CN117297653A - Ultrasonic probe sound head and ultrasonic probe - Google Patents
Ultrasonic probe sound head and ultrasonic probe Download PDFInfo
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- CN117297653A CN117297653A CN202311180745.6A CN202311180745A CN117297653A CN 117297653 A CN117297653 A CN 117297653A CN 202311180745 A CN202311180745 A CN 202311180745A CN 117297653 A CN117297653 A CN 117297653A
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- 239000000523 sample Substances 0.000 title claims abstract description 37
- 210000001503 joint Anatomy 0.000 claims description 53
- 238000000605 extraction Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 14
- 238000002604 ultrasonography Methods 0.000 claims description 8
- 230000007704 transition Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000012814 acoustic material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 210000003238 esophagus Anatomy 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/08—Detecting organic movements or changes, e.g. tumours, cysts, swellings
- A61B8/0883—Detecting organic movements or changes, e.g. tumours, cysts, swellings for diagnosis of the heart
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Medical Informatics (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Physics & Mathematics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Gynecology & Obstetrics (AREA)
- Cardiology (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
An acoustic head and ultrasonic probe includes a flexible circuit board (300), with a positive interface (310) in a first portion of the flexible circuit board (300) mounted on a backing (200) for positive electrical connection with an array element. A second portion of the flexible circuit board (300) is embedded into the backing (200) from a top wall of the top of the backing (200) and extends out of the backing (200) so that electrical circuitry on the flexible circuit board (300) is electrically connected to other components. Because the second part of the flexible circuit board (300) extends out of the inner lining, the additional volume increased by bending the flexible circuit board (300) from the outer side wall of the back lining (200) can be avoided, the whole volume of the sound head is reduced, and meanwhile, the consistency of the appearance of each part of the sound head can be ensured.
Description
Technical Field
The application relates to the field of medical equipment, in particular to a sound head structure of an ultrasonic probe.
Background
The ultrasonic probe is an important part of ultrasonic equipment (such as ultrasonic diagnostic imaging equipment), and the working principle of the ultrasonic probe is that the piezoelectric effect is utilized to convert an excitation electric pulse signal of an ultrasonic complete machine into an ultrasonic signal to enter a patient body, and then an ultrasonic echo signal reflected by tissues is converted into an electric signal, so that the detection of the tissues is realized.
Among them, a transesophageal ultrasound probe (TEE) is a device capable of being extended into a body cavity of a human body to perform ultrasonic detection. Generally, referring to fig. 1 and 2, the ultrasonic probe includes a backing 1, a flexible circuit board 2, a wafer 3, a copper foil 4, and a matching layer 5, wherein the flexible circuit board 2 is covered on the backing 1, the wafer 3 is positioned on the flexible circuit board 2, the copper foil 4 is covered on the wafer 3, and the matching layer 5 is positioned on the copper foil 4. The outer side of the flexible circuit board 2 is bent from the top wall of the backing 1 to the position of the outer side wall, the outer side of the copper foil 4 is bent from the top wall of the wafer 3 to the flexible circuit board 2 and welded with the flexible circuit board 2, so that the positive electrode and the negative electrode of the wafer 3 are led out to the flexible circuit board 2.
Since the ultrasound probe is used to see the heart through the esophagus, the smaller the volume of the sound head, the better. However, the volume of the existing ultrasonic probe is reduced as much as possible, but the existing ultrasonic probe still causes discomfort to a patient.
Disclosure of Invention
The application mainly provides an acoustic head of an ultrasonic probe and the ultrasonic probe adopting the acoustic head, so as to provide a novel flexible circuit board and backing assembly structure.
In one embodiment, an acoustic head of an ultrasonic probe is provided, including:
the wafer is cut into a plurality of array elements;
a backing;
a flexible circuit board comprising a first portion mounted on top of the backing and a second portion embedded downwardly into the backing from a top wall of the backing top and protruding from within the backing; wherein, the part of the first part positioned at the top of the back lining contacts with each array element of the plurality of array elements;
the first part is provided with a negative electrode butt joint part and a positive electrode butt joint part, and the second part is provided with at least one switching part;
the positive electrode butt joint part is provided with a positive electrode connecting point, the negative electrode butt joint part is provided with a negative electrode connecting point, the switching part is provided with a switching point used for being connected with a control unit of the ultrasonic probe, and the positive electrode connecting point and the negative electrode connecting point are electrically connected with the switching point; the array element is positioned above the positive electrode butt joint part, and the positive electrode of the array element is electrically connected with a positive electrode connection point on the positive electrode butt joint part;
the negative electrode extraction structure conducts the negative electrode of the array element and the negative electrode connection point of the negative electrode butt joint part;
and a matching layer overlying the negative extraction structure.
