WO2021042329A1

WO2021042329A1 - Acoustic head of ultrasound probe and ultrasound probe

Info

Publication number: WO2021042329A1
Application number: PCT/CN2019/104551
Authority: WO
Inventors: 郑洲; 唐明; 符多喜; 吴飞
Original assignee: 深圳迈瑞生物医疗电子股份有限公司
Priority date: 2019-09-05
Filing date: 2019-09-05
Publication date: 2021-03-11
Also published as: CN114072058A; CN117297653A; CN114072058B

Abstract

An acoustic head and an ultrasound probe comprising a flexible circuit board (300), a positive electrode docking part (310) in a first part of the flexible circuit board (300) being mounted on a backing (200) to facilitate electrical connection with an array element positive electrode. A second part of the flexible circuit board (300) is embedded in the backing (200) downward from the top wall of the top part of the backing (200), and extends out from inside the backing (200) to facilitate electrical connection of the circuit on the flexible circuit board (300) with other components. The second part of the flexible circuit board (300) extending out from inside the backing can avoid the additional volume increase due to the bending of the flexible circuit board (300) from the outer wall of the backing (200), reducing the overall volume of the acoustic head and also ensuring the consistency of the shape of each component of the acoustic head.

Description

Acoustic head of ultrasonic probe and ultrasonic probe

Technical field

The application relates to the field of medical equipment, and specifically to an acoustic head structure of an ultrasonic probe.

Background technique

Ultrasound probe is an important part of ultrasonic equipment (such as ultrasonic diagnostic imaging equipment). Its working principle is to use piezoelectric effect to convert the excitation electrical pulse signal of the whole ultrasonic machine into ultrasonic signal into the patient's body, and then the ultrasonic echo signal reflected by the tissue Converted into electrical signals, so as to realize the detection of tissues.

Among them, the transesophageal ultrasound probe (TEE) is a device that can be inserted into the body cavity for ultrasonic testing. Generally, please refer to Figures 1 and 2. This kind of ultrasonic probe includes a backing 1, a flexible circuit board 2, a chip 3, a copper foil 4, and a matching layer 5. The flexible circuit board 2 covers the backing 1, and the chip 3 is located On the flexible circuit board 2, the copper foil 4 covers the wafer 3, and the matching layer 5 is located on the copper foil 4. The outer side of the flexible circuit board 2 is bent from the top wall of the backing 1 to the position of the outer side wall, and the outer side of the copper foil 4 is bent from the top wall of the chip 3 to the flexible circuit board 2 and welded together with the flexible circuit board 2. Thus, the positive and negative electrodes of the chip 3 are led out to the flexible circuit board 2.

Summary of the invention

technical problem

Since the ultrasound probe is used to see the heart through the esophagus, the smaller the acoustic head volume, the better. However, although the volume of the existing ultrasound probe has been reduced as much as possible, it still causes discomfort to the patient.

The solution to the problem

Technical solutions

This application mainly provides an acoustic head of an ultrasonic probe and an ultrasonic probe adopting the acoustic head, so as to provide a new type of flexible circuit board and backing assembly structure.

An embodiment of the present application provides an acoustic head of an ultrasound probe, including:

A wafer, the wafer is cut into a number of array elements;

Backing

A flexible circuit board comprising a first part and a second part, the first part is mounted on the top of the backing, and the second part is embedded in the back from the top wall of the top of the backing. Lining and extending from the backing; wherein the part of the first part at the top of the backing is in contact with each of the plurality of array elements;

The first part has a negative electrode butting part and a positive electrode butting part, and the second part has at least one adapter part;

The positive connection part has a positive connection point, the negative connection part has a negative connection point, the adapter part has a connection point for connecting with the control unit of the ultrasonic probe, and the positive connection point and the negative connection point are both Electrically connected to the transition point; the array element is located above the positive electrode butting portion, and the positive electrode of the array element is electrically connected to the positive electrode connection point on the positive electrode butting portion;

A negative electrode lead-out structure, which connects the negative electrode of the array element with the negative electrode connection point of the negative electrode butting portion;

And a matching layer, the matching layer covering the negative electrode lead structure.

