CN210110725U - Clamping mechanism in semiconductor packaging equipment - Google Patents
Clamping mechanism in semiconductor packaging equipment Download PDFInfo
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- CN210110725U CN210110725U CN201921109961.0U CN201921109961U CN210110725U CN 210110725 U CN210110725 U CN 210110725U CN 201921109961 U CN201921109961 U CN 201921109961U CN 210110725 U CN210110725 U CN 210110725U
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- bottom plate
- screw rod
- semiconductor packaging
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Abstract
The utility model discloses a locking mechanism in semiconductor packaging equipment, including bottom plate and movable mould board, still include toggle mechanism, screw rod, driving medium and servo motor, the screw rod is rotatable to be located on the bottom plate, servo motor fixes on the bottom plate and connects the screw rod, is equipped with the internal thread that cooperatees with the screw rod on the driving medium, the driving medium cover is established on the screw rod; the toggle mechanism comprises a toggle component and a connecting rod which are connected in a rotating mode, the toggle component comprises an upper toggle and a lower toggle which are connected in a rotating mode, the upper toggle is connected with the movable template in a rotating mode, the lower toggle is connected with the bottom plate in a rotating mode, and the connecting rod is connected with the transmission piece in a rotating mode. The mould closing mechanism in the semiconductor packaging equipment provided by the utility model has the advantages that the situation that hydraulic oil pollutes semiconductor strips and the external environment is avoided, and the mould closing mechanism is very environment-friendly; the mold closing device is particularly suitable for high-temperature working conditions, is beneficial to improving the mold closing precision of semiconductor packaging equipment and improving the yield of products; simple structure, convenient maintenance, stable operation and no noise.
Description
Technical Field
The utility model relates to a semiconductor package equipment technical field especially relates to locking mechanism in semiconductor package equipment.
Background
Semiconductor packaging is an important part in the semiconductor industry chain, and refers to a process for wrapping a strip material with chips into plastic packages with different shapes by using a plastic package material, and a mold clamping mechanism is an important component in semiconductor packaging equipment.
The traditional packaging equipment mostly adopts a die assembly mode of a hydraulic servo system, and the die assembly mode has the advantages of high response speed, wide speed regulation range, high power gain and the like. But also has the defects that the structure of a hydraulic servo system is complex and the cost is high; the volume elasticity of the hydraulic oil changes along with the temperature, so the influence of the temperature change on a system is large, and particularly, the packaging equipment needing high temperature is more remarkable, so the existing semiconductor packaging equipment cannot meet the requirement of high precision of a mold closing position; meanwhile, the high temperature is accompanied by greater oil leakage risk, and leaked hydraulic oil can pollute the bars and has great influence on the environment; the hydraulic oil of the hydraulic servo system needs to be replaced regularly, and the maintenance difficulty is increased.
Therefore, a new mold clamping mechanism in a semiconductor packaging apparatus is needed to meet the current demand.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: provided is a mold clamping mechanism in a semiconductor packaging apparatus, which has high mold clamping accuracy and is environmentally friendly.
In order to solve the technical problem, the utility model discloses a technical scheme be: the die clamping mechanism in the semiconductor packaging equipment comprises a bottom plate, a movable template, a toggle mechanism, a screw rod, a transmission part and a servo motor, wherein the screw rod is rotatably arranged on the bottom plate; the toggle mechanism comprises a toggle component and a connecting rod which are connected in a rotating mode, the toggle component comprises an upper toggle and a lower toggle which are connected in a rotating mode, the upper toggle is connected with the movable template in a rotating mode, the lower toggle is connected with the bottom plate in a rotating mode, and the connecting rod is connected with the transmission piece in a rotating mode.
Furthermore, the movable mould supporting seat extending towards the bottom plate is arranged on the movable mould plate, and the upper toggle is rotatably connected with the movable mould supporting seat.
Furthermore, a base extending towards the movable template is arranged on the bottom plate, and the lower elbow is rotatably connected with the base.
Furthermore, the servo motor further comprises a driven wheel connected with the screw rod, a driving wheel is arranged at the output end of the servo motor, and the driving wheel is connected with the driven wheel through a transmission belt.
