CN117250678A - Microprism processing method and microprism - Google Patents

Microprism processing method and microprism Download PDF

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Publication number
CN117250678A
CN117250678A CN202311034481.3A CN202311034481A CN117250678A CN 117250678 A CN117250678 A CN 117250678A CN 202311034481 A CN202311034481 A CN 202311034481A CN 117250678 A CN117250678 A CN 117250678A
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CN
China
Prior art keywords
prism
wafer
strips
microprism
cross
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Pending
Application number
CN202311034481.3A
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Chinese (zh)
Inventor
田勇
王建军
张严
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Torchlight Dongguan Microoptics Co ltd
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Torchlight Dongguan Microoptics Co ltd
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Application filed by Torchlight Dongguan Microoptics Co ltd filed Critical Torchlight Dongguan Microoptics Co ltd
Priority to CN202311034481.3A priority Critical patent/CN117250678A/en
Publication of CN117250678A publication Critical patent/CN117250678A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/04—Prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/04—Prisms
    • G02B5/045—Prism arrays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

The application relates to the technical field of optical elements, and discloses a microprism processing method and a microprism, wherein the method comprises the following steps: manufacturing a prism wafer, wherein one surface of the prism wafer is a plane, the other surface of the prism wafer is a structural surface with a plurality of grooves arranged along a first direction, the grooves penetrate through the prism wafer along a second direction so as to form a prism protruding structure between any two grooves, the first direction and the second direction are mutually perpendicular, and the height of the prism protruding structure is smaller than that of the prism wafer; fixing the structural surface of the prism wafer on a supporting piece; grinding the plane of the prism wafer until the height of the prism wafer is smaller than or equal to the height of the prism protruding structure, so as to obtain a plurality of prism strips; and cutting the prism strips to obtain a plurality of microprisms. Through the mode, batch processing of the microprisms is realized, and the processing efficiency of the microprisms is improved.

Description

Microprism processing method and microprism
Technical Field
The embodiment of the application relates to the technical field of optical elements, in particular to a microprism processing method and a microprism.
Background
The use of microprisms has been expanding from medical endoscopes to the optical communications industry and current cell phone prisms, etc., and the demand has increased year by year. The surface and the angle of the microprism can meet the requirement of precise light path deflection through precise design and processing, the surface of the microprism has high reflectivity, the optical signal loss can be effectively reduced, and further, the size of the microprism is small, so that the device applying the microprism can maintain relatively compact device size while maintaining precise polarization.
At present, a single prism strip is ground by using a cold working method to obtain a micro prism, but in the prior art, the grinding of the prism strip in a cuboid shape needs to be realized by means of a support of a leaning body, and in order to ensure the precision of the micro prism and the feasibility of a machining process, a leaning body with a relatively large size is generally used, and the prism strip and the leaning body are ground together in the machining process until the prism strip is ground into a right-angle micro prism strip, which leads to low machining efficiency of the micro prism, thereby limiting the yield of the micro prism.
Disclosure of Invention
In view of the above problems, embodiments of the present application provide a method for processing a micro prism and a micro prism, which are used for realizing batch processing of the micro prism, so as to improve the processing efficiency of the micro prism.
According to an aspect of an embodiment of the present application, there is provided a method for processing a microprism, including: manufacturing a prism wafer, wherein one surface of the prism wafer is a plane, the other surface of the prism wafer is a structural surface with a plurality of grooves arranged along a first direction, the grooves penetrate through the prism wafer along a second direction so as to form a prism protruding structure between any two grooves, the first direction and the second direction are mutually perpendicular, and the height of the prism protruding structure is smaller than that of the prism wafer; fixing the structural surface of the prism wafer on a supporting piece; grinding the plane of the prism wafer until the height of the prism wafer is smaller than or equal to the height of the prism protruding structure, so as to obtain a plurality of prism strips; and cutting the prism strips to obtain a plurality of microprisms.
In an alternative, the cross-section of the recess is inverted triangular and the cross-section of the prismatic relief structure is triangular.
In an alternative, the cross-section of the groove is inverted trapezoidal and the cross-section of the prismatic protruding structures is trapezoidal.
