CN114982253A - Acoustic device and magnetic circuit assembly thereof - Google Patents

Abstract

An embodiment of the present specification discloses an acoustic device, including: a housing having an accommodating chamber; the speaker set up in the holding intracavity, the speaker includes: the voice coil is arranged on the magnetic circuit component; the magnetic circuit component forms a magnetic gap; one end of the voice coil is arranged in the magnetic gap, the other end of the voice coil is connected with the vibration assembly, the vibration assembly is connected with the vibration transmission plate, and the vibration transmission plate is connected with the shell.

Description

Acoustic device and magnetic circuit assembly thereof

Cross-referencing

The priority claims of both the chinese application 202010358223.0 filed on 29/04 in 2020 and the chinese application 202021689802.5 filed on 12/08 in 2020, are hereby incorporated by reference in their entirety.

Technical Field

The application relates to the technical field of acoustics, in particular to a bone conduction acoustic device.

Background

Bone conduction is a way of sound conduction, i.e. converting sound into mechanical vibrations of different frequencies, which are transmitted through human bones and tissues (e.g. skull, bone labyrinth, inner ear lymph, spiral organ, auditory nerve, auditory center). The bone conduction acoustic device (such as a bone conduction earphone) is tightly attached to a bone, the bone conduction technology is utilized for receiving the bone, the sound waves can be directly transmitted to the auditory nerve through the bone, so that the ears can be opened, the eardrum is not damaged, and the bone conduction acoustic device can be widely applied to bone conduction technologies of different scenes, such as a hearing aid. Because the sound quality of the bone conduction acoustic device directly affects the hearing experience of the user, it is very important for the bone conduction acoustic device to improve the sound quality.

Disclosure of Invention

The present application relates to an acoustic device. The acoustic device includes: a housing having an accommodating chamber; the speaker set up in the holding intracavity, the speaker includes: the voice coil is arranged on the magnetic circuit component; the magnetic circuit component forms a magnetic gap; one end of the voice coil is arranged in the magnetic gap, the other end of the voice coil is connected with the vibration assembly, the vibration assembly is connected with the vibration transmission plate, and the vibration transmission plate is connected with the shell.

In some embodiments, the vibration assembly includes an inner support, an outer support, and a vibration plate; the other end of the voice coil is connected with the inner support; one end of the outer bracket is physically connected with two sides of the magnetic circuit component; the vibrating reed is physically connected with the inner support and the outer support and used for limiting the relative movement of the inner support and the outer support in a first direction; the first direction is the radial direction of the accommodating cavity; at least one of the inner holder, the outer holder and the vibration plate is connected to the vibration transmission plate so that vibration is transmitted to the vibration transmission plate.

In some embodiments, the outer support and the inner support are movably connected to the vibrating reed to limit relative movement of the outer support and the inner support along the first direction, and to allow the inner support and the vibrating reed to move relative to the outer support in a second direction; the second direction is an extending direction of the inner stent and the outer stent.

In some embodiments, the other end of the external bracket is provided with a first protrusion, the vibrating plate is provided with a first through hole, and the first protrusion is movably connected with the vibrating plate through the first through hole.

In some embodiments, one end of the inner bracket is provided with a second protrusion, the vibrating plate is provided with a second through hole, and the second protrusion is movably connected with the vibrating plate through the second through hole.

In some embodiments, the speaker further includes an elastic damping sheet disposed between the vibration sheet and one end of the inner bracket to damp vibration of the inner bracket in the second direction.

In some embodiments, the second post comprises a first column section and a second column section physically connected, the second column section disposed above the first column section; the first column section penetrates through the second through hole, and the second column section is inserted into the vibration transmission plate; the elastic damping piece is provided with a third through hole, and the elastic damping piece is sleeved on the second column section through the third through hole and supported on the first column section.

In some embodiments, a shield element is also included; the protective element comprises a fitting part, an accommodating part and a supporting part, and the fitting part and the accommodating part form a second accommodating cavity; the vibration transmission plate is arranged in the second accommodating cavity, the attaching portion is attached to the outer end face of the vibration transmission plate, and the supporting portion is connected to the second accommodating cavity and arranged above the shell.

In some embodiments, the inner wall of the housing is provided with an annular bearing platform for supporting the annular support portion and the elastic damping sheet.

In some embodiments, the magnetic circuit assembly comprises a set of magnetic elements and a magnetically permeable cover; the magnetic conduction cover comprises a cover body bottom, a cover body side part and a cylindrical groove, and the cylindrical groove is formed by the cover body bottom and the cover body side part; the magnetic element group is arranged in the cylinder groove and forms the magnetic gap with the magnetic conduction cover.

In some embodiments, the magnetic shield further comprises a fixing piece, wherein the fixing piece is used for fixing the magnetic element group to the bottom of the shield body; the fixing piece comprises a bolt and a nut, the bolt penetrates through the magnetic element group in sequence and then penetrates out of the bottom of the cover body, and the magnetic element group and the bottom of the cover body are fixedly connected through threaded connection.

In some embodiments, the inner support forms a cover slot into which the set of magnetic elements partially extends, and the outer support is cylindrically shaped.

In some embodiments, the magnetic circuit assembly comprises a first magnetic circuit assembly and a second magnetic circuit assembly surrounding the first magnetic circuit assembly to form the magnetic gap; the first magnetic circuit assembly includes a first magnetic element and a second magnetic element, and a total magnetic field generated by the magnetic circuit assembly has a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the first magnetic element or the second magnetic element within the magnetic gap.

In some embodiments, the angle between the magnetization directions of the first magnetic element and the second magnetic element is 150-180 degrees.

In some embodiments, the magnetization directions of the first and second magnetic elements are opposite.

In some embodiments, the magnetization directions of the first and second magnetic elements are perpendicular or parallel to the vibration direction of the voice coil in the magnetic gap.

In some embodiments, the second magnetic circuit assembly comprises a third magnetic element, the first magnetic circuit assembly comprises a first magnetically permeable element; the first magnetic conductive element is disposed between the first magnetic element and the second magnetic element, and the third magnetic element is disposed at least partially around the first magnetic element and the second magnetic element.

In some embodiments, the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface of the first magnetic element connected to the first magnetic conductive element, and the magnetization direction of the first magnetic element is opposite to the magnetization direction of the second magnetic element.

In some embodiments, the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element is 60-120 degrees.

In some embodiments, the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element is 0-30 degrees.

In some embodiments, the second magnetic assembly comprises a first magnetic conductive element and the first magnetic assembly comprises a second magnetic conductive element; the second magnetic conductive element is arranged between the first magnetic element and the second magnetic element; the first magnetic conductive element is disposed at least partially around the first magnetic element and the second magnetic element.

In some embodiments, the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface where the first magnetic element and the second magnetic conductive element are connected, and the magnetization direction of the first magnetic element is opposite to the magnetization direction of the second magnetic element.

In some embodiments, the second magnetic conductive element is disposed around the first magnetic element, the first magnetic element surrounding between the second magnetic elements.

In some embodiments, the upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element.

In some embodiments, the magnetic circuit assembly comprises a first magnetic circuit assembly and a second magnetic circuit assembly surrounding the first magnetic circuit assembly to form the magnetic gap; the first magnetic circuit assembly comprises a first magnetic element and the second magnetic circuit assembly comprises a first magnetically permeable element; the first magnetic conductive element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element is directed to the outer region of the first magnetic element from the central region of the first magnetic element or to the first magnetic element from the outer region of the first magnetic element.

In some embodiments, the magnetic circuit assembly comprises a first magnetic circuit assembly and a second magnetic circuit assembly surrounding the first magnetic circuit assembly to form the magnetic gap; the first magnetic circuit assembly comprises a first magnetic element and the second magnetic circuit assembly comprises a second magnetic element; the second magnetic element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element is directed to the outer region of the first magnetic element from the central region of the first magnetic element or to the first magnetic element from the outer region of the first magnetic element.

In some embodiments, the magnetization direction of the second magnetic element is directed from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the inner ring of the second magnetic element.

Additional features of the present application will be set forth in part in the description which follows. Additional features of some aspects of the present application will be apparent to those of ordinary skill in the art in view of the following description and associated drawings, or in view of the understanding of the production or operation of the embodiments. The features disclosed in this application may be realized and attained by practice or use of various methods, instrumentalities and combinations of the specific embodiments described below.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. Like reference symbols in the various drawings indicate like elements.

FIG. 1 is a block diagram of the structure of an exemplary acoustic device according to some embodiments of the present application;

FIG. 2 is a schematic structural diagram of an exemplary acoustic device according to some embodiments of the present application;

FIG. 3A is a schematic illustration of a disassembled structure of the acoustic device of FIG. 2 according to some embodiments of the present application;

FIG. 3B is a schematic cross-sectional structural view of the acoustic device of FIG. 3A, according to some embodiments of the present application;

fig. 3C is a schematic structural view of a diaphragm of the acoustic device of fig. 3A according to some embodiments of the present application;

fig. 4 is a schematic longitudinal cross-sectional view of a bone conduction acoustic device according to some embodiments of the present application;

FIG. 5 is a schematic illustration in longitudinal section of an air-conducting acoustic device according to some embodiments of the present application;

figure 6 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 7 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 6 according to the present application;

figure 8 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 9 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 8 according to the present application;

figure 10 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 11 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 10 according to the present application;

figure 12 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 13 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 12 according to the present application;

fig. 14 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 15 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly of fig. 14 according to the present application;

figure 16 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 17 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly of fig. 16 according to the present application;

figure 18 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 19 is a schematic view of the variation of magnetic field strength of a magnetic circuit assembly shown in fig. 18 according to the present application;

figure 20 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 21 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 20 according to the present application;

figure 22 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 23 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 22 according to the present application;

figure 24 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 25 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly of fig. 24 according to the present application;

fig. 26 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 27 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly of fig. 26 according to the present application;

figure 28 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 29 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 28 according to the present application;

figure 30 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 31 is a schematic view of the variation of magnetic field strength of a magnetic circuit assembly shown in fig. 38 according to the present application;

fig. 32 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 33 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 32 according to the present application;

figure 34 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 35 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 34 according to the present application;

figure 36 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 37 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 36 according to the present application;

figure 38 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 39 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 38 according to the present application;

figure 40 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 41 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 40 according to the present application;

fig. 42 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 43 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 42 according to the present application;

fig. 44 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 45 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 44 according to the present application;

figure 46 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 47 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 46 according to the present application;

fig. 48 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application;

fig. 49 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 48 according to the present application;

figure 50 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 51 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 50 according to the present application;

figure 52 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 53 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 52 according to the present application;

figure 54 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 55 is a schematic view of the variation in magnetic field strength of the magnetic circuit assembly shown in fig. 54 according to the present application;

figure 56 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application;

fig. 57 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 56 according to the present application;

FIG. 58 is a cross-sectional schematic view of a magnetic element configuration according to some embodiments of the present application;

FIG. 59 is a cross-sectional schematic view of a magnetic element structure according to some embodiments of the present application;

FIG. 60 is a schematic diagram of a magnetic element structure according to some embodiments of the present application;

fig. 61 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application

Fig. 62 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application;

figure 63 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application;

fig. 64 is a graph comparing frequency response curves of a speaker according to the present application using the magnetic circuit assemblies shown in fig. 63 and 56, respectively.

Detailed Description

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below. It is obvious that the drawings in the following description are only examples or embodiments of the application, and that for a person skilled in the art the application can also be applied to other similar contexts on the basis of these drawings without inventive effort. It is understood that these exemplary embodiments are given solely to enable those skilled in the relevant art to better understand and implement the present invention, and are not intended to limit the scope of the invention in any way. Unless otherwise apparent from the context, or otherwise indicated, like reference numbers in the figures refer to the same structure or operation.

As used in this application and in the claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are inclusive in the plural, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" are intended to cover only the explicitly identified steps or elements as not constituting an exclusive list and that the method or apparatus may comprise further steps or elements. The term "based on" is "based, at least in part, on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment". Relevant definitions for other terms will be given in the following description.

Hereinafter, without loss of generality, in describing the bone conduction related art in the present invention, a description of "bone conduction speaker" or "bone conduction headset" will be employed. The description is merely one form of bone conduction application and it will be apparent to one of ordinary skill in the art that the "speaker" or "earpiece" may be replaced by other words of the same kind, such as "player", "hearing aid", etc. Indeed, various implementations of the invention may be readily applied to other non-speaker-type hearing devices. For example, it will be apparent to those skilled in the art that, having the benefit of the basic principles of a bone conduction speaker, various modifications and changes in form and detail may be made to the specific manner and procedure of implementing a bone conduction speaker, and in particular, the incorporation of ambient sound pickup and processing functionality into a bone conduction speaker to enable the speaker to function as a hearing aid, without departing from such principles. For example, a microphone, such as a microphone, may pick up sounds from the user/wearer's surroundings and, under certain algorithms, transmit the sound processed (or resulting electrical signal) to a bone conduction speaker portion. That is, the bone conduction speaker may be modified to a certain extent to add a function of picking up ambient sound, and after a certain signal processing, the bone conduction speaker part transmits the sound to the user/wearer, thereby realizing the function of the bone conduction hearing aid. By way of example, the algorithms described herein may include one or more combinations of noise cancellation, automatic gain control, acoustic feedback suppression, wide dynamic range compression, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, and the like.

In some embodiments, the acoustic device may be a device having acoustic output capabilities. Such as hearing aids, listening bracelets, earphones, speakers, smart glasses, and the like. Wherein, the hearing aid is a small-sized loudspeaker, which enlarges the originally inaudible sound and utilizes the residual hearing of the hearing-impaired person to transmit the sound to the auditory center of the brain. In some embodiments, the hearing aid employs ear canal sound transmission, however, when the low frequency of the hearing impaired person is poor or the overall hearing loss is heavy, the ear canal sound transmission has a limited improvement in the hearing effect of the hearing impaired person.

In some embodiments, the acoustic device may comprise a bone conduction headset. The bone conduction earphone can convert audio frequency into mechanical vibration with different frequencies, human bones are used as media for transmitting the mechanical vibration, and the mechanical vibration is transmitted to auditory nerves. In this way, it is possible to enable the user to receive sound without passing through the external auditory meatus and eardrum of the ear.

FIG. 1 is a block diagram of the structure of an exemplary acoustic device shown in accordance with some embodiments of the present application. As shown in fig. 1, an acoustic device 100 (e.g., a bone conduction speaker, bone conduction earpiece, etc.) may include a magnetic circuit component 102, a vibration component 104, a support component 106, and a storage component 108.

The magnetic circuit assembly 102 may provide a magnetic field. The magnetic field may be used to convert a signal containing acoustic information into a vibration signal. In some embodiments, the sound information may include video having a particular data format, an audio file, or data or files that may be converted to sound by a particular means. The signal containing the acoustic information may come from the memory component 108 of the acoustic device 100 itself, or may come from an information generating, storing, or transmitting system other than the acoustic device 100. The signal containing acoustic information may include a combination of one or more of an electrical signal, an optical signal, a magnetic signal, a mechanical signal, and the like. The signal containing the sound information may be from one signal source or multiple signal sources. The multiple signal sources may or may not be correlated. In some embodiments, the acoustic device 100 acquires the signal containing the sound information in a number of different ways, the acquisition of the signal may be wired or wireless, and may be real-time or delayed. For example, the acoustic device 100 may receive an electrical signal containing sound information in a wired or wireless manner, or may directly obtain data from a storage medium (e.g., the storage component 108) to generate a sound signal. For another example, a bone conduction hearing aid may include a component having a sound collection function, which picks up sound in the environment, converts mechanical vibration of the sound into an electrical signal, and processes the electrical signal through an amplifier to obtain an electrical signal meeting specific requirements. In some embodiments, the wired connection may include a metal cable, an optical cable, or a hybrid of metal and optical cables, such as a coaxial cable, a communication cable, a flex cable, a spiral cable, a non-metal sheathed cable, a multi-core cable, a twisted-pair cable, a ribbon cable, a shielded cable, a telecommunications cable, a twinax cable, a parallel twin-core wire, a twisted-pair wire, and the like, in any combination of one or more thereof. The above-described examples are merely for convenience of illustration, and the medium for wired connection may be other types of transmission medium, such as other transmission medium of electrical or optical signals.

Wireless connections may include radio communications, free-space optical communications, acoustic communications, and electrical Iso sensing, among others. Wherein the radio communications may include the IEEE802.11 family of standards, the IEEE802.15 family of standards (e.g., Bluetooth, ZigBee, etc.), first generation mobile communication technologies, second generation mobile communication technologies (e.g., FDMA, TDMA, SDMA, CDMA, and SSMA, etc.), general packet radio service technologies, third generation mobile communication technologies (e.g., CDMA2000, WCDMA, TD-SCDMA, and WIMAX, etc.), fourth generation mobile communication technologies (e.g., TD-LTE, FDD-LTE, etc.), satellite communications (e.g., GPS technologies, etc.), Near Field Communications (NFC), and other technologies operating in the ISM band (e.g., 2.4GHz, etc.); free space optical communication may include visible light, infrared signals, and the like; the acoustic communication may include acoustic waves, ultrasonic signals, etc.; electromagnetic induction may include near field communication techniques and the like. The above examples are for convenience of illustration only, and the medium for the wireless connection may be of other types, such as Z-wave technology, other premium civilian radio bands, and military radio bands, among others. For example, as some application scenarios of the present technology, the acoustic apparatus 100 may acquire a signal containing sound information from other devices through bluetooth technology.

The vibration assembly 104 may generate mechanical vibrations. The generation of vibration is accompanied by the conversion of energy, and the speaker 100 can convert a signal containing sound information into mechanical vibration by using a specific magnetic circuit member 102 and a specific vibration member 104. The conversion process can contain coexistence and conversion of different energy types from . For example, the electrical signal may be directly converted into mechanical vibrations by a transducer device, producing sound. For another example, sound information may be included in the light signal, and a particular transducing device may effect the conversion of the light signal into a vibration signal. Other types of energy that may coexist and be converted during operation of the transducer device include thermal energy, Iso field energy, and the like. The energy conversion mode of the energy conversion device can comprise moving coil type, electrostatic type, piezoelectric type, moving iron type, pneumatic type, electromagnetic type and the like. The frequency response range and sound quality of the acoustic device 100 may be affected by the vibrating component 104. For example, in a moving coil transducer device, the vibrating assembly 104 includes a wound cylindrical voice coil and a vibrating body (e.g., a vibrating plate or a vibrating membrane), the cylindrical voice coil driven by a signal current drives the vibrating body to vibrate and generate sound in a magnetic field, and the expansion and contraction of the material of the vibrating body, the deformation, size, shape, and fixing manner of the folds, the magnetic density of the magnetic field, and the like all have great influence on the sound effect quality of the acoustic device 100. The vibrating body in the vibrating assembly 104 can be a mirror-symmetric structure, a centrosymmetric structure or an asymmetric structure, and a discontinuous hole-shaped structure can be arranged on the vibrating body, so that the vibrating body generates larger displacement, the loudspeaker realizes higher sensitivity, and the output power of vibration and sound is improved; the vibrating body can be of a ring body structure, a plurality of supporting rods which converge towards the center are arranged in the ring body, and the number of the supporting rods can be two or more.