In an embodiment, the backing includes at least three backing blocks, which are a first backing block, a second backing block, and a third backing block, respectively. The first backing block, the second backing block are The backing block and the third backing block are joined together to form a support platform, the second backing block and the third backing block are located on both sides of the first backing block, the flexible circuit board has at least two adapter parts, and They are a first adapter part and a second adapter part. The positive connecting part is located on the top wall of the first backing block. The first adapter part is separated from the first backing block and the second backing block. The gap between the two protrudes out of the backing, and the second transition part protrudes from the gap between the first backing block and the third backing block to the outside of the backing.

In an embodiment, the side walls on both sides of the first backing block are symmetrically arranged with respect to the top wall.

In an embodiment, the side walls on both sides of the first backing block are inclined planes, vertical planes arranged in a vertical direction, or inclined arc-shaped surfaces.

In an embodiment, the second backing block and the third backing block have side walls that can be attached to the first backing block.

In an embodiment, the top wall of the backing block is flush, and is assembled into a flat support platform.

In an embodiment, the array element includes an outer array element located on the outer sides of the two sides and an inner array element located between the outer array elements, and at least the positive electrode of the inner array element is connected to the positive electrode connection point on the positive electrode docking portion, and at least The negative electrode of the inner array element is electrically connected to the negative electrode connection point of the flexible circuit board through the negative lead-out structure.

In one embodiment, the negative electrode lead structure has a main body that can be electrically connected to all inner array elements and at least one negative electrode lead portion protruding and extending outward from the main body, and the negative electrode lead portion is from the outer array element. Position lead-out, the negative electrode butting portion is arranged corresponding to the negative electrode lead-out portion, and the negative electrode connection point of the negative electrode butting portion is electrically connected to the negative electrode lead-out portion.

In one embodiment, the negative electrode butting portion is bent downward from the positive electrode butting portion to the side surface of the backing, the negative electrode lead-out portion is bent downward and covers the outside of the negative electrode butting portion, and the negative electrode leads The part is welded to the butt part of the negative electrode.

In an embodiment, the negative electrode lead structure is copper foil.

In an embodiment, the negative lead-out structure includes a conductive layer provided on the sidewall of the inner array element, the sidewall of the backing, and the negative connecting portion of the flexible circuit board, and the conductive layer is formed of a conductive material. The conductive layer continuously extends from the negative electrode of the inner element through the backing sidewall to the negative electrode connection point of the negative electrode butting portion, so that the negative electrode of the inner element is electrically connected to the negative electrode connection point.

In an embodiment, the lower surface of the inner vibrator has a partition groove to isolate the conductive layer on the side wall of the inner vibrator from the positive electrode.

In an embodiment, the side wall of the outer element has a conductive layer, the conductive layer of the outer element is electrically connected to the conductive layer of the inner element, and the conductive layer connects the positive and negative electrodes of the outer element. When turned on, the flexible circuit board is electrically connected to the positive electrode of the outer array element.

In an embodiment, the backing has a cutting groove, and the lowermost edge of the conductive layer on the sidewall of the backing is lower than the lowermost edge of the cutting groove.

In an embodiment, the conductive layer is a gold-plated layer.

In an embodiment, the wafer has an octagonal shape, the array elements are strip-shaped, and the inner array elements are arranged side by side between two outer array elements.

A wafer, the wafer is cut into a number of array elements;

Backing, the backing includes at least two backing blocks, and the backing blocks are joined together to form a support platform;

A flexible circuit board, the flexible circuit board having a negative butting portion, a positive butting portion and at least one transition portion, the positive butting portion has a positive connection point, the negative butting portion has a negative connection point, and the transition portion has The connecting point for connecting with the control unit of the ultrasound probe, the positive connection point and the negative connection point are electrically connected to the switching point, the positive connection part is installed on the supporting table, and the array element is located at the Above the positive electrode butting portion, and the positive electrode of the array element is electrically connected to the positive electrode connection point on the positive electrode butting portion, and the transition portion extends from the gap between the adjacent backing blocks to the outside of the backing;

A negative electrode lead-out structure, which connects the negative electrode of the array element and the negative electrode connection point;

And a matching layer, which covers the negative electrode lead structure.

An embodiment of the present application provides an ultrasonic probe, which includes the acoustic head and a base as described in any one of the above, and the acoustic head is installed on the base through a backing.

