CN117289408A - Optical module - Google Patents

Abstract

In the optical module provided by the application, the end part of the optical receiving and transmitting cavity is provided with the opening, and one end of the circuit board extends into the inner cavity of the optical receiving and transmitting cavity from the opening; the light emitting device, the light receiving device and the optical component are arranged in the inner cavity of the light receiving and transmitting cavity, and the optical component comprises a displacement prism and a reflecting prism. The light emitting device comprises a light emitting chip, the light receiving device comprises a light receiving chip, and the difference between the height of the photosensitive surface of the light receiving chip and the height of the light emitting optical axis of the light emitting chip is less than 1mm. The displacement prism is arranged on a transmission light path of the optical signal to be received by the optical receiving chip and is used for adjusting the transmission height of the optical signal; the reflecting surface of the reflecting prism is arranged above the light receiving chip and is used for reflecting the light signal to be received to the light receiving chip. Furthermore, in the optical module provided by the application, when the height of the photosensitive surface of the optical receiving chip in the optical transceiver cavity is smaller than the height difference of the light-emitting optical axis of the optical emitting chip, the optical receiving chip can also normally receive optical signals.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology. Meanwhile, along with the development of the optical module, the internal structure of the optical module is more and more abundant, so that the optical module is more convenient to use and generate.

Disclosure of Invention

The embodiment of the application provides an optical module, so as to provide an optical module with a novel structure, when the height of a photosensitive surface of an optical receiving chip positioned in the same cavity is smaller than the height phase difference of an optical axis of light emitted by an optical emitting chip, the optical receiving chip can also normally receive optical signals.

The application provides an optical module, include:

a circuit board;

the optical transceiver component is used for generating optical signals and receiving the optical signals from the outside of the optical module;

the optical fiber assembly is optically connected with the optical port of the optical module and the optical transceiver assembly;

wherein, the optical transceiver module includes:

the optical transceiver comprises an optical transceiver cavity, wherein one end of the optical transceiver cavity is provided with an adapter mounting hole, the optical fiber assembly is connected through the adapter mounting hole, the other end of the optical transceiver cavity is provided with an opening, the opening is communicated with an inner cavity of the optical transceiver cavity, and one end of the circuit board extends into the inner cavity through the opening; a baffle plate is arranged in the inner cavity along the length direction of the optical transceiver cavity, the inner cavity is divided into a first inner cavity and a second inner cavity along the width direction of the optical transceiver cavity by the baffle plate, a through hole is arranged on the baffle plate, and the through hole is communicated with the second inner cavity and the second inner cavity;

The light emitting device is arranged on the bottom plate of the first inner cavity and is electrically connected with the circuit board and comprises a light emitting chip;

the light receiving device is arranged on the top surface of the circuit board extending into the inner cavity and is positioned in the second inner cavity, is electrically connected with the circuit board and comprises a light receiving chip, and the difference between the height of the light sensitive surface of the light receiving chip and the height of the light emitting optical axis of the light emitting chip is less than 1mm;

the optical component is arranged in the inner cavity of the optical receiving and transmitting cavity and comprises a displacement prism and a reflecting prism; the displacement prism is arranged on a transmission light path of the optical signal to be received by the optical receiving chip and is used for adjusting the transmission height of the optical signal transmission light path in the optical receiving and transmitting cavity; the reflecting prism is positioned on the reflecting surface of the light receiving chip and is positioned above the light receiving chip and used for reflecting the light signal to be received to the light receiving chip.

The optical module comprises an opening at the end part of an optical receiving and transmitting cavity, and one end of a circuit board extends into the inner cavity of the optical receiving and transmitting cavity from the opening; the partition board is arranged in the optical transceiver cavity, and the inner cavity of the optical transceiver cavity is divided into a first inner cavity and a second inner cavity along the width direction of the optical transceiver cavity. The light emitting device is arranged on the bottom plate of the first inner cavity, the light receiving device is arranged on the top surface of the circuit board extending into the inner cavity and is positioned in the second inner cavity, and the optical component is arranged in the inner cavity of the light receiving and transmitting cavity, wherein the optical component comprises a displacement prism and a reflecting prism. The light emitting device comprises a light emitting chip, the light receiving device comprises a light receiving chip, and the difference between the height of the photosensitive surface of the light receiving chip and the height of the light emitting optical axis of the light emitting chip is less than 1mm. In the optical module provided by the application, the displacement prism is arranged on a transmission light path of an optical signal to be received by the optical receiving chip and is used for adjusting the transmission height of the optical signal; the reflecting surface of the reflecting prism is arranged above the light receiving chip and is used for reflecting the light signal to be received to the light receiving chip. Furthermore, in the optical module provided by the application, an optical module with a novel structure is provided, and the optical receiving chip can normally receive optical signals when the height of the photosensitive surface of the optical receiving chip in the optical receiving and transmitting cavity is smaller than the height difference of the light emitting optical axis of the optical emitting chip.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system provided according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

fig. 3 is a schematic structural diagram of an optical module provided according to some embodiments;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments;

fig. 5 is a schematic diagram of an internal structure of an optical module provided according to some embodiments;

FIG. 6 is an exploded view of an optical transceiver cavity and a circuit board according to some embodiments;

fig. 7 is a schematic structural view of an optical transceiver module with an open cover provided in accordance with some embodiments;

Fig. 8 is an exploded view of a light receiving device and a circuit board according to some embodiments;

FIG. 9 is a schematic structural view of a cover plate provided according to some embodiments;

fig. 10 is a schematic view of a first embodiment of a cartridge;