In an alternative mode, the optical support flat plate structures are arranged at two ends of the prism wafer along the first direction in an extending mode, wherein the height of each optical support flat plate structure is equal to that of the prism wafer, and each optical support flat plate structure comprises a first surface positioned on the same side as the plane and a second surface positioned on the same side as the structural surface; fixing the structural surface of the prism wafer to a support member, comprising: fixing the structural surface of the prism wafer and the second surfaces of the optical support flat structures at the two ends of the structural surface of the prism wafer together to a support piece; grinding the plane of the prism wafer, comprising: the plane of the prism wafer and the first face of the optical support plate structure are polished.
In an alternative manner, after fabricating the prism wafer, the method further comprises: adhering the structural surface of the prism wafer to a glass plate by using an adhesive; fixing the structural surface of the prism wafer to a support member, comprising: one side of the glass plate facing away from the structural surface of the prism wafer is fixed to the support member.
In an alternative, after adhering the structured face of the prism wafer to a glass plate using an adhesive, the method further comprises: and filling the plurality of grooves with low-temperature wax.
In an alternative way, cutting the plurality of prism slivers to obtain a plurality of microprisms, including: setting the width of the microprism, and setting a first jump distance and a second jump distance of the cutting machine; placing a plurality of prism strips on a cutting machine, and placing a blade of the cutting machine at the starting end of the prism strips and parallel to a gap between any two prism strips; starting a cutting machine to cut a plurality of prism strips and a glass flat plate along a first direction at a first cutter jumping distance; controlling the blade of the cutting machine to move the width of the micro prism in the opposite direction of the first direction, or controlling the blade of the cutting machine to move the width of the micro prism after returning to the initial end, and starting the cutting machine to cut a plurality of prism strips and glass plates at a first jump distance; rotating the blade of the cutter to make the blade of the cutter perpendicular to the cut prism strips; starting a cutting machine to cut the plurality of prism strips and the glass flat plate at a second jump distance, and separating the cut prism strips from the glass flat plate to obtain a plurality of microprisms. In an alternative way, after moving the blade of the cutter by the width of the microprism and starting the cutter to cut the prism strip and the glass sheet at the first jump distance, the method further comprises: and repeatedly executing the steps of controlling the blade of the cutting machine to move the width of the micro-prisms in the reverse direction of the first direction, or controlling the blade of the cutting machine to move the width of the micro-prisms after returning to the starting end, and starting the cutting machine to cut the plurality of prism strips and the glass flat plate at the first jump distance.
In an alternative mode, if the cross section of the groove is an inverted triangle, the cross section of the prism protruding structure is a triangle, and the first jump distance is equal to l 1 Wherein l is 1 Is the length of the base of the triangle; if the cross section of the groove is inverted trapezoid, the cross section of the prism convex structure is trapezoid, and the first jump distance is equal to l 2 +l 3 Wherein l 2 Is the length of the long base of the trapezoid, l 3 Is the length of the short base of the inverted trapezoid.
According to another aspect of the embodiments of the present application, there is provided a microprism that is processed by using the microprism processing method provided in the above embodiments.
According to the embodiment of the application, one surface is a plane, the other surface is the prism wafer with a plurality of grooves and a structural surface of a micro prism protruding structure formed between any two grooves, the structural surface is fixed on a supporting piece, the plane of the prism wafer is ground until the height of the prism wafer is equal to that of the prism protruding structure, a plurality of prism strips are obtained, and finally a plurality of micro prisms are obtained by cutting the plurality of prism strips. By the method, a plurality of microprisms can be obtained by processing one surface of the prism wafer, so that the processing flow is shortened, the processing efficiency of the microprisms is improved, batch processing of the microprisms can be realized, and the yield of the microprisms is remarkably improved.
The foregoing description is only an overview of the technical solutions of the embodiments of the present application, and may be implemented according to the content of the specification, so that the technical means of the embodiments of the present application can be more clearly understood, and the following detailed description of the present application will be presented in order to make the foregoing and other objects, features and advantages of the embodiments of the present application more understandable.
Drawings
The drawings are only for purposes of illustrating embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the figures. In the drawings:
FIG. 1 is a schematic diagram of a conventional microprism strip process;
FIG. 2 is a schematic flow chart of a method for processing microprisms according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a prism wafer according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a prism wafer according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a prism wafer fixed to a support according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a prism wafer according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a prism wafer fixed to a support according to an embodiment of the present disclosure;
FIG. 8 is a schematic flow chart of a method for processing microprisms according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a prism wafer according to an embodiment of the present disclosure;
FIG. 10 is a flow chart of sub-steps of step 140 provided in an embodiment of the present application;
fig. 11 is a schematic structural diagram of a prism wafer according to an embodiment of the present disclosure.
