CN117352439B - High-precision semiconductor element packaging hot press - Google Patents
High-precision semiconductor element packaging hot press Download PDFInfo
- Publication number
- CN117352439B CN117352439B CN202311643595.8A CN202311643595A CN117352439B CN 117352439 B CN117352439 B CN 117352439B CN 202311643595 A CN202311643595 A CN 202311643595A CN 117352439 B CN117352439 B CN 117352439B
- Authority
- CN
- China
- Prior art keywords
- base
- fixedly connected
- hot press
- piece
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 43
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 30
- 230000007306 turnover Effects 0.000 claims description 27
- 230000007246 mechanism Effects 0.000 claims description 25
- 238000003756 stirring Methods 0.000 claims description 17
- 238000007731 hot pressing Methods 0.000 claims description 16
- 238000005096 rolling process Methods 0.000 claims description 12
- 230000001276 controlling effect Effects 0.000 claims 2
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000003860 storage Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a high-precision semiconductor element packaging hot press, which relates to the field of semiconductor packaging hot press and solves the problems that the size of a hot press cavity is tightly attached to elements when the traditional high-precision semiconductor element packaging hot press is used and the storage and taking efficiency in the production process is affected.
Description
Technical Field
The invention relates to the technical field of semiconductor element packaging hot pressing, in particular to a high-precision semiconductor element packaging hot press.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors have wide applications in radios, televisions, and thermometry. Such as diodes, are devices fabricated using semiconductors. A semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. After the semiconductor is manufactured, the semiconductor needs to be packaged by a hot press, so that adverse effects of the external environment on the semiconductor element can be avoided.
When the packaging film for packaging the semiconductor element is used in the current semiconductor element packaging hot press, the packaging film is used for bonding the upper film and the lower film together after being hot-melted in the heat sealing process, so that the semiconductor element is packaged in the packaging film, however, the size of a hot pressing cavity of the existing hot press is relatively fixed in the using process, and the hot pressing cavity is generally required to be attached to a packaging shell just, so that the semiconductor element packaging hot press can be put in after being accurately aligned when the element is stored, the outer wall of the element is hard to be taken out after the hot pressing is finished, and the production efficiency is greatly reduced. For this reason, we propose a high-precision semiconductor device package thermocompressor.
Disclosure of Invention
The invention aims to provide a high-precision semiconductor element packaging hot press which is convenient for improving the loading and unloading and demoulding efficiency of semiconductor elements, so as to solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a high-precision semiconductor element encapsulation hot press, includes organism, lower mould mechanism and shake mechanism, the upside fixedly connected with mount and bottom plate of organism, lower mould mechanism include with the bottom plate is followed horizontal direction sliding connection's base, be equipped with two sets of upset moulds on the base, be equipped with in the base and be used for control the control of upset mould upset state's control, lower mould mechanism is used for the base get into when the mount bottom is passed through control both sides the upset mould rotates and is the horizontality the base leaves control when the mount downside upset slope of upset mould promotes the efficiency of drawing of patterns and pan feeding, shake mechanism include with two sets of rolling discs that the base rotates to be connected, be equipped with the multiunit on the rolling disc be used for right the stirring piece that the upset mould bottom was stirred, be equipped with on the rolling disc and be used for the base is kept away from when the mount bottom position the rolling disc keeps when the base is close to the mount the static driving piece of rolling disc, be convenient for promote semiconductor element and go up unloading and drawing of patterns efficiency.
Preferably, the lower die mechanism further comprises a fixed die fixedly mounted on the base, the lower die cavities capable of being mutually communicated are formed in the overturning die and the fixed die, fixed pipes are fixedly connected to two sides of the fixed die, two groups of lower die cavities are fixedly connected with rotating shafts connected with the inner walls of the fixed pipes in a rotating mode, device grooves are formed in the base, control pieces are mounted in the device grooves, the whole assembly structure of the lower die cavities is changed, and the elements are more convenient to feed and discharge.