FIG. 11 is a schematic diagram of an optical transceiver according to some embodiments;

fig. 12 is a schematic diagram ii of a cartridge according to some embodiments;

fig. 13 is a cross-sectional view of a cartridge provided in accordance with some embodiments;

fig. 14 is a cross-sectional view two of a cartridge provided in accordance with some embodiments;

FIG. 15 is a state of use diagram provided in accordance with some embodiments;

fig. 16 is a cross-sectional view one of a use condition of a cartridge provided in accordance with some embodiments;

fig. 17 is a second cross-sectional view of a use state of a cartridge provided in accordance with some embodiments;

fig. 18 is a top view of a cartridge provided in accordance with some embodiments;

fig. 19 is a top view of a use state of a cartridge provided according to some embodiments;

fig. 20 is a third cross-sectional view of a use state of the cartridge provided in accordance with some embodiments;

fig. 21 is a cross-sectional view fourth of a use condition of the cartridge provided in accordance with some embodiments;

Fig. 22 is a second exploded view of a light receiving device and a circuit board according to some embodiments;

fig. 23 is an exploded view of a light receiving device and a circuit board according to some embodiments.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In an optical communication system, an optical signal is used to carry information to be transmitted, and the optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since light has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost, low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and the electric connection is mainly used for power supply, I2C signal transmission, data information transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-range signal transmission, such as several kilometers (6 kilometers to 8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to achieve unlimited distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing apparatus 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port configured to access the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that an information connection is established between the optical fiber 101 and the optical network terminal 100. Illustratively, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101. Since the optical module 200 is a tool for implementing the mutual conversion between the optical signal and the electrical signal, it has no function of processing data, and the information is not changed during the above-mentioned photoelectric conversion process.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. Illustratively, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits an electrical signal from the network cable 103 to the optical module 200, so that the optical network terminal 100, as a host computer of the optical module 200, can monitor the operation of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal, and fig. 2 shows only the configuration of the optical network terminal 100 related to the optical module 200 in order to clearly show the connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 and the optical network terminal 100 propose a bi-directional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module provided according to some embodiments, and fig. 4 is an exploded schematic diagram of an optical module provided according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, and an optical transceiver 209.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being covered on the lower housing 202 to form the above-mentioned housing having two openings; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed at both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction in which the two openings 204 and 205 are connected may be the same as the longitudinal direction of the optical module 200 or may be different from the longitudinal direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out from the electrical port 204 and is inserted into an upper computer (for example, the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 such that the external optical fiber 101 connects to an optical transceiver component 209 within the optical module 200.

The circuit board 300, the optical transceiver 209 and other devices are conveniently installed in the upper shell 201 and the lower shell 202 in a combined assembly mode, and the upper shell 201 and the lower shell 202 form packaging protection for the devices. In addition, when devices such as the circuit board 300 and the optical transceiver 209 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are convenient to deploy, and the automatic production implementation is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located outside the housing thereof, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates 2022 of the lower housing 202, with a snap-in member that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a limiting amplifier (limiting amplifier), a clock data recovery (Clock and Data Recovery, CDR) chip, a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, a flexible circuit board may be used to connect the hard circuit board and the optical transceiver.

In the embodiment of the present application, the optical transceiver 209 is configured to generate an optical signal and receive an optical signal from outside the optical module, so as to implement optical signal transmission and optical signal reception of the optical module. In the optical module provided in some embodiments of the present application, to facilitate optical signal transmission inside the optical module, the optical module further includes an optical fiber assembly, where the optical fiber assembly includes an optical fiber adapter 206, an optical fiber 207, and a pigtail adapter 208, one end of the optical fiber 207 is connected to the optical fiber adapter 206, the other end of the optical fiber 207 is connected to one end of the pigtail adapter 208, and the pigtail adapter 208 is optically connected to the optical transceiver component 209. Thus, the optical signal generated by the optical transceiver 209 is transmitted to the optical fiber 207 through the pigtail adapter 208, to the optical fiber adapter 206 through the optical fiber 207, and finally to the external optical fiber through the optical fiber adapter 206; optical signals from external optical fibers are transmitted through fiber optic adapter 206 to optical fiber 207, through optical fiber 207 to pigtail adapter 208, and finally through pigtail adapter 208 to optical transceiver component 209. In the embodiment of the present application, the height of the optical fibers in the pigtail adapter 208 is flush with the height of the top surface of the circuit board 300, so that the optical signals can enter and exit the optical transceiver 209 through the pigtail adapter 208.

Fig. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments, and fig. 6 is an exploded schematic diagram of an optical transceiver and a circuit board according to some embodiments. As shown in fig. 5 and 6, in some embodiments, the optical transceiver component 209 includes an optical transceiver cavity for housing a light emitting device for generating an optical signal, a light receiving device for receiving an optical signal, and an optical component for transmitting an optical signal; the end of the optical transceiver cavity is provided with an opening, and one end of the circuit board 300 extends into the inner cavity of the optical transceiver cavity through the opening; the surface of the circuit board 300 that protrudes into the interior cavity of the optical transceiver cavity is used to carry and electrically connect the light emitting device and the light receiving device. Illustratively, the optical transceiver assembly includes a package 400 and a cover 500, the cover 500 covering the package 400 to form a package cavity; the end of the cartridge 400 is provided with an opening 410.

