JP2943530B2 - Optical connection component and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical connecting component and a method of manufacturing the same, and more particularly, to an optical integrated circuit device and an optical integrated circuit device, an optical integrated circuit device and an optical fiber array, an optical fiber array and an optical fiber array, and the like. The present invention relates to an optical connection component and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the technology of integration in optical devices has been advanced, and researches on optical integration circuits for forming circuits having various functions on one chip and forming optical waveguides connecting the functional circuits have been actively conducted. It has been done. However, what matters here is a technique for connecting optical integrated circuit elements (hereinafter referred to as optical circuit elements) and an optical circuit element to an optical fiber.

Conventionally, in such a connection, a side surface having a waveguide cross section of an element formed as a planar circuit is mirror-polished, aligned while confirming light loss by a fine adjustment table, and fixed by an adhesive or the like. was there.

Further, there has been a method for performing a connection with high accuracy by utilizing anisotropic etching of silicon.

A description will be given below with reference to FIGS. 7 (a) and 7 (b).

As shown in FIGS. 7A and 7B, a V groove 102 for a guide pin and a V
After the groove 103 is formed, the optical fiber 104 is bonded and fixed, and the end face is polished.
2 and the plate spring 106 is bitten and adhered and fixed. A guide pin V-groove 112 and an optical fiber V-groove 113 are also formed on the silicon substrate 111, and the optical fiber 114 is bonded and fixed to the optical fiber V-groove 113 by an optical fiber pressing plate 116, and the end face is polished. A leaf spring 115 is fixed to the silicon substrate 111.

In the optical fiber array 100 and the optical fiber array 110 thus manufactured, the cylindrical rod 10
5 is inserted into the guide pin V-groove 112, the cylindrical rod 10
5 is fixed by being pressed by the leaf spring 115, and the optical fiber 104 and the optical fiber 114 can be positioned (see Japanese Patent Application Laid-Open No. 1-211703).

[0008]

A method for confirming light loss by a fine adjustment table and performing alignment is to dispose an optical circuit element or an optical fiber array on the fine adjustment table with a certain degree of accuracy and to perform fine adjustment with submicron accuracy. There is a problem that it needs to be performed and it takes time for assembly. Further, there is also a problem that the line configuration is difficult for a flow operation when moving to the next step.

Regarding the method of utilizing anisotropic etching of silicon, the material of the cylindrical rod for guiding is mainly stainless steel, which is different from silicon which is often used for a substrate on which an optical integrated circuit is formed or an optical fiber array. And
There was a lack in thermal or mechanical reliability due to differences in elongation / shrinkage and hardness due to heat. Further, in the assembly equipment, there is a problem that the configuration of the equipment becomes complicated because the optical circuit element and the cylindrical rod have completely different shapes. This is a big problem when the future optical device became gradually combine viewed optical circuit element of several millimeters square by micronization.

An object of the present invention is to provide an optical connection component which is easy to assemble, has a simple line configuration, has high thermal reliability, and can be miniaturized, and a method for manufacturing the same.

[0011]

(1) The present invention relates to an optical integrated circuit device having a V-groove formed on a surface on which an optical circuit is formed, and a mirror-finished side having a cross section of the optical waveguide. against the circuit elements, trapezoidal beam is formed in the front portion, the optical circuit is formed in the rear portion, another optical integrated circuit element section of the optical waveguide connected to said optical waveguide are mirror Oite the composed light connecting piece by a, the V groove and the beam of the trapezoidal the optical waveguide each other of the two optical integrated circuit element is connected by matching. Further, at least one of the optical integrated circuit elements is an optical fiber array.

(2) The method for manufacturing an optical connection component according to the present invention comprises:
The substrate material of the two optical integrated circuit elements is silicon, and the V-groove of one of the integrated circuit elements is formed by shaving off the silicon by anisotropic etching using a mask pattern. trapezoidal beams One of the optical integrated circuit element, comprising the step of surrounding the trapezoidal beam of said silicon is formed scraped by anisotropic etching using the mask pattern. Further, the method includes a step in which the mirror surface of the optical waveguide cross section of the optical integrated circuit device having the trapezoidal beam is half-cut by electrolytic grinding and cutting.

