CN117318734A - Chip signal transmitting circuit and method - Google Patents
Chip signal transmitting circuit and method Download PDFInfo
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- CN117318734A CN117318734A CN202311586952.1A CN202311586952A CN117318734A CN 117318734 A CN117318734 A CN 117318734A CN 202311586952 A CN202311586952 A CN 202311586952A CN 117318734 A CN117318734 A CN 117318734A
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000011159 matrix material Substances 0.000 claims abstract description 166
- 230000002093 peripheral effect Effects 0.000 claims abstract description 40
- 239000008186 active pharmaceutical agent Substances 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 claims description 3
- 238000013507 mapping Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229910052710 silicon Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/401—Circuits for selecting or indicating operating mode
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/44—Transmit/receive switching
Abstract
The present disclosure relates to a chip signal transmitting circuit and method, the circuit including a first matrix selector; a second matrix selector connected to the first matrix selector; and for each second matrix selector, the Pad modules connected with the second matrix selector are respectively provided with a plurality of signal input interfaces, the signal output interfaces of the first matrix selector are connected with the first signal input interfaces of the second matrix selector, the working frequency of the signal input interfaces of the first matrix selector is smaller than the preset working frequency, the working frequency of the signal input interfaces of the second matrix selector except the first signal input interfaces is larger than or equal to the preset working frequency, and the first matrix selector and the second matrix selector are respectively provided with a first peripheral register and a second peripheral register, so that the high-efficiency operation of the interfaces with larger working frequency is ensured, and the flexible mapping of the interfaces with smaller number and multiple working frequencies to the plurality of pads is realized.
Description
Technical Field
The disclosure relates to the technical field of chip design, and in particular relates to a chip signal transmitting circuit and a chip signal transmitting method.
Background
With the continuous development of integrated circuit manufacturing process, along with moore's law, the chip process is more and more advanced and the integration level is higher and higher. Under the premise of the technology, peripheral interfaces IP (Internet Protocol ) used for mapping to the PADs (PADs are pins of a silicon chip, are packaged inside the chip and cannot be seen by a user) inside the chip are more and more complex, so that the number of the PADs of the chip is exponentially increased, and the manufacturing cost of the chip is also increased.
The existing mapping relation between the chip internal signal and the PAD comprises the following steps: each GPIO (General-purpose input/output) supports two interfaces IP input from the internal hardware of the Chip and one input from the software of the Chip control register, so that only two interfaces IP mapping are supported for each PAD of the Chip, which reduces flexibility of PAD usage, and if the SoC (System on Chip) is relatively large in scale and relatively complex in function, so that a certain SoC Chip supports a certain number of General data interfaces, for example, a SoC Chip supports a certain number of General data interfaces, interfaces I2C (Inter-Integrated Circuit, integrated circuit bus)/SPI (Serial Peripheral Interface )/USART (Universal Synchronous/Asynchronous Receiver/Transmitter, general synchronous/asynchronous serial receiver/Transmitter)/SAI (Serial Audio Interface, serial audio interface standard)/CAN (Controller Area Network ) and other interfaces, or a certain analog signal needs to be sent to the PAD, a larger number of PADs needs to be supported.
In the related art, on the one hand, as the number of interfaces IP integrated inside a chip increases, digital logic to be mapped to a PAD becomes complex, and when a chip architect considers pin assignment (which is related to chip application and involves board-level design of the chip), various situations need to be considered, which increases design complexity. On the other hand, from the aspect of economic cost, the increase of the number of chip interfaces can greatly improve the area of the chip and increase the manufacturing cost of the chip. If more advanced processes are used, the cost increases exponentially with the number of PADs.
Therefore, how to map more chip internal signals onto PADs under the condition of controlling the number of the PADs of the chips, and increase the flexibility of mapping, so as to save the design resources of the hardware circuit board of the chip PCB, is a problem to be solved in the design of the large-scale SoC.
Disclosure of Invention
To solve or at least partially solve the above technical problems, embodiments of the present disclosure provide a chip signal transmitting circuit and method.
