit assembly 4300 according to some embodiments of the present invention. As shown in FIG. 4C, unlike magnetic circuit assembly 4200, magnetic circuit assembly 4300 may further include a fourth magnetic element 412.

[0168] The lower surface of the fourth magnetic element 412 may be connected to the upper surface of the first magnetic field changing element 406, and the upper surface of the fourth magnetic element 412 may be connected to the lower surface of the second magnetic element 408. The connection method between the fourth magnetic element 412 and the element 406 changes in the first magnetic field and the second magnetic element 408 may be based on any one or more connection means, as described elsewhere herein. In some embodiments, a magnetic gap may be formed between the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, the second magnetic element 408, the third magnetic element 410 and/or the fourth magnetic element 412. The magnetization direction of the second magnetic element 408 and third magnetic element 410 can be found in FIG. 4A and/or FIG. 4B of the present invention, respectively.

[0169] In some embodiments, magnetic circuit assembly 4300 may generate a first magnetic field, and first magnetic element 402 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the fourth magnetic element 412 may generate a third magnetic field, and the third magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0170] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be greater than or equal to 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 402 may be perpendicular to the bottom surface or the top surface of the first magnetic element 402 vertically upward (the direction indicated by arrow a in FIG. 4C). The magnetization direction of the fourth magnetic element 412 may be oriented from the upper surface of the fourth magnetic element 412 to the lower surface (the direction indicated by arrow d in FIG. 4C). On the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deviated 180 degrees in a clockwise direction.

[0171] In some embodiments, at the position of the fourth magnetic element 412, the internal angle between the direction of the first magnetic field and the magnetization direction of the fourth magnetic element 412 may not exceed 90 degrees. In some embodiments, at the position of the fourth magnetic element 412, the internal angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the fourth magnetic element 412 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0172] Compared to the magnetic circuit assembly 4200, a fourth magnetic element 412 may be added to the magnetic circuit assembly 4300. The fourth magnetic element 412 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 4300, thereby increasing the amount of magnetic flux density in the magnetic gap. In addition, under the action of the fourth magnetic element 412, the magnetic flux lines will further converge towards the position of the magnetic gap, thereby increasing the amount of magnetic flux in the magnetic gap.

[0173] The above description of magnetic circuit assembly 4300 may be a specific example only, and should not be construed as the only feasible implementation. Obviously, one skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4300 without going beyond the scope of this principle, but these modifications and changes - are still in the above-described volume. For example, magnetic circuit assembly 4200 may further include one or more conductive elements. One or more conductive elements may be coupled to at least one of the first magnetic element 402, the first magnetic guide element 404, the second magnetic element 408, the third magnetic element 410, and the fourth magnetic element 412.

[0174] In FIG. 4D is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4400 according to some embodiments of the present invention. As shown in FIG. 4D, unlike magnetic circuit assembly 4300, magnetic circuit assembly 4400 may further include a magnetic shield 414.

[0175] Magnetic shield 414 may include any one or more magnetically permeable materials described in the present invention, such as mild steel, transformer steel sheet, ferrite, and the like. The magnetic shield 414 may be coupled to the first magnetic field varying element 406, the second magnetic element 408, the third magnetic element 410, and the fourth magnetic element 412 through any one or more connecting means as described elsewhere herein. The magnetic shield processing means 414 may include any of the processing means as described elsewhere herein, such as casting, ductile processing, cutting, powder metallurgy, and the like, or any combination thereof. In some embodiments, the magnetic shield 414 may include a support plate and a side wall, and the side wall may be an annular structure. In some embodiments, the base plate and side wall may be formed as a single unit. In some embodiments, the support plate may be connected to the side wall by any one or more connecting means, as described elsewhere herein.

[0176] Compared to the magnetic circuit assembly 4300, a magnetic shield 414 may be added to the magnetic circuit assembly 4400. The magnetic shield 414 can suppress the magnetic leakage of the magnetic circuit assembly 4300, effectively reduce the length of the magnetic circuit and the magnetic resistance, so that more magnetic lines can pass through the magnetic gap and increase the amount of magnetic induction in the magnetic gap.

[0177] The above description of magnetic circuit assembly 4400 may be a specific example only, and should not be construed as the only feasible implementation. Obviously, one skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4400 without going beyond this principle, but these modifications and changes - are still in the above-described volume. For example, magnetic circuit assembly 4400 may further include one or more conductive elements. One or more conductive elements may be coupled to at least one of the first magnetic element 402, the first magnetic guide element 404, the second magnetic element 408, the third magnetic element 410, and the fourth magnetic element 412. As another example, the magnetic circuit assembly 4200 may optionally include a fifth magnetic element. The lower surface of the fifth magnetic element may be connected to the upper surface of the first magnetic guide element 404, and the magnetization direction of the fifth magnetic element may be opposite to the magnetization direction of the first magnetic element 402.

[0178] In FIG. 4E is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4500 according to some embodiments of the present invention. As shown in FIG. 4E, unlike the magnetic circuit assembly 4200, the connecting surface between the first magnetic field changing element 406 and the second magnetic element 408 of the magnetic circuit assembly 4500 may have a wedge-shaped cross-section.

[0179] Compared with the magnetic circuit assembly 4100, the connecting surface of the first magnetic field changing element 406 and the second magnetic element 408 of the magnetic circuit assembly 4500 may have a wedge-shaped cross-section, whereby the magnetic induction line can rotate smoothly. At the same time, the wedge-shaped cross section can facilitate the assembly of the first magnetic field changing element 406 and the second magnetic element 408, and can reduce the readout of the assembly and reduce the weight of the bone conduction reproducer.

[0180] The above description of the magnetic circuit assembly 4500 may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, one skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4500 without going beyond this principle, but these modifications and changes - are still in the above-described volume. For example, magnetic circuit assembly 4500 may further include one or more conductive elements. The conductive element may be coupled to at least one of the first magnetic element 402, the first magnetic guide element 404, the second magnetic element 408, and the third magnetic element 410. As another example, the magnetic circuit assembly 4500 may further include a fifth magnetic element. The lower surface of the fifth magnetic element may be coupled to the upper surface of the first magnetic guide element 404, and the direction of magnetization of the fifth magnetic element may be opposite to the direction of magnetization of the first magnetic element 402. In some embodiments, the magnetic circuit assembly 4500 may further include a magnetic shield. The magnetic shield may be configured to surround the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, the second magnetic element 408, and the third magnetic element 410.

[0181] In FIG. 4F is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4600 according to some embodiments of the present invention. As shown in FIG. 4F, unlike the magnetic circuit assembly 4100, the magnetic circuit assembly 4600 may further include a fifth magnetic element 416. In some embodiments, the fifth magnetic element 416 may include one or more magnets. The magnet may include any one or more magnetic materials described in the present invention. In some embodiments, the fifth magnetic element 416 may include a first magnet, and the first magnetic element 402 may include a second magnet. The first magnet and the second magnet may include the same magnetic material or different magnetic materials. In some embodiments, the fifth magnetic element 416, the first magnetic element 402, and the first magnetic guide element 404 may be configured as an axisymmetric structure. For example, the fifth magnetic element 416, the first magnetic element 402 and the first magnetic guide element 404 may be cylinders. In some embodiments, the fifth magnetic element 416, the first magnetic element 402, and the first magnetic guide element 404 may be coaxial cylinders of the same or different diameters. For example, the diameter of the first magnetic guide element 404 may be larger than that of the first magnetic element 402 and/or the fifth magnetic element 416. The side wall of the first magnetic element 402 and/or the fifth magnetic element 416 may define a first concave portion and/or a second concave portion . In some embodiments, the ratio of the thickness of the second magnetic element 416 to the sum of the thickness of the first magnetic element 402, the thickness of the second magnetic element 416, and the thickness of the first magnetic guide element 404 may be in the range of 0.4 to 0.6. The ratio of the thickness of the first magnetic guide member 404 to the sum of the thickness of the first magnetic member 402, the thickness of the second magnetic member 416, and the thickness of the first magnetic guide member 404 may be in the range of 0.5 to 1.5.

[0182] In some embodiments, the internal angle between the magnetization direction of the fifth magnetic element 416 and the magnetization direction of the first magnetic element 402 may be in the range of 150 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the fifth magnetic element 416 and the magnetization direction of the first magnetic element 402 may be in the range of 90 degrees to 180 degrees. For example, the magnetization direction of the fifth magnetic element 416 may be opposite to the magnetization direction of the first magnetic element 402 (as shown, in direction a and in direction e).

[0183] Compared to the magnetic circuit assembly 4100, a fifth magnetic element 416 may be added to the magnetic circuit assembly 4600. The fifth magnetic element 426 can suppress magnetic leakage of the first magnetic element 402 in the magnetization direction in the magnetic circuit assembly 4600, whereby the magnetic field generated by the first magnetic element 402 can be pressed into the magnetic gap, thereby increasing the amount of magnetic flux density in the magnetic gap.

[0184] The above description of magnetic circuit assembly 4600 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4600 without going beyond the scope of this principle, but these modifications and changes are are still in the scope described above. In some embodiments, the magnetic circuit assembly 4600 may further include one or more conductive elements. One or more conductive elements may be coupled to at least one of the first magnetic element 402, the first magnetic guide element 404, the second magnetic element 408, and the fifth magnetic element 416. For example, one or more conductive elements may be provided at the first concave portion and/or or the second concave section. In some embodiments, the at least one magnetic element may be added to the magnetic circuit assembly 4600, and the further added magnetic element may be coupled to the first magnetic field changing element 406. In some embodiments, the magnetic circuit assembly 4600 may further include a magnetic shield. The magnetic shield may be configured to surround the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, the second magnetic element 408, and the fifth magnetic element 416.

[0185] In FIG. 4G is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4700 according to some embodiments of the present invention. The magnetic circuit assembly 4700 may include a first magnetic element 402, a first magnetic guide element 404, a first magnetic field changing element 406, a second magnetic element 408, a third magnetic element 410, a fourth magnetic element 412, a fifth magnetic element 416, a sixth magnetic element 418 , a seventh magnetic element 420 and a second ring element 422. A first magnetic element 402, a first magnetic guide element 404, a first magnetic field changing element 406, a second magnetic element 408, a third magnetic element 410, a third magnetic element 410, a fourth magnetic element 412 and a fifth magnetic element 416 can be found in FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E and/or FIG. 4F of the present invention. In some embodiments, the first magnetic field varying element 406 and/or the second annular element 422 may include an annular magnetic element or an annular magnetic guide element. The annular magnetic element may include any one or more magnetic materials described in the present invention, and the annular magnetic guide element may include any one or more magnetically conductive materials described in the present invention.

[0186] In some embodiments, a sixth magnetic element 418 may be coupled to a fifth magnetic element 416 and a second ring element 422, and a seventh magnetic element 420 may be coupled to a third magnetic element 410 and a second ring element 422. In some embodiments, the first magnetic element element 402, fifth magnetic element 416, second magnetic element 408, third magnetic element 410, fourth magnetic element 412, sixth magnetic element 418 and/or seventh magnetic element 420 and first magnetic guide element 404, first magnetic field changing element 406 and second annular element 422 may form a magnetic circuit.

[0187] The magnetization direction of the second magnetic element 408 can be found in FIG. 4A of the present invention. The magnetization directions of the third magnetic element 410, the fourth magnetic element 412, and the fifth magnetic element 416 can be found in FIG. 4B, FIG. 4C and FIG. 4F of the present invention, respectively.

[0188] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 402 and the magnetizing direction of the sixth magnetic element 418 may not exceed 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 402 may be perpendicular to the bottom surface or the top surface of the first magnetic element 402 vertically upward (the direction indicated by arrow a in FIG. 4F). the magnetization direction of the sixth magnetic element 418 may be oriented from the outer ring of the sixth magnetic element 418 to the inner ring (the direction indicated by arrow f in FIG. 4F). On the right side of the first magnetic element 402, the magnetization direction of the sixth magnetic element 418 may be the same as the magnetization direction of the first magnetic element 402 deviated by 270 degrees in the clockwise direction). In some embodiments, in the same vertical direction, the direction of magnetization of the sixth magnetic element 418 may be the same as the direction of magnetization of the second magnetic element 408. In some embodiments, the direction of magnetization of the first magnetic element 402 may be perpendicular to the bottom surface or the top surface of the first magnetic element 402 vertically upward (direction indicated by arrow a in Fig. 4F). The magnetization direction of the seventh magnetic element 420 may be oriented from the bottom surface of the seventh magnetic element 420 to the top surface (the direction indicated by arrow e in FIG. 4F). On the right side of the first magnetic element 402, the magnetization direction of the first magnetic element 402 is deflected 360 degrees in a clockwise direction. In some embodiments, the direction of magnetization of the seventh magnetic element 420 may be the same as the direction of magnetization of the third magnetic element 412.

[0189] In some embodiments, at the position of the sixth magnetic element 418, the internal angle between the direction of the magnetic field generated by the magnetic circuit assembly 4700 and the magnetization direction of the sixth magnetic element 418 may not exceed 90 degrees. In some embodiments, at the position of the sixth magnetic element 418, the internal angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the sixth magnetic element 418 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0190] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 402 and the magnetizing direction of the seventh magnetic element 420 may not exceed 90 degrees.

