CN117316813A - Whole addressing and receiving device of seed crystal compasses - Google Patents

Whole addressing and receiving device of seed crystal compasses Download PDF

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Publication number
CN117316813A
CN117316813A CN202311042420.1A CN202311042420A CN117316813A CN 117316813 A CN117316813 A CN 117316813A CN 202311042420 A CN202311042420 A CN 202311042420A CN 117316813 A CN117316813 A CN 117316813A
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CN
China
Prior art keywords
regular
wafer
addressing
execution
connecting rod
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311042420.1A
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Chinese (zh)
Inventor
赵裕兴
王乾宝
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Suzhou Delphi Laser Co Ltd
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Suzhou Delphi Laser Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Delphi Laser Co Ltd filed Critical Suzhou Delphi Laser Co Ltd
Priority to CN202311042420.1A priority Critical patent/CN117316813A/en
Publication of CN117316813A publication Critical patent/CN117316813A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a whole addressing and receiving device of a wafer compass, which comprises a wafer addressing and receiving component, wherein the wafer addressing and receiving component comprises a wafer addressing support frame, a wafer addressing moving plate, a wafer addressing servo motor, a material box support plate, a material box, a wafer addressing belt transmission mechanism and a wafer addressing screw rod transmission mechanism; a wafer compass assembly is arranged on one side of the wafer addressing and receiving assembly along the negative direction of the Y axis; the crystal compass assembly comprises a jacking electric cylinder, a regular rear supporting assembly, a regular executing assembly, a regular left connecting rod assembly and a regular right connecting rod assembly. According to the wafer alignment device, wafers with steel rings are aligned through the wafer alignment assembly, so that the wafers with the steel rings are opposite to the wafer material box, and the subsequent wafers with the steel rings can conveniently enter the material box.

