CN117388671A - System board, burn-in test system and burn-in test equipment - Google Patents

System board, burn-in test system and burn-in test equipment Download PDF

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Publication number
CN117388671A
CN117388671A CN202311519497.3A CN202311519497A CN117388671A CN 117388671 A CN117388671 A CN 117388671A CN 202311519497 A CN202311519497 A CN 202311519497A CN 117388671 A CN117388671 A CN 117388671A
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China
Prior art keywords
power supply
system board
signal
unit
assembly
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Pending
Application number
CN202311519497.3A
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Chinese (zh)
Inventor
曾泉
何海平
苏鹏
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Sky Chip Interconnection Technology Co Ltd
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Sky Chip Interconnection Technology Co Ltd
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Application filed by Sky Chip Interconnection Technology Co Ltd filed Critical Sky Chip Interconnection Technology Co Ltd
Priority to CN202311519497.3A priority Critical patent/CN117388671A/en
Publication of CN117388671A publication Critical patent/CN117388671A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The application discloses a system board, a burn-in test system and burn-in test equipment, wherein the system board comprises a substrate, a control unit, a power supply assembly, an excitation generating assembly and a detection assembly, wherein the control unit, the power supply assembly, the excitation generating assembly and the detection assembly are arranged on the substrate and are electrically connected through a plurality of interfaces; the control unit is used for generating a power supply signal and a configuration signal according to the received test instruction and outputting the power supply signal and the configuration signal to the power supply assembly and the excitation generation assembly respectively; the power supply assembly is used for providing working power supply for the system board, the adapter board and the burn-in board according to the power supply signals; the excitation generating component is used for generating an excitation signal according to the configuration signal and outputting the excitation signal to the chip to be tested; the detection component is used for transmitting the received output signal of the chip to be detected to external equipment. The system board development cost and the maintenance cost can be reduced, and the working efficiency of the system board can be improved.