Reference numerals in the specific embodiments are as follows:
10. prism strips; 20. a backrest body;
200. a prism wafer; 210. a plane; 220. a structural surface; 221. a groove; 222. a prismatic projection structure; 230. an optical support plate structure; 231. a first face; 232. a second face;
300. a support;
400. a glass plate.
Detailed Description
Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein.
The use of microprisms has been expanding from medical endoscopes to the optical communications industry and current cell phone prisms, etc., and the demand has increased year by year. The surface and the angle of the microprism can meet the requirement of precise light path deflection through precise design and processing, the surface of the microprism has high reflectivity, the optical signal loss can be effectively reduced, and further, the size of the microprism is small, so that the device applying the microprism can maintain relatively compact device size while maintaining precise polarization.
Because of the small volume of the microprisms, manual operation is relatively inconvenient, and manual wiping of individual microprisms is extremely inefficient and is prone to breakage when the microprism strips are wiped. Thus, in the prior art, individual prismatic bars are processed to produce microprismatic bars using cold working, which refers to a process of mechanically changing the shape and surface state of a glass article without heating, typically including grinding, polishing, cutting, turning, drilling, sanding, and blasting, etc.
Referring to fig. 1 specifically, fig. 1 shows a schematic processing diagram of a conventional micro-prism strip, in which one surface of a rectangular prism strip 10 is adhered to an inclined surface of a leaning body 20 by optical adhesive, so that the prism strip 10 leans against the inclined surface of the leaning body 20, then two right angles of the prism strip 10 facing upwards are polished, and then the leaning body 20 is rotated counterclockwise by 90 ° so that the other two right angles of the prism strip 10 face upwards, so that the two right angles are polished, and finally the micro-prism strip is obtained. In this process, in order to ensure accuracy of the microprisms and feasibility of the processing process, a relatively large-sized support is generally used, and the prism strip 10 and the support 20 are ground together during the processing until the prism strip 10 is ground into a rectangular microprism strip, which results in low processing efficiency of the microprisms, thereby limiting the yield of the microprisms.
Based on this, the embodiment of the application provides a processing method of a micro prism, which is to manufacture a prism wafer with one surface being a plane and the other surface being a structural surface with a plurality of grooves, grind the plane of the prism wafer, and control the height of the prism wafer, so as to obtain a plurality of prism strips, and finally obtain a plurality of micro prisms by cutting the prism strips. By the method, a plurality of microprisms can be obtained by processing one surface of the prism wafer, so that the processing flow is shortened, the processing efficiency of the microprisms is improved, batch processing of the microprisms can be realized, and the yield of the microprisms is remarkably improved.
Fig. 2 is a schematic flow chart of a processing method of a micro prism according to an embodiment of the present application, and fig. 3 and fig. 4 are schematic structural diagrams of a prism wafer according to two embodiments of the present application, where "·" indicates that a y-axis direction is out of a paper surface. As shown in the figure, the microprism processing method includes the steps of:
step 110: the method comprises the steps of manufacturing a prism wafer 200, wherein one surface of the prism wafer 200 is a plane 210, the other surface is a structural surface 220 with a plurality of grooves 221 arranged along a first direction x, the grooves 221 penetrate through the prism wafer 200 along a second direction y so as to form a prism protruding structure 222 between any two grooves 221, the first direction x and the second direction y are perpendicular to each other, and the height of the prism protruding structure 222 is smaller than that of the prism wafer 200.
Wherein the plane 210 may be a polished surface or a roughened surface, and each groove 221 of the plurality of grooves 221 has the same shape. When the plurality of grooves 221 are staggered in sequence along the first direction x, and each groove 221 penetrates through the prism wafer 200 along the second direction y, a prism protruding structure 222 is formed between any two grooves 221, so as to form a structural surface 220 of the prism wafer 200.
The cross-section of the groove 221 and the cross-section of the prism protruding structure 222 may have the same shape or may have different shapes, preferably the same shape, such as a triangle, a trapezoid, etc., wherein the triangle is preferably a right triangle. Specifically, the cross section of the groove 221 may be an inverted triangle as shown in fig. 3, and the cross section of the prism-protrusion structure 222 is a triangle as shown in fig. 3, wherein the inverted triangle and the triangle have the same side length and angle; the cross-section of the groove 221 may also be an inverted trapezoid as shown in fig. 4, and the cross-section of the prism protrusion 222 is a trapezoid as shown in fig. 4, wherein the inverted trapezoid and the trapezoid have the same side length and angle.