In the acoustic head and the ultrasonic probe according to the above-mentioned embodiments, the positive connection part in the first part of the flexible circuit board is installed on the backing so as to be electrically connected to the positive electrode of the array element. The second part of the flexible circuit board is embedded in the backing from the top wall of the top of the backing, and protrudes from the backing, so that the circuits on the flexible circuit board are electrically connected with other components. Since the second part of the flexible circuit board protrudes from the inside of the inner lining, the additional volume increase due to the bending of the flexible circuit board from the outer side wall of the backing can be avoided, so that the overall volume of the acoustic head is reduced, and the acoustic head can be guaranteed The consistency of the shape of each part.

The beneficial effects of the invention

Brief description of the drawings

Description of the drawings

Figure 1 is a schematic structural diagram of the acoustic head of a transesophageal ultrasound probe;

Figure 2 is a cross-sectional view of the acoustic head of Figure 1;

FIG. 3 is a schematic diagram of the structure of the acoustic head in an embodiment of the application;

4 and 5 are exploded schematic diagrams of the acoustic head in an embodiment of the application;

Figure 6 is a cross-sectional view of the acoustic head in an embodiment of the application;

7 is a schematic diagram of the structure of the flexible circuit board and the backing (before cutting) in an embodiment of the application;

8-10 are schematic diagrams of different shapes of the first backing block in an embodiment of the application;

11 is a schematic diagram of a conductive layer used as a negative electrode lead structure in an embodiment of the application;

FIG. 12 is a schematic diagram of the structure of the lower surface (positive electrode) of the wafer in an embodiment of the application.

Invention embodiment

Embodiments of the present invention

Hereinafter, the present invention will be further described in detail through specific embodiments in conjunction with the accompanying drawings. Among them, similar elements in different embodiments adopt the related similar element numbers. In the following embodiments, many detailed descriptions are used to make this application better understood. However, those skilled in the art can easily realize that some of the features can be omitted under different circumstances, or can be replaced by other elements, materials, and methods. In some cases, some operations related to this application are not shown or described in the specification. This is to avoid the core part of this application being overwhelmed by excessive descriptions. For those skilled in the art, these are described in detail. Related operations are not necessary, they can fully understand the related operations based on the description in the manual and the general technical knowledge in the field.

In addition, the features, operations, or features described in the specification can be combined in any appropriate manner to form various implementations. At the same time, the steps or actions in the method description can also be sequentially exchanged or adjusted in a manner obvious to those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for the purpose of clearly describing a certain embodiment, and are not meant to be a necessary sequence, unless it is specified that a certain sequence must be followed.

The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application include direct and indirect connection (connection) unless otherwise specified.

This embodiment provides an acoustic head of an ultrasound probe, which can be applied to various ultrasound probes, especially transesophageal ultrasound probes (TEE).

Please refer to FIGS. 3 to 5, the acoustic head includes a chip 100, a backing 200, a flexible circuit board 300, a negative electrode lead structure 400 and a matching layer 500.

The wafer 100 is cut into a number of strip-shaped array elements. These array elements can be used to transmit and receive ultrasonic signals.

Among them, the upper surface of the array element is the negative electrode, and the lower surface is the positive electrode. Usually the array element includes the inner array element 110 and the outer array element 120. Please refer to Fig. 4. Generally, the outer array element 120 is the outer array element 120 (in some embodiments, it may be called the waste array element). There may be more than one outer array element 120. Please refer to FIG. 4, in an embodiment, the chip 100 has an octagonal shape, and the inner array element 110 is arranged side by side between two outer array elements 120. Of course, the wafer 100 may also adopt other shapes, and is not limited to the shape and structure shown in FIG. 4.

Please refer to Figures 1 and 2. In some embodiments, the chip 3, the copper foil 4, and the flexible circuit board 2 and the corresponding part of the chip 3 will be cut into a number of independent strips (as shown in Figure 4, the inner array element 110 and The outer array element 120), in order to ensure that at least the positive and negative poles of all the inner array elements in the chip 3 are led out, usually the copper foil 4 and the flexible circuit board 2 protruding from the periphery of the chip 3 are added with a lead-out area, thereby forming A plurality of lead-out

portions

41, 21 that are folded downward. As shown in Figures 1 and 2, when the chip 3 is octagonal, the more commonly used method is that the copper foil 4 and the flexible circuit board 2 are respectively provided with