In some embodiments, the circuit board 300 is provided with a mounting hole 310, the mounting hole 310 is a notch formed at one end of the circuit board 300, and two sides or three sides of the mounting hole 310 are respectively the circuit boards. Illustratively, as shown in fig. 6, the assembly holes 310 each have a circuit board on three sides; specific: the circuit board 300 forms a first clamping area 320, a second clamping area 330 and an extending area 340 at the edge of the assembly hole 310, and the first clamping area 320, the extending area 340 and the second clamping area 330 are sequentially connected around the assembly hole 310; the first clamping area 320 and the second clamping area 330 are located at two opposite sides of the assembly hole 310 and are used for clamping the outer side wall of the optical transceiver cavity; the protruding region 340 is configured to protrude into the optical transceiver cavity. Of course, in the embodiment of the present application, two sides of the assembly hole 310 are provided with a circuit board, and then the assembly hole 310 is located at a side of the circuit board 300, for example, the left side of the assembly hole 310 has no first clamping area 320 or the right side of the assembly hole 310 has no second clamping area 330.

In this application embodiment, set up the baffle in the light receiving and transmitting cavity, the baffle is used for separating the inner chamber of light receiving and transmitting cavity into first inner chamber and second inner chamber along the length direction of light receiving and transmitting cavity, light emitting device sets up in first inner chamber, light receiving device sets up in the second inner chamber, and then the light signal that light emitting device produced transmits in first inner chamber, light receiving device waits to receive light signal transmission in the second inner chamber, effectively realize the isolation of reflection light signal and received light signal, avoid producing between reflection light signal and the received light signal and cross talk in order to influence the quality of light receiving device received light signal.

Fig. 7 is a schematic structural diagram of an optical transceiver module with an open cover according to some embodiments, and fig. 8 is an exploded schematic diagram of a light receiving device and a circuit board according to some embodiments. As shown in fig. 7 and 8, in some embodiments, a septum 420 is disposed inside the cartridge 400, the septum 420 being disposed along the length of the cartridge 400, thereby separating the interior cavity of the cartridge 400 into a first interior cavity 430 and a second interior cavity 440 along the length of the cartridge 400. The light emitting device 600 is disposed in the first cavity 430, and the light receiving device 700 is disposed in the second cavity 440.

In some embodiments of the present application, the light emitting device 600 includes an optical emission chip, a TEC, etc. and the electrical devices in the light emitting device 600 are electrically connected to the circuit board 300. The electrical components in the light emitting device 600 may be directly disposed on the bottom plate of the package 400, and connected to the circuit board 300 through wire bonding; alternatively, the electrical components or portions of the electrical components in the light emitting device 600 are disposed on the surface of the circuit board 300 that extends into the interior cavity of the package 400.

In some embodiments of the present application, the light receiving device 700 includes an optical receiving chip, a cross-foot amplifier, and the like, and the electrical devices in the light receiving device 700 are electrically connected to the circuit board 300. The electrical components in the light receiving device 700 may be directly disposed on the surface of the circuit board 300 protruding into the cavity of the package 400 or the electrical components or portions of the electrical components in the light receiving device 700 may be disposed on the bottom plate of the package 400.

To facilitate the transmission of the optical signal generated by the light emitting device 600 and the transmission of the optical signal to be received by the light receiving device 700, the optical assembly 800 is disposed in the package 400, and the optical assembly 800 includes a lens, a reflecting mirror, a filter, and the like; wherein a portion of the devices in the optical assembly 800 are disposed in the first interior cavity 430 and another portion of the devices in the optical assembly 800 are disposed in the second interior cavity 440.

In this embodiment, an adapter mounting hole is disposed on a side wall of the package 400, the adapter mounting hole is communicated with an inner cavity of the package 400, and the pigtail adapter 208 is disposed in the adapter mounting hole to establish an optical connection with the optical fiber 207 in the package 400. Illustratively, the adapter mounting bore communicates with the first interior cavity 430. Of course, in the embodiment of the present application, the adapter mounting hole may be disposed on one side of the second inner cavity 440, so that the adapter mounting hole communicates with the second inner cavity 440.

Fig. 9 is a schematic structural view of a cover plate according to some embodiments. As shown in fig. 9, in some embodiments, the cover plate 500 includes a top plate 510 and a fourth side plate 520, one end of the fourth side plate 520 is connected to the other end of the top plate 510, and the top plate 510 and the fourth side plate 520 form a bent structure.

Fig. 10 is a schematic view of a cartridge according to some embodiments. As shown in fig. 10, in some embodiments, the package 400 includes a bottom plate 450, a first side plate 460, a second side plate 470, and a third side plate 480, the first side plate 460, the second side plate 470, and the third side plate 480 are surrounded by edges of the bottom plate 450, and the first side plate 460, the second side plate 470, and the third side plate 480 are sequentially connected. The second side plate 470 is connected to one end of the bottom plate 450, the first side plate 460 and the third side plate 480 are connected to opposite sides of the bottom plate 450, and the bottom plate 450, the first side plate 460, the second side plate 470 and the third side plate 480 form a shell structure without a cover and without a side wall at the other end.

In some embodiments, as shown in fig. 10, an adapter mounting hole 431 is provided on the second side plate 470, the adapter mounting hole 431 communicates with the first interior cavity 430, and the pigtail adapter 208 is disposed within the adapter mounting hole 431.

In some embodiments, one end of the partition 420 is connected to the inner wall of the second side plate 470, the bottom of the partition 420 is connected to the bottom plate, and the extending direction of the partition 420 is parallel to the extending direction of the first side plate 460. Illustratively, the diaphragm 420 is integrally formed with the housing 400.

In some embodiments, the other end of the first side plate 460 is provided with a first open slot 411, the other end of the third side plate 480 is provided with a second open slot 412, and the first open slot 411 and the second open slot 412 are used for embedding the fixed circuit board 300. The first open slot 411 and the second open slot 412 have the same height from the bottom plate 450, which facilitates the assembly and fixation of the circuit board 300 on the package 400.