Description

System board, burn-in test system and burn-in test equipment
Technical Field
The application relates to the technical field of chip testing, in particular to a system board, a burn-in test system and burn-in test equipment.
Background
In order to ensure the reliability of the chip, burn-in (Burn in) testing must be performed before the chip is shipped. The burn-in test is to provide necessary excitation signals for the chip to be tested by the burn-in test equipment, simulate the working state of the chip, and make the chip overload work at high temperature or under other conditions to make the defect of the chip be exposed in an accelerated manner, so as to reject the defective chip.
In the prior art, the burn-in system board is a core component of the burn-in device, and is used for generating corresponding excitation signals according to test conditions of the tested chip, outputting the excitation signals to the tested chip, and continuously monitoring output signals (test results) of the chip, so as to make corresponding working state adjustment according to the output signals of the tested chip.
However, the existing burn-in test system board is generally of an integral structure, has no modularized design, has extremely high integration level, and causes complex system board structure, difficult error checking and difficult maintenance, so that the research and development cost and the maintenance cost are higher; meanwhile, as the whole modification is often involved in modifying one functional unit, the compatibility is poor, the functional unit cannot be flexibly adapted to different testing environments, and the working efficiency is low.
Disclosure of Invention
The technical problem that this application mainly solves is to provide system board, ageing test system and ageing test equipment, can solve current ageing test system board use cost height and work efficiency low problem.
In order to solve the technical problems, a first technical scheme adopted by the application is to provide a system board, wherein the system board is electrically connected with a chip to be tested placed on an aging board through an adapter board, the system board comprises a base plate, a control unit, a power supply assembly, an excitation generating assembly and a detection assembly, which are arranged on the base plate, and the control unit, the power supply assembly, the excitation generating assembly and the detection assembly are electrically connected through a plurality of interfaces; the control unit is used for generating a power supply signal and a configuration signal according to the received test instruction and outputting the power supply signal and the configuration signal to the power supply assembly and the excitation generation assembly respectively; the power supply assembly is used for providing working power supply for the system board, the adapter board and the burn-in board according to the power supply signals; the excitation generating component is used for generating an excitation signal according to the configuration signal and outputting the excitation signal to the chip to be tested; the detection component is used for transmitting the received output signal of the chip to be detected to external equipment.
Wherein the control unit, the power supply component, the excitation generating component and the detection component form a stacked structure on the substrate.
Wherein the stacked structure comprises a lateral stacked structure and/or a longitudinal stacked structure.
Wherein the interface comprises at least one of a connector, a bonding wire, and a metallized hole.
The system board also comprises at least one group of golden fingers, and the golden fingers are arranged on the base plate; the power supply assembly, the excitation generating assembly and the detection assembly are electrically connected with the adapter plate through the golden finger.
The power supply assembly comprises at least one power supply unit, a power supply filtering unit and a power supply protection unit; each power supply unit is used for providing working power supply for each corresponding chip to be tested and the system board on the burn-in board; the power supply filtering units are connected with each power supply unit in a one-to-one correspondence manner so as to filter the working power supply; the power protection units are connected with each power supply unit in a one-to-one correspondence manner so as to cut off the working power supply when at least one power supply unit is detected to be abnormal.
The excitation generating component comprises an analog signal generating unit, a digital signal generating unit and at least one driving unit; the analog signal generating unit is used for generating a corresponding analog signal according to the configuration signal and outputting the analog signal to the chip to be tested; the digital signal generating unit is used for generating a corresponding digital signal according to the configuration signal and outputting the digital signal to the chip to be tested; the driving unit is electrically connected with the analog signal generating unit and the digital signal generating unit respectively so as to enhance the analog signal and the digital signal.
The detection assembly comprises a signal detection unit and a signal shaping unit; the signal shaping unit is used for shaping the received output signal of the chip to be tested; the signal detection unit is electrically connected with the signal shaping unit and is used for outputting the shaped output signal to external equipment.
In order to solve the technical problem, a second technical scheme adopted by the application is to provide an aging test system, which comprises an aging board, an adapter board and the system board, wherein the system board is electrically connected with the aging board through the adapter board so as to perform aging test on a chip to be tested placed on the aging board.
In order to solve the technical problem, a third technical scheme adopted by the application is to provide an aging test device, which comprises the system board.