lead portions

41, 21 from the six directions of the chip 3 (because the outer array element ( It may also be called a waste array element) It is usually used to protect the inner array element, and it is not necessary to lead the positive and negative poles out, so the lead-out parts can only be set in the other six directions). These lead-out

parts

41, 21 must and can only be folded down from outside the edge of the chip 3, otherwise the positive and negative electrodes of all the vibration elements cannot be led out, so the outer edges of the copper foil 4 and the flexible circuit board 2 must exceed the chip 3. As a result, the size of the acoustic head becomes larger, and the outer edges of the copper foil 4 and the flexible circuit board 2 and the outer edges of the chip 3 are also poorly consistent.

The backing 200 may adopt an integral backing block, and also include at least two backing blocks (for example, 210, 220, 230). When there are more than two backing blocks, the backing blocks are arranged side by side and joined together to form a support platform. Generally, the top wall of the backing block is flush, and is assembled into a flat support platform. Of course, whether the top wall of the support table is a plane or other shapes can be set according to the actual structure needs, and it can also be arcuate, undulating, and special-shaped to adapt to the structure of other components.

The supporting table serves as a supporting structure for the flexible circuit board 300, the wafer 100 and the matching layer 500. The flexible circuit board 300 includes a first part and a second part. The first part is installed on the top of the backing 200, and the second part is embedded in the backing 200 from the top wall of the top of the backing 200 and protrudes from the backing 200. . Wherein, the part of the first part at the top of the backing 200 is in contact with each element of the plurality of elements, so that the area of the part of the first part at the top of the backing 200 is smaller than the area formed by all the inner elements 110.

The first part has a positive connection part 310 and a negative connection part 330, and the second part has at least one adapter part 320. The positive connection part 310 has a positive connection point, the negative connection part 330 has a negative connection point, and the adapter part 320 has a connection point for connecting with the control unit of the ultrasound probe. Both the positive connection point and the negative connection point are electrically connected to the connection point. connection. Among them, various electrical connection terminals such as the positive connection point, the negative connection point, and the transfer point can be realized by using electrical connection structures such as electrodes and connection terminals.

The transfer point can be divided into a positive transfer point and a negative transfer point. The positive connection point is electrically connected to the positive transfer point, and the negative transfer point is electrically connected to the negative connection point. Of course, in order to achieve these electrical connections, some circuits may be provided on the flexible circuit board 300 to successfully lead out the positive and negative electrodes of the array element. These circuits can be implemented by existing means, and will not be repeated here.

The positive electrode docking portion 310 is installed on a supporting table, and may be located on a part of the supporting table. The array element is located above the positive electrode docking portion 310, and the positive electrode of the array element is connected to the positive electrode connection point on the positive electrode docking portion 310. Please refer to FIG. 4, the positive mating portion 310 may be located in the middle of all the array elements, so that the positive mating portion 310 can be electrically connected to all the array elements (or only the inner array element 110) at the same time with a narrow width.

There can be one or more adapter parts 320. Please refer to FIGS. 5 to 7. The figures show two adapter parts 320. In some embodiments, one of the two adapter parts 320 may be omitted. One. As shown in FIGS. 6 and 7, the adapter portion 320 extends from the gap between adjacent backing blocks (for example, between 210 and 220 and between 210 and 230) to the outside of the backing 200, so that the flexible circuit board 300 is electrically connected with other components, for example, connected with the control unit of the ultrasonic probe, so as to control the working state of the array element. Alternatively, when the backing 200 is an integral backing block, the integral backing block may have some gaps, and the adapter portion 320 of the second part may also be embedded in and out of the backing 200 from these gaps.

1 and 2, when the adaptor 21 of the flexible circuit board 2 is arranged outside the backing 1, in order to ensure the electrical connection between the flexible circuit board 2 and the positive electrode of the array element, the bend of the flexible circuit board 2 must be located on the chip 3 beyond. In the case of keeping the width of the chip 3 unchanged, since the flexible circuit board 2 itself needs to occupy a certain amount of space when it is bent, it will cause the width of the acoustic head to expand outward, and finally make the width of the acoustic head larger than that of the chip 3. The width.

Please refer to FIG. 6, in this embodiment, since the adapter portion 320 of the flexible circuit board 300 protrudes from the inside of the lining, by adjusting the size of each backing block, it can be ensured that the width of the backing 200 is consistent with the width of the chip 100. When the width of the wafer 100 is unchanged, the width of the acoustic head is basically the same as that of the wafer 100 finally. It can avoid the additional increase in volume due to the bending of the flexible circuit board 300 from the outer side wall of the backing 200, which reduces the overall volume of the acoustic head. Moreover, this structure can ensure the uniformity of the shapes of the matching layer 500, the wafer 100 and the backing 200.

Please refer to FIGS. 3 to 5, the negative electrode lead structure 400 conducts the negative electrode of the array element and the negative electrode connection point. The negative lead structure 400 can adopt various structures that can lead the negative electrode of the array element and conduct it to the negative connection point of the flexible circuit board 300, such as copper foil or a conductive layer, which will be described in detail below.

The matching layer 500 is an acoustic material layer laid on the radiating surface of the chip 100 in order to achieve the matching of the acoustic characteristic impedance between the transducer chip 100 and the sound transmission medium, so that the sound energy can pass through well. The matching layer 500 covers the negative electrode lead structure 400.

Further, referring to FIGS. 5 to 7, in an embodiment, the backing 200 includes at least three backing blocks, which are a first backing block 210, a second backing block 220, and a third backing block, respectively 230, the second backing block 220 and the third backing block 230 are located on both sides of the first backing block 210. The flexible circuit board 300 has at least two adapter portions 320, which are a first adapter portion 320a and a second adapter portion 320b (as shown in FIG. 6), and the positive mating portion 310 is located on the top of the first backing block 210. On the wall, the first adapter portion 320a extends from the gap between the first backing block 210 and the second backing block 220 to the outside of the backing 200, and the second adapter portion 320b extends from the first backing block 210 to The gaps between the third backing blocks 230 extend out of the backing 200.

This structure is advantageous for arranging the positive electrode docking portion 310 of the flexible circuit board 300 in the middle of the supporting table so as to be able to be docked with all the array elements. The provision of two adapter parts 320 is beneficial to improve the convenience and stability of the connection between the flexible circuit board 300 and other components (such as the control unit), and the two adapter parts 320 can be used for docking with the control unit. Of course, in some embodiments, one of the second backing block 220 and the third backing block 230 may also be omitted, so that the top wall of the first backing block 210 extends outward instead of the omitted second backing block. The backing block 220 or the third backing block 230 forms a support platform of the same size. At this time, the transition part 320 on the side of the omitted second backing block 220 or third backing block 230 can also be omitted.

Of course, the first backing block 210 can be set in any possible shape, which can meet the needs of forming a supporting platform, and can lead the adapter portion 320 of the flexible circuit board 300 from between the two backing blocks. However, in terms of processing cost and assembly efficiency, please refer to FIGS. 8 to 10. Generally, the side walls 212 on both sides of the first backing block 210 are symmetrically arranged with respect to the top wall 211. Correspondingly, the second backing block 220 and the third backing block 230 have side walls that can be attached to the first backing block 210. In particular, in one embodiment, the second backing block 220 and the third backing block 230 have a symmetrical structure, which not only facilitates processing, but also facilitates assembly.

Under the condition of symmetrical arrangement, the shape of the side walls 212 on both sides of the first backing block 210 can also be flexibly selected according to needs. Please refer to FIGS. 8 to 10, the side walls 212 on both sides of the first backing block 210 It can be set but not limited to an inclined plane (as shown in Fig. 8), a vertical plane arranged in a vertical direction (as shown in Fig. 9) or an inclined arc surface (as shown in Fig. 10) .

Further, the outer array element 120 is usually arranged on both sides of the inner array element 110, which can be used to protect the inner array element 110. In order to lead out the positive electrode of the inner element 110, in one embodiment, at least the positive electrode of the inner element 110 is connected to the positive connection point on the positive mating portion 310, and at least the negative electrode of the inner element 110 is connected to the flexible circuit through the negative lead structure 400 The negative connection point of the board 300 is electrically connected.

In order to realize the extraction of the negative electrode of the inner element 110 (or all the elements), please refer to FIGS. 3 to 5. In one embodiment, the negative electrode extraction structure 400 has at least a main body 410 that can be electrically connected to all the inner elements 110 and At least one negative electrode lead-out portion 420 protruding and extending outward from the main body 410. The negative electrode lead-out portion 420 is drawn from the position of the outer array element 120, and the negative electrode docking portion 330 is provided corresponding to the negative electrode lead-out portion 420, and is also drawn from the position of the outer array element 120.

In this structure, the negative electrode lead-out portion 420 is only drawn from the outer element 120 on one or both sides, and there is no need to provide the negative electrode lead-out portion 420 in too many positions, which can reduce the overall volume of the acoustic head and is also beneficial to the wafer 100 and the back. The consistency of the outer structure of the lining 200 and the matching layer 500.

The negative mating portion 330 is also arranged at the position of the outer array element 120, which can prevent the flexible circuit board 300 from disposing too many negative mating portions 330, and can also cleverly use the space of the outer array element 120 to connect the flexible circuit board 300 The related circuit is arranged below the outer array element 120 so as to be connected to the negative lead portion 420. Without changing the size of the wafer 100, the volume of the entire acoustic head can be further reduced.

In addition, referring to FIGS. 3 and 4, in one embodiment, the negative electrode butting portion 330 is bent downward from the positive electrode butting portion 310 to the side surface of the backing 200, and the negative electrode lead-out portion 420 is bent downward and covers the negative electrode butting portion On the outside of 330, the negative electrode lead part 420 and the negative electrode butting part 330 are welded.

Since the outer element 120 is not directly used for the emission and recovery of ultrasonic waves, the flexible circuit board 300 does not have to be connected to the positive electrode of the outer element 120. Therefore, in some embodiments, the negative electrode docking portion 330 may be located on the outer element 120. Bending downwards from the bottom of the, so that the negative connecting portion 330 does not protrude beyond the chip 100, or only slightly protrudes from the chip 100, further reducing the width of the acoustic head.

The negative lead-out structure 400 shown above may be made of copper foil or other materials capable of conducting electricity.

Of course, the negative lead-out structure 400 can also adopt other methods. For example, referring to FIGS. 7 and 11, in another embodiment, the negative lead-out structure 400 may also include the sidewalls disposed on the inner array element 110, the sidewalls of the backing 200, and the negative connection of the flexible circuit board 300. The conductive layer A of the part 330 is formed of a conductive material. The conductive layer A extends continuously from the negative electrode of the inner array element 110 through the sidewall of the backing 200 to the negative electrode connection point of the negative electrode docking part 330, so that the inner side The negative electrode of the array element 110 is electrically connected to the negative electrode connection point.

This structure omits the traditional copper foil, and the flexible circuit board 300 directly uses the conductive layer A to electrically connect with the negative electrode of the inner array element 110, which can reduce the overall structure of the acoustic head, and at the same time is beneficial to the wafer 100, the backing 200 and the matching layer 5. 00 External shape, especially the consistency of the side walls.

The upper surface of the inner element 110 is a negative electrode, and the lower surface is a positive electrode. Since the conductive layer A is provided on the side wall of the inner element 110, the positive electrode and the negative electrode of the inner element 110 may be connected. In order to eliminate this hidden danger, in one embodiment, as shown in FIG. 12, the lower surface of the inner element 110 has a partition groove 101 to separate the conductive layer A on the sidewall of the inner element 110 from the positive electrode. Each inner array element 110 may be provided with a conductive layer A on the sidewalls of one or both ends, and the isolation groove 101 is provided corresponding to the conductive layer A. As shown in Figures 11 and 12, in an embodiment, the inner array element 110 is provided with a conductive layer A at both ends of the side wall, so as to enhance the conductive layer A's effect on the negative electrode of the array element, and avoid the occurrence of a certain section of the conductive layer. A has an open circuit and cannot lead out the negative electrode of the inner element 110. At this time, the partition groove 101 can separate the middle part and the end part of the inner element 110 to avoid short circuit of the positive electrode and the negative electrode. When the conductive layer A is provided on the side wall of only one end of the inner array element 110, the isolation groove 101 may be provided only on this end.

As for the outer array element 120, generally, the conductive layer A may not be provided on the sidewall thereof, which does not affect the lead-out of the negative electrode of the inner array element 110. Of course, in some embodiments, corresponding conductive layers A may also be provided on both ends of the outer array element 120. In order to facilitate the overall processing, the partition groove 101 may be processed together for the entire wafer 100. At this time, the partition groove 101 may also be provided on the outer array element 120.