In one embodiment, the backing comprises at least three backing blocks, which are a first backing block, a second backing block and a third backing block respectively, the first backing block, the second backing block and the third backing block are spliced to form a supporting table, the second backing block and the third backing block are positioned on two sides of the first backing block, the flexible circuit board is provided with at least two transfer parts, which are a first transfer part and a second transfer part respectively, the positive electrode butt joint part is positioned on the top wall of the first backing block, the first transfer part extends out of the backing from a gap between the first backing block and the second backing block, and the second transfer part extends out of the backing from a gap between the first backing block and the third backing block.
In one embodiment, the side walls of the first backing block are symmetrically disposed with respect to the top wall.
In one embodiment, the two side walls of the first backing block are obliquely arranged planes, vertical planes arranged along the vertical direction or obliquely arranged arc-shaped planes.
In one embodiment, the second backing block and the third backing block have sidewalls that are conformable to the first backing block.
In one embodiment, the top walls of the backing blocks are flush and are pieced together to form a planar support table.
In one embodiment, the array elements include an outer array element located at two outer sides and an inner array element located between the outer array elements, at least the positive electrode of the inner array element is connected with a positive electrode connection point on the positive electrode butt joint part, and at least the negative electrode of the inner array element is electrically connected with a negative electrode connection point of the flexible circuit board through a negative electrode lead-out structure.
In one embodiment, the negative electrode lead-out structure is provided with at least a main body capable of being electrically connected with all inner side array elements and at least one negative electrode lead-out part extending outwards from the main body, the negative electrode lead-out part is led out from the position of the outer side array elements, the negative electrode butt joint part is arranged corresponding to the negative electrode lead-out part, and a negative electrode connecting point of the negative electrode butt joint part is electrically connected with the negative electrode lead-out part.
In one embodiment, the anode butt-joint part is bent downwards from the cathode butt-joint part to the side surface of the backing, the anode lead-out part is bent downwards and covers the outer side of the anode butt-joint part, and the anode lead-out part is welded with the anode butt-joint part.
In one embodiment, the negative electrode lead-out structure is a copper foil.
In one embodiment, the negative electrode lead-out structure includes a conductive layer disposed on a side wall of the inner array element, a side wall of the backing, and a negative electrode butt joint portion of the flexible circuit board, where the conductive layer is formed of a conductive material, and extends continuously from a negative electrode of the inner array element to a negative electrode connection point of the negative electrode butt joint portion through the side wall of the backing, so that the negative electrode of the inner array element is electrically connected with the negative electrode connection point.
In one embodiment, the lower surface of the inner vibrating element is provided with a separation groove so as to separate the conductive layer on the side wall of the inner vibrating element from the positive electrode.
In one embodiment, the side wall of the outer array element is provided with a conductive layer, the conductive layer of the outer array element is electrically connected with the conductive layer of the inner vibration element, the conductive layer conducts the positive electrode and the negative electrode of the outer array element, and the flexible circuit board is electrically connected with the positive electrode of the outer array element.
In one embodiment, the backing has cut grooves, and the lowermost edge of the conductive layer on the side walls of the backing is lower than the lowermost edge of the cut grooves.
In one embodiment, the conductive layer is a gold plating layer.
In one embodiment, the wafer is octagonal, the array elements are strip-shaped, and the inner array elements are arranged between two outer array elements side by side.
In one embodiment, an acoustic head of an ultrasonic probe is provided, including:
the wafer is cut into a plurality of array elements;
a backing comprising at least two backing blocks, the backing blocks being spliced to form a support table;
the flexible circuit board is provided with a negative electrode butt joint part, a positive electrode butt joint part and at least one switching part, wherein the positive electrode butt joint part is provided with a positive electrode connecting point, the negative electrode butt joint part is provided with a negative electrode connecting point, the switching part is provided with a switching point used for being connected with a control unit of the ultrasonic probe, the positive electrode connecting point and the negative electrode connecting point are electrically connected with the switching point, the positive electrode butt joint part is arranged on a supporting table, the array element is positioned above the positive electrode butt joint part, the positive electrode of the array element is electrically connected with the positive electrode connecting point on the positive electrode butt joint part, and the switching part extends out of the backing from a gap between adjacent backing blocks;
the negative electrode extraction structure conducts the negative electrode of the array element with the negative electrode connection point;
and a matching layer, which covers over the negative electrode extraction structure.
An embodiment of the present application provides an ultrasound probe comprising a sound head as described in any one of the preceding claims and a base station, the sound head being mounted on the base station by a backing.
In the acoustic head and the ultrasonic probe according to the above embodiments, the positive electrode butting portion in the first portion of the flexible circuit board is mounted on the backing so as to be electrically connected to the positive electrode of the array element. The second portion of the flexible circuit board is embedded downwardly into the backing from the top wall of the top portion of the backing and extends out of the backing so that the electrical circuitry on the flexible circuit board is electrically connected to other components. Because the second part of the flexible circuit board extends out of the inner lining, the additional volume increased because the flexible circuit board is bent from the outer side wall of the back lining can be avoided, the whole volume of the sound head is reduced, and meanwhile, the consistency of the appearance of each part of the sound head can be ensured.