In a first aspect, embodiments of the present disclosure provide a chip signal transmitting circuit, comprising:
a first matrix selector;
at least one second matrix selector connected to the first matrix selector;
for each second matrix selector, a Pad module connected to the second matrix selector;
a first peripheral register and a second peripheral register respectively disposed on the first matrix selector and the second matrix selector, the first peripheral register and the second peripheral register each being used for selecting a target signal input interface from a plurality of signal input interfaces according to a state of the Pad module,
the first matrix selector and the second matrix selector are respectively provided with a plurality of signal input interfaces, the signal output interfaces of the first matrix selector are connected with the first signal input interfaces of the second matrix selector, the working frequency of the signal input interfaces of the first matrix selector is smaller than the preset working frequency, and the working frequency of the signal input interfaces of the second matrix selector except the first signal input interfaces is larger than or equal to the preset working frequency.
In a possible implementation manner, the circuit further comprises a control selection register, a software control interface and a hardware control interface are arranged on the control selection register, the hardware control interface of the control selection register is connected with the signal output interface of the second matrix selector, the signal output interface of the control selection register is connected with the Pad module, and the control selection register selects the software control interface or the hardware control interface according to the state of the Pad module.
In one possible embodiment, the software control interface of the control selection register is connected to a preset register.
In one possible implementation, the ports of the Pad module receive ST control signals, IE control signals, C control signals, PU control signals, PD control signals, I control signals, OEN control signals, SL control signals, and DS [2:0] control signals.
In one possible embodiment, the signal input interface of the first matrix selector is connected to the chip interface IP or to a preset value signal output interface, and the signal input interface of the second matrix selector is connected to the chip interface IP.
In a possible implementation, the first peripheral register is configured to select the signal input interface connected to the preset value signal output interface in case the state of the Pad module is a specified operation mode.
In one possible implementation, the operating frequency of the signal input interfaces of the first matrix selector is less than 10MHz, and the operating frequency of the signal input interfaces of the second matrix selector other than the first signal input interface is greater than or equal to 10MHz.
In a possible embodiment, the number of signal input interfaces of the first matrix selector is greater than the second matrix selector.
In one possible implementation, a pin is disposed on the Pad module, and the pin is used for transmitting a signal processed by the Pad module.
In a second aspect, an embodiment of the present disclosure provides a chip signal transmitting method implemented based on the chip signal transmitting circuit, where the method includes:
selecting a first target signal input interface from a plurality of signal input interfaces of the second matrix selector according to the state of the Pad module through a second external register of the second matrix selector;
transmitting a signal received by the first target signal input interface to the Pad module under the condition that the first target signal input interface is not the first signal input interface;
and under the condition that the first target signal input interface is the first signal input interface, selecting a second target signal input interface from a plurality of signal input interfaces of the first matrix selector through a first peripheral register of the first matrix selector according to the state of the Pad module, and transmitting signals received by the second target signal input interface to the Pad module.
Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has at least part or all of the following advantages:
the chip signal transmitting circuit comprises a first matrix selector; at least one second matrix selector connected to the first matrix selector; and for each second matrix selector, the Pad modules connected with the second matrix selector are respectively provided with a plurality of signal input interfaces, the signal output interfaces of the first matrix selector are connected with the first signal input interfaces of the second matrix selector, the working frequency of the signal input interfaces of the first matrix selector is smaller than the preset working frequency, the working frequency of the signal input interfaces of the second matrix selector except the first signal input interfaces is larger than or equal to the preset working frequency, the first matrix selector and the second matrix selector are respectively provided with a first peripheral register and a second peripheral register, and the first peripheral register and the second peripheral register are respectively used for selecting target signal input interfaces from the plurality of signal input interfaces according to the state of the Pad module, so that the high-efficiency operation of the interfaces with larger working frequency is ensured, the interfaces with more quantity and smaller working frequency can be flexibly mapped to a plurality of pads.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the related art will be briefly described below, and it will be apparent to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 schematically illustrates a structural schematic diagram of a chip signal transmitting circuit according to an embodiment of the present disclosure;
fig. 2 schematically illustrates a schematic structure of a chip signal transmitting circuit according to another embodiment of the present disclosure;
FIG. 3 schematically illustrates a flow diagram of a chip signal transmission method according to an embodiment of the disclosure;
fig. 4 schematically illustrates a structural diagram of a chip signal receiving circuit according to an embodiment of the present disclosure;
fig. 5 schematically illustrates a structural diagram of a chip signal receiving circuit according to another embodiment of the present disclosure;
fig. 6 schematically shows a flow diagram of a chip signal receiving method according to an embodiment of the disclosure;
fig. 7 schematically shows a flow diagram of a chip signal receiving method according to another embodiment of the present disclosure.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are some, but not all, embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the disclosure, are within the scope of the disclosure.