Of course, referring to FIG. 11, in an embodiment, the side wall of the outer array element 120 also has a conductive layer A, and the conductive layer A of the outer array element 120 is electrically connected to the conductive layer A of the inner array element 110. At this time, the conductive layer A connects the positive electrode and the negative electrode of the outer array element 120, and the flexible circuit board 300 is electrically connected to the positive electrode of the outer array element 120. That is, through the outer element 120, the negative electrode of the inner element 110 can be connected to the flexible circuit board 300, so as to enhance the effect of drawing out the negative electrode of the inner element 110.

Furthermore, usually the wafer 100 is cut after being placed on the backing 200 and the flexible circuit board 300. As shown in FIGS. 4 and 5, when the wafer 100 is cut, the matching layer 500 and the positive electrode of the flexible circuit board 300 are also butt-connected. The part 310 and the backing 200 are cut, and the matching layer 500 may be cut into the same shape and structure as the wafer 100. The positive connecting portion 310 of the flexible circuit board 300 will also be cut into a strip structure consistent with the chip 100, and the positive connection point is located on the strip structure. The backing 200 serves as a supporting structure, and the top surface of the backing 200 has a cutting groove. In order to prevent the cutting groove from separating the conductive layer A, in one embodiment, the lowermost edge of the conductive layer A on the sidewall of the backing 200 is lower than the lowermost edge of the cutting groove, so that the conductive layer A is always in a via state .

Generally, the conductive layer A shown above can be made of various conductive materials, but in order to ensure reliable conduction, preferably, the conductive layer A can be made of a relatively soft, oxidation-resistant metal, such as gold plating. After the conductive layer A is plated, the acoustic head needs to be cut, so as to ensure that the conductive layer A is not easy to fall off and collapse during cutting. In an embodiment, the conductive layer A is a gold-plated layer.

On the other hand, this embodiment also provides an ultrasonic probe, which includes the acoustic head as shown in any of the foregoing embodiments. Please refer to FIGS. 3 to 7, the ultrasound probe further includes a base 600, and the backing 200 is installed on the base 600 and assembled to other components through the base 600.

Of course, the ultrasound probe also includes components such as a housing, a control unit for controlling the array elements, and the like. These structures can be implemented with reference to existing structures, and this embodiment will not repeat them one by one.

The above uses specific examples to illustrate the application, which are only used to help understand the application, and are not used to limit the application. For those of ordinary skill in the art, according to the idea of the present application, the above-mentioned specific implementation manners can be changed.

Claims

An acoustic head of an ultrasonic probe, which is characterized in that it comprises:

A wafer, the wafer is cut into a number of array elements;

Backing

A flexible circuit board comprising a first part and a second part, the first part is mounted on the top of the backing, and the second part is embedded in the back from the top wall of the top of the backing. And extend from the backing; wherein the part of the first part at the top of the backing is in contact with each of the plurality of array elements; the first part has a negative butt joint and a positive butt joint Part, the second part has at least one adapter part;

The positive connection part has a positive connection point, the negative connection part has a negative connection point, the adapter part has a connection point for connecting with the control unit of the ultrasonic probe, and the positive connection point and the negative connection point are both Electrically connected to the transition point; the array element is located above the positive electrode butting portion, and the positive electrode of the array element is electrically connected to the positive electrode connection point on the positive electrode butting portion;

A negative electrode lead-out structure, which connects the negative electrode of the array element with the negative electrode connection point of the negative electrode butting portion;