In some embodiments of the present application, the cartridge 400 and the cover 500 may be assembled by glue bonding, or by press-welding. To facilitate the assembly and fixation of the package 400 and the cover plate 500, the top of the inner walls of the first side plate 460, the second side plate 470 and the third side plate 480 are provided with a first supporting surface 461, the first supporting surface 461 is lower than the top surfaces of the first side plate 460, the second side plate 470 and the third side plate 480, and the first supporting surface 461 is used for supporting the cover plate 500.

Further, in some embodiments of the present application, the top of the partition 420 is provided with a second supporting surface 422, and the second supporting surface 422 is flush with the first supporting surface 461, so that the second supporting surface 422 is used for supporting the cover plate 500.

Fig. 11 is a schematic structural diagram of an optical transceiver provided in accordance with some embodiments. As shown in fig. 11, the cover 500 covers the connection tube 400, the top plate 510 covers the top of the tube 400, the fourth side plate 520 is clamped between the first side plate 460 and the third side plate 480 and forms an opening 410 with the first opening slot 411 and the second opening slot 412 at the other end of the tube 400, and the cover 500 covers the connection tube 400 to form an optical transceiver cavity with the opening 410.

The optical module provided in this embodiment of the present application may be used in a relatively stable working environment such as a data center, and the optical transceiver 209 may adopt a non-airtight packaging structure, so that the circuit board 300 may extend into the package 400, so as to shorten the routing distance between the optical transmitting chip in the optical transmitting device 600 and the optical receiving chip in the optical receiving device 700 and the high-frequency signal line on the circuit board 300, so as to facilitate high-frequency signal transmission.

Therefore, in some embodiments of the present application, in order to ensure the assembly firmness of the circuit board 300 and the package 400, the circuit board 300 is generally fixedly connected to the package 400 by using glue, and in order to ensure the assembly firmness of the circuit board 300 and the package 400, the contact area between the circuit board 300 and the package 400 is generally increased, and in order to prevent the glue from adversely affecting the transceiver 209 in the embodiments of the present application, the contact area between the circuit board 300 and the package 400 needs to be controlled. In an example, a fixed supporting surface 413 is disposed in the opening 410, and the fixed supporting surface 413 supports the circuit board 300 and is connected to the bottom surface of the circuit board 300 through glue. In some examples, the height of the fixed support surface 413 on the package 400 is greater than the height of the top surface of the base plate 450 adjacent to the fixed support surface 413 to facilitate control of the contact area of the fixed support surface 413 with the circuit board 300.

Fig. 12 is a schematic structural view of a cartridge according to some embodiments, and fig. 13 is a cross-sectional view of a cartridge according to some embodiments. As shown in fig. 12 and 13, a first step surface 432 and a second step surface 433 are provided on the bottom plate 450 in the first inner cavity 430, the first step surface 432 and the second step surface 433 being for carrying a lens or the like; the difference in height between the first step surface 432 and the second step surface 433 facilitates the setting and control of the relative height of the lens and other devices in the first cavity 430. Of course, in some implementations of the present application, the floor 450 in the first interior cavity 430 is not limited to providing the first step surface 432 and the second step surface 433.

In some embodiments, a fifth step surface 436 is further disposed on the bottom plate 450 in the first cavity 430, the fifth step surface 436 is lower than the second step surface 433, and there is a height difference between the fifth step surface 436 and the second step surface 433, the fifth step surface 436 is located at one side of the fixed support surface 413 and is closer to the fixed support surface 413 than the second step surface 433, i.e., the fifth step surface 436 is located between the second step surface 433 and the fixed support surface 413. In this embodiment, the fifth step surface 436 is provided, so that the overflow glue is prevented from flowing to the second step surface 433 when the support surface 413 and the circuit board 300 are fixedly connected by glue, so as to affect the device provided on the second step surface 433.

Further, in some embodiments of the present application, a support stand or post is further disposed on the bottom plate 450 in the first cavity 430 to facilitate the fixation of the lens and other devices. As shown in fig. 12 and 13, for example, a first support table 434 and a second support table 435 are disposed on the first step surface 432, the first support table 434 is connected to the inner wall of the third side plate 480, the second support table 435 is connected to the partition 420, and a gap is disposed between the first support table 434 and the second support table 435, so as to facilitate transmission of the optical signal.

As shown in fig. 13, the bottommost surface of the adapter mounting hole 431 is lower than the first step surface 432, and then the adapter mounting hole 431 and the bottom plate 450 form a limiting step surface 451, and the limiting step surface 451 is used for assisting in positioning and mounting of the pigtail adapter 208, so that the precision of assembly positioning of the pigtail adapter 208 is conveniently ensured, and the optical coupling efficiency of the pigtail adapter 208 is conveniently ensured.

Fig. 14 is a cross-sectional view of a cartridge, second, provided in accordance with some embodiments. As shown in fig. 12 and 14, a third step surface 441 and a fourth step surface 442 are provided on the bottom plate 450 of the second cavity 440, and the third step surface 441 and the fourth step surface 442 are used for carrying a lens or the like; the third step surface 441 and the fourth step surface 442 have a height difference, so that the arrangement and control of the relative heights of the devices such as lenses in the second cavity 440 can be realized conveniently. Of course, in some implementations of the present application, the bottom plate 450 in the second cavity 440 is not limited to the third step surface 441 and the fourth step surface 442. Illustratively, the fourth step surface 442 is flush with the fifth step surface 436 to reduce the difficulty of processing the fourth step surface 442 and the fifth step surface 436 and to control the processing cost.

Further, in some embodiments of the present application, a support stand or post may also be provided on the bottom plate 450 of the second cavity 440 to facilitate the fixation of the mirror and the like. As shown in fig. 12 and 14, for example, a third support table 443 is provided on the third step surface 441.