Preferably, the control piece comprises a fixed block fixedly mounted at the bottom end of the turnover mould, a first connecting rod is rotationally connected to the side face of the fixed block, a second connecting rod is slidably connected to the outer wall of the first connecting rod, a tension spring fixedly connected with the second connecting rod is fixedly connected to the first connecting rod, a driving block is rotationally connected to one end of the second connecting rod, which is far away from the first connecting rod, the driving block is slidably connected with the inner wall of the device groove along the horizontal direction, and an adjusting piece for moving and adjusting the driving block in a linkage mode when the base moves is arranged in the device groove, so that the turnover state of the turnover mould is controlled conveniently.
Preferably, the adjusting piece includes with two sets of dwang that device inslot wall rotated and is connected, two sets of coaxial fixedly connected with gear post between the dwang, evenly set up the multiunit on the bottom plate with gear post engaged with gear groove, two sets of dwang run through both sides respectively the driving piece, set up on the dwang with driving piece threaded connection's thread groove is convenient for link when the base removes the driving piece removes and adjusts.
Preferably, the shake mechanism further comprises a reset spring fixedly mounted at one end of the stirring block, one side of the rotating disc is coaxially and fixedly connected with a connecting shaft connected with the rotating device groove in a rotating mode, a plurality of groups of sliding grooves are uniformly formed in the rotating disc, the stirring block is in sliding connection with the inner wall of the sliding groove, the reset spring is far away from one end of the stirring block and is fixedly connected with the sliding groove, the bottom end of the turnover mould is convenient to be impacted through the stirring block, the turnover mould shakes in the turnover process, and the demoulding efficiency is improved.
Preferably, the driving piece comprises a bevel gear coaxially and fixedly arranged on the rotating rod, a bevel gear ring is coaxially and rotatably connected to the side surface of the rotating disc, the bevel gear ring is meshed with the bevel gear, a rotating piece used for controlling the connecting shaft to rotate unidirectionally is arranged on the bevel gear ring, the rotating disc is conveniently controlled to rotate when the base is far away from the bottom end of the fixing frame, and the rotating disc is kept to be static when the base is close to the fixing frame.
Preferably, the rotating member comprises a fixed ring coaxially and fixedly arranged on the outer wall of the connecting shaft, a plurality of groups of ratchets are uniformly and rotatably connected on the fixed ring, a plurality of groups of ratchets are connected with the fixed ring through a spring rotating shaft, a plurality of groups of helical tooth blocks are uniformly and fixedly connected on the inner wall of the conical tooth ring, and the connecting shaft is convenient to control to rotate unidirectionally.
Preferably, an electric telescopic rod is fixedly connected to the base, and the output end of the electric telescopic rod is fixedly connected with the fixing frame, so that the moving state of the base can be controlled conveniently.
Preferably, the fixing frame is fixedly connected with a hydraulic rod, and the output end of the hydraulic rod is fixedly connected with an upper hot pressing plate which is in sliding connection with the inner wall of the fixing frame along the vertical direction, so that hot pressing packaging operation is facilitated.
Compared with the prior art, the invention has the beneficial effects that:
1. the high-precision semiconductor element packaging hot press solves the problem that the size of a hot pressing cavity is tightly attached to elements when the traditional high-precision semiconductor element packaging hot press is used, and the storage and taking efficiency in the production process is affected, the electric telescopic rod pushes the base to slide outwards, at the moment, the gear column rolls in the gear groove to drive the rotating rods at two sides to rotate, so that the driving blocks simultaneously slide towards the middle to draw close together, the second connecting rod is pulled, the turnover molds at two sides can be unfolded at the same time, the semiconductor elements on the inner walls can be separated from the lower mold cavity better, the demolding efficiency is improved, when the base slides out, the elements are only adhered to the inner walls of a group of lower mold cavities due to different inclination angles of the turnover molds and the inner walls of the fixed mold, at the moment, the elements are easier to be taken out, the whole space of the lower mold cavity is increased due to the fact that the two side turnover molds are unfolded, the elements to be packaged are more conveniently placed in the lower mold cavity, and the elements are automatically clamped in the lower mold cavity to be attached and fixed when the turnover molds at two sides are turned to be in a horizontal state, and the feeding efficiency is improved.