The support assembly 106 may support the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108. The support assembly 106 may include one or more housings, one or more connectors. The one or more housings may form a receiving space for receiving the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108. The one or more connectors may connect the housing with the magnetic circuit assembly 102, the vibration assembly 104, and/or the storage assembly 108.

The storage component 108 may store signals containing sound information. In some embodiments, storage component 108 may include one or more storage devices. The Storage device may include a Storage device on a Storage system such as a Direct Attached Storage (Direct Attached Storage), a Network Attached Storage (Network Attached Storage), and a Storage Area Network (Storage Area Network). The storage device may include various types of storage devices such as solid-state storage devices (solid-state disk, solid-state hybrid disk, etc.), mechanical hard disk, USB flash memory, memory stick, memory card (e.g., CF, SD, etc.), other drives (e.g., CD, DVD, HD DVD, Blu-ray, etc.), Random Access Memory (RAM), and Read Only Memory (ROM). Wherein the RAM can comprise a decimal count tube, a number selection tube, a delay line memory, a Williams tube, a Dynamic Random Access Memory (DRAM), a Static Random Access Memory (SRAM), a thyristor random access memory () T-RAM, a zero-capacitance random access memory (Z-RAM) and the like; the ROM may include bubble memory, magnetic button wire memory, thin film memory, magnetic wire memory, magnetic core memory, magnetic drum memory, optical disk drives, hard disks, magnetic tape, early NVRAM nonvolatile memory), phase change memory, magnetoresistive random access memory, ferroelectric random access memory, nonvolatile SRAM, flash memory, EEPROM, erasable programmable read only memory, punch-and-play memory, floating gate access memory, nano-RAM, racetrack memory, variable resistive memory, and programmable metallization cells, among others. The above-mentioned storage device/storage unit is just to exemplify some examples, and the storage device that can be used by the storage device/storage unit is not limited thereto.

The above description of the structure of the acoustic device is merely a specific example and should not be considered the only possible embodiment. It is clear that, after having understood the fundamental principles of the acoustic device, it is possible for a person skilled in the art to make various modifications and variations in form and detail of the specific ways and steps of implementing the acoustic device without departing from such principles, but these modifications and variations are still within the scope of what has been described above. For example, the acoustic device 100 may include one or more processors that may execute one or more sound signal processing algorithms. The sound signal processing algorithm may modify or enhance the sound signal. Such as noise reduction, acoustic feedback suppression, wide dynamic range compression, automatic gain control, active environment recognition, active anti-noise, directional processing, tinnitus processing, multi-channel wide dynamic range compression, active howling suppression, volume control, or the like, or any combination thereof, of the acoustic signal, and such modifications and variations are intended to be within the scope of the claims appended hereto. For another example, the acoustic device 100 may include one or more sensors, such as a temperature sensor, a humidity sensor, a velocity sensor, a displacement sensor, and the like. The sensor may collect user information or environmental information. As another example, the storage component 108 may not be necessary and may be removable from the acoustic device 100.

Fig. 2 is a schematic structural diagram of an exemplary acoustic device according to some embodiments of the present application. As shown in fig. 2, the acoustic device 1 may include a housing 11, a speaker assembly 12, and a shield member 13. The speaker assembly 12 may be disposed within the housing 11. A protective element 13 may be supported on the housing 11 for protecting the speaker assembly 12.

As shown in fig. 2, the housing 11 has a receiving cavity 110 (which may also be referred to as a first receiving cavity), and the receiving cavity 110 is used for placing the speaker assembly 12, that is, the speaker assembly 12 is disposed in the receiving cavity 110. In some embodiments, when the acoustic device 1 is used, the side of the casing 11 facing the open end 111 of the accommodating cavity 110 is close to the head of the user, and the mechanical vibration generated by the speaker assembly 12 can be transmitted to the head of the user through the side of the casing facing the open end 111.

In some embodiments, the inner wall of the housing 11 is provided with an annular bearing platform 112, and the inner wall of the housing 11 refers to the inner wall of the accommodating cavity 110 of the housing 11. In some embodiments, an annular platform 112 may be disposed in the inner wall at a location proximate to the open end 111. In some embodiments, the annular platform 112 may be disposed on an inner wall of the housing above the speaker assembly 12. The annular platform 112 may be used to support the protective element 13. By disposing the protection element 13 on the annular platform 112, the protection element 13 can cover or substantially cover the open end 111, thereby protecting the speaker assembly 12 in the accommodating cavity 110.

In some embodiments, the speaker assembly 12 may include a magnetic circuit assembly (not shown), a voice coil (not shown), a vibration assembly (not shown), and a vibration plate 121. The magnetic circuit component forms a magnetic gap, at least part of the voice coil is arranged in the magnetic gap, the other end of the voice coil is physically connected with the vibration component, the vibration component is physically connected with the vibration transmission plate 121, and the vibration transmission plate 121 is physically connected with the shell 11. Specifically, the magnetic circuit assembly may form a magnetic field, and the voice coil may be located in the magnetic gap, i.e., in the magnetic field formed by the magnetic circuit assembly, and may be acted by an ampere force. The ampere force drives the voice coil to vibrate, so as to drive the vibration component to generate mechanical vibration, the vibration component transmits the vibration to the vibration transmission plate 121, the vibration transmission plate 121 transmits the vibration to the shell 11, and finally the shell 11 transmits the vibration to auditory nerves through tissues and bones of a human body, so that a user can hear the sound. In some embodiments, the vibration transfer plate 121 and at least part of the housing 11 may also be referred to as elements in the vibration assembly.

In some embodiments, the magnetic circuit assembly, the voice coil, and the vibration assembly may be disposed within the receiving cavity 110. The vibration transmission plate 121 is connected to the vibration component and exposed out of the accommodating cavity 110 through the opening end. By exposing the vibration transmission plate 121 to the outside of the accommodating cavity 110, the vibration transmission plate 121 can be closer to the head of the user, and the vibration of the exposed vibration transmission plate 121 can be transmitted to the bone of the user more rapidly and powerfully. Therefore, the mechanical vibration transmitted to the ears of the people is more complete, the frequency band is not easy to lose, and the hearing effect of the hearing-impaired people is effectively improved.

As shown in fig. 2, the shielding member 13 may be disposed above the open end 111 and attached to the outer end surface of the vibration transmission plate 121. In some embodiments, the protective element 13 may include a fitting portion 131 (i.e., a bottom portion), a receiving portion 132 (i.e., a side wall), and a supporting portion 133 (e.g., an annular supporting portion, i.e., an extension portion). The attaching portion 131 and the accommodating portion 132 form an accommodating cavity (also referred to as a second accommodating cavity, for example, a cylindrical accommodating cavity), the vibration transmission plate 121 may be disposed in the second accommodating cavity, the attaching portion 131 is attached to an outer end surface of the vibration transmission plate 121, and the supporting portion 133 is connected to the accommodating portion 132 and disposed above the housing 11. Specifically, the outer end surface of the vibration transmission plate 121 refers to an end surface away from the accommodating cavity 110 or away from the vibration component.

In the assembling process of the protection element 13, the protection element 13 may be covered above the opening end 111, the vibration transmission plate 121 exposed outside the accommodating cavity 110 is extended into the second accommodating cavity, and the outer end surface of the vibration transmission plate 121 is attached to the attaching portion 131. In some embodiments, the support portion 133 may be disposed above the annular platform 112.

In some embodiments, the protective element 13 may comprise a protective screen. Through the mesh structure of the protective gauze, in the process of generating mechanical vibration by the loudspeaker component 12, the air inside and outside the accommodating cavity 110 circulates mutually to balance the air pressure difference inside and outside the accommodating cavity 110, so that the sound generated by the air inside the accommodating cavity 110 due to vibration is reduced, the sound generated by the air vibration near the vibration transmission plate 121 is attenuated, the sound leakage phenomenon is reduced, and the tone quality and the sound effect of the whole acoustic device 1 are improved.

In some embodiments, in order to improve the connection stability between the support portion 133 and the annular platform 112, as shown in fig. 2, the acoustic device 1 may include an upper cover 14 (e.g., an annular upper cover), and the upper cover 14 is used to press the support portion 133 against the annular platform 112. Thus, the protection element 13 can be stably disposed (or supported) on the annular bearing platform 112, and the falling of the support portion 133 can be reduced.

There are various embodiments regarding the positional relationship and the support structure among the upper cover 14, the support portion 133, and the annular base 112.

FIG. 3A is a schematic illustration of a disassembled structure of the acoustic device of FIG. 2 according to some embodiments of the present application; FIG. 3B is a schematic cross-sectional structural view of the acoustic device of FIG. 3A, according to some embodiments of the present application; fig. 3C is a schematic structural view of a diaphragm of the acoustic device of fig. 3A according to some embodiments of the present application. As shown in fig. 3A, the acoustic device 300 may include a housing 11 and a speaker assembly 12. The speaker assembly 12 may be disposed within the housing 11. Speaker assembly 12 may include a vibration plate 121, a vibration assembly, a magnetic circuit assembly, and a voice coil 124.

As shown in fig. 3A and 3B, the magnetic circuit assembly may include a first magnetic circuit assembly 1231 and a second magnetic circuit assembly 1232 (e.g., a magnetically permeable cover). In some embodiments, the first magnetic circuit assembly 1231 may include one or more magnetic elements and/or one or more magnetically permeable elements. In some embodiments, the second magnetic circuit assembly 1232 may include one or more magnetic elements and/or one or more magnetically permeable elements. In some embodiments, the magnetic elements of the magnetic circuit assembly may have corresponding magnetization directions so as to form a relatively stable magnetic field. As described herein, a magnetic element refers to an element that can generate a magnetic field. In some embodiments, the magnetic element may be included as a single magnet or a combination of magnets. In some embodiments, the second magnetic circuit assembly 1232 is used to modulate the magnetic field generated by the first magnetic circuit assembly 1231 to increase the utilization of the magnetic field. In some embodiments, the vibration assembly may be physically connected to the second magnetic circuit assembly 1232. Further description of the magnetic circuit assembly, the first magnetic circuit assembly 1231 and the second magnetic circuit assembly 1232 may refer to the detailed description in fig. 4-61.

For convenience of description, fig. 3A describes the second magnetic circuit assembly 1231 as a permeable cover, and it should be noted that the second magnetic circuit assembly 1231 is only described herein as a permeable cover, and is not intended to limit the scope of the present description. The flux guide shield may include a shield bottom 12321, a shield side 12322, and a cylindrical slot 12323, the shield bottom 12321 and the shield side 12322 forming a cylindrical slot 12323. In some embodiments, the cover side 12322 can be provided in a cylindrical shape.

In some embodiments, the first magnetic circuit assembly 1231 is disposed within the cylindrical slot 12323 and forms a magnetic gap with the flux shield 1232. Correspondingly, at least a portion of the voice coil 124 is located in the magnetic gap, that is, the voice coil 124 is located in the magnetic field formed between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232, so that the voice coil 124 can generate an ampere force under the excitation of an electrical signal (e.g., an audio signal), and further drive the vibration plate 121 to generate mechanical vibration. In some embodiments, the first magnetic circuit assembly 1231 includes one or more magnetic elements and/or one or more magnetically permeable elements disposed on or within the first magnetic circuit assembly 1231. Further description of the first magnetic circuit assembly 1231 may be had with reference to the detailed description of fig. 6-64.

In some embodiments, the first magnetic circuit assembly 1231 is physically connected to the flux guide 1232, for example, the cover bottom 12321 of the flux guide 1232 can be connected by one or a combination of magnetic absorption, adhesive bonding, clamping, and screw connection.

In some embodiments, as shown in fig. 3B, the acoustic device 300 includes a fastener 126 for fastening the first magnetic circuit assembly 1231 to the cover bottom 12321.

In some embodiments, the fixing member 126 may include a bolt 1261 and a nut 1262, and the bolt 1261 passes through the first magnetic circuit assembly 1231 and then passes through the cover bottom 12321 in sequence, so as to fixedly connect the first magnetic circuit assembly 1231 and the cover bottom 12321 by screwing. With this arrangement, since the nut 1262 is embedded in the bottom 12321 of the cover, the dimension of the speaker assembly 12 in the extending direction of the inner and outer frames is compressed, which is beneficial to controlling the overall dimension of the speaker assembly 12. Of course, the nut 1262 may be disposed on the side of the cover bottom 12321 away from the barrel groove 12323, where the above-mentioned overall dimensions allow, and the relative fixing between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 may also be achieved.

In some embodiments, the fixing member 126 may connect the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 together, in which case, an adhesive (not shown in fig. 3A and 3B) may be further disposed between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232, so that a gap between the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 can be filled, and the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 are relatively fixed more stably, thereby preventing the first magnetic circuit assembly 1231 and the magnetic conductive cover 1232 from moving relatively under mechanical vibration to generate noise in the acoustic device 300.

When the first magnetic circuit assembly 1231 and the permeable cover 1232 are fixed relative to each other, a gap (not labeled in fig. 3A) is provided between the first magnetic circuit assembly 1231 and the permeable cover 1232 for accommodating the voice coil 124. The magnetic field generated by the first magnetic circuit assembly 1231 may be distributed in the gap (which may also be referred to as a magnetic gap). In some embodiments, the magnetic gap is sized as uniformly as possible to increase the uniformity of the magnetic field distribution and thus the smoothness of the vibration of the voice coil 124 under the magnetic field.

It should be noted that: to increase the smoothness of the vibration of the voice coil 124 under the action of the magnetic field, the distance between the voice coil 124 and the first magnetic circuit assembly 1231 or the flux guide cover 1232 is equal everywhere. In some embodiments, during the pre-processing and post-assembly of the speaker assembly, the coaxiality of the first magnetic circuit assembly 1231, the flux guide sleeve 1232, the voice coil 124, and other components can be ensured.

In some embodiments, as shown in fig. 3A and 3B, the vibration assembly may include an inner holder 1221, an outer holder 1222, and a vibration plate 1223. One end of the outer bracket 1222 is physically connected to both sides of the magnetic circuit assembly (e.g., the cover side 12322 of the flux guide 1232). In some embodiments, the physical connection may include one or more combinations of magnetic attraction, snap fit, threaded connection, and the like. In some embodiments, one end of the outer bracket 1222 may be integrally formed with both sides of the magnetic circuit assembly (e.g., the cover side 12322 of the flux shield 1232). For example, one end of the outer bracket 1222 is integrally formed with two sides of the magnetic circuit assembly (e.g., the cover side 12322 of the flux guide 1232) by injection molding. By arranging the outer bracket 1222 and the element in the magnetic circuit assembly (for example, the cover body side part 12322 of the magnetic conductive cover 1232) as an integral part, the assembly error of the outer bracket 12222 and the magnetic circuit assembly can be effectively reduced, and the coaxiality of the outer bracket 1222 and the magnetic circuit assembly can be ensured.

One end of the inner support 1221 is physically connected to the voice coil 124. As described above, the voice coil 124 is subjected to an ampere force in the magnetic field formed by the magnetic circuit assembly, the ampere force drives the voice coil 124 to vibrate, and the inner support 1221 connected to the voice coil 124 vibrates. The inner holder 1221 and the outer holder 1222 are connected by the vibrating piece 1223, and thus the outer holder 1222 and the vibrating piece 1223 are also vibrated. In some embodiments, at least one of the inner holder 1221, the outer holder 1222, and the vibration plate 1223 is connected to the vibration transfer plate 121, so that vibration is transferred to the vibration transfer plate 121.

In some embodiments, the vibrating piece 1223 physically connects the inner support 1221 and the outer support 1222, and may be configured to limit the relative movement of the inner support 1221 and the outer support 1222 in the first direction; the first direction is a radial direction of the accommodating chamber 110. Because the vibrating reed 1223 connects the inner support 1221 and the outer support 1222, the assembling error of the outer support 1222 may also cause the assembling error between the inner support 1221 and the magnetic circuit component, and further cause the stability of the vibration of the voice coil 124 under the action of the magnetic field to decrease, that is, the stability of the mechanical vibration generated by the vibration component driven by the voice coil 124 is deteriorated, and further the sound quality of the acoustic device 300 is affected.

In some embodiments, the outer support 1222 and/or the inner support 1221 is movably connected to the vibration plate 1223 to limit relative movement of the outer support 1222 and the inner support 1221 in a first direction, while allowing movement of the inner support 1221 and the vibration plate 1223 in a second direction relative to the outer support 1222; the second direction is an extending direction of the inner bracket 1221 and the outer bracket 1222.

In some embodiments, the outer support 1222 is movably connected to the vibration plate 1223. As described herein, the first element (e.g., the external bolster 1222) being movably connected to the second element means that the first element and the second element can undergo relative movement through the connecting portion. In some embodiments, an end of the outer bracket 1222 remote from the magnetic circuit assembly (i.e., close to the vibration transmission plate 1121) is provided with a first protrusion 12221, the vibration plate 1223 is opened with a first through hole 12231, and the first protrusion 12221 is movably connected to the vibration plate 1223 through the first through hole 12231, that is, the vibration plate 1223 can move up and down along the first protrusion 12221. In some embodiments, the first post 12221 is adapted to the first through hole 12231. The first protruding pillar 12221 is movably disposed through the first through hole 12231.

In some embodiments, the number of the first posts 12221 and the first through holes 12231 can be multiple.

In some embodiments, the inner support 1221 is movably connected to the membrane 1223. In some embodiments, one end of the inner bracket 1221 may be provided with a second protrusion 12211, the vibration plate 1223 is provided with a second through hole 12232, and the second protrusion 12211 is movably connected to the vibration plate 1223 through the second through hole 12232.

In some embodiments of the present disclosure, the relative movement of the outer bracket 1222 and the inner bracket 1221 in the first direction can be limited by the first boss 12221 matching the first through hole 12231 and the second boss 12211 matching the second through hole 12232, while the movement of the inner bracket 1221 and the vibrating plate 1223 in the second direction relative to the outer bracket 1222 is allowed to facilitate the transmission of the mechanical vibration generated by the vibrating assembly out. The other portion of the inner support 1221 may be fixedly connected to the vibration plate 1223, so that the inner support 1221 may transmit vibration to the vibration plate 1223 through the inner support 1221 under the vibration of the voice coil. As described herein, a first element (e.g., inner support 1221) being fixedly connected to a second element means that the first and second elements cannot move relative to each other through a connection, i.e., the first and second elements remain relatively stationary through the connection.