The beneficial effects of this application are: compared with the prior art, the system board, the aging test system and the aging test equipment are provided, the system board is subjected to modularized design, the control unit, the power supply assembly, the excitation generation assembly and the detection assembly are electrically connected through the interfaces, a plurality of functional assemblies can be independently developed, the research and development efficiency of the system board is improved, and the research and development cost is reduced. Meanwhile, when the system board fails, the system board can be quickly repaired by positioning the corresponding functional components and replacing the functional components, so that the maintenance cost of the system board is reduced. Further, when the test requirement changes, the compatibility and the expansibility of the system board can be improved by developing and adjusting the corresponding functional components in the system board, so that the system board is applied to more working scenes, and the working efficiency of the system board is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a functional block diagram of one embodiment of a system board of the present application;
FIG. 2 is a schematic view of a first embodiment of a stacked configuration formed by a plurality of functional components in the system board of FIG. 1;
FIG. 3 is a schematic view of a second embodiment of a stacked configuration formed by a plurality of functional components in the system board of FIG. 1;
FIG. 4 is a functional block diagram of one embodiment of a burn-in system of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terminology used in the embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.
In the prior art, the burn-in system board is a core component of the burn-in device, and is used for generating corresponding excitation signals according to test conditions of the tested chip, outputting the excitation signals to the tested chip, and continuously monitoring output signals (test results) of the chip, so as to make corresponding working state adjustment according to the output signals of the tested chip. However, the existing burn-in test system board is generally of an integral structure, has no modularized design, has extremely high integration level, and causes complex system board structure, difficult error checking and difficult maintenance, so that the research and development cost and the maintenance cost are higher; meanwhile, as the whole modification is often involved in modifying one functional unit, the compatibility is poor, the functional unit cannot be flexibly adapted to different testing environments, and the working efficiency is low.
Based on the above situation, the application provides a system board, an aging test system and aging test equipment, which can solve the problems of high use cost and low working efficiency of the existing aging test system board.
The present application will be described in detail with reference to the drawings and embodiments.
Referring to fig. 1, fig. 1 is a schematic block diagram of an embodiment of a system board of the present application. In this embodiment, the system board 100 is electrically connected to the chip to be tested placed on the burn-in board through the interposer, and the system board 100 includes a substrate 60, and a control unit 10, a power supply assembly 20, an excitation generating assembly 30, and a detecting assembly 40 disposed on the substrate 60, where the control unit 10, the power supply assembly 20, the excitation generating assembly 30, and the detecting assembly 40 are electrically connected through a plurality of interfaces (not shown).
In this embodiment, the control unit 10 is configured to generate a power signal and a configuration signal according to the received test instruction, and output the power signal and the configuration signal to the power supply component and the excitation generating component, respectively. The power supply assembly 20 is used for providing working power for the system board 100, the adapter board and the burn-in board according to the power signal. The excitation generating component 30 is configured to generate an excitation signal according to the configuration signal, and output the excitation signal to the chip under test. The detecting component 40 is configured to transmit the received output signal of the chip to be detected to an external device.
In some embodiments, the external device is an upper computer, and the test instruction is a program code written in the upper computer based on the chip to be tested.
In some embodiments, the control unit 10 is integrated with a communication unit, and the control unit 10 communicates with an upper computer through the communication unit. In some embodiments, the communication unit is a communication circuit.
In some embodiments, the types of chips to be tested are different, the corresponding test instructions are different, the control unit 10 generates different configuration signals based on the received different test instructions, and the excitation generating component 30 generates analog signals and/or digital signals according to the different configuration signals.
In this embodiment, the system board 100 further includes at least one set of golden fingers 50, and the golden fingers 50 are disposed on the substrate 60. The number of the golden fingers 50 may be set as required, and may be 2 groups, 3 groups or more, which is not limited in this application.
In the present embodiment, the power supply unit 20, the excitation generating unit 30, and the detecting unit 40 are electrically connected to the interposer through the gold finger 50. In some embodiments, 3 groups of golden fingers 50 are disposed on the substrate 60, and the power supply assembly 20, the excitation generating assembly 30, and the detection assembly 40 are electrically connected to the interposer through different golden fingers 50.
In this embodiment, the interface includes at least one of a connector, a bonding wire, and a metallized hole. In some embodiments, the connector includes a gold finger, and the bonding wire includes gold wire, copper wire, aluminum wire, and the like, which is not limited in this application.
It can be appreciated that by modularly designing the system board 100 and electrically connecting the control unit 10, the power supply unit 20, the excitation generating unit 30 and the detecting unit 40 through a plurality of interfaces, after the interfaces of the functional units are defined, the functional units can be submitted to different developers for development, and the multiple tasks are simultaneously parallel, so that the development time is greatly shortened. By independently developing a plurality of functional components, the development efficiency of the system board 100 can be effectively improved, thereby reducing the development cost.
Further, when the system board 100 malfunctions, the malfunction of the system board 100 can be quickly repaired by locating to and replacing the corresponding functional components, thereby reducing the maintenance cost of the system board 100.