Furthermore, the servo motor is installed on the bottom plate through an adjusting plate, a screw hole is formed in the bottom plate, a long round hole corresponding to the screw hole is formed in the adjusting plate, and a connecting line between the circle center of the driving wheel and the circle center of the driven wheel is parallel to a long axis of the long round hole.
Furthermore, still include regulating block and regulation pole, the regulating block is located on the bottom plate, the middle part of adjusting the pole with regulating block threaded connection, the one end of adjusting the pole supports holds the regulating plate, the other end of adjusting the pole is equipped with twists the portion, the regulation pole is located the regulating plate with between the screw rod.
Furthermore, a mounting seat is arranged on the bottom plate, the screw rod is rotatably sleeved in the mounting seat through a bearing, and one end, far away from the movable template, of the screw rod penetrates through the mounting seat and is connected with the driven wheel.
Further, the relative both sides of driving medium have the ear that extends outwards respectively, the quantity of bent elbow mechanism is two, the driving medium is located two between the bent elbow mechanism, one the connecting rod with one the ear rotates to be connected, another the connecting rod with another the ear rotates to be connected.
Furthermore, the movable die plate further comprises a guide post arranged on the bottom plate, and a guide hole matched with the guide post is formed in the movable die plate.
Furthermore, the upper crank elbow, the lower crank elbow and the connecting rod are connected through a shaft rod.
The beneficial effects of the utility model reside in that: the hydraulic servo mechanism is replaced by the toggle servo mechanism, hydraulic oil is not needed by the toggle servo mechanism, the situation that the semiconductor strip material and the external environment are polluted by the hydraulic oil is avoided, and the device is very environment-friendly; the toggle servo mechanism is not easily influenced by temperature, is particularly suitable for high-temperature working conditions, is beneficial to improving the die assembly precision of semiconductor packaging equipment and improving the yield of products; simple structure, convenient maintenance and no noise during working.
Drawings
Fig. 1 is a front view of a clamping mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 2 is a right side view (mold clamping state) of a mold clamping mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 3 is a right side view (mold opened state) of a mold clamping mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention;
fig. 4 is a plan view of a clamping mechanism in a semiconductor packaging apparatus according to a first embodiment of the present invention.
Description of reference numerals:
1. a base plate; 2. moving the template; 3. an elbow bending mechanism; 4. a screw; 5. a transmission member; 6. a servo motor; 7. bending the elbow upwards; 8. lower elbow; 9. a connecting rod; 10. a movable mould supporting seat; 11. a base; 12. a guide post;
13. a driven wheel; 14. a driving wheel; 15. a transmission belt; 16. an adjusting plate; 17. a long round hole;
18. an adjusting block; 19. adjusting a rod; 20. a screwing part; 21. a mounting seat; 22. a bearing; 23. ear parts.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 4, a mold clamping mechanism in a semiconductor packaging apparatus includes a bottom plate 1 and a movable mold plate 2, and further includes a toggle mechanism 3, a screw rod 4, a transmission member 5 and a servo motor 6, wherein the screw rod 4 is rotatably disposed on the bottom plate 1, the servo motor 6 is fixed on the bottom plate 1 and connected to the screw rod 4, an internal thread matched with the screw rod 4 is disposed on the transmission member 5, and the transmission member 5 is sleeved on the screw rod 4; toggle mechanism 3 is including rotating toggle subassembly and the connecting rod 9 of connecting, the toggle subassembly is including rotating last toggle 7 and lower toggle 8 of connecting, go up toggle 7 with movable mould board 2 rotates and connects, lower toggle 8 with bottom plate 1 rotates and connects, connecting rod 9 with driving medium 5 rotates and connects.
From the above description, the beneficial effects of the present invention are: the hydraulic servo mechanism is replaced by the toggle servo mechanism, hydraulic oil is not needed by the toggle servo mechanism, the situation that the semiconductor strip material and the external environment are polluted by the hydraulic oil is avoided, and the device is very environment-friendly; the toggle servo mechanism is not easily influenced by temperature, is particularly suitable for high-temperature working conditions, is beneficial to improving the die assembly precision of semiconductor packaging equipment and improving the yield of products; simple structure, convenient maintenance and no noise during working.
