CN117352443B - Bump reflow packaging welding equipment - Google Patents
Bump reflow packaging welding equipment Download PDFInfo
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- CN117352443B CN117352443B CN202311651302.0A CN202311651302A CN117352443B CN 117352443 B CN117352443 B CN 117352443B CN 202311651302 A CN202311651302 A CN 202311651302A CN 117352443 B CN117352443 B CN 117352443B
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- main cavity
- opening mechanism
- vacuum
- cover
- turntable
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- 238000004806 packaging method and process Methods 0.000 title abstract description 18
- 238000003466 welding Methods 0.000 title abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 100
- 238000001514 detection method Methods 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 7
- 239000007789 gas Substances 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 10
- 230000003028 elevating effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 26
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000008676 import Effects 0.000 description 6
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 235000019253 formic acid Nutrition 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
Abstract
The invention relates to the technical field of reflow packaging and welding, and provides bump reflow packaging and welding equipment, which comprises: the device comprises a plurality of lifting mechanisms, a main cavity upper cover, a plurality of upper vacuum bins, a plurality of lower vacuum bins and a turntable; the main cavity upper cover sets up main cavity top, the main cavity with be provided with the carousel between the main cavity upper cover, the main cavity upper cover sets up a plurality of go up the vacuum storehouse, main cavity below sets up a plurality of vacuum storehouse down, a plurality of go up the vacuum storehouse with a plurality of vacuum storehouse forms a plurality of independent vacuum storehouse environment down, lower vacuum storehouse one-to-one sets up elevating system, a plurality of independent vacuum storehouse do not influence each other, have improved wafer process quality.
Description
Technical Field
The invention relates to the technical field of reflow packaging welding, in particular to bump reflow packaging welding equipment.
Background
The reflow soldering process is an important process flow in the field of electronic processes, and is mainly used for soldering some tiny components. Reflow soldering is also used in advanced semiconductor packaging processes to form the leads of the chip. When the traditional reflow soldering process is performed in a flux manner, the flux needs to be coated in advance, and after the reflow process is finished, the flux needs to be cleaned, so that the process is complex and the production cost is high. The advanced packaging process of the semiconductor adopts a more advanced formic acid reflow process, does not need spin coating or cleaning of soldering flux, and has the advantages of simple process, low cost and high productivity. However, the same type of equipment in the industry is few at present, and only a few foreign manufacturers have similar equipment, so that the turntable runs unstably, and the welding effect is poor.
Disclosure of Invention
The invention provides bump reflow packaging welding equipment which is used for solving the problems that chip packaging is not an independent vacuum bin, the chip packaging is mutually influenced and the processing quality of wafers is low in the prior art.
A bump reflow package soldering apparatus, comprising:
the device comprises a plurality of lifting mechanisms, a main cavity upper cover, a plurality of upper vacuum bins, a plurality of lower vacuum bins and a turntable; the main cavity upper cover sets up main cavity top, the main cavity with be provided with the carousel between the main cavity upper cover, the main cavity upper cover sets up a plurality of go up the vacuum storehouse, main cavity below sets up a plurality of vacuum storehouse down, a plurality of go up the vacuum storehouse with a plurality of vacuum storehouse forms a plurality of independent vacuum storehouse environment down, lower vacuum storehouse one-to-one sets up elevating system.
According to the bump reflow packaging welding equipment disclosed by the invention, the main cavity upper cover comprises a first opening mechanism, a second opening mechanism, an inlet sealing cover, an upper cavity cover and a filtering structure, wherein the upper cavity cover comprises a first opening mechanism and a second opening mechanism: the filter structure set up in the central authorities of upper chamber lid, the first side symmetry of upper chamber lid sets up first opening mechanism with second opening mechanism, the import sealed lid set up in first opening mechanism with the centre of second opening mechanism, first opening mechanism with second opening mechanism is used for opening the import sealed lid, the filter structure is used for right the evacuation is carried out in independent vacuum storehouse and is filtered.