2. According to the high-precision semiconductor element packaging hot press provided by the invention, when the base slides, the bevel gear is driven to rotate by the rotation of the rotating rod, so that the bevel gear ring rotates, when the base is far away from the bottom end of the fixing frame, the bevel gear ring rotates anticlockwise, so that the fixing ring rotates by driving the ratchet through the bevel gear block, the fixing ring drives the connecting shaft to rotate the rotating disc, the stirring block on the rotating disc continuously impacts the bottom of the turnover mould, the turnover mould is pulled down by the first connecting rod, and meanwhile, the device effectively improves the demoulding efficiency of the element, the outer wall of the element is prevented from being adhered in the lower mould cavity of the inner wall of the turnover mould in the hot pressing process, the semiconductor element after the hot pressing is conveniently taken out, otherwise, when the base moves to one side of the fixing frame, the inclined surface of the bevel gear block pushes the ratchet to be attached to the inner wall of the fixing ring, the connecting shaft is not driven to rotate, the stirring block is prevented from shaking and shifting of the upper element when the stirring block is prevented, and meanwhile, the abrasion between the stirring block and the bottom surface of the turnover mould is reduced.
3. According to the high-precision semiconductor element packaging hot press provided by the invention, when the base slides to the bottom of the fixing frame, the gear groove drives the gear column to reversely rotate, so that the rotating rod reversely rotates to drive the driving blocks at two sides to simultaneously slide to two sides, the second connecting rod and the first connecting rod are pushed to support the bottom of the turnover mould until the side surfaces of the two turnover moulds are tightly attached to the side surfaces of the fixing frame, at the moment, the element is stably clamped in the lower mould cavity, the hydraulic rod is started to drive the upper hot-pressing plate to move downwards for hot-pressing packaging, the packaging operation of the semiconductor element can be completed, the whole device automatically operates along with the movement of the base, the motor driving is not required to be independently arranged, the production and use costs are reduced, the operation state is more stable through the linkage operation of a mechanical structure, the loading and unloading efficiency and the demoulding efficiency of the hot press are effectively improved, and the use is more convenient.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of the lower die mechanism of the present invention;
FIG. 3 is a schematic diagram of a dithering mechanism according to the present invention;
FIG. 4 is an enlarged view of area A of FIG. 3;
FIG. 5 is a partial cross-sectional view of the lower die mechanism of the present invention;
FIG. 6 is a schematic view of the control element structure of the present invention;
FIG. 7 is an enlarged view of area B of FIG. 6;
FIG. 8 is a schematic view of a part of the structure of a driving member according to the present invention;
FIG. 9 is a schematic view of a rotor structure according to the present invention;
fig. 10 is an enlarged view of region C in fig. 9.
In the figure: 1-a machine body; 2-fixing frames; 3-a bottom plate; 4-a lower die mechanism; 5-a base; 6-overturning the mould; 7-a control member; 8-a dithering mechanism; 9-rotating a disc; 10-stirring the block; 11-a driving member; 12-fixing mold; 13-a lower mold cavity; 14-fixing the tube; 15-rotating shaft; 16-a device slot; 17-a fixed block; 18-a first connecting rod; 19-a second connecting rod; 20-a tension spring; 21-a drive block; 22-an adjusting member; 24-rotating a rod; 25-gear columns; 26-gear groove; 27-thread grooves; 28-a return spring; 29-a connecting shaft; 30-a sliding groove; 31-bevel gears; 32-conical rings; 33-a rotating member; 34-a securing ring; 35-ratchet teeth; 36-helical gear blocks; 37-an electric telescopic rod; 38-a hydraulic rod; 39-upper hot platen.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-10, the present invention provides a technical solution: the utility model provides a high-precision semiconductor component encapsulation hot press, including organism 1, lower mould mechanism 4 and shake mechanism 8, the upside fixedly connected with mount 2 and bottom plate 3 of organism 1, fixedly connected with hydraulic rod 38 on the mount 2, hydraulic rod 38's output fixedly connected with goes up hot pressboard 39 along vertical direction sliding connection with mount 2 inner wall, lower mould mechanism 4 includes the base 5 along horizontal direction sliding connection with bottom plate 3, be equipped with two sets of upset mould 6 on the base 5, be equipped with the control piece 7 that is used for controlling upset state of upset mould 6 in the base 5, lower mould mechanism 4 is used for controlling through control piece 7 that two upset mould 6 rotate and be the horizontality when base 5 gets into the mount 2 bottom, control upset slope of upset mould 6 when base 5 leaves the mount 2 downside, promote the efficiency of drawing of patterns and pan feeding, shake mechanism 8 includes two sets of rotating disc 9 that are connected with base 5 rotate, be equipped with the multiunit on rotating disc 9 and be used for stirring piece 10 to stir the bottom of upset mould 6, be equipped with on rotating disc 9 and be used for controlling rotating disc 9 when base 5 keeps the stationary drive piece 11 of rotating disc 9 when base 5 is close to 2 bottom.