Fig. 15 is a view of a use state provided in accordance with some embodiments, and fig. 16 is a cross-sectional view of a use state of a cartridge provided in accordance with some embodiments. As shown in fig. 15 and 16, the optical assembly 800 includes a first lens 810, a transflector 820, and an isolator 830; the first lens 810, the transflector 820 and the separator 830 are arranged on the first step surface 432, the first step surface 432 supports and connects the bottoms of the first lens 810, the transflector 820 and the separator 830, and the first lens 810, the transflector 820 and the separator 830 are arranged in sequence from left to right along the direction shown in fig. 15 and 16; the first support table 434 and the second support table 435 support the side to which the trans-mirror 820 is attached, and the trans-mirror 820 covers the gap between the first support table 434 and the second support table 435. For example, the lens 820 is disposed on the first step surface 432 in a 45 ° reflective manner, i.e., the normal line of the lens 820 forms an angle of 45 ° with the line of the first cavity 430 in the longitudinal direction.

As shown in fig. 15 and 16, in some embodiments, the light emitting device 600 includes a light emitting chip 610 and a TEC620, the TEC620 is disposed on the second step surface 433, the light emitting chip 610 is disposed on the TEC620, and the light emitting chip 610 and the TEC620 are wire-bonded to the circuit board 300. Illustratively, the surface edge of the circuit board 300 extending into the package 400 is provided with a plurality of bonding pads, and the light emitting chip 610 and the TEC620 are wire-bonded to the corresponding bonding pads. In some embodiments, the height of the top surface of the light emitting chip 610 is flush with the height of the circuit board 300 in order to control the length of the wire bond between the light emitting chip 610 and the circuit board 300.

The TEC620 is disposed on the second step surface 433, and since the optical transceiver 209 is non-airtight, the circuit board 300 can extend into the package 400 to be connected with the fixed support surface 413 through glue, and in order to prevent glue overflow between the fixed circuit board 300 and the fixed support surface 413 from flowing onto the second step surface 433, a fifth step surface 436 is disposed between the second step surface 433 and the fixed support surface 413. The fifth step surface 436 effectively prevents the overflow glue from flowing to the second step surface 433 when the support surface 413 and the circuit board 300 are fixedly connected by glue, so as to influence the service performance of the TEC 620.

The light emitting device 600 further includes a third lens 630, where the third lens 630 is disposed on the TEC620 and located on the light path of the light emitting chip 610 in the light emitting direction, and the third lens 630 is used for collimating the light signal emitted by the light emitting chip 610 and ensuring the coupling efficiency of the light signal.

The light emitting device 600 further includes a backlight detector 640, where the backlight detector 640 is disposed in a backlight direction of the light emitting chip 610, and the backlight detector 640 is configured to receive backlight of the light emitting chip 610 to assist in detecting light power emitted by the light emitting chip 610. Illustratively, the backlight detector 640 is mounted on the circuit board 300 extending into the package 400.

Fig. 17 is a second cross-sectional view of a use state of a cartridge provided in accordance with some embodiments. As shown in fig. 15 and 17, the light receiving device 700 includes a light receiving chip 710 and a transimpedance amplifier 720; the light receiving chip 710 and the transimpedance amplifier 720 are mounted on the edge of the circuit board 300 extending into the package 400; the light receiving chip 710 is wire-bonded to the transimpedance amplifier 720. The light receiving chip 710 and the transimpedance amplifier 720 are mounted on the circuit board 300 so as to ensure high-frequency signal transmission performance of the light receiving chip 710 and the transimpedance amplifier 720.

In this embodiment, when the height of the optical fiber in the pigtail adapter 208 is flush with the height of the top surface of the circuit board 300, since the height of the top surface of the light emitting chip 610 is flush with the height of the circuit board 300 and the light receiving chip 710 is mounted on the circuit board 300, the difference between the height of the light emitting axis of the light emitting chip 610 and the height of the light sensitive surface of the light receiving chip 710 receiving light will be less than 1mm, or even less than 0.2mm. Therefore, in order to ensure that the optical receiving chip 710 can normally receive the optical signal, the transmission height of the optical signal inputted through the pigtail adapter 208 needs to be adjusted in the package 400 so as to be able to conveniently convert the optical signal from the horizontal direction transmission to the vertical direction transmission.

As shown in fig. 15 and 17, the optical assembly 800 further includes a mirror 850, a displacement prism 860, a second lens 870, and a reflection prism 880; the reflecting mirror 850, the displacement prism 860, the second lens 870, and the reflecting prism 880 are sequentially disposed on the receiving light path of the light receiving device 700. The mirror 850 and the displacement prism 860 are disposed on the third step surface 441, and the second lens 870 and the reflection prism 880 are disposed on the fourth step surface 442; the reflective prism 880 is located above the light receiving chip 710, i.e., a projection of the reflective prism 880 in the direction of the light receiving chip 710 covers the light receiving chip 710. The reflector 850 is used for reflecting the optical signal to be received by the optical receiving chip 710 to change the main optical axis transmission direction of the optical signal on a plane parallel to the bottom plate 450; the displacement prism 860 is used for adjusting the distance between the transmission direction of the main optical axis of the optical signal to be received and the bottom plate 450; the second lens 870 is configured to collect an optical signal to be received; the reflective prism 880 is used to convert the transmission direction of the main optical axis of the optical signal to be received from parallel to the base plate 450 to perpendicular to the base plate 450. Since the receiving optical axis of the light receiving chip 710 is perpendicular to the base plate 450, and the optical signal transmitted into the package 400 through the pigtail adapter 208 is parallel to the base plate 450, it is necessary to convert the transmission direction of the signal from parallel to the base plate 450 to perpendicular to the base plate 450 before the signal is transmitted to the light receiving chip 710; meanwhile, in the course of adjusting the light path transmission height, in order to ensure the realizability of the light path transmission height adjustment and facilitate the assembly of devices, a combination of a reflecting mirror 850, a displacement prism 860 and a reflecting prism 880 is employed.