The bump reflow packaging welding equipment further comprises a third opening mechanism and a fourth opening mechanism, wherein the third opening mechanism and the fourth opening mechanism are respectively arranged on the second side and the third side of the upper cavity cover, and the third opening mechanism and the fourth opening mechanism are used for opening the upper cavity cover.
The bump reflow packaging welding equipment further comprises a main cavity closing detection device upper portion and a plurality of locking structures, wherein the main cavity closing detection device upper portion is arranged on the fourth side of the upper cavity cover, and the locking structures are arranged on the edge of the upper cavity cover.
According to the bump reflow packaging welding equipment, the first opening mechanism and the second opening mechanism are symmetrically arranged at the notch of the inlet sealing cover.
The bump reflow packaging welding equipment according to the invention further comprises: and the plurality of the universal wheels are circularly distributed along the turntable below the turntable.
The bump reflow packaging welding equipment provided by the invention further comprises a lower part of a main cavity body closing detection device, wherein the lower part of the main cavity body closing detection device is arranged at the edge of the main cavity body and corresponds to the upper part of the main cavity body closing detection device.
According to the bump reflow soldering apparatus of the present invention,
the multiple independent vacuum bin environments are respectively set into a preheating zone vacuum bin, a heating zone vacuum bin, a wafer processing zone vacuum bin, a precooling zone vacuum bin and a cooling zone vacuum bin according to the working flow, and the multiple independent vacuum bin environments provide vacuum environments, inert gas environments or reducing gas environments.
According to the bump reflow packaging welding equipment disclosed by the invention, the main cavity comprises a chassis and an angular rotating mechanism, the angular rotating mechanism is arranged in the middle of the chassis, and the turntable is arranged on the angular rotating mechanism.
According to the bump reflow packaging welding equipment, the angle rotating mechanism comprises a driving mechanism and an angle divider, and the driving mechanism drives the angle divider to rotate at a certain angle.
The invention improves the processing quality of the wafer by independent vacuum chambers without influencing each other. The upper part of the main cavity body closing detection device structure and the lower part of the main cavity body closing detection device structure are staggered, the T-shaped mechanism end is a horizontal line, the main cavity body closing detection device is best in effect, and the precision is highest. The universal balls are arranged below the turntable along the turntable in a plurality of circular shapes, play a supporting role, reduce the resistance of the turntable, ensure better turntable rotation precision and improve the wafer processing quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a bump reflow package soldering apparatus 1;
FIG. 2 is a schematic diagram of a bump reflow package soldering apparatus 2;
FIG. 3 is a schematic view of the structure of the main cavity upper cover;
FIG. 4 is a schematic structural view of a main cavity;
FIG. 5 is a schematic structural view of a main cavity upper cover and main cavity combination;
FIG. 6 is a partially enlarged schematic view of the structure of A;
FIG. 7 is a partially enlarged schematic view of structure B;
FIG. 8 is a schematic structural view of a turntable;
FIG. 9 is a schematic view of the structure of a ball;
reference numerals: 1. a main cavity; 2. a main cavity upper cover 2; 3. a vacuum bin is arranged; 4. a lower vacuum bin; 5. a wafer robot; 11. the lower part of the main cavity closing detection device; 12. an angle rotation mechanism; 13. a universal wheel mounting groove; 14. a turntable; 15. a universal wheel; 16. a chassis; 17. a lifting mechanism; 21. the upper part of the main cavity closing detection device; 22. a first opening mechanism; 23. a second opening mechanism; 24. a third opening mechanism; 25. a fourth opening mechanism; 26. a locking structure; 27. an inlet sealing cover; 28. an upper cavity cover; 29. a filtering structure; 31. a vacuum bin of the preheating zone; 32. heating a vacuum bin; 33. a vacuum chamber of the wafer processing area; 34. a vacuum bin of the precooling area; 35. and (5) cooling the vacuum bin in the cooling area.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.