The lower die mechanism 4 further comprises a fixed die 12 fixedly arranged on the base 5, lower die cavities 13 which can be mutually communicated are respectively arranged on the turnover dies 6 and the fixed die 12, fixed pipes 14 are fixedly connected to two sides of the fixed die 12, rotating shafts 15 which are rotationally connected with the inner walls of the fixed pipes 14 are fixedly connected to the side faces of the two groups of turnover dies 6, a device groove 16 is formed in the base 5, a control piece 7 is arranged in the device groove 16, an electric telescopic rod 37 is fixedly connected to the base 5, and the output end of the electric telescopic rod 37 is fixedly connected with the fixed frame 2.
The control piece 7 comprises a fixed block 17 fixedly arranged at the bottom end of the turnover mould 6, a first connecting rod 18 is rotationally connected to the side surface of the fixed block 17, a second connecting rod 19 is slidably connected to the outer wall of the first connecting rod 18, a tension spring 20 fixedly connected with the second connecting rod 19 is fixedly connected to the first connecting rod 18, a driving block 21 is rotationally connected to one end, far away from the first connecting rod 18, of the second connecting rod 19, the driving block 21 is slidably connected with the inner wall of the device groove 16 along the horizontal direction, and an adjusting piece 22 for moving and adjusting the linkage driving block 21 when the base 5 moves is arranged in the device groove 16.
The adjusting piece 22 comprises two groups of rotating rods 24 which are rotationally connected with the inner wall of the device groove 16, a gear column 25 is coaxially and fixedly connected between the two groups of rotating rods 24, a plurality of groups of gear grooves 26 meshed with the gear column 25 are uniformly formed in the bottom plate 3, the two groups of rotating rods 24 respectively penetrate through the driving blocks 21 on two sides, and a thread groove 27 which is in threaded connection with the driving blocks 21 is formed in the rotating rods 24.
The shake mechanism 8 further comprises a reset spring 28 fixedly arranged at one end of the shifting block 10, a connecting shaft 29 which is rotatably connected with the device groove 16 is fixedly connected to one side of the rotating disc 9 coaxially, a plurality of groups of sliding grooves 30 are uniformly formed in the rotating disc 9, the shifting block 10 is slidably connected with the inner wall of the sliding groove 30, and one end, far away from the shifting block 10, of the reset spring 28 is fixedly connected with the sliding groove 30.
The driving piece 11 comprises a bevel gear 31 coaxially and fixedly arranged on the rotating rod 24, a bevel gear ring 32 is coaxially and rotatably connected to the side surface of the rotating disc 9, the bevel gear ring 32 is meshed with the bevel gear 31, a rotating piece 33 for controlling the connecting shaft 29 to rotate unidirectionally is arranged on the bevel gear ring 32, the rotating piece 33 comprises a fixed ring 34 coaxially and fixedly arranged on the outer wall of the connecting shaft 29, a plurality of groups of ratchet teeth 35 are uniformly and rotatably connected to the fixed ring 34, the plurality of groups of ratchet teeth 35 are all connected with the fixed ring 34 through spring rotating shafts, and a plurality of groups of bevel gear blocks 36 are uniformly and fixedly connected to the inner wall of the bevel gear ring 32.