[0191] In some embodiments, at the position of the seventh magnetic element 420, the internal angle between the direction of the magnetic field generated by the magnetic circuit assembly 4700 and the magnetization direction of the seventh magnetic element 420 may not exceed 90 degrees. In some embodiments, at the position of the seventh magnetic element 420, the internal angle between the direction of the magnetic field generated by the first magnetic element 402 and the magnetization direction of the seventh magnetic element 420 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0192] In some embodiments, the first magnetic field changing element 406 may be a ring magnetic element. In this case, the magnetization direction of the first magnetic field change element 406 may be the same as the magnetization direction of the second magnetic element 408 or the fourth magnetic element 412. For example, on the right side of the first magnetic element 402, the magnetization direction of the first magnetic field change element 406 may be oriented away from the outside the ring of the first magnetic field changing element 406 to the inner ring. In some embodiments, the second ring element 422 may be a ring magnetic element. In this case, the magnetization direction of the second annular element 422 may be the same as the direction of the sixth magnetic element 418 or the seventh magnetic element 420. For example, on the right side of the first magnetic element 402, the magnetization direction of the second annular element 422 may be oriented away from the outer ring of the second annular element 422 to the inner ring.

[0193] In the magnetic circuit assembly 4700, a plurality of magnetic elements can increase the total magnetic flux, the interaction of different magnetic elements can suppress the leakage of magnetic induction lines, increase the amount of magnetic induction in the magnetic gap, and increase the sensitivity of the bone conduction repeater.

[0194] The above description of magnetic circuit assembly 4700 may be a specific example only, and should not be construed as the only feasible implementation. Obviously, one skilled in the art, having understood the basic principles of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4700 without going beyond the scope of this principle, but these modifications and changes - are still in the above-described volume. In some embodiments, the magnetic circuit assembly 4700 may further include one or more conductive elements. One or more conductive elements may be coupled to at least one of a first magnetic element 402, a first magnetic guide element 404, a second magnetic element 408, a third magnetic element 410, a fourth magnetic element 412, a fifth magnetic element 416, a sixth magnetic element 418, and seventh magnetic element 420.

[0195] In FIG. 4H is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4800 according to some embodiments of the present invention. As shown in FIG. 4H, unlike magnetic circuit assembly 4700, magnetic circuit assembly 4800 may further include a magnetic shield 414.

[0196] Magnetic shield 414 may include any one or more magnetically permeable materials described in the present invention, such as mild steel, transformer steel sheet, ferrite, and the like. The magnetic shield 414 may be coupled to a first magnetic element 402, a first magnetic field changing element 406, a second magnetic element 408, a third magnetic element 410, a fourth magnetic element 412, a fifth magnetic element 416, a sixth magnetic element 418, a seventh magnetic element 420, and a second ring member 422 through any one or more connecting means as described elsewhere herein. The magnetic shield processing means 414 may include any of the processing means as described elsewhere herein, such as casting, ductile processing, cutting, powder metallurgy, and the like, or any combination thereof. In some embodiments, the magnetic shield may include at least one support plate and a side wall, and the side wall may be an annular structure. In some embodiments, the base plate and side wall may be formed as a single unit. In some embodiments, the support plate may be connected to the side wall through any one or more connecting means, as described elsewhere herein. For example, the magnetic shield 414 may include a first support plate, a second support plate, and a side wall. The first support plate and the side wall may be formed as a single unit, and the second support plate may be connected to the side wall through any one or more connecting means, as described elsewhere herein.

[0197] In the magnetic circuit node 4800, the magnetic shield 414 can complete the magnetic circuit generated by the magnetic circuit node 4800, thereby further concentrating magnetic flux lines in the magnetic gap in the magnetic circuit node 4800, thereby suppressing magnetic leakage, increasing the amount of magnetic flux density in the magnetic gap and increasing the sensitivity of the bone conduction reproducer.

[0198] The above description of magnetic circuit assembly 4800 may be a specific example only, and should not be construed as the only feasible implementation solution. Obviously, one skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4800 without going beyond this principle, but these modifications and changes - are still in the volume described above. For example, the magnetic circuit assembly 4800 may further include one or more conductive elements. The one or more conductive elements may be coupled to at least one of the first magnetic element 402, the first magnetic guide element 404, the second magnetic element 408, the third magnetic element 410, a fourth magnetic element 412, a fifth magnetic element 416, a sixth magnetic element 418, and a seventh magnetic element 420.

[0199] In FIG. 4M is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 4900 according to some embodiments of the present invention. As shown in FIG. 4M, unlike magnetic circuit assembly 4100, magnetic circuit assembly 4900 may further include one or more conductive elements (eg, first conductive element 424, second conductive element 426, and third conductive element 428).

[0200] The description of the conductive element is similar to the conductive element 318, the conductive element 320 and the conductive element 322, and the corresponding description is not repeated here.

[0201] The above description of magnetic circuit assembly 4900 may only be a specific example and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principle of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 4900 without going beyond this principle, but these modifications and changes are are still in the scope described above. For example, the magnetic circuit assembly 4900 may further include at least one magnetic element and/or a magnetic guide element.

[0202] In FIG. 5A is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 5100 according to some embodiments of the present invention. As shown in FIG. 5A, the magnetic circuit assembly 5100 may include a first magnetic element 502, a first magnetic guide element 504, a second magnetic guide element 506, and a second magnetic element 508.

[0203] In some embodiments, the first magnetic element 502 and/or the second magnetic element 508 may include any one or more magnets described in the present invention. In some embodiments, the first magnetic element 502 may include a first magnet, and the second magnetic element 508 may include a second magnet. The first magnet may be identical to or different from the second magnet. The first magnetic guide element 504 and/or the second magnetic guide element 506 may include any one or more magnetically conductive materials described in the present invention. The processing means for the first magnetic guide element 504 and/or the second magnetic guide element 506 may include any one or more processing means as described elsewhere herein. In some embodiments, the first magnetic element 502, the first magnetic guide element 504, and/or the second magnetic element 508 may be configured as an axisymmetric structure. For example, the first magnetic element 502, the first magnetic guide element 504 and/or the second magnetic element 508 may be cylinders. In some embodiments, the first magnetic element 502, the first magnetic guide element 504, and/or the second magnetic element 508 may be coaxial cylinders of the same or different diameters. The thickness of the first magnetic element 502 may be greater than or equal to the thickness of the second magnetic element 508. In some embodiments, the second magnetic guide element 506 may be of a groove type design. The groove type design may include a U-shaped cross section (as shown in FIG. 5A). The second groove-type magnetic guide member 506 may include a support plate and a side wall. In some embodiments, the base plate and side wall may be formed as a single unit. For example, the side wall may be formed by expanding the support plate in a direction perpendicular to the support plate. In some embodiments, the support plate may be connected to the side wall through one or more connecting means, as described elsewhere herein. The second magnetic element 508 may be provided in a ring form or a sheet form. Regarding the shape of the second magnetic element 508, reference may be made to descriptions elsewhere in the specification (eg, with reference to FIG. 6A and FIG. 6B). In some embodiments, the second magnetic element 508 may be coaxial with the first magnetic element 502 and/or the first magnetic guide element 504.

[0204] The top surface of the first magnetic element 502 may be coupled to the bottom surface of the first magnetic guide element 504. The bottom surface of the first magnetic element 502 may be connected to the support plate of the second magnetic guide element 506. The bottom surface of the second magnetic element 508 may be connected to the top surface of the first magnetic guide element 504. The connecting means between the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506 and/or the second magnetic element 508 may include bonding, snapping, welding, riveting, bolting, etc. etc., or any combination thereof.

[0205] The magnetic gap may be formed between the first magnetic element 502, the first magnetic guide element 504 and/or the second magnetic element 508 and the side wall of the second magnetic guide element 506. The voice coil 520 may be located in the magnetic gap. In some embodiments, the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506, and the second magnetic element 508 may form a magnetic circuit. In some embodiments, magnetic circuit assembly 5100 may generate a first magnetic field, and first magnetic element 502 may generate a second magnetic field. The first magnetic field may be jointly generated by magnetic fields generated by all components (eg, first magnetic element 502, first magnetic guide element 504, second magnetic guide element 506, and second magnetic element 508) in magnetic circuit assembly 5100. The strength of the first magnetic field in the magnetic gap (may also be referred to as magnetic induction value or magnetic flux density) may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the second magnetic element 508 may generate a third magnetic field, and the third magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0206] In some embodiments, the internal angle between the magnetization direction of the second magnetic element 508 and the magnetization direction of the first magnetic element 502 may be in the range of 90 degrees to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the second magnetic element 508 and the magnetization direction of the first magnetic element 502 may be in the range of 150 degrees to 180 degrees. In some embodiments, the direction of magnetization of the second magnetic element 508 may be opposite to the direction of magnetization of the first magnetic element 502 (as shown, in direction a and in direction b).

[0207] Compared with the magnetic circuit assembly of a single magnetic element, the magnetic circuit assembly 5100 may add a second magnetic element 508. The magnetization direction of the second magnetic element 508 may be opposite to the magnetization direction of the first magnetic element 502, which may suppress magnetic leakage of the first magnetic element 502 in the direction magnetization, whereby the magnetic field generated by the first magnetic element 502 can be pressed into the magnetic gap, thereby increasing the amount of magnetic flux density in the magnetic gap.

[0208] The above description of magnetic circuit assembly 5100 may only be a specific example, and should not be construed as the only feasible implementation. Obviously, one skilled in the art, having understood the basic principles of the magnetic circuit bone assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 5100 without going beyond the scope of this principle, but these modifications and changes - are still in the volume described above. For example, the second magnetic guide member 506 may have a ring structure or a sheet structure. As another example, magnetic circuit assembly 5100 may further include a conductive element. The conductive element may be coupled to the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506 and the second magnetic element 508.

[0209] In FIG. 5B is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 5200 according to some embodiments of the present invention. As shown in FIG. 5B, unlike magnetic circuit assembly 5100, magnetic circuit assembly 5200 may further include a third magnetic element 510.

[0210] The bottom surface of the third magnetic element 510 may be coupled to a side wall of the second magnetic guide element 506. A magnetic gap may be formed between the first magnetic element 502, the first magnetic guide element 504, the second magnetic element 508, and/or the third magnetic element 510. The voice coil 520 may be located in a magnetic gap. In some embodiments, the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506, the second magnetic element 508, and the third magnetic element 510 may form a magnetic circuit. In some embodiments, the direction of magnetization of the second magnetic element 508 may be as detailed in FIGS. 3A of the present invention.

[0211] In some embodiments, magnetic circuit assembly 5200 may generate a first magnetic field, and first magnetic element 502 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may be greater than the strength of the second magnetic field in the magnetic gap. In some embodiments, the third magnetic element 510 may generate a third magnetic field, and the third magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0212] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the third magnetic element 510 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the third magnetic element 510 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the third magnetic element 510 may be greater than or equal to 90 degrees. In some embodiments, the direction of magnetization of the first magnetic element 502 may be perpendicular to the bottom surface or the top surface of the first magnetic element 502 vertically upward (the direction indicated by arrow a in FIG. 5B). The magnetization direction of the third magnetic element 510 may be oriented from the inner ring of the third magnetic element 510 to the outer ring (the direction indicated by arrow c in FIG. 5B). On the right side of the first magnetic element 502, the magnetization direction of the first magnetic element 502 is deviated by 90 degrees in the clockwise direction.

[0213] In some embodiments, at the position of the third magnetic element 510, the internal angle between the direction of the first magnetic field and the magnetization direction of the third magnetic element 510 may not exceed 90 degrees. In some embodiments, at the position of the third magnetic element 510, the internal angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the third magnetic element 510 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0214] Compared to the magnetic circuit assembly 5100, a third magnetic element 510 may be added to the magnetic circuit assembly 5200. The third magnetic element 510 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5200, thereby increasing the amount of magnetic flux density in the magnetic gap. Under the action of the third magnetic element 510, the magnetic induction lines will further converge towards the position of the magnetic gap, further increasing the amount of magnetic induction in the magnetic gap.

[0215] In FIG. 5C is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 5300 according to some embodiments of the present invention. As shown in FIG. 5C, unlike magnetic circuit assembly 5100, magnetic circuit assembly 5300 may further include a fourth magnetic element 512.

[0216] The fourth magnetic element 512 may be connected to the side wall of the first magnetic element 502 and the second magnetic guide element 506 by bonding, snapping, welding, riveting, bolting, or the like. or any combination thereof. In some embodiments, a magnetic gap may be formed between the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506, the second magnetic element 508, and the fourth magnetic element 512. In some embodiments, the magnetization direction of the second magnetic element 508 can be found at fig. 5A of the present invention.

[0217] In some embodiments, magnetic circuit assembly 5200 may generate a first magnetic field, and first magnetic element 502 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the fourth magnetic element 512 may generate a fourth magnetic field, and the fourth magnetic field may increase the strength of the second magnetic field in the magnetic gap.

[0218] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 may be in the range of 0 to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 502 and the magnetizing direction of the fourth magnetic element 512 may not exceed 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 502 may be perpendicular to the bottom surface or the top surface of the first magnetic element 502 vertically upward (the direction indicated by arrow a in FIG. 5C). The magnetization direction of the fourth magnetic element 512 may be oriented from the outer ring of the fourth magnetic element 512 to the inner ring (the direction indicated by arrow e in FIG. 5C). On the right side of the first magnetic element 502, the magnetization direction of the first magnetic element 502 is deviated by 270 degrees in the clockwise direction.

[0219] In some embodiments, at the position of the fourth magnetic element 512, the internal angle between the direction of the first magnetic field and the magnetization direction of the fourth magnetic element 512 may not exceed 90 degrees. In some embodiments, at the position of the fourth magnetic element 512, the internal angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the fourth magnetic element 512 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc.

[0220] Compared to the magnetic circuit assembly 5200, a fourth magnetic element 512 may be added to the magnetic circuit assembly 5300. The fourth magnetic element 512 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5300, thereby increasing the amount of magnetic flux density in the magnetic gap. In addition, under the action of the fourth magnetic element 512, the magnetic flux lines will further converge towards the position of the magnetic gap, further increasing the amount of magnetic flux in the magnetic gap.

[0221] In FIG. 5D is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 5400 according to some embodiments of the present invention. As shown in FIG. 5D, unlike magnetic circuit assembly 5200, magnetic circuit assembly 5400 may further include a fifth magnetic element 514.