Referring to fig. 1, an embodiment of the present disclosure provides a chip signal transmitting circuit including:
first matrix selectorLow_Speed_Matrix；
And a first matrix selectorLow_Speed_MatrixAt least one second matrix selector connectedHigh_ Speed_Matrix；
For each second matrix selectorHigh_Speed_MatrixAnd a second matrix selectorHigh_Speed_ MatrixA connected Pad module;
a first peripheral register padm_ls_src_sel [ x:0] and a second peripheral register padm_hs_src_sel [1:0] respectively provided on the first matrix selector and the second matrix selector, the first peripheral register and the second peripheral register each being for selecting a target signal input interface from a plurality of signal input interfaces according to a state of a Pad module,
the signal input interfaces of the first matrix selector and the second matrix selector are respectively provided with a plurality of signal input interfaces, the signal output interfaces of the first matrix selector are connected with the first signal input interface 0 of the second matrix selector, the working frequency of the signal input interfaces of the first matrix selector is smaller than the preset working frequency, and the working frequency of the signal input interfaces 1-3 or 4-6 except the first signal input interface 0 in the second matrix selector is larger than or equal to the preset working frequency.
In fig. 1, a second matrix selectorHigh_Speed_MatrixIs 2, in practical applications, the second matrix selectorHigh_Speed_MatrixThe number of (c) may not be limited thereto.
Referring to fig. 1, the circuit further includes a control selection register oe_sel, a software control interface 0 and a hardware control interface 1 are disposed on the control selection register oe_sel, the hardware control interface 1 of the control selection register oe_sel is connected with the signal output interface of the second matrix selector, and the signal output interface of the control selection register is connected with the Pad module, where the control selection register selects the software control interface or the hardware control interface according to the state of the Pad module.
In this embodiment, the software control interface of the control selection register is connected to a preset register oe_en.
In FIG. 1, when the source of the control signal (IE/OEN/PU/PD, etc.) on the port of the PAD in the chip can come from two parts: software (i.e., preset register oe_en); hardware (some digital peripheral, i.e. signal input interface).
As shown in fig. 1, for the control signal of this PAD for OEN, it is possible to select whether it is currently controlled by software or hardware via the oe_sel register.
In the mode of software controlling the PAD, software preset for outputting an OEN control signal is stored on a preset register oe_en so that the PAD module receives the OEN control signal from the software.
In the mode of controlling PAD by hardware, selecting one of n+1 first matrix selector signal input interfaces according to the state of the PAD module and the efficiency of the signal input interfaces through a first peripheral register padm_ls_src_sel [ x:0], and selecting the signal input interface 0-3 mapped to the PAD in the second matrix selector signal input interface according to the state of the PAD module and the efficiency of the signal input interface through a second peripheral register padm_hs_src_sel [1:0 ].
In fig. 1, the mth PAD is taken as an example, so that the names of the two peripheral registers are beginning with padm.
Referring to FIG. 1, ports of the Pad module receive ST control signals, IE control signals, C control signals, PU control signals, PD control signals, I control signals, OEN control signals, SL control signals, and DS [2:0] control signals.
Referring to fig. 1, the signal input interface 0~n-1 of the first matrix selector is connected to the chip interface IP, the signal input interface n-n+1 of the first matrix selector is connected to the signal output interface with a preset value, and the signal input interface 1-6 of the second matrix selector is connected to the chip interface IP, where the signal input interface 1-3 of the second matrix selector is different from the chip interface IP to which the signal input interface 4-6 is connected. In this embodiment, the working frequency of the signal input interface of the first matrix selector is less than 10MHz, and the working frequency of the signal input interfaces of the second matrix selector other than the first signal input interface is greater than or equal to 10MHz. In practical application, the signal input interface 0~n-1 of the first matrix selector may be connected to chip interfaces such as an I2C interface, a USART interface, an SAI interface, and a CAN interface, and the signal input interfaces 1-3 of the second matrix selector are connected to chip interfaces such as an SPI interface.