Further, when the test requirement varies, the compatibility and expansibility of the system board 100 can be improved by developing and adjusting the corresponding functional components in the system board 100, so that the system board 100 is applied to more working scenes, and the working efficiency of the system board 100 is improved.
In the present embodiment, the control unit 10, the power supply unit 20, the excitation generating unit 30, and the detecting unit 40 form a stacked structure on a substrate. In some embodiments, the stacked structure comprises a lateral stacked structure and/or a longitudinal stacked structure. When the stacking structure comprises a transverse stacking structure and a longitudinal stacking structure, the stacking structure is a three-dimensional structure. In some embodiments, when multiple functional components form a stacked structure, electrical connection between the functional components may be achieved through metallized holes between the layers.
Specifically, referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of a first embodiment of a stacked structure formed by a plurality of functional components in the system board of fig. 1, and fig. 3 is a schematic structural diagram of a second embodiment of a stacked structure formed by a plurality of functional components in the system board of fig. 1.
As shown in fig. 2, the power supply assembly 20, the excitation generating assembly 30, and the detection assembly 40 form a three-layered stacked structure with electrical connections between the layers being made through metallized holes 201. The control unit 10 may be arranged directly on the substrate 60, making electrical connection with the power supply assembly 20 via the metallized holes 201 on the one hand, and with the excitation generating assembly 30 via the bonding wires 101 on the other hand.
It can be appreciated that the control unit 10 and the power module 20 are tiled on the substrate 60, the excitation generating module 20 and the detection module 40 are disposed on the power module 20, and the stacking direction is perpendicular to the plane of the substrate 60, so as to form a longitudinal stack, which can effectively reduce the area of the substrate 60.
As shown in fig. 3, the power supply unit 20, the excitation generating unit 30 and the detecting unit 40 form a three-layer laminated structure, and the layers are electrically connected through the metallized holes 201, wherein the lamination direction of the power supply unit 20, the excitation generating unit 30 and the detecting unit 40 is perpendicular to the plane of the substrate 60, so as to form a longitudinal stack. One side surface of the control unit 10 is fixed in contact with one end of the laminated structure formed by the power supply assembly 20, the excitation generating assembly 30 and the detection assembly 40, and the metallized holes 201 are connected through the metallized holes 202 so as to conduct the control unit 10 with the power supply assembly 20 and the excitation generating assembly 30. The lamination direction of the control unit 10 is parallel to the plane in which the substrate 60 lies.
It can be appreciated that by making the lamination direction of the control unit 10 perpendicular to the lamination direction of the power supply assembly 20, the excitation generating assembly 30, and the detection assembly 40, each functional assembly in the system board 100 can be made to extend not only in the longitudinal direction but also in the lateral direction, making the stacking manner more flexible.
In the prior art, the burn-in system board is generally of an integral structure, and all functional units are concentrated on one base plate, so that the area of the base plate is large, and the manufacturing cost of the base plate is high.
Unlike the prior art, the system board 100 in this embodiment adopts a modularized design, and a plurality of functional components not only can be independently disposed on the substrate 60, but also can be longitudinally and transversely stacked along with the requirement to form a plurality of stacked structures, so that not only is the flexibility of the arrangement of the system board 100 improved, but also the surface mounting area of the substrate 60 is effectively reduced, thereby reducing the manufacturing cost of the substrate 60 and further reducing the research and development cost of the system board 100.
With continued reference to fig. 1, in the present embodiment, the power supply assembly 20 includes at least one power supply unit 21, a power filter unit 22, and a power protection unit 23.
In some embodiments, each power supply unit 21 is configured to provide an operating power supply for each corresponding chip to be tested on the burn-in board and the system board 100. In some embodiments, the number of the power supply units 21 may be determined according to the number of the chips to be tested placed on the burn-in board, for example, 6 chips to be tested are placed on the burn-in board, and then the number of the power supply units 21 on the system board 100 is set to be 6 correspondingly. In some embodiments, the operating power provided by each power supply unit 21 may be set to different powers (e.g. different voltages or currents) according to the types of chips to be tested, so as to meet the test requirements of the chips to be tested of different types.
It can be appreciated that by adjusting the number of the power supply units 21 in the system board 100 and specifically adjusting and controlling specific parameters of each power supply unit 21 through a modular design, different power supply units 21 can be corresponding to different types of chips to be tested, so as to better supply power to the chips to be tested. Further, by meeting the flexible power supply requirements, the system board 100 can be better powered.
In some embodiments, the power filtering unit 22 is connected to each power supply unit 21 in a one-to-one correspondence to filter the working power generated by each power supply unit 21. In some embodiments, the power supply filtering unit 22 filters the power supply unit 21 through pi-type filtering to obtain a better filtering effect. In some embodiments, the power filter unit 22 is connected to each power supply unit 21 in a one-to-one correspondence through bonding wires.
In some embodiments, the power protection unit 23 is connected to each power supply unit 21 in a one-to-one correspondence to cut off the operating power when an abnormality of at least one power supply unit 21 is detected. In some embodiments, the power protection units 23 are connected to each power supply unit 21 in a one-to-one correspondence through bonding wires.
As can be appreciated, by detecting each power supply unit 21 by the power supply protection unit 23 and cutting off the operating power supply when detecting abnormality of at least one power supply unit 21, the chip to be tested can be better protected, thereby improving the test efficiency and reducing the test cost.