In some embodiments of the present application, third support 443 supports mirror 850. For example, the mirror 850 is disposed on the third step surface 441 in a 45 ° reflective manner, that is, the normal line of the mirror 850 forms an angle of 45 ° with the line of the second cavity 440 in the longitudinal direction.

In some embodiments of the present application, a first supporting member 453 is further disposed in the second inner cavity 440, the first supporting member 453 is disposed on the fourth step surface 442, and the reflective prism 880 is disposed on the first supporting member 453, for example, the reflective prism 880 is connected to the top of the reflective prism 880. By disposing the reflection prism 880 on the first support 453, it is convenient to realize that the reflection prism 880 is disposed above the light receiving chip 710. Further, the second lens 870 is disposed on the first supporting member 453, so that the relative position between the optical axis of the second lens 870 and the reflective surface of the reflective prism 880 is facilitated, and the converged optical signal to be received is conveniently transmitted to the reflective surface of the reflective prism 880 with high coupling ratio.

In some embodiments of the present application, a second supporting member 452 is further disposed in the second inner cavity 440, the second supporting member 452 is disposed on the third step surface 441, and the displacement prism 860 is disposed on the second supporting member 452. By providing the displacement prism 860 on the second support 452, assembly of the displacement prism 860 in the cartridge 400 is facilitated. The second supporting member 452 is provided with a light-passing hole 4521, and the displacement prism 860 is arranged at one side of the light-passing hole 4521, so that the light signal to be received passing through the light-passing hole 4521 can be transmitted to the displacement prism 860 or the light signal to be received passing through the displacement prism 860 can be transmitted through the light-passing hole 4521. By providing the light passing hole 4521 in the second support 452, the second support 452 having a relatively large volume can be selected without affecting the transmission of the light signal to be received in the second inner cavity 440, thereby facilitating the assembly of the displacement prism 860 on the second support 452 and the assembly of the second support 452 in the second inner cavity 440. As shown in fig. 17, the cross section of the displacement prism 860 is a diamond, the displacement prism 860 is located at one end of the light-passing hole 4521 away from the reflector 850, and the second supporting member 452 is disposed at the edge of the third step surface 441, so that the displacement prism 860 is located above the fourth step surface 442, and thus the height difference between the third step surface 441 and the fourth step surface 442 can be fully utilized, so that the displacement prism 860 is conveniently disposed in the second inner cavity 440.

In some embodiments of the present application, the light-transmitting hole 4521 is disposed near one end of the reflector 850, and the second filter 890 is used for filtering, so as to improve the quality of the optical signal received by the optical receiving chip 710.

In some embodiments of the present application, the optical assembly 800 further includes a first filter 840; the side surfaces of the partition 420 support the first optical filter 840 such that the first optical filter 840 covers the through holes 421 in a direction perpendicular to the side surfaces of the partition 420. The first optical filter 840 is used for filtering light with a wavelength other than the light signal to be received, and further the coverage of the first optical filter 840 on the through hole 421 can effectively reduce the light signal generated by the light emitting chip 610 from entering the second inner cavity 440. For example, as shown in fig. 17, the first filter 840 is located in the second cavity 440, but the first filter 840 may also be disposed in the first cavity 430.

Fig. 18 is a top view of a cartridge provided in accordance with some embodiments. As shown in fig. 18, in some embodiments, the first supporting table 434 is connected to the inner wall of the third side plate 480, and the first supporting table 434 is connected to the third side plate 480, so as to effectively control the processing procedure of the first supporting table 434, for example, reduce the side surface of the first supporting table 434 to be processed, thereby facilitating the reduction of the processing difficulty of the first supporting table 434; the first fixing surface 4341 is disposed on a side of the first support table 434, and the first fixing surface 4341 supports a side surface connected to the transflector 820. In order to facilitate the first fixing surface 4341 to support and connect the side surface of the lens-reflector 820, the first support table 434 is further provided with a first arc transition surface 4342, and the first arc transition surface 4342 connects the first fixing surface 4341 and the inner wall of the third side plate 480, so that the assembly accuracy of the lens-reflector 820 on the first fixing surface 4341 is effectively prevented from being affected due to chamfering during the processing of the first fixing surface 4341.

In some embodiments, a third arc transition surface 4343 is further disposed on the first support table 434, the third arc transition surface 4343 is disposed on a side of the first support table 434 away from the first arc transition surface 4342, and the third arc transition surface 4343 is connected to an inner wall of the third side plate 480. The third arc transition surface 4343 provided on the first support table 434 further facilitates processing of the first support table 434 while also enabling effective avoidance of the isolator 830.

In some embodiments, a second support 435 is attached to a side of the partition 420. The connection of the second support 435 to the spacer 420 can effectively control the processing procedure for processing the second support 435, such as reducing the required processing side of the second support 435, thereby reducing the processing difficulty of the second support 435. The second fixing surface 4351 is disposed on the side of the second support 435, the second fixing surface 4351 supports the side surface connected to the transflector 820, and the second fixing surface 4351 and the first fixing surface 4341 support the transflector 820 together, so as to firmly fix the transflector 820. In order to facilitate the second fixing surface 4351 to support and connect the side surface of the lens-reflector 820, the second support table 435 is further provided with a second arc transition surface 4352, and the second arc transition surface 4352 connects the second fixing surface 4351 and the side surface of the partition 420, so that the influence of chamfering during the processing of the second fixing surface 4351 on the assembly precision of the lens-reflector 820 on the second fixing surface 4351 is effectively avoided.

