CN117377216A - Method for enhancing interconnection reliability of blind holes and HDI (high-density interconnect) multilayer board manufactured by same - Google Patents
Method for enhancing interconnection reliability of blind holes and HDI (high-density interconnect) multilayer board manufactured by same Download PDFInfo
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- CN117377216A CN117377216A CN202311558068.7A CN202311558068A CN117377216A CN 117377216 A CN117377216 A CN 117377216A CN 202311558068 A CN202311558068 A CN 202311558068A CN 117377216 A CN117377216 A CN 117377216A
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- copper foil
- foil layer
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- blind holes
- hole
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 195
- 239000011889 copper foil Substances 0.000 claims abstract description 180
- 238000005553 drilling Methods 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 12
- 230000007423 decrease Effects 0.000 claims description 10
- 238000009713 electroplating Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 12
- 230000001965 increasing effect Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
Abstract
The invention discloses a method for enhancing the interconnection reliability of blind holes, which comprises the following steps: manufacturing an inner layer circuit on an inner layer soft board, and manufacturing a pattern for drilling blind hole opposite sites and opening blind holes on the inner layer soft board, wherein the inner layer soft board comprises a first copper foil layer, a second copper foil layer and a third copper foil layer which are arranged on the upper surface and the lower surface of the first copper foil layer; manufacturing a group of symmetrical blind holes on the inner soft board, wherein the blind holes do not penetrate through the first copper foil layer; drilling the first copper foil layer to obtain a connecting hole, wherein the connecting hole is communicated with the blind hole, and the diameter of the connecting hole is smaller than that of the blind hole; and filling the blind holes, wherein the filling material covers the side walls and the bottoms of the blind holes. According to the method for enhancing the interconnection reliability of the blind holes, the phenomenon of copper pitting can be avoided, the residual glue is guaranteed to overflow well in the glue removing process, the copper column can be communicated between the upper copper foil layer, the middle copper foil layer and the lower copper foil layer for conduction, the first blind holes and the second blind holes form butterfly-shaped blind holes, the contact area is increased due to double conduction of the bottoms and the side walls, and the risk of failure of the interconnection of the blind holes is solved.
Description
Technical Field
The invention relates to the technical field of flexible circuit board manufacturing, in particular to a method for enhancing the interconnection reliability of blind holes and an HDI multilayer board manufactured by the method.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
HDI (High Density Interconnector, high-density interconnect) circuit boards are an integral part of all electronic products, and the high-density interconnect circuit boards can meet the demands of lighter, smaller and thinner electronic devices, so that the HDI blind hole technology has been developed in order to increase the wiring density of the HDI circuit boards. With the continuous development and popularization of 5G and artificial intelligence technologies, handheld terminals such as mobile phones, tablet computers, notebook computers and the like become more intelligent, which promotes the increase of the demand for HDI high-density interconnection circuit boards, the structure and technology of the HDI boards gradually develop from the first order, the second order, the third order, the multiple orders and the like, including the latest arbitrary layer interconnection technology, and the application of the HDI boards is increasingly being pursued.
In order to ensure the flatness of the surface of the hole and the flatness of the surface of the circuit, the conventional processing of the circuit blind hole mostly adopts a blind hole electroplating hole filling mode, and then adopts a hole filling grinding plate and a quantitative etching mode to grind the hole opening and obtain a relatively flat etched metal conducting layer.
The HDI multilayer soft and hard combined plate, the inlayer has three-layer soft board, and each layer blind hole interconnection structure, and the unable through-hole that uses of three-layer soft board is filled up, needs to use the blind hole to fill up, and is switched on with outer blind hole interconnection again, and inlayer three-layer soft board is because of structural factor, and the blind hole easily has carbon residue, cull risk, influences the reliability of blind hole.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present invention and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the invention section.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a method for enhancing the interconnection reliability of blind holes and an HDI multi-layer board manufactured by the method, which can ensure that residual glue can well overflow in the process of removing glue in the blind holes, and inner copper cannot cause concave corrosion exceeding defect caused by inner corrosion.
The invention discloses a method for enhancing the interconnection reliability of blind holes, which comprises the following steps:
manufacturing an inner layer circuit on an inner layer flexible board, and manufacturing a pattern for drilling blind hole opposite sites and windowing blind holes on the inner layer flexible board, wherein the inner layer flexible board comprises a first copper foil layer, a second copper foil layer and a third copper foil layer which are arranged on the upper surface and the lower surface of the first copper foil layer;
manufacturing a group of symmetrical blind holes on the inner layer soft board, wherein the blind holes do not penetrate through the first copper foil layer;
drilling the first copper foil layer to obtain a connecting hole, wherein the connecting hole is communicated with the blind hole, and the diameter of the connecting hole is smaller than that of the blind hole;
filling the blind holes, wherein filling materials cover the side walls and the bottoms of the blind holes;
drilling the outer layer plate.