In the prism wafer 200, the height H of the prism protruding structures 222 is the dimension thereof along the third direction z, that is, the height from the cross-sectional vertices of the prism protruding structures 222 to the cross-sectional bottom edge, and the height H of the prism wafer 200 is the dimension thereof along the third direction z, that is, the height from the cross-sectional vertices of the prism protruding structures 222 to the plane 210 of the prism wafer 200, and H > H. As can be seen from fig. 3 and 4, the difference (H-H) between the height of the prism wafer 200 and the height of the prism protruding structures 222 in the prism wafer 200 forms a solid portion of the prism wafer 200, and when the prism wafer 200 is manufactured, the solid portion of the prism wafer 200 is polished off, so that the connection between the prism protruding structures 222 is broken.
Step 120: the structured surface 220 of the prism wafer 200 is secured to a support 300.
Referring to fig. 5 specifically, fig. 5 is a schematic structural diagram of fixing a prism wafer to a support, and as shown in the drawing, before polishing a solid portion of the prism wafer 200, the structural surface 220 of the prism wafer 200 needs to be fixed to a support 300, for example, an adhesive disc of a polishing machine, that is, an optical pad, so as to fix the prism wafer 200 when the polishing machine grinds the solid portion of the prism wafer 200. Specifically, taking the cross section of the prism-shaped protrusion 222 as an example, the top edge where the vertex of the cross section of each prism-shaped protrusion 222 is located may be adhered and fixed to the support 300 by an adhesive, and taking the cross section of the prism-shaped protrusion 222 as an example, the top edge where the short bottom edge of the cross section of each prism-shaped protrusion 222 is located may be adhered and fixed to the support 300 by an adhesive, wherein the adhesive preferably uses cold glue.
Step 130: the plane 210 of the prism wafer 200 is polished until the height H of the prism wafer 200 is less than or equal to the height H of the prism raised structures 222, resulting in a plurality of prism strips.
Specifically, the plane 210 of the prism wafer 200 is ground until the height H of the prism wafer 200 is less than or equal to the height H of the prism protruding structures 222, i.e., the solid portion of the prism wafer 200 is ground completely, so that the connection between the prism protruding structures 222 is broken, and a plurality of mutually independent prism protruding structures 222, i.e., a plurality of prism strips, are obtained.
Step 140: and cutting the prism strips to obtain a plurality of microprisms.
After the multiple prism strips are obtained through grinding, the lengths of the multiple prism strips can be cut along the second direction y respectively, and the lengths of all the micro prism strips can be cut along the second direction y at the same time, so that the multiple micro prisms are finally obtained. When the cross section of the prism protruding structure 222 is triangular/right triangle, a plurality of triangular micro prisms/right angle micro prisms can be obtained after the plurality of prism strips are cut, and when the cross section of the prism protruding structure 222 is trapezoid, a plurality of trapezoid micro prisms can be obtained after the plurality of prism strips are cut.
In the embodiment of the invention, a plurality of prism strips are obtained by manufacturing a prism wafer 200 with a plane 210 on one side and a structural surface 220 with a plurality of grooves 221 and micro-prism protruding structures 222 formed between any two grooves 221 on the other side, and fixing the structural surface 220 on a supporting piece 300 to grind the plane 210 of the prism wafer 200 until the height H of the prism wafer 200 is equal to the height H of the prism protruding structures 222, and finally obtaining a plurality of micro-prisms by cutting the plurality of prism strips. In this way, a plurality of microprisms can be obtained by processing one surface of the prism wafer 200, which shortens the processing flow, improves the processing efficiency of the microprisms, and can realize batch processing of the microprisms, thereby remarkably improving the yield of the microprisms.
Optionally, according to some embodiments of the present application, the cross-section of the groove 221 is inverted triangle, and the cross-section of the prism-protruding structure 222 is triangle.
Optionally, in accordance with some embodiments of the present application, the cross-section of the groove 221 is inverted trapezoidal and the cross-section of the prismatic raised structures 222 is trapezoidal.
The specific implementation and beneficial effects of the foregoing embodiments may refer to the foregoing embodiments shown in fig. 2 to 5, and are not repeated herein.