[0222] The bottom surface of the third magnetic element 510 may be connected to the fifth magnetic element 514, and the bottom surface of the fifth magnetic element 514 may be connected to the side wall of the second magnetic guide element 506. A magnetic gap may be formed between the first magnetic element 502, the first magnetic a guide member 504, a second magnetic member 508, and/or a third magnetic member 510. The voice coil 520 may be located in the magnetic gap. In some embodiments, the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506, the second magnetic element 508, the third magnetic element 510, and the fifth magnetic element 514 may form a magnetic circuit. In some embodiments, the magnetization direction of the second magnetic element 508 and the third magnetic element 510 can be found in FIG. 5A and FIG. 5B of the present invention.

[0223] In some embodiments, magnetic circuit assembly 5400 may generate a first magnetic field. The first magnetic element 502 may generate a second magnetic field, and the strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the fifth magnetic element 514 may generate a fifth magnetic field, and the fifth magnetic field may increase the strength of a second magnetic field in the magnetic gap.

[0224] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 may be in the range of 0 degrees to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 502 and the magnetizing direction of the fifth magnetic element 514 may be greater than or equal to 90 degrees.

[0225] In some embodiments, at some positions of the fifth magnetic element 514, the internal angle between the direction of the first magnetic field and the magnetization direction of the fifth magnetic element 514 may not exceed 90 degrees. In some embodiments, at the position of the fifth magnetic element 514, the internal angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the fifth magnetic element 514 may be an internal angle that is less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, etc. In some embodiments, the magnetization direction of the first magnetic element 502 may be perpendicular to the bottom surface or the top surface of the first magnetic element 502 vertically upward (the direction indicated by arrow a in FIG. 5D). The magnetization direction of the fifth magnetic element 514 may be oriented from the upper surface of the fifth magnetic element 514 to the lower surface (the direction indicated by arrow d in FIG. 5D). On the right side of the first magnetic element 502, the magnetization direction of the first magnetic element 502 is deviated by 180 degrees in the clockwise direction.

[0226] Compared to the magnetic circuit assembly 5200, a fifth magnetic element 514 may be added to the magnetic circuit assembly 5400. The fifth magnetic element 514 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5400, thereby increasing the amount of magnetic flux density in the magnetic gap. In addition, under the action of the fourth magnetic element 514, the magnetic flux lines will further converge towards the position of the magnetic gap, further increasing the amount of magnetic flux in the magnetic gap.

[0227] In FIG. 5E is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 5500 according to some embodiments of the present invention. As shown in FIG. 5E, unlike magnetic circuit assembly 5300, magnetic circuit assembly 5500 may further include a sixth magnetic element 516.

[0228] The sixth magnetic element 516 may be connected to the side wall of the second magnetic element 508 and the second magnetic guide element 506 by bonding, snapping, welding, riveting, bolting, or the like. or any combination thereof. In some embodiments, a magnetic gap may be formed between the first magnetic element 502, the first magnetic guide element 504, the second magnetic guide element 506, the second magnetic element 508, the fourth magnetic element 512, and the sixth magnetic element 516. In some embodiments, the magnetization direction of the second magnetic element element 508 and fourth magnetic element 512 can be found in FIG. 5A and FIG. 5C of the present invention.

[0229] In some embodiments, magnetic circuit assembly 5500 may generate a first magnetic field, and first magnetic element 502 may generate a second magnetic field. The strength of the first magnetic field in the magnetic gap may exceed the strength of the second magnetic field in the magnetic gap. In some embodiments, the sixth magnetic element 516 may generate a sixth magnetic field, and the sixth magnetic field may increase the strength of a second magnetic field in the magnetic gap.

[0230] In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 may be in the range of 0 degrees to 180 degrees. In some embodiments, the internal angle between the magnetization direction of the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 may be in the range of 45 degrees to 135 degrees. In some embodiments, the internal angle between the magnetizing direction of the first magnetic element 502 and the magnetizing direction of the sixth magnetic element 516 may not exceed 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 502 may be perpendicular to the bottom surface or the top surface of the first magnetic element 502 vertically upward (the direction indicated by arrow a in FIG. 5E). The magnetization direction of the sixth magnetic element 516 may be oriented from the outer ring of the sixth magnetic element 516 to the inner ring (the direction indicated by arrow f in FIG. 5E). On the right side of the first magnetic element 502, the magnetization direction of the sixth magnetic element 516 may be the same as the magnetization direction of the first magnetic element 502 deflected by 270 degrees in the clockwise direction).

[0231] In some embodiments, at the position of the sixth magnetic element 516, the internal angle between the direction of the first magnetic field and the magnetization direction of the sixth magnetic element 516 may not exceed 90 degrees. In some embodiments, at the position of the sixth magnetic element 516, the internal angle between the direction of the magnetic field generated by the first magnetic element 502 and the magnetization direction of the sixth magnetic element 516 may be greater than or equal to 90 degrees, such as 90 degrees, 110 degrees, or 120 degrees.

[0232] Compared to the magnetic circuit assembly 5100, a fourth magnetic element 512 and a sixth magnetic element 516 may be added to the magnetic circuit assembly 5500. The fourth magnetic element 512 and the sixth magnetic element 516 may increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly 5500, increase the amount of magnetic induction in the magnetic gap, thereby increasing the sensitivity of the bone conduction repeater.

[0233] In FIG. 5F is a diagram showing a longitudinal sectional view of a magnetic circuit assembly 5600 according to some embodiments of the present invention. As shown in FIG. 5F, unlike magnetic circuit assembly 5100, magnetic circuit assembly 5600 may further include a third magnetic guide member 518.

[0234] In some embodiments, the third magnetic guide element 518 may include any one or more magnetically conductive materials described in the present invention. The magnetically conductive materials included in the first magnetic guide member 504, the second magnetic guide member 506, and/or the third magnetic guide member 518 may be the same or different. In some embodiments, the third magnetic guide element 5186 may be configured as a symmetrical design. For example, the third magnetic guide 518 may be a cylinder. In some embodiments, the first magnetic element 502, the first magnetic guide element 504, the second magnetic element 508 and/or the third magnetic guide element 518 may be coaxial cylinders of the same or different diameters. The third magnetic guide element 518 may be connected to the second magnetic element 508. In some embodiments, the third magnetic guide element 518 may be coupled to the second magnetic element 508 and the second magnetic guide element 506, whereby the third magnetic guide element 518 and the second magnetic guide element 506 form a cavity. The cavity may include a first magnetic element 502, a second magnetic element 508, and a first magnetic guide element 504.

[0235] Compared to the magnetic circuit assembly 5100, the third magnetic guide element 518 may add a magnetic guide element to the magnetic circuit assembly 5600. The third magnetic guide element 518 can suppress magnetic leakage of the second magnetic element 508 in the magnetization direction in the magnetic circuit assembly 5600, whereby the magnetic field generated by the second magnetic element 508 can be pressed into the magnetic gap, thereby increasing the amount of magnetic flux density in the magnetic gap .

[0236] In FIG. 6A is a diagram showing a cross section of a magnetic element according to some embodiments of the present invention. The magnetic element 600 can be applied to any magnetic circuit assembly in the present invention (eg, the magnetic circuit assembly shown in FIGS. 3A - 3G, FIGS. 4A - 4M, or FIGS. 5A - 5F). As shown, the magnetic element 600 may be configured in a ring shape. The magnetic element 600 may include an inner ring 602 and an outer ring 604. In some embodiments, the inner ring 602 and/or the outer ring 604 may be shaped like a circle, an ellipse, a triangle, a quadrilateral, or any other polygon.

[0237] In FIG. 6B is a diagram showing a magnetic element according to some embodiments of the present invention. The magnetic element may be applied to any magnetic circuit assembly in the present invention (eg, the magnetic circuit assembly shown in FIGS. 3A - 3G, FIGS. 4A - 4M, or FIGS. 5A - 5F). As shown, the magnetic element may consist of several magnets s arranged one behind the other. Each of the two ends of any of several magnets can be connected to the end of an adjacent magnet or separated from it by some distance. The spacing between two adjacent magnets may be the same or different. In some embodiments, the magnetic element may be composed of two or three sheet magnets (eg, magnet 608-2, magnet 608-4, and magnet 608-6) that are positioned equidistantly. Sheet magnets can be fan-shaped, quadrangular, etc.

[0238] In FIG. 6C is a diagram showing the direction of magnetization of a magnetic element in a magnetic circuit assembly according to some embodiments of the present invention. As shown, the magnetic circuit assembly may include a first magnetic element 601, a second magnetic element 603, and a third magnetic element 605. The magnetization direction of the first magnetic element 601 may be oriented from the bottom surface of the first magnetic element 601 to the top surface (i.e., the direction , perpendicular to the paper and pointing outward). The second magnetic element 603 may surround the first magnetic element 601. A magnetic gap may be formed between the inner ring of the second magnetic element 603 and the outer ring of the first magnetic element 601. The magnetization direction of the second magnetic element 603 may be oriented from the inner ring of the second magnetic element 603 to the outer ring a second magnetic element 603. An inner ring of a third magnetic element 605 may be connected to an outer ring of a first magnetic element 601, and an outer ring of a third magnetic element 605 may be connected to an inner ring of a second magnetic element 603. The magnetization direction of the third magnetic element 605 may be oriented away from the outer ring of the third magnetic element 603 to the inner ring of the third magnetic element 605.

[0239] In FIG. 6D is a diagram showing the magnetic flux lines of a magnetic element in a magnetic circuit assembly according to some embodiments of the present invention. As shown, a magnetic circuit assembly 600 (e.g., the magnetic circuit assembly in FIGS. 3A - 3G, FIGS. 4A - 4M, or FIGS. 5A - 5F) may include a first magnetic element 602 and a second magnetic element 604. The magnetization direction of the first magnetic element element 602 may be oriented from the bottom surface of the first magnetic element 602 to the top surface (indicated by arrow a in FIG. 6D). The first magnetic element 602 may generate a second magnetic field, and the second magnetic field may be represented by magnetic induction lines (indicated by solid lines in FIG. 6D, which represent the distribution of the second magnetic field in the absence of the second magnetic element 604). The direction of the magnetic field of the second magnetic field at some point may be the direction of the tangent at a point on the magnetic induction line. The magnetization direction of the second magnetic element 604 may be such that the inner ring of the second magnetic element 604 points toward the outer ring (as shown by arrow b). The second magnetic element 604 may generate a third magnetic field. The third magnetic field may be represented by magnetic induction lines (indicated by dotted lines in FIG. 6D, which indicate the distribution of the third magnetic field in the absence of the first magnetic element 602). The direction of the magnetic field of the third magnetic field at some point may be the direction of the tangent at a point on the third magnetic induction line. Due to the interaction of the second magnetic field and the third magnetic field, the magnetic circuit assembly 600 can generate the first magnetic field. The strength of the first magnetic field on the voice coil 606 may be greater than the strength of the second magnetic field or the third magnetic field on the voice coil 606. As shown, the internal angle between the magnetic field direction of the second magnetic field on the voice coil 606 and the magnetization direction of the second magnetic element 604 may be less than or equals 90 degrees.

[0240] In FIG. 7A is a diagram illustrating a magnetic circuit assembly 7000 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 7000 may include a first magnetic element 702, a first magnetic guide element 704, a first annular magnetic element 706, and a second annular magnetic element 708. The first annular magnetic element 706 may also be referred to as a first magnetic field varying element (e.g. first magnetic field changing element 406 described in Fig. 4A). The first magnetic element 702, the first magnetic guide element 704, the first annular magnetic element 706, and the second annular magnetic element 708 may be similar or identical to the first magnetic element 702, the first magnetic element 402, the first magnetic guide element 404, the first magnetic field changing element 406, and the second magnetic element 408, respectively, described with reference to FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, fig. 4G, fig. 4H and/or FIG. 4M. For example, the first annular magnetic element 706 may be formed as a single piece of magnetic material, or may be a combination of several magnetic elements. The second annular magnetic element 708 may be formed as a single piece of magnetic material, or may be a combination of several magnetic elements. As another example, the second annular magnetic element 708 may be coupled to the first annular magnetic element 702 and the first annular magnetic element 706. Additionally, the first annular magnetic element 706 may be coupled to the top surface of the second annular magnetic element 708, and the inner wall of the second annular magnetic element 708. element 708 may be connected to the outer wall of the first magnetic element 702.

[0241] The first magnetic element 702, the first magnetic guide element 704, the first annular magnetic element 706, and the second annular magnetic element 708 may form a magnetic circuit and a magnetic gap. The voice coil 720 may be located in the magnetic gap. The voice coil 720 may have a round shape or a non-round shape. A non-circular shape may include an ellipse, triangle, quadrilateral, pentagon, other polygons, or other irregular shapes. When an alternating current including audio information passes through the voice coil 720, the voice coil 720 in the magnetic gap may vibrate under the action of the Ampere force in the magnetic field in the magnetic circuit, thereby converting the audio information into a vibration signal. The vibration signal can be transmitted to the auditory nerve through the tissue and bones of a person through other components (eg, the vibration unit 104 shown in FIG. 1) in the bone conduction headset, thereby allowing the person to hear sound. The amount of Ampere force on the voice coil 720 may affect the vibration of the voice coil, thereby further affecting the sensitivity of the bone conduction headset. The magnitude of the Ampere force on the voice coil can be related to the magnitude of the magnetic induction in the magnetic gap. Additionally, the magnitude of the magnetic induction in the magnetic gap can be changed by adjusting the parameters of the magnetic circuit assembly.