Further, in the method for enhancing the interconnection reliability of the blind holes, in the step of manufacturing a group of symmetrical blind holes on the inner layer flexible board without penetrating through the first copper foil layer, manufacturing a first blind hole on the second copper foil layer, wherein the first blind hole only penetrates through the second copper foil layer but does not penetrate through the first copper foil layer, manufacturing a second blind hole on the third copper foil layer, and the second blind hole only penetrates through the third copper foil layer but does not penetrate through the first copper foil layer, wherein the first copper foil layer is the bottoms of the blind holes of the first blind hole and the second blind hole.
Further, in the method for enhancing the interconnection reliability of the blind holes, the step of manufacturing a group of symmetrical blind holes on the inner layer flexible board without penetrating through the first copper foil layer, the first blind holes and the second blind holes are distributed in a trapezoid shape, the inner diameter of the first blind holes is gradually reduced from the second copper foil layer towards the first copper foil layer, and the inner diameter of the second blind holes is gradually reduced from the third copper foil layer towards the first copper foil layer.
In the method for enhancing the interconnection reliability of the blind holes, in the step of performing laser blind holes on the three layers of inner layer flexible boards, a laser drilling machine is used for aligning the position points by using the blind holes, and blind holes are manufactured according to the positions of the blind holes for opening.
Further, in the method for enhancing the interconnection reliability of the blind holes, the step of drilling the first copper foil layer to obtain the connecting holes, wherein the connecting holes are communicated with the blind holes, and the diameter of the connecting holes is 40 μm.
In the method for enhancing the interconnection reliability of the blind holes, in the step of filling the blind holes, electroplating is adopted to fill the blind holes, and the material for filling the blind holes is copper.
In the method for enhancing the interconnection reliability of the blind holes, in the step of filling the blind holes, the material for filling the blind holes forms copper columns capable of communicating the first copper foil layer, the second copper foil layer and the third copper foil layer in the connecting holes.
Further, the method for enhancing the interconnection reliability of the blind holes, which includes the steps of "drilling the outer layer plate", specifically includes:
attaching a first prepreg to the second copper foil layer, and covering a fourth copper foil layer on the first prepreg for lamination;
laminating a second prepreg on the bottom of the third copper foil layer, and covering a fifth copper foil layer on the second prepreg for lamination;
laser drilling is carried out on the fourth copper foil layer to form a third blind hole, and the third blind hole and the first blind hole are stacked holes;
laser drilling is carried out on the fifth copper foil layer to form a fourth blind hole, and the fourth blind hole and the second blind hole are stacked holes;
and carrying out copper deposition treatment on the fourth copper foil layer and the fifth copper foil layer, manufacturing blind hole plating patterns of the third blind holes and the fourth blind holes, and then carrying out hole filling electroplating.
Furthermore, the invention also discloses an HDI multi-layer board manufactured by adopting the method for enhancing the interconnection reliability of the blind holes, which comprises the following steps:
the inner layer soft board comprises a first copper foil layer, a second copper foil layer and a third copper foil layer, wherein the second copper foil layer and the third copper foil layer are arranged on the upper surface and the lower surface of the first copper foil layer, the first copper foil layer is provided with a connecting hole, the second copper foil layer is provided with a first blind hole, the third copper foil layer is provided with a second blind hole, the first blind hole and the second blind hole are distributed in a trapezoid manner, the first blind hole and the second blind hole are symmetrically arranged along the first copper foil layer, the inner diameter of the first blind hole gradually decreases from the second copper foil layer towards the first copper foil layer, and the inner diameter of the second blind hole gradually decreases from the third copper foil layer towards the first copper foil layer;
the outer layer board is arranged on the upper surface and the lower surface of the inner layer soft board, the outer layer board comprises a fourth copper foil layer and a fifth copper foil layer, the fourth copper foil layer is pressed on the second copper foil layer through a first prepreg, the fifth copper foil layer is pressed on the bottom of the third copper foil layer through a second prepreg, a third blind hole is formed in the fourth copper foil layer, the third blind hole and the first blind hole form a stacked hole, a fourth blind hole is formed in the fifth copper foil layer, and the fourth blind hole and the second blind hole form a stacked hole.