In this embodiment, the first peripheral register is configured to select the signal input interface connected to the preset value signal output interface in the case that the state of the Pad module is the specified operation mode. In practical application, when the state of the Pad module is in the normal open mode, the first peripheral register selects the signal input interface n, and sends the preset value 1 received by the signal input interface n to the Pad module, and when the state of the Pad module is in the normal closed mode, the first peripheral register selects the signal input interface n+1, and sends the preset value 0 received by the signal input interface n+1 to the Pad module.
In fig. 1, the number of signal input interfaces of the first matrix selector is n+2, where n is a positive integer, and the number of signal input interfaces of the second matrix selector is 4, and in practical applications, the number of signal input interfaces of the second matrix selector includes, but is not limited to, 4, and in general, the number of signal input interfaces of the first matrix selector is greater than the number of signal input interfaces of the second matrix selector.
Referring to fig. 1, a pin is disposed on the Pad module, and the pin is used for transmitting signals processed by the Pad module.
The following is the working principle of the chip signal transmitting circuit in fig. 1:
for each control selection register oe_sel in fig. 1, selecting either the software control interface 0 or the hardware control interface 1 according to the state of the Pad module by the current control selection register oe_sel;
in the case where the hardware control interface 1 is selected by the current control selection register oe_sel, selecting a first target signal input interface from a plurality of signal input interfaces of a second matrix selector connected to the current control selection register oe_sel according to the state of the Pad module through a second external register of the second matrix selector; under the condition that the first target signal input interface is the first signal input interface, selecting a second target signal input interface from a plurality of signal input interfaces of the first matrix selector according to the state of the Pad module through a first peripheral register of the first matrix selector connected with the second matrix selector, and transmitting signals received by the second target signal input interface to the Pad module;
in the case where the hardware control interface 1 is selected by the current control selection register oe_sel, selecting a first target signal input interface from a plurality of signal input interfaces of a second matrix selector connected to the current control selection register oe_sel according to the state of the Pad module through a second external register of the second matrix selector; transmitting a signal received by the first target signal input interface to the Pad module under the condition that the first target signal input interface is not the first signal input interface;
in case the current control selection register oe_sel selects the software control interface 0, a signal output by the software in the preset register oe_en connected to the current control selection register oe_sel is sent to the Pad module.
Referring to fig. 2, the chip signal transmitting circuit may further include only one second matrix selector, wherein each device of the chip signal transmitting circuit of fig. 2 is identical in function to that of fig. 1.
Referring to fig. 3, an embodiment of the present disclosure provides a chip signal transmitting method implemented based on the chip signal transmitting circuit, where the method includes:
s1, selecting a first target signal input interface from a plurality of signal input interfaces of a second matrix selector according to the state of a Pad module through a second external register of the second matrix selector;
s2, transmitting a signal received by the first target signal input interface to the Pad module under the condition that the first target signal input interface is not the first signal input interface;
s3, when the first target signal input interface is the first signal input interface, selecting a second target signal input interface from a plurality of signal input interfaces of the first matrix selector according to the state of the Pad module through a first peripheral register of the first matrix selector, and transmitting signals received by the second target signal input interface to the Pad module.
In this embodiment, in the case where the chip signal transmitting circuit includes a control selection register, the chip signal transmitting method includes:
selecting a software control interface or a hardware control interface according to the state of the Pad module through a control selection register;
under the condition that the control selection register selects the hardware control interface, selecting a first target signal input interface from a plurality of signal input interfaces of a second matrix selector through a second external register of the second matrix selector connected with the current control selection register according to the state of the Pad module; under the condition that the first target signal input interface is the first signal input interface, selecting a second target signal input interface from a plurality of signal input interfaces of the first matrix selector according to the state of the Pad module through a first peripheral register of the first matrix selector connected with the second matrix selector, and transmitting signals received by the second target signal input interface to the Pad module;
under the condition that the control selection register selects the hardware control interface, selecting a first target signal input interface from a plurality of signal input interfaces of a second matrix selector through a second external register of the second matrix selector connected with the current control selection register according to the state of the Pad module; transmitting a signal received by the first target signal input interface to the Pad module under the condition that the first target signal input interface is not the first signal input interface;
and under the condition that the control selection register selects the software control interface, sending a signal output by software in a preset register connected with the control selection register to the Pad module.