[0013]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B are perspective views of a pair of optical circuit elements according to a first embodiment of the present invention. FIG.
(A), (b) is a diagram in which the optical circuit element of FIG. 1 (b) is inverted to make it easier to understand the state before connecting and connecting the components.

In the first embodiment, as shown in FIGS. 1A and 1B, a V-groove 12 and a trapezoidal groove 13 are formed in an optical circuit element 11. The material of the optical circuit element 11 is silicon and V
The groove 12 and the trapezoidal groove 13 are formed by using a mask pattern and shaving off using anisotropic etching of silicon. An optical waveguide 14 is formed in the trapezoidal groove 13. The optical waveguide 14 is obtained by coating a transparent resin. At this time, before coating the transparent resin, the cladding layer 16 is formed by coating with a resin having a lower refractive index than the resin. The upper part of the optical waveguide 14 is coated with a resin having a low refractive index as the cladding layer 16 to complete the optical waveguide 14. The optical waveguide section 15 is mirror-finished by polishing or the like.

An optical waveguide 22 is formed in the optical circuit element 21. This is the simplest configuration, and various other functional circuits are formed in the optical circuit element. The material of the optical circuit element is silicon, and doped SiO ₂ 23 is deposited on the silicon as the optical waveguide 22, and then SiO ₂ 26 is further deposited as a cladding layer. Beams 24 of trapezoidal front side portion of the optical circuit element 21 is formed. The trapezoidal beam 24 is formed by using a mask pattern and shaving off silicon around the trapezoidal beam 24 using anisotropic etching. This step is performed before the optical waveguide 22 is formed.

In connecting the optical circuit element 11 and the optical circuit element 21, it is necessary to minimize the connection loss between the optical waveguide 14 and the optical waveguide 22 by making the cross section 25 a mirror surface. However, it is difficult to polish the cross section 25 of the optical circuit element 21, and here, the electrolytic grinding cutting method is applied. In this method, in the grinding process, an electric field is applied around the blade, and the grinding solution also serving as the electrolytic solution is caused to flow to the cutting portion to prevent clogging of the blade-like grindstone and abrasion of the processed surface, thereby obtaining an excellent mirror surface. be able to. When applying this method,
By placing the edge of blade to the middle of the optical circuit element 21, the cross-section 25 without dividing the optical circuit element 21 can be a mirror surface (IEICE Technical Report VO1.91
NO. 410 Mechanical parts EMC 91-71).

Optical circuit element thus manufactured 11.
And 21 are aligned with the V-groove 12 and the trapezoidal beam 24, and furthermore, are slid side by side so that the optical waveguide 14 and the optical waveguide 22 can be accurately connected.

FIGS. 2A and 2B show FIGS. 1A and 1B, respectively.
It is each sectional drawing of a pair of optical circuit elements. The cross section of the connection at the time of connection is shown for each optical circuit element for easy understanding. Here, for ease of explanation, the illustration is made without the cladding layer 16 and SiO ₂ 26.

As shown in FIGS. 2A and 2B, the centers of the optical waveguides 14 and 22 coincide with each other. Distance and the distance between the optical waveguide 22 between the optical waveguide 14 is equal in 1 _1, V grooves 1
2 and the distance between the trapezoidal beams 24 are equal to 1 ₂ , and the distance between the V-groove 12 and the optical waveguide 14 and the trapezoidal beam 2
4 the distance between the optical waveguide 22 is made equal in 1 _3.
As one method for making the sizes of the optical waveguides 14 and 22 as equal as possible, the width of the optical waveguide 22 is set equal to the width of the bottom of the trapezoidal optical waveguide 14. Trapezoidal beam 2
4, the width of the W ₁ V groove 12 is W 2, the width of the trapezoidal groove 13 is W ₃ , the height of the optical waveguides 14 and 22 is b, and the trapezoidal beam 24 is
Of the height h _1, the optical circuit element 11 from the center of the optical waveguide 22
If the height to the upper side is h ₂ , the angle of V formed by anisotropic etching is 70.52 °, so W ₂ = 2 (h ₂ −b / 2) tan 35.26 ° + W ₁ W ₃ = 2 (h ₂ + b / 2) tan 35.26 ° + a, and it is necessary to satisfy h ₁ > h ₂ −b / 2 in order for the V-groove 12 and the trapezoidal beam 24 to engage without gap. .

