CN117377230A - Tin spraying method for long circuit board - Google Patents
Tin spraying method for long circuit board Download PDFInfo
- Publication number
- CN117377230A CN117377230A CN202311200088.7A CN202311200088A CN117377230A CN 117377230 A CN117377230 A CN 117377230A CN 202311200088 A CN202311200088 A CN 202311200088A CN 117377230 A CN117377230 A CN 117377230A
- Authority
- CN
- China
- Prior art keywords
- tin
- pcb
- spraying
- tin spraying
- air knife
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 117
- 238000005507 spraying Methods 0.000 title claims abstract description 74
- 238000007664 blowing Methods 0.000 claims abstract description 17
- 238000005476 soldering Methods 0.000 claims abstract description 17
- 238000005406 washing Methods 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 238000001035 drying Methods 0.000 claims abstract description 10
- 230000004907 flux Effects 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 6
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000007598 dipping method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007654 immersion Methods 0.000 description 9
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 7
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a tin spraying method of a long circuit board, which comprises the following steps: feeding, acid washing, microetching, water washing and drying; the soldering flux is coated on the copper surface of the PCB uniformly; hanging a PCB, entering a tin spraying machine, and spraying tin for the first time on the PCB, wherein more than 50% of the PCB needs to be sprayed with tin; hot air is used for blowing flat, and hot air is used for blowing flat soldering tin on the PCB; turning around the PCB, entering a tin spraying machine, carrying out secondary tin spraying, controlling the stroke of the secondary tin spraying, immersing copper surfaces in the PCB of the lower immersed part into a tin furnace, and carrying out secondary tin spraying on more than 50% of the PCB; hot air is used for blowing flat, and hot air is used for blowing flat soldering tin on the PCB; washing and drying the PCB again, and discharging; the long circuit board with the length larger than 620mm can be uniformly sprayed with tin, and the tin spraying efficiency and effect are not affected.
Description
Technical Field
The invention relates to a tin spraying method of a long circuit board.
Background
Currently, in the field of multilayer circuit board processing, the steps of processing a tin spraying and washing board are as follows: pretreatment-hanging plate-tin spraying-post-treatment washing plate; however, the conventional technique can only produce a plate having a length of 620mm or less, and if the length exceeds the range, it cannot be produced.
At present, new energy automobiles, outdoor billboards, elevators, communication base station antennas, large machine tools and the like are required to be adopted to be long-line boards, so that the length of a required circuit board exceeds 620mm, if the size of a tin furnace is increased, the tin furnace needs to be kept at a certain temperature, and the power consumption of the tin furnace is greatly increased along with the increase of the size, so that the cost of enterprises is greatly increased, and therefore, a tin spraying method for the long-line boards is needed to be searched.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a tin spraying method for a long circuit board, which can uniformly spray tin on the long circuit board with the length of more than 620mm, and can not influence tin spraying efficiency and effect.
The invention is realized in the following way: a tin spraying method of a long circuit board comprises the following steps:
step 1, feeding, acid washing, microetching, water washing and drying;
step 2, applying soldering flux, namely uniformly coating the soldering flux on the copper surface of the PCB;
step 3, hanging the PCB, entering a tin spraying machine, and spraying tin for the first time on the PCB, wherein more than 50% of the PCB needs to be sprayed with tin;
step 4, hot air is used for blowing out, namely, hot air is used for blowing out soldering tin on the PCB;
step 5, turning around the PCB, entering a tin spraying machine, carrying out secondary tin spraying, controlling the stroke of the secondary tin spraying, and immersing copper surfaces in the PCB of the lower immersed part into a tin furnace, wherein the secondary tin spraying needs to spray more than 50% of tin of the PCB;
step 6, hot air is used for blowing out, namely, hot air is used for blowing out soldering tin on the PCB;
and 7, washing and drying the PCB again, and discharging.
Further, the first tin spraying temperature is 245 ℃, and the tin dipping time is 2 seconds.
Further, the second tin spraying temperature is 245 ℃, and the tin dipping time is 4 seconds.