The working modes of the Pad module in this embodiment include a transmitting mode and a receiving mode, and when the working mode of the Pad module is the transmitting mode, the chip signal transmitting circuit and the method are used to realize the chip signal transmitting. When the working mode of the Pad module is a receiving mode, the chip signal is received through the following chip signal transmitting circuit and method.
Referring to fig. 4, an embodiment of the present disclosure provides a chip signal receiving circuit including:
a first matrix selector;
at least one exclusive-or gate di_inv connected to the first matrix selector;
for each exclusive or gate di_inv, a Pad module connected to the exclusive or gate di_inv;
a control selector ls_iofn_filter_en, which is arranged between the first matrix selector and each exclusive or gate di_inv, wherein the output interface of the control selector ls_iofn_filter_en is connected with the first matrix selector, a first input control interface 1 and a second input control interface 0 are arranged on the control selector ls_iofn_filter_en, and the output interface of the exclusive or gate di_inv is connected with the second input control interface 0 of the control selector ls_iofn_filter_en;
the input interface and the output interface of the FILTER PAD_FILTER are respectively connected with the output interface of the exclusive-OR gate di_inv and the first input control interface 1 of the control selector ls_iofn_filter_en;
a first peripheral register ls_iofn_pad_ival_sel [ x:0] and a plurality of signal output interfaces 0~n, which are all disposed on the first matrix selector, the first peripheral register ls_iofn_pad_ival_sel [ x:0] being used to select a first target signal output interface from the plurality of signal output interfaces 0~n according to the state of the Pad module.
In this embodiment, the FILTER pad_filter is used to synchronize the signal from the exclusive or gate with the signal inside the chip.
For each signal output interface of the first matrix selector, the signal output interfaces corresponding to all PADs (from PAD0 to PAD n) can be realized, so each signal output interface can select to receive the level from any PAD, as long as the first peripheral register ls_iofn_pad_ival_sel [ x:0] is configured. For example, as for the signal output interface n, as long as the value of the first peripheral register ls_iofn_pad_ival_sel [ x:0] is configured, an output C control signal specifying PAD may be connected to the signal output interface n, where the C control signal of PAD is a level received by PAD in the input mode, i.e., pad_ival, and the signal output interface n is a signal output interface numbered n.
Referring to fig. 5, the circuit further includes:
and a plurality of second matrix selectors connected with the exclusive-OR gate di_inv, wherein each second matrix selector is provided with a second external register padm_hs_src_sel [2:0] and three signal output interfaces, the second external register padm_hs_src_sel [2:0] is used for selecting a second target signal output interface from the three signal output interfaces according to the state of the Pad module, the working frequency of the first matrix selector signal output interface 0~n is smaller than the preset working frequency, and the working frequency of the second matrix selector signal output interfaces 0-4 is larger than or equal to the preset working frequency.
Referring to fig. 3, the three signal output interfaces include one of the signal output interfaces 1 to 3 connected to the exclusive or gate, a signal output interface with an output value of 0, and signal output interfaces 0 and 4 with an output value of 1.
In this embodiment, the second external register is configured to select the signal output interface 0 or 4 with an output value of 1 or 0 in the case where the state of the Pad module is the specified operation mode. In practical application, when the state of the Pad module is in the normal open mode, the second external register selects the signal output interface 4, and sends the preset value 1 received by the signal output interface 4 to the chip interface IP, and when the state of the Pad module is in the normal closed mode, the second external register selects the signal output interface 0, and sends the preset value 0 received by the signal output interface 0 to the chip interface IP.