In order to improve the processing precision of the microprism, optionally, referring specifically to fig. 6 and 7, fig. 6 shows a schematic structural diagram of the prism wafer provided in the embodiment of the present application, fig. 7 shows a schematic structural diagram of the prism wafer fixed to the support member provided in the embodiment of the present application, and as shown in the figure, the two ends of the prism wafer 200 along the first direction x are extended and provided with an optical supporting flat structure 230, where the height of the optical supporting flat structure 230 is equal to the height of the prism wafer 200, and the optical supporting flat structure 230 includes a first surface 231 on the same side as the plane 210 and a second surface 232 on the same side as the structural surface 220. The step 120 includes: the structural face 220 of the prism wafer 200 and the second faces 232 of the optical support plate structures 230 at both ends thereof are commonly fixed to the support 300. The step 130 includes: the planar surface 210 of the prism wafer 200 and the first surface 231 of the optical support plate structure 230 are polished.
The fact that the optical support plate structures 230 are disposed on both ends of the prism wafer 200 along the first direction x in an extending manner means that the optical support plate structures 230 are integrated with the prism wafer 200 when the prism wafer 200 is manufactured, and the optical support plate structures 230 may be made of the same material as the prism wafer 200 or a different material from the prism wafer 200, such as hard glass, colorless optical glass, or quartz.
Since the height of the optical supporting plate structure 230 is equal to the height H of the prism wafer 200, when the plane 210 of the prism wafer 200 is placed on a horizontal plane, the plane 210 of the prism wafer 200 and the first surface 231 of the optical supporting plate structure 230 can be simultaneously attached to the horizontal plane, and when the structural surface 220 of the prism wafer 200 is placed on a horizontal plane, taking the cross section of the prism protruding structure 222 as an example, the top edge where the vertex of the cross section of the prism protruding structure 222 is located and the second surface 232 of the optical supporting plate structure 230 can be simultaneously attached to the horizontal plane. In this case, when the structural surface 220 of the prism wafer 200 and the second surface 232 of the optical support plate structure 230 are commonly fixed to the support 300, the optical support plate structure 230 can support the entire prism wafer 200, and the probability of deformation of the prism protruding structures 222 when the plane 210 of the prism wafer 200 is polished can be effectively reduced.
Further, after the structural surface 220 of the prism wafer 200 and the second surface 232 of the optical supporting plate structure 230 are fixed to the supporting member 300 together, when the plane 210 of the prism wafer 200 is polished and the first surface 231 of the optical supporting plate structure 230 is polished together, the optical supporting plate structure 230 can serve as a reference of parallelism, and when the plane 210 of the prism wafer 200 is polished, a plane reference is provided, so that the included angle between the polished surface and the inclined plane of the prism protruding structure 222 is prevented from being changed, the uniformity of each micro prism strip is ensured, and the control of the angle precision of each micro prism is realized.
In order to improve the cutting efficiency of the micro prism strip, according to some embodiments of the present application, optionally, referring to fig. 8 and 9, fig. 8 is a schematic flow chart of a micro prism processing method provided in an embodiment of the present application, and fig. 9 is a schematic structural diagram of a prism wafer provided in an embodiment of the present application. As shown in the figure, the step 110 includes:
step 111: the structured surface 220 of the prism wafer 200 is adhered to a glass plate 400 using an adhesive.
Step 120a: the side of the glass plate 400 facing away from the structured surface 220 of the prism wafer 200 is secured to the support 300.
The adhesive may use a cold glue that does not require heating, has excellent gluing effect and use convenience, and does not damage the structure of the prism wafer 200.
The structural surface 220 of the prism wafer 200 is adhered to the glass plate 400 by an adhesive, taking the cross section of the prism-shaped convex structures 222 as a triangle as an example, that is, the top edge where the vertex of the cross section of each prism-shaped convex structure 222 is located is adhered to one surface of the glass plate 400, so that each prism-shaped convex structure 222 is adhered and fixed to the glass plate 400.
Thereafter, the other side of the glass plate 400, i.e., the side facing away from the structured surface 220 of the prism wafer 200, is fixed to the support 300, and for example, the side of the glass plate 400 facing away from the structured surface 220 of the prism wafer 200 is adhered to the bonding plate of the grinder, i.e., the plane of the optical backing plate, by an adhesive.
In this way, after the connection between the prism wafer 200 and the prism protruding structures 222 is broken, the prism protruding structures 222 can still be fixed on the glass plate 400 through the adhesive, so as to obtain a plurality of prism strips which are orderly arranged on the glass plate 400, so that the width and the length of the prism strips can be cut at the same time, the cutting efficiency of the prism strips is improved, and the processing efficiency of the micro-prisms is further improved.
