CN117393477A - 晶粒载体及其内部晶舟输送装置 - Google Patents

晶粒载体及其内部晶舟输送装置 Download PDF

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CN117393477A
CN117393477A CN202210779453.3A CN202210779453A CN117393477A CN 117393477 A CN117393477 A CN 117393477A CN 202210779453 A CN202210779453 A CN 202210779453A CN 117393477 A CN117393477 A CN 117393477A
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陈宏奇
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    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

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Abstract

本发明关于一种晶粒载体及其内部晶舟输送装置，包括一装载端口，该装载端口设于该主架的一支持架体，用以装载一容纳有晶舟的晶粒载体，并供将该晶粒载体以Y轴向推动；一载体定位输送机构，该载体定位输送机构由上而下设有相间隔的多层托架，本发明通过该载体定位输送机构的多层托架，可以将该晶粒载体以Z轴向位移；而当其中一托架的高度外部平台的第一轨道衔接时，通过该主动投料机构推移该晶粒载体内的晶舟移出该晶粒载体至该第一轨道，而该第一轨道又可以延长衔接至制程不同的目的地，因此可以简易使得该各个晶舟可以上轨而到达不同制程的目的地。

Description

晶粒载体及其内部晶舟输送装置
技术领域
本发明关于一种半导体制程相关设备，尤指一种晶粒载体及其内部晶舟输送装置。
背景技术
晶粒的产生在积体电路(integrated circuit，IC)制程中居于重要环节，其主要是先经IC设计，再经光罩制作，然后利用成像将设计的电路缩小至晶圆上，然后再经曝光，在晶圆产生逐颗的晶粒。而在制程中对于晶粒的支撑与承载，以便后续制程的衔接或是运送、贮存，主要是在利用一弹匣，该弹匣在自动化与一贯化的过程通常是与一装载端口相互衔接，而该弹匣内设置有一个或多个晶舟(boat)，而在现有技术中，公开号为TW202019797的中国台湾专利，揭示一种“用于搬运晶粒载体的装置”，依据其专利说明书，其所载“为了进一步提高半导体制造厂(FAB)中的工作效率和生产质量，本教示揭露了用于自动装载和卸载晶粒载体(例如，一种装有多个晶舟的弹匣)的装置和方法，使用多弹匣储存器(storage)和多线道变换器(multi-lane changer)，以将每个晶舟转移到与处理工具的流动通道对齐的相应通道，以处理晶舟中的晶粒。”并且根据其图1与配合的说明，可以理解该先前技术将第一线道变换器耦接到第一装载端口，并包含多个线道。前述第一装载端口可包含一推杆，推杆可操作以将来自所接收的晶粒载体的晶舟推动到第一线道变换器中的一输送器(conveyor)。输送器可沿Y方向和/或Z方向移动晶舟，以使晶舟与处理工具150的一入口(input)对齐。
可知该现有技术必须设有该线道变换器(第一线道变换器)，且该线道变换器与该装载端口(第一装载端口)必须能够“耦接”，而该晶粒载体以及其内部晶舟的轮廓也必须对应该构造的空间，才能符合缜密的系统以及匹配推杆的推送，因此构件都必须相互精准匹配，相对较无缓冲、弹性应用与变换规格的空间。
发明内容
有鉴于前述，本发明人认为应有一种改善的构造，为此设计一种晶粒载体及其内部晶舟输送装置，包括一装载端口，该装载端口设于该主架的一支持架体，用以装载一容纳有晶舟的晶粒载体，并供将该晶粒载体以Y轴向推动；一载体定位输送机构，该载体定位输送机构由上而下设有相间隔的多层托架，各层托架与相间隔的托架之间形成一暂存空间，该各层托架共设一升降机构，供将该晶粒载体以Z轴向位移；一平台，该平台设于该载体定位输送机构一侧方，且顶面设有X轴向的第一轨道；一主动投料机构，该主动投料机构设于该载体定位输送机构一侧方，供该载体定位输送机构其中一托架的高度与该第一轨道衔接时推移该晶粒载体内的晶舟移出该晶粒载体至该第一轨道。
本发明通过该载体定位输送机构的多层托架，可以将该晶粒载体以Z轴向位移；而当其中一托架的高度与该第一轨道衔接时，通过该主动投料机构推移该晶粒载体内的晶舟移出该晶粒载体至该第一轨道，而该第一轨道又可以延长衔接至制程不同的目的地，因此使得该各个晶舟可以上轨而到达不同制程的目的地。
且通过Z轴位移产生的纵向空间，可以让源源不断进入该装载端口的该晶粒载体有缓冲上轨的空间。
再者，即使该晶粒载体外部轮廓有所不同，只要该晶粒载体内的晶舟底部能够上轨的轨距能够匹配第一轨道，都可以达到令该晶舟到达预定的制程的目的地，而无须以相对精准而相对繁琐的线道变换器以及周边构造来变换第一轨道，同样本发明可以令该晶舟到达预定的制程的目的地。
附图说明
图1是本发明架设晶粒载体及晶舟立体示意图。
图2是本发明晶粒载体分解出载体门挡机构立体分解示意图。
图3是本发明侧面显示晶粒载体进程示意图。
图4是本发明载体定位输送机构承载晶粒载体作动示意图。
图5是本发明主动投料机构将晶舟推入第一轨道示意图。
图6是本发明设有多组轨道实施例示意图。
图7是本发明移动机构Y轴向移动示意图。
图号说明：
1.装载端口
2.晶粒载体
21.载体门挡机构
3.载体定位输送机构
30.托架
31.移动机构
33.升降机购
4.主动投料机构
5.晶舟
6.平台
61.第一轨道
62.第二轨道
7.支持架体
P.暂存空间。
具体实施方式
请参阅图1所示，本发明包括一种晶粒载体及其内部晶舟输送装置，包括：
一装载端口1：
该装载端口1设于一支持架体7，用以装载一容纳有晶舟5的晶粒载体2；如图3所示，并供将该晶粒载体2以Y轴向推动；该晶舟5纳设于该晶粒载体2，为一种治具，主要是保护晶粒不任意被接触及摩擦，故执行半导体制程时须将晶粒放在晶舟5上，并通过晶粒载体2为搬送移动的载体，且通过该晶舟5能一次性运送多个晶粒而较有效率。
一载体定位输送机构3：
该载体定位输送机构3由上而下设有相间隔的多层托架30，各层托架30与相间隔的托架30之间形成一暂存空间P，该各层托架30共设一升降机构33，供将该晶粒载体2以Z轴向位移。
一平台6：
该平台6设于该载体定位输送机构3一侧方，且顶面设有一X轴向的第一轨道61。
一主动投料机构4：
该主动投料机构4设于该载体定位输送机构3一侧方，供该载体定位输送机构3其中一托架30的高度与该第一轨道61衔接时，推移该晶粒载体2内的晶舟5移出该晶粒载体2至该第一轨道61。该主动投料机构4可以为夹持机具或是如图例所示以压缸动力推出机构。
请参阅图2所示，为避免该晶粒载体2内的该晶舟5脱出，通常于该晶粒载体2朝向该第一轨道的一侧邻边，设有一载体门挡机构21，防止该晶粒载体2内固持的该晶舟5脱出。该载体门挡机构21可以为一种可轻易拆装的构造以便于作业中选择性拆装。
请参阅图4与图5所示，本发明通过该载体定位输送机构3的多层托架30，可以将该晶粒载体2以Z轴向位移。而当其中一托架30的高度与该第一轨道61平高而可以将该晶舟5输送至该第一轨道61，通过该主动投料机构4推移该晶粒载体2内的晶舟5移出该晶粒载体2至该第一轨道61，以该主动投料机构4为压缸动力推出机构为例。而该第一轨道61又可以衔接至制程预设的目的地(可选择)，因此使得该各个晶舟5可以上轨而到达制程预设的目的地。
且通过Z轴位移产生的纵向空间，可以让源源不断进入该装载端口1的该晶粒载体2有缓冲上轨的暂存空间P。再者，即使该晶粒载体2外部轮廓有所不同，只要该晶粒载体2内的晶舟5底部能够上轨的轨距能够匹配第一轨道61，都可以达到令该晶舟5到达预定的制程的目的地，而无须以相对精准而相对繁琐的线道变换器以及周边构造来变换第一轨道61，简易令该晶舟5到达预定的制程的目的地。
本发明较佳实施例，其中该载体定位输送机构3底部设有一Y轴向的移动机构31，该移动机构31可对该载体定位输送机构3作Y方向的移动与定位，如图6与图7所示，用于当该平台6上更设有平行相隔的第二轨道62时，可以调整对应所需对应的第二轨道62，而该第二轨道62又可以衔接至制程预设的目的地(可选择)。

