CN117381162A - Earphone diaphragm assembling and welding device and welding method - Google Patents
Earphone diaphragm assembling and welding device and welding method Download PDFInfo
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- CN117381162A CN117381162A CN202311707087.1A CN202311707087A CN117381162A CN 117381162 A CN117381162 A CN 117381162A CN 202311707087 A CN202311707087 A CN 202311707087A CN 117381162 A CN117381162 A CN 117381162A
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- earphone
- vibrating diaphragm
- welding
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- 238000003466 welding Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000005520 cutting process Methods 0.000 claims abstract description 63
- 238000003698 laser cutting Methods 0.000 claims abstract description 42
- 239000003292 glue Substances 0.000 claims abstract description 11
- 238000001931 thermography Methods 0.000 claims description 33
- 238000010191 image analysis Methods 0.000 claims description 27
- 238000000605 extraction Methods 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- 238000003709 image segmentation Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 210000005069 ears Anatomy 0.000 claims description 8
- 238000001228 spectrum Methods 0.000 claims description 7
- 229910000952 Be alloy Inorganic materials 0.000 claims description 6
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000001845 vibrational spectrum Methods 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000009825 accumulation Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention relates to an earphone diaphragm assembly welding device and a welding method, wherein a diaphragm is positioned on a diaphragm bracket by using a dispensing method, and then laser welding is performed by using a laser welding mode, so that the diaphragm is positioned accurately during laser welding, and the connection is stable during welding; after welding, the adhesive dispensing positioning points on the vibrating diaphragm are cut at fixed points by utilizing laser cutting, so that the problem that vibration energy is absorbed by glue in the process that the vibrating diaphragm bracket drives the vibrating diaphragm to vibrate is solved, and the welding stability and the sound quality of the vibrating diaphragm are improved; when the positioning, utilize high definition camera shooting image to be used for the vibrating diaphragm to fix a position, when cutting simultaneously, in order to reduce the error accumulation when welding, carry out infrared positioning to carry out the lack of laser cutting site according to the result of infrared positioning, guaranteed the accuracy of cutting, guaranteed simultaneously that the vibrating diaphragm after the cutting is connected firmly.
Description
Technical Field
The invention relates to the field of laser processing, in particular to an earphone diaphragm assembling and welding device and a welding method.
Background
The earphone vibrating diaphragm of the current high-end earphone needs to be adhered to the vibrating diaphragm support, and the vibrating diaphragm is driven to vibrate by driving the vibrating diaphragm support to produce sound; the prior art adopts the bonding mode to connect vibrating diaphragm and vibrating diaphragm support, but the use of adhesive probably leads to the quality of vibrating diaphragm to descend, and the adhesive probably introduces impurity or produces chemical reaction, leads to the intensity and the stability of vibrating diaphragm to reduce. At the same time, the use of adhesives introduces additional weight, which increases the overall thickness of the diaphragm, thereby affecting the acoustical quality of the earphone; in addition, stress concentration can be caused in the bonding process, and uneven stress can be introduced, so that the stress between the vibrating diaphragm and the support is unevenly distributed, and the sound quality and the frequency response of the earphone are affected. Most importantly, the glue used in the bonding process absorbs vibration energy, resulting in reduced efficiency of vibration transfer to the diaphragm, affecting response speed.
Disclosure of Invention
In order to solve the problems, the invention provides an earphone diaphragm assembling and welding device which comprises a main control module, an adhesion module, an image acquisition module, a laser welding and cutting module.
The main control module is connected with the bonding module, the image acquisition module, the laser welding assembly and the laser cutting assembly;
the bonding module is used for performing spot-bonding on the earphone vibrating diaphragm so as to bond the earphone vibrating diaphragm to the vibrating diaphragm bracket; the image acquisition module acquires images of the earphone vibrating diaphragm to position the earphone vibrating diaphragm;
the laser welding and cutting module comprises a laser welding assembly and a laser cutting assembly;
the laser welding assembly is used for welding the edge of the vibrating diaphragm of the earphone; the laser cutting assembly cuts the dispensing position from the diaphragm.
The earphone vibrating diaphragm is a round vibrating diaphragm used on the flat earphone, and three vibrating diaphragm ears are arranged at the edge of the earphone vibrating diaphragm and used for adhesive dispensing and bonding the earphone vibrating diaphragm and the vibrating diaphragm support; the diameter of the earphone diaphragm behind the diaphragm ear is equal to the diameter of the diaphragm bracket; the vibrating diaphragm ears are triangular and are 3-5 in number;
the material of the earphone diaphragm is a composite diaphragm with a metal plating layer plated on the outer part of the diaphragm base material; the diaphragm base material is made of fiber film material, and the metal plating layer is beryllium alloy or titanium alloy; the vibrating diaphragm support is made of metal, and specifically is beryllium alloy or titanium alloy.