Furthermore, a movable mould supporting seat 10 extending towards the bottom plate 1 is arranged on the movable mould plate 2, and the upper toggle 7 is rotatably connected with the movable mould supporting seat 10.
As can be seen from the above description, the movable mold supporting seat 10 can avoid the upper toggle 7 from interfering with the movable mold plate 2, which is beneficial to ensuring the working stability of the mold clamping mechanism.
Furthermore, a base 11 extending towards the movable template 2 is arranged on the bottom plate 1, and the lower elbow 8 is rotatably connected with the base 11.
As can be seen from the above description, the base 11 can prevent the lower toggle 8 from interfering with the bottom plate 1, which is beneficial to ensuring the working stability of the mold clamping mechanism.
Further, the device also comprises a driven wheel 13 connected with the screw rod 4, a driving wheel 14 is arranged at the output end of the servo motor 6, and the driving wheel 14 is connected with the driven wheel 13 through a transmission belt 15.
As is apparent from the above description, the servo motor 6 can stably drive the screw 4.
Furthermore, the servo motor 6 is installed on the base plate 1 through an adjusting plate 16, a screw hole is formed in the base plate 1, a long circular hole 17 corresponding to the screw hole is formed in the adjusting plate 16, and a connecting line between the circle center of the driving wheel 14 and the circle center of the driven wheel 13 is parallel to a long axis of the long circular hole 17.
As can be seen from the above description, the adjusting plate 16 is connected to the base plate 1 by screws, and the relative position of the adjusting plate 16 to the base is adjustable, so that the tension of the belt 15 can be adjusted.
Further, still include regulating block 18 and regulation pole 19, regulating block 18 locates on the bottom plate 1, the middle part of adjusting pole 19 with regulating block 18 threaded connection, the one end of adjusting pole 19 supports and holds regulating plate 16, the other end of adjusting pole 19 is equipped with twists the portion 20, the adjusting pole 19 is located regulating plate 16 with between the screw rod 4.
As can be seen from the above description, the arrangement of the adjusting block 18 and the adjusting rod 19 can facilitate the user to adjust the relative position relationship between the adjusting plate 16 and the base, and reduce the difficulty in adjusting the adjusting plate 16; the threaded connection of the adjusting block 18 and the adjusting rod 19 can enable a user to finely adjust the adjusting plate 16, so that the tensioning degree of the transmission belt 15 is easier to control; the screw 20 is provided to facilitate the user (using a tool) to rotate the adjustment lever 19.
Further, a mounting seat 21 is arranged on the bottom plate 1, the screw rod 4 is rotatably sleeved in the mounting seat 21 through a bearing 22, and one end, far away from the movable template 2, of the screw rod 4 penetrates through the mounting seat 21 and is connected with the driven wheel 13.
As can be seen from the above description, the arrangement of the mounting seat 21 and the bearing 22 is beneficial to improving the stability of the operation of the screw rod 4.
Further, the relative both sides of driving medium 5 have ear 23 that extends outwards respectively, the quantity of toggle mechanism 3 is two, driving medium 5 is located two between the toggle mechanism 3, one connecting rod 9 and one ear 23 rotates to be connected, another connecting rod 9 and another ear 23 rotates to be connected.
Furthermore, the die further comprises a guide post 12 arranged on the bottom plate 1, and a guide hole matched with the guide post 12 is arranged on the movable die plate 2.
From the above description, the guide post 12 and the guide hole are arranged to improve the working stability of the clamping mechanism.
Furthermore, the upper toggle 7, the lower toggle 8 and the connecting rod 9 are connected through a shaft rod.
From the above description, the toggle mechanism 3 has the advantages of few parts, simple structure, stable operation, and is beneficial to reducing the manufacturing cost of the mold clamping mechanism.