In order to enhance the fixity between the structural surface 220 of the prism wafer 200 and the glass plate 400, according to some embodiments of the present application, optionally, please continue to refer to fig. 8, the above step 111 further includes: step 112: the plurality of grooves 221 are filled with low-temperature wax.
The low temperature wax may be a polyolefin wax, a microcrystalline wax, a barrier wax, a resin, or the like. Since the bonding area between each prism-protrusion structure 222 and the glass plate 400 is small due to the fact that the bonding effect between each prism-protrusion structure 222 and the glass plate 400 is not strong, low-temperature wax is filled in each groove 221 to serve as a support, and the obtained prism strips cannot fall off from the glass plate 400 after the connection between each prism-protrusion structure 222 is ground and broken, so that the cutting efficiency of the prism strips is ensured.
Further, the low-temperature wax is filled in each groove 221 to serve as a support, so that each prism protruding structure 222 can not generate angular deformation when the plane 210 of the prism wafer 200 is ground, the uniformity of each prism strip is ensured, and the precision of a single micro prism is ensured.
In order to improve the processing efficiency of the microprisms, according to some embodiments of the present application, optionally, referring to fig. 10, fig. 10 is a schematic flow chart of sub-steps of the step 140 provided in the embodiment of the present application, where, as shown in the figure, the step 140 includes the following steps:
step 141: setting the width of the microprism, and setting the first and second jump distances of the cutting machine.
Step 142: and placing the plurality of prism strips on a cutting machine, and placing a blade of the cutting machine at the starting end of the plurality of prism strips and parallel to a gap between any two prism strips.
Step 143: the cutter is activated to cut the plurality of prism slivers and the glass sheet 400 in the first direction x at a first distance of the skip.
Step 144: the cutter blade is controlled to move the width of the micro-prisms in the opposite direction of the first direction x, or the cutter blade is controlled to move the width of the micro-prisms after returning to the starting end, and the cutter is started to cut the plurality of prism strips and the glass flat plate 400 at the first jump distance.
Step 145: the blade of the cutter is rotated so that the blade of the cutter is perpendicular to the cut plurality of prism slivers.
Step 146: starting the cutting machine to cut the prism strips and the glass flat plate 400 at the second jump distance, and separating the cut prism strips from the glass flat plate 400 to obtain a plurality of microprisms.
After the prism wafer 200 is ground to obtain a plurality of prism strips adhered to the glass plate 400, in order to improve the cutting efficiency of the prism strips, the width (i.e., the x-direction dimension) of the micro-prisms, the first jump distance and the second jump distance of the cutting machine are set, so that the cutting machine cuts the plurality of micro-prism strips by the first jump distance and the second jump distance successively, and a plurality of micro-prisms with the width equal to the width of the micro-prisms are obtained, thereby improving the processing efficiency of the micro-prisms.
First, in order to cut the prism strips with different structures to obtain different micro prisms, it is necessary to set different micro prism widths and first jump distances according to the different prism protruding structures 222, and to perform width (i.e., x directionSize), with particular reference to fig. 2 and 3, when the cross-section of the groove 221 is inverted triangle and the cross-section of the prism projection 222 is triangle, the width of the microprism is set to W 1 First jump distance L 1 Length l of base of triangle 1 Triangular microprisms can be obtained after cutting, for example, when the triangle is a right triangle, right-angle microprisms can be obtained after cutting; when the cross section of the groove 221 is an inverted trapezoid and the cross section of the prism projection structure 222 is a trapezoid, the width of the microprism is set to W 2 First jump distance L 2 Length l of long base arranged in trapezoid 2 Length l of short base of inverted trapezoid 3 Sum (l) 2 +l 3 ) And obtaining the trapezoid microprism after cutting. And then, setting different second jump distances according to the structural requirements of different microprisms, and cutting the lengths (namely the y-direction sizes) of the prism strips subjected to the width cutting to obtain the microprisms with different structures. The microprism width of each microprism obtained was the same for the same cut microprism strip.
Next, the plurality of prism strips attached to the glass plate 400 are placed on a cutter, and a blade of the cutter is placed at a start end of the plurality of prism strips, for example, a left inclined surface (for example, a position shown by a point a in the drawing) of a first prism convex structure 222 of the prism wafer 200 counted along the first direction x, and a gap between the blade of the cutter and any two micro prism strips is made parallel. Then, the cutting machine is started to jump a first distance L 1 Or L 2 The plurality of prism slivers and the glass plate 400 are cut in the first direction x until the first round of prism slivers are cut.
