CN106388864A - Manufacturing method of two-dimensional array energy converter and two-dimensional array energy converter - Google Patents
Manufacturing method of two-dimensional array energy converter and two-dimensional array energy converter Download PDFInfo
- Publication number
- CN106388864A CN106388864A CN201610998896.6A CN201610998896A CN106388864A CN 106388864 A CN106388864 A CN 106388864A CN 201610998896 A CN201610998896 A CN 201610998896A CN 106388864 A CN106388864 A CN 106388864A
- Authority
- CN
- China
- Prior art keywords
- dimensional array
- matching layer
- breadth
- orthogonal
- piezoelectric chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Abstract
The invention provides a manufacturing method of a two-dimensional array energy converter and the two-dimensional array energy converter and relates to the technical field of two-dimensional array energy converters. The method comprises the following steps: printing a first matching layer and a second matching layer through a 3D (Three Dimensional) printing technology; adhering the first matching layer to a ground electrode face of a piezoelectric wafer, and adhering the second matching layer to the first matching layer, so as to form a first integrated part through the piezoelectric wafer, the first matching layer and the second matching layer; cutting the first integrated part from a side face to form two-dimensional arrays which are orthogonal vertically and horizontally; molding the two-dimensional arrays which are orthogonal vertically and horizontally into a plane on a molding die; according to the two-dimensional arrays which are orthogonal vertically and horizontally and are molded into the plane, generating a public electrode lead wire and a signal transmission channel, so as to from a second integrated part; by virtue of the 3D printing technology, printing the outer part of the second integrated part into a back lining through adopting a back lining filling die; and by virtue of the 3D printing technology, printing an acoustic lens on the outer side of a part cured and molded by the back lining through adopting an acoustic lens filling die.
Description
Technical field
The present invention relates to two-dimensional array transducer technical field, more particularly, to a kind of manufacture method of two-dimensional array transducer
And two-dimensional array transducer.
Background technology
Currently, supersonic diagnostic appts have a wide range of applications in medical field, by launching ultrasonic wave to object body
And checked in vivo according to the echo receiving, understand that physiology or institutional framework form find human body diseases by measurement.And mesh
Front 3-D supersonic imaging is one of important directions of ultrasound medicine development.In 3-D supersonic imaging, three-dimensional image acquisition is general
Need to realize by two-dimensional array transducer.
At present, two-dimensional array transducer can be divided into rectangular array and circle ring array according to the arrangement mode of array element, clinical
Upper conventional two-dimensional rectangle array.And make two-dimensional array transducer at present and face many difficulties, particularly to array element cutting technique
Electrical connection techniques and array element between require very high.In recent years, with array element cutting technique from machine cuts, laser cutting
It is transitioned into the miniature molding stage, electrical connection techniques are from manual welding, bending multilayer circuit to ultra-large special IC
Be combined with laser boring, have been able to easily make the two-dimensional array comprising thousand of array elements, but apart from array elements up to ten thousand
Array makes still relatively large distance.It can be seen that, how the manufacture two-dimensional array transducer of efficient quick become currently urgently to be resolved hurrily
Problem.
Content of the invention
Embodiments of the invention provide a kind of manufacture method of two-dimensional array transducer and two-dimensional array transducer, to solve
The how problem of the manufacture two-dimensional array transducer of efficient quick.
For reaching above-mentioned purpose, the present invention adopts the following technical scheme that：
A kind of manufacture method of two-dimensional array transducer, including：
First matching layer and the second matching layer are printed by 3D printing technique；
Described first matching layer is bonded on the ground electrode face of piezoelectric chip, and the second matching layer is bonded to first
Join layer so that piezoelectric chip, the first matching layer and the second matching layer form one first global facility；
Described first global facility is cut into two-dimensional array orthogonal in length and breadth from side；
Described two-dimensional array orthogonal in length and breadth is shaped to plane on mould；
According to the two-dimensional array orthogonal in length and breadth being shaped to plane, generate public electrode lead and signal transmission pathway, shape
Become the second global facility；
By 3D printing technique, mould is irrigated using a backing and is printed as backing by outside described second global facility；
By 3D printing technique, mould, the member outside printing sound after backing curing molding are irrigated using an acoustic lens
Lens.
