CN217822657U

CN217822657U - High-precision semiconductor element packaging hot press

Info

Publication number: CN217822657U
Application number: CN202221336703.8U
Authority: CN
Inventors: 代敦科
Original assignee: Dongguan Taizhu Precision Machinery Co ltd
Current assignee: Dongguan Taizhu Precision Machinery Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-15
Anticipated expiration: 2032-05-31

Abstract

The utility model discloses a high-accuracy semiconductor element encapsulation hot press relates to hot press technical field, this hot press includes the base, when upward movement was accomplished in last hot pressboard hot pressing, the slider can stimulate first piston with the inside gas of first cylinder body extrude and blow off through the second gas vent, and then the semiconductor element that has been encapsulated separates with hot pressboard down under gas blowing, and the inside gas of second piston extrusion second cylinder body blows off through first gas-supply pipe, and then first subassembly and the second that breaks away from the gas that the subassembly blew off and can make encapsulation membrane and hot pressboard quick separation, and the wind-force that blows off distributes evenly, the encapsulation bag can even atress, avoid the encapsulation bag atress uneven and by the tearing condition. The gas that first break away from the subassembly and the second breaks away from the subassembly and blows off all produces through last hot pressboard removal process, need not to set up power drive in addition, therefore this simple structure, low in manufacturing cost is convenient for use widely on a large scale.

Description

High-precision semiconductor element packaging hot press

Technical Field

The utility model relates to a hot press technical field specifically is a high-accuracy semiconductor element encapsulates hot press.

Background

A semiconductor refers to a material having a conductivity between a conductor (conductor) and an insulator (insulator) at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from insulator to conductor. After the semiconductor is manufactured, the semiconductor needs to be packaged by a hot press, and then the adverse effect of the external environment on the semiconductor element can be avoided.

The semiconductor element encapsulation hot press that uses at present, a packaging film for encapsulating semiconductor element is at the heat-seal in-process, make upper and lower membrane bonding together through making after the packaging film hot melt, and then encapsulate semiconductor element inside, however the packaging film adheres easily on packaging mold in the hot melt in-process, need the workman just can take out after with packaging film and hot press separation, and cause the condition that the packaging film torn and draws the damage easily in the course of separation, the probability of semiconductor element reworking encapsulation has been increased, the encapsulation efficiency of hot pressing packaging machine has been reduced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a high-accuracy semiconductor element encapsulates hot press has solved the encapsulation membrane and on the easy adhesion of hot melt in-process on packaging mold, needs the workman just can take out after with encapsulation membrane and hot press separation to cause the encapsulation membrane to tear the condition of pulling the damage easily in the course of separation, increased the probability of semiconductor element package of doing over again, reduced the problem of hot pressing packaging machine packaging efficiency.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a high-accuracy semiconductor element encapsulates hot press, includes the base, the fixed support frame that is provided with in top of base, the fixed pneumatic cylinder that is provided with in top intermediate position of support frame, the drive end of pneumatic cylinder runs through support frame and fixedly connected with and goes up the hot pressboard, the equal fixed connecting rod that is provided with in left and right sides wall of going up the hot pressboard, the one end of connecting rod is the fixed slider that is provided with all, the bottom and the top of slider are the first subassembly and the second that breaks away from of fixedly connected with respectively and break away from the subassembly, the first fixed second gas-supply pipe that is provided with in outer wall top that breaks away from the subassembly, the second breaks away from the fixed first gas-supply pipe that is provided with in top lateral wall of subassembly, the second spout has all been seted up to support frame cavity left and right sides wall, the inside of second spout slides and is provided with down the hot pressboard, the hot pressing chamber has been seted up at the top of hot pressboard down, the fixed electric telescopic handle that is provided with in top one side of base, electric telescopic handle's drive end is connected with hot pressboard down.