Description

Whole addressing and receiving device of seed crystal compasses
Technical Field
The invention relates to the technical field related to wafer production and processing, in particular to a crystal compass whole addressing and receiving device.
Background
After the wafer is torn off, the wafer and the steel ring are required to be subjected to material collection treatment.
Through the mass retrieval, the prior art publication number is CN218144469U, a receiving device for wafer recovery is disclosed, and the receiving device comprises a base component and a first lifting component, and further comprises a second lifting component which is identical to the first lifting component in structure, wherein the first lifting component and the second lifting component are arranged at two side positions of the base component along the X-axis direction in a mirror image distribution manner. According to the invention, a double-material box structure is adopted, one material box is full and automatically withdraws, and the second material box enters into a material receiving state, so that the sufficient time for taking, placing and replacing the material box is reserved; through the structure setting that the elevating platform includes elevating platform motion board and elevating platform bottom plate to and the cooperation of third guide rail assembly, guiding axle, compression spring and sensor unit, have the function of striking protection warning.
In summary, the problems in the prior art are: when the wafer is required to be not regular after being received, the situation that the wafer with the steel ring and the wafer material box cannot be aligned possibly occurs, and the subsequent wafer with the steel ring cannot conveniently enter the material box.
In view of the above-mentioned drawbacks, the present inventors have actively studied and innovated to create a crystal compass whole addressing and receiving device, which has more industrial application value.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide a crystal compass whole addressing and receiving device.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the wafer addressing and receiving assembly comprises a wafer addressing and receiving assembly, wherein the wafer addressing and receiving assembly comprises a wafer addressing support frame, a wafer addressing moving plate, a wafer addressing servo motor, a material box support plate, a material box, a wafer addressing belt transmission mechanism and a wafer addressing screw transmission mechanism, the wafer addressing servo motor on one side of the bottom of the wafer addressing support frame can drive the wafer addressing moving plate to move on the wafer addressing support frame along the Z-axis direction through the wafer addressing belt transmission mechanism and the wafer addressing screw transmission mechanism, and the material box for storing wafers is arranged on the material box support plate on the wafer addressing moving plate;
a wafer compass assembly is arranged on one side of the wafer addressing and receiving assembly along the negative direction of the Y axis;
the crystal compass assembly comprises a jacking electric cylinder, a regulated rear supporting assembly, a regulated executing assembly, a regulated left connecting rod assembly and a regulated right connecting rod assembly;
the jacking electric cylinder is installed on the regular rear supporting component through the electric cylinder installation seat, the jacking electric cylinder can drive the regular execution component to move on the regular rear supporting component along the Z-axis direction, the regular left connecting rod component and the regular right connecting rod component are sequentially arranged above the regular execution component along the positive direction of the X-axis, and the regular execution component can synchronously drive the regular left connecting rod component and the regular right connecting rod component above the regular execution component to move along the X-axis direction.
As a further improvement of the invention, the regular back support assembly comprises a regular back support plate, a regular back support movable plate and a regular back support connecting plate, wherein two regular back support guide rails are arranged on one side of the regular back support plate along the positive direction of the Y axis, and the regular back support movable plate is connected with the regular back support guide rails through regular back support sliding blocks;
the regular execution assembly comprises a regular execution substrate, a regular execution motor and a regular execution belt transmission mechanism, wherein the regular execution substrate is connected with the regular rear support movable plate through a regular rear support connecting plate, regular execution guide rails distributed along the X-axis direction are arranged on the regular execution substrate, and the regular execution motor on one side of the bottom of the regular execution substrate can synchronously drive the regular left connecting rod assembly and the regular right connecting rod assembly above to move along the X-axis direction on the regular execution guide rails through the regular execution belt transmission mechanism.
As a further improvement of the invention, at least one regular rear supporting reinforcing rib is arranged on one side of the regular rear supporting plate along the negative direction of the Y axis.
As a further improvement of the present invention, a photosensor mount is mounted on the regular execution substrate at a position midway along the X-axis direction, and at least one photosensor is mounted on the photosensor mount.
As a further improvement of the present invention, the right-left link assembly includes right-left links distributed along the Y-axis direction, the bottom of the right-left link is connected to the right-execution guide rail on the right-execution base plate through the right-left link bracket and the right-execution slider, and the bottom of the right-left link is connected to the right-execution guide rail on the right-execution base plate through the right-right link bracket and the right-execution slider.