In embodiments of the invention, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
A bump reflow package soldering apparatus according to an embodiment of the present invention is described below with reference to fig. 1 to 9, including: a plurality of lifting mechanisms 17, a main cavity 1, a main cavity upper cover 2, a plurality of upper vacuum chambers 3, a plurality of lower vacuum chambers 4 and a turntable 14; the main cavity upper cover 2 sets up in main cavity 1 top, is provided with carousel 14 between main cavity 1 and the main cavity upper cover 2, and main cavity upper cover 2 sets up a plurality of vacuum warehouses 3, and main cavity 1 below sets up a plurality of vacuum warehouses 4 down, and a plurality of vacuum warehouses 3 and a plurality of vacuum warehouses 4 down form a plurality of independent vacuum warehouses environment, and vacuum warehouses 4 one-to-one set up elevating system 17 down. Independent vacuum does not affect each other, and the processing quality of the wafer is improved.
In addition, the lifting mechanism 17 performs movement position control on the electric cylinder through the photoelectric sensor, so that the movement precision is ensured.
The plurality of independent vacuum chamber environments are respectively set as a preheating zone vacuum chamber 31, a heating zone vacuum chamber 32, a wafer processing zone vacuum chamber 33, a pre-cooling zone vacuum chamber 34 and a cooling zone vacuum chamber 35 according to the working process, and provide a vacuum environment, an inert gas environment or a reducing gas environment.
The main cavity upper cover 2 comprises a first opening mechanism 22, a second opening mechanism 23, an inlet sealing cover 27, an upper cavity cover 28 and a filtering structure 29; the first opening mechanism 22 and the second opening mechanism 23 may be air cylinders or electric cylinders. The filter structure 29 sets up in the central authorities of upper chamber lid 28, the first side symmetry of upper chamber lid 28 sets up first opening mechanism 22 and second opening mechanism 23, the sealed lid 27 of import sets up in the centre of first opening mechanism 22 and second opening mechanism 23, first opening mechanism 22 and second opening mechanism 23 are used for opening sealed lid 27 of import, first opening mechanism 22 and second opening mechanism 23 symmetry set up the breach department at sealed lid 27 of import, be equipped with the joint in breach right angle department, be equipped with 2 joints in 2 right angle departments for the cooperation is opened by first opening mechanism 22 and second opening mechanism 23, this setting is very favorable to the opening of sealed lid 27 of import. The opening width of the inlet sealing cover 27 is limited at the right angle of the notch and at the upright edges of the first opening mechanism 22 and the second opening mechanism 23, so that the inlet sealing cover 27 and the wafer are protected. The wafer robot 5 conveys the wafer through the inlet seal cover 27, and the first opening mechanism 22 and the second opening mechanism 23 open the inlet seal cover 27.
The filter structure 29 is used to evacuate and filter the individual vacuum chambers.
In another embodiment of the present invention, a third opening mechanism 24 and a fourth opening mechanism 25 are further included, the second side and the third side of the upper cavity cover 28 are respectively provided with the third opening mechanism 24 and the fourth opening mechanism 25, and the third opening mechanism 24 and the fourth opening mechanism 25 are matched with the use of the supporting structure of the bump reflow apparatus for opening the upper cavity cover 2. The third opening mechanism 24 and the fourth opening mechanism 25 are air cylinders or electric cylinders.
In addition, the bump reflow soldering apparatus further includes a main cavity closing detecting device upper portion 21, a lower portion 11 of the main cavity closing detecting device structure, and a plurality of locking structures 26, the fourth side of the upper cavity cover 28 is provided with the main cavity closing detecting device upper portion 21, and the edge of the upper cavity cover 28 is provided with the plurality of locking structures 26. The main cavity closure detection device lower part 11 is provided at the edge of the main cavity 1 and corresponds to the main cavity closure detection device upper part 21. The upper part 21 of the main cavity closing detection device is a T-shaped mechanism, and the lower part 11 of the main cavity closing detection device is also a T-shaped mechanism. The upper part 21 of the main cavity body closing detection device structure and the lower part 11 of the main cavity body closing detection device structure are staggered, the T-shaped mechanism end is a horizontal line, the main cavity body closing detection device has the best effect and highest precision, and the sealing of the main cavity body and the processing quality of wafers are ensured.