The first separation assembly comprises a first cylinder body, a first exhaust port is formed in one side of the lower portion of the outer wall of the first cylinder body, a first piston is arranged inside the first cylinder body in a sliding mode, a first piston rod is fixedly arranged at the top of the first piston, and a first spring is sleeved on the outer wall of the first piston rod.

Furthermore, a plurality of first air distribution ports are uniformly formed in the bottom of the upper hot pressing plate, and the first air distribution ports are connected with first air conveying pipes through pipelines.

Further, the slider slides and sets up in the inside of first spout, the bottom fixed connection that first breaks away from the subassembly is in the bottom of first spout, the bottom fixed setting that the second breaks away from the subassembly is at the top of first spout.

Furthermore, a plurality of second gas distribution openings are uniformly formed in the bottom of the hot-pressing cavity and are connected with a second gas conveying pipe through pipelines.

Further, the second separation assembly comprises a second cylinder body, a second exhaust port is formed in the lower portion of the outer wall of the second cylinder body, a second piston is arranged in the second cylinder body in a sliding mode, a second piston rod is fixedly arranged at the bottom of the second piston, and a second spring is sleeved on the outer wall of the second piston rod.

Further, the bottom fixed connection of first spring is at first cylinder body top, first exhaust port and first cylinder body cavity are inside to be linked together, first gas-supply pipe fixed connection is in outer wall one side top of first cylinder body, second gas-supply pipe fixed connection is in outer wall one side top of second cylinder body.

Advantageous effects

The utility model provides a high-accuracy semiconductor element encapsulation hot press. Compared with the prior art, the method has the following beneficial effects:

1. the utility model provides a high-accuracy semiconductor element encapsulation hot press, when upward movement was accomplished in last hot pressboard hot pressing, the slider can stimulate first piston with the inside gas of first cylinder body extrude and blow out through the second gas vent, and then the semiconductor element that has been encapsulated separates with hot pressboard down under gas blowing, and the inside gas of second cylinder body is blown out through first gas-supply pipe to second piston extrusion, and then first subassembly and the second that breaks away from the gas that the subassembly blew out and can make encapsulated film and hot pressboard quick separation, and the wind-force distribution that blows out is even, the encapsulation bag can even atress, avoid the encapsulation bag atress uneven and by the tearing condition.

2. A first exhaust port is formed in one side of the lower portion of the outer wall of a first cylinder body, a first piston is arranged inside the first cylinder body in a sliding mode, a first piston rod is fixedly arranged at the top of the first piston, and a first spring is sleeved on the outer wall of the first piston rod. The gas that first break away from the subassembly and the second breaks away from the subassembly and blows off all produces through last hot pressboard removal process, need not to set up power drive in addition, therefore this simple structure, low in manufacturing cost is convenient for use widely on a large scale.

Drawings

FIG. 1 is a schematic view of the front three-dimensional structure of the present invention;

FIG. 2 is a schematic view of a back side three-dimensional structure of the present invention;

FIG. 3 is an enlarged schematic perspective view of part A of the present invention;

fig. 4 is a schematic diagram of an exploded perspective structure of the first detachment assembly of the present invention;

fig. 5 is a schematic view of the second exploded perspective structure of the detachment assembly of the present invention.