And a matching layer, the matching layer covering the negative electrode lead structure.
The acoustic head of claim 1, wherein the backing comprises at least three backing blocks, which are a first backing block, a second backing block, and a third backing block, respectively, and the first backing block A backing block, a second backing block, and a third backing block are joined together to form a support platform. The second backing block and the third backing block are located on both sides of the first backing block, and the flexible circuit board has At least two adapter parts, which are respectively a first adapter part and a second adapter part, the positive mating part is located on the top wall of the first backing block, and the first adapter part is separated from the first backing block The gap between the block and the second backing block protrudes out of the backing, and the second transition part protrudes out of the backing from the gap between the first backing block and the third backing block.
3. The acoustic head according to claim 2, wherein the side walls on both sides of the first backing block are symmetrically arranged with respect to the top wall.
The acoustic head according to claim 3, wherein the side walls on both sides of the first backing block are inclined planes, vertical planes arranged in a vertical direction, or inclined arc surfaces.
3. The acoustic head of claim 2, wherein the second backing block and the third backing block have side walls that can be attached to the first backing block.
3. The acoustic head according to claim 1, wherein the top wall of the backing block is flush and spliced into a flat support platform.
The acoustic head according to claim 1, wherein the array element includes an outer array element located on the outer sides of both sides and an inner array element located between the outer array elements, and at least the positive electrode of the inner array element and the positive electrode butting portion The positive pole connection point on the upper side is connected, and at least the negative pole of the inner array element is electrically connected to the negative pole connection point of the flexible circuit board through the negative lead-out structure.
The acoustic head according to claim 7, wherein the negative lead-out structure has a main body that can be electrically connected to at least all inner array elements, and at least one negative lead-out portion protruding outward from the main body, and the negative lead The portion is led out from the position of the outer array element, the negative electrode butting portion is provided corresponding to the negative electrode lead-out portion, and the negative electrode connection point of the negative electrode butting portion is electrically connected to the negative electrode lead-out portion.
The acoustic head according to claim 8, wherein the negative electrode butting portion is bent downward from the positive electrode butting portion to the side surface of the backing, and the negative electrode lead-out portion is bent downward and covers the negative electrode butting portion. On the outside of the part, the negative electrode lead part is welded to the negative electrode butting part.
9. The acoustic head according to claim 8 or 9, wherein the negative lead-out structure is copper foil.
7. The acoustic head according to claim 7, wherein the negative lead-out structure comprises a conductive layer disposed on the side wall of the inner array element, the side wall of the backing, and the negative connecting portion of the flexible circuit board, and The conductive layer is formed of a conductive material, and the conductive layer extends continuously from the negative electrode of the inner array element through the backing side wall to the negative electrode connection point of the negative electrode butting part, so that the negative electrode of the inner array element is connected to the negative electrode of the negative electrode. The negative connection point is electrically connected.
The acoustic head according to claim 11, wherein the inner vibrating element has a partition groove on the lower surface thereof to separate the conductive layer on the side wall of the inner vibrating element from the positive electrode.
The acoustic head of claim 11, wherein the side wall of the outer element has a conductive layer, the conductive layer of the outer element is electrically connected to the conductive layer of the inner element, and the conductive layer connects the conductive layer to the conductive layer of the inner element. The positive and negative electrodes of the outer array element are connected, and the flexible circuit board is electrically connected to the positive electrode of the outer array element.
The acoustic head according to claim 11, wherein the backing has a cutting groove, and the lowermost edge of the conductive layer on the sidewall of the backing is lower than the lowermost edge of the cutting groove.
The acoustic head according to claim 11, wherein the conductive layer is a gold-plated layer.
7. The acoustic head according to claim 7, wherein the wafer is octagonal, the array element is strip-shaped, and the inner array element is arranged side by side between two outer array elements.
An acoustic head of an ultrasonic probe, which is characterized in that it comprises:

A wafer, the wafer is cut into a number of array elements;

Backing, the backing includes at least two backing blocks, and the backing blocks are joined together to form a support platform;

A flexible circuit board, the flexible circuit board having a negative butting portion, a positive butting portion and at least one transition portion, the positive butting portion has a positive connection point, the negative butting portion has a negative connection point, and the transition portion has The connecting point for connecting with the control unit of the ultrasound probe, the positive connection point and the negative connection point are electrically connected to the switching point, the positive connection part is installed on the supporting table, and the array element is located at the Above the positive electrode butting portion, and the positive electrode of the array element is electrically connected to the positive electrode connection point on the positive electrode butting portion, and the transition portion extends from the gap between the adjacent backing blocks to the outside of the backing;

A negative electrode lead-out structure, which connects the negative electrode of the array element and the negative electrode connection point;

And a matching layer, which covers the negative electrode lead structure.
An ultrasonic probe, characterized by comprising the acoustic head and a base according to any one of claims 1-17, and the acoustic head is mounted on the base through a backing.