[0242] Parameters of the magnetic circuit assembly 7000 may include the thickness H (i.e., the height H of the first magnetic element 702, as shown in FIG. 7A) of the first magnetic element 702, the thickness w of the first annular magnetic element 706, the height h of the second magnetic element element 708, radius R of the magnetic circuit, etc. In some embodiments, the radius R of the magnetic circuit (i.e., the return magnetic path) may mean the average half-width of the magnetic circuit, i.e. the distance between the central axis (indicated by the dotted line in FIG. 7A) of the magnetic circuit assembly 7000 and the outer wall of the first annular magnetic element 706. In some embodiments, parameters of the magnetic circuit assembly 7000 may include the ratio of the radius R of the magnetic circuit to the thickness H of the first magnetic element 702 (denoted as R/H), the ratio of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit (denoted as w/R), the ratio of the height h of the second annular magnetic element 708 to the thickness H of the first magnetic element 702 (denoted as h/ H) etc. In some embodiments, the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 702 may be in the range of 2.0 to 4.0. For example, the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 702 may be 2.0, 2.4, 2.8, 3.2, 3.6, or 4.0. The ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first magnetic element 702 may not exceed 0.8, or not exceed 0.6, or not exceed 0.5, etc. For example, the ratio h/H of the height h of the second magnetic element 708 to the thickness H of the first magnetic element 702 may be 0.4. The ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit may be in the range of 0.05-0.50, or 0.1-0.35, or 0.1-0.3, or 0.1 -0.25, or 0.1-0.20. For example, the ratio w/R of the thickness w of the first annular magnetic element 706 and the radius R of the magnetic circuit may be in the range of 0.16-0.18.

[0243] In some embodiments, when the ratio of the thickness H of the first magnetic element 702 to the radius R of the magnetic circuit is constant (i.e., R/H is constant), the values of the two parameters w/R and h/H can be optimized to achieve the greatest value of magnetic induction (or tension) in the magnetic gap and Ampere force on the voice coil, i.e. the highest coefficient BL of the driving force. Additional descriptions of the relationship between the parameters w/R, h/H and the driving force coefficient BL can be found in FIG. 7B. In some embodiments, by setting different values of R/H and adjusting the values of w/R and h/H, it is possible to maximize the amount of magnetic induction (or intensity) in the magnetic gap and the ampere strength of the coil, i.e. achieve the highest value of the coefficient BL of the driving force. Additional descriptions of the relationship between the parameters R/H, w/R, h/H and the driving force coefficient BL can be found in FIG. 7C - 7E.

[0244] In FIG. 7B is a diagram showing an exemplary relationship curve between the driving force coefficient of the voice coil 720 and the parameters of the magnetic circuit assembly in FIG. 7A according to some embodiments of the present invention. As shown in FIG. 7B, when the ratio of the radius R of the magnetic circuit to the thickness H of the first magnetic element 702 is constant (ie, R/H is constant), the driving force coefficient BL changes with the values of the parameter w/R and h/H. In some embodiments, when the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit is constant, the larger the ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first magnetic element 702, the greater the ratio may be BL driving force. Additionally, if the size of the magnetic circuit (i.e., the radius R of the magnetic circuit) is constant, the larger the height h of the second annular magnetic element 708, the larger the ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first magnetic element 702 can be. , and the greater the driving force coefficient BL can be. But as the height h of the second annular magnetic element 708 increases, the distance between the second annular magnetic element 708 and the voice coil 720 decreases. During the vibration process, the voice coil 720 and the second ring magnetic element 708 may collide with each other, resulting in a knocking sound, which affects the sound quality of the bone conduction headset. As shown in FIG. 7B, the ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first magnetic element 702 may not exceed 0.8, or not exceed 0.6, or not exceed 0.5, etc. For example, the ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first magnetic element 702 may be 0.4.

[0245] In some embodiments, when the ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first annular magnetic element 702 is constant, the driving force coefficient BL may first increase and then decrease as the ratio w/R of the thickness w of the first annular element magnetic element 706 to the radius R of the magnetic circuit. The ratio w/R corresponding to the maximum driving force coefficient BL may be within a certain range. For example, when the ratio h/H of the height h of the second magnetic element 708 to the thickness H of the first magnetic element 702 is 0.4, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit may be in the range of 0.08-0.25. When the ratio h/H of the height h of the second magnetic element 708 and the thickness H of the first magnetic element 702 changes, the range of the ratio w/R corresponding to the maximum driving force coefficient BL may change. For example, when the ratio h/H of the height h of the second magnetic element 708 to the thickness H of the first magnetic element 702 is 0.72, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit may be in the range of 0.04-0.20. Additional descriptions of the range of values of the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit corresponding to the maximum driving force coefficient BL can be found in FIG. 7C - 7E.

[0246] In FIG. 7C - 7E are graphs showing relationship curves between the driving force coefficient of the voice coil 720 and the parameters of the magnetic circuit assembly in FIG. 7A according to some embodiments of the present invention. As shown in FIG. 7C to 7E, the coefficient BL of the driving force of the voice coil 720 located in the magnetic circuit node 7000 changes with the parameter R/H, w/R and h/H of the magnetic circuit node 7000. As shown in FIG. 7C, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first annular magnetic element 702 is 2.0 and 2.4, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit may be in the range of 0.05-0.20, or 0.05-0.15, or 0.05-0.25, or 0.1-0.25, or 0.1-0.18. As shown in FIG. 7D, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 702 is 2.8 and 3.2, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit may be in the range of 0.05-0.25, or 0.1-0.20, or 0.05-0.30, or 0.10-0.25. As shown in FIG. 7E, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first annular magnetic element 702 is 3.6 and 4.0, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic circuit may be in the range of 0.05-0.20, or 0.10-0.15, or 0.05-0.25, or 0.10-0.20.

[0247] Referring to FIG. 7C to 7E, when the ratio h/H of the height h of the second annular magnetic element 708 to the thickness H of the first annular magnetic element 702 is 0.4, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 706 to the radius R of the magnetic chains can be in the range of 0.15-0.20, or 0.16-0.18.

[0248] In FIG. 8A is a diagram illustrating a magnetic circuit assembly 8000 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 8000 may include a first magnetic element 802, a first magnetic guide element 804, a first annular magnetic element 806, a second annular magnetic element 808, and a magnetic shield 814. The first annular magnetic element 806 may also be referred to as a first magnetic change element. fields (eg, the first magnetic field changing element 406 described in FIG. 4A). The first magnetic element 802, the first magnetic guide element 804, the first annular magnetic element 806, the second annular magnetic element 808, the magnetic shield 804 can be described in detail in FIG. 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, fig. 4G, fig. 4H, and/or FIG. 4M. For example, the first annular magnetic element 806 may be formed as a single unit of magnetic materials or may be a combination of several magnetic elements. The second annular magnetic element 808 may be formed as a single unit of magnetic materials or may be a combination of several magnetic elements. As another example, the magnetic shield 814 may be configured to surround a first magnetic element 802, a first annular magnetic element 806, and a second annular magnetic element 808. In some embodiments, the magnetic shield 814 may include a support plate and a side wall, and a side wall may be a ring structure. In some embodiments, the base plate and side wall may be formed as a single unit. The first magnetic element 802, the first magnetic guide element 804, the first annular magnetic element 806, and the second annular magnetic element 808 may form a magnetic circuit and a magnetic gap. The voice coil 820 may be located in a magnetic gap. The voice coil 820 may have a round shape or a non-round shape. Non-circular shapes may include oval, triangle, quadrilateral, pentagon, other polygons, or other irregular shapes.

[0249] Parameters of the magnetic circuit assembly 8000 may include the thickness H of the first magnetic element 802 (as shown in FIG. 8A, i.e., the height H of the first magnetic element 802), the thickness w of the first annular magnetic element 806, the height h of the second annular magnetic element 808, radius R of the magnetic circuit, etc. In some embodiments, the radius R of the magnetic circuit (i.e., the magnetic circuit) may be equal to the distance between the central axis of the magnetic circuit assembly 8000 (shown as a dotted line in FIG. 8A) and the outer wall of the first annular magnetic element 806. In some embodiments, the parameters magnetic circuit assembly 8000 may also include a ratio of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 (may be expressed as R/H), a ratio of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit (may be expressed as w/R ), the ratio of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 802 (may be expressed as h/H), and the like. In some embodiments, the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 may be in the range of 2.0 to 4.0. For example, the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 may be 2.0, 2.4, 2.8, 3.2, 3.6, and 4.0. The ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 802 may not exceed 0.8, or not exceed 0.6, or not exceed 0.5, etc. For example, the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 702 may be 0.4. The ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit may be in the range of 0.02-0.50, or 0.05-0.35, or 0.05-0.25, or 0.1 -0.25, or 0.1-0.20. For example, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit may be in the range of 0.16-0.18. When the thickness H of the first magnetic element 802 and the radius R of the magnetic circuit are constant (for example, R/H is constant), the two parameters w/R and h/H are optimized, whereby the amount of magnetic induction in the magnetic gap and the ampere force of the coil are maximized, i.e. e. the coefficient BL of the driving force takes the greatest value. The relationship between the parameter w/R and h/H and the driving force coefficient BL can be found in Fig. 8B. In some embodiments, when R/H changes, the two parameters w/R and h/H can be optimized such that the amount of magnetic induction in the magnetic gap and the ampere strength of the coil are maximized, i.e. the coefficient BL of the driving force takes the greatest value. The relationship between the parameter R/H, w/R, h/H and the driving force coefficient BL can be found in Fig. 8C - 8E.

[0250] In FIG. 8B shows a curve of the relationship between the driving force coefficient at voice coil 820 and the parameters of the magnetic circuit assembly in FIG. 8A according to some embodiments of the present invention. As shown in FIG. 8B, when the ratio of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 is constant (ie, R/H is constant), the driving force coefficient BL may vary with the parameter w/R and h/H. In some embodiments, when the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit is constant, the greater the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 802, the greater the driving coefficient BL strength. Additionally, the larger the height h of the second annular magnetic element 808, the larger the ratio h/H between the height h of the second annular magnetic element 808 and the thickness H of the first magnetic element 702 can be, and the greater the driving force coefficient BL. As shown in FIG. 8B, the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 802 may not exceed 0.8, or not exceed 0.6, or not exceed 0.5. For example, the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 802 may be 0.4.

[0251] In some embodiments, when the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first annular magnetic element 802 is constant, the driving force coefficient BL may vary with the change in the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R magnetic circuit. For example, when the ratio h/H of the height h of the second magnetic element 808 to the thickness H of the first magnetic element 802 is 0.4, the driving force coefficient BL may decrease as the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit increases. When the ratio h/H of the height h of the second magnetic element 808 and the thickness H of the first magnetic element 802 changes, the range of the ratio w/R corresponding to the maximum driving force coefficient BL may change. For example, when the ratio h/H of the height h of the second magnetic element 808 to the thickness H of the first magnetic element 802 is 0.4, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit may be in the range of 0.02-0.22. When the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first magnetic element 802 is 0.72, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit can be within range 0.02-0.16.

[0252] Referring to FIG. 7B, when the parameters R/H, w/R, h/H of the magnetic circuit node 8000 and 7000 are the same, the driving force coefficient BL of the voice coil located in the magnetic circuit node 8000 with a magnetic shield can be greater than that of the coil in the magnetic circuit node 7000 magnetic circuit without a magnetic shield, i.e. The Amp of the voice coil located in the magnetic circuit node 8000 may be greater for the coil in the magnetic circuit node 7000. For example, as shown in FIG. 7B and FIG. 8B, if w/R and h/H are about 0.21 and 0.4, respectively, the driving force coefficient BL of the voice coil located in the magnetic circuit node 8000 may be 2.817, and the driving force coefficient BL of the magnetic circuit node 7000 may be equal to 2.376.

[0253] In FIG. 8C - 8E show curves of the relationship between the driving force coefficient at the voice coil 820 and the magnetic circuit assembly parameters in FIG. 8A according to some embodiments of the present invention. As shown in FIG. 8C to 8E, the driving force coefficient BL of the voice coil 820 in the magnetic circuit node 8000 changes with the parameter R/H, w/R and h/H of the magnetic circuit node 8000. As shown in FIG. 8C, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 is 2.0 and 2.4, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit may be in the range of 0.02-0.15, or 0.05-0.15, or 0.02-0.20. As shown in FIG. 8D, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 is 2.8 and 3.2, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit can be 0.01-0.20, or 0.05-0.15, or 0.02-0.25, or 0.10-0.15. As shown in FIG. 8E, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 is 3.6 and 4.0, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic circuit may be in the range of 0.02-0.20, or 0.05-0.15, or 0.05-0.25, or 0.10-0.20.

[0254] Referring to FIG. 8C to 8E, when the ratio h/H of the height h of the second annular magnetic element 808 to the thickness H of the first annular magnetic element 802 is 0.4, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w of the first annular magnetic element 806 to the radius R of the magnetic chains can be in the range of 0.05-0.20 or 0.16-0.18. Comparing fig. 7C and FIG. 8C, FIG. 7D and FIG. 8D, and FIG. 7E and FIG. 8E, respectively, when the ratio R/H of the magnetic circuit radius R to the thickness H of the first magnetic element 802 is the same, if the driving force coefficient BL is maximized, the ratio w/R of the thickness w to the magnetic circuit radius R of the first annular magnetic element 806 in the magnetic component 8000. having a magnetic shield may vary downward with respect to the magnetic component 7000. For example, when the ratio R/H of the radius R of the magnetic circuit to the thickness H of the first magnetic element 802 (or 702) is 2.0, if the driving force coefficient BL is maximized, the ratio w /R of the thickness w of the first annular magnetic element 806 in the magnetic shield magnetic component 8000 to the radius R of the magnetic circuit may be in the range of 0.02-0.15. The ratio w/R of the thickness w of the first annular magnetic element 706 in the magnetic component 7000 without a magnetic shield to the radius R of the magnetic circuit may be in the range of 0.05-0.25.