In some embodiments, one side of the third supporting table 443 is connected to the side surface of the partition 420, and the other side is connected to the inner wall of the first side plate 460, so as to effectively control the processing procedure of the third supporting table 443, for example, reduce the processing difficulty of the third supporting table 443 by reducing the required processing side surface of the third supporting table 443. The third fixing surface 4431 is provided on a side of the third supporting base 443, and the third fixing surface 4431 supports the connection mirror 850.

In order to facilitate the third fixing surface 4431 to support and connect the reflector 850, the third supporting table 443 is further provided with a second arc transition surface 4352, and the second arc transition surface 4352 connects the side surface of the partition 420 with the third fixing surface 4431, so that the influence of chamfering on the side close to the partition 420 on the accuracy of the reflector 850 on the third fixing surface 4431 during the processing of the third fixing surface 4431 is effectively avoided. Further, the third supporting table 443 is further provided with a fourth arc transition surface, and the fourth arc transition surface connects the inner wall of the first side plate 460 and the third fixing surface 4431, so that the influence of chamfering on the side close to the first side plate 460 on the accuracy of the reflector 850 on the third fixing surface 4431 during the processing of the third fixing surface 4431 is effectively avoided.

Fig. 19 is a top view showing a use state of a package provided according to some embodiments, fig. 20 is a cross-sectional view three showing a use state of a package provided according to some embodiments, fig. 21 is a cross-sectional view four showing a transmission optical path (only a main optical axis is drawn, a solid line) of an optical signal generated by the light emitting device 600 and a transmission optical path (only a main optical axis is drawn, a broken line) of an optical signal to be received by the light receiving device 700, and a wavelength of the optical signal generated by the light emitting device 600 is different from a wavelength of the optical signal to be received by the light receiving device 700.

As shown in fig. 19 and 20, the optical signal generated by the optical emission chip 610 is transmitted to the third lens 630, collimated by the third lens 630, transmitted to the isolator 830, transmitted to the lens 820 through the isolator 830, transmitted to the first lens 810 through the lens 820, and converged by the first lens 810 to the pigtail adapter 208. The optical signals generated by the optical transmitting chip 610 are converged and transmitted to the pigtail adapter 208 through the first lens 810, so that the coupling efficiency of the optical signals to the pigtail adapter 208 is improved; the end face of the optical fiber core insert in the tail fiber adapter 208 is an inclined face, so that the transmission light path of the optical signal reflected by the end face of the optical fiber core insert is effectively reduced to return along the incident light path; the isolator 830 can further reduce the transmission of the reflected optical signal to the optical transmitting chip 610 along the original transmission optical path, so as to reduce interference of the reflected optical signal to the optical transmitting chip 610 caused by modulation of the reflected optical signal.

As shown in fig. 19 and 21, an optical signal to be received by the optical receiving chip 710 from the outside of the optical module is transmitted to the first lens 810 through the pigtail adapter 208, collimated by the first lens 810, transmitted to the transparent and reflective mirror 820, reflected by the transparent and reflective mirror 820 to the first filter 840, filtered by the first filter 840, transmitted to the reflective mirror 850, reflected by the reflective mirror 850, transmitted to the second filter 890, filtered again by the second filter 890, transmitted to the light-transmitting hole 4521 of the second support 452, transmitted to the displacement prism 860 through the light-transmitting hole 4521, transmitted to the second lens 870 after the height of the transmission light path in the second inner cavity 440 is adjusted by the displacement prism 860, transmitted to the reflective prism 880 after being converged by the second lens 870, and transmitted to the optical receiving chip 710 after being reflected by the reflective surface of the reflective prism 880. The optical signal to be received is reflected twice in the displacement prism 860, so as to adjust the height of the main optical axis of the optical signal to be received in the second inner cavity 440.

Fig. 22 is a second exploded view of a light receiving device and a circuit board according to some embodiments, and fig. 23 is a third exploded view of a light receiving device and a circuit board according to some embodiments. As shown in fig. 22 and 23, in some embodiments, the first engaging surface 462 is disposed on the outer wall of the first side plate 460, the second engaging surface 481 is disposed on the outer wall of the third side plate 480, and the first engaging surface 462 and the second engaging surface 481 are formed by the upper width of the package 400 being larger than the lower width. When the package 400 is assembled into the assembly hole 310 of the circuit board 300 or when the circuit board 300 extends into the opening 410, the first clamping surface 462 limits the first clamping area 320, the second clamping surface 481 limits the second clamping area 330, and the first clamping surface 462 and the second clamping surface 481 have a limiting guiding function so as to facilitate the assembly of the package 400 and the circuit board 300. Illustratively, the top surface of the first clamping region 320 contacts the first clamping surface 462 and the top surface of the second clamping region 330 contacts the second clamping surface 481.