Drawings
FIG. 1 is a schematic diagram of the structure of a sound head of a transesophageal ultrasound probe;
FIG. 2 is a cross-sectional view of the sound head of FIG. 1;
FIG. 3 is a schematic view of the structure of an acoustic head according to an embodiment of the present application;
FIGS. 4 and 5 are exploded views of an acoustic head in one embodiment of the present application;
FIG. 6 is a cross-sectional view of an acoustic head in one embodiment of the present application;
FIG. 7 is a schematic diagram of the structure of a flexible circuit board and backing (before dicing) in one embodiment of the present application;
FIGS. 8-10 are schematic illustrations of different shapes of a first backing block in one embodiment of the present application;
FIG. 11 is a schematic view of a conductive layer used as a negative electrode lead-out structure in one embodiment of the present application;
fig. 12 is a schematic view of the structure of the lower surface (positive electrode) of the wafer in one embodiment of the present application.
Detailed Description
The invention will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present application. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, some operations associated with the present application have not been shown or described in the specification to avoid obscuring the core portions of the present application, and may not be necessary for a person skilled in the art to describe in detail the relevant operations based on the description herein and the general knowledge of one skilled in the art.
Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.
The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated.
The present embodiment provides an acoustic head of an ultrasonic probe, which can be applied to various types of ultrasonic probes, particularly transesophageal ultrasonic probes (TEEs).
Referring to fig. 3 to 5, the sound head includes a wafer 100, a backing 200, a flexible circuit board 300, a negative extraction structure 400, and a matching layer 500.
The wafer 100 is diced into a plurality of strip-shaped array elements. These array elements can be used to transmit and receive ultrasound signals.
Wherein the upper surface of the array element is a negative electrode, and the lower surface is a positive electrode. Generally, the array elements include an inner array element 110 and an outer array element 120, referring to fig. 4, the array elements located on two outer sides are generally outer array elements 120 (may be referred to as waste array elements in some embodiments), where the outer array elements 120 on each side may be more than one. Referring to fig. 4, in one embodiment, the wafer 100 is octagonal, and the inner array elements 110 are disposed between two outer array elements 120. Of course, other shapes for wafer 100 are possible and are not limited to the shape and configuration shown in FIG. 4.
Referring to fig. 1 and 2, in some embodiments, since the wafer 3, the copper foil 4 and the portion of the flexible circuit board 2 corresponding to the wafer 3 are cut into a plurality of independent strips (the inner array element 110 and the outer array element 120 shown in fig. 4), in order to ensure that at least the positive and negative poles of all the inner array elements in the wafer 3 are led out, the led-out areas are generally increased at the portion of the copper foil 4 and the flexible circuit board 2 protruding from the periphery of the wafer 3, so as to form a plurality of led-out portions 41 and 21 turned down. As shown in fig. 1 and 2, when the wafer 3 is octagonal, it is a more common method to provide the copper foil 4 and the flexible circuit board 2 with extraction portions 41, 21 from six directions of the wafer 3, respectively (since the outer array element (may also be referred to as a waste array element) is generally used to protect the inner array element, it is not necessary to require that it must extract the positive and negative electrodes, and thus the extraction portions may be provided only in the other six directions). These lead-out portions 41, 21 must be folded down only from outside the edge of the wafer 3, otherwise, the positive and negative electrodes of all vibration elements cannot be led out, so that the outer edges of the copper foil 4 and the flexible circuit board 2 must exceed the wafer 3, resulting in an increase in the size of the sound head, and the consistency of the outer edges of the copper foil 4 and the flexible circuit board 2 with the outer edges of the wafer 3 is poor.
The backing 200 may be provided as a unitary backing block, and also includes at least two backing blocks (e.g., 210, 220, 230). When the backing blocks are more than two, the backing blocks are arranged side by side and spliced to form the supporting table. Typically, the top wall of the backing block is flush and is split into a planar support table. Of course, the top wall of the supporting table is in a plane or other shapes, and can be set according to the actual structure requirement, and can also be in a cambered surface shape, a height fluctuation shape, a special-shaped shape and the like so as to adapt to the structures of other parts.
The support table serves as a support structure for the flexible circuit board 300, the wafer 100, and the matching layer 500. The flexible circuit board 300 includes a first portion mounted on top of the backing 200 and a second portion embedded down into the backing 200 from a top wall of the top of the backing 200 and protruding from the backing 200. The portion of the first portion located at the top of the backing 200 contacts each of the plurality of array elements, so that the area of the portion of the first portion located at the top of the backing 200 is smaller than the combined area of all the inner array elements 110.
The first portion has a positive electrode interface 310 and a negative electrode interface 330, and the second portion has at least one adapter 320. The positive electrode docking portion 310 has a positive electrode connection point, the negative electrode docking portion 330 has a negative electrode connection point, the adapter portion 320 has an adapter point for connection with a control unit of the ultrasound probe, and both the positive electrode connection point and the negative electrode connection point are electrically connected with the adapter point. The positive electrode connection point, the negative electrode connection point, the transfer point and other various electrical connection ends can be realized by adopting an electrical connection structure such as an electrode, a connection terminal and the like.