As shown in fig. 3C, in some embodiments, the vibrating piece 1223 can include a ring-shaped edge portion 12233 and one or more ribs 12234 connected to the ring-shaped edge portion 12233, wherein the ring-shaped edge portion 12233 is opened with a first through hole 12231. A through groove (not shown) corresponding to the rib 12234 may be formed on a surface of the inner support 1221 facing the vibration transmission plate 121, and the rib 12234 may be received in the through groove, so as to limit the relative movement of the outer support 1222 and the inner support 1221 along the first direction, and allow the inner support 1221 and the vibration plate 1223 to move relative to the outer support 1222 in the second direction; the second direction is an extending direction of the inner bracket 1221 and the outer bracket 1222.

Fig. 3C is a schematic view of a vibrating piece according to some embodiments of the present application. As shown in fig. 11C, in some embodiments, the vibration piece 1223 may further include one or more ribs 12234 connected between the annular middle portion 12235, the annular edge portion 12233, and the annular middle portion 12235. The annular middle portion 12235 is opened with a second through hole 12232, and the position of the second post 12211 corresponds to the position of the second through hole 12232 (not limited to the case shown in fig. 3A). The annular edge 12233 has a first through hole 12231, and the position of the first protruding column 12221 corresponds to the position of the first through hole 12231.

In some embodiments, the speaker assembly 12 may include a resilient damping patch 125, the resilient damping patch 125 being disposed between the baffle 121 and an end of the inner support 1221 to dampen vibrations of the inner support 1221 in the second direction.

In some embodiments, the second post 12211 can comprise a first column section 12212 and a second column section 12213 physically connected. As shown in fig. 3A, the second column section 12213 is disposed above the first column section 12212; the first column section 12212 penetrates through the second through hole 12232, and the second column section 12213 is inserted into the vibration transmission plate 121; the elastic damping piece 125 is provided with a third through hole 1251, and the elastic damping piece 125 is sleeved on the second column section 12213 through the third through hole 1251 and supported on the first column section 12212.

In some embodiments, the first column section 12212 and the second column section 12213 are a unitary piece, and the cross-sectional area of the second column section 12213 is less than the cross-sectional area of the first column section 12212.

In some embodiments, the outer edge of the elastic damping sheet 125 may be connected to the housing 11. In some embodiments, the outer edge of the elastic shock absorbing sheet 125 may be disposed between the housing 11 and a shielding member (not shown, refer to the shielding member 13 in fig. 2). Specifically, the outer edge of the elastic damping piece 125 may be fixedly coupled to the housing 11, and the shielding member is fixedly coupled to the elastic damping piece 125.

In some embodiments, the elastic damping sheet 125 may be clamped between an annular platform provided on the inner wall of the housing 11 and a supporting portion (not shown, refer to the supporting portion 133 in fig. 2) of the shielding member, and the annular platform may support the elastic damping sheet 125. In some embodiments, the inner surface of the support portion may be adhesively attached to the resilient damping sheet 125, and the resilient damping sheet 125 may be adhesively attached to the annular platform.

The elastic damping piece 125 may be sandwiched between an annular platform, which may support the elastic damping piece 125, and a support portion. In some embodiments, the outer surface of the support portion may be adhesively attached to the resilient damping sheet 125, and the resilient damping sheet 125 may be adhesively attached to the annular platform.

For some embodiments, the elastic damping sheet 125 may be clamped between a second cover body (not shown in the drawings, and refer to the second cover body 142 in fig. 2) of the upper cover and an annular platform, which may support the elastic damping sheet 125. In some embodiments, the elastic damping piece 125 can be fixed to the second cover body and the annular bearing platform by adhesive bonding.

In some embodiments of the present disclosure, the smoothness of the vibration transfer plate 121 may be increased by providing the elastic damping sheet 125 to damp the vibration of the inner bracket 11401 in the second direction.

In some embodiments, inner support 1221 forms cover slot 12214. In some embodiments, the end of the inner support 1221 facing the first magnetic circuit assembly 1231 forms a lid slot 12214. The first magnetic circuit assembly 1231 partially extends into the cover slot 12214. In some embodiments, one end of the inner bracket 1221 (the end facing the first magnetic circuit assembly 1231) is covered on the first magnetic circuit assembly 1231, so that the first magnetic circuit assembly 1231 can partially protrude into the cover slot 12214. So set up, under the sound production demand that satisfies speaker subassembly 12, can make speaker subassembly 12 the size in the extending direction of interior outer support compress, be favorable to controlling the whole size of speaker subassembly 12.

Fig. 4 is a schematic longitudinal cross-sectional view of a bone conduction acoustic device according to some embodiments of the present application. As shown, the bone conduction acoustic device 400 may include a magnetic circuit assembly (not shown), a vibration assembly 403, and a voice coil 404. In some embodiments, the magnetic circuit assembly may include a first magnetic circuit assembly 401 and a second magnetic circuit assembly 402, the second magnetic circuit assembly 402 being disposed around the first magnetic circuit assembly 401 to form a magnetic gap, the voice coil 404 may be disposed within the magnetic gap, and the voice coil 404 is coupled to the vibration assembly 403.

At least one of the first and second magnetic circuit assemblies 401, 402 may comprise a magnetic element and/or a magnetically permeable element. In the present application, the strength of the magnetic field in the magnetic gap and its distribution can be varied by the magnetic elements, the combination of magnetic flux elements and the variation of the position, and by setting the magnetization direction of the individual magnetic elements.

In some embodiments, the first magnetic circuit assembly may include a first magnetic element and a second magnetic element, the total magnetic field generated by the magnetic circuit assembly having a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the first magnetic element or the second magnetic element within the magnetic gap. In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are opposite. In some embodiments, the angle between the magnetization directions of the first magnetic element and the second magnetic element is 150 degrees and 180 degrees. For example, the angle between the magnetization directions of the first and second magnetic elements may be equal to, for example, 150 °, 170 °, 180 °, or the like. In some embodiments, the magnetization directions of the first magnetic element and the second magnetic element are perpendicular or parallel to the vibration direction of the voice coil in the magnetic gap and the magnetization directions are opposite. As described herein, the vibration direction of the voice coil in the magnetic gap refers to the vibration direction of the voice coil at a certain time. In some embodiments, if the magnetization directions of the first magnetic element and the second magnetic element are parallel to the vibration direction of the voice coil in the magnetic gap, the first magnetic element and the second magnetic element may be stacked along the vibration direction of the voice coil in the magnetic gap; if the magnetization directions of the first magnetic element and the second magnetic element are perpendicular to the vibration direction of the voice coil in the magnetic gap, the first magnetic element and the second magnetic element may be stacked along the direction perpendicular to the vibration direction of the voice coil in the magnetic gap. For more details on the first magnetic circuit assembly, reference may be made to fig. 6-63.

In some embodiments, the first magnetic circuit assembly comprises a first magnetic element, a second magnetic element and a first magnetically permeable element, and the second magnetic circuit assembly may comprise a third magnetic element. The first magnetic conductive element is disposed between the first magnetic element and the second magnetic element, and the third magnetic element is disposed at least partially around the first magnetic element and the second magnetic element. In some embodiments, the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface where the first magnetic element and the first magnetic conductive element are connected, and the magnetization direction of the first magnetic element is opposite to the magnetization direction of the second magnetic element. In some embodiments, the angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element may be in the range of 60-120 degrees, and/or 0-30 degrees. For more description of the first magnetic conductive element of the first magnetic circuit assembly and the third magnetic element of the second magnetic circuit assembly, reference may be made to fig. 6, 8, 34, 36, 38, 40, 42, 54 and/or 56.

In some embodiments, the first magnetic assembly may include a first magnetic element, a second magnetic element, and a second magnetic conductive element, the second magnetic assembly including the first magnetic conductive element; the second magnetic conduction element is arranged between the first magnetic element and the second magnetic element; the first magnetic conductive element is disposed at least partially around the first magnetic element and the second magnetic element. In some embodiments, the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface where the first magnetic element and the first magnetic conductive element are connected, and the magnetization direction of the first magnetic element is opposite to the magnetization direction of the second magnetic element. In some embodiments, the second magnetic conductive element is disposed around the first magnetic element with the first magnetic element surrounding between the second magnetic elements. In some embodiments, the upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element. In some embodiments, if the first magnetic element and the second magnetic element can be stacked along the vibration direction of the voice coil in the magnetic gap, the upper surface of the second magnetic conductive element is connected to the lower surface of the first magnetic element, and the lower surface of the second magnetic conductive element is connected to the upper surface of the second magnetic element. In some embodiments, if the first magnetic element and the second magnetic element can be stacked along a direction perpendicular to the vibration direction of the voice coil in the magnetic gap, the outer wall of the second magnetic conductive element is connected to the inner surfaces of the first magnetic element and the second magnetic element. As described herein, the inner surface (or inner wall or inner ring or inner region) of the magnetic element refers to a face that is substantially parallel to the direction of vibration of the voice coil in the magnetic gap and away from the voice coil. The outer surface (or outer wall or outer ring or outer area) of the magnetic element refers to a face that is substantially parallel to the direction of vibration of the voice coil in the magnetic gap and close to the voice coil; the inner surface of the magnetic element refers to a surface substantially parallel to the direction of vibration of the voice coil in the magnetic gap and away from the voice coil; the upper surface (i.e., top surface) of the magnetic element means a surface substantially perpendicular to the vibration direction of the voice coil in the magnetic gap and close to the vibration plate; the lower surface (i.e., bottom surface) of the magnetic element refers to a surface substantially perpendicular to the vibration direction of the voice coil in the magnetic gap and away from the sound vibration piece. For more description of the first and second magnetic circuit assemblies, reference may be made to fig. 10, 12, 44, 46, 48, 50, and/or 52.

In some embodiments, the first magnetic circuit assembly may comprise a first magnetic element and the second magnetic circuit assembly may comprise a first magnetically permeable element; the first magnetic conductive element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element is directed from the central region (or inner region) of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the central region (or inner region) of the first magnetic element. In some embodiments, the first magnetic element is ring-shaped. In some embodiments, the first magnetic element is cylindrical. For more description of the first and second magnetic circuit assemblies, reference may be made to fig. 24, 26, 28, 30, 32, 61 and/or 62.

In some embodiments, the first magnetic circuit assembly may comprise a first magnetic element and the second magnetic circuit assembly may comprise a second magnetic element; the second magnetic element at least partially surrounds the first magnetic element; the magnetization direction of the first magnetic element is directed from the central region (or inner region) of the first magnetic element to the outer region of the first magnetic element or from the outer region of the first magnetic element to the central region (or inner region) of the first magnetic element. In some embodiments, the magnetization direction of the second magnetic element is directed from the outer ring of the second magnetic element to the inner ring of the second magnetic element or from the inner ring of the second magnetic element to the inner ring of the second magnetic element. For more description of the first and second magnetic circuit assemblies, reference may be made to fig. 14, 16, 18, 20, 22 and/or 63.

The magnetic element described in the present application refers to an element that can generate a magnetic field, such as a magnet or the like. The magnetic element may have a magnetization direction that is a magnetic field direction inside the magnetic element, i.e., a magnetic induction line direction inside the magnetic element or an S-pole pointing N-pole direction of the magnetic element. The magnetic element may comprise one or more magnets. For example two magnets. In some embodiments, the magnet may comprise a metal alloy magnet, ferrite, or the like. Wherein the metal alloy magnet may comprise neodymium iron boron, samarium cobalt, alnico, iron chromium cobalt, aluminum iron boron, iron carbon aluminum, or the like, or combinations thereof. The ferrite may comprise barium ferrite, steel ferrite, magnesium manganese ferrite, lithium manganese ferrite, or the like, or various combinations thereof. It should be noted that the magnetizer referred to herein may also be referred to as a magnetic field concentrator or an iron core. The magnetizer can adjust the distribution of the magnetic field generated by the magnetic element. The magnetizer may include a member processed from a soft magnetic material. In some embodiments, the soft magnetic material may include a metal material, a metal alloy, a metal oxide material, an amorphous metal material, and the like, such as iron, an iron-silicon based alloy, an iron-aluminum based alloy, a nickel-iron based alloy, an iron-cobalt based alloy, a low carbon steel, a silicon steel sheet, a ferrite, and the like. In some embodiments, the magnetizer may be processed by one or more combined methods of casting, plastic working, cutting working, powder metallurgy, and the like. The casting may include sand casting, investment casting, pressure casting, centrifugal casting, etc.; the plastic working may include one or more of rolling, casting, forging, stamping, extruding, drawing, etc. in combination; the cutting process may include turning, milling, planing, grinding, or the like. In some embodiments, the processing method of the magnetizer may include 3D printing, numerical control machine tool, and the like. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like. In some embodiments, the magnetic element and the magnetically permeable element may be arranged in an axisymmetric configuration. The axisymmetrical structure may be a ring structure, a column structure, or other axisymmetrical structure.

In some embodiments, when a current is applied to the voice coil 404, the voice coil 404 is in the magnetic field formed by the first magnetic circuit assembly 401 and the second magnetic circuit assembly 402 and is subjected to an ampere force. The ampere force drives the voice coil 404 to vibrate, and further drives the vibration component 403 to vibrate. The vibration component 403 transmits the vibrations through the tissue and bone to the auditory nerve, thereby causing a person to hear the sound. The vibration member 403 may be in direct contact with the skin of the human body, or may be in contact with the skin through a vibration transmission layer composed of a specific material. Further description of the vibration assembly 403 may refer to the detailed description of fig. 2-3C.

Fig. 5 is a longitudinal cross-sectional schematic view of a gas conduction acoustic device according to some embodiments of the present application. As shown in fig. 5, the air-conduction acoustic device may include a first magnetic circuit assembly 501, a diaphragm 503, and a voice coil 504. Wherein, the diaphragm 503 at least partially surrounds the first magnetic circuit assembly 501, a magnetic gap is formed between the first magnetic circuit assembly 501 and the diaphragm 503, the voice coil 504 can be disposed in the magnetic gap, and the diaphragm 503 is connected to the voice coil 504. The diaphragm 503 may be attached to the housing (or support) of the air conduction speaker by one or more bellows. The first magnetic circuit assembly 501 and the diaphragm 503 may comprise magnetic and/or magnetically permeable elements. In the present application, the intensity of the magnetic field in the magnetic gap and the distribution of the intensity thereof can be changed by the magnetic elements, the combination of magnetic conductive elements and the position change, and setting the magnetization direction of each magnetic element. Similar to the principle of generating sound by a bone conduction speaker, the voice coil 504 vibrates in the magnetic gap under the action of an ampere force, and the vibration of the voice coil 504 drives the diaphragm 503 to vibrate, so as to push air to vibrate, and thus people can hear the sound.

The above description of the bone conduction acoustic device and the gas conduction acoustic device structure are merely specific examples. And should not be construed as the only possible embodiment. It will be apparent to persons skilled in the art that, having the benefit of the basic principles of the bone conduction speaker, numerous modifications and variations in form and detail of the specific modes and steps of carrying out the bone conduction speaker are possible without departing from such principles, but such modifications and variations are within the scope of the above description. For example, a bone conduction acoustic device may include a housing, a connector. The connecting piece connects the vibrating plate and the shell. For another example, the air conduction speaker may include a non-metallic housing to which the voice coil is connected by a bellows.

Figure 6 is a schematic longitudinal cross-sectional view of a magnetic circuit assembly according to some embodiments of the present application; fig. 7 is a schematic diagram of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 6 according to the present description.

As shown in fig. 6, the magnetic circuit assembly 600 may include a first magnetic element 601, a second magnetic element 602, a third magnetic element 603, and a first magnetic permeable element 604.

In some embodiments, the first magnetic conductive element 604 is disposed between the first magnetic element 601 and the second magnetic element 602, and the third magnetic element 603 is disposed at least partially around the first magnetic element 601 and the second magnetic element 602. The first and second magnetic elements 601 and 602 form a magnetic gap with the third magnetic element 603. In some embodiments, the magnetization directions of the first magnetic element 601 and the second magnetic element 602 are perpendicular to the surface of the first magnetic element 604 connected to the first magnetic element 601 and/or the second magnetic element 602 (i.e. vertical direction in the figure, and the direction of the arrow on each magnetic element in the figure represents the magnetization direction of the magnetic element), and the magnetization directions of the first magnetic element 601 and the second magnetic element 602 are opposite.

In some embodiments, the placement of the first magnetic element 601 and the second magnetic element 602 may include the same magnetic poles of the first magnetic element 601 and the second magnetic element 602 being proximate to the first magnetic conductive element 604; the different magnetic poles are remote from the first magnetic permeable element 604. For example, the N-pole of the first magnetic element 601 is closer to the first magnetic conductive element 604 than the S-pole of the first magnetic element 601 and the N-pole of the second magnetic element 602 is to the second magnetic conductive element 602, i.e., both the magnetic induction line or the magnetic field direction (i.e., the S-pole is directed to the N-pole direction) are directed to the first magnetic conductive element 604 inside the first magnetic element 601 and the second magnetic element 602. For another example, the S-pole of the first magnetic element 601 is closer to the first magnetic conductive element 604 than the N-pole of the first magnetic element 601 and the S-pole of the second magnetic element 602 are to the N-pole of the second magnetic element 602, that is, the magnetic induction line or the magnetic field direction (i.e., the S-pole is directed to the N-pole direction) is away from the first magnetic conductive element 604 inside the first magnetic element 601 and the second magnetic element 602.

By setting the magnetization directions of the first magnetic element 601 and the second magnetic element 602 to be vertical and opposite, so that the first magnetic element 601 and the second magnetic element 602 are oppositely magnetized, the directions of the magnetic induction lines generated by the first magnetic element 601 and the second magnetic element 602 in the magnetic gap can be substantially the same, for example, both are directed from the first magnetic conductive element 604 to the third magnetic element 603; or both, from the third magnetic element 603 towards the first magnetic permeable element 604, thereby increasing the magnetic field strength in the magnetic gap. In addition, by setting the magnetization directions of the first magnetic element 601 and the second magnetic element 602 to be vertical and opposite, the magnetic fields generated by the first magnetic element 601 and the second magnetic element 602 in the magnetic gap can be suppressed, so that the magnetic induction lines corresponding to the magnetic fields extend in the horizontal direction and are distributed in the magnetic gap. For example, when the magnetic induction lines or magnetic field directions (i.e., S-pole direction toward N-pole direction) inside the first magnetic element 601 and the second magnetic element 602 are both directed toward the first magnetic conductive element 604, the magnetic induction lines may extend from the end of the first magnetic conductive element 604 into the magnetic gap along a horizontal or nearly horizontal direction; when the magnetic induction lines or magnetic field directions (i.e., S poles point in the N pole direction) inside the first magnetic element 601 and the second magnetic element 602 are both away from the first magnetic conductive element 604, the magnetic induction lines extend from the magnetic gap to the end of the first magnetic conductive element 604 along the horizontal direction or the direction close to the horizontal direction.