In this embodiment, the signal output interfaces of the first matrix selector and the second matrix selector are both connected to the chip interface IP.
In this embodiment, the working frequency of the first matrix selector signal output interface is less than 10MHz, and the working frequency of the second matrix selector signal output interface is greater than or equal to 10MHz. In practical application, the signal output interface 0~n of the first matrix selector may be connected to chip interfaces such as an I2C interface, a USART interface, an SAI interface, and a CAN interface, and the signal output interfaces 0 to 4 of the second matrix selector are connected to chip interfaces such as an SPI interface.
In fig. 4, the number of signal input interfaces of the first matrix selector is n+1, where n is a positive integer, and the number of second matrix selectors is 3, and in practical applications, the number of second matrix selectors includes, but is not limited to, 3, and typically, the number of signal output interfaces of the first matrix selector is greater than the number of second matrix selectors.
Referring to fig. 4 and 5, a pin is disposed on the Pad module, and the pin is used for receiving signals, and a port of the Pad module receives an ST control signal, an IE control signal, a C control signal, a PU control signal, a PD control signal, an I control signal, an OEN control signal, an SL control signal, and a DS [2:0] control signal.
The following is the working principle of the chip signal receiving circuit in fig. 4:
selecting a first target signal output interface from a plurality of signal output interfaces of the first matrix selector according to the state of the Pad module through a first peripheral register of the first matrix selector; selecting a target input control interface from the first input control interface 1 and the second input control interface 0 according to the state of the Pad module by the control selector;
when the target input control interface is the first input control interface 1, receiving a signal output by a port of the Pad module through an exclusive or gate, and sending a new signal ls_iofn_ival obtained by processing the signal through the exclusive or gate and a filter to the first target signal output interface through the target input control interface;
and under the condition that the target input control interface is the second input control interface 0, receiving a signal output by a port of the Pad module through an exclusive or gate, and sending a new signal ls_iofn_ival obtained by processing the signal through the exclusive or gate to the first target signal output interface through the target input control interface.
The following is the working principle of the chip signal receiving circuit in fig. 5:
determining a target second matrix selector for receiving signals, wherein the target second matrix selector can be one or a plurality of target second matrix selectors; for each target second matrix selector, selecting a second target signal output interface from the three signal output interfaces according to the state of the Pad module through a second external register of the target second matrix selector;
the second target signal output interface is a signal output interface 4, and the preset value 1 received by the signal output interface 4 is used as an hs_iofn_ival signal to be sent to a chip interface IP;
the second target signal output interface is a signal output interface 0, and a preset value 0 received by the signal output interface 0 is used as an hs_iofn_ival signal to be sent to a chip interface IP;
the second target signal output interface is one of the signal output interfaces 1-3, receives the C control signal output by the port of the Pad module through the exclusive-OR gate, and sends the hs_iofn_ival signal obtained by processing the C control signal through the exclusive-OR gate to the second target signal output interface,
wherein the hs_iofn_ival signal sent to the first target second matrix selector is hs0_iofn_ival, the hs_iofn_ival signal sent to the second target second matrix selector is hs1_iofn_ival, and the hs_iofn_ival signal sent to the third target second matrix selector is hs2_iofn_ival.
Referring to fig. 6, an embodiment of the present disclosure provides a chip signal receiving method implemented based on a chip signal receiving circuit according to the above, wherein the method includes:
s4, selecting a first target signal output interface from a plurality of signal output interfaces of the first matrix selector according to the state of the Pad module through a first peripheral register of the first matrix selector;
s5, selecting a target input control interface from the first input control interface and the second input control interface according to the state of the Pad module through a control selector;
s6, receiving the signal output by the port of the Pad module through the exclusive OR gate, and sending the signal to the first target signal output interface through the target input control interface.
In this embodiment, the receiving, by the exclusive or gate, the signal output by the port of the Pad module, and sending the signal to the first target signal output interface via the target input control interface, includes:
receiving a signal output by a port of the Pad module through an exclusive or gate and transmitting the signal to a first target signal output interface through a filter and a target input control interface under the condition that the target input control interface is the first input control interface 1;
in the case that the target input control interface is the second input control interface 0, the signal output by the port of the Pad module is received through the exclusive or gate, and the signal is sent to the first target signal output interface only through the target input control interface.