Specifically, described first global facility is cut into two-dimensional array orthogonal in length and breadth from side, including：
Described first global facility is cut into the two-dimensional array with transverse cuts groove and longitudinally cutting groove from side, makes
Obtain described two-dimensional array and form multiple array elements；
Described transverse cuts groove cuts through to described second matching layer from described piezoelectric chip；Described longitudinally cutting groove is from described
Piezoelectric chip cuts, and does not cut through described piezoelectric chip.
Specifically, the array element number of described two-dimensional array is 625, and array element area is 1.3cm × 1.3cm, between array element
Gap be 0.1mm.
Specifically, according to the two-dimensional array orthogonal in length and breadth being shaped to plane, public electrode lead and signal transmission are generated
Path, forms the second global facility, including：
The ground electrode connecting wire being shaped to the two-dimensional array orthogonal in length and breadth of plane is welded together, forms common electrical
Pole lead；
Successively the signal lead pad of the signal electrode lead of described piezoelectric chip and pcb board is welded on FPC plate
Together, form signal transmission pathway.
A kind of two-dimensional array transducer, including：Piezoelectric chip, the first matching layer being obtained using 3D printing and the second coupling
Layer；Described first matching layer is bonded on the ground electrode face of piezoelectric chip, and described second matching layer is bonded in the first matching layer；Institute
State piezoelectric chip, the first matching layer and the second matching layer and form one first global facility；
In length and breadth orthogonal two-dimensional array is distributed with described first global facility；
It is connected with public electrode lead and signal transmission pathway on described two-dimensional array orthogonal in length and breadth；It is connected with common electrical
The two-dimensional array orthogonal in length and breadth of pole lead and signal transmission pathway constitutes one second global facility；
Outside described second global facility, backing is printed with by 3D printing technique；
Outside described backing, acoustic lens is printed with by 3D printing technique.
Specifically, described two-dimensional array orthogonal in length and breadth have multiple transverse cuts grooves and longitudinally cutting groove so that institute
State and multiple array elements are formed with two-dimensional array；Described transverse cuts groove cuts through to described second matching layer from described piezoelectric chip；
Described longitudinally cutting groove cuts from described piezoelectric chip, and does not cut through described piezoelectric chip；Margin location in described two-dimensional array
Install and be equipped with electrode isolation groove.
Additionally, the array element number of described two-dimensional array is 625, array element area is 1.3cm × 1.3cm, between array element
Gap is 0.1mm.
Additionally, the ground electrode of described two-dimensional array orthogonal in length and breadth is connected with ground electrode connecting wire, each ground electrode connects
Wire welds together, and forms public electrode lead；
The signal electrode of described piezoelectric chip is connected with signal electrode lead, described signal electrode lead pass through FPC plate by
Layer is welded together with the signal lead pad of pcb board, forms signal transmission pathway.
A kind of manufacture method of two-dimensional array transducer provided in an embodiment of the present invention and two-dimensional array transducer, due to
One matching layer, the second matching layer, backing and acoustic lens are all using 3D printing technique shaping so that whole two-dimensional array transducer system
Make simple and quick, the electronics that can solve between array element cutting technique that current two-dimensional array transducer faces and array element connects
Technical problem.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, also may be used
So that other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 provides a kind of schematic flow sheet of the manufacture method of two-dimensional array transducer for the embodiment of the present invention；
Fig. 2 provides a kind of structural representation one of two-dimensional array transducer for the embodiment of the present invention；
Fig. 3 provides a kind of structural representation two of two-dimensional array transducer for the embodiment of the present invention；
Fig. 4 is two-dimensional array and cutting groove schematic diagram in the embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of not making creative work
Embodiment, broadly falls into the scope of protection of the invention.
As shown in figure 1, the embodiment of the present invention provides a kind of manufacture method of two-dimensional array transducer, including：
Step 101, the first matching layer and the second matching layer are printed by 3D printing technique.
Step 102, described first matching layer is bonded on the ground electrode face of piezoelectric chip, and by the second matching layer bonding
To the first matching layer so that piezoelectric chip, the first matching layer and the second matching layer form one first global facility.
Step 103, described first global facility is cut into two-dimensional array orthogonal in length and breadth from side.
Herein, this step 103 can be in the following way：Described first global facility is cut into from side and has laterally
The two-dimensional array of cutting groove and longitudinally cutting groove is so that described two-dimensional array forms multiple array elements；Described transverse cuts groove is from institute
State piezoelectric chip to cut through to described second matching layer；Described longitudinally cutting groove cuts from described piezoelectric chip, and does not cut through described
Piezoelectric chip.
Herein, the array element number of described two-dimensional array can be 25 × 25=625, array element area be 1.3cm ×
1.3cm, the gap between array element is 0.1mm.
Step 104, described two-dimensional array orthogonal in length and breadth is shaped to plane on mould.
Step 105, basis are shaped to the two-dimensional array orthogonal in length and breadth of plane, generate public electrode lead and signal transmission
Path, forms the second global facility.
Herein, this step 105 can be realized in the following way：The two-dimensional array orthogonal in length and breadth of plane will be shaped to
Ground electrode connecting wire welds together, and forms public electrode lead；With FPC plate (flexible PCB, Flexible Printed
Circuit) successively by the signal electrode lead of described piezoelectric chip and pcb board (printed circuit board, Printed Circuit
Board signal lead pad) welds together, and forms signal transmission pathway.
Step 106, pass through 3D printing technique, using one backing irrigate mould be printed as outside described second global facility
Backing.
Step 107, pass through 3D printing technique, using one acoustic lens irrigate mould, outside the part after backing curing molding
Side prints acoustic lens.
A kind of manufacture method of two-dimensional array transducer provided in an embodiment of the present invention, due to the first matching layer, second
Join layer, backing and acoustic lens all using 3D printing technique shaping so that whole two-dimensional array transducer is simple to manufacture and fast, can
To solve the problems, such as the electrical connection techniques between array element cutting technique that current two-dimensional array transducer faces and array element.
Corresponding to above-mentioned embodiment of the method, as shown in Figures 2 and 3, the embodiment of the present invention provides a kind of two-dimensional array to change
Energy device 20, including：Piezoelectric chip 201, the first matching layer 202 being obtained using 3D printing and the second matching layer 203；Described first
Matching layer 202 is bonded on the ground electrode face of piezoelectric chip 201, and described second matching layer 203 is bonded in the first matching layer 202；
Described piezoelectric chip 201, the first matching layer 202 and the second matching layer 203 form one first global facility.
Two-dimensional array 204 orthogonal in length and breadth is distributed with described first global facility.
It is connected with public electrode lead 205 and signal transmission pathway 206 on described two-dimensional array 204 orthogonal in length and breadth.Even
It is connected to public electrode lead and the two-dimensional array orthogonal in length and breadth of signal transmission pathway constitutes one second global facility.
Outside described second global facility, backing 207 is printed with by 3D printing technique.
In described backing 207 outside, acoustic lens 208 is printed with by 3D printing technique.
Specifically, as shown in figure 4, multiple transverse cuts grooves 209 being had on described two-dimensional array 204 orthogonal in length and breadth and indulging
To cutting groove 210 so that multiple array elements 211 are formed with described two-dimensional array 204；Described transverse cuts groove 209 is from described pressure
Electric chip 201 cuts through to described second matching layer 203；Described longitudinally cutting groove 210 cuts from described piezoelectric chip 201, and not
Cut through described piezoelectric chip 201；The marginal position of described two-dimensional array 204 is provided with electrode isolation groove 212.
Herein, the array element number of described two-dimensional array can be 25 × 25=625, array element area can for 1.3cm ×
1.3cm, the gap between array element can be 0.1mm.
Additionally, as shown in Fig. 2 the ground electrode of described two-dimensional array 204 orthogonal in length and breadth is connected with ground electrode connecting wire
213, each ground electrode connecting wire 213 welds together, and forms public electrode lead 205.
Additionally, as shown in Figures 2 and 3, the signal electrode of described piezoelectric chip 201 is connected with signal electrode lead 214, institute
State signal electrode lead 214 successively to weld together with the signal lead pad 217 of pcb board 216 by FPC plate 215, formed
Signal transmission pathway 206.
A kind of manufacture method of two-dimensional array transducer provided in an embodiment of the present invention and two-dimensional array transducer, due to
One matching layer, the second matching layer, backing and acoustic lens are all using 3D printing technique shaping so that whole two-dimensional array transducer system
Make simple and quick, the electronics that can solve between array element cutting technique that current two-dimensional array transducer faces and array element connects
Technical problem.
Apply specific embodiment in the present invention principle of the present invention and embodiment are set forth, above example
Explanation be only intended to help and understand the method for the present invention and its core concept；Simultaneously for one of ordinary skill in the art,
According to the thought of the present invention, all will change in specific embodiments and applications, in sum, in this specification
Hold and should not be construed as limitation of the present invention.
Claims (8)
1. a kind of manufacture method of two-dimensional array transducer is it is characterised in that include：
First matching layer and the second matching layer are printed by 3D printing technique；
Described first matching layer is bonded on the ground electrode face of piezoelectric chip, and the second matching layer is bonded to the first coupling
Layer is so that piezoelectric chip, the first matching layer and the second matching layer form one first global facility；
Described first global facility is cut into two-dimensional array orthogonal in length and breadth from side；
Described two-dimensional array orthogonal in length and breadth is shaped to plane on mould；
According to the two-dimensional array orthogonal in length and breadth being shaped to plane, generate public electrode lead and signal transmission pathway, form the
Two global facilities；
By 3D printing technique, mould is irrigated using a backing and is printed as backing by outside described second global facility；
By 3D printing technique, mould is irrigated using an acoustic lens, the member outside after backing curing molding prints acoustic lens.
2. the manufacture method of two-dimensional array transducer according to claim 1 is it is characterised in that by described first entirety portion
Part cuts into two-dimensional array orthogonal in length and breadth from side, including：
Described first global facility is cut into the two-dimensional array with transverse cuts groove and longitudinally cutting groove so that institute from side
State two-dimensional array and form multiple array elements；
Described transverse cuts groove cuts through to described second matching layer from described piezoelectric chip；Described longitudinally cutting groove is from described piezoelectricity
Chip cuts, and does not cut through described piezoelectric chip.
3. the manufacture method of two-dimensional array transducer according to claim 2 is it is characterised in that the battle array of described two-dimensional array
First number is 625, and array element area is 1.3cm × 1.3cm, and the gap between array element is 0.1mm.
4. the manufacture method of two-dimensional array transducer according to claim 1 is it is characterised in that according to being shaped to plane
Orthogonal two-dimensional array in length and breadth, generates public electrode lead and signal transmission pathway, forms the second global facility, including：
The ground electrode connecting wire being shaped to the two-dimensional array orthogonal in length and breadth of plane is welded together, forms public electrode and draw
Line；
Successively the signal lead pad of the signal electrode lead of described piezoelectric chip and pcb board is welded together with FPC plate,
Form signal transmission pathway.
5. a kind of two-dimensional array transducer is it is characterised in that include：Piezoelectric chip, the first matching layer being obtained using 3D printing
With the second matching layer；Described first matching layer is bonded on the ground electrode face of piezoelectric chip, and described second matching layer is bonded in
One matching layer；Described piezoelectric chip, the first matching layer and the second matching layer form one first global facility；
In length and breadth orthogonal two-dimensional array is distributed with described first global facility；
It is connected with public electrode lead and signal transmission pathway on described two-dimensional array orthogonal in length and breadth；It is connected with public electrode to draw
The two-dimensional array orthogonal in length and breadth of line and signal transmission pathway constitutes one second global facility；
Outside described second global facility, backing is printed with by 3D printing technique；
Outside described backing, acoustic lens is printed with by 3D printing technique.
6. two-dimensional array transducer according to claim 5 is it is characterised in that have on described two-dimensional array orthogonal in length and breadth
There are multiple transverse cuts grooves and longitudinally cutting groove so that multiple array elements are formed with described two-dimensional array；Described transverse cuts groove
Cut through to described second matching layer from described piezoelectric chip；Described longitudinally cutting groove cuts from described piezoelectric chip, and does not cut through
Described piezoelectric chip；The marginal position of described two-dimensional array is provided with electrode isolation groove.
7. two-dimensional array transducer according to claim 6 is it is characterised in that the array element number of described two-dimensional array is
625, array element area is 1.3cm × 1.3cm, and the gap between array element is 0.1mm.