Further, a front air knife and a rear air knife are arranged on the tin spraying machine, the distance between the edge of the front air knife and the edge of the rear air knife is about 12-30 mm, the edge of the front air knife is 3-15 mm higher than the edge of the rear air knife, and the angle of the front air knife is 30-50 degrees; the angle of the rear air knife is 50-70 degrees.
The invention has the following advantages: according to the tin spraying method for the long circuit board, tin spraying can be carried out on the long circuit board longer than 620mm, tin spraying is carried out on the PCB twice in the tin spraying process, and in the second tin spraying process, the length of lower dipping is controlled, all copper surfaces in lower dipping are enabled to be immersed into a tin furnace, uniformity of tin spraying in the PCB is guaranteed, and falling-off is avoided.
Drawings
The invention will be further described with reference to examples of embodiments with reference to the accompanying drawings.
Fig. 1 is a flow chart illustrating an implementation of a tin spraying method for a long circuit board according to the present invention.
Fig. 2 is a schematic diagram of a tin spraying method for a long circuit board according to the present invention.
Detailed Description
As shown in fig. 1, the tin spraying method of the long circuit board of the invention comprises the following steps:
step 1, feeding, acid washing, microetching, water washing and drying; wherein, the pan feeding: transferring the PCB to be sprayed to a station to be processed; acid washing: acid cleaning is carried out on the PCB by adopting an acidic cleaning agent; microetching: microetching the PCB by adopting microetching liquid; washing: washing the micro-etched PCB with water to remove residual dirt on the surface; and (3) drying: drying the washed PCB;
step 2, applying soldering flux, namely uniformly coating the soldering flux on the copper surface of the PCB;
step 3, hanging the PCB, entering a tin spraying machine, and carrying out primary tin spraying on the PCB, wherein more than 50% of the PCB needs to be sprayed with tin, the primary tin spraying temperature is 245 ℃, and the tin dipping time is 2 seconds; through the arrangement, the tin spraying for the first time can uniformly spray tin to more than 50% of the PCB;
step 4, hot air is used for blowing out, namely, hot air is used for blowing out soldering tin on the PCB;
step 5, as shown in fig. 2, turning around the PCB 1, entering a tin spraying machine, performing a second tin spraying, controlling the stroke of the second tin spraying, wherein the copper surfaces 11 in the PCB 1 at the lower dipping part are all immersed in the tin furnace 2, the second tin spraying needs to spray tin at more than 50% of the PCB 1, and the tin spraying temperature at 245 ℃ for 4 seconds; in this step, there is a portion crossing the portion in the first tin spraying; the second tin spraying needs to pay attention to the immersion length, and the copper surface on the horizontal plane of the part entering the tin furnace should be fully immersed in the tin furnace, namely the contact position of the PCB 1 and the tin water surface in the tin furnace 2 (namely a horizontal line a formed by the PCB 1 and the tin water surface) is free of copper surface; through the arrangement, tin spraying can be uniform, copper surfaces 11 on the PCB 1 are all tin sprayed, and through the arrangement of tin dipping time, the tin dipping time is twice that of the first tin dipping time, so that tin can be uniformly coated on the crossing part, the influence of the first tin dipping is avoided, and the quality of the PCB 1 is ensured;
step 6, hot air is used for blowing out, namely, hot air is used for blowing out soldering tin on the PCB;
and 7, washing and drying the PCB again, and discharging.
In a preferred embodiment, the tin spraying machine is provided with a front air knife and a rear air knife, the distance between the edge of the front air knife and the edge of the rear air knife is about 12-30 mm, the edge of the front air knife is 3-15 mm higher than the edge of the rear air knife, and the angle of the front air knife is 30-50 degrees; the angle of the rear air knife is 50-70 degrees. The pressure of the front air knife and the rear air knife can be set to be 0.8 to 4kg; through setting up this preceding air knife and back air knife for in step 4 and step 6 hot air blow at ordinary times, make the tin on PCB board surface by even blowing, even attached to the surface of copper, in the later stage soldering in-process, be favorable to more with the part soldering to the PCB board on. For example, the distance between the front air knife edge and the rear air knife edge is about 12mm, the front air knife edge is 15mm higher than the rear air knife edge, and the front air knife angle is 50 degrees; the angle of the rear air knife is 70 degrees; it can also be set as: the distance between the front air knife edge and the rear air knife edge is about 30mm, the front air knife edge is 3mm higher than the rear air knife edge, and the front air knife angle is 30 degrees; the angle of the rear air knife is 50 degrees; the blowing-out effect is good at the moment; it can also be set up to: the distance between the front air knife edge and the rear air knife edge is about 21mm, the front air knife edge is 9mm higher than the rear air knife edge, and the front air knife angle is 40 degrees; the angle of the rear air knife is 60 degrees, and the rear air knife can realize the blowing-leveling effect.