As a further improvement of the invention, at least one regular execution sensor is arranged on the regular execution substrate along the X-axis direction, and a regular connecting rod sensing piece matched with the regular execution sensor is arranged at the bottom of the regular right connecting rod bracket.
As a further improvement of the invention, the bottom of one side of the regular left connecting rod and the bottom of one side of the regular right connecting rod along the negative direction of the Y axis are respectively provided with a regular connecting rod sensor.
As a further improvement of the invention, a regular execution limiting block is arranged at a position along the middle of the X-axis direction on the regular execution substrate, and the regular execution limiting block is used for limiting the regular left connecting rod and the regular right connecting rod in the X-axis direction.
As a further improvement of the invention, one side of the wafer addressing support frame is provided with wafer addressing plates distributed along the Z-axis direction, and the wafer addressing moving plate is provided with wafer addressing sensors.
By means of the scheme, the invention has at least the following advantages:
according to the wafer alignment device, wafers with steel rings are aligned through the wafer alignment assembly, so that the wafers with the steel rings are opposite to the wafer material box, and the subsequent wafers with the steel rings can conveniently enter the material box;
the photoelectric sensor is used for monitoring whether the material exists in the material box corresponding layer or not and the wafer addressing sensor is combined for feeding back the current position information, so that whether the material exists in the material box corresponding layer or not can be monitored more easily.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a crystal compass whole addressing and receiving device;
FIG. 2 is a schematic diagram of the crystal compass assembly of FIG. 1;
FIG. 3 is a schematic view of the structure of the post-alignment support assembly of FIG. 2;
FIG. 4 is a schematic diagram of the structure of the regulated execution assembly of FIG. 2;
FIG. 5 is a schematic illustration of the structure of the structured left connecting rod assembly of FIG. 2;
FIG. 6 is a schematic illustration of the structure of the right and right connecting rod assembly of FIG. 2;
FIG. 7 is a schematic diagram of a side of the wafer addressing and receiving assembly of FIG. 1;
fig. 8 is a schematic diagram of another side of the wafer addressing and receiving assembly of fig. 1.
In the drawings, the meaning of each reference numeral is as follows.
The wafer alignment and collection assembly 1, the wafer addressing and collection assembly 2, the jacking electric cylinder 3, the electric cylinder mounting seat 4, the alignment and collection assembly 5, the alignment and execution assembly 6, the alignment and left connecting rod assembly 7, the alignment and right connecting rod assembly 8, the wafer 9, the alignment and collection support plate 10, the alignment and collection reinforcing rib 11, the alignment and collection support guide rail 12, the alignment and collection movable plate 13, the alignment and collection slide block 14, the alignment and collection connecting plate 15, the alignment and execution base plate 16, the alignment and execution motor 17, the alignment and execution sensor 18, the alignment and execution belt transmission mechanism 19, the photoelectric sensor frame 20, the photoelectric sensor 21, the alignment and execution guide rail 22, the alignment and execution slide block 23, the alignment and execution limiting block 24, the alignment and left connecting rod support 25, the alignment and right connecting rod support 26, the alignment and connection rod sensor 27, the alignment and right connecting rod support 28, the alignment and right connecting rod sensing piece 29, the alignment and right connecting rod 30, the wafer addressing support frame 31, the wafer addressing plate 32, the wafer addressing and movement plate 33, the wafer addressing sensor 34, the wafer servo motor 35, the cassette support plate 37, the wafer addressing and the belt transmission mechanism 39.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In order to make the present invention better understood by those skilled in the art, the following description will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present invention.
Examples
As shown in figures 1 to 8 of the drawings,
the wafer compass whole addressing and receiving device comprises a wafer addressing and receiving component 2, wherein the wafer addressing and receiving component 2 comprises a wafer addressing support frame 31, a wafer addressing moving plate 33, a wafer addressing servo motor 35, a material box support plate 36, a material box 37, a wafer addressing belt transmission mechanism 38 and a wafer addressing screw transmission mechanism 39, the wafer addressing servo motor 35 on one side of the bottom of the wafer addressing support frame 31 can drive the wafer addressing moving plate 33 to move on the wafer addressing support frame 31 along the Z-axis direction through the wafer addressing belt transmission mechanism 38 and the wafer addressing screw transmission mechanism 39, and the material box 37 for storing wafers 9 is arranged on the material box support plate 36 on the wafer addressing moving plate 33;
a wafer compass assembly 1 is arranged on one side of the wafer addressing and receiving assembly 2 along the negative direction of the Y axis;
the crystal compass assembly 1 comprises a jacking electric cylinder 3, a regulated rear supporting assembly 5, a regulated executing assembly 6, a regulated left connecting rod assembly 7 and a regulated right connecting rod assembly 8;
the jacking electric cylinder 3 is installed on the regular rear supporting component 5 through the electric cylinder installation seat 4, the jacking electric cylinder 3 can drive the regular execution component 6 to move on the regular rear supporting component 5 along the Z-axis direction, the regular left connecting rod component 7 and the regular right connecting rod component 8 are sequentially arranged above the regular execution component 6 along the positive direction of the X-axis, and the regular execution component 6 can synchronously drive the regular left connecting rod component 7 and the regular right connecting rod component 8 above to move along the X-axis direction.