Starting electric telescopic rod 37 promotes for base 5 slides to the outside, the gear post 25 rolls in gear groove 26 inside this moment, drive the dwang 24 of both sides and rotate, make drive piece 21 slide towards the centre simultaneously and draw close, pulling second connecting rod 19, simultaneously make head rod 18 drive fixed block 17 and upset mould 6 downside upset, axis of rotation 15 rotates around the inner wall of fixed pipe 14, can make the upset mould 6 of both sides expand to both sides simultaneously, the semiconductor element of inner wall can be better separate with lower die cavity 13, promote the efficiency of drawing of patterns, when base 5 roll-off, because upset mould 6 is different with the inclination of fixed mould 12 inner wall, the element can only adhere with the inner wall of a set of lower die cavity 13, take out the element more easily this moment, when the pan feeding, because upset mould 6 of both sides opens, the holistic space increase of lower die cavity 13, more conveniently put into down the encapsulated element into die cavity 13, and automatic clamp the element is fixed in lower die cavity 13 when upset of both sides upset mould 6 is the horizontality, promote material loading efficiency.
When the base 5 slides, the rotation of dwang 24 can drive bevel gear 31 and rotate, thereby make bevel gear ring 32 rotate, when base 5 kept away from mount 2 bottom position, bevel gear ring 32 anticlockwise rotates, thereby drive ratchet 35 through helical tooth piece 36 and make solid fixed ring 34 rotate, gu fixed ring 34 drives connecting axle 29 and make carousel 9 rotate, stir the bottom of piece 10 constantly striking turnover mould 6 on the carousel 9, make turnover mould 6 carry out continuous shake when being pulled down by first connecting rod 18, the in-process of shake first connecting rod 18 can be continuous slide relative second connecting rod 19, extension spring 20 is used for the pulling and makes one end of first connecting rod 18 and second connecting rod 19 conflict reset, the device effectually promoted the drawing of patterns efficiency of component, avoid the component outer wall to adhere in the inner wall lower die cavity 13 of turnover mould 6 in the in-process of hot pressing, conveniently take out the semiconductor component that the hot pressing was accomplished, otherwise when base 5 moved to mount 2 one side, the inner wall laminating of ratchet 35 to solid fixed ring 34 can be promoted to the inclined plane of helical tooth piece 36, it does not drive the connecting axle 29 again and cause the upset piece 10 to shift between the side and the die bottom surface to avoid simultaneously to stir the wearing and tearing down to the side when the piece is gone into to the side.
Notably, are: when the base 5 slides to the bottom of the fixed frame 2, the gear groove 26 drives the gear column 25 to reversely rotate, so that the rotating rod 24 can reversely rotate, the driving blocks 21 on two sides are driven to simultaneously slide to two sides, the second connecting rod 19 and the first connecting rod 18 are pushed to support the bottom of the turnover mould 6 until the side surfaces of the two turnover moulds 6 are tightly attached to the side surfaces of the fixed mould 12, at the moment, the element is stably clamped in the lower mould cavity 13, the starting hydraulic rod 38 drives the upper hot-pressing plate 39 to move downwards for hot-pressing packaging, the packaging operation of the semiconductor element can be completed, the whole device automatically runs along with the movement of the base 5, the motor driving is not required to be independently arranged, the production and use costs are reduced, the operation state is more stable through the linkage operation of a mechanical structure, the loading and unloading efficiency and the demoulding efficiency of a hot press are effectively improved, and the use is more convenient.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. A high-precision semiconductor component packaging hot press, comprising:
the device comprises a machine body (1), wherein a fixing frame (2) and a bottom plate (3) are fixedly connected to the upper side of the machine body (1);
the lower die mechanism (4), the lower die mechanism (4) comprises a base (5) which is connected with the bottom plate (3) in a sliding way along the horizontal direction, two groups of turnover dies (6) are arranged on the base (5), and a control piece (7) for controlling the turnover state of the turnover dies (6) is arranged in the base (5);
the shaking mechanism (8), shaking mechanism (8) include with base (5) rotate two sets of rolling disc (9) of being connected, be equipped with the multiunit on rolling disc (9) be used for right toggle piece (10) that toggle is stirred to upset mould (6) bottom, be equipped with on rolling disc (9) and be used for base (5) are kept away from when mount (2) bottom position control rolling disc (9) rotate base (5) are close to keep rolling disc (9) stationary driving piece (11) when mount (2).
2. The high-precision semiconductor component packaging hot press according to claim 1, wherein: the lower die mechanism (4) further comprises a fixed die (12) fixedly mounted on the base (5), the overturning die (6) and the fixed die (12) are provided with lower die cavities (13) which can be mutually communicated, two sides of the fixed die (12) are fixedly connected with fixed pipes (14), two groups of the side faces of the overturning die (6) are fixedly connected with rotating shafts (15) rotatably connected with the inner walls of the fixed pipes (14), device grooves (16) are formed in the base (5), and control pieces (7) are mounted in the device grooves (16).