The beneficial effects of the invention are as follows:
according to the method for enhancing the interconnection reliability of the blind holes and the HDI multilayer board manufactured by the method, the first copper foil layer materials at the two ends of the connecting holes can avoid the phenomenon of copper pitting, the connection ensures that residual glue overflows well in the glue removing process, the copper columns can be communicated with the first copper foil layer, the second copper foil layer and the third copper foil layer for conduction, the black holes and the electroplated bottoms and side walls of the first blind holes and the second blind holes are conducted in double mode, the first blind holes and the second blind holes form butterfly-shaped blind holes, the contact area is increased, and the risk of blind hole interconnection failure is fundamentally solved.
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments, as illustrated in the accompanying drawings.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method of enhancing the reliability of blind via interconnects in an embodiment of the invention;
fig. 2 to 3 are schematic diagrams illustrating variations of blind holes made in an inner layer flexible printed circuit board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an HDI multi-layer board according to an embodiment of the present invention.
Reference numerals of the above drawings: 1. a first copper foil layer; 11. a connection hole; 2. a second copper foil layer; 21. a first blind hole; 3. a third copper foil layer; 31. a second blind hole; 4. a fourth copper foil layer; 41. a third blind hole; 5. a fifth copper foil layer; 51. a fourth blind hole; 6. AD glue.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, in the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference between them, nor should they be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
The following is a detailed description of embodiments with reference to fig. 1 to 4.
The invention discloses a method for enhancing the interconnection reliability of blind holes, which comprises the following steps: .
Manufacturing an inner layer circuit on an inner layer flexible board, and manufacturing a pattern for drilling blind hole opposite sites and windowing blind holes on the inner layer flexible board, wherein the inner layer flexible board comprises a first copper foil layer 1, a second copper foil layer 2 and a third copper foil layer 3 which are arranged on the upper surface and the lower surface of the first copper foil layer 1;
manufacturing a group of symmetrical blind holes on the inner layer soft board, wherein the blind holes do not penetrate through the first copper foil layer 1;
drilling the first copper foil layer 1 to obtain a connecting hole 11, wherein the connecting hole 11 is communicated with the blind hole, and the diameter of the connecting hole 11 is smaller than that of the blind hole;
filling the blind holes, wherein filling materials cover the side walls and the bottoms of the blind holes;
drilling the outer layer plate.
Specifically, in this embodiment, in the step of "making a set of symmetrical blind holes for the inner layer flexible board, and not penetrating through the first copper foil layer 1", making the first blind holes 21 for the second copper foil layer 2, the first blind holes 21 only penetrate through the second copper foil layer 2, but not penetrate through the first copper foil layer 1, making the second blind holes 31 for the third copper foil layer 3, the second blind holes 31 only penetrate through the third copper foil layer 3, but not penetrate through the first copper foil layer 1, and the first copper foil layer 1 is the blind hole bottoms of the first blind holes 21 and the second blind holes 31.
Specifically, in this embodiment, in the step of "making a group of symmetrical blind holes for the inner layer flexible board, and not penetrating through the first copper foil layer 1", the first blind holes 21 and the second blind holes 31 are all distributed in a trapezoid, and the inner diameter of the first blind holes 21 gradually decreases from the second copper foil layer 2 toward the first copper foil layer 1, and the inner diameter of the second blind holes 31 gradually decreases from the third copper foil layer 3 toward the first copper foil layer 1.
Specifically, in this embodiment, in the step of performing laser blind holes on the three layers of the inner layer flexible board, a laser drilling machine is used to align the positions of the blind holes, and a blind hole is manufactured according to the position of the blind hole for opening.
Specifically, in this embodiment, step "the first copper foil layer 1 is drilled to obtain a connection hole 11, the connection hole 11 is in communication with the blind hole," the diameter of the connection hole 11 is 40 μm. The overflow of residual glue can be convenient for in the process of removing glue in the connecting hole, the diameter of the connecting hole 11 is smaller than the minimum diameter of the first blind hole 21 and the second blind hole 22, the copper pitting phenomenon can be avoided by the first copper foil layer 1 material at the two ends of the connecting hole 11, and the connecting hole 11 is matched with the inclined surfaces of the first blind hole and the second blind hole, so that the residual glue can be well overflowed in the process of removing glue.
Specifically, in this embodiment, in the step of "filling the blind hole", electroplating is used to fill the blind hole, and the material for filling the blind hole is copper.
Specifically, in this embodiment, in the step of "filling the blind hole", the material for filling the blind hole forms a copper pillar in the connecting hole 11, which can be communicated with the first copper foil layer 1, the second copper foil layer 2 and the third copper foil layer 3, so as to ensure that the bottom and the side wall of the first blind hole and the second blind hole after the black hole and the electroplating are conducted in double, and the first blind hole and the second blind hole form a butterfly-shaped blind hole, thereby increasing the contact area and fundamentally solving the risk of failure of the interconnection of the blind holes.
Specifically, in this embodiment, the step of "drilling the outer layer plate" specifically includes:
attaching a first prepreg to the second copper foil layer 2, and covering a fourth copper foil layer 4 on the first prepreg for lamination;
laminating a second prepreg on the bottom of the third copper foil layer 3, and covering a fifth copper foil layer 5 on the second prepreg for lamination;
drilling holes on the fourth copper foil layer 4 by laser to form a third blind hole 41, wherein the third blind hole 41 and the first blind hole 21 are stacked holes;
laser drilling is performed on the fifth copper foil layer 5 to form a fourth blind hole 51, and the fourth blind hole 51 and the second blind hole 31 are stacked holes;
and carrying out copper deposition treatment on the fourth copper foil layer 4 and the fifth copper foil layer 5, manufacturing blind hole plating patterns of the third blind holes 41 and the fourth blind holes 51, and then carrying out hole filling electroplating.
Specifically, as shown in fig. 4, in this embodiment, there is further provided an HDI multilayer board manufactured by using the method for enhancing the reliability of blind hole interconnection, including:
the inner layer flexible board comprises a first copper foil layer 1, a second copper foil layer 2 and a third copper foil layer 3, wherein the second copper foil layer 2 and the third copper foil layer 3 are arranged on the upper surface and the lower surface of the first copper foil layer 1, the first copper foil layer 1 is provided with a connecting hole 11, the second copper foil layer 2 is provided with a first blind hole 21, the third copper foil layer 3 is provided with a second blind hole 31, the first blind hole 21 and the second blind hole 31 are distributed in a trapezoid shape, the first blind hole 21 and the second blind hole 31 are symmetrically arranged along the first copper foil layer 1, the inner diameter of the first blind hole 21 gradually decreases from the second copper foil layer 2 towards the first copper foil layer 1, the inner diameter of the second blind hole 31 gradually decreases from the third copper foil layer 3 towards the first copper foil layer 1, and an AD glue 6 is arranged between the first copper foil layer 1 and the second copper foil layer 2;
the outer layer board of setting in both sides about the inlayer soft board, the outer layer board includes fourth copper foil layer 4 and fifth copper foil layer 5, fourth copper foil layer 4 is in through first prepreg pressfitting on the second copper foil layer 2, fifth copper foil layer 5 is in through the second prepreg pressfitting the bottom of third copper foil layer 3, be equipped with third blind hole 41 on the fourth copper foil layer 4, and third blind hole 41 and first blind hole 21 form the hole of folding, be equipped with fourth blind hole 51 on the fifth copper foil layer 5, and fourth blind hole 51 and second blind hole 31 form the hole of folding.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.
Claims (9)
1. A method of enhancing the reliability of a blind via interconnect, comprising the steps of:
manufacturing an inner layer circuit on an inner layer flexible board, and manufacturing a pattern for drilling blind hole opposite sites and windowing blind holes on the inner layer flexible board, wherein the inner layer flexible board comprises a first copper foil layer, a second copper foil layer and a third copper foil layer which are arranged on the upper surface and the lower surface of the first copper foil layer;
manufacturing a group of symmetrical blind holes on the inner layer soft board, wherein the blind holes do not penetrate through the first copper foil layer;
drilling the first copper foil layer to obtain a connecting hole, wherein the connecting hole is communicated with the blind hole, and the diameter of the connecting hole is smaller than that of the blind hole;
filling the blind holes, wherein filling materials cover the side walls and the bottoms of the blind holes;
drilling the outer layer plate.
2. The method of claim 1, wherein in the step of forming a set of symmetrical blind vias in the inner layer flexible board without penetrating the first copper foil layer, forming a first blind via in the second copper foil layer, wherein the first blind via penetrates only the second copper foil layer but does not penetrate the first copper foil layer, forming a second blind via in the third copper foil layer, wherein the second blind via penetrates only the third copper foil layer but does not penetrate the first copper foil layer, and wherein the first copper foil layer is the blind via bottoms of the first blind via and the second blind via.