In some embodiments, the magnetization direction of the third magnetic element 603 is perpendicular to the magnetization direction of the first magnetic element 601 or the second magnetic element 602. By arranging the magnetization directions perpendicular to each other, the magnetic induction lines in the magnetic gap can be further guided to extend in a horizontal or near-horizontal direction. For example, when the magnetic induction lines or magnetic field directions (i.e., N pole pointing to S pole direction) inside the first magnetic element 601 and the second magnetic element 602 are both pointing to the first magnetic conductive element 604, the magnetic induction lines may extend from the end of the first magnetic conductive element 604 into the magnetic gap along the horizontal or near horizontal direction and pass through the third magnetic element 603; when the magnetic induction lines or magnetic field directions (i.e., S-poles pointing to N-pole directions) inside the first magnetic element 601 and the second magnetic element 602 are both away from the first magnetic conductive element 604, the magnetic induction lines pass through the third magnetic element 603 and extend from the magnetic gap to the end of the first magnetic conductive element 604 along a horizontal or nearly horizontal direction. Like this, can make the magnetic field direction of voice coil loudspeaker voice coil position department in the magnetic gap mainly along horizontal direction or be close horizontal direction distribution, improve the homogeneity and the intensity in magnetic field, can effectively improve the audio that the voice coil loudspeaker voice coil vibration produced.

It should be noted that, in some other embodiments, the magnetization direction of each magnetic element may be in other directions, and the combination of magnetic elements with different magnetization directions may also achieve the effect of increasing the strength of the magnetic field and/or making the strength distribution of the magnetic field more uniform.

Note that the vertical direction may be understood as a direction in which the voice coil vibrates, that is, a direction perpendicular to a plane in which the top surface of the first magnetic element 601 is located. In some embodiments, the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 may be set to be not perpendicular to each other, and the magnetization directions of the two may have a preset angle. Wherein, the preset included angle can be set within a certain angle range. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 60 degrees and 120 degrees. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 50 degrees and 130 degrees. In some embodiments, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 is between 0 degrees and 30 degrees. For example, the angle between the magnetization direction of the third magnetic element 603 and the magnetization direction of the first magnetic element 601 or the magnetization direction of the second magnetic element 602 may be equal to 0 °, 60 °, 80 °, 90 °, 100 °, 180 °, etc.

In some embodiments, the magnetization direction of the first magnetic element 601 and the magnetization direction of the second magnetic element 602 may also have a predetermined angle. In some embodiments, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 is between 90 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 is between 150 degrees and 180 degrees. For example, the angle between the magnetization direction of the second magnetic element 602 and the magnetization direction of the first magnetic element 601 may be equal to, for example, 170 °, 180 °, or the like. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more of bonding, clamping, welding, riveting, bolt connection and the like. As described herein, the angle between two magnetization directions may refer to an angle that needs to be rotated to a direction in which the other magnetization direction is located, with reference to one of the magnetization directions, wherein the clockwise rotation angle is a positive number, and the counterclockwise rotation angle is a negative number.

In some embodiments, as shown in fig. 6, the magnetic circuit assembly further comprises a second magnetic permeable element 605, a third magnetic permeable element 606 and a fourth magnetic permeable element 607. The bottom surface of the second magnetic conductive element 605 is connected to the top surface of the first magnetic element 601, and the bottom surface of the third magnetic conductive element 606 is connected to the top surface of the third magnetic element 603. The second magnetic permeable element 605 and the third magnetic permeable element 606 are spaced apart at the magnetic gap. The top surface of the fourth magnetic permeable element 607 may be connected to both the bottom surface of the second magnetic element 602 and the bottom surface of the third magnetic element 603.

In some embodiments, the first magnetic element 601, the second magnetic element 602, the first magnetic conductive element 604, the second magnetic conductive element 605, and the fourth magnetic conductive element 607 may each be a cylinder, a cuboid, or a three column, etc. The third magnetic element 603 and the third magnetic conductive element 606 may be ring-shaped (continuous ring-shaped, discontinuous ring-shaped, rectangular ring-shaped, triangular ring-shaped, etc.). In some embodiments, the first magnetic element 601, the second magnetic element 602, the first magnetic conductive element 604 and the second magnetic conductive element 605 may be identical in shape and size of a cross section perpendicular to the vertical direction, and the third magnetic element 603 and the third magnetic conductive element 606 may be identical in shape and size of a cross section perpendicular to the vertical direction. In some embodiments, the sum of the thicknesses of the first magnetic element 601, the second magnetic element 602, the first magnetic permeable element 604, and the second magnetic permeable element 605 may be equal to the sum of the thicknesses of the third magnetic element 603 and the third magnetic permeable element 606. In some embodiments, the fourth magnetic permeable element 607 and the third magnetic permeable element 606 may be the same in thickness.

In some embodiments, the first magnetic element 601, the second magnetic element 602, the third magnetic element 603, the first magnetic permeable element 604, the second magnetic permeable element 605, the third magnetic permeable element 606, and the fourth magnetic permeable element 607 form a magnetic circuit. In some embodiments, the magnetic circuit assembly 6000 may generate a total or full magnetic field and the first magnetic element 601 may generate a first magnetic field. The full magnetic field is a magnetic field generated by the combined action of all components (e.g., the first magnetic element 601, the second magnetic element 602, the third magnetic element 603, the first magnetic conductive element 604, the second magnetic conductive element 605, the third magnetic conductive element 606 and the fourth magnetic conductive element 607) in the magnetic circuit assembly 600. The magnetic field strength (which may also be referred to as magnetic induction or magnetic flux density) of a full magnetic field within the magnetic gap is greater than the magnetic field strength of the first magnetic field within the magnetic gap. In some embodiments, the second magnetic element 602 may generate a second magnetic field and the third magnetic element 603 may generate a third magnetic field. The second magnetic field and/or the third magnetic field may increase the magnetic field strength of the full magnetic field at the magnetic gap. The second magnetic field and/or the third magnetic field increasing the magnetic field strength of the full magnetic field as used herein means that the magnetic field strength of the full magnetic field in the presence of the second magnetic field and/or the third magnetic field (i.e., the presence of the second magnetic element 602 and/or the third magnetic element 603) is greater in the magnetic gap than in the absence of the second magnetic field and/or the third magnetic field (i.e., the absence of the second magnetic element 602 and/or the third magnetic element 603). For example, the full magnetic field generated in the presence of the second and third magnetic elements 602 and 603 in the magnetic gap has a magnetic field strength that is greater than the full magnetic field generated in the absence of the second and third magnetic elements 602 and 603 (i.e., in the presence of the first magnetic element 601 only) in the magnetic gap. For another example, the magnetic field strength of the full magnetic field generated in the presence of the third magnetic element 603 in the magnetic gap is greater than the magnetic field strength of the full magnetic field generated in the absence of the third magnetic element 603 (i.e., in the presence of only the first magnetic element 601 and the second magnetic element 602) in the magnetic gap. In other embodiments of the present disclosure, unless otherwise specified, the magnetic circuit assembly indicates a structure including all the magnetic elements and the magnetic conductive element, the full magnetic field indicates a magnetic field generated by the magnetic circuit assembly as a whole, and the second magnetic field, the third magnetic field, … …, and the nth magnetic field each indicate a magnetic field generated by the corresponding magnetic element. In different embodiments, the magnetic elements that generate the first magnetic field (or the second magnetic field, the third magnetic field, … …, the nth magnetic field) may be the same or different.

Fig. 7 is a schematic diagram of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 6 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 6. For convenience of description only, the Z-axis in this specification is an axis that is disposed in the magnetic gap and extends along the vertical direction for representing the distribution of the strength of the magnetic field in the vertical direction. The zero-point position of the Z-axis can be set by those skilled in the art according to actual measurement requirements, for example, the zero-point position of the Z-axis can be set at the center of the first magnetic element 601, the first magnetic conductive element 604 and the second magnetic element 602 in the vertical direction; for another example, the midpoint in the thickness direction of the third magnetic element 603; as another example, the first magnetic permeable element 604 is at the center in the vertical direction. As shown in fig. 7, due to the opposing arrangement of the first magnetic element 601 and the second magnetic element 602, the magnetic field strength is highest near the zero point of the Z axis (e.g., -0.110mm), the maximum value of the magnetic field strength is about 0.61T, and the distribution of the magnetic field strength is relatively uniform in the vicinity of the zero point (e.g., -0.110mm to 0.171 mm).

Fig. 8 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 8, in some embodiments, the magnetic circuit assembly 800 may include a first magnetic element 801, a second magnetic element 802, a third magnetic element 803, a first magnetic conductive element 804, a second magnetic conductive element 805, a third magnetic conductive element 806, a fourth magnetic conductive element 807, and a fifth magnetic conductive element 808. The present embodiment is different from the embodiment shown in fig. 6 in that, compared to the fourth magnetic permeable element 607 in the embodiment shown in fig. 6, the fourth magnetic permeable element 807 and the fifth magnetic permeable element 808 are provided at an interval in the magnetic gap, the top surface of the fourth magnetic permeable element 807 is connected to the bottom surface of the second magnetic element 802, and the top surface of the fifth magnetic permeable element 808 is connected to the bottom surface of the third magnetic element 803.

In some embodiments, the fourth magnetic conductive element 807 can be a cylinder, a rectangular parallelepiped, a triangular prism, or the like, and the fifth magnetic conductive element 808 can be a ring (continuous ring, discontinuous ring, rectangular ring, triangular ring, or the like). In some embodiments, the fourth magnetic conductive element 807 may be the same shape and size as the cross-sections of the first magnetic element 801, the second magnetic element 802, the first magnetic conductive element 804, and the second magnetic conductive element 805 in a direction perpendicular to the Z-axis. The fourth magnetic conductive element 807 and the fifth magnetic conductive null 808 may be the same in thickness. In some embodiments, the fifth magnetic permeable element 808 may be the same as the third magnetic permeable element 806 in thickness and shape and size of the cross-section perpendicular to the Z-axis.

Fig. 9 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 8 according to the present application. In the alkaline gap, the intensity of each point in the Z axis direction of a horizontal magnetic field is measured along the Z axis direction shown in fig. 8. As shown in fig. 9, since the magnetic permeable element distribution on both sides of the first magnetic element 801 and the second magnetic element 802 is more symmetrical compared to fig. 6, the magnetic field intensity generated by the magnetic circuit assembly in the magnetic gap is more symmetrical on both sides of the zero point (e.g., on both sides of 0.031 mm), and varies more uniformly at positions near the zero point (e.g., -0.344mm to 0.075 mm). However, due to the discontinuity of the fourth 807 and fifth 808 magnetic permeable elements, the maximum value of the magnetic field strength is reduced to about 0.4T compared to the magnetic circuit assembly 600 having the continuous fourth 607 magnetic permeable element.

It should be noted that, in the embodiments shown in fig. 6 and fig. 8, on the basis of providing each magnetic element, a person skilled in the art may further determine the number, the arrangement position, and the arrangement form of the magnetic conductive elements as needed, and this application is not limited thereto. For example, the second magnetic permeable element 605 and the third magnetic permeable element 603 of the embodiment shown in fig. 6 may also be connected together.

Fig. 10 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 10, the magnetic circuit assembly 1000 may include a first magnetic element 1001, a second magnetic element 1002, a first magnetic permeable element 1003, and a second magnetic permeable element 1004.

In some embodiments, the second magnetic permeable element 1004 is disposed between the first magnetic element 1001 and the second magnetic element 1002; the first magnetic conductive element 1003 is at least partially arranged around the first magnetic element 1001 and the second magnetic element 1002, and a magnetic gap is formed between the first magnetic element 1001 and the second magnetic element 1002 and the first magnetic conductive element 1003; the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 are perpendicular to the surface of the second magnetic conductive element 1004 connected to the first magnetic element 1001 and/or the second magnetic element 1002 (i.e. vertical direction in the figure, and the direction of the arrow on each magnetic element in the figure represents the magnetization direction of the magnetic element), and the magnetization directions of the two are opposite.

In some embodiments, the placement of the first magnetic element 1001 and the second magnetic element 1002 may include the same magnetic pole of the first magnetic element 1001 and the second magnetic element 1002 being proximate to the second magnetic permeable element 1004; the different magnetic pole is distal from the second magnetically permeable element 1004. For example, the N-pole of the first magnetic element 1001 is closer to the second magnetic conductive element 1004 than the S-pole of the first magnetic element 1001 and the N-pole of the second magnetic element 1002 is closer to the second magnetic conductive element 1004 than the S-pole of the second magnetic element 1002, that is, both the magnetic induction line and the magnetic field direction (i.e., the S-pole is directed to the N-pole direction) are directed to the second magnetic conductive element 1004 inside the first magnetic element 1001 and the second magnetic element 1002. For another example, the S-pole of the first magnetic element 1001 is closer to the second magnetic conductive element 1004 than the N-pole of the first magnetic element 1001 and the S-pole of the second magnetic element 1002 are to the second magnetic conductive element 1002, i.e., both the magnetic induction line and the magnetic field direction (i.e., the S-pole is directed to the N-pole direction) are away from the second magnetic conductive element 1004 inside the first magnetic element 1001 and the second magnetic element 1002.

By setting the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 to be vertical and opposite to each other, so that the first magnetic element 1001 and the second magnetic element 1002 are oppositely magnetized, the directions of the magnetic induction lines generated by the first magnetic element 1001 and the second magnetic element 1002 in the magnetic gap can be substantially the same, for example, both of the directions are directed from the second magnetic element 1004 to the first magnetic element 1003; or both, from the first magnetic permeable element 1003 towards the second magnetic permeable element 1004, thereby increasing the magnetic field strength within the magnetic gap. In addition, by setting the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 to be vertical and opposite, the magnetic fields generated by the first magnetic element 1001 and the second magnetic element 1002 can be suppressed, and the magnetic induction lines corresponding to the magnetic fields are distributed in the horizontal direction extending in the magnetic gap. For example, when the magnetic induction lines or the magnetic field directions (i.e., S-pole direction toward N-pole direction) inside the first magnetic element 1001 and the second magnetic element 1002 are both directed toward the second magnetic conductive element 1004, the magnetic induction lines may extend from the end of the second magnetic conductive element 1004 into the magnetic gap along the horizontal direction or the direction close to the horizontal direction and pass through the first magnetic conductive element 1003. Therefore, the magnetic field direction at the position of the voice coil in the magnetic gap is mainly distributed along the horizontal direction or close to the horizontal direction, the uniformity and the strength of the magnetic field are improved, and the sound effect generated by the vibration of the voice coil can be effectively improved.

In other embodiments, the magnetization directions of the magnetic elements may be in other directions, and the combination of magnetic elements with different magnetization directions may also achieve the effect of increasing the strength of the magnetic field and/or making the strength distribution of the magnetic field more uniform. In addition, a preset angle may exist between the magnetization direction of the first magnetic element 1001 and the magnetization direction of the second magnetic element 1002. The preset included angle may be set within a certain angle range, for example, 60 °, 80, 90 °, 100 °, and the like. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like. In some embodiments, the magnetization direction of the first magnetic element 601 and the magnetization direction of the second magnetic element 602 may have a predetermined angle. E.g., 170 °, 190 °, etc. The associated description of the magnetization directions of the first magnetic element 1001 and the second magnetic element 1002 can refer to the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in fig. 6.

In some embodiments, as shown in fig. 10, the magnetic circuit assembly further comprises a third magnetic conductive element 1005 and a fourth magnetic conductive element 1006, wherein a bottom surface of the third magnetic conductive element 1005 may be connected to a top surface of the first magnetic element 1001, and a top surface of the fourth magnetic conductive element 1006 may be connected to both a bottom surface of the second magnetic element 1002 and a bottom surface of the second magnetic element 1004.

In some embodiments, the first magnetic element 1001, the second magnetic element 1002, the second magnetic element 1004, and the third magnetic element 1005 may each be an cylinder, a rectangular parallelepiped, a triangular prism, or the like. The first magnetic conductive element 1003 has a ring shape (continuous ring shape, discontinuous ring shape, rectangular ring shape, triangular ring shape, etc.). In some embodiments, the first magnetic element 1001, the second magnetic element 1002, the second magnetic element 1004, and the third magnetic element 1005 may be identical in shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 1001, second magnetic element 1002, second magnetic permeable element 1004, and third magnetic permeable element 1005 may be equal to the thickness of the first magnetic permeable element 1003.

Fig. 11 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 10 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 10, and as shown in fig. 11, the strength of the magnetic field is weakened near the zero point (for example, in the range of-0.500 to 0.188 mm) due to the absence of the third magnetic element 603 for further enhancing the magnetic field as compared with the magnetic circuit assembly of fig. 6, and only the maximum value of about 0.38T can be achieved, but the magnetic field strength distribution near the zero point is still relatively uniform.

Fig. 12 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 12, the magnetic circuit assembly 1200 may include a first magnetic element 1201, a second magnetic element 1202, a first magnetic conductive element 1203, a second magnetic conductive element 1204, a third magnetic conductive element 1205, and a fourth magnetic conductive element 1206. The present embodiment is different from the embodiment shown in fig. 10 in that the fourth magnetic conductive element 1206 is no longer connected to the first magnetic conductive element 1203 in the embodiment shown in fig. 12, and the top surface of the fourth magnetic conductive element 1206 is connected to the bottom surface of the second magnetic element 1202. The fourth magnetic element 1206 is spaced apart from the second magnetic permeable element 1204 at a magnetic gap. The associated description of the magnetization directions of the first magnetic element 1201 and the second magnetic element 1202 may refer to the magnetization directions of the first magnetic element 601 and the second magnetic element 602 in fig. 6.

In some embodiments, the first magnetic element 1201, the second magnetic element 1202, the second magnetic element 1204, the third magnetic element 1205, and the fourth magnetic element 1206 may all be cylinders, rectangular solids, triangular prisms, or the like, and the first magnetic conductor 1203 may be ring-shaped (circular ring-shaped, rectangular ring-shaped, triangular ring-shaped, or the like).

In some embodiments, the sum of the thicknesses of the first magnetic element 1201, the second magnetic element 1202, the second magnetic conductive element 1204, the third magnetic conductive element 1205, and the fourth magnetic conductive element 1206 may be equal to the thickness of the first magnetic conductive element 1203.

It should be noted that, in the embodiment shown in fig. 10 and 12, on the basis of providing the first magnetic element, the second magnetic element and the second magnetic conducting element, a person skilled in the art may further change the number, the arrangement position and the arrangement form of the magnetic conducting elements as needed, and the application is not limited thereto. For example, the second magnetic conductive element 1004 and the third magnetic conductive element 1005 of the magnetic circuit assembly of the embodiment shown in fig. 10 may also be connected together.

Fig. 13 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 12 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 12, and as shown in fig. 13, since the fourth magnetic permeable element 1206 and the first magnetic permeable element 1203 are no longer connected, the maximum value of the magnetic field strength is improved compared to the magnetic assembly 1000 having the continuous fourth magnetic permeable element 1006 in fig. 10, the maximum value of the magnetic field strength in the vicinity of the zero point (for example, 0.176mm) is about 0.58T, and the magnetic field strength distribution in the vicinity of the zero point is relatively uniform.