The switching point can be divided into a positive switching point and a negative switching point, wherein the positive switching point is electrically connected with the positive switching point, and the negative switching point is electrically connected with the negative switching point. Of course, in order to realize these electrical connections, some circuits may be further disposed on the flexible circuit board 300, so as to successfully lead out the positive electrode and the negative electrode of the array element, and these circuits may be completely realized by existing means, which is not described herein again.
The positive electrode butt-joint part 310 is mounted on a support table, and may be located on a part of the support table. The array element is located above the positive electrode butt joint part 310, and the positive electrode of the array element is connected with the positive electrode connection point on the positive electrode butt joint part 310. Referring to fig. 4, the positive electrode butt-joint portion 310 may be located in the middle of all the array elements, so that the positive electrode butt-joint portion 310 can be electrically connected to all the array elements (or only the inner array element 110) at the same time with a narrower width.
The number of the adaptor portions 320 may be one or more, and referring to fig. 5 to 7, two adaptor portions 320 are shown, and in some embodiments, one of the two adaptor portions 320 may be omitted. As shown in fig. 6 and 7, the adapter 320 extends from the gap between adjacent backing blocks (e.g., between 210 and 220 and between 210 and 230) to the outside of the backing 200 so that the flexible circuit board 300 is electrically connected to other components, such as a control unit of an ultrasonic probe, to control the operation of the array elements. Alternatively, when the backing 200 is a unitary backing block, the unitary backing block may have slits, and the transition 320 of the second portion may also be inserted into and out of the backing 200 through the slits.
Referring to fig. 1 and 2, when the adapter 21 of the flexible circuit board 2 is disposed outside the backing 1, the bending portion of the flexible circuit board 2 must be located outside the wafer 3 in order to ensure the electrical connection between the flexible circuit board 2 and the positive electrode of the array element. In the case of keeping the width of the wafer 3 unchanged, since the flexible circuit board 2 itself needs to occupy a certain space additionally when being bent, the width of the sound head will be enlarged outwards, and finally the width of the sound head is larger than the width of the wafer 3.
Referring to fig. 6, in the present embodiment, since the adapter 320 of the flexible circuit board 300 extends from the inner portion of the inner liner, the width of the backing 200 is ensured to be consistent with the width of the wafer 100 by adjusting the size of each backing block, and the sound head is finally obtained to be substantially consistent with the width of the wafer 100 under the condition that the width of the wafer 100 is unchanged. The volume is prevented from being additionally increased due to the bending of the flexible circuit board 300 from the outer side wall of the backing 200, so that the overall volume of the sound head is reduced. Moreover, this configuration ensures uniformity in the profile of the matching layer 500, wafer 100, and backing 200.
Referring to fig. 3 to 5, the negative electrode lead-out structure 400 conducts the negative electrode of the array element to the negative electrode connection point. The negative electrode lead-out structure 400 may take various structures capable of leading out and conducting the negative electrode of the array element to the negative electrode connection point of the flexible circuit board 300, for example, by means of copper foil or a conductive layer, which will be described in detail below.
The matching layer 500 is an acoustic material layer that is applied to the radiation surface of the transducer wafer 100 to achieve good transmission of acoustic energy in order to match the acoustic characteristic impedance between the transducer wafer 100 and the acoustic transmission medium. The matching layer 500 covers over the negative electrode extraction structure 400.
Further, referring to fig. 5 to 7, in one embodiment, the backing 200 includes at least three backing blocks, which are a first backing block 210, a second backing block 220, and a third backing block 230, respectively, and the second backing block 220 and the third backing block 230 are located on two sides of the first backing block 210. The flexible circuit board 300 has at least two through-connection portions 320, which are a first through-connection portion 320a and a second through-connection portion 320b (as shown in fig. 6), respectively, the positive electrode butt-connection portion 310 is located on the top wall of the first backing block 210, the first through-connection portion 320a extends from the gap between the first backing block 210 and the second backing block 220 to the outside of the backing 200, and the second through-connection portion 320b extends from the gap between the first backing block 210 and the third backing block 230 to the outside of the backing 200.
This configuration facilitates placement of the positive interface 310 of the flexible circuit board 300 in the middle of the support table to enable interfacing with all array elements. Providing two adapter portions 320 is advantageous in that the convenience and stability of the connection of the flexible circuit board 300 to other components (e.g., a control unit) can be improved, and both adapter portions 320 can be used to interface the control unit. Of course, in some embodiments, one of the second backing block 220 and the third backing block 230 may be omitted, with the top wall of the first backing block 210 extending outwardly, instead of the omitted second backing block 220 or third backing block 230, to form a similarly sized support stand. In this case, the transfer portion 320 located at the omitted second backing block 220 or third backing block 230 side may be omitted.
Of course, the first backing block 210 may be configured in any shape that is capable of satisfying the support stand required for formation, and capable of guiding the adapter 320 of the flexible circuit board 300 out from between the two backing blocks. However, in terms of processing cost and assembly efficiency, referring to fig. 8 to 10, the side walls 212 on both sides of the first backing block 210 are generally symmetrically disposed with respect to the top wall 211. Correspondingly, the second backing block 220 and the third backing block 230 have sidewalls that can be bonded to the first backing block 210. In particular, in one embodiment, the second backing block 220 and the third backing block 230 are symmetrical, which not only facilitates manufacturing, but also facilitates assembly.
In the symmetrical arrangement, the shape of the two side walls 212 of the first backing block 210 can be flexibly selected according to the requirement, please refer to fig. 8 to 10, and the two side walls 212 of the first backing block 210 can be arranged, but are not limited to, a plane (as shown in fig. 8) arranged obliquely, a vertical plane (as shown in fig. 9) arranged vertically, or an arc plane (as shown in fig. 10) arranged obliquely.
Further, the outer array element 120 is typically disposed on both sides of the inner array element 110, which may be used to protect the inner array element 110. To extract the positive electrode of the inner array element 110, in one embodiment, at least the positive electrode of the inner array element 110 is connected to the positive electrode connection point on the positive electrode butt joint 310, and at least the negative electrode of the inner array element 110 is electrically connected to the negative electrode connection point of the flexible circuit board 300 through the negative electrode extraction structure 400.
In order to achieve extraction of the negative poles of the inner array element 110 (or all array elements), referring to fig. 3 to 5, in one embodiment, the negative pole extraction structure 400 has at least a main body 410 capable of electrically connecting with all the inner array elements 110 and at least one negative pole extraction portion 420 protruding and extending outwards from the main body 410. The negative electrode lead-out portion 420 is led out from the position of the outer array element 120, the negative electrode butt-joint portion 330 is provided corresponding to the negative electrode lead-out portion 420, and is also led out from the position of the outer array element 120, and the negative electrode connection point of the negative electrode butt-joint portion 330 is electrically connected to the negative electrode lead-out portion 420.
In this structure, the negative electrode lead-out portion 420 is led out from the outer array element 120 on one side or both sides, and there is no need to provide the negative electrode lead-out portion 420 at too many positions, so that the overall volume of the sound head can be reduced, and the consistency of the outer structures of the wafer 100, the backing 200 and the matching layer 500 is also facilitated.
The anode butt-joint part 330 is also arranged at the position of the outer array element 120, so that the flexible circuit board 300 can be prevented from being provided with too many anode butt-joint parts 330, and the space of the outer array element 120 can be skillfully utilized, and related circuits on the flexible circuit board 300 are arranged at the position below the outer array element 120 so as to butt-joint the anode lead-out part 420. The overall sound head volume can be further reduced without changing the size of the wafer 100.
In addition, referring to fig. 3 and 4, in one embodiment, the anode butt-joint portion 330 is bent downward from the cathode butt-joint portion 310 to the side surface of the backing 200, the anode lead-out portion 420 is bent downward and covers the outside of the anode butt-joint portion 330, and the anode lead-out portion 420 is welded with the anode butt-joint portion 330.
Since the outer array element 120 is not directly used for sending and recovering ultrasonic waves, the flexible circuit board 300 does not have to be abutted against the positive electrode of the outer array element 120, and thus, in some embodiments, the negative electrode abutting portion 330 may be bent downward under the outer array element 120, so that the negative electrode abutting portion 330 does not protrude from the wafer 100, or protrudes only slightly from the wafer 100, thereby further reducing the width of the sound head.
The negative electrode lead-out structure 400 shown above may be made of copper foil or other materials that may be capable of conducting electricity.
Of course, other manners of the negative electrode lead-out structure 400 are also possible. For example, referring to fig. 7 and 11, in another embodiment, the anode lead-out structure 400 may also include a conductive layer a disposed on a side wall of the inner array element 110, a side wall of the backing 200, and the anode butt-joint portion 330 of the flexible circuit board 300, where the conductive layer a is formed of a conductive material and extends continuously from the anode of the inner array element 110 to the anode connection point of the anode butt-joint portion 330 via the side wall of the backing 200, so that the anode of the inner array element 110 is electrically connected to the anode connection point.
The structure omits the conventional copper foil, and the flexible circuit board 300 is directly electrically connected with the negative electrode of the inner array element 110 by using the conductive layer A, so that the overall structure of the sound head can be reduced, and the consistency of the external shapes, particularly the side walls, of the wafer 100, the backing 200 and the matching layer 500 is facilitated.