3. The high-precision semiconductor component packaging hot press according to claim 2, wherein: the control piece (7) including fixed mounting in fixed block (17) of upset mould (6) bottom, the side of fixed block (17) rotates and is connected with head rod (18), the outer wall sliding connection of head rod (18) has second connecting rod (19), fixedly connected with on head rod (18) with extension spring (20) of second connecting rod (19) fixed connection, second connecting rod (19) keep away from the one end rotation of head rod (18) is connected with driving block (21), driving block (21) with device groove (16) inner wall is followed horizontal direction sliding connection, be equipped with in device groove (16) and be used for being in linkage when base (5) remove driving block (21) carries out regulating part (22) of removal regulation.
4. The high-precision semiconductor component packaging hot press according to claim 3, wherein: the adjusting piece (22) comprises two groups of rotating rods (24) which are rotationally connected with the inner wall of the device groove (16), gear columns (25) are coaxially and fixedly connected between the rotating rods (24), a plurality of groups of gear grooves (26) which are meshed with the gear columns (25) are uniformly formed in the bottom plate (3), the two groups of rotating rods (24) penetrate through the two sides of the driving block (21) respectively, and thread grooves (27) which are in threaded connection with the driving block (21) are formed in the rotating rods (24).
5. The high-precision semiconductor component packaging hot press according to claim 4, wherein: the shake mechanism (8) still include fixed mounting in reset spring (28) of stirring piece (10) one end, one side coaxial fixedly connected with of rolling disc (9) with connecting axle (29) that device groove (16) rotated and are connected, multiunit sliding tray (30) have evenly been seted up on rolling disc (9), stir piece (10) with sliding tray (30) inner wall sliding connection, reset spring (28) keep away from stir piece (10) one end with sliding tray (30) fixed connection.
6. The high-precision semiconductor component packaging hot press according to claim 5, wherein: the driving piece (11) comprises a bevel gear (31) which is coaxially and fixedly arranged on the rotating rod (24), a bevel gear ring (32) is coaxially and rotatably connected to the side face of the rotating disc (9), the bevel gear ring (32) is meshed with the bevel gear (31), and a rotating piece (33) which is used for controlling the connecting shaft (29) to rotate unidirectionally is arranged on the bevel gear ring (32).
7. The high-precision semiconductor component packaging hot press according to claim 6, wherein: the rotating piece (33) comprises a fixed ring (34) which is coaxially and fixedly arranged on the outer wall of the connecting shaft (29), a plurality of groups of ratchets (35) are uniformly and rotatably connected to the fixed ring (34), the plurality of groups of ratchets (35) are connected with the fixed ring (34) through spring rotating shafts, and a plurality of groups of helical tooth blocks (36) are uniformly and fixedly connected to the inner wall of the bevel gear ring (32).
8. The high-precision semiconductor component packaging hot press according to claim 1, wherein: an electric telescopic rod (37) is fixedly connected to the base (5), and the output end of the electric telescopic rod (37) is fixedly connected with the fixing frame (2).