Fig. 14 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 14, the magnetic circuit assembly 1400 may include a first magnetic element 1401 and a second magnetic element 1402, the second magnetic element 1402 at least partially surrounding the first magnetic element 1401 (i.e., an inner surface or wall of the second magnetic element 1402 surrounds an outer surface or wall of the first magnetic element 1401), and a magnetic gap is formed between the first magnetic element 1401 and the second magnetic element 1402. The voice coil may be disposed in the magnetic gap.

In some embodiments, the magnetization directions of the first magnetic element 1401 and the second magnetic element 1402 are both parallel to the top surface of the first magnetic element 1401 (i.e., horizontal in the figure) or perpendicular to the inner and outer surfaces. For example, the magnetization direction of the first magnetic element 1401 may be a direction outward along the center thereof (i.e., the center region is directed to the outer region), and the magnetization direction of the second magnetic element 1402 may be a direction inward (the side closer to the first magnetic element 1401) and outward (the side farther from the first magnetic element 1401) thereof. For another example, the magnetization direction of the first magnetic element 1401 may be a direction in which the outer side is directed toward the center, and the magnetization direction of the second magnetic element 1402 may be a direction along the outer side (the side far from the first magnetic element 1401) toward the inner side (the side near to the first magnetic element 1401).

In some embodiments, the placement of the first magnetic element 1401 and the second magnetic element 1402 may include different poles of the first magnetic element 1401 and the second magnetic element 1402 being closer or farther from each other. For example, the N pole of the first magnetic element 1401 is located in the central region of the first magnetic element 1401, the S pole is located in the outer region of the first magnetic element 1401, that is, in the first magnetic element 1401, on the same plane parallel to the upper surface or the lower surface of the first magnetic element 1401, the magnetic induction line or magnetic field direction (i.e., the S pole is directed to the N pole direction) is directed outward from the center; the N pole of the second magnetic element 1402 is located at the outer region of the second magnetic element 1402, and the S pole is located at the inner region of the second magnetic element 1402, i.e. inside the second magnetic element 1402, on the same plane parallel to the upper surface or the lower surface of the second magnetic element 1402, the magnetic induction line or magnetic field direction (i.e. the S pole pointing in the N pole direction) is both inner pointing to the outer. For another example, the S pole of the first magnetic element 1401 is located in the central region of the first magnetic element 1401, the N pole is located in the outer region of the first magnetic element 1401, that is, in the first magnetic element 1401, on the same plane parallel to the upper surface or the lower surface of the first magnetic element 1401, the magnetic induction line or the magnetic field direction (i.e., the S pole is directed to the N pole direction) is directed from the outside to the inside; the S pole of the second magnetic element 1402 is located at the outer region of the second magnetic element 1402, and the N pole is located at the inner region of the second magnetic element 1402, i.e. inside the second magnetic element 1402, on the same plane parallel to the upper surface or the lower surface of the second magnetic element 1402, the magnetic induction line or magnetic field direction (i.e. the S pole pointing towards the N pole direction) is both outward pointing towards the inner.

In some alternative embodiments, the first magnetic element 1401 may comprise two magnets and the placement of the two magnets may comprise an adjacent arrangement with like poles closer and opposite poles further apart. For example, the N poles of the two magnets are close to each other (the magnetization directions of the right and left magnets of the first magnetic element 1401 are opposite as shown in the figure). Also for example, the S poles of the two magnets are close to each other. In some embodiments, the second magnetic element 1402 may also include two magnets, which are respectively close to the first magnetic element 1401 and have opposite magnetic induction lines or fields inside. For example, the magnetic induction or field direction inside the magnets of both of the second magnetic element 1402 faces away from the first magnetic element 1401.

By setting the magnetization direction of the first magnetic element 1401 to a horizontal direction, it is possible to better cause the magnetic field generated by the first magnetic element 1401 to extend in the horizontal direction or a nearly horizontal direction in the magnetic gap. And the magnetization direction of the second magnetic element 1402 is the same as the first magnetic element 1401, the magnetic induction lines within the magnetic gap can be further guided to be distributed in the magnetic gap along the horizontal or near horizontal direction. For example, when the magnetic induction lines or magnetic field directions inside the first magnetic element 1401 and the second magnetic element 1402 are both directed from the first magnetic element 1401 to the second magnetic element 1402 (i.e., the S-pole is directed to the N-pole direction), the magnetic induction lines may extend from the outside of the first magnetic element 1401 into the magnetic gap in a horizontal or near horizontal direction and pass through the second magnetic element 1402, and the second magnetic element 1402 may emanate from the outside of the second magnetic element 1402 and extend in the magnetic gap in a horizontal or near horizontal direction and pass into the inside of the second magnetic element 1402. For another example, when the magnetic induction lines or the magnetic field directions inside the first magnetic element 1401 and the second magnetic element 1402 are both directed from the second magnetic element 1402 to the first magnetic element 1401 (i.e., the S-pole is directed to the N-pole direction), the magnetic induction lines may emanate from the inside of the first magnetic element 1401, extend from the magnetic gap in a horizontal or near horizontal direction, and penetrate the outside of the first magnetic element 1401, and the second magnetic element 1402 may emanate from the inside of the second magnetic element 1402, extend from the magnetic gap in a horizontal or near horizontal direction, and penetrate the outside of the first magnetic element 1402. Like this, can be so that the magnetic field direction of voice coil loudspeaker voice coil position department in the magnetic gap mainly distributes along the horizontal direction or near the horizontal direction, improved the homogeneity and the intensity in magnetic field, can effectively improve the audio that the voice coil loudspeaker voice coil vibration produced.

In other embodiments, the magnetization direction of each magnetic element may be in other directions, and a combination of magnetic elements with different magnetization directions may also achieve the effect of increasing the strength of the magnetic field and/or making the strength distribution of the magnetic field more uniform. In this embodiment, the horizontal direction may be understood as a direction perpendicular to the direction in which the voice coil vibrates, i.e., a direction parallel to the plane in which the top surface of the first magnetic element is located. Additionally, the magnetization directions of the first magnetic element 1401 and the second magnetic element 1402 may be parallel, and may allow for some angular misalignment, for example, the magnetization directions may be at an angle of between 170 ° and 190 °.

In some embodiments, the magnetic circuit assembly further comprises a first magnetic permeable element 1403 and a second magnetic permeable element 1404, the bottom surface of the first magnetic permeable element 1403 being connected to the top surface of the second magnetic element 1402, and the top surface of the second magnetic permeable element being connected to the bottom surface of the second magnetic element 1402. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like.

In some embodiments, the first magnetic element 1401 can be a cylinder, a rectangular parallelepiped, a triangular prism, or the like, and the second magnetic element 1402, the first magnetic permeable element 1403, and the second magnetic permeable element 1404 can be ring-shaped (continuous ring, discontinuous ring, rectangular ring, triangular ring, or the like). In some embodiments, the first magnetic element 1401 may be formed by splicing two semi-cylindrical, two rectangular parallelepiped or two other magnets, and the magnetization directions of the two magnets constituting the first magnetic element 1401 may be opposite. In some embodiments, the second magnetic element 1402, the first magnetic permeable element 1403, and the second magnetic permeable element 1404 may be identical in shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the second magnetic element 1402, the first magnetic permeable element 1403, and the second magnetic permeable element 1404 may be equal to the thickness of the first magnetic element 1401.

Fig. 15 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 14 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 14. As shown in fig. 15, the intensity of the magnetic field is substantially symmetrical about the Z-axis zero point position, and the intensity of the magnetic field is distributed relatively uniformly along the Z-axis, the difference between the highest value and the lowest value of the magnetic field intensity is small, and the highest value of the magnetic field intensity is near the zero point (e.g., -0.002mm or 0.002mm), which is about 0.48T.

Fig. 16 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 16, the magnetic circuit assembly 1600 may include a first magnetic element 1601, a second magnetic element 1602, a first magnetically permeable element 1603, and a second magnetically permeable element 1604. This embodiment is different from the embodiment shown in fig. 14 in that the top surface of the second magnetic conducting element 1604 is connected to the bottom surfaces of the first magnetic element 1601 and the second magnetic element 1602. In some embodiments, the second magnetic permeable element 1604 may be a cylinder. In some embodiments, the sum of the thicknesses of the second magnetic element 1602 and the first magnetic permeable element 1603 may be equal to the thickness of the first magnetic element 1601.

Fig. 17 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 16 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 16. As shown in fig. 17, a relatively uniform magnetic field is generated in the vicinity of the zero point of the Z axis, and since the second magnetic permeable element 1604 connects the first magnetic element 1601 and the second magnetic element 1602, the magnetic field strength in the vicinity of the zero point (for example, 0.292mm) is improved to approximately 0.53T as compared with the magnetic circuit assembly of fig. 14.

Fig. 18 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 18, the magnetic circuit assembly 1800 may include a first magnetic element 1801, a second magnetic element 1802, a first magnetic conductive element 1803, a second magnetic conductive element 1804, and a third magnetic conductive element 1805. Compared with the embodiment shown in fig. 14, the present embodiment is different in that the present embodiment further includes a third magnetic conductive element 1805, and a top surface of the third magnetic conductive element 1805 is connected to a bottom surface of the first magnetic element 1801. The third magnetic permeable element 1802 and the second magnetic permeable element 1804 are spaced apart on either side of the magnetic gap.

In some embodiments, the first magnetic element 1801 and the third magnetic conductive element 1805 may be cylinders, rectangular solids, triangular columns, or the like. In some embodiments, the sum of the thicknesses of the second magnetic element 1802, the first magnetic permeable element 1803, and the second magnetic permeable element 1804 may be equal to the sum of the thicknesses of the first magnetic element 1801 and the third magnetic permeable element 1805. The second 1804 and third 1805 magnetic permeable elements may be equal in thickness.

Fig. 19 is a schematic view of the variation of magnetic field strength of a magnetic circuit assembly shown in fig. 18 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 18. As shown in fig. 19, the maximum value of the magnetic field intensity is about 0.5T near the Z-axis zero point (e.g., 0.0209mm), and the intensity of the magnetic field is distributed relatively uniformly on both sides, particularly above, the Z-axis zero point position. The maximum magnetic field strength in the magnetic gap is increased compared to the magnetic circuit assembly 1400 of fig. 14 without the third magnetic permeable element.

Fig. 20 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 20, the magnetic circuit assembly 2000 may include a first magnetic element 2001, a second magnetic element 2002, a first magnetic conductive element 2003, a second magnetic conductive element 2004, and a third magnetic conductive element 2005. The present embodiment is different from the embodiment shown in fig. 16 in that the present embodiment further includes a third magnetic conductive element 2005, and a bottom surface of the third magnetic conductive element 2005 is connected to a top surface of the first magnetic element 2001.

In some embodiments, the third magnetic conductive element 2005, the first magnetic element 2001 can be a cylinder, a cuboid, a triangular prism, or the like. The third magnetic permeable element 2005 and the first magnetic element 2001 may be identical in shape and size of the cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 2001 and the third magnetic conductive element 2005 and the sum of the thicknesses of the second magnetic element 2002 and the second magnetic conductive element 2003 may be the same.

Fig. 21 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 20 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 20. As shown in fig. 21, since the magnetic conductive member is added as compared with the magnetic circuit assembly of fig. 16, the maximum value of the intensity of the magnetic field (e.g., -0.016mm) reaches 0.6T.

Fig. 22 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 22, the magnetic circuit assembly 2200 may include a first magnetic element 2201, a second magnetic element 2202, a first magnetic permeable element 2203, a second magnetic permeable element 2204, a third magnetic permeable element 2205, and a fourth magnetic permeable element 2206. Compared with the embodiment shown in fig. 18, the present embodiment is different in that the present embodiment further includes a fourth magnetic permeable element 2206, and a bottom surface of the fourth magnetic permeable element 2206 is connected to a surface of the first magnetic element 2201. The fourth magnetic permeable element 2206 is spaced apart from the first magnetic permeable element 2203 on both sides of the magnetic gap. In some embodiments, the first, third, and fourth magnetic permeable elements 2201, 2205, 2206 may be cylinders, cuboids, or triangular prisms, among others. In some embodiments, the sum of the thicknesses of the second magnetic element 2202, the first magnetic permeable element 2203, and the second magnetic permeable element 2204 may be equal to the sum of the thicknesses of the first magnetic element 2201, the third magnetic permeable element 2205, and the fourth magnetic permeable element 2206. The first magnetic permeable element 2203 and the fourth magnetic permeable element 2206 may be equal in thickness.

Fig. 23 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 22 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 22. As shown in fig. 23, the highest value of the intensity of the magnetic field (for example, the highest value at-0.039 mm) is about 0.53T, and since the magnetic circuit assembly of fig. 23 is more uniformly distributed in the direction of the Z axis with respect to the magnetic circuit assembly of fig. 18, the intensity of the magnetic field is more uniformly distributed near the zero point of the Z axis.

In the embodiments shown in fig. 14, 16, 18, 20 and 22, on the basis of the first magnetic element and the second magnetic element, a person skilled in the art may further determine the number, the arrangement position and the arrangement form of the magnetic conductive elements as needed, which is not further limited in the present application. For example, the magnetic circuit assembly of the embodiment shown in fig. 14 may further include a third magnetic conductive element (not shown in the figure) and a fourth magnetic conductive element (not shown in the figure), wherein the bottom surface of the third magnetic conductive element is connected to the top surface of the first magnetic element 1401, and the top surface of the fourth magnetic conductive element is connected to the bottom surface of the first magnetic element 1401.

Fig. 24 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 24, magnetic circuit assembly 2400 may include a first magnetic element 2401 and a first magnetic permeable element 2402, with first magnetic permeable element 2402 at least partially surrounding first magnetic element 2401, with an inner ring of first magnetic permeable element 2402 forming a magnetic gap with first magnetic element 2401. The voice coil 124 of the speaker assembly 12 may be disposed in the magnetic gap.

In some embodiments, the magnetization direction of the first magnetic element 2401 is parallel to the top surface (i.e., horizontal in the figure) of the first magnetic element 2401. For example, the magnetization direction of the first magnetic element 2401 may be in an outward direction along its center.

In some alternative embodiments, the first magnetic element 2401 may include two magnets, and the placement of the two magnets may include an adjacent arrangement with like poles closer and opposite poles farther. For example, the N poles of the two magnets are close to each other (as shown in the figure, the left and right magnets of the first magnetic element 2401 have opposite magnetization directions, and the magnetization directions of the two magnets may both point to the first magnetic permeable element 2402). Further description of the first magnetic element 2401 and its magnetization direction may refer to the detailed description of the first magnetic element 1401 in FIG. 14.

Note that, in the present embodiment, the horizontal direction may be understood as a direction perpendicular to the direction in which the voice coil vibrates, i.e., a direction parallel to the plane in which the top surface of the first magnetic element 2401 is located.

By arranging the magnetization direction of the first magnetic element 2401 to be in a horizontal direction, the magnetic field generated by the first magnetic element 2401 can be better made to extend in a horizontal direction or a nearly horizontal direction in the magnetic gap. Like this, can make the magnetic field direction of voice coil loudspeaker voice coil position department in the magnetic gap mainly along horizontal direction or be close horizontal direction distribution, improve the homogeneity in magnetic field, can effectively improve the audio that the voice coil loudspeaker voice coil vibration produced. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like.

In some embodiments, the first magnetic element 2401 can be a cylinder, a cuboid, a triangular prism, or the like, and the first magnetic permeable element 2402 can be a ring (continuous ring, discontinuous ring, rectangular ring, triangular ring, or the like). In some embodiments, the first magnetic element 2401 may be formed by splicing two semi-cylindrical, two rectangular or two other magnets, and the magnetization directions of the two magnets forming the first magnetic element 2401 may be opposite. In some embodiments, the first magnetic element 2401 and the first magnetic permeable element 2402 can be the same in thickness.

Fig. 25 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 24 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 24. As shown in fig. 25, the intensity of the magnetic field is smaller than that of the magnetic element 1400 in fig. 14 because no more magnetic elements are provided, the highest value of the magnetic field intensity (for example, the highest value at-0.338 mm) is around 0.26T, but the distribution of the intensity of the magnetic field is more uniform, and the difference between the highest value and the lowest value of the intensity of the magnetic field is smaller.

Fig. 26 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 26, the magnetic circuit assembly 2600 may include a first magnetic element 2601, a first magnetic permeable element 2602, and a second magnetic permeable element 2603. Compared with the embodiment shown in fig. 24, the present embodiment is different in that the present embodiment further includes a second magnetic permeable member 2603, and the top surface of the second magnetic permeable member 2603 is connected to both the bottom surface of the first magnetic member 2601 and the bottom surface of the first magnetic permeable member 2602.

Fig. 27 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 26 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 26. As shown in fig. 27, the intensity distribution of the magnetic field is relatively uniform in the vicinity of the zero point (for example, 0.312mm) of the Z axis, and the second magnetic permeable member 2603 connects the first magnetic element 2601 and the first magnetic permeable member 2602, so that the magnetic field intensity in the vicinity of the zero point (for example, 0.312mm) of the Z axis is increased to approximately 0.35T as compared with the magnetic circuit assembly of fig. 24.

Fig. 28 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 28, the magnetic circuit assembly 2800 may include a first magnetic element 2801, a first magnetic conductive element 2802, and a second magnetic conductive element 2803. Compared with the embodiment shown in fig. 24, the present embodiment is different in that the present embodiment further includes a second magnetic conductive element 2803, and a top surface of the second magnetic conductive element 2803 is connected to a bottom surface of the first magnetic element 2801. This embodiment differs from the embodiment shown in fig. 26 in that the top surface of the second magnetic permeable element 2803 is connected only to the bottom surface of the first magnetic element 2801 and not to the bottom surface of the first magnetic permeable element 2802.

In some embodiments, the first and second magnetic conductive elements 2801 and 2802 may be cylinders, cuboids, or triangular prisms, etc., and the first and second magnetic conductive elements 2801 and 2802 may be identical in shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first and second magnetic conductive elements 2801 and 2803 can be equal to the thickness of the first magnetic conductive element 2802.

Fig. 29 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 28 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 28. As shown in fig. 29, the intensity of the magnetic field is distributed very uniformly around the zero point position (for example, in the range of-0.03 mm to 0.5 mm). And due to the addition of the second magnetic permeable element 2803, the magnetic field strength near the zero point of the Z axis (e.g., 0.49mm) is improved compared to the magnetic circuit assembly of fig. 24, approximately 0.32T. And since the top surface of the second magnetic permeable element 2803 is not connected to the bottom surface of the first magnetic permeable element 2802, the magnetic field strength near the zero point of the Z-axis (e.g., 0.49mm) is reduced compared to the magnetic circuit assembly of fig. 26.

Fig. 30 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 30, the magnetic circuit assembly 3000 may include a first magnetic element 3001, a first magnetic conductive element 3002, a second magnetic conductive element 3003, and a third magnetic conductive element 3004. Compared with the embodiment shown in fig. 26, the present embodiment is different in that the present embodiment further includes a third magnetic conductive element 3004, and a bottom surface of the third magnetic conductive element 3004 is connected to a top surface of the first magnetic element 3001.

In some embodiments, the first magnetic element 3001 and the third magnetic conductive element 3004 may be cylinders, cuboids, or the like, and the first magnetic element 3001 and the third magnetic conductive element 3004 may be identical in shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 3001 and the third magnetic conductive element 3004 may be equal to the thickness of the first magnetic conductive element 3002.

Fig. 31 is a schematic view of the variation of magnetic field strength of a magnetic circuit assembly according to the present application, as shown in fig. 38. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 30. As shown in fig. 31, the intensity of the magnetic field in the magnetic gap is distributed uniformly around the zero point of the Z-axis (e.g., -0.095-0.106 mm), and since the bottom surface of the third magnetic conductive member 3004 is connected to the top surface of the first magnetic member 3001, the intensity of the magnetic field around the zero point of the Z-axis (e.g., 0.081mm) is reduced, which is approximately 0.28T, compared to the magnetic circuit assembly of fig. 26.

Fig. 32 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 32, magnetic circuit assembly 3200 may include a first magnetic element 3201, a first magnetic conductive element 3202, a second magnetic conductive element 3203, and a third magnetic conductive element 3204. Compared with the embodiment shown in fig. 28, the present embodiment is different in that the present embodiment further includes a third magnetic conductive element 3204, and a bottom surface of the third magnetic conductive element 3204 is connected to a top surface of the first magnetic element 401.

In some embodiments, the first, second, and third magnetic conductive elements 3201, 3203, 3204 may be cylindrical, rectangular, triangular, etc., and the first, second, and third magnetic conductive elements may be identical in shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first, second, and third magnetic conductive elements 3201, 3203, 3204 may be equal to the thickness of the first magnetic conductive element 3201.

Fig. 33 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 32 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 32. As shown in fig. 33, the intensity of the magnetic field in the magnetic gap is distributed relatively uniformly near the zero point of the Z-axis, and since the bottom surface of the third magnetic permeable element 3204 is connected to the top surface of the first magnetic element 401, the magnetic field intensity near the zero point of the Z-axis (e.g., 0.000mm) is reduced, approximately 0.26T, compared to the magnetic circuit assembly of fig. 28.

In the embodiments shown in fig. 24, 26, 28, 30 and 32, after the first magnetic element and the first magnetic conductive element are provided, a person skilled in the art may further determine the number, the arrangement position and the arrangement form of the magnetic conductive elements as needed, which is not further limited in the present application. For example, the third magnetic conductive element 3204 of the magnetic circuit assembly of the embodiment shown in fig. 32 may be connected with the first magnetic conductive element 3202.

Fig. 34 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 34, the magnetic circuit assembly 3400 may include a first magnetic element 3401, a second magnetic element 3402, and a first magnetic permeable element 3403. The first magnetic element 3401 at least partially surrounds the first magnetic element 3403 (i.e. the inner surface or inner wall of the first magnetic element 3401 surrounds the outer surface or outer wall of the first magnetic element 3403), the second magnetic element 3402 at least partially surrounds the first magnetic element 3401 (i.e. the inner surface or inner wall of the second magnetic element 3402 surrounds the outer surface or outer wall of the first magnetic element 3401), and a magnetic gap is formed between the inner rings of the first magnetic element 3401 and the second magnetic element 3402. The voice coil may be disposed in the magnetic gap.

The magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 are each parallel to the top surface (i.e., the horizontal direction in the drawing) of the first magnetic element 3401 and/or the second magnetic element 3402 or perpendicular to the inner and outer surfaces, and the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 are parallel.

In some embodiments, the magnetization direction of the first magnetic element 3401 may be a direction along its center outward (i.e., center directed outward), and the magnetization direction of the second magnetic element 3402 may be a direction along its inner side (side close to the first magnetic element 3401) outward (side far from the first magnetic element 3401). For another example, the magnetization direction of the first magnetic element 3401 may be a direction in which the outer side is directed toward the center, and the magnetization direction of the second magnetic element 3402 may be a direction in which the outer side (the side far from the first magnetic element 3401) is directed toward the inner side (the side near to the first magnetic element 3401).

In some embodiments, the placement of the first and second magnetic elements 3401 and 3402 may include different magnetic poles of the first and second magnetic elements 3401 and 3402 being close to or far from each other. For example, the N pole of the first magnetic element 3401 is located in the central region of the first magnetic element 3401, the S pole is located in the outer region of the first magnetic element 3401, that is, inside the first magnetic element 3401, on the same plane parallel to the upper surface or the lower surface of the first magnetic element 3401, and both the magnetic induction line or the magnetic field direction (that is, the S pole is directed in the N pole direction) are directed from the center to the outside; the N-pole of the second magnetic element 3402 is located in an outer region of the second magnetic element 3402, and the S-pole is located in an inner region of the second magnetic element 3402, that is, inside the second magnetic element 3402, on the same plane parallel to the upper surface or the lower surface of the second magnetic element 3402, both the magnetic induction line or the magnetic field direction (that is, the S-pole is directed in the N-pole direction) are directed inward toward the outside. For another example, the S-pole of the first magnetic element 3401 is located in the central region of the first magnetic element 3401, and the N-pole is located in the outer region of the first magnetic element 3401, that is, inside the first magnetic element 3401, on the same plane parallel to the upper surface or the lower surface of the first magnetic element 3401, the magnetic induction lines or the magnetic field directions (i.e., the S-pole is directed toward the N-pole direction) are all directed outward toward the inside; the S-pole of the second magnetic element 3402 is located in an outer region of the second magnetic element 3402, and the N-pole is located in an inner region of the second magnetic element 3402, that is, inside the second magnetic element 3402, on the same plane parallel to the upper surface or the lower surface of the second magnetic element 3402, the magnetic induction line or the magnetic field direction (i.e., the S-pole is directed in the N-pole direction) is directed outward toward the inside.

In some alternative embodiments, the first magnetic element 3401 may include two or more magnets, and the magnetization directions of the two or more magnets may be both directed to the second magnetic element 3402 (as shown in the figure, the magnetization directions of the left and right magnets of the first magnetic element 3401 are opposite, and are directed to the second magnetic element 3402, respectively).

In some embodiments, the second magnetic element 3402 may also include two or more magnets, the magnetization directions of both of which point outward from the inside of the second magnetic element 3402. In other embodiments, the magnetization direction of each magnetic element may be in other directions, and a combination of magnetic elements with different magnetization directions may also achieve the effect of increasing the strength of the magnetic field and/or making the strength distribution of the magnetic field more uniform.

Note that, in this embodiment, the horizontal direction can be understood as a direction perpendicular to the direction in which the voice coil vibrates, that is, a direction parallel to the plane in which the top surface of the first magnetic element 3401 is located. In addition, the magnetization directions of the first magnetic element 3401 and the second magnetic element 3402 may be parallel or may have a predetermined angle. The preset included angle may be set within a certain angle range, for example, 60 °, 80, 90 °, 100 °, and the like. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like. The relevant description about the magnetization directions of the first and second magnetic elements 3401 and 3402 may refer to the magnetization directions about the first and second magnetic elements 601 and 602 in fig. 6.

In some embodiments, the magnetic circuit assembly may further comprise a second magnetic permeable element 3404 and a third magnetic permeable element 3405. The bottom surface of the second magnetic conductive element 3404 is connected to the top surface of the second magnetic element 3402, and the top surface of the third magnetic conductive element 3405 is connected to the bottom surface of the second magnetic element 3402. In some embodiments, the first magnetic permeable element 3403 may be a cylinder, a cuboid, a triangular prism, or the like. The first magnetic element 3401, the second magnetic element 3402, the second magnetic conductive element 3404, and the third magnetic conductive element 3405 may be ring-shaped (continuous ring-shaped, discontinuous ring-shaped, rectangular ring-shaped, triangular ring-shaped, or the like). The second magnetic element 3402, the second magnetic permeable element 3404, and the third magnetic permeable element 3405 may be identical in shape and size in cross section perpendicular to the Z-axis. In some embodiments, the first magnetic element 3401 and the first magnetic permeable element 3403 may be the same in thickness. The sum of the thicknesses of the second magnetic element 3402, the second magnetic conductive element 3404, and the third magnetic conductive element 3405 may be equal to the thickness of the first magnetic element 3401, and may be equal to the thickness of the first magnetic conductive element 3403.

Fig. 35 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 34 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 34. As shown in fig. 35, the first magnetic conductive element 3405 reduces leakage flux of the magnetic circuit assembly, and the magnetic field strength is distributed relatively uniformly along the Z-axis compared to the magnetic circuit assembly of fig. 14.

Fig. 36 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 36, the magnetic circuit assembly 3600 may include a first magnetic element 3601, a second magnetic element 3602, a first magnetic permeable element 3603, a second magnetic permeable element 3604, and a third magnetic permeable element 3605. The present embodiment is different from the embodiment shown in fig. 34 in that the top of the third magnetic conductive element 3605 of the present embodiment is connected to the bottom surfaces of the first magnetic element 3601, the second magnetic element 3602, and the first magnetic conductive element 3603.

In some embodiments, the sum of the thicknesses of the second magnetic element 3602 and the second magnetic permeable element 3604 may be equal to the thickness of the first magnetic element 3601, and may be equal to the thickness of the first magnetic permeable element 3603.

Fig. 37 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 36 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 36. As shown in fig. 37, the intensity of the magnetic field is distributed relatively uniformly in the vicinity of the zero point of the Z axis (-0.091 to 0.232mm), and since the top of the third magnetic conductive element 3605 is connected to the bottom surfaces of the first magnetic element 3601, the second magnetic element 3602, and the first magnetic conductive element 3603, the magnetic field intensity in the vicinity of the zero point of the Z axis (for example, 0.232mm) is increased to approximately 0.68T compared to the magnetic circuit assembly of fig. 34.

Fig. 38 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 38, the magnetic circuit assembly 3800 may include a first magnetic element 3801, a second magnetic element 3802, a first magnetic conductive element 3803, a second magnetic conductive element 3804, a third magnetic conductive element 3805, and a fourth magnetic conductive element 3806. Compared with the embodiment shown in fig. 34, the present embodiment is different in that the present embodiment further includes a fourth magnetic conductive element 3806, and a top surface of the fourth magnetic conductive element 3806 is connected to both the first magnetic conductive element 3803 and the bottom surface of the first magnetic element 3801. The third and fourth magnetic permeable elements 3805, 3806 are spaced apart at a magnetic gap.

In some embodiments, the outer ring of the fourth magnetic permeable element 3806 and the first magnetic element 3801 may be identical in outer contour shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the third and fourth magnetic permeable elements 3805, 3806 may be the same in thickness, and the first magnetic permeable element 3803, first magnetic element 3801 and second magnetic element 3802 may be the same in thickness.

Fig. 39 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 38 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 38. As shown in fig. 39, the magnetic field strength is distributed uniformly around the zero point of the Z-axis (e.g., within a range of 0.227-0.5 mm), and due to the addition of the fourth magnetic conductive element 3806, the magnetic field strength around the zero point of the Z-axis (e.g., 0.109mm) is increased to about 0.54T compared to the magnetic circuit assembly of fig. 34.

Fig. 40 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 40, magnetic circuit assembly 4000 can include a first magnetic element 4001, a second magnetic element 4002, a first magnetic permeable element 4003, a second magnetic permeable element 4004, a third magnetic permeable element 4005, and a fourth magnetic permeable element 4006. This embodiment is different from the embodiment shown in fig. 36 in that this embodiment further includes a fourth magnetic permeable element 4006, and the bottom surface of the fourth magnetic permeable element 4006 is connected to both the top surfaces of the first magnetic element 4003 and the first magnetic element 4001.

In some embodiments, first, third, and fourth magnetic permeable elements 4003, 4005, and 4006 can be cylinders, cuboids, or triangular prisms, among others. The second magnetic conductive element 4004 may be ring-shaped (continuous ring-shaped, discontinuous ring-shaped, rectangular ring-shaped, triangular ring-shaped, etc.). First magnetic element 4001, second magnetic element 4002, and first magnetic permeable element 4003 may be the same in thickness, and second magnetic permeable element 4004 and fourth magnetic permeable element 4006 may be the same in thickness.

Fig. 41 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 40 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 40. As shown in fig. 40, the magnetic field is more symmetrical at the zero point of the intensity with respect to the Z axis, and due to the addition of the fourth magnetic permeable element 4006, the magnetic field intensity is reduced to approximately 0.52T in the vicinity of the zero point of the Z axis (e.g., 0.312mm) compared to the magnetic circuit assembly of fig. 36.

Fig. 42 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 42, magnetic circuit assembly 4200 may include a first magnetic element 4201, a second magnetic element 4202, a first magnetic permeable element 4203, a second magnetic permeable element 4204, a third magnetic permeable element 4205, a fourth magnetic permeable element 4206, and a fifth magnetic permeable element 4207. This embodiment is different from the embodiment shown in fig. 38 in that it further comprises a fifth magnetic permeable element 4207, and the bottom surface of fifth magnetic permeable element 4207 is connected to both the top surfaces of first magnetic permeable element 4203 and first magnetic element 4201. Fifth magnetic permeable element 4207 is spaced apart from second magnetic permeable element 4204 at a magnetic gap.

In some embodiments, the fourth and fifth magnetic permeable elements 4206 and 4207 may be identical in thickness and shape and size of a cross-section perpendicular to the Z-axis. The fifth magnetic permeable element 4207 and the second magnetic permeable element 4204 may be identical in thickness.

Fig. 43 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 42 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 42. As shown in fig. 43, the intensity distribution of the magnetic field is highly symmetric about the position of the zero point of the Z-axis, and due to the addition of fifth magnetic permeable element 4207, the magnetic field intensity near the zero point of the Z-axis (e.g., 0.151mm) is similar compared to the magnetic circuit assembly of fig. 38.

In the embodiments shown in fig. 34, 36, 38, 40, and 42, after the first magnetic element, the second magnetic element, and the first magnetic conductive element are provided, a person skilled in the art may further determine the number, the arrangement position, and the arrangement form of the magnetic conductive elements as needed, which is not limited in this application. For example, the fourth magnetic permeable element 4006 of the magnetic circuit assembly of the embodiment shown in fig. 40 may be connected to the second magnetic permeable element 4004.

Fig. 44 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 44, the magnetic circuit assembly may include a first magnetic element 4401, a first magnetic permeable element 4402 and a second magnetic permeable element 4403. The first magnetic element 4401 at least partially surrounds the second magnetic conductive element 4403, the first magnetic conductive element 4402 surrounds the first magnetic element 4401, and a magnetic gap is formed between the first magnetic element 4401 and the first magnetic conductive element 4402. A voice coil of the speaker may be disposed in the magnetic gap.

In some embodiments, the magnetization direction of the first magnetic element 4401 is parallel to the top surface (i.e., horizontal in the figure) of the first magnetic element 4401. In some embodiments, the magnetization direction of the first magnetic element 4401 points from the first magnetic element 4401 to the first magnetic permeable element 4402. In some embodiments, the magnetization direction of the first magnetic element 4401 points from the first magnetic element 4401 to the second magnetic permeable element 4403. Further description of the first magnetic element 4401 and its magnetization direction can refer to the detailed description of the first magnetic element 1401 in fig. 14.

Note that, in the present embodiment, the horizontal direction may be understood as a direction perpendicular to the direction in which the voice coil vibrates, i.e., a direction parallel to the plane in which the top surface of the first magnetic element 4401 is located. The connection mode between the magnetic conduction element and the magnetic element can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like.

In some embodiments, the second magnetic permeable element 4403 may be cylindrical or rectangular parallelepiped in shape. In some embodiments, the first magnetic element 4401, the first magnetic permeable element 4402, and the second magnetic permeable element 4403 can be the same in thickness.

Fig. 45 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 44 according to the present application. In the magnetic gap shown in fig. 44, the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 44. As shown in fig. 45, the maximum value of the intensity of the magnetic field (for example, the maximum value at the zero point position) is about 0.3T, the intensity of the magnetic field is distributed very uniformly along the Z axis, and the intensity of the magnetic field is highly symmetrical at the zero point position of the Z axis.

Fig. 46 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 46, the magnetic circuit assembly 4600 may include a first magnetic element 4601, a first magnetic permeable element 4602, a second magnetic permeable element 4603 and a third magnetic permeable element 4604. Compared with the embodiment shown in fig. 44, the present embodiment is different in that the present embodiment further includes a third magnetic permeable element 4604, and a top surface of the third magnetic permeable element 4604 is connected to bottom surfaces of the first magnetic permeable element 4602, the second magnetic permeable element 4603, and the first magnetic element 4601.

Fig. 47 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 46 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 46. As shown in fig. 47, the magnetic field strength is relatively uniform along the Z-axis (e.g., in the range of-0.041-0.500 mm), and due to the addition of the third magnetic permeable element 4604, the magnetic field strength near the zero point of the Z-axis (e.g., 0.348mm) is improved, approximately 0.43T, compared to the magnetic circuit assembly of fig. 44.

Fig. 48 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 48, the magnetic circuit assembly may include a first magnetic element 4801, a first magnetic conductive element 4802, a second magnetic conductive element 4803, and a third magnetic conductive element 4804. The present embodiment is different from the embodiment shown in fig. 44 in that the present embodiment further includes a third magnetic conductive element 4804, and the top surface of the third magnetic conductive element 4804 is connected to both the bottom surface of the first magnetic element 4801 and the bottom surface of the second magnetic conductive element 4803. The present embodiment is different from the embodiment shown in fig. 46 in that the top surface of the third magnetic permeable element 4804 of the present embodiment is connected to only the bottom surface of the second magnetic permeable element 4803 and the bottom surface of the first magnetic element 4801, and is not connected to the bottom surface of the first magnetic permeable element 4802.

In some embodiments, the third magnetic permeable element 4804 can be a cylinder, a cuboid, a triangular prism, or the like. The outer ring of the third magnetic permeable element 4804 and the first magnetic element 4801 may be identical in shape and size of the outer contour of the cross section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 4801 and the third magnetic conductive element 4804 can be equal to the thickness of the first magnetic conductive element 4802.

Fig. 49 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 48 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 48. As shown in fig. 48, the magnetic field strength is distributed relatively uniformly along the Z-axis, and due to the addition of the third magnetic permeable element 4804, the magnetic field strength is increased near the zero point of the Z-axis (e.g., -0.088mm) compared to the magnetic circuit assembly of fig. 44, which is approximately 0.34T.

Fig. 50 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 50, the magnetic circuit assembly 5000 may include a first magnetic element 5001, a first magnetically permeable element 5002, a second magnetically permeable element 5003, a third magnetically permeable element 5004 and a fourth magnetically permeable element 5005. Compared with the embodiment shown in fig. 48, the present embodiment further includes a fourth magnetic conductive element 5005, and the bottom surface of the fourth magnetic conductive element 5004 is connected to the top surface of the second magnetic conductive element 5003 and the top surface of the first magnetic element 5001.

In some embodiments, the fourth magnetic conductive element 5005 can be a cylinder, a cuboid, or the like, and the outer contour shape and size of the fourth magnetic conductive element 5005 and the outer ring of the first magnetic element 5001 in cross section perpendicular to the Z-axis can be the same. In some embodiments, the sum of the thicknesses of the fourth magnetic permeable element 5005 and the first magnetic element 5001 can be equal to the thickness of the first magnetic permeable element 5002 and equal to the thickness of the second magnetic permeable element 5003.

Fig. 51 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 50 according to the present application. In the magnetic gap, the intensity of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 50. As shown in fig. 50, the strength of the magnetic field is very uniformly distributed along the Z-axis, and due to the addition of the fourth magnetic permeable element 5005, the magnetic field strength near the zero point of the Z-axis (e.g., -0194mm) is reduced, approximately 0.3T, compared to the magnetic circuit assembly of fig. 48.

Fig. 52 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 52, the magnetic circuit assembly 5200 may include a first magnetic element 5201, a first magnetic element 5202, a second magnetic element 5203, a third magnetic element 5204, and a fourth magnetic element 5205. Compared with the embodiment shown in fig. 48, the present embodiment is different in that the present embodiment further includes a fourth magnetic permeable element 5205, and a bottom surface of the fourth magnetic permeable element 5205 is connected to a top surface of the second magnetic permeable element 5203 and a top surface of the first magnetic element 5201.

In some embodiments, the fourth magnetic permeable element 5205 may be a cylinder, a rectangular parallelepiped, a triangular prism, or the like, and the fourth magnetic permeable element 5205 and the third magnetic permeable element 5204 may be identical in shape and size in cross-section perpendicular to the Z-axis. In some embodiments, the sum of the thicknesses of the first magnetic element 5201, the third magnetic element 5204, and the fourth magnetic element 5205 may be equal to the thickness of the first magnetic element 5202.

Fig. 53 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 52 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 52. As shown in fig. 53, the highest value of the intensity of the magnetic field (e.g., the highest value at the-0.011 mm position) is similar, about 0.3T, as compared to the magnetic circuit assembly of fig. 48, but the intensity of the magnetic field is very uniformly distributed along the entire Z-axis.

In the embodiments shown in fig. 44, 46, 48, 50 and 52, on the basis of the first magnetic element, the first magnetic conductive element and the second magnetic conductive element, a person skilled in the art may further determine the number, the arrangement position and the arrangement form of the magnetic conductive elements as needed, which is not further limited in the present application. For example, the fourth magnetically permeable element 5005 of the magnetic circuit assembly of the embodiment shown in fig. 50 may be connected to the second magnetically permeable element 5003.

Fig. 54 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 54, the magnetic circuit assembly 5400 may include a first magnetic element 5401, a second magnetic element 5402, a third magnetic element 5403, a fourth magnetic element 5404, a fifth magnetic element 5405, a sixth magnetic element 5406, and a first magnetic permeable element 5407. The first magnetic element 5401 at least partially surrounds the first magnetic conductive element 5407, the second magnetic element 5402 surrounds the first magnetic element 5401, and a magnetic gap is formed between the outer ring of the first magnetic element 5401 and the second magnetic element 5402 (e.g., between the inner rings). A voice coil of the speaker may be disposed in the magnetic gap.

In some embodiments, the bottom surface of the third magnetic element 5403 is coupled to the top surface of the second magnetic element 5402 and the top surface of the fourth magnetic element 5404 is coupled to the bottom surface of the second magnetic element 5402. The bottom surface of the fifth magnetic element 5405 is connected to both the top surface of the first magnetic element 5401 and the top surface of the first magnetic conductive element 5407, and the top surface of the sixth magnetic element 5406 is connected to both the bottom surface of the first magnetic element 5401 and the bottom surface of the first magnetic conductive element 5407. The third magnetic element 5403 is spaced apart from the fifth magnetic element 5405 at the magnetic gap, and the fourth magnetic element 5404 is spaced apart from the sixth magnetic element 5406 at the magnetic gap.

In some embodiments, the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 are both parallel to the top surface (i.e., horizontal in the figure) or perpendicular to the inner and outer surfaces of the first magnetic element 5401 and/or the second magnetic element 5402, and the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 are parallel. For example, the magnetization direction of the first magnetic element 5401 is in a direction outward of its center (i.e., center is directed outward), and the magnetization direction of the second magnetic element 5402 is in a direction inward (side closer to the first magnetic element 5401) and directed outward (side farther from the first magnetic element 5401). For another example, the magnetization direction of the first magnetic element 5401 may be a direction in which the outer side is directed toward the center, and the magnetization direction of the second magnetic element 5402 may be a direction in which the outer side (the side far from the first magnetic element 5401) is directed toward the inner side (the side near to the first magnetic element 5401).

In some embodiments, the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404 are both perpendicular to the surface of the second magnetic element 5402 to which the third magnetic element 5403 and/or the fourth magnetic element 5404 are coupled (i.e., vertical in the figure, the direction of the arrow on each magnetic element in the figure represents the magnetization direction of the magnetic element), and the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404 are opposite.

In some embodiments, the magnetization directions of the fifth magnetic element 5405 and the sixth magnetic element 5406 are both perpendicular to the surface of the first magnetic element 5401 to which the fifth magnetic element 5405 or the sixth magnetic element 5406 is connected (i.e., the vertical direction in the figure, and the direction of the arrow on each magnetic element in the figure represents the magnetization direction of the magnetic element), and the magnetization directions of the fifth magnetic element 5405 and the sixth magnetic element 5406 are opposite.

In some embodiments, the placement of the third and fourth magnetic elements 5403 and 5404 may include the same magnetic poles of the third and fourth magnetic elements 5403 and 5404 being proximate to the second magnetic element 5402; the different magnetic pole is away from the second magnetic element 5402. For example, the N-pole of the third magnetic element 5403 is closer to the second magnetic element 5402 than the S-pole of the third magnetic element 5403 and the N-pole of the fourth magnetic element 5404 are to the S-pole of the fourth magnetic element 5404, i.e., both the magnetic induction lines and the magnetic field direction (i.e., the S-pole is directed in the N-pole direction) are directed toward the second magnetic element 5402 inside the third magnetic element 5403 and the third magnetic element 5403. For example, the S-pole of the third magnetic element 5403 is closer to the first magnetic conductive element 5407 than the N-pole of the third magnetic element 5403 and the S-pole of the fourth magnetic element 5404 is to the first magnetic conductive element 5407 than the N-pole of the fourth magnetic element 5404, that is, both the magnetic induction line and the magnetic field direction (i.e., the S-pole is directed in the N-pole direction) are away from the second magnetic element 5402 inside the third magnetic element 5403 and the fourth magnetic element 5404.

In some embodiments, the placement of the fifth and sixth magnetic elements 5405 and 5406 may include the same magnetic poles of the fifth and sixth magnetic elements 5405 and 5406 being proximate to the first magnetic permeable element 5407; the different magnetic pole is away from the first magnetic permeable element 5407. For example, the N-pole of the fifth magnetic element 5405 is closer to the first magnetic permeable element 5407 than the S-pole of the fifth magnetic element 5405 and the N-pole of the sixth magnetic element 5406 are to the S-pole of the sixth magnetic element 5406, that is, both the magnetic induction line and the magnetic field direction (that is, the S-pole is directed in the N-pole direction) are directed to the first magnetic permeable element 5407 inside the fifth magnetic element 5405 and the sixth magnetic element 5406. For example, the S-pole of the fifth magnetic element 5405 is closer to the first magnetic permeable element 5407 than the N-pole of the fifth magnetic element 5405 and the S-pole of the sixth magnetic element 5406 are to the N-pole of the sixth magnetic element 5406, that is, both the magnetic induction line and the magnetic field direction (i.e., the S-pole is directed to the N-pole direction) are away from the first magnetic permeable element 5407 inside the fifth magnetic element 5405 and the sixth magnetic element 5406.

By magnetizing the fifth magnetic element 5405 and the sixth magnetic element 5406 in opposition to each other, the directions of the magnetic induction lines generated by the fifth magnetic element 5405 and the sixth magnetic element 5406 in the magnetic gap can be made substantially the same, for example, both directed from the first magnetic conductive element 5407 to the second magnetic element 5402; or both from the second magnetic element 5402 to the first magnetic permeable element 5407, thereby increasing the magnetic field strength within the magnetic gap. In addition, by setting the magnetization directions of the third magnetic element 5403 and the fourth magnetic element 5404, the fifth magnetic element 5405 and the sixth magnetic element 5406, and the third magnetic element 5403 and the fifth magnetic element 5405 to be vertical and opposite, it is possible to suppress the magnetic field generated by the first magnetic element 5401 in the magnetic gap so that the magnetic induction lines corresponding to the magnetic field are distributed in the horizontal direction extending in the magnetic gap. For example, extending from the end of the first magnetic element 5401 in a horizontal or near horizontal direction in the magnetic gap. Like this, can make the magnetic field direction of voice coil loudspeaker voice coil position department in the magnetic gap mainly along horizontal direction or be close horizontal direction distribution, improve the homogeneity in magnetic field, can effectively improve the audio that the voice coil loudspeaker voice coil vibration produced. In other embodiments, the magnetization direction of each magnetic element may be in other directions, and a combination of magnetic elements with different magnetization directions may also achieve the effect of increasing the strength of the magnetic field and/or making the strength distribution of the magnetic field more uniform.

Note that, in this embodiment, the horizontal direction may be understood as a direction perpendicular to a direction in which the voice coil vibrates, i.e., a direction parallel to a plane in which the top surface of the first magnetic element 5401 is located, and the vertical direction may be understood as a direction in which the voice coil vibrates, i.e., a direction perpendicular to a plane in which the top surface of the first magnetic element 5401 is located.

In some embodiments, the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 may be parallel, the magnetization directions of the third magnetic element 5403, the fourth magnetic element 5404, the fifth magnetic element 5405, and the sixth magnetic element 5406 may be parallel, or there may be a predetermined angle, for example, the angle of the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 may be between 170 ° and 190 °. The relevant description about the magnetization directions of the first magnetic element 5401 and the second magnetic element 5402 can refer to the magnetization directions about the first magnetic element 601 and the second magnetic element 602 in fig. 6.

The third, fourth, fifth, and sixth magnetic elements 5403, 5404, 5405, and 5406 may form a magnetic shield field such that the strength of the magnetic field in the magnetic gap increases. The connection mode of the mutual connection between the magnetic elements can comprise one or more combinations of bonding, clamping, welding, riveting, bolt connection and the like.

In some embodiments, the first magnetic conductive element 5407, the fifth magnetic element 5405, and the sixth magnetic element 5406 can be cylinders, cuboids, or triangular prisms, among others. The first magnetic element 5401, the second magnetic element 5402, the third magnetic element 5403, and the fourth magnetic element 5404 may be ring-shaped (continuous ring-shaped, discontinuous ring-shaped, rectangular ring-shaped, triangular ring-shaped, or the like).

In some embodiments, the second magnetic element 5402, the third magnetic element 5403, and the fourth magnetic element 5404 may be identical in shape and size in cross-section perpendicular to the Z-axis. The outer ring of the first magnetic element 5401, the fifth magnetic element 5405, and the sixth magnetic element 5406 may be identical in outer contour shape and size of a cross section perpendicular to the Z-axis. In some embodiments, the first magnetic conductive element 5407, the first magnetic element 5401, and the second magnetic element 5402 can be the same in thickness, the third magnetic element 5403 and the fifth magnetic element 5405 can be the same in thickness, and the fourth magnetic element 5404 and the sixth magnetic element 5406 can be the same in thickness.

Fig. 55 is a schematic view of the variation of magnetic field strength of the magnetic circuit assembly shown in fig. 54 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured along the Z-axis direction shown in fig. 55. As shown in fig. 55, the magnetic shield field is formed due to the added magnetic elements, the intensity of the magnetic field is highly symmetrical about the zero point of the Z-axis, and the intensity of the magnetic field is high.

Fig. 56 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present application. As shown in fig. 56, the magnetic circuit assembly includes a first magnetic element 5601, a second magnetic element 5602, a third magnetic element 5603, a fourth magnetic element 5604, a fifth magnetic element 5605, a sixth magnetic element 5606, and a first magnetic permeable element 5607. The present embodiment differs from the embodiment illustrated in figure 54 in that the size of the inner ring of the third magnetic element 5603 is smaller than the size of the inner ring of the second magnetic element 5602, the size of the inner ring of the fourth magnetic element 5604 is smaller than the size of the inner ring of the second magnetic element 5602, the size of the outer ring of the fifth magnetic element 5605 is larger than the size of the outer ring of the first magnetic element 5601, and the size of the outer ring of the sixth magnetic element 5606 is larger than the size of the outer ring of the first magnetic element 5601. With this arrangement, the fifth magnetic element 5605 and the sixth magnetic element 5606 are projected toward the magnetic gap with respect to the first magnetic element 5601, and the third magnetic element 5603 and the fourth magnetic element 5604 are projected toward the magnetic gap with respect to the second magnetic element 5602.

Fig. 57 is a schematic view of the magnetic field strength variation of the magnetic circuit assembly shown in fig. 56 according to the present application. In the magnetic gap, the strength of the magnetic field at each point in the Z-axis direction is measured in the Z-axis direction shown in fig. 56. As shown in fig. 57, since the added magnetic elements form a magnetic shielding field, the strength of the magnetic field is highly symmetrical about the zero point of the Z-axis, and the overall strength of the magnetic field is higher than in the embodiment shown in fig. 54.

Fig. 58 and 59 are each a cross-sectional schematic view of a magnetic element structure according to some embodiments of the present application. The magnetic element may be adapted for use in any magnetic circuit assembly herein consisting of a magnetic circuit element and a magnetic conducting element.

As shown, the cross-section of the interior-located magnetic element may be circular (e.g., magnetic element 661 of fig. 58), elliptical, rectangular (e.g., magnetic element 681 of fig. 59), triangular, any polygonal, etc. The surrounding magnetic elements may be annular, such as circular (e.g., magnetic element 662 of fig. 58), elliptical, rectangular (e.g., magnetic element 682 of fig. 59), triangular, any polygonal, etc.

A magnetic gap is formed between magnetic element 661 and magnetic element 662. The magnetic element may include an inner ring and an outer ring. In some embodiments, the shape of the inner ring and/or the outer ring may be circular, elliptical, triangular, quadrilateral, or any other polygon. In addition, the magnetic circuit assembly in the embodiment shown in fig. 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32 may be provided in a structure similar to that shown in fig. 58; the magnetic circuit assemblies in the embodiments of fig. 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54 may each be configured similarly to that shown in fig. 59.

In some embodiments, the magnetization direction of magnetic element 661 can radiate outward from the center and the magnetization direction of magnetic element 662 can point outward from its inner side. In some embodiments, the magnetic elements 681 are constructed of different magnets, each having a magnetization direction that points toward the side of the magnetic element 682 opposite thereto.

FIG. 60 is a schematic diagram of a magnetic element structure according to some embodiments of the present application. The magnetic element may be adapted for use in any magnetic circuit assembly herein consisting of a magnetic circuit element and a magnetic conducting element. As shown, the magnetic element may be comprised of a plurality of magnet arrangements. The two ends of any one of the magnets can be connected with the two ends of the adjacent magnet or have a certain distance. The spacing between the plurality of magnets may be the same or different. In some embodiments, the magnetic elements may be comprised of 2 or 3 magnets (e.g., magnets 671, 672 and 673) in sheet form arranged equidistantly. The shape of the sheet-shaped magnet may be a sector, a quadrangle, or the like.

In addition to the above embodiments, in order to further increase the strength of the magnetic field in the magnetic gap, the magnetic circuit assembly may further include other structures (as shown in fig. 61 and 62) to make the strength of the magnetic field in the magnetic gap greater. The embodiment shown in fig. 61 and 62 can be combined with the embodiment shown in the foregoing by those skilled in the art according to the practical use requirement of the loudspeaker, so that the strength of the magnetic field in the magnetic gap is larger and the distribution is more uniform.

Fig. 61 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown in fig. 61, the magnetic circuit assembly 6100 may include a first magnetic element 6101, a first magnetic element 6102, a second magnetic element 6103, and a second magnetic element 6104. In some embodiments, the first magnetic element 6101 and/or the second magnetic element 6104 may include any one or more of the magnets described herein. In some embodiments, the first magnetic element 6101 may comprise a first magnet, and the second magnetic element 6104 may comprise a second magnet, which may be the same or different. The first magnetic permeable element 6102 and/or the second magnetic permeable element 6103 may comprise any one or more of the magnetic permeable materials described herein. The processing method of the first magnetic conductive element 6102 and/or the second magnetic conductive element 6103 may include any one or more of the processing methods described in this application. In some embodiments, the first magnetic element 6101 and/or the first magnetic permeable element 6102 may be arranged in an axisymmetric configuration. For example, the first magnetic element 6101 and/or the first magnetic conductive element 6102 may be a cylinder, a rectangular parallelepiped, or a hollow ring shape (e.g., a shape with a racetrack cross section).

In some embodiments, the first magnetic element 6101 and the first magnetic permeable element 6102 can be coaxial cylinders, containing the same or different diameters. In some embodiments, the second magnetic permeable element 6103 can be a groove-type structure. The groove-type structure may comprise a U-shaped cross-section (as shown in fig. 61). The groove type second magnetic conductive element 6103 may include a bottom plate and a side wall. In some embodiments, the bottom plate and the side walls may be integrally formed, for example, the side walls may be formed by the bottom plate extending in a direction perpendicular to the bottom plate.

In some embodiments, the bottom panel may be connected to the side walls by any one or more of the connection means described herein. The second magnetic element 6104 may be configured to be ring-shaped or sheet-shaped. Reference may be made to the description elsewhere in the specification regarding the shape of the second magnetic element 6104. In some embodiments, the second magnetic element 694 can be coaxial with the first magnetic element 6101 and/or the first magnetic permeable element 6102.

The upper surface of the first magnetic element 6101 may be connected to the lower surface of the first magnetic conductive element 6102. The lower surface of the first magnetic element 6101 may be connected to the bottom plate of the second magnetic conductive element 6103. The lower surface of the second magnetic element 6104 is connected to the sidewall of the second magnetic conductive element 6103. The connection manner between the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and/or the second magnetic element 6104 may include one or more combinations of bonding, snapping, welding, riveting, bolting, and the like.

A magnetic gap is formed between the first magnetic element 6101 and/or the first magnetic conductive element 6102 and the inner ring of the second magnetic element 6104. A voice coil 6105 may be disposed in the magnetic gap. In some embodiments, the heights of the second magnetic element 6104 and the voice coil 6105 are equal to each other with respect to the bottom plate of the second magnetic conductive element 6103. In some embodiments, the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and the second magnetic element 6104 may form a magnetic circuit.