Example one
Referring to fig. 1 to 4, a first embodiment of the present invention is: with reference to fig. 1 to 3, a mold clamping mechanism in a semiconductor packaging device includes a bottom plate 1 and a movable mold plate 2, and further includes a toggle mechanism 3, a screw rod 4, a transmission member 5 and a servo motor 6, wherein the screw rod 4 is rotatably disposed on the bottom plate 1, the servo motor 6 is fixed on the bottom plate 1 and connected to the screw rod 4, an internal thread matched with the screw rod 4 is disposed on the transmission member 5, and the transmission member 5 is sleeved on the screw rod 4; toggle mechanism 3 is including rotating toggle subassembly and the connecting rod 9 of connecting, the toggle subassembly is including rotating last toggle 7 and lower toggle 8 of connecting, go up toggle 7 with movable mould board 2 rotates and connects, lower toggle 8 with bottom plate 1 rotates and connects, connecting rod 9 with driving medium 5 rotates and connects. In this embodiment, the upper toggle 7, the lower toggle 8 and the connecting rod 9 are connected by a shaft.
Be equipped with on the movable mould template 2 towards the movable mould supporting seat 10 that bottom plate 1 extends, go up toggle 7 with movable mould supporting seat 10 rotates and connects, be equipped with the base 11 towards movable mould template 2 extension on the bottom plate 1, lower toggle 8 with base 11 rotates and connects.
The die plate is characterized by further comprising a guide post 12 arranged on the bottom plate 1, and a guide hole matched with the guide post 12 is formed in the movable die plate 2.
The servo motor is characterized by further comprising a driven wheel 13 connected with the screw rod 4, a driving wheel 14 is arranged at the output end of the servo motor 6, and the driving wheel 14 is connected with the driven wheel 13 through a transmission belt 15.
Referring to fig. 1 and 4, specifically, the servo motor 6 is mounted on the base plate 1 through an adjusting plate 16, the base plate 1 is provided with a screw hole, the adjusting plate 16 is provided with a long circular hole 17 corresponding to the screw hole, the adjusting plate 16 is connected with the base plate 1 through a screw, one end of the screw penetrates through the long circular hole 17 and is connected with the screw hole, and a connecting line between the circle center of the driving wheel 14 and the circle center of the driven wheel 13 is parallel to the long axis of the long circular hole 17. In order to facilitate users to adjust the tensioning degree of the transmission belt 15, the clamping mechanism further comprises an adjusting block 18 and an adjusting rod 19, the adjusting block 18 is arranged on the bottom plate 1, the middle of the adjusting rod 19 is in threaded connection with the adjusting block 18, one end of the adjusting rod 19 abuts against the adjusting plate 16, the other end of the adjusting rod 19 is provided with a screwing part 20, and the adjusting rod 19 is located between the adjusting plate 16 and the screw rod 4. The driving portion 20 may be a rubber sleeve, or may be a structure that is engaged with a tool, such as a hexagonal block engaged with a wrench.
Referring to fig. 1 to 3, optionally, an installation seat 21 is disposed on the bottom plate 1, the screw rod 4 is rotatably sleeved in the installation seat 21 through a bearing 22, and one end of the screw rod 4, which is far away from the movable mold plate 2, penetrates through the installation seat 21 and is connected with the driven wheel 13.
Referring to fig. 2 and 3, for making movable mould board 2 force balance, in this embodiment, the relative both sides of driving medium 5 have ear 23 that outwards extends respectively, the quantity of toggle mechanism 3 is two, driving medium 5 is located two between the toggle mechanism 3, one connecting rod 9 with one ear 23 rotates to be connected, another connecting rod 9 with another ear 23 rotates to be connected.