In the figure: 1. a base; 2. a support frame; 3. a hydraulic cylinder; 4. mounting a hot pressing plate; 5. a connecting rod; 6. a slider; 7. a first disengaging assembly; 701. a first cylinder; 702. a first exhaust port; 703. a first piston; 704. a first piston rod; 705. a first spring; 8. a second disengaging assembly; 801. a second cylinder; 802. a second exhaust port; 803. a second piston; 804. a second piston rod; 805. a second spring; 9. a first chute; 10. a first gas pipe; 11. a second gas delivery pipe; 12. a second chute; 13. a lower hot pressing plate; 14. a hot pressing chamber; 15. an electric telescopic rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a high-accuracy semiconductor element encapsulates hot press, which comprises a base 1, the fixed support frame 2 that is provided with in top of base 1, the fixed pneumatic cylinder 3 that also has that sets up in top intermediate position of support frame 2, the drive end of pneumatic cylinder 3 runs through support frame 2 and hot pressboard 4 on the fixedly connected with, it is all fixed with connecting rod 5 to go up the left and right sides wall of hot pressboard 4, the one end of connecting rod 5 is all fixed and is provided with slider 6, slider 6's bottom and top are the first subassembly 7 that breaks away from of fixedly connected with respectively and the second breaks away from subassembly 8, the first fixed second gas-supply pipe 11 that is provided with in outer wall top that breaks away from subassembly 7, the second breaks away from the fixed first gas-supply pipe 10 that is provided with in a top lateral wall of subassembly 8, second spout 12 has all been seted up to support frame 2 cavity left and right sides wall, the inside of second spout 12 slides and is provided with hot pressboard 13 down, hot pressboard 14 has been seted up at the top of hot pressboard 13 down, the fixed electric telescopic handle 15 that is provided with in top one side of base 1, electric telescopic handle 15's drive end is connected with lower hot pressboard 13. The first disengaging assembly 7 includes a first cylinder 701, a first exhaust port 702 is disposed on one side of a lower portion of an outer wall of the first cylinder 701, a first piston 703 is slidably disposed inside the first cylinder 701, a first piston rod 704 is fixedly disposed on a top of the first piston 703, and a first spring 705 is sleeved on an outer wall of the first piston rod 704. A plurality of first gas distribution openings are uniformly formed in the bottom of the upper hot pressing plate 4 and are connected with the first gas conveying pipe 10 through pipelines. The slider 6 slides and sets up in the inside of first spout 9, and the bottom fixed connection that first breaks away from subassembly 7 is in the bottom of first spout 9, and the bottom fixed that the second breaks away from subassembly 8 sets up the top at first spout 9. A plurality of second air distribution openings are uniformly formed in the bottom of the hot pressure cavity 14, and the second air distribution openings are connected with the second air conveying pipe 11 through pipelines. The second disengaging assembly 8 comprises a second cylinder 801, a second exhaust port 802 is formed in the lower portion of the outer wall of the second cylinder 801, a second piston 803 is slidably arranged in the cavity of the second cylinder 801, a second piston rod 804 is fixedly arranged at the bottom of the second piston 803, and a second spring 805 is sleeved on the outer wall of the second piston rod 804. The bottom end of the first spring 705 is fixedly connected to the top of the first cylinder 701, the first exhaust port 702 is communicated with the inside of the cavity of the first cylinder 701, the first air pipe 10 is fixedly connected to the upper portion of one side of the outer wall of the first cylinder 701, and the second air pipe 11 is fixedly connected to the upper portion of one side of the outer wall of the second cylinder 801.

When in use, a layer of packaging film is placed at the bottom of the lower hot press plate 13, then a semiconductor element is placed on the first layer of packaging film, then a second layer of packaging film is placed above the semiconductor element, then the hydraulic cylinder 3 is started to push the upper hot press plate 4, because the heating component is arranged in the upper hot press plate 4, after the upper hot press plate 4 and the lower hot press plate 13 are closed, the first layer of packaging film and the second layer of packaging film are hot-pressed to form, the semiconductor element is sealed between the two packaging films, during the downward movement of the upper hot press plate 4, the first piston 703 slides downwards along the inner wall of the first cylinder 701, the gas in the first cylinder 701 is released through the first exhaust port 702, meanwhile, the second piston 803 moves downwards along the inner wall of the second cylinder 801, the gas in the second cylinder 801 is released from the second exhaust port 802, when the packaging is finished, the upper hot pressing plate 4 and the lower hot pressing plate 13 are separated, the pistons in the first separating assembly 7 and the second separating assembly 8 move in opposite directions, and because the top opening of the first cylinder 701 and the bottom opening of the second cylinder 801 are in sealed sliding connection with the first piston rod 704 and the second piston rod 804 respectively, in the process of moving the first piston 703 and the second piston 804 upwards, the gas in the first cylinder 701 and the second cylinder 801 is discharged through the second gas pipe 11 and the first gas pipe 10 respectively and is discharged through the first gas distribution port and the second gas distribution port, so that the semiconductor element packaging bag is pushed to be separated from the upper hot pressing plate 4 and the lower hot pressing plate 13, and then the electric telescopic rod 15 is started to push the lower hot pressing plate 13 to move out of the support frame 2, and the semiconductor element in the hot pressing cavity 14 is taken out.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high-precision semiconductor element packaging hot press comprises a base (1), and is characterized in that: the top of the base (1) is fixedly provided with a support frame (2), a hydraulic cylinder (3) is fixedly arranged in the middle position of the top of the support frame (2), the driving end of the hydraulic cylinder (3) penetrates through the support frame (2) and is fixedly connected with an upper hot pressing plate (4), the left side wall and the right side wall of the upper hot pressing plate (4) are fixedly provided with connecting rods (5), one end of each connecting rod (5) is fixedly provided with a sliding block (6), the bottom and the top of each sliding block (6) are respectively and fixedly connected with a first separation component (7) and a second separation component (8), a second gas pipe (11) is fixedly arranged above the outer wall of the first separation component (7), one side wall of the top of the second separation component (8) is fixedly provided with a first gas pipe (10), the left side wall and the right side wall of a cavity of the support frame (2) are respectively provided with a second sliding groove (12), a lower hot pressing plate (13) is slidably arranged inside the second sliding groove (12), the top of the lower hot pressing plate (13) is provided with a hot pressing cavity (14), one side of the top of the base (1) is provided with an electric telescopic rod (15), and the driving end of the electric hot pressing plate (15) is connected with the lower hot pressing rod (13);

the first separation assembly (7) comprises a first cylinder body (701), a first exhaust port (702) is formed in one side below the outer wall of the first cylinder body (701), a first piston (703) is arranged inside the first cylinder body (701) in a sliding mode, a first piston rod (704) is fixedly arranged at the top of the first piston (703), and a first spring (705) is sleeved on the outer wall of the first piston rod (704).

2. A high precision semiconductor package hot press as recited in claim 1, wherein: a plurality of first air distribution ports are uniformly formed in the bottom of the upper hot pressing plate (4), and the first air distribution ports are connected with the first air conveying pipe (10) through pipelines.

3. A high precision semiconductor package hot press as recited in claim 1, wherein: the slider (6) slides and is arranged in the first sliding groove (9), the bottom end of the first separation component (7) is fixedly connected to the bottom of the first sliding groove (9), and the bottom end of the second separation component (8) is fixedly arranged at the top of the first sliding groove (9).

4. A high precision semiconductor package hot press as recited in claim 1, wherein: a plurality of second air distribution openings are uniformly formed in the bottom of the hot-pressing cavity (14), and the second air distribution openings are connected with a second air conveying pipe (11) through pipelines.

5. A high precision semiconductor package hot press as recited in claim 1, wherein: the second separation assembly (8) comprises a second cylinder body (801), a second exhaust port (802) is formed in the lower portion of the outer wall of the second cylinder body (801), a second piston (803) is arranged in the cavity of the second cylinder body (801) in a sliding mode, a second piston rod (804) is fixedly arranged at the bottom of the second piston (803), and a second spring (805) is sleeved on the outer wall of the second piston rod (804).

6. A high precision semiconductor package hot press as recited in claim 1, wherein: the bottom end of the first spring (705) is fixedly connected to the top of the first cylinder body (701), the first exhaust port (702) is communicated with the inside of the cavity of the first cylinder body (701), the first air conveying pipe (10) is fixedly connected to the upper portion of one side of the outer wall of the first cylinder body (701), and the second air conveying pipe (11) is fixedly connected to the upper portion of one side of the outer wall of the second cylinder body (801).