The main cavity 1 includes a chassis 16 and an angular rotation mechanism 12, the angular rotation mechanism 12 is disposed in the middle of the chassis 16, and the turntable 14 is disposed on the angular rotation mechanism 12.
The angular rotation mechanism 12 includes a driving mechanism and an angle divider, and the driving mechanism drives the angle divider to rotate at a certain angle. The drive mechanism may be a servo mechanism. The structure of the servo mechanism and the angle divider is adopted, the angle rotation is accurate, poor control during rotation is avoided, and the working efficiency is improved.
As shown in fig. 8 and 9, in another alternative embodiment of the present invention, further includes: the invention sets 2 groups of circular distribution, one group of circular distribution is close to the inner side of the independent vacuum bin, and the other group is close to the outer side of the independent vacuum bin and symmetrically distributed along the axis, so that the universal ball 15 can play a better supporting role, the resistance of the turntable 14 is reduced, and the rotation precision of the turntable 14 is better.
The working flow of the bump reflow packaging welding equipment is as follows:
the wafer manipulator 5 grabs a first wafer, the preheating zone vacuum chamber 31 is opened, the angle rotating mechanism rotates for 60 degrees, and the first wafer enters the preheating zone vacuum chamber 31; the vacuum chamber 31 of the preheating zone is closed, nitrogen supplement replacement and formic acid filling are carried out according to the requirements, and the heater starts to work for preheating.
After the first wafer reaches the preheating standard, the heating zone vacuum bin 32 is opened, the angle rotating mechanism rotates for 60 degrees, and the first wafer enters the heating zone vacuum bin 32; the heating zone vacuum chamber 32 is closed, nitrogen make-up substitution and formic acid filling are performed as required, and the heater begins to operate.
After the first wafer reaches the heating standard, the heating zone vacuum bin 32 is opened, the angular rotation mechanism rotates by 60 degrees, and the first wafer enters the wafer processing zone vacuum bin 34; the wafer processing area vacuum chamber 34 is closed and nitrogen make-up replacement and formic acid fill are performed as needed.
After the first wafer is processed, the vacuum bin 34 of the wafer processing area is opened, the angle rotating mechanism rotates for 60 degrees, and the first wafer enters the vacuum bin 34 of the pre-cooling area; the pre-cooling zone vacuum chamber 34 is closed and the cooling device is started. After the precooling reaches the standard, the mixture enters a cooling area vacuum bin 35, the flow is the same as that of the precooling area, and the temperature reaches the room temperature.
And after cooling, the wafer rotates to the inlet and outlet areas, and the wafer is taken out by the mechanical arm. And then proceeds to the next cycle.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A bump reflow package soldering apparatus, comprising:
the device comprises a plurality of lifting mechanisms, a main cavity upper cover, a plurality of upper vacuum bins, a plurality of lower vacuum bins and a turntable; the main cavity upper cover is arranged above the main cavity, a turntable is arranged between the main cavity and the main cavity upper cover, the main cavity upper cover is provided with a plurality of upper vacuum chambers, the lower vacuum chambers are arranged below the main cavity, the upper vacuum chambers and the lower vacuum chambers form a plurality of independent vacuum chamber environments, and the lower vacuum chambers are provided with lifting mechanisms in one-to-one correspondence;
the main cavity upper cover comprises a first opening mechanism, a second opening mechanism, an inlet sealing cover, an upper cavity cover and a filtering structure: the filtering structure is arranged in the center of the upper cavity cover, the first side of the upper cavity cover is symmetrically provided with the first opening mechanism and the second opening mechanism, the inlet sealing cover is arranged between the first opening mechanism and the second opening mechanism, the first opening mechanism and the second opening mechanism are used for opening the inlet sealing cover, and the filtering structure is used for vacuumizing and filtering the independent vacuum bin;
the first opening mechanism and the second opening mechanism are symmetrically arranged at the right angle of the notch of the inlet sealing cover;
further comprises: the plurality of the universal wheels are circularly distributed along the turntable below the turntable, one group of the universal wheels are close to the inner side of the independent vacuum bin, and the other group of the universal wheels are close to the outer side of the independent vacuum bin and are symmetrically distributed along the axis;
the multiple independent vacuum bin environments are respectively set into a preheating zone vacuum bin, a heating zone vacuum bin, a wafer processing zone vacuum bin, a precooling zone vacuum bin and a cooling zone vacuum bin according to the working flow, and the multiple independent vacuum bin environments provide vacuum environments, inert gas environments or reducing gas environments.