Referring to fig. 7, the method further includes:
s7, determining a target second matrix selector for receiving signals in the plurality of second matrix selectors;
s8, for each target second matrix selector, selecting a second target signal output interface from the three signal output interfaces according to the state of the Pad module through a second external register of the target second matrix selector;
s9, receiving signals output by the ports of the Pad module through the exclusive OR gate, and sending the signals to the second target signal output interface of each target second matrix selector.
In this embodiment, the receiving, by the exclusive or gate, the signal output by the port of the Pad module and sending the signal to the second target signal output interface of each target second matrix selector includes:
the second target signal output interface is a signal output interface 4, and the preset value 1 received by the signal output interface 4 is sent to a chip interface IP;
the second target signal output interface is a signal output interface 0, and a preset value 0 received by the signal output interface 0 is sent to a chip interface IP;
and the second target signal output interface is one of the signal output interfaces 1-3, receives the C control signal output by the port of the Pad module through the exclusive OR gate, and sends the C control signal to the second target signal output interface.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a specific embodiment of the disclosure to enable one skilled in the art to understand or practice the disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A chip signal transmitting circuit, the circuit comprising:
a first matrix selector;
at least one second matrix selector connected to the first matrix selector;
for each second matrix selector, a Pad module connected to the second matrix selector;
a first peripheral register and a second peripheral register respectively disposed on the first matrix selector and the second matrix selector, the first peripheral register and the second peripheral register each being used for selecting a target signal input interface from a plurality of signal input interfaces according to a state of the Pad module,
the first matrix selector and the second matrix selector are respectively provided with a plurality of signal input interfaces, the signal output interfaces of the first matrix selector are connected with the first signal input interfaces of the second matrix selector, the working frequency of the signal input interfaces of the first matrix selector is smaller than the preset working frequency, and the working frequency of the signal input interfaces of the second matrix selector except the first signal input interfaces is larger than or equal to the preset working frequency.
2. The circuit of claim 1, further comprising a control selection register, wherein the control selection register is provided with a software control interface and a hardware control interface, the hardware control interface of the control selection register is connected with the signal output interface of the second matrix selector, the signal output interface of the control selection register is connected with the Pad module, and the control selection register selects the software control interface or the hardware control interface according to the state of the Pad module.
3. The circuit of claim 2, wherein the software control interface controlling the select register is coupled to a preset register.
4. The circuit of claim 2, wherein the port of the Pad module receives ST control signals, IE control signals, C control signals, PU control signals, PD control signals, I control signals, OEN control signals, SL control signals, and DS [2:0] control signals.
5. The circuit of claim 1, wherein the signal input interface of the first matrix selector is connected to a chip interface IP or a preset value signal output interface, and the signal input interface of the second matrix selector is connected to a chip interface IP.
6. The circuit of claim 5, wherein the first peripheral register is configured to select the signal input interface to which the preset value signal output interface is connected if the state of the Pad module is in the specified mode of operation.
7. The circuit of claim 1, wherein the first matrix selector signal input interface has an operating frequency less than 10MHz and the signal input interfaces of the second matrix selector other than the first signal input interface have an operating frequency greater than or equal to 10MHz.
8. The circuit of claim 1, wherein the number of signal input interfaces of the first matrix selector is greater than the second matrix selector.
9. The circuit of claim 1, wherein a pin is provided on the Pad module, the pin being configured to transmit signals processed by the Pad module.
10. A chip signal transmission method implemented based on a chip signal transmission circuit according to any one of claims 1 to 9, the method comprising:
selecting a first target signal input interface from a plurality of signal input interfaces of the second matrix selector according to the state of the Pad module through a second external register of the second matrix selector;
transmitting a signal received by the first target signal input interface to the Pad module under the condition that the first target signal input interface is not the first signal input interface;
and under the condition that the first target signal input interface is the first signal input interface, selecting a second target signal input interface from a plurality of signal input interfaces of the first matrix selector through a first peripheral register of the first matrix selector according to the state of the Pad module, and transmitting signals received by the second target signal input interface to the Pad module.
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