[0255] In FIG. 9A is a diagram showing the distribution of magnetic flux lines of magnetic circuit assembly 900 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 900 may include a first magnetic element 902, a first magnetic guide element 904, a second magnetic guide element 906, and a second magnetic element 914. The first magnetic element 902, the first magnetic guide element 904, the second magnetic guide element 906, and the second magnetic element 914 may be similar or identical to the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, and the second magnetic element 314, respectively, in FIG. 3D. The direction of magnetization of the first magnetic element 902 may be opposite to the direction of magnetization of the second magnetic element 914. The magnetic induction lines generated by the first magnetic element 902 may interact with the magnetic induction lines generated by the second magnetic element 914, thereby causing more magnetic induction lines generated by the first magnetic element. element 902, and more magnetic flux lines generated by the second magnetic element 914 can pass through the voice coil 928 perpendicularly, thereby reducing the leakage of the magnetic lines of the first magnetic element 902 on the voice coil 928.

[0256] In FIG. 9B is a graph showing the relationship curve between the amount of magnetic flux density at the voice coil and the thickness of one or more components in the magnetic circuit assembly 900 of FIG. 9A according to some embodiments of the present invention. The x-axis is the ratio of the thickness (denoted h3) of the first magnetic element 902 to the sum (i.e., h2+h3+h5) of the thickness h3 of the first magnetic element 902, the thickness of the first magnetic guide element 904 (denoted h2) and the thickness of the second magnetic element 914 (denoted h5), which may also be referred to as the first thickness ratio. The y-axis represents the normalized magnitude of magnetic flux density at voice coil 928. The normalized magnitude of magnetic flux density may be the ratio of the actual magnitude of magnetic flux density at voice coil 928 to the largest magnitude of magnetic flux density that the magnetic circuit provides using a magnetic circuit assembly including one a single magnetic element (also called a single magnetic circuit assembly). For example, a single magnetic circuit assembly may include a first magnetic element, a first magnetic guide element, and a second magnetic guide element. The volume of a magnetic element in a single magnetic circuit assembly may be equal to the sum of the volumes of the magnetic elements in a multiple circuit assembly including multiple magnetic elements (e.g., a first magnetic element 902 and a second magnetic element 914 in a magnetic circuit assembly 900) corresponding to the single assembly magnetic circuit. k denotes the ratio of the thickness h2 of the first magnetic guide element 904 to the sum of (h2+h3+h5) the thickness values of the first magnetic element 902, the first magnetic guide element 904 and the second magnetic element 914, which may also be referred to as the second thickness ratio (indicated by "k" in Fig. 9B). As shown, as the first thickness ratio gradually increases, the amount of magnetic flux density on the voice coil 928 may gradually increase, and may gradually decrease after reaching a certain value, i.e. the magnetic induction amount on the voice coil 928 may have a maximum value, and the range of the first thickness ratio corresponding to the maximum value of the magnetic induction amount may be from 0.4 to 0.6. The range of the second thickness ratio, corresponding to the maximum value of the magnetic induction, can be from 0.26 to 0.34.

[0257] In FIG. 10A is a diagram showing the distribution of magnetic flux lines of a magnetic circuit assembly 1000 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 1000 may include a first magnetic element 1002, a first magnetic guide element 1004, a second magnetic guide element 1006, a second magnetic element 1014, and a third magnetic guide element 1016. The first magnetic element 1002, the first magnetic guide element 1004, the second magnetic guide element 1006, the second magnetic element 1014, and the third magnetic guide element 1016 may be identical or similar to the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, the second magnetic element 308, the second magnetic element 314, and the third magnetic element guide element 316 in FIG. 3E of the present invention. The third magnetic guide element 1016 may not be connected to the second magnetic guide element 1006. The direction of magnetization of the first magnetic element 1002 may be opposite to the direction of magnetization of the second magnetic element 1014. The magnetic induction lines generated by the first magnetic element 1002 interact with the magnetic induction lines generated by the second magnetic element 1014 whereby, the magnetic induction lines generated by the first magnetic element 1002 and the magnetic induction lines generated by the second magnetic element 1014 can pass through the voice coil 1028 more perpendicularly, thereby reducing the leakage of the magnetic induction lines of the first magnetic element 1002 to the voice coil coil 1028. The third magnetically permeable plate 1016 may further reduce magnetic line leakage of the first magnetic element 1002 on the voice coil 1028.

[0258] In FIG. 10B shows a curve of the relationship between the amount of magnetic flux density at a voice coil and the thickness of a component in a magnetic circuit assembly according to some embodiments of the present invention. Curve a corresponds to magnetic circuit node 900 in FIG. 9A, and curve b corresponds to magnetic circuit node 1000 in FIG. 10A. The x-axis represents the first thickness ratio, and the y-axis represents the normalized amount of magnetic flux density on the voice coil 928 or 1028. The first thickness ratio and the normalized amount of magnetic flux density are described in detail in FIG. 9B of the present invention. Curve a may express the relationship between the magnitude of the magnetic flux density of the voice coil 928 in the magnetic circuit assembly 900 and the first thickness ratio, and curve b may express the relationship between the magnitude of the magnetic flux density of the voice coil 1028 in the magnetic circuit assembly 1000 and the first thickness ratio. As shown in FIG. 10B, a magnetic circuit assembly 1000 of the third magnetic guide member 1016 is provided. When the range of the first thickness is from 0 to 0.55, the amount of magnetic flux density on the voice coil 1028 is significantly larger than the amount of magnetic flux density on the voice coil 928 (for example, the amount of magnetic flux density corresponding to curve b is higher than the magnetic induction value corresponding to curve a). When the range of the first thickness ratio is from 0.55 to 1, the amount of magnetic induction on the voice coil 1028 is significantly lower than the amount of magnetic induction on the voice coil 928 (for example, the amount of magnetic induction corresponding to curve b is lower than the amount of magnetic induction corresponding to curve a).

[0259] In FIG. 11A is a diagram showing the distribution of magnetic flux lines of magnetic circuit assembly 1100 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 1100 may include a first magnetic element 1102, a first magnetic guide element 1104, a second magnetic guide element 1106, a second magnetic element 1114, and a third magnetic guide element 1116. The first magnetic element 1102, the first magnetic guide element 1104, the second magnetic guide element 1106, the second magnetic element 1114, and the third magnetic guide element 1116 may be similar or identical to the first magnetic element 302, the first magnetic guide element 304, the second magnetic guide element 306, the second magnetic element 308, the fifth magnetic element 314, and the third magnetic element guide element 316, respectively, in FIG. 3E. The third magnetic guide element 1116 may be coupled to the second magnetic guide element 1106. The magnetization direction of the first magnetic element 1102 may be opposite to the magnetization direction of the second magnetic element 1114. The magnetic field of the first magnetic element 1102 and the magnetic field of the second magnetic element 1114 may cancel each other at a point connection of the first magnetic element 1102 and the second magnetic element 1114, whereby the initially divergent magnetic field can pass through the voice coil 1128 under the influence of mutually compensating magnetic fields (for example, a magnetic field generated only by the first magnetic element 1102, or a magnetic field generated only by the second magnetic element 1114), thereby increasing the magnetic field strength on the voice coil 1128. The third magnetic conductive plate 1116 may be coupled to the second magnetic guide element 1106, whereby the magnetic field of the second magnetic element 1114 and the first magnetic element 1102 is coupled to the magnetic circuit, formed by the second magnetic guide element 1106 and the third magnetic guide element 1116, thereby further increasing the amount of magnetic flux density on the voice coil 1128.

[0260] In FIG. 11B shows a curve of the relationship between the amount of magnetic flux density and the thickness of each element in a magnetic circuit assembly according to some embodiments of the present invention. Curve a corresponds to magnetic circuit node 900 in FIG. 9A. Curve b corresponds to magnetic circuit node 1000 in FIG. 10A. Curve c corresponds to magnetic circuit assembly 1100 shown in FIG. 11A. The abscissa axis shows the ratio of the thickness (h3) of the first magnetic element (902, 1002, 1102) to the sum (h3+h5) of the thickness values of the first magnetic element (902, 1002, 1102) and the second magnetic element (914, 1014, 1114), hereafter referred to as the third thickness ratio. The ordinate axis shows the normalized value of magnetic induction on the voice coil (928, 1028, 1128). The normalized magnetic flux density is described with reference to FIG. 9B. Curve a may express the relationship between the amount of magnetic flux density of the voice coil 928 in the magnetic circuit assembly 900 and the first thickness ratio. Curve b may express the relationship between the amount of magnetic flux density of the voice coil 1028 in the magnetic circuit assembly 1000 and the first thickness ratio. Curve c may express the relationship between the amount of magnetic flux density of the voice coil 1128 in the magnetic circuit assembly 1100 and the first thickness ratio. As shown in FIG. 11B, a magnetic circuit assembly 1000 and 1100 including a third magnetic guide element (e.g., magnetic guide element 1014, magnetic guide element 1114), in the case where the first thickness is less than 0.7, the amount of magnetic flux density on the corresponding voice coil (e.g. , voice coil 1028, voice coil 1128) may be greater than the amount of magnetic induction across voice coil 928 in a magnetic circuit assembly 900 that does not include a third magnetic guide element (e.g., the amount of magnetic induction corresponding to curve b and curve c above, than the magnetic induction value corresponding to curve a). When the third magnetic guide element and the second magnetic guide element are connected to each other (for example, the third magnetic guide element 1116 and the second magnetic guide element 1106 in the magnetic circuit assembly 1100 are connected to each other), the amount of magnetic flux density on the voice coil 1128 may be greater than than the amount of magnetic induction on the voice coil 1028 (for example, the amount of magnetic induction corresponding to curve c is higher than the amount of magnetic induction corresponding to curve b).

[0261] In FIG. 11C shows a curve of the relationship between the amount of magnetic flux density at the voice coil and the thickness of the element in the magnetic circuit assembly 1100 shown in FIG. 11A according to some embodiments of the present invention. The x-axis represents the second thickness ratio (represented by “h2 / (h2+h3+h5)” in the figure). The y-axis represents the normalized amount of magnetic flux density on the voice coil 1128, and the second thickness ratio and the normalized amount of magnetic flux density are described with reference to FIG. 9B. As shown in FIG. 11C, as the second thickness ratio gradually increases, the amount of magnetic induction on the voice coil 1128 gradually increases to a maximum value and then decreases. The range of the second thickness ratio, corresponding to the maximum value of the magnetic induction, can be from 0.3 to 0.6.

[0262] In FIG. 12A is a diagram showing a magnetic circuit assembly 1200 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 1200 may include a first magnetic element 1202, a first magnetic guide element 1204, a second magnetic guide element 1206, and a first conductive element 1208. Additional Descriptions of the first magnetic element 1202, the first magnetic guide element 1204, the second magnetic guide element 1206 and the first conductive element 1208 can be found elsewhere herein (eg, with reference to FIGS. 3A-3G). In some embodiments, the first conductive element 1204 may have a portion that overhangs the first magnetic element 1202. The first conductive element 1208 may be located in the first concave portion and coupled to the first magnetic element 1202.

[0263] The first magnetic element 1202, the first magnetic guide element 1204, and the second magnetic guide element 1206 may define a magnetic gap. The voice coil 1210 may be located in a magnetic gap. The cross-section of voice coil 1210 may be circular or non-circular, such as oval, rectangular, square, pentagonal, other polygonal, or other irregular shapes. In some embodiments, an alternating current may flow into the voice coil 1210. The direction of the alternating current may be perpendicular to the surface of the paper and pointing toward the surface of the paper, as shown in FIG. 12A. In the magnetic circuit formed by the first magnetic element 1202, the first magnetic guide element 1204 and the second magnetic guide element 1206, the voice coil 1210 can generate an alternating induction magnetic field A (also referred to as the “first alternating induction magnetic field”) under the influence of a magnetic field in the magnetic circuit. . The direction of the induced magnetic field A may be oriented counterclockwise, as shown in FIG. 12A. The alternating induction magnetic field A can generate a reverse induction current in the voice coil 1210, thereby reducing the current in the voice coil 1210. The first conductive element 1208 can generate an alternating induction current under the action of the alternating induction magnetic field A. Under the influence of the magnetic field in the magnetic circuit, the alternating induction current can generate an alternating induction magnetic field B (also called the “second alternating induction magnetic field”). The direction of the induced magnetic field B may be oriented counterclockwise, as shown in FIG. 12A. Since the direction of the induction magnetic field A and the direction of the induction magnetic field B are opposite, the reverse induction current in the voice coil 1210 can be reduced, i.e. the inductive reactance due to the reverse induction current in the voice coil 1210 may decrease, and the current in the voice coil 1210 may increase.

[0264] The above description of magnetic circuit assembly 1200 may only be a specific example and should not be construed as the only feasible implementation. Obviously, those skilled in the art, having understood the basic principle of the bone conduction reproducer, can make various modifications and changes regarding the form and details of specific means and implementation steps of the magnetic circuit assembly 1200 without going beyond this principle, but these modifications and changes are still are within the scope described above. For example, the first conductive element 1208 may be provided proximate the voice coil 1210, such as an inner wall, an outer wall, a top surface, and/or a bottom surface of the voice coil 1210.

[0265] In FIG. 12B is a graph showing a curve indicating the effect of conductive elements on the inductive reactance in the voice coil in the magnetic circuit assembly 1200 of FIG. 12A according to some embodiments of the present invention. Curve a corresponds to magnetic circuit node 1200 that does not include the first conductive element 1208, and curve b corresponds to magnetic circuit node 1200 that includes the first conductive element 1208. The x-axis represents the frequency of the alternating current in the voice coil 1210, and The y-axis represents the inductive reactance in the voice coil 1210. As shown in FIG. 12B, the inductive reactance in the voice coil 1210 may increase with increasing AC frequency, particularly after the AC frequency exceeds 1200 Hz. When the first conductive element 1208 is provided in the magnetic circuit node 1200, the inductive reactance in the voice coil may be significantly lower than the inductive reactance in the voice coil when the first conductive element 1208 is not provided in the magnetic circuit node 1200 (for example, the inductive reactance corresponding to curve b , lower than the inductive reactance corresponding to curve a, at the same frequency of alternating current).