3. The method of claim 2, wherein in the step of forming a set of symmetrical blind holes in the inner layer flexible board without penetrating the first copper foil layer, the first blind holes and the second blind holes are each distributed in a trapezoid shape, and the inner diameter of the first blind holes gradually decreases from the second copper foil layer toward the first copper foil layer, and the inner diameter of the second blind holes gradually decreases from the third copper foil layer toward the first copper foil layer.
4. The method for enhancing the interconnection reliability of blind holes according to claim 1, wherein in the step of performing laser blind holes on the three layers of the inner layer flexible board, a laser drilling machine is used for aligning the positions of the blind holes and manufacturing blind holes according to the positions of the blind holes.
5. The method of enhancing interconnect reliability of blind holes according to claim 1, wherein step "the first copper foil layer is drilled to obtain connection holes, which are in communication with the blind holes," wherein the connection holes have a diameter of 40 μm.
6. The method of claim 1, wherein in the step of filling the blind via, electroplating is used to fill the blind via, and the material used to fill the blind via is copper.
7. The method of enhancing interconnect reliability of blind via of claim 6, wherein in the step of "filling blind via", the material filling blind via forms a copper pillar capable of communicating the first copper foil layer, the second copper foil layer and the third copper foil layer in the connection via.
8. The method for enhancing the interconnection reliability of blind holes according to claim 1, characterized in that the step of drilling the outer laminate comprises:
attaching a first prepreg to the second copper foil layer, and covering a fourth copper foil layer on the first prepreg for lamination;
laminating a second prepreg on the bottom of the third copper foil layer, and covering a fifth copper foil layer on the second prepreg for lamination;
laser drilling is carried out on the fourth copper foil layer to form a third blind hole, and the third blind hole and the first blind hole are stacked holes;
laser drilling is carried out on the fifth copper foil layer to form a fourth blind hole, and the fourth blind hole and the second blind hole are stacked holes;
and carrying out copper deposition treatment on the fourth copper foil layer and the fifth copper foil layer, manufacturing blind hole plating patterns of the third blind holes and the fourth blind holes, and then carrying out hole filling electroplating.
9. An HDI multilayer board manufactured by the method of enhancing the reliability of blind via interconnection of any one of claims 1 to 8, comprising:
the inner layer soft board comprises a first copper foil layer, a second copper foil layer and a third copper foil layer, wherein the second copper foil layer and the third copper foil layer are arranged on the upper surface and the lower surface of the first copper foil layer, the first copper foil layer is provided with a connecting hole, the second copper foil layer is provided with a first blind hole, the third copper foil layer is provided with a second blind hole, the first blind hole and the second blind hole are distributed in a trapezoid manner, the first blind hole and the second blind hole are symmetrically arranged along the first copper foil layer, the inner diameter of the first blind hole gradually decreases from the second copper foil layer towards the first copper foil layer, and the inner diameter of the second blind hole gradually decreases from the third copper foil layer towards the first copper foil layer;
the outer layer board is arranged on the upper surface and the lower surface of the inner layer soft board, the outer layer board comprises a fourth copper foil layer and a fifth copper foil layer, the fourth copper foil layer is pressed on the second copper foil layer through a first prepreg, the fifth copper foil layer is pressed on the bottom of the third copper foil layer through a second prepreg, a third blind hole is formed in the fourth copper foil layer, the third blind hole and the first blind hole form a stacked hole, a fourth blind hole is formed in the fifth copper foil layer, and the fourth blind hole and the second blind hole form a stacked hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311558068.7A CN117377216A (en) | 2023-11-22 | 2023-11-22 | Method for enhancing interconnection reliability of blind holes and HDI (high-density interconnect) multilayer board manufactured by same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311558068.7A CN117377216A (en) | 2023-11-22 | 2023-11-22 | Method for enhancing interconnection reliability of blind holes and HDI (high-density interconnect) multilayer board manufactured by same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117377216A true CN117377216A (en) | 2024-01-09 |
Family
ID=89407978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311558068.7A Pending CN117377216A (en) | 2023-11-22 | 2023-11-22 | Method for enhancing interconnection reliability of blind holes and HDI (high-density interconnect) multilayer board manufactured by same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117377216A (en) |
-
2023
- 2023-11-22 CN CN202311558068.7A patent/CN117377216A/en active Pending
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