In the present embodiment, the excitation generating assembly 30 includes an analog signal generating unit 31, a digital signal generating unit 32, and at least one driving unit 33.
In some embodiments, the analog signal generating unit 31 is configured to generate a corresponding analog signal according to the configuration signal, and output the analog signal to the chip to be tested. In some embodiments, the analog signal generating unit 31 may generate waveforms such as sine waves, square waves, saw-tooth waves, etc. according to the received different configuration signals, and the waveform data is stored in the random access memory (Random Access Memory, RAM).
In some embodiments, the digital signal generating unit 32 is configured to generate a corresponding digital signal according to the configuration signal, and output the digital signal to the chip to be tested. In some embodiments, the digital signal generating unit 32 stores the edited signal data in a Static Random-Access Memory (SRAM), generates a set address signal through hardware frequency division, and makes the SRAM output a required digital signal waveform, and after being driven by the driving unit 33, makes the pull and fill currents of each signal reach 200mA.
In some embodiments, the driving unit 33 is electrically connected to the analog signal generating unit 31 and the digital signal generating unit 32, respectively, to enhance the analog signal and the digital signal. In some embodiments, the driving unit 33 is a driving circuit.
In the present embodiment, the detecting unit 40 includes a signal detecting unit 42 and a signal shaping unit 41.
In some embodiments, the signal shaping unit 41 is configured to shape the received output signal of the chip under test.
As can be appreciated, the output signal has signal deviation through the transmission of the burn-in board, the interposer and the gold finger, and the received output signal is shaped by the signal shaping unit 41, so that the detection accuracy can be improved.
In some embodiments, the signal detecting unit 42 is electrically connected to the signal shaping unit 41, and is configured to output the shaped output signal to an external device. In some embodiments, the signal detection unit 42 also transmits the output signal to an instrument or collection card.
Each of the functional components in the above embodiments mostly includes a plurality of functional units, and the plurality of functional units may be stacked in a lateral direction or a longitudinal direction, which is not limited in this application.
In some embodiments, the power supply unit 21, the power filter unit 22, and the power protection unit 23 in the power supply assembly 20 may form a longitudinal stack structure, and the analog signal generation unit 31, the digital signal generation unit 32, and the driving unit 33 in the excitation generation assembly 30 may form a lateral stack structure.
Unlike the prior art, the present embodiment is capable of independently developing a plurality of functional components by modularly designing the system board 100 and electrically connecting the control unit 10, the power supply assembly 20, the excitation generating assembly 30 and the detecting assembly 40 through a plurality of interfaces, thereby improving the developing efficiency of the system board 100 and reducing the developing cost. Meanwhile, when the system board 100 fails, the system board failure can be quickly repaired by locating to and replacing the corresponding functional components, thereby reducing the maintenance cost of the system board 100. Further, when the test requirement varies, the compatibility and expansibility of the system board 100 can be improved by developing and adjusting the corresponding functional components in the system board 100, so that the system board 100 is applied to more working scenes, and the working efficiency of the system board 100 is improved.
Correspondingly, the application provides a burn-in test system.
In particular, referring to fig. 4, fig. 4 is a schematic block diagram of an embodiment of the burn-in test system of the present application. In this embodiment, the burn-in test system 200 includes the burn-in board 120, the interposer 110, and the system board 100, where the system board 100 is electrically connected to the burn-in board 120 through the interposer 110, so as to perform a burn-in test on the chip 130 to be tested placed on the burn-in board 120.
In this embodiment, the burn-in board 120 and the system board 100 are placed in two separate temperature zones for operation.
It can be appreciated that, since the system board 100 is not placed in the temperature area where the burn-in board 120 is located, the system board 100 is prevented from being impacted by unnecessary high temperature or low temperature, so that the possibility of failure of each functional component of the system board 100 at high temperature and low temperature is reduced, the quality of the test signal is ensured, the integrity of the test signal is improved, and the service life and the test efficiency of the system board 100 are further improved.
Correspondingly, the application provides burn-in equipment, which comprises the system board.
As can be appreciated, the research and development cost and the maintenance cost of the system board are reduced, and the working efficiency of the system board is improved, so that the overall preparation cost of the aging test equipment is effectively reduced, and the test efficiency of the aging test equipment is improved.
Compared with the prior art, the system board is modularly designed, the control unit, the power supply assembly, the excitation generating assembly and the detection assembly are electrically connected through the interfaces, a plurality of functional assemblies can be independently developed, the research and development efficiency of the system board is improved, and the research and development cost is reduced. Meanwhile, when the system board fails, the system board can be quickly repaired by positioning the corresponding functional components and replacing the functional components, so that the maintenance cost of the system board is reduced. Further, when the test requirement changes, the compatibility and the expansibility of the system board can be improved by developing and adjusting the corresponding functional components in the system board, so that the system board is applied to more working scenes, and the working efficiency of the system board is improved.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.