[0266] In FIG. 13A is a block diagram illustrating a magnetic circuit assembly 1300 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 1300 may include a first magnetic element 1302, a first magnetic guide element 1304, a second magnetic guide element 1306, and a first conductive element 1318. The first magnetic element 1302, the first magnetic guide element 1304, the second magnetic guide element 1306, and the first conductive element 1318 may refer to related descriptions in the present invention. The first conductive element 1318 may be connected to the top surface of the first magnetic guide element 1304. The first conductive element 1318 may have a sheet shape, a ring shape, a mesh shape, a hole plate shape, or the like.

[0267] The first magnetic element 1302, a magnetic gap may be formed between the first magnetic guide element 1304 and the second magnetic guide element 1306. The voice coil 1328 may be located in the magnetic gap. The cross-section of the voice coil 1328 may be circular or non-circular. Non-circular shapes may include oval, triangle, quadrilateral, pentagon, other polygons, or other irregular shapes.

[0268] The above description of magnetic circuit assembly 1300 may only be a specific example, and should not be construed as the only feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 1300 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, a first conductive element 1318 may be provided in the vicinity of the voice coil 1328, such as an inner wall, an outer wall, a top surface, and/or a bottom surface of the voice coil 1328.

[0269] In FIG. 13B shows a curve of the effect of the magnetic guide element on the inductive reactance in the voice coil in the magnetic circuit assembly 1300 of FIG. 13A according to some embodiments of the present invention. Curve a corresponds to magnetic circuit node 1300 without first conductive element 1318, and curve b corresponds to magnetic circuit node 1300 with first conductive element 1318. The x-axis represents the frequency of the alternating current in the voice coil 1110, and the y-axis represents the inductive reactance in the voice coil 1110. .As shown in Fig. 13B, the inductive reactance in the voice coil 1110 may increase as the AC frequency increases, particularly after the AC frequency exceeds 1200 Hz. When the first conductive element 1318 is provided in the magnetic circuit assembly 1300, the inductive reactance in the voice coil 1110 may be significantly lower than the inductive reactance in the voice coil when the first conductive element 1318 is not provided in the magnetic circuit assembly 1300 (e.g., the inductive reactance corresponding to the curve b, lower than the inductive reactance corresponding to curve a, at the same alternating current frequency).

[0270] In FIG. 14A is a block diagram illustrating a magnetic circuit assembly 1400 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 1400 may include a first magnetic element 1402, a first magnetic guide element 1404, a second magnetic guide element 1406, a first conductive element 1418, a second conductive element 1420, and a third conductive element 1422. The first magnetic element 1402, the first magnetic guide element 1404, second magnetic guide element 1406, first conductive element 1418, second conductive element 1420 and third conductive element 1422 can be found in FIG. 3F of the present invention. The magnetic gap may be formed between the first magnetic element 1302, the first magnetic guide element 1304, and the second magnetic guide element 1306. The magnetic gap may accommodate a voice coil 1428. The cross-section of the voice coil 1428 may have a circular shape or a non-circular shape. Non-circular shapes may include oval, triangle, quadrilateral, pentagon, other polygons, or other irregular shapes.

[0271] The above description of magnetic circuit assembly 1400 may be a specific example only, and should not be construed as the only feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 1400 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, a first conductive element 1418 may be provided in the vicinity of the voice coil 1428, such as an inner wall, an outer wall, a top surface, and/or a bottom surface of the voice coil 1428.

[0272] In FIG. 14B shows the effect curve of the number of conductive elements in the magnetic circuit assembly 1420 of FIG. 14A on inductive reactance in a voice coil according to some embodiments of the present invention. Curve m corresponds to a node of a magnetic circuit without a conductive element. Curve n corresponds to a magnetic circuit assembly provided with a conductive element (eg, magnetic circuit assembly 1200 shown in FIG. 12A). The l curve corresponds to a magnetic circuit assembly (eg, magnetic circuit assembly 1400 shown in FIG. 14A) in which a plurality of conductive elements may be provided. The abscissa axis represents the frequency of the alternating current in the voice coil, and the ordinate axis represents the inductive reactance in the voice coil. As shown in FIG. 14B, when the AC frequency increases to about 1200 Hz, the inductive reactance in the voice coil may increase as the AC frequency increases. With one or more conductive elements, the inductive reactance in the voice coil can be significantly lower than the inductive reactance in the voice coil when no conductive elements are provided (for example, the inductive reactance corresponding to the n and l curves is lower than the inductive reactance corresponding to the m curve ). When a plurality of conductive elements are provided in the magnetic circuit assembly 1400, the inductive reactance in the voice coil may be significantly lower than the inductive reactance in the voice coil when the conductive element is provided (for example, the inductive reactance corresponding to the l curve is lower than the inductive reactance corresponding to the l curve n).

[0273] In FIG. 15A is a diagram showing a magnetic circuit assembly 1500 according to some embodiments of the present invention. As shown, the magnetic circuit assembly 1500 may include a first magnetic element 1502, a first magnetic guide element 1504, a first annular element 1506, a first annular magnetic element 1508, a second annular magnetic element 1510, a third annular magnetic element 1512, a magnetic shield 1514, and a second a magnetic element 1516. A first magnetic element 1502, a first magnetic guide element 1504, a first annular element 1506, a first annular magnetic element 1508, a second annular magnetic element 1510, a third annular magnetic element 1512, a magnetic shield 1514, and a second magnetic element 1516 can be found in FIG. . 4A, FIG. 4B, FIG. 4C, FIG. 4D, FIG. 4E, FIG. 4F, fig. 4G, fig. 4H and/or FIG. 4M.

[0274] The first magnetic element 1502, the first magnetic guide element 1504, the second magnetic element 1516, the second annular magnetic element 1510 and/or the third annular magnetic element 1512 may define a magnetic gap. The voice coil 1528 may be located in a magnetic gap. The voice coil 1528 may be round or non-round. Non-circular shapes may include oval, triangle, quadrilateral, pentagon, other polygons, or other irregular shapes.

[0275] The above description of the magnetic circuit assembly 1500 may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of the specific means and implementation steps of the magnetic circuit assembly 1500 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, the magnetic circuit assembly 1500 may further include one or more conductive elements that may be provided proximate the voice coil 1528, such as an inner wall, an outer wall, a top surface, and/or a bottom surface of the voice coil 1528. In some embodiments, the conductive element may be coupled to a first magnetic element 1502, a second magnetic element 1516, a first annular magnetic element 1508, a second annular magnetic element 1510, and/or a third annular magnetic element 1512. As another example, the magnetic circuit assembly 1500 may further include a third magnetic guide element, and the third magnetic guide element may be coupled to the second magnetic element 1516.

[0276] In FIG. 15B is a graph showing the relationship curve between voice coil Ampere force and the thickness of one or more magnetic elements in the magnetic circuit assembly 1500 of FIG. 15A according to some embodiments of the present invention. The abscissa axis represents the first thickness ratio, and the ordinate axis represents the normalized Ampere force acting on the voice coil. Normalized Ampere force may refer to the ratio of the actual Ampere force on the voice coil located in the magnetic circuit node 1500 to the maximum Ampere force on the voice coil located in a single magnetic circuit node that includes a single magnetic element (also referred to as a single node magnetic circuit). For example, a single magnetic circuit assembly may include a first magnetic element, a first magnetic guide element, and a second magnetic guide element. The volume of the first magnetic element in a single magnetic circuit node may be equal to the sum of the volumes of the first magnetic element 1502 and the second magnetic element 1516 in the magnetic circuit node 1500. Additional descriptions of the first thickness ratio and the second thickness ratio can be found in FIG. 9B. As shown in FIG. 15B, for any value of the second thickness ratio k, the value on the y-axis exceeds 1, i.e. in the magnetic circuit node 1500, the Amp force on the voice coil 1528 may exceed the Amp force on the voice coil located in a single magnetic circuit node. When the second thickness ratio k remains unchanged, as the first thickness ratio increases, the Ampere force on the voice coil 1528 located in the magnetic circuit assembly 1500 may gradually decrease. When the first thickness ratio remains unchanged, as the second thickness ratio k decreases, the Ampere force on the voice coil 1528 located in the magnetic circuit assembly 1500 can gradually increase. When the range of the first thickness ratio is from 0.1 to 0.3, or the range of the second thickness ratio k is from 0.2 to 0.7, the Ampere force on the voice coil 1528 located in the magnetic circuit node 1500 may be 50% - 60% higher than the Ampere strength of a voice coil located in a single magnetic node of a magnetic circuit.

[0277] In FIG. 16 is a diagram illustrating a bone conduction reproducer 1600 according to some embodiments of the present invention. As shown, the bone conduction speaker 1600 may include a first magnetic element 1602, a first magnetic guide element 1604, a second magnetic guide element 1606, a second magnetic element 1608, a voice coil 1610, a third magnetic guide element 1612, a bracket 1614, and a connector 1616. Additional descriptions of the first magnetic element 1602, the first magnetic guide element 1604, the second magnetic guide element 1606, the second magnetic element 1608, the voice coil 1610 and/or the third magnetic guide element 1612 can be found elsewhere herein (for example, with reference to FIG. 3A -3G, 4A-4M, and 5A-5F).

[0278] The top surface of the first magnetic element 1602 may be coupled to the bottom surface of the first magnetic guide element 1604. The bottom surface of the second magnetic element 1608 may be coupled to the top surface of the first magnetic guide element 1604. The second magnetic guide element 1606 may include a first support slab and first side wall. A lower surface of the first magnetic element 1602 may be coupled to an upper surface of the first support plate. The magnetic gap may be formed between the side wall of the second magnetic guide element 1606, the side wall of the first magnetic element 1602, the first magnetic guide element 1604, and/or the second magnetic element 1608. The bracket 1614 may include a second support plate and a second side wall. The voice coil 1610 may be located in a magnetic gap. Voice coil 1610 may be coupled to the second side wall. A seam may be formed between the voice coil 1610 and the second support plate. After the voice coil 1610 is placed in the magnetic gap, the third magnetic guide element 1612 can extend through the seam to connect with the top surface of the second magnetic element 1608 and the first side wall of the second magnetic guide element 1606, whereby the third magnetic guide element 1612 and the second magnetic guide element 1606 form a closed cavity. The first magnetic element 1602, the first magnetic guide element 1604, the second magnetic guide element 1606, the second magnetic element 1608, the voice coil 1610, and/or the third magnetic guide element 1612 may be connected by one or more connecting means as described elsewhere herein. . In some embodiments, one or more holes (e.g., pin holes) may be provided on the first magnetic element 1602, the first magnetic guide element 1604, the second magnetic guide element 1606, the second magnetic element 1608, the third magnetic guide element 1612, and/or the bracket 1614. , threaded holes, etc.). Openings may be provided at the center, at the periphery, or at other positions on the first magnetic element 1602, the first magnetic guide element 1604, the second magnetic guide element 1606, the second magnetic element 1608, the third magnetic guide element 1612, and/or the bracket 1614. The connector 1616 may connect different elements. For example, connector 1616 may include a nipple. The nipple may pass through various elements (e.g., first magnetic element 1602, first magnetic guide element 1604, second magnetic guide element 1606, second magnetic element 1608, third magnetic guide element 1612 and/or bracket 1614) through the holes and lock the various elements after them. deformation with a punching head through bracket 1614.

[0279] The above description of the bone conduction reproducer 1600 may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the shape and details of specific means and implementation steps of the bone conduction reproducer 1600 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, bone conduction speaker 1600 may include one or more conductive elements provided on an inner side wall, outer wall, top, and/or bottom of voice coil 1610. As another example, bone conduction speaker 1600 may further include one or more annular magnetic elements, wherein the one or more annular magnetic elements may be coupled to the top surface of the second side wall of the second magnetic guide element 1606 or fixed in the magnetic gap.

[0280] In FIG. 17 is a diagram illustrating a bone conduction reproducer 1700 in accordance with some embodiments of the present invention. As shown, the bone conduction speaker 1700 may include a first magnetic element 1702, a first magnetic guide element 1704, a second magnetic guide element 1706, a second magnetic element 1708, a voice coil 1710, a third magnetic guide element 1712, a bracket 1714, a connector 1716, a support connection 1718 and spacer 1720. The top surface of the first magnetic element 1702 may be connected to the bottom surface of the first magnetic guide element 1706. The bottom surface of the second magnetic element 1708 may be connected to the top surface of the first magnetic guide element 1706. The second magnetic guide element 1706 may include itself the first base plate and the first side wall. The first side wall may be formed by expanding the support plate in a direction perpendicular to the first support plate. A lower surface of the first magnetic element 1702 may be coupled to an upper surface of a first support plate of the second magnetic guide element 1706. A magnetic gap may be formed between a first side wall of the second magnetic guide element 1706, a side surface of the first magnetic element 1702, the first magnetic guide element 1704 and/or or a second magnetic element 1708. The support link 1718 may include one or more connecting rods. Voice coil 1710 may be coupled to reference link 1718. Voice coil 1710 may be located in a magnetic gap. The third magnetic guide 1712 may include a second support plate and a second side wall. The second side wall may be formed by expanding the second support plate. The second side wall may be provided with one or more first holes, and the first holes correspond to the connection rods of the support connection 1718. Each of the connection rods of the support connection 1718 may penetrate one of the first holes of the third magnetic guide element 1712. When the voice coil 1710 is located in the magnetic gap , the second side wall of the third magnetic guide element 1712 may be connected to the support link 1718 by the support link connecting rods 1718 passing through the first holes, and the second support plate may be connected to the top surface of the second magnetic element 1708. First magnetic element 1702, first magnetic guide element 1704, second magnetic guide element 1706, second magnetic element 1708, voice coil 1710, and/or third magnetic guide element 1712 may be connected through one or more connecting means, as described elsewhere herein. In some embodiments, the first magnetic element 1702, the first magnetic guide element 1704, the second magnetic guide element 1706, the second magnetic element 1708, the third magnetic guide element 1712, and/or the bracket 1714 may be provided with one or more second holes at the center, at the periphery, or in other positions. Connector 1716 may connect various elements (eg, first magnetic element 1702, first magnetic guide element 1704, second magnetic guide element 1706, second magnetic element 1708, third magnetic guide element 1712, and/or bracket 1714) through the holes. For example, connector 1716 may include a nipple. The nipple may pass through various elements (e.g., first magnetic element 1702, first magnetic guide element 1704, second magnetic guide element 1706, second magnetic element 1708, third magnetic guide element 1712 and/or bracket 1714) through the holes and secure the various elements after them. punch head through the staple 1714. The staple 1914 may be coupled to the support link 1718, and the spacer 1920 may be further coupled to a second side wall of the third magnetic guide 1712 and a first side wall of the second magnetic guide 1706, thereby further securing the second magnetic a guide element 1706; and a third magnetic guide element 1712. In some embodiments, the spacer 1720 may be coupled to the bracket 1714 via a vibration plate.