8. two-dimensional array transducer according to claim 5 is it is characterised in that the ground of described two-dimensional array orthogonal in length and breadth
Electrode is connected with ground electrode connecting wire, and each ground electrode connecting wire welds together, and forms public electrode lead；
The signal electrode of described piezoelectric chip is connected with signal electrode lead, described signal electrode lead pass through FPC plate successively with
The signal lead pad of pcb board welds together, and forms signal transmission pathway.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610998896.6A CN106388864A (en) | 2016-11-08 | 2016-11-08 | Manufacturing method of two-dimensional array energy converter and two-dimensional array energy converter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610998896.6A CN106388864A (en) | 2016-11-08 | 2016-11-08 | Manufacturing method of two-dimensional array energy converter and two-dimensional array energy converter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106388864A true CN106388864A (en) | 2017-02-15 |
Family
ID=59230712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610998896.6A Pending CN106388864A (en) | 2016-11-08 | 2016-11-08 | Manufacturing method of two-dimensional array energy converter and two-dimensional array energy converter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106388864A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760243A (en) * | 2018-12-28 | 2019-05-17 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing equipment and method |
| CN109759306A (en) * | 2019-02-03 | 2019-05-17 | 中国科学院微电子研究所 | Ultrasound transducer array structure and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151150A (en) * | 2011-01-25 | 2011-08-17 | 古伦勇 | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof |
| US20130289593A1 (en) * | 2012-04-30 | 2013-10-31 | Timothy L. Hall | Ultrasound Transducer Manufacturing Using Rapid-Prototyping Method |
| US20160185056A1 (en) * | 2014-12-31 | 2016-06-30 | General Electric Company | System and method for manufacturing an ultrasound probe lens |
-
2016
- 2016-11-08 CN CN201610998896.6A patent/CN106388864A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151150A (en) * | 2011-01-25 | 2011-08-17 | 古伦勇 | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof |
| US20130289593A1 (en) * | 2012-04-30 | 2013-10-31 | Timothy L. Hall | Ultrasound Transducer Manufacturing Using Rapid-Prototyping Method |
| US20160185056A1 (en) * | 2014-12-31 | 2016-06-30 | General Electric Company | System and method for manufacturing an ultrasound probe lens |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109760243A (en) * | 2018-12-28 | 2019-05-17 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing equipment and method |
| CN109759306A (en) * | 2019-02-03 | 2019-05-17 | 中国科学院微电子研究所 | Ultrasound transducer array structure and preparation method thereof |
| CN109759306B (en) * | 2019-02-03 | 2020-11-13 | 中国科学院微电子研究所 | Ultrasonic transducer array structure and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9538986B2 (en) | Probe for ultrasonic diagnostic apparatus and method of manufacturing the same | |
| US7103960B2 (en) | Method for providing a backing member for an acoustic transducer array | |
| US11806752B2 (en) | Ultrasound transducer and method for wafer level front face attachment | |
| US9073086B2 (en) | Probe for ultrasonic diagnostic apparatus and method of manufacturing the same | |
| JP4909115B2 (en) | Ultrasound probe | |
| CN101495247B (en) | Ultrasound transducer featuring a pitch independent interposer and method of making the same | |
| JP2007181684A (en) | Transducer assembly having z-axis interconnection | |
| CN103181785A (en) | Ultrasound probe and manufacturing method thereof | |
| EP2894631B1 (en) | Ultrasonic diagnostic apparatus and manufacturing method thereof | |
| CN102151150B (en) | Two-dimensional array and three-dimensional imaging transducer and manufacturing method thereof | |
| CN103371850A (en) | Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus | |
| KR101222911B1 (en) | Two dimensional ultrasonic transducer | |
| US9616463B2 (en) | Probe for ultrasound system and method of manufacturing the same | |
| CN106388864A (en) | Manufacturing method of two-dimensional array energy converter and two-dimensional array energy converter | |
| CN102596430A (en) | Curved ultrasonic hifu transducer formed by tiled segments | |
| KR101151844B1 (en) | Manufacturing method of a conductive baking layer and two dimensional ultrasonic transducer with a conductive baking layer | |
| CN107280704A (en) | Two-dimensional ultrasound corrugated battle array probe and preparation method thereof | |
| KR101133462B1 (en) | Probe for ultrasonic diagnostic apparatus and manufacturing method thereof | |
| KR20150073056A (en) | Ultrasonic diagnostic instrument and manufacturing method thereof | |
| CN114190978A (en) | Array ultrasonic transducer and manufacturing method and assembling device thereof | |
| JP2014023131A (en) | Ultrasonic probe, and method of manufacturing the same | |
| JP3553923B2 (en) | Forward looking ultrasonic probe and method of manufacturing the same | |
| CN109939915A (en) | A kind of spliced ultrasonic transducer and preparation method thereof | |
| CN114871083B (en) | Flexible cylindrical array of capacitive micromachined ultrasonic transducer and preparation method thereof | |
| US20230201876A1 (en) | Array architecture and interconnection for transducers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
|
| RJ01 | Rejection of invention patent application after publication |