In some embodiments, the magnetic circuit assembly may generate a full magnetic field (which may also be referred to as "total magnetic field of the magnetic circuit assembly"), and the first magnetic element 6101 may generate the first magnetic field. The full magnetic field is formed by all components in the magnetic circuit assembly (e.g., the magnetic fields generated by the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and the second magnetic element 6104. the magnetic field strength (which may also be referred to as magnetic induction or magnetic flux density) of the full magnetic field in the magnetic gap is greater than the magnetic field strength of the first magnetic field in the magnetic gap. in some embodiments, the second magnetic element 6104 may generate a second magnetic field, the second magnetic field may increase the strength of the full magnetic field at the magnetic gap, where increasing the strength of the full magnetic field means, the magnetic field strength of the full magnetic field at the magnetic gap in the presence of the second magnetic field (i.e., in the presence of the second magnetic element) is greater than the magnetic field strength of the full magnetic field at the magnetic gap in the absence of the second magnetic field (i.e., in the absence of the second magnetic element).

In other embodiments in this specification, unless otherwise specified, the magnetic circuit assembly indicates a structure including all the magnetic elements and the magnetic conductive element, the full magnetic field indicates a magnetic field generated by the magnetic circuit assembly as a whole, and the first magnetic field, the second magnetic field, the third magnetic field, … …, and the nth magnetic field each indicate a magnetic field generated by the corresponding magnetic element. In different embodiments, the magnetic elements that generate the second magnetic field (or the third magnetic field, … …, nth magnetic field) may be the same or different.

In some embodiments, the angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is between 0 degrees and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is between 45 degrees and 145 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 6101 is vertical upward (the direction shown in a) perpendicular to the lower surface or the upper surface of the first magnetic element 6101, and the magnetization direction of the second magnetic element 6104 is directed from the inner ring (inner surface) to the outer ring (outer surface) of the second magnetic element 6104 (as shown in b, the magnetization direction of the first magnetic element is shifted 90 degrees in the clockwise direction on the right side of the first magnetic element).

In some embodiments, at the position of the second magnetic element 6104, the angle between the direction of the full magnetic field and the magnetization direction of the second magnetic element 6104 is not higher than 90 degrees. In some embodiments, at the position of the second magnetic element 6104, an angle between the direction of the magnetic field generated by the first magnetic element 6101 and the magnetization direction of the second magnetic element 6104 may be an angle of 0 degree, 10 degrees, 20 degrees, or the like that is less than or equal to 90 degrees. Compared with the magnetic circuit assembly with a single magnetic element, the second magnetic element 6104 can increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly in fig. 60, thereby increasing the magnetic induction in the magnetic gap. Moreover, under the action of the second magnetic element 6104, the originally divergent magnetic induction lines converge toward the position of the magnetic gap, thereby further increasing the magnetic induction intensity in the magnetic gap.

The above description of the structure of the magnetic circuit assembly is merely a specific example and should not be considered as the only possible embodiment. It is clear that, having knowledge of the basic principles of the magnetic circuit assembly, it is possible for a person skilled in the art to carry out various modifications and variants in form and detail of the specific modes and steps of implementation of the magnetic circuit assembly without departing from such principles, but these modifications and variants remain within the scope of the above description. For example, the second magnetic permeable element 6103 may be an annular structure or a sheet structure. For another example, the magnetic circuit assembly of fig. 61 may further include a magnetic conductive cover, which may surround the first magnetic element 6101, the first magnetic element 6102, the second magnetic element 6103, and the second magnetic element 6104.

Fig. 62 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly according to some embodiments of the present application. As shown, unlike the magnetic circuit assembly of fig. 61, the magnetic circuit assembly may further include a third magnetic element. The upper surface of the third magnetic element 6205 is connected to the second magnetic element 6204, and the lower surface is connected to the sidewall of the second magnetic conductive element 6203. The first magnetic element 6201, the first magnetic permeable element 6202, the second magnetic element 6204, and/or the third magnetic element 6205 may form a magnetic gap therebetween. Voice coil 6209 may be disposed in the magnetic gap. In some embodiments, the first magnetic element 6201, the first magnetic element 6202, the second magnetic element 6203, the second magnetic element 6204, and the third magnetic element 6205 may form a magnetic loop. In some embodiments, the magnetization direction of the second magnetic element 6204 can be referred to the detailed description of fig. 52 of the present application.

In some embodiments, the magnetic circuit assembly may generate a first full magnetic field and the first magnetic element 701 may generate a second magnetic field, the first full magnetic field having a greater magnetic field strength within the magnetic gap than the second magnetic field strength within the magnetic gap. In some embodiments, the third magnetic element 6205 may generate a third magnetic field that may increase the magnetic field strength of the second magnetic field at the magnetic gap.

In some embodiments, the angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is between 0 and 180 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is between 45 and 145 degrees. In some embodiments, the angle between the magnetization direction of the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 is equal to or greater than 90 degrees. In some embodiments, the magnetization direction of the first magnetic element 6201 is perpendicular to the lower or upper surface of the first magnetic element 6201 and is directed upward (as shown in the direction of a), and the magnetization direction of the third magnetic element 6205 is directed from the upper surface of the third magnetic element 6205 to the lower surface (as shown in the direction of c, on the right side of the first magnetic element, the magnetization direction of the first magnetic element is shifted 180 degrees in the clockwise direction).

In some embodiments, at the location of the third magnetic element 6205, the angle between the direction of the full magnetic field and the magnetization direction of the third magnetic element 6205 is no higher than 90 degrees. In some embodiments, at the location of the third magnetic element 6205, the angle between the direction of the magnetic field generated by the first magnetic element 6201 and the magnetization direction of the third magnetic element 6205 may be an angle less than or equal to 90 degrees, such as 0 degrees, 10 degrees, 20 degrees, and the like.

The magnetic circuit assembly of fig. 62 further adds a third magnetic element 6205, as compared to the magnetic circuit assembly of fig. 61. The third magnetic element 6205 may further increase the total magnetic flux in the magnetic gap in the magnetic circuit assembly, thereby increasing the magnetic induction in the magnetic gap. Further, under the action of the third magnetic element 6205, the magnetic induction lines further converge to the position of the magnetic gap, and the magnetic induction intensity in the magnetic gap is further increased.

The above description of the structure of the magnetic circuit assembly is merely a specific example and should not be considered as the only possible embodiment. It is clear that, with knowledge of the basic principle of the magnetic circuit assembly, it is possible for a person skilled in the art to make various modifications and variations in form and detail of the specific ways and steps of implementing the magnetic circuit assembly without departing from this principle, but these modifications and variations are still within the scope of what has been described above. For example, the second magnetically permeable element may be an annular structure or a sheet structure. For another example, the magnetic circuit assembly may not include the second magnetically permeable element. For another example, the magnetic circuit assembly may further add at least one magnetic element. In some embodiments, the lower surface of the further magnetic element may be connected to the upper surface of the second magnetic element. The magnetization direction of the further added magnetic element is opposite to the magnetization direction of the third magnetic element. In some embodiments, the further magnetic element may be connected to the side walls of the first and second magnetic conductive elements. The magnetization direction of the further added magnetic element is opposite to the magnetization direction of the second magnetic element. For other magnetic circuit structures capable of increasing the strength of the magnetic field in the magnetic gap, refer to PCT application No. PCT/CN2018/071851 filed on 8/1/2018, the entire contents of which are incorporated by reference in the present application and will not be described herein again.

Fig. 63 is a longitudinal cross-sectional schematic view of a magnetic circuit assembly shown in accordance with some embodiments of the present description. In some embodiments, as shown in fig. 63, the magnetic circuit assembly 6300 may include a first magnetic element 6301, a second magnetic element 6302, a first magnetic conductive element 6303, a second magnetic conductive element 6304, and a third magnetic conductive element 6305. The second magnetic element 6302 surrounds the first magnetic element 6301, forming a magnetic gap between the first magnetic element 6301 and the second magnetic element 6302. A voice coil of the speaker may be disposed in the magnetic gap. The bottom surface of the first magnetic conductive element 6303 is connected to the top surface of the second magnetic element 6302, the bottom surface of the second magnetic conductive element 6304 is connected to the top surface of the first magnetic element 6301, and the top surface of the third magnetic conductive element 6305 is connected to the top surface of the first magnetic element 6301 and the top surface of the second magnetic element 6302. The magnetization directions of the first magnetic element 6301 and the second magnetic element 6302 both extend along the vertical direction, and the magnetization direction of the first magnetic element 6301 is opposite to the magnetization direction of the second magnetic element 6302. In some embodiments, the N-pole of the first magnetic element 6301 is directed toward the second magnetic conductive element 6304 (i.e., upward in fig. 71), and the N-pole of the second magnetic element 6302 is directed toward the third magnetic conductive element 6305 (i.e., downward in fig. 71).

Fig. 64 is a graph comparing frequency response curves of a speaker according to the present application using the magnetic circuit assembly shown in fig. 63 and 56, respectively. As shown in fig. 64, in the speaker using the magnetic circuit assembly (which may also be called a super linear magnetic circuit) shown in fig. 56, compared with the speaker using the magnetic circuit assembly (which may also be called a conventional magnetic circuit) shown in fig. 63, the speaker using the magnetic circuit assembly shown in fig. 63 has a higher sound volume in each frequency band of sound, and changes in low and high frequency ranges are more gradual, the overall frequency response is more linear, and the sound quality is better.

Having thus described the basic concept, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only, and is not intended to limit the present application. Various modifications, improvements and adaptations to the present application may occur to those skilled in the art, although not explicitly described herein. Such modifications, improvements and adaptations are proposed in the present application and thus fall within the spirit and scope of the exemplary embodiments of the present application.

Also, this application uses specific language to describe embodiments of the application. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with at least one embodiment of the application. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, certain features, structures, or characteristics may be combined as suitable in one or more embodiments of the application.

Further, those skilled in the art will appreciate that aspects of the present application may be illustrated and described in terms of several patentable species or situations, including any new and useful process, machine, manufacture, or composition of matter, or any new and useful improvement thereof. Accordingly, various aspects of the present application may be embodied entirely in hardware, entirely in software (including firmware, resident software, micro-code, etc.) or in a combination of hardware and software. The above hardware or software may be referred to as "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the present application may be represented as a computer product, including computer readable program code, embodied in one or more computer readable media.

Additionally, the order in which elements and sequences of the processes are recited in the present application, the use of alphanumeric or other designations, is not intended to limit the order of the processes and methods in the present application, unless otherwise indicated in the claims. While various presently contemplated embodiments of the invention have been discussed in the foregoing disclosure by way of example, it is to be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.

Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.

Numerals describing the number of components, attributes, etc. are used in some embodiments, it being understood that such numerals used in the description of the embodiments are modified in some instances by the use of the modifier "about", "approximately" or "substantially", etc. Unless otherwise indicated, "about", "approximately" or "substantially" indicates that the number allows a variation of ± 20%. Accordingly, in some embodiments, the numerical data used in the specification and claims are approximations that may vary depending upon the desired properties of the individual embodiments. In some embodiments, numerical data should take into account the specified significant digits and employ a general digit preservation approach. Notwithstanding that the numerical ranges and data setting forth the broad scope of the range in some embodiments of the application are approximations, in specific embodiments, such numerical values are set forth as precisely as possible within the scope of the application.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the present application. Thus, by way of example, and not limitation, alternative configurations of the embodiments of the present application can be viewed as being consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to only those embodiments explicitly described and depicted herein.

Claims (27)

1. An acoustic device, characterized by: the method comprises the following steps:

   the shell is provided with a first accommodating cavity;

   the speaker, set up in first holding intracavity, the speaker includes: the voice coil is arranged on the magnetic circuit component; the magnetic circuit component forms a magnetic gap; one end of the voice coil is arranged in the magnetic gap, the other end of the voice coil is connected with the vibration assembly, the vibration assembly is connected with the vibration transmission plate, and the vibration transmission plate is connected with the shell.
2. An acoustic device according to claim 1, wherein: the vibration assembly comprises an inner support, an outer support and a vibration plate;

   the other end of the voice coil is connected with the inner support;

   one end of the outer bracket is physically connected with two sides of the magnetic circuit component;

   the vibrating piece is physically connected with the inner support and the outer support and used for limiting the relative movement of the inner support and the outer support in a first direction; the first direction is the radial direction of the accommodating cavity;

   at least one of the inner holder, the outer holder and the vibration plate is connected to the vibration transmission plate so that vibration is transmitted to the vibration transmission plate.
3. An acoustic device according to claim 2, wherein:

   the outer support and the inner support are movably connected with the vibrating piece so as to limit the relative movement of the outer support and the inner support along the first direction and allow the inner support and the vibrating piece to move relative to the outer support in the second direction; the second direction is an extending direction of the inner stent and the outer stent.
4. An acoustic device according to claim 3, wherein:

   the other end of the outer support is provided with a first convex column, the vibrating piece is provided with a first through hole, and the first convex column is movably connected with the vibrating piece through the first through hole.
5. An acoustic device according to claim 3, wherein:

   one end of the inner support is provided with a second convex column, the vibrating piece is provided with a second through hole, and the second convex column is movably connected with the vibrating piece through the second through hole.
6. An acoustic device according to claim 5, wherein:

   the loudspeaker further comprises an elastic damping sheet, wherein the elastic damping sheet is arranged between the vibration transmission plate and one end of the inner support to reduce the vibration of the inner support in the second direction.
7. An acoustic device according to claim 6, wherein:

   the second convex column comprises a first column section and a second column section which are physically connected, and the second column section is arranged above the first column section; the first column section penetrates through the second through hole, and the second column section is inserted into the vibration transmission plate;

   the elastic damping piece is provided with a third through hole, and the elastic damping piece is sleeved on the second column section through the third through hole and supported on the first column section.
8. An acoustic device according to claim 1, wherein: also includes a protective element;

   the protective element comprises a fitting part, an accommodating part and a supporting part, and the fitting part and the accommodating part form a second accommodating cavity;

   the vibration transmission plate is arranged in the second accommodating cavity, the attaching portion is attached to the outer end face of the vibration transmission plate, and the supporting portion is connected to the second accommodating cavity and arranged above the shell.
9. An acoustic device according to claim 8, wherein:

   the inner wall of the shell is provided with an annular bearing platform used for supporting the annular supporting part and the elastic damping sheet.
10. An acoustic device according to claim 1, wherein:

    the magnetic circuit component comprises a magnetic element group and a magnetic conduction cover;

    the magnetic conduction cover comprises a cover body bottom, a cover body side part and a cylindrical groove, and the cylindrical groove is formed by the cover body bottom and the cover body side part;

    the magnetic element group is arranged in the cylinder groove and forms the magnetic gap with the magnetic conduction cover.
11. An acoustic device according to claim 10, wherein: the fixing piece is used for fixing the magnetic element group at the bottom of the cover body;

    the fixing piece comprises a bolt and a nut, the bolt penetrates through the magnetic element group in sequence and then penetrates out of the bottom of the cover body, and the magnetic element group and the bottom of the cover body are fixedly connected through threaded connection.
12. An acoustic device according to claim 11, wherein:

    the inner support forms a cover groove, the magnetic element group partially extends into the cover groove, and the outer support is arranged in a cylindrical shape.
13. An acoustic device according to claim 1, wherein:

    the magnetic circuit assembly comprises a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap;

    the first magnetic circuit assembly includes a first magnetic element and a second magnetic element, and a total magnetic field generated by the magnetic circuit assembly has a magnetic field strength within the magnetic gap that is greater than a magnetic field strength of the first magnetic element or the second magnetic element within the magnetic gap.
14. An acoustic device according to claim 13, wherein: the included angle between the magnetization directions of the first magnetic element and the second magnetic element is 150-180 degrees.
15. The acoustic device of claim 13, wherein the magnetization directions of the first and second magnetic elements are opposite.
16. An acoustic device according to claim 15, wherein: the magnetization directions of the first magnetic element and the second magnetic element are perpendicular to or parallel to the vibration direction of the voice coil in the magnetic gap.
17. An acoustic device according to claim 13, wherein:

    the second magnetic circuit assembly comprises a third magnetic element, and the first magnetic circuit assembly comprises a first magnetic conductive element;

    the first magnetic conductive element is disposed between the first magnetic element and the second magnetic element, and the third magnetic element is disposed at least partially around the first magnetic element and the second magnetic element.
18. An acoustic device according to claim 17, wherein: the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface where the first magnetic element is connected with the first magnetic conduction element, and the magnetization directions of the first magnetic element and the second magnetic element are opposite.
19. An acoustic device according to claim 17, wherein: and the included angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element is 60-120 degrees.
20. An acoustic device in accordance with claim 17, wherein: and an included angle between the magnetization direction of the third magnetic element and the magnetization direction of the first magnetic element or the magnetization direction of the second magnetic element is 0-30 degrees.
21. An acoustic device according to claim 13, wherein:

    the second magnetic assembly comprises a first magnetic conductive element and the first magnetic assembly comprises a second magnetic conductive element;

    the second magnetic conductive element is arranged between the first magnetic element and the second magnetic element; the first magnetic conductive element is disposed at least partially around the first magnetic element and the second magnetic element.
22. An acoustic device according to claim 21, wherein: the magnetization direction of the first magnetic element and the magnetization direction of the second magnetic element are both perpendicular to the surface where the first magnetic element and the second magnetic conductive element are connected, and the magnetization direction of the first magnetic element is opposite to the magnetization direction of the second magnetic element.
23. An acoustic device according to claim 21, wherein: the second magnetic conductive element is arranged to surround the first magnetic element, and the first magnetic element surrounds the second magnetic element.
24. An acoustic device according to claim 21, wherein: the upper surface of the second magnetic conduction element is connected with the lower surface of the first magnetic element, and the lower surface of the second magnetic conduction element is connected with the upper surface of the second magnetic element.
25. An acoustic device according to claim 1, wherein:

    the magnetic circuit assembly comprises a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap;

    the first magnetic circuit assembly comprises a first magnetic element and the second magnetic circuit assembly comprises a first magnetically permeable element;

    the first magnetic conductive element at least partially surrounds the first magnetic element;

    the magnetization direction of the first magnetic element is directed to the outer region of the first magnetic element from the central region of the first magnetic element or to the first magnetic element from the outer region of the first magnetic element.
26. An acoustic device according to claim 1, wherein:

    the magnetic circuit assembly comprises a first magnetic circuit assembly and a second magnetic circuit assembly, and the second magnetic circuit assembly surrounds the first magnetic circuit assembly to form the magnetic gap;

    the first magnetic circuit assembly comprises a first magnetic element and the second magnetic circuit assembly comprises a second magnetic element;

    the second magnetic element at least partially surrounds the first magnetic element;

    the magnetization direction of the first magnetic element is directed to the outer region of the first magnetic element from the central region of the first magnetic element or to the first magnetic element from the outer region of the first magnetic element.
27. An acoustic device in accordance with claim 26, wherein: the magnetization direction of the second magnetic element is directed to the inner ring of the second magnetic element from the outer ring of the second magnetic element or directed to the inner ring of the second magnetic element from the inner ring of the second magnetic element.

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