[0281] The above description of the bone conduction reproducer 1700 may only be a specific example, and should not be construed as the only feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the shape and details of specific means and implementation steps of the bone conduction reproducer 1700 without going beyond the scope of this principle, but these modifications and changes are still are within the scope described above. For example, bone conduction speaker 1700 may include one or more conductive elements provided proximate the inner side wall, outer wall, top, and/or bottom of voice coil 1710. As another example, bone conduction speaker 1700 may further include one or more annular magnetic elements, and the one or more annular magnetic elements may be connected to the upper surface of the first side wall of the second magnetic guide element 1706 or fixed in the magnetic gap.

[0282] In FIG. 18 is a diagram illustrating a bone conduction reproducer 1800 according to some embodiments of the present invention. As shown, the bone conduction speaker 1800 may include a first magnetic element 1802, a first magnetic guide element 1804, a second magnetic guide element 1806, a spacer 1808, a voice coil 1810, a first vibration plate 1812, a bracket 1814, a second vibration plate 1816, and a vibration panel. 1818. A lower surface of the first magnetic element 1802 may be coupled to an interior wall of a second magnetic guide member 1806. An upper surface of the first magnetic member 1802 may be coupled to a top surface of the first magnetic guide member 1804. A magnetic gap may be formed between the first magnetic member 1802, the first a magnetic guide member 1804 and a second magnetic guide member 1806. The voice coil 1810 may be located in the magnetic gap. In some embodiments, voice coil 1810 may have a circular shape or a non-circular shape, such as triangular, rectangular, square, oval, pentagonal, or other irregular shapes. Voice coil 1810 may be coupled to bracket 1814, bracket 1814 may be coupled to first vibration plate 1812, and first vibration plate 1812 may be coupled to second magnetic guide 1806 via spacer 1808. The bottom surface of second vibration plate 1816 may be coupled to the bracket. 1814, and the top surface of the second vibration plate 1816 may be coupled to the vibration plate 1818. In some embodiments, the first magnetic element 1802, the first magnetic guide element 1804, the second magnetic guide element 1806, the spacer 1808, the voice coil 1810, the first vibration plate 1812, bracket 1814, second vibration plate 11016, and/or vibration panel 1818 may be connected through one or more connection means, as described elsewhere herein. For example, the first magnetic element 1802 may be connected to the first magnetic guide element 1804 and/or the second magnetic guide element 1806 by welding. As another example, the first magnetic element 1802, the first magnetic guide element 1804 and/or the second magnetic guide element 1806 may be provided with one or more holes. The pin may pass through various elements (e.g., first magnetic element 1802, first magnetic guide element 1804, second magnetic guide element 1806, and/or bracket 1814) through the holes and secure the various elements after they are deformed by the punch head through bracket 1814. In some embodiments, the first vibration plate 1812 and/or the second vibration plate 1816 may be configured as one or more coaxial annular bodies. Multiple support bars that converge toward the center may be located in each of one or more coaxial annular bodies, and the center of convergence may be consistent with the center of the first vibration plate 1812 and/or the second vibration plate 1816. The multiple support bars may be staggered in the first vibration plate 1812 and/or second vibration plate 1816.

[0283] The above description of the bone conduction reproducer 1800 may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, those skilled in the art, having understood the basic principle of the magnetic circuit assembly, can make various modifications and changes regarding the shape and details of specific means and implementation steps of the bone conduction reproducer 1800 without going beyond this principle, but these modifications and changes are still are within the scope described above. For example, the bone conduction speaker 1800 may include one or more conductive elements, and the one or more conductive elements may be provided proximate an inner side wall, an outer wall, a top portion, and/or a bottom portion of the voice coil 1810. As another example, the bone conduction speaker 1800 The conductivity element may further include one or more annular magnetic elements, and the one or more annular magnetic elements may be connected to an upper surface of the side wall of the second magnetic guide element 1806 or fixed in the magnetic gap. In some embodiments, the bone conduction speaker may further include a second magnetic element and/or a third magnetic guiding element.

[0284] In FIG. 19 is a diagram illustrating a bone conduction reproducer 1900 in accordance with some embodiments of the present invention. As shown, the bone conduction speaker 1900 may include a first magnetic element 1902, a first magnetic guide element 1910, a second magnetic element 1904, a third magnetic element 1906, a second magnetic guide element 1908, a spacer 1914, a voice coil 1912, a first vibration plate 1916, bracket 1918, a second vibration plate 1920, and a vibration panel 1922. A lower surface of the first magnetic element 1902 may be coupled to an inner wall of a second magnetic guide member 1908. An upper surface of the first magnetic member 1902 may be coupled to a lower surface of the first magnetic guide member 1910. Outer wall the second magnetic element 1904 may be coupled to the inner side wall of the second magnetic guide element 1908. The third magnetic element 1906 may be below the second magnetic element 1904, and at the same time, the outer wall of the third magnetic element 1906 may be connected to the inner side wall of the second magnetic guide element 1908; the inner side wall of the third magnetic element 1906 may be connected to the outer wall of the first magnetic element 1902; the bottom surface of the third magnetic element 1906 may be connected to the inner wall of the second magnetic guide element 1908; a magnetic gap may be formed between the first magnetic element 1902, the first magnetic guide element 1910, the second magnetic element 1904, and the third magnetic element 1906. The voice coil 1912 may be located in the magnetic gap. In some embodiments, voice coil 1912 may be in the form of a track, as shown in FIG. 19, or in other geometric shapes, such as triangular, rectangular, square, oval, pentagonal or other irregular shapes. Voice coil 1912 may be coupled to bracket 1918, bracket 1918 may be coupled to first vibration plate 1916, and first vibration plate 1916 may be coupled to second magnetic guide 1908 via spacer 1914. The bottom surface of second vibration plate 1920 may be coupled to the bracket. 1918, and the top surface of the second vibration plate 1920 may be coupled to the vibration panel 1922. In some embodiments, the second magnetic element 1904 may be composed of multiple magnetic elements, for example, as shown in FIG. 19 including 4 magnetic elements 19041, 19041, 19043 and 19044. The shape surrounded by multiple magnetic elements may be a track shape, as shown in FIG. 19, or another geometric shape, for example, triangular, rectangular, square, oval, pentagonal or other irregular shape. The third magnetic element 1906 may be composed of multiple magnetic elements, for example, as shown in FIG. 19 including 4 magnetic elements 19061, 19061, 19063 and 19064. The shape surrounded by multiple magnetic elements may be a track shape, as shown in FIG. 19, or another geometric shape, for example, triangular, rectangular, square, oval, pentagonal or other irregular shape. As described in other embodiments of the present invention, at least one of the second magnetic element 1904 and the third magnetic element 1906 may be replaced by multiple magnetic elements with different magnetization directions. A plurality of magnetic elements with different magnetization directions can increase the magnetic field strength in the magnetic gap in the bone conduction speaker 1900, which increases the sensitivity of the bone conduction speaker 1900.

[0285] In some embodiments, first magnetic element 1902, first magnetic guide element 1910, second magnetic element 1904, third magnetic element 1906, second magnetic guide element 1908, spacer 1914, voice coil 1912, first vibrating plate 1916, bracket 1918, second vibration plate 1920 and/or vibration panel 1922 may be connected through any one or more connection means as described elsewhere herein. For example, the first magnetic element 1902, the second magnetic element 1904, and the third magnetic element 1906 may be connected to the first magnetic guide element 1910 and/or the second magnetic guide element 1908 by bonding. As another example, spacer 1914 may be coupled to second magnetic guide member 1908 by a staple, and spacer 1914 may further be coupled to second magnetic guide member 1908 and/or second magnetic guide member 1904 by staple and adhesive. In some embodiments, the first vibration plate 1916 and/or the second vibration plate 1920 may be configured as one or more coaxial annular bodies. Multiple support bars that may converge toward a center may be provided in a plurality of rings, and the center of convergence may be consistent with the center of the first vibration plate 1916 and/or the second vibration plate 1920. The multiple support bars may be staggered within the first vibration plate 1916 and/or or a second vibrating plate 1920. The multiple support rods may be straight rods or curved rods, or a portion of the straight rods are partially curved rods. Preferably, the multiple support rods may be curved rods. In some embodiments, the outer surface of the vibration panel 1922 may be a flat surface or a curved surface. For example, the outer surface of the vibration panel 1922 may be a curved surface, that is, convex, as shown in FIG. 19.

[0286] The above description of the bone conduction reproducer 1900 may only be a specific example, and is to be considered only as a feasible implementation solution. Obviously, those skilled in the art, having understood the basic principles of the magnetic circuit assembly, can make various modifications and changes regarding the form and details of specific means and implementation steps of the bone conduction reproducer 1900 without going beyond this principle, but these modifications and changes are still pending to the extent described above. For example, the bone conduction speaker 1900 may include one or more conductive elements provided on an inner side wall, an outer wall, a top portion, and/or a bottom portion of the voice coil 1912. As another example, the bone conduction speaker 1900 may further include one or more annular magnetic elements, wherein the one or more annular magnetic elements may connect a lower surface of a second magnetic element 1904 and an upper surface of a third magnetic element 1906. In some embodiments, the bone conduction speaker may further include a fifth magnetic element and/or a third magnetic element a guide member as described in other embodiments of the present invention.

[0287] The basic principles have been described above. Those skilled in the art will appreciate that the disclosure is provided by way of example only and is not intended to limit the present invention. Although not expressly stated herein, various modifications, improvements, and adjustments may be made by those skilled in the art to the present invention. These changes, improvements and modifications are intended to be included in this invention and are within the spirit and scope of the illustrative embodiments of this invention.

[0288] In addition, certain terminology has been used to describe embodiments of the present invention. For example, the terms “one embodiment,” “an embodiment,” and/or “certain embodiments” mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention. Thus, it is emphasized and understood that two or more references to “embodiment” or “one embodiment” or “alternative embodiment” in different parts of this specification do not necessarily all refer to the same embodiment. In addition, certain features, structures or features of one or more embodiments of the present invention can be suitably combined.

[0289] In addition, those skilled in the art will appreciate that various aspects of the present invention may be illustrated and described by means of several patentable categories or situations, including any new and useful processes, machines, products or combinations of materials or any new and useful their improvements. Accordingly, all aspects of the present invention may be implemented entirely in hardware, entirely in software (including firmware, resident programs, microcode, etc.), or may be implemented in a combination of hardware and software. The above-mentioned hardware or software may be referred to as a “unit”, “module”, “machine”, “unit”, “component” or “system”. In addition, aspects of the present invention may be a computer product located on one or more computer-readable media and including computer-readable program code.

[0290] In addition, the specified order of elements or processing sequences or the use of numbers, letters or other designations is not intended to limit the claimed processes and methods to any order other than that which may be indicated in the claims. Although the foregoing disclosure has discussed various examples that are currently considered to be useful embodiments of the invention, it is to be understood that such details are solely for this purpose, and that the following claims are not limited to the embodiments disclosed, but are instead intended to cover modifications and equivalent configurations that are within the spirit and scope of the disclosed embodiments. For example, while the implementation of the various components described above may be in a hardware device, it may also be implemented only in software, such as installed on an existing server or mobile device.

[0291] Likewise, it is apparent that in the foregoing description of embodiments of the present invention, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of simplifying the disclosure, thereby facilitating understanding of one or more of the various embodiments. However, this invention does not mean that the object of the present invention requires more features than those mentioned in the claims. On the contrary, the claimed subject matter of the invention may not include all features of a single embodiment disclosed above.

[0292] In some embodiments, numbers expressing amounts of ingredients, properties, etc. used to describe and communicate certain embodiments of the invention should be considered to be modified in some cases by the term "about", "approximately" or "substantially" and etc. Unless otherwise noted, “about,” “approximately,” or “substantially” may indicate a ±20% change in the reported value. Accordingly, in some embodiments, the numerical parameters set forth in the description and the following claims are approximate values that may vary depending on the properties that are desired to be obtained according to a particular embodiment. In some embodiments, the numeric data must respect specified significant digits and use an algorithm reserved for common digits. Although the numerical ranges and parameters intended to illustrate the broad scope of some embodiments of the present invention are approximate values, the numerical values in specific examples may be as accurate as possible for practical use.

In one aspect of the present invention, there is provided a bone conduction repeater magnetic circuit assembly, wherein the magnetic circuit assembly generates a first magnetic field, and the magnetic circuit assembly includes:

a first magnetic element generating a second magnetic field;

a first magnetic guide element; And

at least one second magnetic element configured to surround the first magnetic element, wherein a magnetic gap is provided between said at least one second magnetic element and the first magnetic element, wherein the strength of the first magnetic field in the magnetic gap exceeds the strength of the second magnetic field in the magnetic gap .