The upper surface of the inner array element 110 is a negative electrode, and the lower surface is a positive electrode, and the conductive layer a is disposed on the side wall of the inner array element 110, so that the positive electrode and the negative electrode may be conducted. To eliminate this hidden trouble, in one embodiment, as shown in fig. 12, the lower surface of the inner array element 110 has a separation groove 101 to separate the conductive layer a on the sidewall of the inner array element 110 from the positive electrode. Each of the inner array elements 110 may have a conductive layer a on one or both sidewalls, and the isolation grooves 101 are disposed corresponding to the conductive layer a. As shown in fig. 11 and 12, in one embodiment, the side walls at two ends of the inner array element 110 are provided with conductive layers a, so as to enhance the conducting effect of the conductive layers a on the negative electrode of the array element, and avoid the situation that the negative electrode of the inner array element 110 cannot be led out due to the disconnection of a certain section of the conductive layer a. At this time, the isolation groove 101 can separate the middle part from the end part of the inner array element 110, so as to avoid the short circuit between the positive electrode and the negative electrode. When the conductive layer a is provided on only one side wall of the inner array element 110, the isolation groove 101 may be provided only on the one side.
For the outer array element 120, the side wall of the outer array element may not be provided with the conductive layer a, which does not affect the extraction of the negative electrode of the inner array element 110. Of course, in some embodiments, corresponding conductive layers a may be disposed at both ends of the outer array element 120. In order to facilitate the overall processing, the isolation groove 101 may be processed together with the entire wafer 100, and in this case, the isolation groove 101 may be provided on the outer array element 120.
Of course, referring to fig. 11, in one embodiment, the side wall of the outer array element 120 also has a conductive layer a, and the conductive layer a of the outer array element 120 is electrically connected to the conductive layer a of the inner array element 110. At this time, the conductive layer a conducts the positive electrode and the negative electrode of the outer array element 120, and the flexible circuit board 300 is electrically connected to the positive electrode of the outer array element 120. That is, the negative electrode of the inner array element 110 can be conducted to the flexible circuit board 300 by the outer array element 120, so as to enhance the extraction effect of the negative electrode of the inner array element 110.
Further, the wafer 100 is typically diced after being placed on the backing 200 and the flexible circuit board 300, and as shown in fig. 4 and 5, the matching layer 500, the positive electrode butt-joint 310 of the flexible circuit board 300, and the backing 200 are diced at the same time when the wafer 100 is diced, wherein the matching layer 500 may be diced into the same shape and structure as the wafer 100. The positive electrode butt joint 310 of the flexible circuit board 300 is also cut into a strip-shaped structure consistent with the wafer 100, and the positive electrode connection point is located on the strip-shaped structure. The backing 200 acts as a support structure with cut grooves in its top surface. To avoid the dicing channels from breaking the conductive layer a, in one embodiment, the lowermost edge of the conductive layer a on the side wall of the backing 200 is lower than the lowermost edge of the dicing channels, leaving the conductive layer a in a via state at all times.
Typically, the conductive layer a shown above is made of various conductive materials, but in order to ensure reliable conduction, the conductive layer a may be made of a relatively soft oxidation-resistant metal, such as gold plating. After the conductive layer A is plated, the sound head needs to be cut, so that the conductive layer A is not easy to fall off and edge breakage is ensured during cutting. In one embodiment, the conductive layer a is a gold plating layer.
On the other hand, the present embodiment also provides an ultrasonic probe including the acoustic head as described in any one of the above embodiments. Referring to fig. 3 to 7, the ultrasonic probe further includes a base 600, and the backing 200 is mounted on the base 600 and assembled to other components through the base 600.
Of course, the ultrasound probe further includes components such as a housing, a control unit for controlling the array elements, and the like, and these structures can be implemented with reference to the existing structures, which is not described in detail in this embodiment.
The foregoing description of specific examples has been presented only to aid in the understanding of the present application and is not intended to limit the present application. Variations of the above embodiments may be made by those of ordinary skill in the art in light of the concepts of the present application.
Claims (20)
1. An acoustic head of an ultrasonic probe, comprising:
the wafer is cut into a plurality of array elements;
a backing;
the flexible circuit board is provided with a negative electrode butt joint part, a positive electrode butt joint part and at least one switching part, wherein the positive electrode butt joint part is provided with a positive electrode connecting point, the negative electrode butt joint part is provided with a negative electrode connecting point, the switching part is provided with a switching point used for being connected with a control unit of the ultrasonic probe, the positive electrode connecting point and the negative electrode connecting point are electrically connected with the switching point, the positive electrode butt joint part is arranged at the top of the back lining, the array element is positioned above the positive electrode butt joint part, the positive electrode of the array element is electrically connected with the positive electrode connecting point of the positive electrode butt joint part, and the switching part extends out of the back lining from the inside of the back lining;
the negative electrode extraction structure conducts the negative electrode of the array element and the negative electrode connection point of the negative electrode butt joint part;
and a matching layer overlying the negative extraction structure.