FIGS. 3A and 3B show FIGS. 1A and 1B, respectively.
FIG. 4 is a plan view of an example of a mask pattern used for each of the optical circuit elements.

As shown in FIGS. 3A and 3B, the mask pattern 31 is a pattern of the optical circuit element 11, and portions other than the mesh are etched. The gap 32 corresponds to the V-shaped groove 12 and the gap 33 corresponds to the trapezoidal groove 13. Mask pattern 3
Reference numeral 4 denotes a pattern of the optical circuit element 21 , and portions other than the mesh are etched. As a result, the silicon of the pattern 35 remains and the trapezoidal beam 24 is formed. Further, the portion of the pattern 36 remains as a portion where the optical waveguide 22 is formed. In the etched silicon wafer, portions corresponding to the dotted lines of the mask patterns 31 and 34 are cut by dicing to form substrates for the optical circuit elements 11 and 21.

FIGS. 4A and 4B are perspective views of a pair of optical circuit elements according to a second embodiment of the present invention. FIG.
FIGS. 4A and 4B are diagrams in which the optical circuit elements of FIG. 4B are inverted to make it easier to understand the state before connecting the respective elements.

In the second embodiment, as shown in FIGS. 4A and 4B, the material of the optical fiber array 41 is silicon,
The V grooves 42 and 43 are formed by using a mask pattern and shaving off the silicon using anisotropic etching. An optical fiber 44 is fixed to the V groove 43 by an adhesive 45. The optical fiber cross section 46 is mirror-finished by polishing or the like . A trapezoidal beam 54 is formed at the front of the optical fiber array 51. A material likewise silicon of the optical fiber array 51, the trapezoidal beam 54
Is formed by using a mask pattern and shaving off silicon around the trapezoidal beam 54 using anisotropic etching. A V-groove 52 is formed in the rear part of the optical fiber array 51 in the same manner as the V-groove 43. The V-groove 52 is formed by drawing a pattern for the V-groove 52 on a glass mask used for the trapezoidal beam 54 and using the same to etch away the same. V groove 52
The optical fiber 53 is fixed by an adhesive 56.

In connecting the optical fiber array 41 and the optical fiber array 51, it is necessary to minimize the connection loss between the optical fiber 44 and the optical fiber 53 by making the cross section 55 a mirror surface. However, similarly to the first embodiment, it is difficult to polish the cross section 55, and the surface is mirror-finished using electrolytic grinding and cutting. If the fiber arrays 41 and 51 thus produced are aligned by sliding the V-groove 42 and the trapezoidal beam 54 side by side, the optical fiber 4
4 and the optical fiber 53 can be accurately connected.
In the present embodiment, the array fiber can be processed in this manner to form a detachable multi-core optical connector.

FIGS. 5A and 5B show FIGS. 4A and 4B, respectively.
It is each sectional drawing of a pair of optical circuit elements. It is the figure which wrote the cross section of the connection at the time of connection for easy understanding of the element. Naturally, the centers of the optical fibers 44 and 53 coincide.

The distance of FIG. 5 (a), the distance and the distance between the optical fiber 53 between the optical fiber 44 as shown in (b) are equal in 1 _4, the distance between the V grooves 42 and trapezoidal Harima 54 1
₅ , the distance between the V-groove 42 and the optical fiber 44 and the distance between the optical fiber 53 and the trapezoidal beam 54 are equal to ₁₆ . Taking a commonly used optical fiber as an example, the cladding diameter of the optical fibers 44 and 53 is 125 μm. The upper base of the trapezoidal beam 54 is W ₄ , the width of the V groove 42 is W ₅ , the width of the V grooves 43 and 52 is W ₆ , the height of the trapezoidal beam 54 is h ₃ , and the center of the optical fiber 44 is Assuming that the height to the upper side of the optical fiber array is h ₄ , there is a relation of W ₅ = 4h ₄ tan 35.26 ° + W ₄ W ₆ = 62.5 μm / sin 35.26 ° + h _4. platform and beams 54 shape is required to be h _3> 2h ₄ to mesh without gaps.

FIGS. 6A and 6B show FIGS. 4A and 4B, respectively.
FIG. 4 is a plan view of an example of a mask pattern used for each of the optical circuit elements.