Preferably, the post-alignment support assembly 5 comprises a post-alignment support plate 10, a post-alignment support movable plate 13 and a post-alignment support connecting plate 15, wherein two post-alignment support guide rails 12 are arranged on one side of the post-alignment support plate 10 along the positive direction of the Y axis, and the post-alignment support movable plate 13 is connected with the post-alignment support guide rails 12 through post-alignment support sliding blocks 14;
the regular execution assembly 6 comprises a regular execution base plate 16, a regular execution motor 17 and a regular execution belt transmission mechanism 19, the regular execution base plate 16 is connected with the regular rear support movable plate 13 through a regular rear support connecting plate 15, a regular execution guide rail 22 distributed along the X-axis direction is arranged on the regular execution base plate 16, and the regular execution motor 17 on one side of the bottom of the regular execution base plate 16 can synchronously drive the regular left connecting rod assembly 7 and the regular right connecting rod assembly 8 above to move along the X-axis direction on the regular execution guide rail 22 through the regular execution belt transmission mechanism 19.
Preferably, at least one of the post-alignment support ribs 11 is installed on one side of the post-alignment support plate 10 along the negative Y-axis direction.
Preferably, a photosensor holder 20 is mounted on the alignment-performing substrate 16 at a position midway along the X-axis direction, and at least one photosensor 21 is mounted on the photosensor holder 20.
Preferably, the left-hand link assembly 7 includes left-hand links 26 distributed along the Y-axis direction, the right-hand link assembly 8 includes right-hand links 30 distributed along the Y-axis direction, and the bottom of the left-hand links 26 is connected to the right-hand execution rail 22 on the right-hand execution board 16 through the left-hand link brackets 25 and the right-hand execution sliders 23, and the bottom of the right-hand links 30 is connected to the right-hand execution rail 22 on the right-hand execution board 16 through the right-hand link brackets 28 and the right-hand execution sliders 23.
Preferably, at least one of the alignment sensors 18 is mounted on the alignment substrate 16 along the X-axis direction, and the alignment link sensing piece 29 matched with the alignment sensor 18 is mounted on the bottom of the alignment right link bracket 28.
Preferably, the regular left link 26 and the regular right link 30 are each provided with a regular link sensor 27 at the bottom thereof on one side in the negative Y-axis direction.
Preferably, the alignment regulating block 24 is mounted on the alignment regulating substrate 16 at a position along the middle of the X-axis direction, and the alignment regulating block 24 is used for performing a limiting process on the alignment left link 26 and the alignment right link 30 in the X-axis direction.
Preferably, a wafer addressing plate 32 distributed along the Z-axis direction is mounted on one side of the wafer addressing support frame 31, and a wafer addressing sensor 34 is mounted on the wafer addressing movement plate 33. The wafer addressing sensor 34 may be a sensor such as a grating scale reading head, and a grating scale matched with the grating scale reading head is mounted on the wafer addressing board 32 along the Z-axis direction.
The working process of the invention is briefly described as follows:
meanwhile, the existing commonly used material box is provided with thirteen layers, thirteen wafers can be stored, when wafers with steel rings enter the material box layer by layer, the upper sensor is used for detecting the first layer of the material box and detecting whether the material box is provided with the wafers or not, so that dislocation between the wafers with the steel rings and the corresponding layers of the material box often occurs, and the wafers cannot be received.
As shown in fig. 1 to 8, when a wafer needs to enter the material box 37, the lifting cylinder 3 acts, and the cylinder rod of the lifting cylinder 3 stretches out to drive the normalization execution component 6 to lift, and meanwhile, the normalization execution motor 17 in the normalization execution component 6 acts to drive the normalization left connecting rod component 7 and the normalization right connecting rod component 8 to normalize the wafer, so that the normalization of the wafer is realized.
When the wafer enters the material box, the wafer addressing sensor 34 in the wafer addressing and material receiving assembly 2 monitors the position of the wafer addressing plate 32, and the current position is fed back, so that the position information is more accurate. Meanwhile, the two photoelectric sensors 21 in the regular execution assembly 6 monitor whether materials exist in the material box, if no wafer exists in the material box, the wafer is received, if the wafer exists, the wafer addressing servo motor 35 in the wafer addressing and receiving assembly 2 acts, the wafer addressing moving plate 33 is driven to move up and down through the wafer addressing belt transmission mechanism 38 and the wafer addressing screw transmission mechanism 39, then feeding is performed, meanwhile, the wafer addressing sensor 34 in the wafer addressing and receiving assembly 2 feeds back and controls the position information of the current feeding, whether the materials are placed in the corresponding layer in the material box or not is monitored in real time, and accurate receiving of the wafer is realized.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected: can be mechanically or electrically connected: the terms are used herein to denote any order or quantity, unless otherwise specified.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims (9)