2. The sound head of claim 1, wherein the backing comprises at least three backing blocks, which are respectively a first backing block, a second backing block and a third backing block, the first backing block, the second backing block and the third backing block being joined to form a support table, the second backing block and the third backing block being located on either side of the first backing block, the flexible circuit board having at least two transition portions, which are respectively a first transition portion and a second transition portion, the positive electrode abutment portion being located on a top wall of the first backing block, the first transition portion extending out of the backing from a gap between the first backing block and the second backing block, the second transition portion extending out of the backing from a gap between the first backing block and the third backing block.
3. The sound head of claim 2, wherein the side walls of the first backing block are symmetrically disposed with respect to the top wall.
4. The sound head of claim 3, wherein the side walls of the first backing block are obliquely disposed planes, vertically disposed planes, or obliquely disposed arcuate surfaces.
5. The sound head of claim 2, wherein the second backing block and the third backing block have sidewalls capable of conforming to the first backing block.
6. The sound head of claim 2, wherein the top wall of the backing block is flush and the support table is split into a planar shape.
7. The sound head of claim 1, wherein the array elements comprise an outer array element located on the outer sides of the two sides and an inner array element located between the outer array elements, at least the positive electrode of the inner array element is connected with a positive electrode connection point on the positive electrode butt joint part, and at least the negative electrode of the inner array element is electrically connected with a negative electrode connection point of the flexible circuit board through a negative electrode lead-out structure.
8. The sound head of claim 7, wherein the negative electrode lead-out structure has at least a main body capable of electrically connecting with all inner array elements and at least one negative electrode lead-out portion extending convexly outward from the main body, the negative electrode lead-out portion being led out from a position of the outer array element, the negative electrode butt joint portion being provided corresponding to the negative electrode lead-out portion, a negative electrode connection point of the negative electrode butt joint portion being electrically connected with the negative electrode lead-out portion.
9. The sound head of claim 8, wherein the negative electrode butt joint portion is bent downward from the positive electrode butt joint portion to a side surface of the backing, the negative electrode lead-out portion is bent downward and covers an outer side of the negative electrode butt joint portion, and the negative electrode lead-out portion is welded with the negative electrode butt joint portion.
10. The sound head of claim 8 or 9, wherein the negative lead-out structure is copper foil.
11. The sound head of claim 7, wherein the negative electrode lead-out structure comprises a conductive layer disposed on a side wall of the inner array element, a side wall of the backing, and a negative electrode junction of the flexible circuit board, the conductive layer being formed of a conductive material, the conductive layer extending continuously from the negative electrode of the inner array element through the side wall of the backing to a negative electrode junction of the negative electrode junction, the negative electrode of the inner array element being electrically connected to the negative electrode junction.
12. The sound head of claim 11, wherein the lower surface of the inner array element has a separation groove to separate the conductive layer on the side wall of the inner array element from the positive electrode.
13. The sound head of claim 11, wherein the side wall of the outer array element has a conductive layer, the conductive layer of the outer array element is electrically connected with the conductive layer of the inner array element, the conductive layer conducts the positive pole and the negative pole of the outer array element, and the flexible circuit board is electrically connected with the positive pole of the outer array element.
14. The sound head of claim 11, wherein the backing has cut grooves, and the lowermost edge of the conductive layer on the side wall of the backing is lower than the lowermost edge of the cut grooves.
15. The sound head of claim 11, wherein the conductive layer is a gold-plated layer.
16. The sound head of claim 7, wherein the wafer is octagonal, the array elements are in the shape of strips, and the inner array element is disposed side-by-side between two outer array elements.
17. The sound head of claim 1, wherein there are at least two of the transfer points.
18. An acoustic head of an ultrasonic probe, comprising:
the wafer is cut into a plurality of array elements;
a backing;
a flexible circuit board comprising a first portion and a second portion, the first portion
Partially mounted on top of the backing, the second portion being embedded downwardly into the backing from a top wall of the backing top and protruding from within the backing; wherein the portion of the first portion at the top of the backing is in contact with at least some of the plurality of array elements;
the first part has a positive electrode butt joint part, and the second part has a negative electrode butt joint part and a negative electrode butt joint part
One less switching part;
the positive electrode butt joint part is provided with a positive electrode connecting point, the negative electrode butt joint part is provided with a negative electrode connecting point,
the switching part is provided with a switching point used for being connected with a control unit of the ultrasonic probe, and the positive electrode connecting point and the negative electrode connecting point are electrically connected with the switching point; the array element is positioned above the positive electrode butt joint part, and the positive electrode of the array element is electrically connected with a positive electrode connection point on the positive electrode butt joint part;
the negative electrode extraction structure is used for extracting the negative electrode of the array element and the negative electrode pair
The negative electrode connection point of the connection part is conducted;
and a matching layer overlying the negative extraction structure.