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

a second magnetic guide element; And

at least one third magnetic element connected to the second magnetic guide element and said at least one second magnetic element.

According to one embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element located below the magnetic gap, said at least one fourth magnetic element being connected to the first magnetic element and the second magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element does not exceed 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element connected to an upper surface of the first magnetic guide element.

According to one embodiment, the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to another embodiment, the ratio of the thickness of the first magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one fifth magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of the at least one fifth magnetic element is equal to the thickness of the first magnetic element.

According to another embodiment, the thickness of the at least one fifth magnetic element is less than the thickness of the first magnetic element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a third magnetic guide element connected to an upper surface of the fifth magnetic element, wherein the third magnetic guide element is configured to suppress leakage of the first magnetic field strength.

According to another embodiment, the first magnetic guide element is connected to the top surface of the first magnetic element, the second magnetic guide element includes a support plate and a side wall, and the first magnetic element is connected to the support plate of the second magnetic guide element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one conductive element coupled to at least one of a first magnetic element, a first magnetic guide element, or a second magnetic guide element.

In a second aspect of the present invention, there is provided a bone conduction repeater magnetic circuit assembly, wherein the magnetic circuit assembly generates a first magnetic field, wherein the magnetic circuit assembly includes:

a first magnetic element generating a second magnetic field;

a first magnetic guide member;

a second magnetic guide element configured to surround the first magnetic element, and a magnetic gap is provided between the at least one second magnetic element and the first magnetic element; And

at least one second magnetic element located below the magnetic gap, wherein the strength of the first magnetic field in the magnetic gap exceeds the strength of the second magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element does not exceed 90 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one third magnetic element connected to the second magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element located between the second magnetic guide element and the at least one third magnetic element.

According to one embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a magnetic shield configured to enclose the first magnetic element, the first magnetic guide element, the second magnetic guide element and the second magnetic element.

According to one embodiment, the second magnetic guide element is connected to the at least one second magnetic element, and the connecting surface between the second magnetic guide element and the at least one second magnetic element includes a wedge-shaped cross-section.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element connected to an upper surface of the first magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to another embodiment, the ratio of the thickness of the at least one fifth magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one fifth magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of the fifth magnetic element is equal to the thickness of the first magnetic element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one conductive element connected to at least one of the first magnetic element, the first magnetic guide element or the second magnetic element.

In a third aspect of the present invention, there is provided a magnetic circuit assembly of a bone conduction repeater, wherein the magnetic circuit assembly generates a first magnetic field, and the magnetic circuit assembly includes:

a first magnetic element generating a second magnetic field;

a first magnetic guide element;

a second magnetic guide element, wherein at least a portion of the second magnetic guide element is configured to surround the first magnetic element, and a magnetic gap is provided between the second magnetic guide element and the first magnetic element; And

at least one second magnetic element connected to the upper surface of the first magnetic guide element, wherein the strength of the first magnetic field in the magnetic gap is greater than the strength of the second magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to another embodiment, the ratio of the thickness of the first magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one second magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of the at least one second magnetic element is equal to the thickness of the first magnetic element.

According to another embodiment, the thickness of the at least one second magnetic element is less than the thickness of the first magnetic element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one third magnetic element configured to surround said at least one second magnetic element.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element, wherein said at least one fourth magnetic element is connected to a second magnetic guide element and said at least one third magnetic element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element located below the magnetic gap, said at least one fifth magnetic element being connected to the first magnetic element and the second magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of said at least one fifth magnetic element and the magnetization direction of the first magnetic element does not exceed 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a third magnetic guide element connected to the at least one second magnetic element.

In a fourth aspect of the present invention, there is provided a bone conduction repeater magnetic circuit assembly comprising:

a first magnetic element generating a first magnetic field;

a first magnetic guide element; And

at least one second magnetic element configured to surround the first magnetic element, wherein a magnetic gap is provided between said at least one second magnetic element and the first magnetic element, wherein said at least one second magnetic element generates a second magnetic field increasing the strength the first magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a second magnetic guide element; And

at least one third magnetic element connected to the second magnetic guide element and the at least one second magnetic element, wherein the at least one third magnetic element generates a third magnetic field increasing the strength of the first magnetic field in the magnetic gap.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element located below the magnetic gap, wherein said at least one fourth magnetic element is connected to the first magnetic element and the second magnetic guide element, wherein said at least one fourth magnetic element generates a fourth magnetic field increasing the strength of the first magnetic field in the magnetic gap.

According to another embodiment, the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element are in the range of 45 degrees to 135 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element connected to an upper surface of the first magnetic guide element, said at least one fifth magnetic element generating a fifth magnetic field increasing the strength of the first magnetic field in the magnetic gap.

According to another embodiment, the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to another embodiment, the ratio of the thickness of the first magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one fifth magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of the at least one fifth magnetic element is equal to the thickness of the first magnetic element.

According to another embodiment, the thickness of the at least one fifth magnetic element is less than the thickness of the first magnetic element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a third magnetic guide element connected to an upper surface of the fifth magnetic element, wherein the third magnetic guide element is configured to suppress leakage of the strength of the first magnetic field and the second magnetic field.

According to another embodiment, the first magnetic guide element is connected to the top surface of the first magnetic element, the second magnetic guide element includes a support plate and a side wall, and the first magnetic element is connected to the support plate of the second magnetic guide element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one conductive element coupled to at least one of a first magnetic element, a first magnetic guide element, or a second magnetic guide element.

In a fifth aspect of the present invention, there is provided a bone conduction repeater magnetic circuit assembly comprising:

a first magnetic element generating a first magnetic field;

a first magnetic guide member;

a second magnetic guide element configured to surround the first magnetic element, and a magnetic gap is provided between the at least one second magnetic element and the first magnetic element; And

at least one second magnetic element located below the magnetic gap, wherein said at least one second magnetic element generates a second magnetic field that increases the strength of the first magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one third magnetic element coupled to the second magnetic guide element, said at least one third magnetic element generating a third magnetic field increasing the strength of the first magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element located between the second magnetic guide element and the at least one third magnetic element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

a magnetic shield configured to enclose the first magnetic element, the first magnetic guide element, the second magnetic guide element and the second magnetic element.

According to another embodiment, the second magnetic guide element is connected to the at least one second magnetic element, and the connecting surface between the second magnetic guide element and the at least one second magnetic element includes a wedge-shaped cross-section.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element connected to an upper surface of the first magnetic guide element, said at least one fifth magnetic element generating a fifth magnetic field increasing the strength of the first magnetic field in the magnetic gap.

According to yet another embodiment, the magnetic circuit assembly further comprises:

the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to another embodiment, the ratio of the thickness of the at least one fifth magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one fifth magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of the fifth magnetic element is less than or equal to the thickness of the first magnetic element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a third magnetic guide element connected to an upper surface of the fifth magnetic element, wherein the third magnetic guide element is configured to suppress leakage of the strength of the first magnetic field and the second magnetic field.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one conductive element connected to at least one of the first magnetic element, the first magnetic guide element or the second magnetic element.

In a sixth aspect of the present invention, there is provided a bone conduction repeater magnetic circuit assembly comprising:

a first magnetic element generating a first magnetic field;

a first magnetic guide element;

a second magnetic guide element, wherein at least a portion of the second magnetic guide element is configured to surround the first magnetic element, and a magnetic gap is provided between the at least one second magnetic element and the first magnetic element; And

at least one second magnetic element coupled to an upper surface of the first magnetic guide element, said at least one second magnetic element generating a second magnetic field increasing the strength of the first magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to one embodiment, the ratio of the thickness of the first magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one second magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of the at least one second magnetic element is equal to the thickness of the first magnetic element.

According to another embodiment, the thickness of the at least one second magnetic element is less than the thickness of the first magnetic element.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one third magnetic element configured to surround said at least one second magnetic element.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element, wherein said at least one fourth magnetic element is connected to a second magnetic guide element and said at least one third magnetic element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element located below the magnetic gap, said at least one fifth magnetic element being connected to the first magnetic element and the second magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees.

According to another embodiment, the internal angle between the magnetization direction of said at least one fifth magnetic element and the magnetization direction of the first magnetic element does not exceed 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a third magnetic guide element connected to the at least one second magnetic element.

In a seventh aspect of the present invention, there is provided a bone conduction repeater magnetic circuit assembly, wherein the magnetic circuit assembly generates a first magnetic field, wherein the magnetic circuit assembly includes:

a first magnetic element generating a second magnetic field;

a first magnetic guide member;

a second magnetic guide member including a support plate and a side wall, the support plate of the second magnetic guide member being connected to the first magnetic member;

at least one second magnetic element connected to the side wall of the second magnetic guide element, and a magnetic gap is provided between the at least one second magnetic element and the first magnetic element; And

at least one third magnetic element connected to the support plate and the side wall of the second magnetic guide element, wherein the strength of the first magnetic field in the magnetic gap exceeds the strength of the second magnetic field in the magnetic gap.

According to one embodiment, the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to another embodiment, the internal angle between the magnetization direction of the at least one third magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to one embodiment, the magnetic circuit assembly further comprises:

at least one fourth magnetic element connected to the top surface of the at least one second magnetic element and the side wall of the second magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is at least 90 degrees.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one fifth magnetic element connected to an upper surface of the first magnetic guide element.

According to another embodiment, the internal angle between the magnetization direction of the at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees.

According to another embodiment, the ratio of the thickness of the first magnetic element to the sum of the thickness of the first magnetic element, the thickness of the at least one fifth magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0.6.

According to another embodiment, the thickness of said at least one fifth magnetic element is less than or equal to the thickness of the first magnetic element.

According to yet another embodiment, the magnetic circuit assembly further comprises:

a third magnetic guide element connected to an upper surface of the fifth magnetic element, wherein the third magnetic guide element is configured to suppress leakage of the first magnetic field strength.

According to yet another embodiment, the magnetic circuit assembly further comprises:

at least one conductive element coupled to at least one of a first magnetic element, a first magnetic guide element, or a second magnetic guide element.

In the eighth aspect of the present invention, there is provided a bone conduction reproducer comprising:

a vibration assembly including a voice coil and at least one vibration plate;

magnetic circuit assembly, including:

a first magnetic element generating a first magnetic field;

a first magnetic guide element; And

at least one second magnetic element configured to surround the first magnetic element, wherein a magnetic gap is provided between said at least one second magnetic element and the first magnetic element, wherein the voice coil is located in the magnetic gap, said at least one second magnetic element generates a second magnetic field, the first magnetic field and the second magnetic field increasing the strength of the first magnetic field at the voice coil.

According to yet another embodiment, the voice coil shape includes an ellipse or a rectangle.

According to yet another embodiment, the magnetic circuit assembly includes:

a second magnetic guide element connected to the second magnetic element.

[0293] Finally, it should be understood that the embodiments described in this application merely illustrate the principles of the embodiments of the present invention. Other modifications that may be used may be within the scope of the invention. Thus, by way of example and not limitation, alternative configurations of embodiments of the application may be used in accordance with the principles set forth herein. Accordingly, embodiments of the present invention are not limited to those shown and described herein.

Claims (21)

1. A bone conduction repeater magnetic circuit assembly, wherein the magnetic circuit assembly generates a first magnetic field, and the magnetic circuit assembly includes: a first magnetic element generating a second magnetic field; a first magnetic guide element; a second magnetic guide element configured to surround the first magnetic element, and a magnetic gap is provided between said second magnetic guide element and the first magnetic element; And at least one second magnetic element located below the magnetic gap, wherein the strength of the first magnetic field in the magnetic gap exceeds the strength of the second magnetic field in the magnetic gap, wherein the internal angle between the magnetization direction of the at least one second magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees or in the range of 45 degrees to 90 degrees. 2. Magnetic circuit assembly according to claim 1, additionally containing: at least one third magnetic element connected to the second magnetic guide element. 3. The magnetic circuit assembly according to claim 2, wherein the internal angle between the magnetization direction of said at least one third magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees or in the range of 90 degrees to 135 degrees. 4. Magnetic circuit assembly according to claim 2, additionally containing: at least one fourth magnetic element located between the second magnetic guide element and the at least one third magnetic element, wherein the internal angle between the magnetization direction of the at least one fourth magnetic element and the magnetization direction of the first magnetic element is in the range of 45 degrees to 135 degrees or in the range of 90 degrees to 135 degrees. 5. Magnetic circuit assembly according to any one of paragraphs. 1-3, additionally containing: a magnetic shield configured to enclose a first magnetic element, a first magnetic guide element, a second magnetic guide element and a second magnetic element. 6. The magnetic circuit assembly according to claim 1, wherein the second magnetic guide element is connected to the at least one second magnetic element, and the connection surface between the second magnetic guide element and the at least one second magnetic element has a wedge-shaped cross-section. 7. Magnetic circuit assembly according to claim 1, additionally containing: at least one fifth magnetic element connected to the upper surface of the first magnetic guide element, wherein the internal angle between the magnetization direction of said at least one fifth magnetic element and the magnetization direction of the first magnetic element is in the range of 150 degrees to 180 degrees. 8. The magnetic circuit assembly according to claim 7, wherein the ratio of the thickness of said at least one fifth magnetic element to the sum of the thickness of the first magnetic element, the thickness of said at least one fifth magnetic element and the thickness of the first magnetic guide element is from 0.4 to 0 ,6, or the thickness of the fifth magnetic element is equal to the thickness of the first magnetic element. 9. Magnetic circuit assembly according to claim 1, additionally containing: at least one conductive element connected to at least one of the first magnetic element, the first magnetic guide element or the second magnetic element.