In summary, the mold clamping mechanism in the semiconductor packaging equipment provided by the utility model has the advantages that the condition that the hydraulic oil pollutes the semiconductor strip and the external environment is avoided, and the environment is very environment-friendly; the mold closing device is particularly suitable for high-temperature working conditions, is beneficial to improving the mold closing precision of semiconductor packaging equipment and improving the yield of products; the structure is simple, the maintenance is convenient, the work is stable, and no noise is generated; the tension of the transmission belt is accurately and conveniently adjusted.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (10)
1. Mould clamping mechanism in semiconductor packaging equipment, including bottom plate and movable mould board, its characterized in that: the crank mechanism is characterized by further comprising a crank mechanism, a screw rod, a transmission part and a servo motor, wherein the screw rod is rotatably arranged on the bottom plate, the servo motor is fixed on the bottom plate and connected with the screw rod, an internal thread matched with the screw rod is arranged on the transmission part, and the transmission part is sleeved on the screw rod; the toggle mechanism comprises a toggle component and a connecting rod which are connected in a rotating mode, the toggle component comprises an upper toggle and a lower toggle which are connected in a rotating mode, the upper toggle is connected with the movable template in a rotating mode, the lower toggle is connected with the bottom plate in a rotating mode, and the connecting rod is connected with the transmission piece in a rotating mode.
2. The clamping mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the movable mould supporting seat extending towards the bottom plate is arranged on the movable mould plate, and the upper toggle is rotatably connected with the movable mould supporting seat.
3. The clamping mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the bottom plate is provided with a base extending towards the movable template, and the lower elbow is rotatably connected with the base.
4. The clamping mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the servo motor is characterized by further comprising a driven wheel connected with the screw rod, a driving wheel is arranged at the output end of the servo motor, and the driving wheel is connected with the driven wheel through a transmission belt.
5. The clamping mechanism in a semiconductor packaging apparatus according to claim 4, wherein: the servo motor is installed on the bottom plate through an adjusting plate, a screw hole is formed in the bottom plate, a long circular hole corresponding to the screw hole is formed in the adjusting plate, and a connecting line of the circle center of the driving wheel and the circle center of the driven wheel is parallel to a long axis of the long circular hole.
6. The clamping mechanism in a semiconductor packaging apparatus according to claim 5, wherein: still include regulating block and regulation pole, the regulating block is located on the bottom plate, the middle part of adjusting the pole with regulating block threaded connection, the one end of adjusting the pole supports holds the regulating plate, the other end of adjusting the pole is equipped with twists the portion of moving, adjust the pole and be located the regulating plate with between the screw rod.
7. The clamping mechanism in a semiconductor packaging apparatus according to claim 4, wherein: the bottom plate is provided with a mounting seat, the screw rod is rotatably sleeved in the mounting seat through a bearing, and one end, far away from the movable template, of the screw rod penetrates through the mounting seat and is connected with the driven wheel.
8. The clamping mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the relative both sides of driving medium have the ear that extends outwards respectively, the quantity of bent elbow mechanism is two, the driving medium is located two between the bent elbow mechanism, one the connecting rod with one the ear rotates to be connected, another the connecting rod with another the ear rotates to be connected.
9. The clamping mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the movable die plate is characterized by further comprising a guide pillar arranged on the bottom plate, and a guide hole matched with the guide pillar is formed in the movable die plate.
10. The clamping mechanism in a semiconductor packaging apparatus according to claim 1, wherein: the upper crank elbow, the lower crank elbow and the connecting rod are connected through a shaft rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921109961.0U CN210110725U (en) | 2019-07-16 | 2019-07-16 | Clamping mechanism in semiconductor packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921109961.0U CN210110725U (en) | 2019-07-16 | 2019-07-16 | Clamping mechanism in semiconductor packaging equipment |
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| Publication Number | Publication Date |
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| CN210110725U true CN210110725U (en) | 2020-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921109961.0U Active CN210110725U (en) | 2019-07-16 | 2019-07-16 | Clamping mechanism in semiconductor packaging equipment |
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| CN (1) | CN210110725U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117352439A (en) * | 2023-12-04 | 2024-01-05 | 深圳市伟鼎自动化科技有限公司 | High-precision semiconductor element packaging hot press |
-
2019
- 2019-07-16 CN CN201921109961.0U patent/CN210110725U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117352439A (en) * | 2023-12-04 | 2024-01-05 | 深圳市伟鼎自动化科技有限公司 | High-precision semiconductor element packaging hot press |
| CN117352439B (en) * | 2023-12-04 | 2024-02-09 | 深圳市伟鼎自动化科技有限公司 | High-precision semiconductor element packaging hot press |
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