19. An acoustic head of an ultrasonic probe, comprising:
the wafer is cut into a plurality of array elements;
a backing;
a flexible circuit board comprising a first portion and a second portion, the first portion
Partially mounted on top of the backing, the second portion being embedded downwardly into the backing from a top wall of the backing top and protruding from within the backing; wherein the portion of the first portion at the top of the backing is in contact with at least some of the plurality of array elements;
the first part has a negative electrode butt joint part and a positive electrode butt joint part, and the second part has a positive electrode butt joint part
One less switching part;
the positive electrode butt joint part is provided with a positive electrode connecting point, the negative electrode butt joint part is provided with a negative electrode connecting point,
the switching part is provided with a switching point used for being connected with a control unit of the ultrasonic probe, and the positive electrode connecting point and the negative electrode connecting point are electrically connected with the switching point; the array element is positioned above the positive electrode butt joint part, and the positive electrode of the array element is electrically connected with a positive electrode connection point on the positive electrode butt joint part;
the negative electrode extraction structure is used for extracting the negative electrode of the array element and the negative electrode pair
The negative electrode connection point of the connection part is conducted;
and a matching layer overlying the negative extraction structure.
20. An ultrasound probe comprising the acoustic head of any one of claims 1-19 and a base station, the acoustic head being mounted to the base station by a backing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311180745.6A CN117297653A (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/104551 WO2021042329A1 (en) | 2019-09-05 | 2019-09-05 | Acoustic head of ultrasound probe and ultrasound probe |
| CN202311180745.6A CN117297653A (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
| CN201980097946.5A CN114072058B (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201980097946.5A Division CN114072058B (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
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| CN117297653A true CN117297653A (en) | 2023-12-29 |
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| CN202311180745.6A Pending CN117297653A (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
| CN201980097946.5A Active CN114072058B (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
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| CN201980097946.5A Active CN114072058B (en) | 2019-09-05 | 2019-09-05 | Ultrasonic probe sound head and ultrasonic probe |
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| WO (1) | WO2021042329A1 (en) |
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| CN113720390B (en) * | 2021-08-31 | 2023-05-05 | 西安交通大学 | Piezoelectric ultrasonic-vibration acceleration composite sensor and measuring device |
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| JP2805005B2 (en) * | 1989-07-24 | 1998-09-30 | 日本電波工業株式会社 | Ultrasonic probe |
| EP1034743A1 (en) * | 1999-03-10 | 2000-09-13 | Arno Nierich | Transmission device for a transesophageal ultrasound imaging system |
| KR100915485B1 (en) * | 2005-05-30 | 2009-09-03 | 가부시끼가이샤 도시바 | Ultrasonic probe and method of manufacturing the same |
| JP4860351B2 (en) * | 2006-05-22 | 2012-01-25 | 富士フイルム株式会社 | Curved surface attaching method and ultrasonic probe |
| JP2008085413A (en) * | 2006-09-26 | 2008-04-10 | Nippon Dempa Kogyo Co Ltd | Ultrasonic probe and manufacturing method thereof |
| CN202191309U (en) * | 2011-05-23 | 2012-04-18 | 上海爱培克电子科技有限公司 | Ultrasonic probe |
| JP5550706B2 (en) * | 2012-10-31 | 2014-07-16 | 日立アロカメディカル株式会社 | Ultrasonic probe |
| WO2014069500A1 (en) * | 2012-10-31 | 2014-05-08 | 日立アロカメディカル株式会社 | Ultrasonic probe |
| CN103300889B (en) * | 2013-05-17 | 2015-04-29 | 深圳市理邦精密仪器股份有限公司 | Ultrasonic array probe signal acquisition component and preparation method thereof, and probe |
| WO2016208631A1 (en) * | 2015-06-23 | 2016-12-29 | オリンパス株式会社 | Ultrasonic vibrator and ultrasonic probe |
| CN106805994B (en) * | 2015-11-27 | 2020-02-18 | 中科绿谷（深圳）医疗科技有限公司 | Ultrasonic probe and preparation method thereof |
| CN105411623A (en) * | 2015-12-25 | 2016-03-23 | 中国科学院深圳先进技术研究院 | Two-dimensional area array ultrasonic transducer and manufacturing method thereof |
| CN106333708B (en) * | 2016-08-22 | 2019-09-13 | 深圳开立生物医疗科技股份有限公司 | A kind of flexible circuit board, transesophageal probe and transesophageal probe preparation method |
| US20180055339A1 (en) * | 2016-08-29 | 2018-03-01 | David R. RICHARDS | Inflatable covers for transesophageal echocardiography transducer probes |
| CN109700479A (en) * | 2019-02-25 | 2019-05-03 | 南京广慈医疗科技有限公司 | A kind of two-dimensional array ultrasound imaging probe |
| CN110090792B (en) * | 2019-06-03 | 2020-08-18 | 飞依诺科技(苏州)有限公司 | Ultrasonic probe |
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2019
- 2019-09-05 WO PCT/CN2019/104551 patent/WO2021042329A1/en active Application Filing
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| CN114072058B (en) | 2023-10-03 |
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