The existing tin spraying machine can perform the immersion after the immersion path is set, and if the immersion path is different from the immersion path of the next time, the immersion path is required to be reset; in the tin spraying process, the immersion lengths required by the first tin spraying and the second tin spraying are different, so that the immersion length is not required to be set for the first tin spraying, the tin spraying is directly carried out by a default path of a tin spraying machine, and the tin spraying cannot be finished once due to the fact that the length of a PCB is too long, the tin spraying can be carried out according to the maximum length of the tin spraying machine during the first tin spraying, the setting is not required, and the setting is only required before the cleaning; the immersion length is set again when the second tin spraying is performed, and the second tin spraying is performed immediately after the first tin spraying is completed, so that the operation of an operator can be greatly and conveniently performed, and the situation of setting errors can be reduced only by one time setting, so that the rejection rate of the PCB is reduced.
While specific embodiments of the invention have been described above, it will be appreciated by those skilled in the art that the specific embodiments described are illustrative only and not intended to limit the scope of the invention, and that equivalent modifications and variations of the invention in light of the spirit of the invention will be covered by the claims of the present invention.
Claims (4)
1. A tin spraying method of a long circuit board is characterized by comprising the following steps: the method comprises the following steps:
step 1, feeding, acid washing, microetching, water washing and drying;
step 2, applying soldering flux, namely uniformly coating the soldering flux on the copper surface of the PCB;
step 3, hanging the PCB, entering a tin spraying machine, and spraying tin for the first time on the PCB, wherein more than 50% of the PCB needs to be sprayed with tin;
step 4, hot air is used for blowing out, namely, hot air is used for blowing out soldering tin on the PCB;
step 5, turning around the PCB, entering a tin spraying machine, carrying out secondary tin spraying, controlling the stroke of the secondary tin spraying, and immersing copper surfaces in the PCB of the lower immersed part into a tin furnace, wherein the secondary tin spraying needs to spray more than 50% of tin of the PCB;
step 6, hot air is used for blowing out, namely, hot air is used for blowing out soldering tin on the PCB;
and 7, washing and drying the PCB again, and discharging.
2. A method of tin spraying a long circuit board according to claim 1, wherein: the first tin spraying temperature is 245 ℃, and the tin dipping time is 2 seconds.
3. A method of tin spraying a long circuit board according to claim 1, wherein: the temperature of the second tin spraying is 245 ℃, and the tin dipping time is 4 seconds.
4. A method of tin spraying a long circuit board according to claim 1, wherein: the tin spraying machine is provided with a front air knife and a rear air knife, the distance between the edge of the front air knife and the edge of the rear air knife is about 12-30 mm, the edge of the front air knife is 3-15 mm higher than the edge of the rear air knife, and the angle of the front air knife is 30-50 degrees; the angle of the rear air knife is 50-70 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311200088.7A CN117377230A (en) | 2023-09-18 | 2023-09-18 | Tin spraying method for long circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311200088.7A CN117377230A (en) | 2023-09-18 | 2023-09-18 | Tin spraying method for long circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117377230A true CN117377230A (en) | 2024-01-09 |
Family
ID=89395398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311200088.7A Pending CN117377230A (en) | 2023-09-18 | 2023-09-18 | Tin spraying method for long circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117377230A (en) |
-
2023
- 2023-09-18 CN CN202311200088.7A patent/CN117377230A/en active Pending
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| PB01 | Publication | ||
| PB01 | Publication |