CN117288368B - Pressure sensor assembly manufacturing method and pressure sensor assembly - Google Patents
Pressure sensor assembly manufacturing method and pressure sensor assembly Download PDFInfo
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- CN117288368B CN117288368B CN202311576038.9A CN202311576038A CN117288368B CN 117288368 B CN117288368 B CN 117288368B CN 202311576038 A CN202311576038 A CN 202311576038A CN 117288368 B CN117288368 B CN 117288368B
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/03—Detecting, measuring or recording fluid pressure within the body other than blood pressure, e.g. cerebral pressure; Measuring pressure in body tissues or organs
- A61B5/031—Intracranial pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0247—Pressure sensors
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0252—Load cells
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/12—Connectors or connections adapted for particular applications for medicine and surgery
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Heart & Thoracic Surgery (AREA)
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- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
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- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a pressure sensor assembly manufacturing method and a pressure sensor assembly, wherein the method comprises the steps of welding one end of a first wire to a bonding pad of a relative pressure sensor chip to form a first welding spot, wherein the first wire is a bare wire, and the relative pressure sensor chip forms a free end through the first wire; directly welding one end of a second wire with the other end of the first wire to form a second welding spot, wherein the second wire is an enameled wire, and one end of the second wire is a bare area; immersing the pressure sensor assembly in an electroplating solution to perform corrosion prevention treatment on a corrosion-prone region, wherein the pressure sensor assembly is used as a cathode, the pressure sensor assembly comprises a relative pressure sensor chip, a first lead and a second lead, and the corrosion-prone region comprises a first lead, a first welding point, a second welding point and a bare region. Through the transition of the first lead, the welding treatment is convenient for operators, the assembly efficiency and the product yield are improved, and meanwhile, the problem of intracranial pressure measurement accuracy is solved by utilizing the anti-corrosion treatment.
Description
Technical Field
The invention relates to the technical field of medical equipment, in particular to a manufacturing method of a pressure sensor assembly and the pressure sensor assembly.
Background
The intracranial pressure monitoring provides basis for accurately judging intracranial pressure (ICP) change conditions caused by occupancy diseases such as intracranial tumor, intracranial trauma, cerebral hemorrhage, cerebral edema and the like in clinic, and can meet the requirements of diagnosis, treatment and prognosis judgment. The miniature pressure sensor used for intracranial pressure monitoring is small in volume, and has a certain difficulty in direct welding with a lead wire when manufactured by the existing method, so that the product yield is difficult to ensure. Meanwhile, the pressure sensor chip of the intracranial pressure monitoring probe is accommodated in the shell, a silica gel supporting layer is formed on a detection window of the shell, and the intracranial pressure is conducted onto the pressure sensor chip through the silica gel supporting layer.
The water vapor transmittance of the silica gel is very high, gaps are easily formed at the contact surface between the detection window and the silica gel supporting layer, so that corrosive body fluid can enter the shell, as the internal lead usually contains a copper core, solder paste is generally used for welding, and under the condition that water vapor exists, electrochemical corrosion can occur when the tin and copper are electrified, so that the resistance of a welding spot and a copper wire can be changed; when the resistance of the area outside the pressure-sensitive window of the chip changes, the signal transmission and measurement accuracy of the internal circuit are affected. With the increase of the service time, the water vapor entering the inside of the shell increases, and the line corrosion condition is aggravated, so that the detection test precision is reduced and the intracranial pressure monitoring probe on the market is invalid, and the service time of the intracranial pressure monitoring probe on the market is generally not longer than 7 days.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a manufacturing method of a pressure sensor assembly, which solves the problems that the welding difficulty of a pressure sensor and a lead is high and the lead is corroded after welding in the existing manufacturing method.
The invention also provides a pressure sensor assembly.
A method of manufacturing a pressure sensor assembly according to an embodiment of the first aspect of the present invention comprises the steps of:
welding one end of a first wire to a bonding pad of a relative pressure sensor chip to form a first welding spot, wherein the first wire is a bare wire, and the relative pressure sensor chip forms a free end through the first wire;
directly welding one end of a second wire with the other end of the first wire to form a second welding spot, wherein the second wire is an enameled wire, and one end of the second wire is a bare area;
immersing a pressure sensor assembly in an electroplating solution to perform corrosion prevention treatment on a corrosion-prone region, wherein the pressure sensor assembly is used as a cathode, the pressure sensor assembly comprises the relative pressure sensor chip, the first lead and the second lead, and the corrosion-prone region comprises the first lead, the first welding point, the second welding point and the exposed region.
The manufacturing method of the pressure sensor assembly has at least the following beneficial effects:
by using the manufacturing method of the embodiment of the invention, after the first wire is welded with the opposite pressure sensor chip, the second wire is welded with the first wire, and compared with the method of directly welding the second wire serving as an enameled wire with the opposite pressure sensor chip, the method of the embodiment of the invention has the advantages that the first wire serving as a bare wire is used for transition, so that the welding treatment of operators can be better facilitated, and the assembly efficiency and the product yield are improved. Meanwhile, the area easy to corrode is subjected to electroplating treatment, so that an anti-corrosion layer is formed to protect the first lead wire serving as a bare wire, the first welding point and the second welding point which are provided with soldering paste and the bare area of the second lead wire, the problem that the intracranial pressure monitoring is affected due to corrosion of an internal circuit is solved, and even if part of corrosive body fluid enters the inside of the shell from the silica gel supporting layer, the relative pressure sensor chip can still work effectively, and the service life of the product can be ensured.
In addition, after the welding of the second welding spot is finished, the second lead also has a part exposed around the second welding spot, and due to the consistency factor of the welding process, the exposure deviation among batches is larger, so that the product precision of each batch is different, and especially the product precision after a period of use is caused. The pressure sensor component manufactured by the method provided by the embodiment of the invention can be effectively protected by the anti-corrosion layer, the problem of larger exposure deviation among batches can be well solved, and the consistency of the service lives of products can be improved. Furthermore, the anti-corrosion layer of the embodiment of the invention is of an integral conformal electroplating structure and has conductivity, so that the process requirements and difficulties of the first welding spot and the second welding spot can be obviously reduced; in addition, compared with the prior art, the material with general corrosion resistance and low price can be selected from the materials of the first wire and the second wire, such as common copper, silver or alloys and composite layers thereof.
In addition, as the free end of the relative pressure sensor chip is formed by the first lead, when the pressure sensor component obtained by the manufacturing method of the embodiment of the invention is installed in the intracranial pressure monitor, the first lead can ensure that the bottom of the relative pressure sensor chip is suspended, thereby isolating most of mechanical stress and thermal stress, improving the measurement precision and reducing the pressure drift. Meanwhile, the first lead and the second lead are directly welded, so that the number of welding spots in the assembly manufacturing process is reduced, and the reliability of the process and the product is ensured.
According to some embodiments of the invention, before the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further comprises the steps of:
and immersing the pressure sensor component in an activating working solution to activate the corrosion-prone area, and cleaning the residual activating working solution after the activation is completed.
According to some embodiments of the invention, the activating working fluid is sulfuric acid diluent or hydrochloric acid diluent.
According to some embodiments of the invention, before the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further comprises the steps of:
immersing the pressure sensor assembly into oil removing working fluid to remove oil in the corrosion-prone area, and cleaning residual oil removing working fluid after oil removal is completed.
According to some embodiments of the invention, before the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further comprises the steps of:
immersing the pressure sensor assembly in a pretreatment liquid to pretreat the corrosion-prone region so as to enhance the adhesion between the pressure sensor assembly and a substrate during corrosion-resistant treatment, wherein the pressure sensor assembly is used as a cathode;
and cleaning the residual pretreatment liquid after the pretreatment is finished.
According to some embodiments of the invention, the pretreatment liquid is a nickel plating liquid.
According to some embodiments of the invention, before the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further comprises the steps of:
and protecting the area where the internal circuit of the relative pressure sensor chip is exposed.
According to some embodiments of the invention, the means of the protective treatment comprises a silicone protective or vapor deposition insulating layer.
According to some embodiments of the invention, the plating solution is a gold plating solution, a palladium plating solution, or a platinum plating solution.
According to a second aspect of the invention, a pressure sensor assembly is provided, which is manufactured by a method according to any of the first aspect of the invention.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart of a method of manufacturing a pressure sensor assembly in accordance with one embodiment of the present invention;
FIG. 2 is a schematic diagram of a pressure sensor assembly according to one embodiment of the present invention;
FIG. 3 is a schematic illustration of electroplating a pressure sensor assembly in accordance with an embodiment of the present invention;
FIG. 4 is a schematic diagram of the structure of a relative pressure sensor chip according to one embodiment of the present invention;
FIG. 5 is a flow chart of a method of manufacturing a pressure sensor assembly in accordance with a preferred embodiment of the present invention;
FIG. 6 is a schematic diagram of the probe portion of an intracranial pressure monitor according to one embodiment of the present invention;
FIG. 7 is a schematic view of a probe portion of an intracranial pressure monitor according to another embodiment of the invention.
Reference numerals:
a relative pressure sensor chip 110; a first wire 120; a second wire 130; a first pad 140; a second pad 150;
a plating solution 210; a plating cathode 220; a plating anode 230;
a pad 310; an internal circuit 320; an elastic film 330;
a housing 410; a silicone sheath 420; a temperature sensor 430; and a third wire 440.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings, in which it is apparent that the embodiments described below are some, but not all embodiments of the invention.
Referring to fig. 1, a flowchart of a method for manufacturing a pressure sensor assembly according to an embodiment of the present invention is shown, where the method for manufacturing a pressure sensor assembly includes the following steps:
step S110, one end of a first wire 120 is welded to a bonding pad 310 of the opposite pressure sensor chip 110 to form a first welding spot 140, wherein the first wire 120 is a bare wire, and the opposite pressure sensor chip 110 forms a free end through the first wire 120;
step S120, directly welding one end of the second wire 130 with the other end of the first wire 120 to form a second welding spot 150, wherein the second wire 130 is an enameled wire, and one end of the second wire 130 is a bare area;
in step S130, the pressure sensor assembly is immersed in the plating solution 210 to perform corrosion prevention treatment on the corrosion-prone region, wherein the pressure sensor assembly is used as a cathode, and the pressure sensor assembly comprises a relative pressure sensor chip 110, a first lead 120 and a second lead 130, and the corrosion-prone region comprises the first lead 120, a first welding point 140, a second welding point 150 and a bare region.
Specifically, as can be seen from fig. 2, after step S110 is performed, a first solder joint 140 is formed by soldering between the first wire 120 and the pad 310 of the opposite pressure sensor chip 110, and specifically referring to fig. 4, the solder paste of the first solder joint 140 covers the pad 310 of the opposite pressure sensor chip 110.
With continued reference to fig. 2, after step S120 is performed, the other end of the first wire 120 is soldered to one end of the second wire 130 to form a second solder joint 150. The second solder joint 150 may be formed by an omni-directional solder ball bond, i.e., the solder is fully encapsulated to encapsulate the exposed second wire 130 ends. It should be appreciated that after the second bond 150 is bonded, the second wire 130 also has a portion exposed around the second bond 150, and the exposure deviation between batches is large due to the bonding process consistency, which results in different product precision from batch to batch, especially after a period of product use.
Further, as shown in fig. 2, the second wire 130 is configured as an enamel wire, the middle portion of which is wrapped with an insulating layer, while the end portion is exposed, while the first wire 120 is a pure bare wire. The second wires 130 are preferably a plurality of sequentially fixed flat cable structures. In order to ensure that the internal circuit after soldering is not affected by moisture permeation in actual use, step S130 is performed, and as shown in fig. 3, a pressure sensor assembly is placed as a plating cathode 220 in a plating solution 210, and a plating process is performed using an inert plating anode 230 such as graphite, a platinum-plated titanium mesh/sheet, or an iridium-plated titanium mesh/sheet, thereby forming an anti-corrosion layer (not shown). By adopting the electroplating method, the corrosion resistance of the internal circuit is greatly improved, and the metal protection can be realized in all conducting areas through the same process. Therefore, the packaging structure of the pressure sensor assembly can avoid corrosion of corrosive body fluid to a circuit, and can ensure biocompatibility and reliability.
In this embodiment, by using the manufacturing method of the embodiment of the present invention, after the first wire 120 is welded to the opposite pressure sensor chip 110, the second wire 130 is welded to the first wire 120, so that the welding process by an operator can be better facilitated, and the assembly efficiency and the product yield can be improved, compared with the case where the second wire 130, which is an enameled wire, is directly welded to the opposite pressure sensor chip 110, and the first wire 120, which is a bare wire, is used for transition. Meanwhile, the area where corrosion is likely to occur is subjected to electroplating treatment, so that an anti-corrosion layer is formed to protect the first lead 120, the first welding point 140 and the second welding point 150 with soldering paste, and the exposed area of the second lead 130, thereby solving the problem that the intracranial pressure monitoring is affected due to corrosion of the internal circuit, and even if part of corrosive body fluid enters the inside of the shell 410 from the silica gel supporting layer 420, the relative pressure sensor chip 110 can still effectively work, and the service life of the product can be ensured.
The pressure sensor component manufactured by the method provided by the embodiment of the invention can be effectively protected by the anti-corrosion layer, the problem of larger exposure deviation among batches can be well solved, and the consistency of the service lives of products can be improved. Further, since the anti-corrosion layer of the embodiment of the invention is an integral conformal electroplating structure and has conductivity, the process requirements and difficulties of the first welding spot 140 and the second welding spot 150 can be obviously reduced; in addition, the materials of the first wire 120 and the second wire 130 may be selected from materials having general corrosion resistance and low cost, such as common copper, silver or alloys thereof, composite layers, and the like, compared with the prior art.
In addition, since the opposite pressure sensor chip 110 forms a free end through the first lead 120, when the pressure sensor assembly obtained by the manufacturing method according to the embodiment of the present invention is installed in an intracranial pressure monitor, the first lead 120 can ensure that the bottom of the opposite pressure sensor chip 110 is suspended, thereby isolating most of mechanical stress and thermal stress. Meanwhile, the number of welding spots in the assembly manufacturing process is reduced by directly welding the first wire 120 and the second wire 130, and the reliability of the process and the product is ensured.
According to some embodiments of the present invention, as shown in fig. 5, before the step of immersing the pressure sensor assembly in the plating solution 210 to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further includes the steps of:
step S210, immersing the pressure sensor component in the activating working fluid to activate the corrosion-prone area, and cleaning the residual activating working fluid after the activation is completed.
Referring to fig. 5, it can be understood that, after the welding of the pressure sensor assembly is completed, that is, after the steps S110 and S120 are performed, and before the electroplating of the pressure sensor assembly, that is, before the step S130 is performed, the step S210 of the present embodiment may be performed, that is, the pressure sensor assembly is immersed in the activating working fluid to activate the corrosion-prone region to remove the metal surface oxide, and then the residual activating working fluid is removed by washing with deionized water. By performing the activation operation, the corrosion-prone region can be exposed on the surface of the fresh substrate in an activated state, thereby facilitating good bonding with the substrate during subsequent electroplating.
Optionally, the activating working fluid adopts sulfuric acid diluent or hydrochloric acid diluent.
Optionally, the activation working fluid is heated prior to immersing the pressure sensor assembly in the activation working fluid to activate the corrosion-prone region. It can be understood that the heated activation working fluid can accelerate the activation speed to a certain extent, thereby improving a certain activation effect.
According to some embodiments of the present invention, as shown in fig. 5, before the step of immersing the pressure sensor assembly in the plating solution 210 to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further includes the steps of:
and step S310, immersing the pressure sensor assembly in the oil removing working fluid to remove oil in the corrosion-prone area, and cleaning the residual oil removing working fluid after the oil removal is completed.
Referring to fig. 5, it can be understood that after the welding of the pressure sensor assembly is completed, that is, after the steps S110 and S120 are performed, and before the electroplating of the pressure sensor assembly, that is, before the step S130 is performed, the step S310 of this embodiment may be performed, that is, the pressure sensor assembly is immersed in the degreasing working fluid to degrease the corrosion-prone area, so as to remove the greasy dirt on the surface of the substrate, and then the residual degreasing working fluid is cleaned with deionized water and dried.
Optionally, the oil removing working solution adopts organic solvents such as acetone, isopropanol or alcohol.
Optionally, the degreasing working fluid is heated before the pressure sensor assembly is immersed in the degreasing working fluid to degrease the corrosion prone region. It can be understood that the heated oil removal working solution can accelerate the oil removal speed to a certain extent, thereby improving a certain oil removal effect.
Further, ultrasonic-assisted cleaning is used when degreasing the corrosion-prone region. The ultrasonic auxiliary cleaning can strengthen the oil removal effect to a certain extent.
According to some embodiments of the present invention, as shown in fig. 5, before the step of immersing the pressure sensor assembly in the plating solution 210 to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further includes the steps of:
step S410, immersing the pressure sensor component into pretreatment liquid to pretreat the corrosion-prone area so as to enhance the adhesion with the base material during corrosion-resistant treatment, wherein the pressure sensor component is used as a cathode;
step S420, cleaning the residual pretreatment liquid after the pretreatment is completed.
Referring to fig. 5, it can be understood that, after the welding of the pressure sensor assembly is completed, that is, after the steps S110 and S120 are performed, and before the electroplating of the pressure sensor assembly, that is, before the step S130 is performed, the steps S410 and S420 of the present embodiment may be performed, that is, the corrosion-prone area is subjected to a pretreatment, specifically, a pre-electroplating treatment, and then the remaining pretreatment solution is cleaned. The plating material is easy to deposit on the surface of the base material during electroplating, so that the plating layer is loose and has poor binding force. Therefore, a transition layer with good binding force is plated on the surface of the base material in advance in a preplating mode, so that the adhesion between the subsequent anti-corrosion layer and the base material is enhanced.
Optionally, the pretreatment liquid is a nickel plating liquid. It will be appreciated that by pre-plating with a nickel plating solution, a pre-plating layer of nickel can be formed on the perishable region. In some embodiments, the composition of the nickel plating solution includes, but is not limited to, electroplated nickel. The thickness of the pre-plating layer is 1 to 10 microns.
According to some embodiments of the present invention, as shown in fig. 5, before the step of immersing the pressure sensor assembly in the plating solution 210 to subject the corrosion-prone region to corrosion protection, the pressure sensor assembly manufacturing method further includes the steps of:
in step S510, a protection process is performed on the area where the internal circuit 320 of the relative pressure sensor chip 110 is exposed.
Referring to fig. 5, it can be understood that after the welding of the pressure sensor assembly is completed, that is, after the steps S110 and S120 are performed, and before the electroplating of the pressure sensor assembly, that is, before the step S130 is performed, the step S510 of the embodiment may be performed, that is, the exposed portion of the internal circuit 320 of the opposite pressure sensor chip 110 is subjected to a protection treatment, so as to prevent the problem that the measurement accuracy is affected due to the contact between the electroplated metal and the internal circuit 320.
Optionally, the protection treatment mode comprises a silica gel protection or vapor deposition of an insulating layer.
Alternatively, the plating solution 210 may be gold plating solution, palladium plating solution, or platinum plating solution (preferably, bright platinum is formed). Specifically, the components of the gold plating solution include, but are not limited to, sodium gold sulfite, the components of the palladium plating solution include, but are not limited to, diammine palladium chloride, and the components of the platinum plating solution include, but are not limited to, platinum dinitrosulfate.
Further, the corrosion protection layer has a thickness of 0.025 micrometers to 10 micrometers. It will be appreciated that by reasonably setting the thickness of the corrosion protection layer to 0.025 to 10 microns, on the one hand, the protection effect can be ensured, and on the other hand, the risk of breakage due to too-brittle plating caused by too-thick corrosion protection layer can be prevented.
It should be noted that, fig. 5 is a flowchart of a preferred embodiment provided by the present invention, and implementation steps of the preferred embodiment may be understood as follows: the welding between the relative pressure sensor chip 110, the first wire 120 and the second wire 130 is completed through the step S110 and the step S120 to primarily obtain a pressure sensor assembly; then sequentially performing step S510, step S310, step S210, step S410 and step S420 to sequentially complete the protection process, the degreasing process, the activation process and the pretreatment; and finally step S130 is performed to perform corrosion prevention treatment, thereby completing the manufacture of the pressure sensor assembly. It is understood that the preferred embodiment is only one of several examples, and thus, the steps S210, S310, S410, S420 and S510 are performed as a plurality of steps performed between the steps S120 and S130 in a non-sequential order.
In addition, as shown in fig. 2, the embodiment of the present invention further provides a pressure sensor assembly, which is manufactured by the manufacturing method of the pressure sensor assembly according to any one of the embodiments of the first aspect of the present invention.
It is to be understood that the pressure sensor assembly of the present embodiment includes, but is not limited to, a relative pressure sensor chip 110, a first wire 120, and a second wire 130. Specifically, the relative pressure sensor chip 110 may be a strain type pressure sensor, a capacitance type pressure sensor, or a piezoelectric type pressure sensor, preferably a piezoresistive type pressure sensor.
Alternatively, the first wire 120 may be a bare wire such as a gold wire, a silver-plated copper wire, a gold-plated copper wire, a silver-copper alloy wire, or the like. The second wire 130 is preferably a commercially available copper core enamel wire, but is not limited thereto. The first welding spot 140 or the second welding spot 150 may be welded by ultrasonic bonding, solder paste welding, resistance welding, laser soldering, or the like. The invention can effectively avoid the corrosion of each wire and welding spot, and has more obvious effect on materials such as copper, tin, silver and the like which are easy to corrode.
Further, the first conductive wire 120 has better flexibility than the second conductive wire 130, and is more convenient to be welded to the opposite pressure sensor chip 110, thereby reducing the welding difficulty and improving the assembly efficiency. The greater flexibility of the first wire 120 means that it has greater bending capability, i.e., is more flexible to operate, under the same force. That is, the first conductor 120 is a relatively "soft wire" and the second conductor 130 is a relatively "hard wire". The first conductive line 120 and the second conductive line 130 may be made of different materials to achieve different flexibility, or the first conductive line 120 may be thinner when the same materials are used. In addition, in the embodiment shown in fig. 2, the first conductive wire 120 and the second conductive wire 130 are linear, and may also take various curved forms to achieve different postures with respect to the pressure sensor chip 110, which is not limited thereto.
Furthermore, according to some embodiments of the present invention, as shown in fig. 2, the core diameter of the second wire 130 is larger than the diameter of the first wire 120. In particular, referring to fig. 2, it can be appreciated that by providing the first wire 120 with a smaller diameter than the core material of the second wire 130, the first wire 120 is more flexible and less likely to break. In some embodiments, the copper core diameter (neglecting the lacquer layer) of the second wire 130 is 20 micrometers to 200 micrometers and the diameter of the first wire 120 is 10 micrometers to 100 micrometers.
Further, the length of the first conductive line 120 is 0.2 mm to 2 mm, and the length of the second conductive line 130 is 0.3 m to 3 m. It should be noted that, since the first wire 120 is a bare wire and is also required to be electroplated, the length of the first wire 120 is reasonably set to be 0.2 mm to 2 mm based on the consideration of cost and assembly convenience; since the second wire 130 is a wire extending to the outside to be connected to an external circuit, a relatively longer wire may be used, so that the length of the second wire 130 is reasonably set to 0.3 to 3 meters.
Preferably, the second wire 130 may be a direct-welding type enamel wire, and when the direct-welding type enamel wire is used, the second wire 130 is not required to be subjected to a paint removing operation; in some other embodiments, when the second wire 130 is a non-straight wire, the stripping operation may be performed by laser stripping, paint stripper dipping, mechanical stripping, or the like.
With further reference to fig. 4, the first conductive lines 120 and the second conductive lines 130 are each provided in plurality, and the number of the first conductive lines 120 and the second conductive lines 130 is the same. For the opposite pressure sensor chip 110 requiring external power supply, one power supply line must be connected, and two positive and negative output lines are required, so that three first and second wires 120 and 130 are required, respectively. It is understood that the three first wires 120 are soldered to the pads 310 of the opposite pressure sensor chip 110 in parallel, and each of the pads 310 is electrically connected to the internal circuit 320 by a different wire.
In addition, as shown in fig. 6, an embodiment of the present invention further provides an intracranial pressure monitor, including: a housing 410, a pressure sensor assembly as in the second aspect of the present invention, a silicone jacket 420. The casing 410 is provided with a detection window and a wire connection port; the pressure sensor assembly is disposed in the housing 410, the second wire 130 extends to the outside through the wire connection port, and an air passage communicating with the wire connection port is formed below the opposite pressure sensor chip 110; the silica gel supporting layer 420 is disposed on the pressure sensor assembly, is embedded with the detection window, and is used for transmitting pressure to the pressure sensor assembly.
Further, referring to fig. 4, the elastic membrane 330 is disposed on the relative pressure sensor chip 110, and the transmitted intracranial pressure is received by the elastic membrane 330, so that the internal circuit 320 can convert the intracranial pressure into a corresponding pressure value, so it can be understood that, referring to fig. 4 and 6 in combination, the elastic membrane 330 is disposed with a detection window oriented to the housing 410, so as to collect intracranial pressure information; with continued reference to fig. 6, the second wire 130 may extend from the wire connection port to the outside; the silica gel supporting layer 420 is embedded into the detection window and covers the opposite pressure sensor chip 110 and the anti-corrosion layer, specifically, one side of the opposite pressure sensor chip 110 is embedded into the silica gel supporting layer 420, and the other side is located in the air passage communicated with the wire connection port. It should be noted that, the relative pressure sensor chip 110 performs measurement based on the atmospheric pressure, so the inner side of the relative pressure sensor chip 110 according to the embodiment of the present invention needs to be in contact with the atmosphere, i.e. suspended into the air passage.
By installing the pressure sensor assembly of an embodiment of the present invention into housing 410, indirect contact of the pressure sensor assembly with the intracranial pressure can be achieved through the detection window, thereby obtaining the intracranial pressure value and achieving intracranial pressure monitoring. By providing the silicone sheath 420, direct contact with the cranium can be achieved to transfer pressure to the pressure sensor assembly. In addition, the embodiment of the invention is more suitable for the pressure sensor assembly adopting the relative pressure sensor chip 110, ensures the good work of the relative pressure sensor chip 110, and can obviously reduce the product cost compared with the absolute pressure sensor chip.
Optionally, as shown in fig. 7, the intracranial pressure monitor further comprises: a temperature sensor 430, a third wire 440. The temperature sensor 430 is disposed in the case 410; one end of the third wire 440 is electrically connected to the temperature sensor 430, and the other end extends to the outside through the wire connection port. It will be appreciated that by providing temperature sensor 430, monitoring of intracranial temperature conditions may be further accomplished on the basis of monitoring intracranial pressure.
In some embodiments, the third wire 440 is provided in plurality. Further, if the temperature sensor 430 employs a thermistor, two wires need to be disposed at two ends of the thermistor to provide voltage, that is, two wires need to be disposed on the third wire 440.
It will be appreciated that in the embodiment of fig. 6 and 7, the housing 410 is in a regular square configuration, which is only schematically illustrated, and that variations of the housing 410 are contemplated by those skilled in the art based on this, and the invention is not limited thereto. In addition, fig. 6 and 7 only illustrate the probe portion of the intracranial pressure monitor, and other portions such as a host computer, a drainage tube, etc. can refer to the existing and improved technology. The pressure sensor assembly of the present invention may be used for pressure detection in other possible medical devices, such as ureteroscopes, in addition to intracranial pressure monitor probes, and is within the scope of the present invention.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A method of manufacturing a pressure sensor assembly, comprising the steps of:
welding one end of a first wire to a bonding pad of a relative pressure sensor chip to form a first welding spot, wherein the first wire is a bare wire, and the relative pressure sensor chip forms a free end through the first wire;
directly welding one end of a second wire with the other end of the first wire to form a second welding spot, wherein the second wire is an enameled wire, and one end of the second wire is a bare area;
immersing a pressure sensor assembly in an electroplating solution to perform corrosion prevention treatment on a corrosion-prone region, wherein the pressure sensor assembly is used as a cathode, the pressure sensor assembly comprises the relative pressure sensor chip, the first lead and the second lead, and the corrosion-prone region comprises the first lead, the first welding point, the second welding point and the exposed region.