1. The wafer compass whole addressing and receiving device comprises a wafer addressing and receiving component (2), wherein the wafer addressing and receiving component (2) comprises a wafer addressing support frame (31), a wafer addressing moving plate (33), a wafer addressing servo motor (35), a material box support plate (36), a material box (37), a wafer addressing belt transmission mechanism (38) and a wafer addressing screw transmission mechanism (39), the wafer addressing servo motor (35) on one side of the bottom of the wafer addressing support frame (31) can drive the wafer addressing moving plate (33) to move on the wafer addressing support frame (31) along the Z-axis direction through the wafer addressing belt transmission mechanism (38) and the wafer addressing screw transmission mechanism (39), and the material box (37) for storing a wafer (9) is arranged on the material box support plate (36) on the wafer addressing moving plate (33);
the method is characterized in that: a wafer compass assembly (1) is arranged on one side of the wafer addressing and receiving assembly (2) along the negative direction of the Y axis;
the crystal compass assembly (1) comprises a jacking electric cylinder (3), a regulated rear supporting assembly (5), a regulated executing assembly (6), a regulated left connecting rod assembly (7) and a regulated right connecting rod assembly (8);
the lifting electric cylinder (3) is arranged on the regular rear supporting component (5) through the electric cylinder mounting seat (4), the lifting electric cylinder (3) can drive the regular executing component (6) to move along the Z-axis direction on the regular rear supporting component (5), the regular left connecting rod component (7) and the regular right connecting rod component (8) are sequentially arranged above the regular executing component (6) along the positive direction of the X-axis, and the regular left connecting rod component (7) and the regular right connecting rod component (8) above the regular executing component (6) can be synchronously driven to move along the X-axis direction.
2. A crystal compass regular addressing and receiving device as claimed in claim 1, wherein the regular back support assembly (5) comprises a regular back support plate (10), a regular back support movable plate (13) and a regular back support connecting plate (15), two regular back support guide rails (12) are arranged on one side of the regular back support plate (10) along the positive direction of the Y axis, and the regular back support movable plate (13) is connected with the regular back support guide rails (12) through regular back support sliding blocks (14);
the utility model provides a regular execution subassembly (6) is including regular execution base plate (16), regular execution motor (17) and regular execution belt drive mechanism (19), regular execution base plate (16) are connected with regular back support fly leaf (13) through regular back support connecting plate (15), regular execution guide rail (22) that distribute along the X axis direction are installed on regular execution base plate (16), regular execution motor (17) of regular execution base plate (16) bottom one side can synchronous drive regular left connecting rod subassembly (7) and regular right connecting rod subassembly (8) of top along X axis direction removal on regular execution guide rail (22) through regular execution belt drive mechanism (19).
3. A crystal compass whole addressing and receiving device as claimed in claim 2, characterized in that at least one whole back supporting reinforcing rib (11) is arranged on one side of the whole back supporting plate (10) along the negative direction of the Y axis.
4. A crystal compass whole addressing and receiving device as claimed in claim 2, characterized in that a photoelectric sensor frame (20) is mounted on the regulating and executing substrate (16) at a position along the middle of the X-axis direction, and at least one photoelectric sensor (21) is mounted on the photoelectric sensor frame (20).
5. A crystal compass addressing and receiving device as claimed in claim 2, characterized in that the regular left link assembly (7) comprises regular left links (26) distributed along the Y-axis direction, the regular right link assembly (8) comprises regular right links (30) distributed along the Y-axis direction, the bottom of the regular left links (26) is connected with the regular execution guide rails (22) on the regular execution substrate (16) through regular left link brackets (25) and regular execution sliders (23), and the bottom of the regular right links (30) is connected with the regular execution guide rails (22) on the regular execution substrate (16) through regular right link brackets (28) and regular execution sliders (23).
6. The crystal compass whole addressing and receiving device according to claim 5, wherein at least one whole execution sensor (18) is installed on the whole execution substrate (16) along the X-axis direction, and a whole connecting rod sensing piece (29) matched with the whole execution sensor (18) is installed at the bottom of the whole right connecting rod bracket (28).
7. The crystal compass whole addressing and receiving device according to claim 5, wherein the bottom of one side of the regular left connecting rod (26) and the bottom of one side of the regular right connecting rod (30) along the negative direction of the Y axis are respectively provided with a regular connecting rod sensor (27).
8. The crystal compass whole addressing and receiving device according to claim 5, wherein a whole execution limiting block (24) is arranged on the whole execution substrate (16) at a position along the middle of the X-axis direction, and the whole execution limiting block (24) is used for limiting the whole left connecting rod (26) and the whole right connecting rod (30) in the X-axis direction.
9. A whole addressing and receiving device for wafer compasses according to claim 1, wherein a wafer addressing plate (32) distributed along the Z-axis direction is arranged on one side of the wafer addressing support frame (31), and a wafer addressing sensor (34) is arranged on the wafer addressing moving plate (33).
CN202311042420.1A 2023-08-18 2023-08-18 Whole addressing and receiving device of seed crystal compasses Pending CN117316813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311042420.1A CN117316813A (en) 2023-08-18 2023-08-18 Whole addressing and receiving device of seed crystal compasses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311042420.1A CN117316813A (en) 2023-08-18 2023-08-18 Whole addressing and receiving device of seed crystal compasses

Publications (1)

Publication Number Publication Date
CN117316813A true CN117316813A (en) 2023-12-29

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ID=89254298

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311042420.1A Pending CN117316813A (en) 2023-08-18 2023-08-18 Whole addressing and receiving device of seed crystal compasses

Country Status (1)

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CN (1) CN117316813A (en)

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