The embodiment of the application provides an optical module with a novel structure, which enables an optical emission light path and a receiving light path to be separated in two inner cavities, effectively realizes the isolation of a reflected optical signal and a received optical signal, and avoids crosstalk generated between the reflected optical signal and the received optical signal so as to influence the quality of the received optical signal of a light receiving device.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims (10)

1. An optical module, comprising:

a circuit board;

the optical transceiver component is used for generating optical signals and receiving the optical signals from the outside of the optical module;

the optical fiber assembly is optically connected with the optical port of the optical module and the optical transceiver assembly;

wherein, the optical transceiver module includes:

the optical transceiver comprises an optical transceiver cavity, wherein one end of the optical transceiver cavity is provided with an adapter mounting hole, the optical fiber assembly is connected through the adapter mounting hole, the other end of the optical transceiver cavity is provided with an opening, the opening is communicated with an inner cavity of the optical transceiver cavity, and one end of the circuit board extends into the inner cavity through the opening; a baffle plate is arranged in the inner cavity along the length direction of the optical transceiver cavity, the inner cavity is divided into a first inner cavity and a second inner cavity along the width direction of the optical transceiver cavity by the baffle plate, a through hole is arranged on the baffle plate, and the through hole is communicated with the second inner cavity and the second inner cavity;

The light emitting device is arranged on the bottom plate of the first inner cavity and is electrically connected with the circuit board and comprises a light emitting chip;

the light receiving device is arranged on the top surface of the circuit board extending into the inner cavity and is positioned in the second inner cavity, is electrically connected with the circuit board and comprises a light receiving chip, and the difference between the height of the light sensitive surface of the light receiving chip and the height of the light emitting optical axis of the light emitting chip is less than 1mm;

the optical component is arranged in the inner cavity of the optical receiving and transmitting cavity and comprises a displacement prism and a reflecting prism; the displacement prism is arranged on a transmission light path of the optical signal to be received by the optical receiving chip and is used for adjusting the transmission height of the optical signal transmission light path in the optical receiving and transmitting cavity; the reflecting prism is positioned on the reflecting surface of the light receiving chip and is positioned above the light receiving chip and used for reflecting the light signal to be received to the light receiving chip.

2. The optical module of claim 1, wherein the optical transceiver cavity comprises a housing and a cover plate;

the shell comprises a bottom plate, a first side plate, a second side plate and a third side plate, wherein the first side plate, the second side plate and the third side plate are arranged at the edge of the bottom plate and are sequentially connected; the second side plate is positioned at one end of the bottom plate and is connected with the optical fiber assembly; the first side plate and the third side plate are positioned at two side edges of the bottom plate; the partition board is arranged in the tube shell, one end of the partition board is connected with the inner wall of the second side board, and the bottom of the partition board is connected with the bottom board;

The cover plate comprises a top plate and a fourth side plate, and the fourth side plate is connected with one end of the top plate;

the cover plate is connected with the tube shell in a covering way, the top plate covers the top of the tube shell, and the fourth side plate is positioned between the first side plate and the third side plate;

the shell is provided with a fixed supporting surface in the opening, and the fixed supporting surface is in supporting connection with the bottom surface of the circuit board.

3. The light module of claim 2 wherein the second side plate has the adapter mounting hole disposed therein, the adapter mounting hole being in communication with the first interior cavity; the optical fiber assembly comprises a tail fiber adapter which is inlaid in the adapter mounting hole;

a first step surface and a second step surface are arranged on the bottom plate in the first inner cavity, and the first step surface and the second step surface have a height difference; a first lens, a lens and an isolator are arranged on the first step surface; the light emitting device is arranged on the second step surface;

a fifth step surface is further arranged on the bottom plate in the first inner cavity, the fifth step surface is located between the second step surface and the fixed supporting surface, and the fifth step surface is lower than the second step surface.

4. The optical module of claim 2, wherein a third step surface and a fourth step surface are provided on the bottom plate in the second cavity, and a height difference exists between the third step surface and the fourth step surface;

the light receiving device is arranged on the circuit board; the third step surface is provided with a reflecting mirror and the displacement prism, the fourth step surface is provided with a first supporting piece, and the first supporting piece is provided with a second lens and the reflecting prism.

5. The light module of claim 2 wherein the top of the inner walls of the first, second and third side plates provide a first support surface and the top of the spacer provides a second support surface, the first and second support surfaces supporting the top plate;

the other end of the first side plate is provided with a first open slot, the other end of the second side plate is provided with a second open slot, and the first open slot and the second open slot are matched with the fourth side plate to form an opening at the other end of the optical transceiver cavity.

6. A light module as recited in claim 3, wherein a first support stand and a second support stand are provided on said first step surface, said first support stand being connected to an inner wall of said third side plate, said second support stand being connected to a side surface of said partition plate;

A first fixing surface is arranged on the side edge of the first supporting table, and a first arc transition surface is arranged between the first fixing surface and the first side plate; a second fixing surface is arranged on the side edge of the second supporting table, and a second arc transition surface is arranged between the second fixing surface and the partition plate;

the first fixing surface and the second fixing surface fixedly support the transflector.

7. The light module of claim 4 wherein a third support table is disposed on the third step surface, a third fixing surface is disposed on the third support table, and a third arc transition surface is disposed between the third fixing surface and the partition;

the third fixing surface fixedly supports the reflecting mirror.

8. The optical module according to claim 4, wherein a second supporting member is arranged on the third step surface, a light passing hole is arranged on the second supporting member, a second optical filter is arranged at one end of the light passing hole, and the displacement prism is arranged at the other end of the light passing hole;

the second support piece is positioned at the edge of the third step surface, so that the displacement prism is suspended above the fourth step surface.

9. The light module of claim 3 wherein the light emitting device further comprises a TEC and a third lens, the TEC disposed on the second step surface, the light emitting chip and the third lens disposed on the TEC, the light emitting chip and the TEC wire-bonded to the circuit board;

The light emitting device further comprises a backlight detector which is arranged on the circuit board and electrically connected with the circuit board.

10. The optical module of claim 2, wherein a first clamping surface is disposed on an outer wall of the first side plate, and a second clamping surface is disposed on an outer wall of the third side plate;

the one end of circuit board sets up the pilot hole, the edge of pilot hole sets up first joint district, second joint district and stretches into the district, stretch into the district stretches into the opening, the top surface contact of first joint district first joint face, the top surface contact of second joint district the second joint face.