9. The high-precision semiconductor component packaging hot press according to claim 1, wherein: the fixing frame (2) is fixedly connected with a hydraulic rod (38), and the output end of the hydraulic rod (38) is fixedly connected with an upper hot pressing plate (39) which is in sliding connection with the inner wall of the fixing frame (2) along the vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311643595.8A CN117352439B (en) | 2023-12-04 | 2023-12-04 | High-precision semiconductor element packaging hot press |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311643595.8A CN117352439B (en) | 2023-12-04 | 2023-12-04 | High-precision semiconductor element packaging hot press |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117352439A CN117352439A (en) | 2024-01-05 |
| CN117352439B true CN117352439B (en) | 2024-02-09 |
Family
ID=89365269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311643595.8A Active CN117352439B (en) | 2023-12-04 | 2023-12-04 | High-precision semiconductor element packaging hot press |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117352439B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005050835A (en) * | 2003-07-28 | 2005-02-24 | Kyocera Corp | Hot press heater and its machining method |
| KR20080074468A (en) * | 2007-02-09 | 2008-08-13 | (주)아이셀론 | Surface mounting method of semi-conduct chip using the ultrasonic wave |
| CN108043989A (en) * | 2018-02-01 | 2018-05-18 | 绍兴厚道自动化设备有限公司 | A kind of easily demoulding press device of mold |
| CN210110725U (en) * | 2019-07-16 | 2020-02-21 | 深圳市曜通科技有限公司 | Clamping mechanism in semiconductor packaging equipment |
| CN215203056U (en) * | 2021-05-27 | 2021-12-17 | 宁波壬鼎机械有限公司 | Demoulding mechanism and hot-press forming system with same |
| CN217822657U (en) * | 2022-05-31 | 2022-11-15 | 东莞市台铸精密机械有限公司 | High-precision semiconductor element packaging hot press |
| CN218399153U (en) * | 2022-08-09 | 2023-01-31 | 东莞铱诺科技有限公司 | Plastic part injection molding device with electromagnetic push rod mechanism |
-
2023
- 2023-12-04 CN CN202311643595.8A patent/CN117352439B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005050835A (en) * | 2003-07-28 | 2005-02-24 | Kyocera Corp | Hot press heater and its machining method |
| KR20080074468A (en) * | 2007-02-09 | 2008-08-13 | (주)아이셀론 | Surface mounting method of semi-conduct chip using the ultrasonic wave |
| CN108043989A (en) * | 2018-02-01 | 2018-05-18 | 绍兴厚道自动化设备有限公司 | A kind of easily demoulding press device of mold |
| CN210110725U (en) * | 2019-07-16 | 2020-02-21 | 深圳市曜通科技有限公司 | Clamping mechanism in semiconductor packaging equipment |
| CN215203056U (en) * | 2021-05-27 | 2021-12-17 | 宁波壬鼎机械有限公司 | Demoulding mechanism and hot-press forming system with same |
| CN217822657U (en) * | 2022-05-31 | 2022-11-15 | 东莞市台铸精密机械有限公司 | High-precision semiconductor element packaging hot press |
| CN218399153U (en) * | 2022-08-09 | 2023-01-31 | 东莞铱诺科技有限公司 | Plastic part injection molding device with electromagnetic push rod mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117352439A (en) | 2024-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN117352439B (en) | High-precision semiconductor element packaging hot press | |
| CN110948012A (en) | Drilling equipment is used in mould processing | |
| CN114888932B (en) | Automatic die assembly centering device for manufacturing ceramic pot | |
| CN112356393B (en) | Anti-drop injection mold | |
| CN113580528A (en) | Material processing equipment for plastic product production | |
| CN210022046U (en) | Ceramsite rolling granulator | |
| CN210100261U (en) | Blank making device | |
| CN210999972U (en) | Material loading and unloading structure of PVC film blowing machine | |
| CN219520156U (en) | Disc spinning forming device | |
| CN114750453B (en) | Tea ball secondary pressure maintaining forming device | |
| CN217376323U (en) | Automatic change blevile of push of tealeaves cooked flake wrapping machine | |
| CN113977853B (en) | Storage battery shell injection mold | |
| CN117161324A (en) | Casting mould for rapid forming of metal casting piece | |
| CN214810643U (en) | Fertilizer production prilling granulator that can batching according to proportion | |
| CN217752397U (en) | Forming die with rotary blanking structure for producing plastic components of baby carrier | |
| CN216035289U (en) | Feeding mechanism for automatic boxing of plastic toys | |
| CN213291488U (en) | Production device for preparing conductive ring | |
| CN217722599U (en) | Material distribution equipment for soft candy production | |
| CN117087057B (en) | Preparation method and device for multi-type resin co-molded product | |
| CN218959976U (en) | Automatic pouring forming device for candies | |
| CN116552044B (en) | Tablet preforming shaping all-in-one | |
| CN216462534U (en) | Pipe supporting device of plate-pipe integrated laser cutting machine | |
| CN216609817U (en) | Processing platform is used in plastic mold production | |
| CN113681687B (en) | Ceramic raw material granulation system | |
| CN212888207U (en) | Packing device for producing ceramics |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |