CN117253833A - Horizontal multi-joint robot arm for semiconductor - Google Patents
Horizontal multi-joint robot arm for semiconductor Download PDFInfo
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- CN117253833A CN117253833A CN202311535458.2A CN202311535458A CN117253833A CN 117253833 A CN117253833 A CN 117253833A CN 202311535458 A CN202311535458 A CN 202311535458A CN 117253833 A CN117253833 A CN 117253833A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000006243 chemical reaction Methods 0.000 claims abstract description 44
- 235000012431 wafers Nutrition 0.000 abstract description 181
- 230000032258 transport Effects 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a horizontal multi-joint robot arm for a semiconductor, which relates to the technical field of semiconductor wafers and comprises a control base, wherein the top surface of the control base is rotationally connected with a rotating arm, the top surface of the rotating arm is rotationally connected with a folding arm, the top surface of the folding arm is rotationally connected with a conversion robot arm, and the inner side of the conversion robot arm is provided with a sliding wafer tray; the transfer robot comprises a transfer robot, a plurality of transfer stations and a plurality of processing stations, wherein the transfer stations are arranged at the processing positions of semiconductor wafers, sliding wafer trays are also arranged at the inner sides of the transfer stations, and the transfer robot loads and unloads the semiconductor wafers by changing the positions between the wafer trays at the inner sides of the transfer robot and the wafer trays at the inner sides of the transfer stations; the data operation cost of the horizontal multi-joint robot is greatly reduced, meanwhile, the internal system composition of the horizontal multi-joint robot is simplified, and the use cost of the horizontal multi-joint robot is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor wafers, in particular to a horizontal multi-joint robot arm for a semiconductor.
Background
The horizontal multi-joint robot for semiconductors is a device specially used for transporting semiconductor wafers, the current horizontal multi-joint robot, such as a mechanical arm for semiconductor manufacturing disclosed in China patent with the authority of CN112548991B and a six-axis mechanical arm for semiconductor cleaning disclosed in China patent with the authority of CN113635292B, when the device is used for transporting semiconductor wafers, the horizontal multi-joint robot is required to be provided with a precise sensor system such as a vision system, a force sensor and a laser range finder for acquiring the precise position of the semiconductor wafers, then the semiconductor wafers are transported to the horizontal multi-joint robot, the horizontal multi-joint robot again transports the semiconductor wafers from the horizontal multi-joint robot to a station after the semiconductor wafers are transported to the set position, the two movements need to precisely control the positions of the semiconductor wafers, so that the risk of the semiconductor wafers receiving external friction is greatly increased, the sensor system is arranged for acquiring the precise positions of the semiconductor wafers, the horizontal multi-joint robot needs to process data through the horizontal multi-joint robot, and the cost of the horizontal multi-joint robot is increased, and the data of the horizontal multi-joint robot is required to be processed through the horizontal multi-joint robot.
Disclosure of Invention
In order to overcome the technical problems described above, the present invention is directed to providing a horizontal multi-joint robot for a semiconductor, so as to solve the problems of the prior art that the data operation cost and the hardware use cost of the horizontal multi-joint robot are increased due to the fact that the multi-joint robot needs to be equipped with an accurate sensor system such as a vision system, a force sensor, a laser range finder, etc. to obtain the accurate position of the semiconductor wafer.
The aim of the invention can be achieved by the following technical scheme:
the horizontal multi-joint robot for the semiconductor comprises a control base, wherein the top surface of the control base is rotationally connected with a rotating arm, the top surface of the rotating arm is rotationally connected with a folding arm, the top surface of the folding arm is rotationally connected with a conversion robot, and the inner side of the conversion robot is provided with a sliding wafer tray;
the wafer transfer device comprises a wafer transfer station, a transfer robot and a transfer robot, wherein the transfer robot is used for transferring a wafer to the transfer robot, the transfer robot is used for transferring the wafer to the transfer robot, and the transfer robot is used for transferring the wafer to the transfer robot.
As a further scheme of the invention: the conversion robot comprises a rotating seat, the bottom surface of the rotating seat is rotationally connected with the top surface of the folding arm, one side of the rotating seat is fixedly connected with a connecting arm, and one end, far away from the rotating seat, of the connecting arm is rotationally connected with two groups of arc-shaped converters.
As a further scheme of the invention: the one end that the linking arm is close to the arc converter has seted up the transportation track, and the conversion track has been seted up to the inboard of arc converter, and station track has all been seted up to the inboard of a plurality of wafer transfer station, one side fixedly connected with of wafer tray with transportation track, conversion track and station track assorted track slider.
As a further scheme of the invention: the transportation track, the conversion track and the station track are connected end to form a complete circle.
As a further scheme of the invention: and the butt joint between the connecting arm and the two groups of arc-shaped converters is provided with a driving shaft.
As a further scheme of the invention: the side of the connecting arm is provided with a storage groove which is mutually matched with the two groups of arc-shaped converters.
As a further scheme of the invention: the bottom of the control base is fixedly connected with a transportation base.
As a further scheme of the invention: the inner side and the outer side of the arc-shaped converter and the inner side of the conveying rail are both provided with driving rails, and the inner side of each driving rail is provided with an elastic toothed belt.
As a further scheme of the invention: and tooth grooves matched with the elastic tooth belts are formed in the side surfaces of the track sliding blocks.
As a further scheme of the invention: the elastic toothed belt sequentially penetrates through the driving track, the conveying track and the driving track of the inner side and the outer side of one group of arc-shaped converters and the inside of the connecting arm to form an annular shape, a driving motor is mounted at the position, close to the elastic toothed belt, of the inside of the connecting arm, the driving gear is fixedly connected with an output shaft of the driving motor, and the driving gear is meshed with the elastic toothed belt.
The invention has the beneficial effects that:
according to the invention, when a semiconductor wafer is required to be transferred from the wafer transfer station to the horizontal multi-joint robot, the horizontal multi-joint robot rotates two wafer trays between the transfer robot and the wafer transfer station through the transfer robot, so that the two wafer trays exchange positions, the wafer tray with the semiconductor wafer is transferred from the wafer transfer station to the inner side of the transfer robot, the empty wafer tray is transferred from the inner side of the transfer robot to the transfer station, the transfer of the semiconductor wafer is realized under the condition that the semiconductor wafer is not moved, the semiconductor wafer is not subjected to mechanical collision in the transfer process, the protection effect on the semiconductor wafer is improved, and the transfer robot does not need to be provided with a sensor system to acquire the accurate position of the semiconductor wafer during the transfer, so that the data operation cost of the horizontal multi-joint robot is greatly reduced, meanwhile, the internal system composition of the horizontal multi-joint robot is simplified, and the use cost of the horizontal multi-joint robot is reduced.
2. According to the invention, the track sliding blocks on one side of the wafer tray are matched with the conveying track, the converting track and the station track, and the conveying track, the converting track and the station track are connected end to form a complete circle, so that the wafer tray can slide on the conveying track, the converting track and the station track through the track sliding blocks arranged on one side of the wafer tray, and the wafer tray cannot be separated from the conveying track, the converting track and the station track in the sliding process, so that the sliding stability of the wafer tray on the conveying track, the converting track and the station track is ensured;
because the transportation track, the conversion track and the station track are connected end to form a complete circle, the wafer trays can be converted back and forth between the transportation track and the station track through the track sliding blocks arranged on one side of the wafer trays, and the function of converting the two groups of wafer trays between the conversion robot and the wafer transfer station is realized.
3. In the invention, the S-pole magnet and the N-pole magnet are arranged on the end face of the wafer tray, when the wafer tray on the inner side of the conversion robot needs to be matched with the wafer tray on the wafer transfer station, the S-pole magnet and the N-pole magnet on one wafer tray just correspond to the N-pole magnet and the S-pole magnet on the other wafer tray, and the magnetic attraction generated between the S-pole magnet and the N-pole magnet can enable the wafer tray on the inner side of the conversion robot to be automatically aligned with the wafer tray on the wafer transfer station, so that the conversion of the positions between the wafer tray on the inner side of the conversion robot and the wafer tray on the wafer transfer station is greatly facilitated.
Drawings
The invention is further described below with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a horizontal multi-joint robot in accordance with the present invention;
FIG. 3 is a schematic diagram of the wafer pallet inside the transfer robot prior to transfer in accordance with the present invention;
FIG. 4 is a schematic diagram of the wafer pallet inside the transfer robot after transfer in accordance with the present invention;
FIG. 5 is a schematic view of the arc switch of the present invention after being received;
FIG. 6 is a schematic diagram of an arcuate converter in accordance with the present invention;
FIG. 7 is a schematic view of a wafer pallet according to the present invention;
FIG. 8 is a schematic view of a wafer transfer station according to the present invention;
fig. 9 is a schematic view showing the structure of a wafer tray in embodiment 2 of the present invention;
fig. 10 is a schematic view of a wafer pallet according to embodiment 3 of the present invention.
In the figure: 1. a control base; 11. a transport base; 2. a rotating arm; 3. a folding arm; 4. a converting robot; 41. a rotating seat; 42. a connecting arm; 421. a transport rail; 43. an arc-shaped converter; 431. converting the track; 432. a drive rail; 44. a drive shaft; 5. a wafer tray; 51. a track slider; 52. an S-pole magnet; 53. an N-pole magnet; 54. an infrared emitter; 55. an infrared receiver; 6. a wafer transfer station; 61. a station track; 7. a semiconductor wafer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1 and 2, the invention discloses a horizontal multi-joint robot for a semiconductor, which comprises a control base 1, wherein the top surface of the control base 1 is rotationally connected with a rotating arm 2, the top surface of the rotating arm 2 is rotationally connected with a folding arm 3, the top surface of the folding arm 3 is rotationally connected with a conversion robot 4, and the inner side of the conversion robot 4 is provided with a sliding wafer tray 5;
the wafer transfer device further comprises a plurality of wafer transfer stations 6, the plurality of wafer transfer stations 6 are all arranged at processing positions of the semiconductor wafers 7, sliding wafer trays 5 are also arranged on the inner sides of the wafer transfer stations 6, and the transfer robot 4 loads and unloads the semiconductor wafers 7 by changing positions between the wafer trays 5 on the inner sides of the transfer robot 4 and the wafer trays 5 on the inner sides of the wafer transfer stations 6;
it should be noted that, the wafer transfer station 6 refers to a processing station of the semiconductor wafer 7, for example, when the semiconductor wafer 7 is transported to a station of a photolithography machine, when the photolithography machine is used for performing circuit etching on the semiconductor wafer 7, a wafer transfer station 6 may be disposed on the photolithography machine, or the wafer transfer station 6 may be disposed at a cleaning mechanism of the semiconductor wafer 7, for example, after the cleaning mechanism is used for performing ultrasonic cleaning and deionized water impact and blow-drying on the semiconductor wafer 7, when the semiconductor wafer 7 needs to be transported to the cleaning mechanism, a wafer transfer station 6 may be disposed at a position where the semiconductor wafer 7 needs to be transferred, in general, the wafer transfer station 6 may be disposed at each transport node in the processing process of the semiconductor wafer 7;
as shown in fig. 3, when the horizontal multi-joint robot is used, the control base 1 is directly moved to the position of the wafer transfer station 6 at the corresponding position, and then the empty wafer tray 5 at the inner side of the transfer robot 4 is butt-jointed with the wafer tray 5 on which the semiconductor wafer 7 is placed on the wafer transfer station 6;
as shown in fig. 4, when the semiconductor wafer 7 is required to be transferred from the wafer transfer station 6 to the horizontal multi-joint robot, the horizontal multi-joint robot rotates the two wafer trays 5 through the transfer robot 4, so that the two wafer trays 5 exchange positions, the wafer tray 5 with the semiconductor wafer 7 placed thereon is transferred from the wafer transfer station 6 to the inner side of the transfer robot 4, the empty wafer tray 5 is transferred from the inner side of the transfer robot 4 to the wafer transfer station 6, the transfer of the semiconductor wafer 7 is realized without moving the semiconductor wafer 7, the semiconductor wafer 7 is not mechanically impacted during the transfer, the protection effect on the semiconductor wafer 7 is improved, and during the transfer, the transfer robot 4 does not need to be equipped with a sensor system such as a vision system, a force sensor, a laser range finder and the like to acquire the accurate position of the semiconductor wafer 7, so that the data operation cost of the horizontal multi-joint robot is greatly reduced, the internal system of the horizontal multi-joint robot is simplified, and the cost of the horizontal multi-joint robot is reduced.
As shown in fig. 5 and 6, the converting robot 4 includes a rotating base 41, a bottom surface of the rotating base 41 is rotatably connected with a top surface of the folding arm 3, a connecting arm 42 is fixedly connected to one side of the rotating base 41, and two groups of arc converters 43 are rotatably connected to one end of the connecting arm 42 away from the rotating base 41;
it should be noted that, the rotating motor is installed at a position inside the folding arm 3 near the rotating seat 41, and an output shaft of the rotating motor is fixedly connected with a center position of a bottom surface of the rotating seat 41, so that after the rotating motor is opened, the rotating seat 41 can be directly driven to rotate by the output shaft of the rotating motor, the rotating seat 41 can drive the connecting arm 42, and the connecting arm 42 drives the wafer tray 5 and the semiconductor wafer 7 on the top surface of the wafer tray 5, thereby realizing a transportation function of the semiconductor wafer 7.
As shown in fig. 3, 6, 7 and 8, a transportation rail 421 is provided at one end of the connecting arm 42 near the arc-shaped converter 43, a conversion rail 431 is provided at the inner side of the arc-shaped converter 43, station rails 61 are provided at the inner sides of the plurality of wafer transfer stations 6, a rail slider 51 matched with the transportation rail 421, the conversion rail 431 and the station rails 61 is fixedly connected to one side of the wafer tray 5, and the transportation rail 421, the conversion rail 431 and the station rails 61 are connected end to form a complete circle;
it should be noted that, since the track slider 51 on one side of the wafer tray 5 is matched with the transport track 421, the conversion track 431 and the station track 61, and the transport track 421, the conversion track 431 and the station track 61 are connected end to form a complete circle, the wafer tray 5 can slide on the transport track 421, the conversion track 431 and the station track 61 through the track slider 51 on one side thereof, and cannot separate from the transport track 421, the conversion track 431 and the station track 61 in the sliding process, so that the sliding stability of the wafer tray 5 on the transport track 421, the conversion track 431 and the station track 61 is ensured;
since the transportation rail 421, the conversion rail 431 and the station rail 61 are connected end to form a complete circle, the wafer trays 5 can be converted back and forth between the transportation rail 421 and the station rail 61 through the rail sliding blocks 51 arranged on one side of the wafer trays, and the function of converting the two groups of wafer trays 5 between the conversion robot 4 and the wafer transfer station 6 is realized.
As shown in fig. 5, the butt joint between the connecting arm 42 and the two groups of arc-shaped converters 43 is provided with a driving shaft 44, the bottom of the driving shaft 44 can be connected with a motor (not shown in the figure) through a coupling, the motor is fixedly installed on the bottom surface of the connecting arm 42 through a bolt, a bearing seat (not shown in the figure) can be installed at the position, close to the driving shaft 44, of the end part of the connecting arm 42, the side surface of the driving shaft 44 is fixedly connected with one end of the arc-shaped converter 43, when the position of the arc-shaped converter 43 needs to be adjusted, the motor can be turned on, the output shaft of the motor directly drives the driving shaft 44 to rotate through the coupling, and the rotating driving shaft 44 can drive the arc-shaped converter 43 to synchronously rotate because the side surface of the driving shaft 44 is fixedly connected with one end of the arc-shaped converter 43;
when the converting robot 4 needs to convert the wafer tray 5 with the wafer transferring station 6, the motor is turned on, the output shaft of the motor directly drives the driving shaft 44 to rotate through the coupler, the rotating driving shaft 44 drives the arc-shaped converters 43 to synchronously rotate, so that the other ends of the two groups of arc-shaped converters 43 are contacted with two sides of the wafer transferring station 6, as shown in fig. 3, at the moment, the transporting rail 421, the converting rail 431 and the station rail 61 are connected end to form a complete circle, and the wafer tray 5 can slide on the transporting rail 421, the converting rail 431 and the station rail 61 through the rail sliding blocks 51 arranged on one side of the wafer tray 5, so that the conversion of the wafer tray 5 between the transporting rail 421 and the station rail 61 is realized;
when the wafer tray 5 is converted, the motor is turned on again, and the rotation direction of the motor is opposite to that of the motor, so that the other ends of the two groups of arc converters 43 are directly separated from contact with the two sides of the wafer transfer station 6.
As shown in fig. 5, the side surface of the connecting arm 42 is provided with a receiving groove which is engaged with the two sets of arc converters 43;
it should be noted that, after the conversion of the wafer tray 5 is completed, the motor is turned on, the output shaft of the motor directly drives the driving shaft 44 to rotate through the coupling, and since the side surface of the driving shaft 44 is fixedly connected with one end of the arc-shaped converter 43, the rotating driving shaft 44 drives the arc-shaped converter 43 to synchronously rotate, and the other ends of the two rotating groups of arc-shaped converters 43 are directly separated from contact with two sides of the wafer transfer station 6 and are embedded into the storage groove on the side surface of the connecting arm 42;
the magnet can be arranged on the top surface of the inner cavity of the accommodating groove, the iron block is arranged at the position, close to the magnet, of the top surface of the two groups of arc-shaped converters 43, and when the two groups of arc-shaped converters 43 rotate to enter the accommodating groove, the magnetic attraction force generated by the magnet acts on the iron block, so that the positions of the two groups of arc-shaped converters 43 are limited, the conversion robot 4 is ensured to be stable in the accommodating groove in the process of transporting the semiconductor wafer 7, and the movement of the conversion robot 4 is also facilitated;
it should be emphasized that the magnetic attraction force generated by the magnet in the inner cavity of the accommodating groove and the iron blocks on the top surfaces of the two groups of arc-shaped converters 43 should be smaller than the torque force of the motor, so that after the motor is opened, the output shaft of the motor is ensured to overcome the magnetic attraction force generated by the magnet in the inner cavity of the accommodating groove and the iron blocks on the top surfaces of the two groups of arc-shaped converters 43, and the two groups of arc-shaped converters 43 are rotated out of the accommodating groove.
As shown in fig. 1, the bottom of the control base 1 is fixedly connected with a transport base 11, the main purpose of the transport base 11 is to transport the control base 1, which can be arranged on a limited track, displacement of the control base 1 is realized through cooperation of the transport base 11 and the track, a track or a roller can be arranged on the bottom surface of the transport base 11, and the track or the roller is driven by a motor, so that displacement of the control base 1 is also realized.
As shown in fig. 6, the inner side and the outer side of the arc-shaped converters 43 and the inner side of the transportation rail 421 are both provided with driving rails 432, the inner side of the driving rails 432 is provided with elastic toothed belts, the side surface of the rail sliding block 51 is provided with tooth grooves matched with the elastic toothed belts, the elastic toothed belts sequentially pass through the driving rails 432 on the outer side and the inner side of one group of the arc-shaped converters 43, the transportation rail 421, the driving rails 432 on the inner side and the outer side of the other group of the arc-shaped converters 43 and the inside of the connecting arm 42 to form a ring shape, the inside of the connecting arm 42 is provided with a driving motor close to the position of the elastic toothed belts, the output shaft of the driving motor is fixedly connected with a driving gear, and the driving gear is meshed with the elastic toothed belts;
it should be noted that, the elastic toothed belt is made of rubber, the number of the elastic toothed belt is one, the elastic toothed belt is sleeved between the two groups of arc-shaped converters 43 and the connecting arm 42, pulleys are arranged at the end positions of the two groups of arc-shaped converters 43 and the connecting arm 42, friction force between the elastic toothed belt and the two groups of arc-shaped converters 43 and between the elastic toothed belt and the connecting arm 42 is reduced, the elastic toothed belt is convenient to rotate, when the elastic toothed belt needs to be started, the driving motor can be started, the output shaft of the driving motor can directly drive the driving gear to rotate, and the rotating driving gear can also drive the elastic toothed belt to move due to the meshing of the driving gear and the elastic toothed belt, so that the rotation of the elastic toothed belt is realized;
since the rail slider 51 at one side of the wafer tray 5 is matched with the transportation rail 421, the conversion rail 431 and the station rail 61, and the transportation rail 421, the conversion rail 431 and the station rail 61 are connected end to form a complete circle, tooth grooves matched with the elastic toothed belt are formed at the side surface of the rail slider 51, the rail slider 51 is meshed with the elastic toothed belt through the tooth grooves, and the transportation rail 421, the conversion rail 431 and the station rail 61 limit the movement track of the wafer tray 5 through the rail slider 51, when the elastic toothed belt rotates, the elastic toothed belt drives the wafer tray 5, and the wafer tray 5 can slide on the transportation rail 421, the conversion rail 431 and the station rail 61 through the rail slider 51 arranged at one side of the elastic toothed belt;
it should be emphasized that when the arc length of the transfer rail 421 and the transition rail 431 on the inner side of the two sets of arc-shaped transducers 43 is greater than the arc length of the station rail 61, and when the elastic toothed belt drives the wafer tray 5 on the inner side of the transfer robot 4, the end surface of the wafer tray 5 on the inner side of the transfer robot 4 contacts with the end surface of the wafer tray 5 on the wafer transfer station 6, as shown in fig. 3 and 4, the wafer tray 5 on the inner side of the transfer robot 4 can act on the wafer tray 5 on the wafer transfer station 6 through the extrusion force, so that the wafer tray 5 on the wafer transfer station 6 and the wafer tray 5 on the inner side of the transfer robot 4 can synchronously move, and because the arc length of the transfer rail 421 and the transition rail 431 on the inner side of the two sets of arc-shaped transducers 43 is greater than the arc length of the station rail 61, the end surface of the wafer tray 5 on the inner side of the transfer robot 4 and the wafer tray 5 on the wafer transfer station 6 need to have a driving action of the elastic toothed belt, so that the wafer tray 5 can ensure that the two hundred and eighty degrees of rotation of the wafer tray 5 can be interchanged.
Example 2
As shown in fig. 9, the end surface of the wafer tray 5 is provided with an S-pole magnet 52 and an N-pole magnet 53, when the wafer tray 5 inside the transfer robot 4 needs to be matched with the wafer tray 5 on the wafer transfer station 6, the S-pole magnet 52 and the N-pole magnet 53 on one wafer tray 5 exactly correspond to the N-pole magnet 53 and the S-pole magnet 52 on the other wafer tray 5, and the magnetic attraction generated between the S-pole magnet 52 and the N-pole magnet 53 can enable the wafer tray 5 inside the transfer robot 4 to be automatically aligned with the wafer tray 5 on the wafer transfer station 6, so that the transfer of the positions between the wafer tray 5 inside the transfer robot 4 and the wafer tray 5 on the wafer transfer station 6 is greatly facilitated, and the accurate position of the wafer tray 5 can be obtained by using a sensor system such as a vision system, a force sensor, a laser range finder and the like can be avoided.
Example 3
As shown in fig. 10, the end surface of the wafer tray 5 is provided with an infrared emitter 54 and an infrared receiver 55, when the wafer tray 5 inside the conversion robot 4 needs to be matched with the wafer tray 5 on the wafer transfer station 6, the infrared emitter 54 and the infrared receiver 55 on one wafer tray 5 exactly correspond to the infrared receiver 55 and the infrared emitter 54 on the other wafer tray 5, and the position between the wafer tray 5 inside the conversion robot 4 and the wafer tray 5 on the wafer transfer station 6 can be accurately abutted through the identification of the infrared receiver 55 and the infrared emitter 54, so that the conversion of the position between the wafer tray 5 inside the conversion robot 4 and the wafer tray 5 on the wafer transfer station 6 is greatly facilitated;
the foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.
Claims (10)
1. The utility model provides a horizontal multi-joint robot hand for semiconductor, includes control base (1), and the top surface rotation of control base (1) is connected with swinging boom (2), and the top surface rotation of swinging boom (2) is connected with folding arm (3), its characterized in that:
the top surface of the folding arm (3) is rotatably connected with a conversion robot (4), and a sliding wafer tray (5) is arranged on the inner side of the conversion robot (4);
still include a plurality of wafer transfer station (6), a plurality of wafer transfer station (6) all set up the processing position department at semiconductor wafer (7), and wafer transfer station (6) inboard also is equipped with gliding wafer tray (5), and conversion robot (4) are through changing the position between wafer tray (5) of conversion robot (4) inboard and wafer tray (5) of wafer transfer station (6) inboard come loading and unloading semiconductor wafer (7).
2. The horizontal multi-joint robot for semiconductors according to claim 1, wherein the converting robot (4) comprises a rotating base (41), the bottom surface of the rotating base (41) is rotatably connected with the top surface of the folding arm (3), a connecting arm (42) is fixedly connected to one side of the rotating base (41), and two groups of arc converters (43) are rotatably connected to one end, far away from the rotating base (41), of the connecting arm (42).
3. The horizontal multi-joint robot for semiconductors according to claim 2, wherein a transportation rail (421) is provided at one end of the connecting arm (42) close to the arc-shaped converter (43), a conversion rail (431) is provided at the inner side of the arc-shaped converter (43), station rails (61) are provided at the inner sides of the plurality of wafer transfer stations (6), and rail sliding blocks (51) matched with the transportation rail (421), the conversion rail (431) and the station rails (61) are fixedly connected to one side of the wafer tray (5).
4. A horizontal multi-joint robot for semiconductors according to claim 3, wherein the transportation rail (421), the switching rail (431) and the station rail (61) are connected end to form a complete circle.
5. A horizontal multi-joint robot for semiconductors according to claim 3, characterized in that the connection arms (42) are provided with drive shafts (44) at the junction between the two sets of arc-shaped transducers (43).
6. A horizontal multi-joint robot for semiconductors according to claim 3, wherein the side surface of the connecting arm (42) is provided with a receiving groove which is mutually engaged with the two groups of arc-shaped converters (43).
7. The horizontal multi-joint robot for semiconductors according to claim 1, wherein the bottom of the control base (1) is fixedly connected with a transport base (11).
8. The horizontal multi-joint robot for semiconductors according to claim 4, wherein the inner side and the outer side of the arc-shaped converter (43) and the inner side of the transportation rail (421) are both provided with a driving rail (432), and the inner side of the driving rail (432) is provided with an elastic toothed belt.
9. The horizontal multi-joint robot for semiconductors according to claim 8, wherein the side of the track slider (51) is provided with tooth grooves matching with the elastic tooth belts.
10. The horizontal multi-joint robot for semiconductors according to claim 9, wherein the elastic toothed belt sequentially passes through a driving rail (432) on the outer side and the inner side of one set of arc converters (43), a transporting rail (421), the driving rail (432) on the inner side and the outer side of the other set of arc converters (43) and the inside of the connecting arm (42) to form a ring shape, a driving motor is mounted in the connecting arm (42) at a position close to the elastic toothed belt, a driving gear is fixedly connected to an output shaft of the driving motor, and the driving gear is meshed with the elastic toothed belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311535458.2A CN117253833B (en) | 2023-11-17 | 2023-11-17 | Horizontal multi-joint robot arm for semiconductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311535458.2A CN117253833B (en) | 2023-11-17 | 2023-11-17 | Horizontal multi-joint robot arm for semiconductor |
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| Publication Number | Publication Date |
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| CN117253833A true CN117253833A (en) | 2023-12-19 |
| CN117253833B CN117253833B (en) | 2024-01-30 |
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| CN202311535458.2A Active CN117253833B (en) | 2023-11-17 | 2023-11-17 | Horizontal multi-joint robot arm for semiconductor |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076094A (en) * | 2000-08-31 | 2002-03-15 | Daikin Ind Ltd | Board carrying apparatus |
| KR20150041338A (en) * | 2013-10-08 | 2015-04-16 | 주식회사 엘지실트론 | Appratus for carrying a wafer |
| CN113628991A (en) * | 2021-07-29 | 2021-11-09 | 深圳市星国华先进装备科技有限公司 | Wafer transmission mechanism arm of probe testing machine |
| CN116985159A (en) * | 2023-08-22 | 2023-11-03 | 上海广川科技有限公司 | Manipulator with liftable arm |
-
2023
- 2023-11-17 CN CN202311535458.2A patent/CN117253833B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076094A (en) * | 2000-08-31 | 2002-03-15 | Daikin Ind Ltd | Board carrying apparatus |
| KR20150041338A (en) * | 2013-10-08 | 2015-04-16 | 주식회사 엘지실트론 | Appratus for carrying a wafer |
| CN113628991A (en) * | 2021-07-29 | 2021-11-09 | 深圳市星国华先进装备科技有限公司 | Wafer transmission mechanism arm of probe testing machine |
| CN116985159A (en) * | 2023-08-22 | 2023-11-03 | 上海广川科技有限公司 | Manipulator with liftable arm |
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| CN117253833B (en) | 2024-01-30 |
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