2. The method of manufacturing a pressure sensor assembly according to claim 1, wherein prior to the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the method further comprises the steps of:
and immersing the pressure sensor component in an activating working solution to activate the corrosion-prone area, and cleaning the residual activating working solution after the activation is completed.
3. The method of manufacturing a pressure sensor assembly according to claim 2, wherein the activating working fluid is a sulfuric acid diluent or a hydrochloric acid diluent.
4. The method of manufacturing a pressure sensor assembly according to claim 1, wherein prior to the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the method further comprises the steps of:
immersing the pressure sensor assembly into oil removing working fluid to remove oil in the corrosion-prone area, and cleaning residual oil removing working fluid after oil removal is completed.
5. The method of manufacturing a pressure sensor assembly according to claim 1, wherein prior to the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the method further comprises the steps of:
immersing the pressure sensor assembly in a pretreatment liquid to pretreat the corrosion-prone region so as to enhance the adhesion between the pressure sensor assembly and a substrate during corrosion-resistant treatment, wherein the pressure sensor assembly is used as a cathode;
and cleaning the residual pretreatment liquid after the pretreatment is finished.
6. The method of manufacturing a pressure sensor assembly of claim 5, wherein the pretreatment liquid is a nickel plating liquid.
7. The method of manufacturing a pressure sensor assembly according to claim 1, wherein prior to the step of immersing the pressure sensor assembly in the plating solution to subject the corrosion-prone region to corrosion protection, the method further comprises the steps of:
and protecting the area where the internal circuit of the relative pressure sensor chip is exposed.
8. The method of claim 7, wherein the protective treatment comprises a silicone protective or vapor deposition of an insulating layer.
9. The method of manufacturing a pressure sensor assembly according to any one of claims 1 to 8, wherein the plating solution is gold plating solution, palladium plating solution or platinum plating solution.
10. A pressure sensor assembly, characterized in that it is manufactured by a pressure sensor assembly manufacturing method according to any one of claims 1 to 9.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1515662A (en) * | 1972-10-03 | 1978-06-28 | Kdg Instr Ltd | Transducers |
| CN113080922A (en) * | 2021-03-22 | 2021-07-09 | 清华大学深圳国际研究生院 | Packaging structure and method of catheter type intracranial pressure measuring probe |
| CN116077829A (en) * | 2023-01-18 | 2023-05-09 | 微智医疗器械有限公司 | Implant device, electro-stimulator, and electrode plating method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050001316A1 (en) * | 2003-07-01 | 2005-01-06 | Motorola, Inc. | Corrosion-resistant bond pad and integrated device |
| EP1947439B1 (en) * | 2005-11-01 | 2012-02-08 | Hitachi, Ltd. | Semiconductor pressure sensor |
| AT11941U1 (en) * | 2010-02-12 | 2011-07-15 | Plansee Metall Gmbh | TOUCH SENSOR ARRANGEMENT |
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2023
- 2023-11-24 CN CN202311576038.9A patent/CN117288368B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1515662A (en) * | 1972-10-03 | 1978-06-28 | Kdg Instr Ltd | Transducers |
| CN113080922A (en) * | 2021-03-22 | 2021-07-09 | 清华大学深圳国际研究生院 | Packaging structure and method of catheter type intracranial pressure measuring probe |
| CN116077829A (en) * | 2023-01-18 | 2023-05-09 | 微智医疗器械有限公司 | Implant device, electro-stimulator, and electrode plating method |
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