Claims (3)

1.一种晶粒载体及其内部晶舟输送装置，其特征在于，包括：
一装载端口，该装载端口设于一支持架体，用以装载一容纳有晶舟的晶粒载体，并供将该晶粒载体以Y轴向推动；
一载体定位输送机构，该载体定位输送机构由上而下设有相间隔的多层托架，各层托架与相间隔的托架之间形成一暂存空间，该各层托架共设一升降机构，供将该晶粒载体以Z轴向位移；
一平台，该平台设于该载体定位输送机构一侧方，且顶面设有X轴向的第一轨道；
一主动投料机构，该主动投料机构设于该载体定位输送机构一侧方，供该载体定位输送机构其中一托架的高度与该第一轨道衔接时，推该晶粒载体内的晶舟移出该晶粒载体至该第一轨道。
2.如权利要求1所述的晶粒载体及其内部晶舟输送装置，其特征在于，其中该平台顶面还设有与该第一轨道平行相间隔的第二轨道；且该载体定位输送机构底部设有一Y轴向的移动机构。
3.如权利要求1所述的晶粒载体及其内部晶舟输送装置，其特征在于，其中该主动投料机构为夹持机具或以压缸动力推出机构。
CN202210779453.3A 2022-07-04 2022-07-04 晶粒载体及其内部晶舟输送装置 Pending CN117393477A (zh)

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