As shown in FIGS. 6A and 6B, the mask pattern 61 is a pattern of the optical fiber array 41, and portions other than the mesh are etched. The gap 62 is V
The gap 63 hits the groove 42 and corresponds to the V-shaped groove 43. The mask pattern 64 is a pattern of the optical fiber array 51, and portions other than the mesh are etched. As a result, the silicon of the pattern 65 remains, and the trapezoidal beam 54 and the V-groove 5
Since the two patterns are drawn on the same mask, the trapezoidal beam 54 and the V groove 42 are naturally etched and formed at the same time. In the etched silicon wafer, the portions corresponding to the dotted lines of the mask patterns 61 and 64 are cut by dicing to form the substrates of the optical fiber array 41 and the optical fiber array 51.

In the first and second embodiments, the optical connecting parts for connecting the optical waveguide and the optical fiber array are shown, respectively. As described above, the optical connection parts can be made by setting the respective positions.

[0031]

As described above, according to the present invention, in two optical integrated circuit elements to be connected, a V-groove is formed in one optical circuit element or an optical fiber array, and the V-groove is formed in the other optical circuit element or an optical fiber array. Decided to form a trapezoidal beam for connection, so there was no need to use a fine-tuning table at all, it was easy to assemble, the structure of the equipment was simple, and the material was made of homogeneous silicon high thermal and mechanical reliability, and further, because it is fitted beamed V groove and trapezoid, unlike the case of fitting the case and a circular male and female fitting the male and female rectangular comrades, since no gap (It is not necessary to provide a clearance.) Positioning can be performed with high accuracy, and there is an effect that the size can be reduced when a number of optical integrated circuit elements are to be connected and connected.

[Brief description of the drawings]

FIG. 1 is a perspective view of each of a pair of optical circuit elements according to a first embodiment of the present invention.

FIG. 2 is a sectional view of each of a pair of optical circuit elements of FIG.

FIG. 3 is a plan view of an example of a mask pattern used for each of the optical circuit elements of FIG. 1;

FIG. 4 is a perspective view of a pair of optical fiber arrays according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view of each of the pair of optical fiber arrays of FIG. 4;

FIG. 6 is a plan view of an example of a mask pattern used for each of the optical fiber arrays of FIG. 4;

FIG. 7 is a perspective view of a pair of optical fiber arrays of a conventional optical connection component.

[Explanation of symbols]

11 and 21 the beam of the optical circuit elements 12,42,43,52 V groove 13 trapezoidal grooves 14 and 22 optical waveguide 15 waveguide section 23 doped SiO ₂ 24, 54 trapezoidal 25, 55 cross 26 SiO ₂ 31, 34 , 61, 64 Mask pattern 32, 33, 62 , 63 Gap 35, 36, 65 Pattern 41, 51, 100, 110 Optical fiber array 44, 53, 104, 114 Optical fiber 45, 56 Adhesive 46 Optical fiber cross section 101, 111 Silicon substrate 102,112 V groove for guide pin 103,113 V groove for optical fiber 105 Cylindrical rod 106,115 Leaf spring 107,116 Optical fiber pressing plate

Claims (4)

(57) [Claims] 1. An optical integrated circuit device having a V-groove formed on a surface on which an optical circuit is formed, a side surface having a cross section of an optical waveguide is a mirror surface, and a trapezoidal front portion opposed to the optical integrated circuit device.
-Shaped beam is formed, an optical circuit is formed in the rear part, and another optical integrated circuit element whose optical waveguide connected to the optical waveguide has a mirror-finished cross section.
The Oite, optical connecting parts, characterized in that said optical waveguide each other of the two optical integrated circuit element by the V groove and the beam of the trapezoidal matches are connected. 2. The optical connection component according to claim 1, wherein at least one of said optical integrated circuit elements is an optical fiber array. 3. The substrate of the two optical integrated circuit elements is made of silicon, and the V-groove of one of the integrated circuit elements is formed by shaving off the silicon by anisotropic etching using a mask pattern. in contrast, the comprising the steps trapezoidal beam another optical integrated circuit element, which is formed by shaved off around the trapezoidal beam of the silicon by anisotropic etching using the mask pattern Manufacturing method of optical connection parts. 4. A method for manufacturing an optical connection part, comprising a step of half-cutting a mirror surface of an optical waveguide cross section of an optical integrated circuit device having a trapezoidal beam by electrolytic grinding and cutting.