2. The bump reflow package soldering apparatus in accordance with claim 1, further comprising a third opening mechanism and a fourth opening mechanism, the second side and the third side of the upper cavity cover being provided with a third opening mechanism and a fourth opening mechanism, respectively, the third opening mechanism and the fourth opening mechanism being for opening the upper cavity cover.
3. The bump reflow package soldering apparatus in accordance with claim 1, further comprising a main cavity closure detection device upper portion and a plurality of locking structures, wherein the fourth side of the upper cavity cover is provided with the main cavity closure detection device upper portion, and the edge of the upper cavity cover is provided with the plurality of locking structures.
4. The bump reflow package soldering apparatus in accordance with claim 1, further comprising: and the plurality of the universal wheels are circularly distributed along the turntable below the turntable.
5. The bump reflow package apparatus in accordance with claim 3, further comprising a main cavity closure detection device lower portion disposed at an edge of the main cavity and corresponding to an upper portion of the main cavity closure detection device.
6. The bump reflow package apparatus in accordance with claim 1, wherein the main cavity includes a chassis and an angular rotation mechanism disposed intermediate the chassis, the turntable being disposed on the angular rotation mechanism.
7. The bump reflow package soldering apparatus in accordance with claim 1, wherein the angular rotation mechanism comprises a driving mechanism and an angular divider, the driving mechanism driving the angular divider to rotate at an angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311651302.0A CN117352443B (en) | 2023-12-05 | 2023-12-05 | Bump reflow packaging welding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311651302.0A CN117352443B (en) | 2023-12-05 | 2023-12-05 | Bump reflow packaging welding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117352443A CN117352443A (en) | 2024-01-05 |
| CN117352443B true CN117352443B (en) | 2024-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311651302.0A Active CN117352443B (en) | 2023-12-05 | 2023-12-05 | Bump reflow packaging welding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117352443B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05245624A (en) * | 1992-02-26 | 1993-09-24 | Oki Electric Ind Co Ltd | Device and method for reflowing solder |
| US5338008A (en) * | 1990-11-15 | 1994-08-16 | Senju Metal Industry Co., Ltd. | Solder reflow furnace |
| CN114029578A (en) * | 2021-10-26 | 2022-02-11 | 江苏雷博微电子设备有限公司 | Reflow soldering process and module structure thereof |
| CN116705668A (en) * | 2023-08-02 | 2023-09-05 | 江苏新智达新能源设备有限公司 | Closed encapsulation curing mechanism and encapsulation curing method for formic acid system |
-
2023
- 2023-12-05 CN CN202311651302.0A patent/CN117352443B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5338008A (en) * | 1990-11-15 | 1994-08-16 | Senju Metal Industry Co., Ltd. | Solder reflow furnace |
| JPH05245624A (en) * | 1992-02-26 | 1993-09-24 | Oki Electric Ind Co Ltd | Device and method for reflowing solder |
| CN114029578A (en) * | 2021-10-26 | 2022-02-11 | 江苏雷博微电子设备有限公司 | Reflow soldering process and module structure thereof |
| CN116705668A (en) * | 2023-08-02 | 2023-09-05 | 江苏新智达新能源设备有限公司 | Closed encapsulation curing mechanism and encapsulation curing method for formic acid system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117352443A (en) | 2024-01-05 |
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