Thereafter, the blade of the cutter is controlled to move the micro prism width W in the direction opposite to the first direction x 1 Or W 2 To the right slope of the prismatic raised structure 222 (e.g., the position shown at B in the figure) and then again start the cutter a first distance L 1 Or L 2 Cutting the plurality of prism strips and glass plate 400 in a direction opposite to the first direction x until the second wheel edge is completedCutting of the strips, or controlling the blades of the cutter to return to the starting ends of the strips, and then moving the width W of the prisms 1 Or W 2 To the right slope of the prismatic raised structure 222 (e.g., the position shown at B in the figure) and then again start the cutter a first distance L 1 Or L 2 The plurality of prism slivers and the glass plate 400 are cut in the first direction x until the second round of prism slivers are cut. In the way, after the second round of cutting, the glass plate which is cut into a plurality of mutually independent glass plates and the width of which is the width W of the microprism can be obtained 1 Or W 2 Is provided.
Then, the blade of the cutting machine is rotated to enable the plurality of prism strips and the plurality of glass plates obtained after cutting to be perpendicular to the blade of the cutting machine, the cutting machine is started again to cut the lengths of the plurality of prism strips and the plurality of glass plates at a second jump distance to obtain a plurality of sections of prism strips and glass plates adhered to each section of prism strips, and finally, each section of prism strips and the glass plates adhered to each section of prism strips are separated to obtain a plurality of micro-prism widths W 1 Or W 2 Is a micro prism of (a).
Through setting up the first jump distance of microprism width and cutting machine, can make the cutting machine paste the cutting of width at the rectangular prism that carries out of glass flat 400 to many, obtain the rectangular cutting efficiency of rectangular microprism of preset width to through setting up the second jump distance of cutting machine, make the cutting machine can cut the rectangular length of many prisms simultaneously, obtain a plurality of microprisms, improved microprism's machining efficiency obviously.
To meet the requirements of microprisms of different widths, according to some embodiments of the present application, optionally, step 144 above includes: the above-described step 144 is repeatedly performed.
Referring specifically to fig. 11, fig. 11 is a schematic structural diagram of a prism wafer according to an embodiment of the present application, where the width of the microprism is set to W 3 The first jump distance is L 2 Then, the first and second electrodes are connected,starting the cutting machine from the position shown in the point A by a first jump distance L 2 Cutting the plurality of prism slivers and the glass plate 400 in the first direction x until the cutting of the first round prism slivers is completed, and then controlling the blade of the cutter to move the micro prism width W in the opposite direction of the first direction x 3 Or controlling the cutter blade to return to the initial ends of the prism strips and then moving the prism width W 3 Then the cutting machine is started again from the position shown in the point B by a first jump distance L 2 Cutting the plurality of prism strips and the glass plate 400 along the first direction x or in the opposite direction of the first direction x to complete the cutting of the second round of prism strips … …, in this way, the prism wafers of the different sized prism bulge structures 222 can be repeatedly cut to obtain a width of microprism width W 3 To meet the microprism requirements of different widths. For example, after the cutting machine completes the cutting of the first, second, third and fourth prism slivers in sequence from the positions indicated by points A, B, C and D, each of the slivers may be of width l 2 Is cut into two strips of prism strips having a width of microprism width W 3 Is a microprism strip and a width of the microprism width W 3 A rectangular prism strip, and after cutting the lengths (i.e. the y-direction dimension) of the cut prism strips, finally obtaining a plurality of prism widths W 3 Is a triangular microprism of (c).
Optionally, if the cross section of the groove 221 is inverted triangle, the cross section of the prism protruding structure 222 is triangle, and the first jump distance is equal to l according to some embodiments of the present application 1 Wherein l is 1 Is the base length of the triangle. If the cross section of the groove 221 is inverted trapezoid, the cross section of the prism protruding structure 222 is trapezoid, and the first jump distance is equal to l 2 +l 3 Wherein l 2 Is the length of the long base of the trapezoid, l 3 Is the length of the short base of the inverted trapezoid.
According to still another aspect of the embodiments of the present application, a microprism is provided, where the microprism is obtained by using the microprism processing method provided in the foregoing embodiments.
The specific implementation and beneficial effects of the foregoing embodiments may refer to the foregoing embodiments, and are not repeated herein.