Claims (10)

1. A system board, which is electrically connected with a chip to be tested placed on an aging board through an adapter board, and is characterized in that,
the system board comprises a substrate, a control unit, a power supply assembly, an excitation generating assembly and a detection assembly, wherein the control unit, the power supply assembly, the excitation generating assembly and the detection assembly are arranged on the substrate and are electrically connected through a plurality of interfaces;
the control unit is used for generating a power supply signal and a configuration signal according to the received test instruction and outputting the power supply signal and the configuration signal to the power supply assembly and the excitation generation assembly respectively;
the power supply assembly is used for providing working power supply for the system board, the adapter board and the aging board according to the power supply signals;
the excitation generation component is used for generating an excitation signal according to the configuration signal and outputting the excitation signal to the chip to be tested;
the detection component is used for transmitting the received output signal of the chip to be detected to the external equipment.
2. The system board of claim 1, wherein the system board comprises a plurality of modules,
the control unit, the power supply assembly, the excitation generating assembly, and the detection assembly form a stacked structure on the substrate.
3. The system board of claim 2, wherein the system board comprises a plurality of modules,
the stack comprises a lateral stack and/or a longitudinal stack.
4. A system board according to any one of claim 1 to 3,
the interface includes at least one of a connector, a bonding wire, and a metallized hole.
5. The system board of claim 1, wherein the system board comprises a plurality of modules,
the system board also comprises at least one group of golden fingers, and the golden fingers are arranged on the base plate;
the power supply assembly, the excitation generation assembly and the detection assembly are electrically connected with the adapter plate through the golden finger.
6. The system board of claim 1, wherein the system board comprises a plurality of modules,
the power supply assembly comprises at least one power supply unit, a power supply filtering unit and a power supply protection unit;
each power supply unit is used for providing the working power supply for each corresponding chip to be tested and the system board on the burn-in board;
the power supply filtering units are connected with each power supply unit in a one-to-one correspondence manner so as to filter the working power supply;
the power supply protection units are connected with each power supply unit in a one-to-one correspondence mode, so that the working power supply is cut off when at least one power supply unit is detected to be abnormal.
7. The system board of claim 1, wherein the system board comprises a plurality of modules,
the excitation generating component comprises an analog signal generating unit, a digital signal generating unit and at least one driving unit;
the analog signal generating unit is used for generating a corresponding analog signal according to the configuration signal and outputting the analog signal to the chip to be tested;
the digital signal generating unit is used for generating a corresponding digital signal according to the configuration signal and outputting the digital signal to the chip to be tested;
the driving unit is electrically connected with the analog signal generating unit and the digital signal generating unit respectively so as to enhance the analog signal and the digital signal.
8. The system board of claim 1, wherein the system board comprises a plurality of modules,
the detection assembly comprises a signal detection unit and a signal shaping unit;
the signal shaping unit is used for shaping the received output signal of the chip to be tested;
the signal detection unit is electrically connected with the signal shaping unit and is used for outputting the shaped output signal to the external equipment.
9. A burn-in system, comprising a burn-in board, an interposer, and a system board according to any one of claims 1 to 8, wherein the system board is electrically connected to the burn-in board through the interposer, so as to perform a burn-in test on the chip to be tested placed on the burn-in board.
10. A burn-in apparatus comprising the system board of any one of claims 1 to 8.
CN202311519497.3A 2023-11-14 2023-11-14 System board, burn-in test system and burn-in test equipment Pending CN117388671A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311519497.3A CN117388671A (en) 2023-11-14 2023-11-14 System board, burn-in test system and burn-in test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311519497.3A CN117388671A (en) 2023-11-14 2023-11-14 System board, burn-in test system and burn-in test equipment

Publications (1)

Publication Number Publication Date
CN117388671A true CN117388671A (en) 2024-01-12

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311519497.3A Pending CN117388671A (en) 2023-11-14 2023-11-14 System board, burn-in test system and burn-in test equipment

Country Status (1)

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