The welding device also comprises an alignment module, an image analysis module, a laser and an audio detection module;
the main control module is connected with the alignment module, the image analysis module, the laser and the audio detection module;
the alignment module aligns the earphone vibrating diaphragm and the vibrating diaphragm bracket before bonding so as to facilitate spot-gluing bonding; the image analysis module analyzes the acquired image of the image acquisition module to acquire accurate position coordinates of welding; the laser generates welding laser and cutting laser and transmits the welding laser and the cutting laser to the laser welding assembly and the laser cutting assembly;
the audio detection module is used for carrying out audio detection on the vibrating diaphragm after cutting.
The alignment module comprises a rotary disk and a centering clamp, the rotary disk drives the vibrating diaphragm support to rotate, and the centering clamp is arranged above the rotary disk in a lifting manner and is used for aligning the vibrating diaphragm of the earphone with the vibrating diaphragm support; the centering fixture is provided with two semicircular clamping pieces, and the diameter of the semicircle is equal to that of the vibrating diaphragm support, so that when the centering fixture aligns and clamps the outer side of the vibrating diaphragm support, the earphone vibrating diaphragm above the vibrating diaphragm support is pushed by the semicircular clamping pieces to align with the vibrating diaphragm support;
the image acquisition module is arranged above the rotating disc, and comprises a high-definition camera and a thermal imaging camera, wherein the high-definition camera and the thermal imaging camera acquire images of the earphone diaphragm on the rotating disc to obtain a high-definition image and a thermal imaging image, and the high-definition image and the thermal imaging image are sent to the main control module; the main control module sends the high-definition images and the thermal imaging images of the earphone diaphragm to the image analysis module;
the image analysis module is provided with an image processor, and performs image segmentation, edge extraction and coordinate extraction on the high-definition image and the thermal imaging image, so that the bonding coordinates and welding coordinates of the earphone diaphragm are obtained.
The adhesive module is provided with an adhesive dispensing head which is arranged on the two-dimensional movable bracket; the bonding module acquires bonding coordinates from the main control module, and uses hot melt adhesive to carry out point bonding on the bonding positions according to the bonding coordinates;
after the glue head is moved to the bonding coordinates during bonding, the first glue dispensing is performed; rotating the rotating disc by a preset angle after the first dispensing is finished, so that a second bonding position reaches the lower part of the dispensing head, and performing second dispensing; rotating the rotating disc by a preset angle after the second dispensing is finished, so that a third bonding position reaches the lower part of the dispensing head, and performing third dispensing; and so on until all the bonding positions are completely dispensed;
the number of the dispensing positions of each earphone vibrating diaphragm is the same as the number of the vibrating diaphragm ears.
The laser welding assembly is provided with a laser welding head, the laser welding head outputs welding laser which is continuous laser, the round edge of the earphone vibrating diaphragm is heated and welded, and the earphone vibrating diaphragm and the vibrating diaphragm bracket are welded together;
and when the welding is performed, the laser welding head starts to perform laser welding after moving to the bonding coordinates, and the rotary disc rotates in the welding process, so that the round edge of the earphone vibrating diaphragm is heated and welded.
The laser cutting assembly is provided with a laser cutting head for laser cutting, the laser cutting head outputs femtosecond or picosecond laser, and the connection position of the vibrating diaphragm lug of the earphone vibrating diaphragm and the circular edge of the vibrating diaphragm is cut;
when the earphone diaphragm is cut, the laser cutting head starts to cut after moving to the cutting coordinates, and the rotary disc rotates in the cutting process, so that the connection position of the diaphragm lug of the earphone diaphragm and the circular edge of the diaphragm is cut.
An earphone diaphragm assembling and welding method, which uses the earphone diaphragm assembling and welding device, comprises the following steps:
step one, feeding of an earphone vibrating diaphragm and a vibrating diaphragm support:
mounting the vibrating diaphragm support on the rotary disk, placing a piece of earphone vibrating diaphragm above the vibrating diaphragm support, and when the earphone vibrating diaphragm is placed, enabling the overlapping rate of the positions of the earphone vibrating diaphragm and the vibrating diaphragm support to be larger than 80%;
step two, aligning the earphone vibrating diaphragm and the vibrating diaphragm support:
the centering clamp is lowered to the lowest point of the semicircular clamping piece to be lower than the upper edge of the vibrating diaphragm support, and the highest point of the semicircular clamping piece is higher than the upper edge of the vibrating diaphragm of the earphone; the centering clamp aligns and clamps the outer side of the vibrating diaphragm support, and the earphone vibrating diaphragm above the vibrating diaphragm support is pushed by the semicircular clamping piece to align with the vibrating diaphragm support;
the vibration film bracket is driven to rotate 360 degrees by the rotary disk, and the centering clamp does not rotate, so that the vibration film of the earphone and the vibration film bracket are ensured to be aligned completely;
step three, first positioning of the earphone diaphragm:
the rotating disc is fixed, the high-definition camera collects images of the earphone vibrating diaphragm on the rotating disc, high-definition images are obtained, and the high-definition images are sent to the main control module; the main control module sends the high-definition images of the earphone diaphragm to the image analysis module; the image processor of the image analysis module performs image segmentation, edge extraction and coordinate extraction processing on the high-definition image so as to obtain bonding coordinates and welding coordinates of the earphone diaphragm;
the bonding coordinate is the outer edge position of one vibrating diaphragm lug on the earphone vibrating diaphragm, and the welding coordinate is the circular edge position of the earphone vibrating diaphragm;
fourth, adhesive bonding:
after the dispensing head moves to the bonding coordinates, dispensing for the first time; rotating the rotating disc by a preset angle after the first dispensing is finished, so that a second bonding position reaches the lower part of the dispensing head, and performing second dispensing; rotating the rotating disc by a preset angle after the second dispensing is finished, so that a third bonding position reaches the lower part of the dispensing head, and performing third dispensing; and so on until all the bonding positions are completely dispensed;
step five, welding an earphone vibrating diaphragm:
after the laser welding head moves to the bonding coordinates, starting to perform laser welding, and rotating a rotating disc in the welding process, so as to heat and weld the round edge of the earphone vibrating diaphragm;
the diameter of the welded laser spot is 0.1 to 1 percent of the diameter of the vibrating diaphragm; energy density per unit area of 10 5 To 10 7 W/cm 2 ；
Step six, second positioning of the earphone diaphragm:
the rotary disk is fixed, the thermal imaging camera collects images of the earphone diaphragm on the rotary disk to obtain thermal imaging images, and the thermal imaging images are sent to the main control module; the main control module sends the earphone diaphragm thermal imaging image to the image analysis module; the image processor of the image analysis module performs image segmentation, edge extraction and coordinate extraction processing on the thermal imaging image so as to obtain cutting coordinates of the earphone diaphragm;
the cutting coordinate is the intersection position of a concentric ring with the diameter L at the outer side of a ring formed by a high-temperature point on the vibrating diaphragm of the earphone and the vibrating diaphragm ear;
wherein l=d+l 0 Wherein D is the diameter of a ring formed by a high temperature point on the earphone diaphragm, L 0 Is a preset offset length;
whereby the cutting coordinates comprise n coordinate start points and n coordinate end points; wherein n is the number of vibrating diaphragm lugs;
cutting the earphone vibrating diaphragm:
the laser cutting head starts to cut after moving to a coordinate starting point of the cutting coordinate, and the rotary table rotates in the cutting process until reaching a coordinate end point of the corresponding cutting coordinate, so that one-time cutting is completed; the rotary disk continues to rotate, and cuts the part between all coordinates and corresponding coordinate end points, so that the connection position of the vibrating diaphragm lug of the earphone vibrating diaphragm and the circular edge of the vibrating diaphragm is cut.
The laser cutting head outputs femtosecond laser, the laser power of the femtosecond laser is 10W, and the cutting thickness is greater than the thickness of the earphone diaphragm and less than 110% of the thickness of the earphone diaphragm.
The method further comprises the step of: and (3) audio detection:
blowing out the cut material by using compressed air after cutting, driving the vibrating diaphragm of the earphone to vibrate, and collecting the vibration spectrum in the vibration process; performing difference between the vibration spectrum and a preset standard spectrum; calculating the peak frequency and the peak height of the differential spectrum after the difference; if the peak value frequency is higher than a threshold value in a preset interval, judging that the welding of the earphone diaphragm fails; otherwise, the earphone diaphragm is welded to be qualified.
The beneficial effects of the invention are as follows:
according to the invention, the diaphragm is positioned on the diaphragm support by using a dispensing method, and then laser welding is performed by using a laser welding mode, so that the diaphragm is ensured to be positioned accurately during laser welding, and is firmly connected during welding, and the diaphragm is ensured to be integral and free from deformation without being clamped by other clamps;
after welding, the adhesive dispensing positioning points on the vibrating diaphragm are cut at fixed points by utilizing laser cutting, so that the problem that vibration energy is absorbed by glue in the process that the vibrating diaphragm bracket drives the vibrating diaphragm to vibrate is solved, and the welding stability and the sound quality of the vibrating diaphragm are improved;
the rotary disk at the bottom is used for rotation during dispensing, welding and cutting, so that the glue head, the welding head and the cutting head do not pass through the position right above the vibrating diaphragm during the dispensing, welding and cutting, damage to the vibrating diaphragm is caused during the processing process, and the glue is placed and adhered to the surface of the vibrating diaphragm;
when the positioning, utilize high definition camera shooting image to be used for the vibrating diaphragm to fix a position, when cutting simultaneously, in order to reduce the error accumulation when welding, carry out infrared positioning to carry out the lack of laser cutting site according to the result of infrared positioning, guaranteed the accuracy of cutting, guaranteed simultaneously that the vibrating diaphragm after the cutting is connected firmly.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall architecture of the present invention;
fig. 2 is a schematic overall appearance of the device of the present invention.
FIG. 3 is a schematic view of the laser welding assembly and laser cutting assembly positions of the present invention;
FIG. 4 is a schematic view of the position of a rotating disk according to the present invention;
FIG. 5 is a schematic diagram of the working principle of the alignment module of the present invention;
fig. 6 is a schematic view of the mounting structure of the rotary disk and the diaphragm support of the present invention.
Detailed Description
Example 1:
referring to fig. 1 to 6, the invention provides an earphone diaphragm 71 assembling and welding device, which comprises a main control module 1, an adhesion module 2, an image acquisition module, a laser welding assembly and a laser cutting assembly.
The main control module 1 is connected with the bonding module 2, the image acquisition module and the laser welding and cutting module 4;
the bonding module 2 performs spot-bonding on the earphone diaphragm 71 to bond the earphone diaphragm 71 to the diaphragm bracket 73; the image acquisition module acquires an image of the earphone diaphragm 71 to position the earphone diaphragm 71;
the laser welding and cutting module 4 comprises a laser welding assembly and a laser cutting assembly;
the laser welding assembly welds the edge of the earphone diaphragm 71; the laser cutting assembly cuts the dispensing position from the diaphragm.
The earphone diaphragm 71 is a circular diaphragm used on a flat earphone, three diaphragm lugs 72 are arranged at the edge of the earphone diaphragm 71, and the diaphragm lugs 72 are used for adhesive dispensing and bonding the earphone diaphragm 71 and the diaphragm bracket 73; the diameter of the earphone diaphragm 71 after the diaphragm ear 72 is equal to the diameter of the diaphragm bracket 73; the vibrating diaphragm lugs 72 are triangular and are 3-5 in number;
the material of the earphone diaphragm 71 is a composite diaphragm with a metal plating layer plated on the outer part of the diaphragm base material; the diaphragm base material is made of fiber film material, and the metal plating layer is beryllium alloy or titanium alloy; the diaphragm support 73 is made of metal, specifically beryllium alloy or titanium alloy.
The welding device also comprises an alignment module, an image analysis module, a laser 6 and an audio detection module;
the main control module 1 is connected with the alignment module, the image analysis module, the laser 6 and the audio detection module;
the alignment module aligns the earphone diaphragm 71 and the diaphragm bracket 73 before bonding so as to facilitate spot-bonding; the image analysis module analyzes the acquired image of the image acquisition module to acquire accurate position coordinates of welding; the laser 6 generates welding laser and cutting laser and transmits the welding laser and the cutting laser to the laser welding assembly and the laser cutting assembly;
the audio detection module is used for carrying out audio detection on the vibrating diaphragm after cutting.
The alignment module comprises a rotary disk 75 and a centering clamp 74, the rotary disk 75 drives the diaphragm bracket 73 to rotate, and the centering clamp 74 is arranged above the rotary disk 75 in a lifting manner and is used for aligning the earphone diaphragm 71 with the diaphragm bracket 73; the centering fixture 74 is two semicircular clamping pieces, and the diameter of the semicircle is equal to that of the diaphragm bracket 73, so that when the centering fixture 74 is aligned and clamped outside the diaphragm bracket 73, the earphone diaphragm 71 above the diaphragm bracket 73 is pushed by the semicircular clamping pieces to be aligned with the diaphragm bracket 73;
the image acquisition module is arranged above the rotary disk 75, the image acquisition module comprises a high-definition camera 31 and a thermal imaging camera 32, the high-definition camera 31 and the thermal imaging camera 32 acquire images of the earphone diaphragm 71 on the rotary disk 75 to obtain a high-definition image and a thermal imaging image, and the high-definition image and the thermal imaging image are sent to the main control module 1; the main control module 1 sends the high-definition image and the thermal imaging image of the earphone diaphragm 71 to the image analysis module;
the image analysis module is provided with an image processor, and performs image segmentation, edge extraction and coordinate extraction on the high-definition image and the thermal imaging image, thereby obtaining the bonding coordinates and welding coordinates of the earphone diaphragm 71.
The bonding module 2 is provided with a dispensing head which is arranged on the two-dimensional moving bracket; the bonding module 2 acquires bonding coordinates from the main control module 1, and uses hot melt adhesive to carry out point bonding on bonding positions according to the bonding coordinates;
after the glue head is moved to the bonding coordinates during bonding, the first glue dispensing is performed; rotating the rotating disc 75 by a preset angle after the first dispensing is completed, so that the second bonding position reaches the lower part of the dispensing head, and performing the second dispensing; rotating the rotating disc 75 by a preset angle after the second dispensing is completed, so that a third bonding position reaches the lower part of the dispensing head, and performing third dispensing; and so on until all the bonding positions are completely dispensed;
the number of dispensing positions of each earphone diaphragm 71 is the same as the number of diaphragm ears 72.
The laser welding assembly is provided with a laser welding head, the laser welding head outputs welding laser, the welding laser is continuous laser, the round edge of the earphone diaphragm 71 is heated and welded, and the earphone diaphragm 71 and the diaphragm bracket 73 are welded together;
the laser welding is started after the laser welding head moves to the bonding coordinates at the time of welding, and the rotary plate 75 is rotated during the welding process, thereby heating and welding the circular edge of the earphone diaphragm 71.
The laser cutting assembly is provided with a laser cutting head for laser cutting, the laser cutting head outputs femtosecond or picosecond laser, and the connection position of the vibrating diaphragm lug 72 of the earphone vibrating diaphragm 71 and the circular edge of the vibrating diaphragm is cut;
the laser cutting head starts to perform laser cutting after moving to the cutting coordinates during cutting, and the rotary disk 75 rotates during cutting, so that the connection position of the diaphragm lug 72 of the earphone diaphragm 71 and the circular edge of the diaphragm is cut.
Example 2:
an assembling and welding method for an earphone diaphragm 71, wherein the assembling and welding device for the earphone diaphragm 71 comprises the following steps:
step one, feeding of an earphone diaphragm 71 and a diaphragm bracket 73:
mounting the vibrating diaphragm bracket 73 on the rotary disk 75, and placing a piece of earphone vibrating diaphragm 71 above the vibrating diaphragm bracket 73, wherein when the earphone vibrating diaphragm 71 is placed, the overlapping rate of the positions of the earphone vibrating diaphragm 71 and the vibrating diaphragm bracket 73 is more than 80%;
step two, aligning the earphone diaphragm 71 and the diaphragm bracket 73:
the centering fixture 74 is lowered to a lowest point of the semicircular clip below the upper edge of the diaphragm support 73 and a highest point of the semicircular clip above the upper edge of the earphone diaphragm 71; the centering fixture 74 is aligned and clamped on the outer side of the diaphragm bracket 73, and the earphone diaphragm 71 above the diaphragm bracket 73 is pushed by the semicircular clamping piece to be aligned with the diaphragm bracket 73;
the diaphragm bracket 73 is driven to rotate 360 degrees by the rotary disk 75 after that, and the centering clamp 74 does not rotate, so that the earphone diaphragm 71 and the diaphragm bracket 73 are ensured to be aligned completely;
step three, first positioning of the earphone diaphragm 71:
the rotating disc 75 is fixed, the high-definition camera 31 collects images of the earphone diaphragm 71 on the rotating disc 75, obtains high-definition images, and sends the high-definition images to the main control module 1; the main control module 1 sends the high-definition image of the earphone diaphragm 71 to the image analysis module; the image processor of the image analysis module performs image segmentation, edge extraction and coordinate extraction processing on the high-definition image, so as to obtain bonding coordinates and welding coordinates of the earphone diaphragm 71;
the bonding coordinate is the outer edge position of one vibrating diaphragm lug 72 on the earphone vibrating diaphragm 71, and the welding coordinate is the circular edge position of the earphone vibrating diaphragm 71;
fourth, adhesive bonding:
after the dispensing head moves to the bonding coordinates, dispensing for the first time; rotating the rotating disc 75 by a preset angle after the first dispensing is completed, so that the second bonding position reaches the lower part of the dispensing head, and performing the second dispensing; rotating the rotating disc 75 by a preset angle after the second dispensing is completed, so that a third bonding position reaches the lower part of the dispensing head, and performing third dispensing; and so on until all the bonding positions are completely dispensed;
step five, welding the earphone diaphragm 71:
after the laser welding head moves to the bonding coordinates, starting to perform laser welding, and rotating the rotating disc 75 in the welding process, so as to perform heating welding on the round edge of the earphone diaphragm 71;
the diameter of the welded laser spot is 0.1 to 1 percent of the diameter of the vibrating diaphragm; energy density per unit area of 10 5 To 10 7 W/cm 2 ；
Step six, second positioning of the earphone diaphragm 71:
the rotary disk 75 is fixed, the thermal imaging camera 32 collects images of the earphone diaphragm 71 on the rotary disk 75 to obtain thermal imaging images, and the thermal imaging images are sent to the main control module 1; the main control module 1 sends the thermal imaging image of the earphone diaphragm 71 to the image analysis module; the image processor of the image analysis module performs image segmentation, edge extraction and coordinate extraction processing on the thermal imaging image, so as to obtain cutting coordinates of the earphone diaphragm 71;
the cutting coordinates are the positions where concentric rings with the outer diameter L formed by high temperature points on the earphone diaphragm 71 intersect with the diaphragm ears 72;
wherein l=d+l 0 Wherein D is the diameter of the ring formed by the high temperature point on the earphone diaphragm 71, L 0 Is a preset offset length; l (L) 0 Less than the length of the vibrating diaphragm ear;
the purpose of setting like this is guaranteeing not to influence the joint strength of welding position when the cutting, guarantees simultaneously that as far as possible vibrating diaphragm ear is cut off, avoids vibrating diaphragm ear to vibrating diaphragm acoustics's influence.
Whereby the cutting coordinates comprise n coordinate start points and n coordinate end points; wherein n is the number of diaphragm ears 72;
step seven, cutting the earphone diaphragm 71:
after the laser cutting head moves to a coordinate starting point of the cutting coordinates, starting to perform laser cutting, and rotating the rotary table 75 in the cutting process until reaching a coordinate end point of the corresponding cutting coordinates, so as to complete one-time cutting; the rotary disk 75 continues to rotate, and cuts the part between all coordinates and the corresponding coordinate end points, so as to cut the connection position of the diaphragm lug 72 of the earphone diaphragm 71 and the circular edge of the diaphragm.
The laser cutting head outputs a femtosecond laser, the laser power of the femtosecond laser is 10W, and the cutting thickness is greater than the thickness of the earphone diaphragm 71 and less than 110% of the thickness of the earphone diaphragm 71.
The method further comprises the step of: and (3) audio detection:
blowing out the cut material by using compressed air after cutting, driving the earphone diaphragm 71 to vibrate, and collecting a vibration spectrum in the vibration process; performing difference between the vibration spectrum and a preset standard spectrum; calculating the peak frequency and the peak height of the differential spectrum after the difference; if the peak frequency is greater than the threshold value in the preset interval, judging that the earphone diaphragm 71 fails to be welded; otherwise the earphone diaphragm 71 is welded to be acceptable.
After welding processing is accomplished, take off vibrating diaphragm support from the rotary disk, later use compressed air to sweep the vibrating diaphragm surface, prevent that the vibrating diaphragm surface from still having impurity, the vibrating diaphragm after sweeping both can direct mount to the earphone in use.
The description of the foregoing embodiments has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to the particular embodiment, but, where applicable, may be interchanged and used with the selected embodiment even if not specifically shown or described. The same elements or features may also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those skilled in the art. Numerous details are set forth, such as examples of specific parts, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to one skilled in the art that the exemplary embodiments may be embodied in many different forms without the use of specific details, and neither should be construed to limit the scope of the disclosure. In certain example embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are inclusive and, therefore, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless specifically indicated. It should also be appreciated that additional or alternative steps may be employed.
Claims (10)
1. An earphone diaphragm (71) assembling and welding device comprises a main control module (1), an adhesion module (2), an image acquisition module and a laser welding and cutting module (4); the method is characterized in that:
the main control module (1) is connected with the bonding module (2), the image acquisition module, the laser welding assembly and the laser cutting assembly;
the bonding module (2) is used for performing spot-bonding on the earphone vibrating diaphragm (71) so as to bond the earphone vibrating diaphragm (71) to the vibrating diaphragm bracket (73); the image acquisition module acquires an image of the earphone diaphragm (71) so as to position the earphone diaphragm (71);
the laser welding and cutting module (4) comprises a laser welding assembly and a laser cutting assembly;
the laser welding assembly is used for welding the edge of the earphone diaphragm (71); the laser cutting assembly cuts the dispensing position from the diaphragm.
2. An earphone diaphragm (71) assembly welding apparatus according to claim 1, characterized in that:
the earphone vibrating diaphragm (71) is a round vibrating diaphragm used on the flat earphone, three vibrating diaphragm ears (72) are arranged at the edge of the earphone vibrating diaphragm (71), and the vibrating diaphragm ears (72) are used for gluing the earphone vibrating diaphragm (71) and the vibrating diaphragm bracket (73) in a point mode; the diameter of the earphone diaphragm (71) comprises a diaphragm lug (72) and is equal to the diameter of the diaphragm bracket (73); the vibrating diaphragm lugs (72) are triangular and are 3-5 in number;
the material of the earphone diaphragm (71) is a composite diaphragm with a metal plating layer plated outside the diaphragm base material; the diaphragm base material is made of fiber film material, and the metal plating layer is beryllium alloy or titanium alloy; the vibrating diaphragm support (73) is made of metal, and is specifically beryllium alloy or titanium alloy.
3. An earphone diaphragm (71) assembly welding apparatus according to claim 2, characterized in that:
the welding device also comprises an alignment module, an image analysis module, a laser (6) and an audio detection module;
the main control module (1) is connected with the alignment module, the image analysis module, the laser (6) and the audio detection module;
the aligning module aligns the earphone vibrating diaphragm (71) and the vibrating diaphragm bracket (73) before bonding so as to facilitate spot-bonding; the image analysis module analyzes the acquired image of the image acquisition module to acquire accurate position coordinates of welding; the laser (6) generates welding laser and cutting laser and transmits the welding laser and the cutting laser to the laser welding assembly and the laser cutting assembly;
the audio detection module is used for carrying out audio detection on the vibrating diaphragm after cutting.
4. A headset diaphragm (71) assembly welding apparatus according to claim 3, characterized in that:
the aligning module comprises a rotating disc (75) and a centering clamp (74), wherein the rotating disc (75) drives the vibrating diaphragm support (73) to rotate, and the centering clamp (74) is arranged above the rotating disc (75) in a lifting manner and is used for aligning the earphone vibrating diaphragm (71) with the vibrating diaphragm support (73); the centering clamp (74) is two semicircular clamping pieces, and the diameter of the semicircle is equal to that of the vibrating diaphragm support (73), so that when the centering clamp (74) aligns and clamps on the outer side of the vibrating diaphragm support (73), the earphone vibrating diaphragm (71) above the vibrating diaphragm support (73) is pushed by the semicircular clamping pieces to align with the vibrating diaphragm support (73);
the image acquisition module is arranged above the rotating disc (75), and comprises a high-definition camera (31) and a thermal imaging camera (32), wherein the high-definition camera (31) and the thermal imaging camera (32) acquire images of an earphone diaphragm (71) on the rotating disc (75) to obtain high-definition images and thermal imaging images, and the high-definition images and the thermal imaging images are sent to the main control module (1); the main control module (1) sends the high-definition image and the thermal imaging image of the earphone diaphragm (71) to the image analysis module;
the image analysis module is provided with an image processor, and performs image segmentation, edge extraction and coordinate extraction on the high-definition image and the thermal imaging image, so that bonding coordinates and welding coordinates of the earphone diaphragm (71) are obtained.
5. An earphone diaphragm (71) assembly welding apparatus according to claim 4, wherein:
the bonding module (2) is provided with a dispensing head which is arranged on the two-dimensional moving bracket; the bonding module (2) acquires bonding coordinates from the main control module (1), and uses hot melt adhesive to carry out spot gluing bonding on bonding positions according to the bonding coordinates;
after the glue head is moved to the bonding coordinates during bonding, the first glue dispensing is performed; rotating the rotating disc (75) by a preset angle after the first dispensing is finished, so that the second bonding position reaches the lower part of the dispensing head, and performing the second dispensing; rotating the rotating disc (75) by a preset angle after the second dispensing is finished, so that a third bonding position reaches the lower part of the dispensing head, and performing third dispensing; and so on until all the bonding positions are completely dispensed;
the number of dispensing positions of each earphone diaphragm (71) is the same as the number of diaphragm lugs (72).
6. An earphone diaphragm (71) assembly welding apparatus according to claim 5, wherein:
the laser welding assembly is provided with a laser welding head, the laser welding head outputs welding laser, the welding laser is continuous laser, the round edge of the earphone vibrating diaphragm (71) is heated and welded, and the earphone vibrating diaphragm (71) and the vibrating diaphragm bracket (73) are welded together;
and when the welding is performed, the laser welding head starts to perform laser welding after moving to the bonding coordinates, and the rotary disc (75) rotates in the welding process, so that the round edge of the earphone diaphragm (71) is heated and welded.
7. An earphone diaphragm (71) assembly welding apparatus according to claim 6, wherein:
the laser cutting assembly is provided with a laser cutting head for laser cutting, the laser cutting head outputs femtosecond or picosecond laser, and the connection position of the vibrating diaphragm lug (72) of the earphone vibrating diaphragm (71) and the circular edge of the vibrating diaphragm is cut;
when the cutting is performed, the laser cutting head starts to perform laser cutting after moving to the cutting coordinates, and the rotary disc (75) rotates in the cutting process, so that the connection position of the vibrating diaphragm lug (72) of the earphone vibrating diaphragm (71) and the circular edge of the vibrating diaphragm is cut.
8. An earphone diaphragm (71) assembling and welding method, using the earphone diaphragm (71) assembling and welding device according to claim 7, characterized by comprising the steps of:
step one, feeding of an earphone vibrating diaphragm (71) and a vibrating diaphragm bracket (73):
mounting a vibrating diaphragm support (73) on a rotating disc (75), placing a piece of earphone vibrating diaphragm (71) above the vibrating diaphragm support (73), and when the earphone vibrating diaphragm (71) is placed, enabling the overlapping rate of the positions of the earphone vibrating diaphragm (71) and the vibrating diaphragm support (73) to be larger than 80%;
secondly, aligning the earphone vibrating diaphragm (71) and the vibrating diaphragm bracket (73):
the centering clamp (74) is lowered to the lowest point of the semicircular clamping piece to be lower than the upper edge of the vibrating diaphragm bracket (73), and the highest point of the semicircular clamping piece is higher than the upper edge of the vibrating diaphragm (71) of the earphone; the centering clamp (74) is aligned and clamped at the outer side of the vibrating diaphragm support (73), and the earphone vibrating diaphragm (71) above the vibrating diaphragm support (73) is pushed by the semicircular clamping piece to be aligned with the vibrating diaphragm support (73);
the vibration film bracket (73) is driven to rotate 360 degrees by the rear rotating disc (75), and the centering clamp (74) does not rotate, so that the vibration film (71) of the earphone is completely aligned with the vibration film bracket (73);
step three, first positioning of the earphone diaphragm (71):
the rotating disc (75) is fixed, the high-definition camera (31) collects images of the earphone diaphragm (71) on the rotating disc (75) to obtain high-definition images, and the high-definition images are sent to the main control module (1); the main control module (1) sends the high-definition image of the earphone diaphragm (71) to the image analysis module; the image processor of the image analysis module performs image segmentation, edge extraction and coordinate extraction processing on the high-definition image so as to obtain bonding coordinates and welding coordinates of the earphone diaphragm (71);
the bonding coordinate is the outer edge position of one vibrating diaphragm lug (72) on the earphone vibrating diaphragm (71), and the welding coordinate is the round edge position of the earphone vibrating diaphragm (71);
fourth, adhesive bonding:
after the dispensing head moves to the bonding coordinates, dispensing for the first time; rotating the rotating disc (75) by a preset angle after the first dispensing is finished, so that the second bonding position reaches the lower part of the dispensing head, and performing the second dispensing; rotating the rotating disc (75) by a preset angle after the second dispensing is finished, so that a third bonding position reaches the lower part of the dispensing head, and performing third dispensing; and so on until all the bonding positions are completely dispensed;
fifthly, welding an earphone diaphragm (71):
after the laser welding head moves to the bonding coordinates, starting to perform laser welding, and rotating a rotating disc (75) in the welding process, so as to heat and weld the round edge of the earphone vibrating diaphragm (71);
the diameter of the welded laser spot is 0.1 to 1 percent of the diameter of the vibrating diaphragm; energy density per unit area of 10 5 To 10 7 W/cm 2 ；
Step six, second positioning of the earphone diaphragm (71):
the rotary disc (75) is fixed, the thermal imaging camera (32) collects images of the earphone diaphragm (71) on the rotary disc (75) to obtain thermal imaging images, and the thermal imaging images are sent to the main control module (1); the main control module (1) sends the thermal imaging image of the earphone diaphragm (71) to the image analysis module; the image processor of the image analysis module performs image segmentation, edge extraction and coordinate extraction processing on the thermal imaging image so as to obtain cutting coordinates of the earphone diaphragm (71);
the cutting coordinate is the intersection position of a concentric ring with the diameter L at the outer side of a ring formed by a high-temperature point on the earphone diaphragm (71) and the diaphragm lug (72);
wherein l=d+l 0 Wherein D is the diameter of a ring formed by a high temperature point on the earphone diaphragm (71), L 0 Is a preset offset length;
whereby the cutting coordinates comprise n coordinate start points and n coordinate end points; wherein n is the number of vibrating diaphragm lugs (72);
step seven, cutting the earphone vibrating diaphragm (71):
after the laser cutting head moves to a coordinate starting point of the cutting coordinate, starting to perform laser cutting, and rotating a rotary table (75) in the cutting process until reaching a coordinate end point of the corresponding cutting coordinate, so as to complete one-time cutting; the rotary disk (75) continues to rotate, and cuts the part between all coordinates and corresponding coordinate end points, so that the connection position of the vibrating diaphragm lug (72) of the earphone vibrating diaphragm (71) and the circular edge of the vibrating diaphragm is cut.
9. The earphone diaphragm (71) assembling and welding method according to claim 8, wherein:
the laser cutting head outputs femtosecond laser, the laser power of the femtosecond laser is 10W, and the cutting thickness is greater than the thickness of the earphone diaphragm (71) and less than 110% of the thickness of the earphone diaphragm (71).
10. The earphone diaphragm (71) assembling and welding method according to claim 9, wherein:
the method also comprises the step eight of: and (3) audio detection:
blowing out the cut material by using compressed air after cutting, driving the earphone diaphragm (71) to vibrate, and collecting a vibration frequency spectrum in the vibration process; performing difference between the vibration spectrum and a preset standard spectrum; calculating the peak frequency and the peak height of the differential spectrum after the difference; if the peak value frequency is higher than a threshold value in a preset interval, judging that the earphone diaphragm (71) fails to be welded; otherwise, the earphone diaphragm (71) is welded to be qualified.
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| CN117381162B (en) | 2024-03-19 |
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