Claims (10)

1. A method of microprism processing, the method comprising:
manufacturing a prism wafer, wherein one surface of the prism wafer is a plane, the other surface of the prism wafer is a structural surface with a plurality of grooves arranged along a first direction, the grooves penetrate through the prism wafer along a second direction so as to form a prism protruding structure between any two grooves, the first direction and the second direction are mutually perpendicular, and the height of the prism protruding structure is smaller than that of the prism wafer;
fixing the structural surface of the prism wafer on a supporting piece;
grinding the plane of the prism wafer until the height of the prism wafer is smaller than or equal to the height of the prism protruding structure, so as to obtain a plurality of prism strips;
and cutting the prism strips to obtain a plurality of microprisms.
2. The method of claim 1, wherein the grooves are inverted triangular in cross-section and the prismatic raised structures are triangular in cross-section.
3. The method of claim 1, wherein the grooves are inverted trapezoids in cross-section and the prismatic raised structures are trapezoids in cross-section.
4. The method of claim 1, wherein the prism wafer is provided with an optical support plate structure extending along both ends of the first direction, wherein the optical support plate structure has a height equal to the height of the prism wafer, and the optical support plate structure includes a first face on the same side as the plane and a second face on the same side as the structural face;
the fixing the structural surface of the prism wafer on a supporting piece comprises the following steps: fixing the structural surface of the prism wafer and the second surfaces of the optical support plate structures at two ends of the structural surface of the prism wafer together to the support piece;
the grinding the plane of the prism wafer includes: the plane of the prism wafer and the first face of the optical support plate structure are polished.
5. The method of claim 1, wherein after the prism wafer is fabricated, the method further comprises: adhering the structural surface of the prism wafer to a glass plate by using an adhesive;
the fixing the structural surface of the prism wafer on a supporting piece comprises the following steps: and fixing one surface of the glass plate, which is away from the structural surface of the prism wafer, on the supporting piece.
6. The method of claim 5, wherein after the adhering the structured surface of the prism wafer to a glass plate using an adhesive, the method further comprises: and filling the grooves with low-temperature wax.
7. The method of claim 5, wherein said cutting a plurality of said prism slivers to obtain a plurality of microprisms, comprises:
setting the width of the microprism, and setting a first jump distance and a second jump distance of the cutting machine;
placing a plurality of prism strips on a cutting machine, and placing a blade of the cutting machine at the starting ends of the prism strips and parallel to gaps between any two prism strips;
starting the cutting machine to cut a plurality of the prism strips and the glass flat plate along the first direction at the first tool-jumping distance;
controlling a blade of the cutting machine to move the width of the micro prism in the direction opposite to the first direction, or controlling the blade of the cutting machine to move the width of the micro prism after returning to the starting end, and starting the cutting machine to cut a plurality of prism strips and the glass flat plate at the first cutter-jumping distance;
rotating the blade of the cutter to make the blade of the cutter vertical to the plurality of the cut prism strips;
and starting the cutting machine to cut the prism strips and the glass plate at the second jump distance, and separating the cut prism strips from the glass plate to obtain a plurality of microprisms.
8. The method of claim 7, wherein after moving the blade of the cutter the micro-prism width and activating the cutter to cut the prism slivers and the glass sheet at the first skip distance, the method further comprises:
and repeatedly executing the steps of controlling the cutter blade to move the micro prism width along the direction opposite to the first direction, or controlling the cutter blade to move the micro prism width after returning to the starting end, and starting the cutter to cut a plurality of prism strips and the glass flat plate at the first cutter-jumping distance.
9. The method of claim 7, wherein if the cross-section of the groove is an inverted triangle, the cross-section of the prismatic protruding structures is a triangle, the first jump distance is equal to l 1 Wherein l is 1 Is the base length of the triangle;
if the cross section of the groove is inverted trapezoid, the cross section of the prism protruding structure is trapezoid, and the first tool-jumping distance is equal to l 2 +l 3 Wherein l 2 Is the length of the long base of the trapezoid, l 3 Is the short base length of the inverted trapezoid.
10. A microprism, characterized in that it is obtained by processing using the microprism processing method according to any one of claims 1 to 9.
CN202311034481.3A 2023-08-16 2023-08-16 Microprism processing method and microprism Pending CN117250678A (en)

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CN202311034481.3A CN117250678A (en) 2023-08-16 2023-08-16 Microprism processing method and microprism

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Application Number Priority Date Filing Date Title
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