CN117219531B - Bonding height detection method in heat dissipation cover bonding process - Google Patents
Bonding height detection method in heat dissipation cover bonding process Download PDFInfo
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- CN117219531B CN117219531B CN202311487518.8A CN202311487518A CN117219531B CN 117219531 B CN117219531 B CN 117219531B CN 202311487518 A CN202311487518 A CN 202311487518A CN 117219531 B CN117219531 B CN 117219531B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 157
- 238000000034 method Methods 0.000 title claims abstract description 76
- 230000008569 process Effects 0.000 title claims abstract description 49
- 238000001514 detection method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 200
- 238000005259 measurement Methods 0.000 claims abstract description 75
- 238000007731 hot pressing Methods 0.000 claims abstract description 64
- 239000000853 adhesive Substances 0.000 claims abstract description 58
- 230000001070 adhesive effect Effects 0.000 claims abstract description 56
- 230000005855 radiation Effects 0.000 claims description 43
- 238000001179 sorption measurement Methods 0.000 claims description 31
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Abstract
The invention discloses a bonding height detection method in a heat dissipation cover mounting process, which is suitable for detecting the bonding height of a heat dissipation cover after the heat dissipation cover is bonded to a flip chip, wherein the heat dissipation cover is bonded to the flip chip through an adhesive, the flip chip comprises a substrate and a chip loaded on the substrate, the heat dissipation cover is covered on the chip, and the bonding height detection method in the heat dissipation cover mounting process comprises the following steps: step 1, calculating the thickness of a substrate and the thickness of a chip at a dispensing station through laser measurement; step 2, calculating the thickness of the heat dissipation cover through laser measurement at the mounting station; and 3, measuring the total thickness of the heat dissipation cover to the substrate at the hot pressing station through laser. According to the bonding height detection method in the heat dissipation cover mounting process, the overall height of the substrate, the chip, the heat dissipation cover and the final bonded structure is measured through laser.
Description
Technical Field
The invention relates to the technical field of height detection methods, in particular to a bonding height detection method in a heat dissipation cover mounting process.
Background
The Lid Attach (heat dissipation cover mounting) is a process of semiconductor packaging, and has the functions of connecting the upper surface of the flip chip with the heat dissipation cover through heat conduction glue and fixing the heat dissipation cover and the whole packaging through adhesive; the method comprises the steps of sequentially completing heat dissipation glue spraying or adhesive spraying, attaching a heat dissipation cover and a packaging body through a heat dissipation cover attaching machine, and then placing the heat dissipation cover and the packaging body into an oven for curing; the specific process flow is as follows: firstly, the sealant or the adhesive is dotted on the corresponding area of the flip chip or the heat dissipation cover, then the heat dissipation cover is positioned and placed on the flip chip, finally, the heat dissipation cover and the flip chip are bonded through the sealant or the adhesive, the sealant or the adhesive curing process is carried out after the bonding process is finished, the thickness and the flatness of the flip chip are generally required to meet certain technological requirements, the sealant or the adhesive is generally required to be uniformly coated after the bonding, and finally, the overall flatness is required to meet the technological requirements.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art.
Therefore, the invention provides a bonding height detection method in a heat dissipation cover mounting process, which is used for measuring the overall height of a substrate, a chip, a heat dissipation cover and finally bonded through laser.
According to the embodiment of the invention, the bonding height detection method in the heat dissipation cover mounting process is suitable for detecting the bonding height of the heat dissipation cover after the heat dissipation cover is bonded to the flip chip, wherein the heat dissipation cover is bonded to the flip chip through an adhesive, the flip chip comprises a substrate and a chip loaded on the substrate, the heat dissipation cover is covered on the chip, and the bonding height detection method in the heat dissipation cover mounting process comprises the following steps:
step 1, calculating the thickness of a substrate and the thickness of a chip at a dispensing station through laser measurement;
step 2, calculating the thickness of the heat dissipation cover through laser measurement at the mounting station;
and 3, measuring the total thickness of the heat dissipation cover to the substrate at the hot pressing station through laser.
The invention has the advantages that,
1. measuring the thickness of the substrate, the thickness of the chip, the thickness of the heat dissipation cover and the overall thickness after lamination by laser, and further detecting whether the corresponding thickness meets the process requirement;
2. the thickness uniformity or flatness of the same relevant area is judged by taking a plurality of thickness values in the same relevant area, that is to say, the thickness uniformity of the substrate, the thickness uniformity of the chip, the thickness uniformity of the heat dissipation cover and the thickness uniformity of the whole attached area can be judged, and whether the whole attached flatness meets the process requirement can be detected.
According to one embodiment of the invention, the adhesive is pre-adhered to the chip, and the adhesive adheres the chip and the heat sink cap together.
According to one embodiment of the present invention, the adhesive is pre-adhered to the substrate, the adhesive adheres the substrate and the heat sink cap together, and the chip is wrapped therein, and the adhesive thickness is calculated according to the thickness of the substrate, the thickness of the heat sink cap, and the total thickness of the heat sink cap to the substrate.
According to one embodiment of the present invention, the adhesive is pre-adhered to the chip and the substrate, and when the adhesive adheres the chip, the substrate and the heat sink cap together, the thickness of the adhesive on the substrate is calculated according to the thickness of the substrate, the thickness of the heat sink cap and the total thickness of the heat sink cap to the substrate.
According to one embodiment of the invention, in the step 1, the dispensing station is provided with a jacking mechanism, a base arranged on the jacking mechanism and a jig which can be moved to the upper part of the base and is used for loading the substrate, the base comprises a base edge and a plurality of base bulges, the base edges and the base bulges are arranged in an array manner, the base edge and the base bulges are of an integrated structure, vacuum adsorption holes matched with a vacuum pump are distributed on each base bulge, and during operation, the base is jacked up by the jacking mechanism, and the substrate is adsorbed by the vacuum adsorption holes after the vacuum pump is started.
According to one embodiment of the present invention, the step 1, the step of designating any one of the base protrusions, specifically includes the steps of:
step 1.1,Before the dispensing station operates, the base is lifted to the height during operation, and when the substrate is jacked up and adsorbed by the vacuum adsorption hole, a fixed position A is taken at the edge of the base, the fixed position A is not covered by the jig, and the height value h at the fixed position A is measured by laser Dispensing A ；
Simultaneously, the measuring position except the vacuum adsorption hole is taken out on the base bulge, and the base plate measuring position p for taking the measuring position of the base bulge is shot by a camera Base-substrate The method comprises the steps of carrying out a first treatment on the surface of the And take the chip measuring position p of the protruding measuring position of base through the camera shooting teaching Base-chip Then closing the vacuum, and taking away the substrate;
and measuring the position p of the substrate by laser Base-substrate And chip measurement position p Base-chip Measuring the heights, wherein the height values are h respectively Base-substrate And h Base-chip ；
Step 1.2, when the dispensing station actually operates, the base is lifted to the height of the operating time, and after the substrate is jacked up and adsorbed by the vacuum adsorption hole, the height value h at the fixed position A is measured by laser ’ Dispensing A ；
Substrate measurement position p for calculating pedestal bump measurement position by camera shooting identification Dispensing-substrate And chip measurement position p Dispensing-chip ；
And measuring the position p of the substrate by laser Dispensing-substrate And chip measurement position p Dispensing-chip Measuring the heights, wherein the height values are h respectively ’ Dispensing-substrate And h ’ Dispensing-chip ；
Step 1.3, calculating the actual height h of the base bulge Dispensing-base Corresponding to the thickness value h of the substrate on the base bump Dispensing-substrate And a thickness value h of the chip Dispensing-chip ；
Case one, base bump height actual value h Dispensing-base Measuring the height value h of the position for the pedestal elevation in step 1.1 Base-substrate Plus the height value h at the fixed position A in step 1.2 ’ Dispensing A Subtracting the height value h at the fixed position A in step 1.1 Dispensing A Is the final number of (3);
case two, height actual value h of base bulge Dispensing-base Measuring the height value h of the position for the pedestal elevation in step 1.1 Base-chip Plus the height value h at the fixed position A in step 1.2 ’ Dispensing A Subtracting the height value h at the fixed position A in step 1.1 Dispensing A Is the final number of (3);
calculating the thickness value h of the substrate Dispensing-substrate : thickness value h of substrate Dispensing-substrate For the height value h of the substrate measurement position in step 1.2 ’ Dispensing-substrate Actual value h of height of base boss Dispensing-base Is a difference in (2);
calculating the thickness value h of the chip Dispensing-chip : thickness value h of chip Dispensing-chip Measuring the height value h of the position for the chip in step 1.2 ’ Dispensing-chip Subtracting the actual value h of the height of the base bulge Dispensing-base Subtracting the thickness value h of the substrate Dispensing-substrate Is the final result of (a).
According to one embodiment of the present invention, the step 2 specifically includes the following steps:
step 2.1, before the mounting station operates, the base is lifted to the operating height, the base plate is lifted up and is adsorbed by the vacuum adsorption holes, and the measuring position p of the base plate corresponding to the step 1.2 on the base plate bulge is shot and identified through a downward camera Dispensing-substrate And chip measurement position p Dispensing-chip After the heat dissipation cover is assembled, the camera shoots and identifies the corresponding substrate measuring position p on the heat dissipation cover Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is measured at position p of heat radiation cover Front surface of heat dissipation cover The mounting head sucks the heat radiation cover to move to a preset position, and the heat radiation cover measuring position p are identified through teaching or shooting by an upward camera Front surface of heat dissipation cover Corresponding position p Reverse side of heat dissipation cover Moving the mounting head to align the upward laser with p Reverse side of heat dissipation cover Recording the device coordinate position p Apparatus and method for controlling the operation of a device Then the heat dissipation cover is removed; the mounting head moves to the equipment coordinate position p Apparatus and method for controlling the operation of a device Measuring the mounting head height value h by using laser Mounting head ；
2.2, when the mounting station is running and before the heat dissipation cover is covered on the chip, the upward camera is used for shooting and identifying the heat dissipation cover and the heat dissipation cover measuring position p Reverse side of heat dissipation cover Corresponding position p ’ Reverse side of heat dissipation cover Moving the mounting head to align the upward laser to position p ’ Reverse side of heat dissipation cover Measuring the height value h of the heat dissipation cover by using laser ’ Heat radiation cover ；
Step 2.3, calculating the thickness of the heat dissipation cover, namely calculating the measurement position p of the corresponding substrate Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is a heat dissipation cover thickness h Heat radiation cover : corresponding to the thickness h of the heat dissipation cover Heat radiation cover For the height h of the heat radiation cover ’ Heat radiation cover And the mounting head height value h Mounting head Is a difference in (c).
According to an embodiment of the present invention, in the step 3, the method specifically includes the following steps:
step 3.1, before the operation of the hot pressing station, lifting the base to the height during operation, and simultaneously taking a fixed position B at the edge of the base when the base is jacked up and adsorbed by the vacuum adsorption hole, wherein the fixed position B is not covered by the jig, and measuring the height value h at the fixed position B by laser Hot pressing B ；
Shooting and identifying the position of the heat dissipation cover of the workpiece by using a camera, then calculating the position of the mounting station corresponding to the height measurement on the heat dissipation cover, taking away the substrate after vacuum suction is closed, and then moving the laser to the corresponding position to measure the height value h at the position corresponding to the base Hot pressing base ；
Step 3.2, when the hot pressing station is operated, namely when the workpiece is jacked up and is adsorbed by the vacuum adsorption hole, controlling the laser to move to a fixed position B, and measuring the height value h at the fixed position B ’ Hot pressing B ；
The position of the heat radiation cover of the workpiece is identified by shooting with a camera, and then the mounting station is calculatedCorresponding to the height measurement position of the heat radiation cover, measuring the height value h at the height measurement position ’ Hot-pressing heat-dissipating cover ；
Step 3.3, calculating the actual height h of the base bulge Hot press-base bump ：
Actual value h of height of base boss Hot press-base bump Is the height value h corresponding to the base position in the 3.1 step Hot pressing base Plus the height value h at the fixed position B in step 3.2 ’ Hot pressing B Subtracting the height value h at the fixed position B in step 3.1 Hot pressing B Is the final number of (3);
calculating the actual value h of the total thickness from the heat radiating cover to the substrate Hot pressing assembly ：
In case one, when the adhesive adheres to the periphery of the heat dissipating cover, the actual value h of the total thickness of the heat dissipating cover to the substrate Hot pressing assembly The height value h of the mounting station corresponding to the height measurement position on the heat radiation cover in the 3.2 step ’ Hot-pressing heat-dissipating cover Subtracting the actual value h of the height of the base bump in the 3.3 rd step Hot press-base bump ；
In case two, when the adhesive adheres to the inside of the heat dissipating cover, the actual value h of the total thickness of the heat dissipating cover to the substrate Hot pressing assembly Thickness h of the substrate Dispensing-substrate And a heat dissipation cover thickness h Heat radiation cover And (3) summing.
According to one embodiment of the invention, when the adhesive is tightly attached between the substrate and the heat dissipating cover, the thickness of the adhesive is the final result of subtracting the thickness value of the corresponding substrate from the actual thickness value of the heat dissipating cover to the substrate and subtracting the thickness value of the heat dissipating cover from the thickness value of the corresponding substrate.
According to one embodiment of the invention, the height measurement positions of the dispensing station, the mounting station and the hot pressing station are identified by camera shooting and have a corresponding relationship, namely the total height of the base, the chip and the heat dissipation cover after being attached to the flip chip is measured at the same plane position on the base or the chip respectively.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a schematic view of a dispensing station;
FIG. 3 is a schematic illustration of height position measurement at a dispensing station;
fig. 4 is a schematic view of the mounting head sucking the heat dissipating cover;
fig. 5 is a schematic view of a structure in which a heat dissipating cover is attached to a substrate.
The reference numerals in the figures are: 1. a substrate; 2. a heat-dissipating cover; 3. an adhesive; 4. a chip; 5. a base; 51. a base edge; 52. the base is convex; 6. a jig; 7. a mounting head; 8. a vacuum adsorption tank; 9. vacuum adsorption holes; 10. and the laser height measuring device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "one side", "the other side", "the two sides", "the middle", "the upper end", "the lower end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, directly connected, or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The following specifically describes a bonding height detection method in a heat dissipating cover mounting process according to an embodiment of the present invention with reference to the accompanying drawings.
Referring to fig. 1, 2, 3, 4 and 5, the bonding height detection method in the heat dissipation cover mounting process of the present invention is suitable for height detection after the heat dissipation cover 2 is bonded to a flip chip, the heat dissipation cover 2 is bonded to the flip chip through an adhesive 3, the flip chip includes a substrate 1 and a chip 4 loaded on the substrate 1, and the heat dissipation cover 2 is covered on the chip 4. The adhesive 3 refers to a liquid and paste adhesive, and is in a state after the dispensing operation by the dispensing valve only when the adhesive has not passed through the curing stage.
The method for detecting the bonding height involves three stations, namely a dispensing station, a mounting station and a hot pressing station. The height measurement positions of the dispensing station, the mounting station and the hot pressing station are identified through camera shooting and have corresponding relations, namely the positions of the same plane on the base plate 1 or the chip 4 are respectively measured to be the total height of the base plate 5, the base plate 1, the chip 4 and the heat dissipation cover 2 after being attached to the flip chip, then the thickness of the relevant parts is calculated, and the calculation accuracy is ensured, and the method specifically comprises the following steps:
step 1, calculating the thickness of a substrate and the thickness of a chip at a dispensing station through laser measurement, and further detecting whether the thickness of the substrate meets the process requirements or not and whether the thickness of the chip meets the process requirements or not;
step 2, calculating the thickness of the heat dissipation cover through laser measurement at the mounting station, and further detecting whether the thickness of the heat dissipation cover meets the process requirements;
and 3, measuring the total thickness of the heat dissipation cover 2 to the substrate 1 at the hot-pressing station through laser, and further detecting whether the total thickness of the heat dissipation cover 2 to the substrate 1 meets the process requirement.
The positions of the samples in the 1 st, 2 nd and 3 rd steps need to be kept as uniform as possible by visual guidance recognition. By taking a reference point on the base 5, the corresponding substrate thickness and total thickness are calculated during operation.
The adhesive 3 is adhered by the following three processes:
the first process mode, adhesive 3, is pre-adhered to the chip 4, and the adhesive 3 adheres the chip 4 and the heat dissipating cover 2 together. This process does not allow calculation of adhesive thickness.
In the second process, the adhesive 3 is pre-adhered to the substrate 1, the adhesive 3 adheres the substrate 1 and the heat dissipation cover 2 together, and the chip 4 is wrapped therein, so that the thickness of the adhesive can be calculated according to the thickness of the substrate, the thickness of the heat dissipation cover and the total thickness from the heat dissipation cover 2 to the substrate 1, and whether the thickness of the adhesive meets the process requirement is detected.
In the third process, the adhesive 3 is pre-adhered to the chip 4 and the substrate 1, and when the adhesive 3 adheres the chip 4, the substrate 1 and the heat dissipation cover 2 together, the thickness of the adhesive on the substrate 1 can be calculated according to the thickness of the substrate, the thickness of the heat dissipation cover and the total thickness of the heat dissipation cover 2 to the substrate 1, so as to detect whether the thickness of the adhesive meets the process requirement.
Referring to fig. 2, the dispensing station is provided with base protrusions 52, vacuum adsorption holes are distributed on the base protrusions 52, and during operation, the base protrusions 52 are jacked up by a jacking mechanism and adsorb the substrate 1 by starting vacuum adsorption, namely, close adhesion between the base 5 and the substrate 1 is ensured by vacuum adsorption. Specifically, in step 1, the dispensing station is provided with a jacking mechanism, a base 5 mounted on the jacking mechanism, and a jig 6 capable of being moved to the upper side of the base 5 and used for loading the substrate 1, the base 5 comprises a base edge 51 and a plurality of base protrusions 52, the plurality of base protrusions 52 are arrayed, the base edge 51 and the base protrusions 52 are of an integrated structure, vacuum adsorption grooves 8 and vacuum adsorption holes 9 matched with a vacuum pump are distributed on the base protrusions 52, during operation, the base 5 is jacked up through the jacking mechanism, and the substrate 1 is adsorbed through the vacuum adsorption grooves 8 and the vacuum adsorption holes 9 after the vacuum pump is started. Preferably, the base bulge 52 is square, the vacuum adsorption groove 8 is in an x-shaped structure, four ends of the vacuum adsorption groove 8 are in one-to-one correspondence with four corners of the base bulge 52, the base bulge 52 is provided with four vacuum adsorption holes 9, the four vacuum adsorption holes 9 are positioned at the four ends of the vacuum adsorption groove 8, and the vacuum adsorption holes 9 are round holes.
Referring to fig. 3, step 1, calculating the thickness of the substrate and the thickness of the chip at the dispensing station by laser measurement, and designating any one of the base bumps 52 specifically includes the steps of:
step 1.1, before the dispensing station is operated, the base 5 is lifted to the height of operation, and when the substrate 1 is lifted up and sucked by the vacuum suction hole 9, a fixed position a is taken at the edge 51 of the base, see fig. 2, the fixed position a is not covered by the jig 6, of course, the fixed position a is also not covered by the substrate 1, the laser height measuring device 10 is moved to the position 1 shown in fig. 3, and the height h at the fixed position a is measured by the laser height measuring device 10 Dispensing A ；
At the same time, the measuring position except the vacuum adsorption hole 9 is taken out on the base bulge 52, and the substrate measuring position p for taking out the measuring position of the base bulge is photographed by a camera Base-substrate The method comprises the steps of carrying out a first treatment on the surface of the And take the chip measuring position p of the protruding measuring position of base through the camera shooting teaching Base-chip Then the vacuum is closed, and the substrate 1 is taken away;
the laser height measuring device 10 is moved to the position 2 shown in fig. 3, and the position p is measured on the substrate by the laser height measuring device 10 Base-substrate And chip measurement position p Base-chip Height of the processMeasuring, the height values are h respectively Base-substrate And h Base-chip ；
The other base projections 52 calculate the corresponding substrate measurement positions p by camera shooting recognition Base-substrate And chip measurement position p Base-chip Measuring the position p of the substrate by means of a laser Base-substrate And chip measurement position p Base-chip Height measurement is carried out to obtain height values of corresponding positions on different base bulges 52;
step 1.2, when the dispensing station actually operates, the base 5 is lifted to the height of the operating time, and after the substrate 1 is jacked up and sucked by the vacuum suction holes 9, the height h at the fixed position A is measured by the laser height measuring device 10 ’ Dispensing A ；
Substrate measurement position p for calculating pedestal bump measurement position by camera shooting identification Dispensing-substrate And chip measurement position p Dispensing-chip ；
And measuring the position p of the substrate by laser Dispensing-substrate And chip measurement position p Dispensing-chip Measuring the heights, wherein the height values are h respectively ’ Dispensing-substrate And h ’ Dispensing-chip . Specifically, the laser height measurement device 10 is moved to the position 3 shown in fig. 3, and the substrate measurement position p is measured by the laser height measurement device 10 Dispensing-substrate Height value h at ’ Dispensing-substrate The method comprises the steps of carrying out a first treatment on the surface of the At the same time, the laser altimeter 10 is moved to the position 4 shown in fig. 3, and the chip measurement position p is measured by the laser altimeter 10 Dispensing-chip Height value h at ’ Dispensing-chip ；
Step 1.3, calculating the actual height h of the pedestal elevation 52 Dispensing-base Corresponding to the thickness h of the substrate 1 on the base bump 52 Dispensing-substrate Thickness value h of chip 4 Dispensing-chip ；
Case one, calculate the actual value h of the height of the pedestal elevation 52 Dispensing-base : actual value h of height of base boss 52 Dispensing-base Measuring the height value of the position for the pedestal elevation 52 in step 1.1h Base-substrate Plus the height value h at the fixed position A in step 1.2 ’ Dispensing A Subtracting the height value h at the fixed position A in step 1.1 Dispensing A Is the final number of (3); the specific calculation formula is as follows:
h dispensing-base =h Base-substrate +h ’ Dispensing A -h Dispensing A （1）
In case two, the actual value h of the height of the base boss 52 is calculated Dispensing-base : actual value h of height of base boss 52 Dispensing-base Measuring the height h of the position for the base bump 52 in step 1.1 Base-chip Plus the height value h at the fixed position A in step 1.2 ’ Dispensing A Subtracting the height value h at the fixed position A in step 1.1 Dispensing A Is the final number of (3); the specific calculation formula is as follows:
h dispensing-base =h Base-chip + h ’ Dispensing A -h Dispensing A （2）
Calculating the thickness value h of the substrate 1 Dispensing-substrate : thickness value h of substrate 1 Dispensing-substrate Measuring a height value h of a position for the substrate 1 in step 1.2 ’ Dispensing-substrate Actual value h of height with base boss 52 Dispensing-base Is a difference in (2); the specific calculation formula is as follows:
h dispensing-substrate =h ’ Dispensing-substrate -h Dispensing-base （3）
Calculating the thickness value h of the chip 4 Dispensing-chip : thickness value h of chip 4 Dispensing-chip Measuring the height value h of the location for the chip 4 in step 1.2 ’ Dispensing-chip Subtracting the actual value h of the height of the base projection 52 Dispensing-base Subtracting the thickness value h of the substrate 1 Dispensing-substrate Is the final number of (3); the specific calculation formula is as follows:
h dispensing-chip =h ’ Dispensing-chip -h Dispensing-base -h Dispensing-substrate （4）
The lasers in step 1.1 and step 1.2 are lasers at the same height position and are downward-emitting lasers, i.e. height h Dispensing A 、h Base-substrate 、h Base-chip 、h ’ Dispensing A 、h ’ Dispensing-substrate And h ’ Dispensing-chip All laser measurements were made at the same height position.
After the thicknesses of the substrates are calculated by sampling at a plurality of positions on the workpiece, the thicknesses and the flatness of the substrates can be judged according to the process requirements, namely whether the deviation of the thickness values of all the positions is within a certain range or not, and whether the process requirements are met or not.
In the same way, after sampling and calculating a plurality of thicknesses at a plurality of positions on the chip 4, the thickness and the flatness of the chip can be judged according to the process requirements, namely whether the deviation of the thickness values at all positions is within a certain range or not, and whether the process requirements are met or not.
Step 2, calculating the thickness of the heat dissipation cover by laser measurement at a mounting station, and specifically comprising the following steps:
before the operation of the mounting station, step 2.1, firstly, the base 5 is lifted to the height of the operation, meanwhile, the substrate 1 is jacked up and sucked by the vacuum suction holes 9, and the substrate measuring position p corresponding to the step 1.2 on the base bulge 52 is identified by shooting the downward camera Dispensing-substrate And chip measurement position p Dispensing-chip After the heat radiation cover 2 is assembled, the camera shoots and identifies the corresponding substrate measuring position p on the heat radiation cover 2 Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is measured at position p of heat radiation cover Front surface of heat dissipation cover The mounting head 7 sucks the heat dissipating cover 2 to move to a preset position, recognizes the heat dissipating cover measurement position p on the heat dissipating cover 2 by teaching or by photographing with an upward camera Front surface of heat dissipation cover Corresponding position p Reverse side of heat dissipation cover The mounting head 7 is moved to align the upward laser beam p Reverse side of heat dissipation cover Recording the device coordinate position p Apparatus and method for controlling the operation of a device Subsequently, the heat radiation cover 2 is removed; the mounting head 7 moves to the device coordinate position p Apparatus and method for controlling the operation of a device Measuring the mounting head height value h by using laser Mounting head ；
The heat dissipation cover 2 includes a cover body 21 and a cover edge 22, the cover body 21 corresponds to the chip 4 on the substrate 1, and the cover body 21 and the cover edge 22 are in an integrated structure. The height to be measured on the heat dissipation cover 2 is divided into two groups, one group is the height of the cover body 21, and the other group is the height of the cover edge 22.
Step 2.2, when the mounting station is operated, and before the heat dissipation cover 2 is covered on the chip 4, that is, after the workpiece after the glue is dispensed by the previous dispensing station flows to the mounting station, the upward camera is used for shooting and identifying the measuring position p of the heat dissipation cover 2 and the heat dissipation cover Reverse side of heat dissipation cover Corresponding position p ’ Reverse side of heat dissipation cover The mounting head 7 is moved to align the upward laser beam at the position p ’ Reverse side of heat dissipation cover Measuring the height value h of the heat dissipation cover by using laser ’ Heat radiation cover ；
Step 2.3, calculating the thickness of the heat dissipation cover, namely calculating the measurement position p of the corresponding substrate Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is a heat dissipation cover thickness h Heat radiation cover : corresponding to the thickness h of the heat dissipation cover Heat radiation cover For the height h of the heat radiation cover ’ Heat radiation cover And the mounting head height value h Mounting head Is a difference in (2); the specific calculation formula is as follows:
h heat radiation cover =h ’ Heat radiation cover -h Mounting head （5）
After a plurality of positions on the heat dissipation cover 2 are sampled and calculated, the thickness and the flatness of the heat dissipation cover can be judged according to the process requirements, namely whether the deviation of the thickness values of all the positions is within a certain range or not, and whether the process requirements are met or not.
The lasers in step 2.1 and step 2.2 are lasers at the same height position and are upwardly emitting lasers, i.e. height value h Mounting head And h ’ Heat radiation cover All laser measurements were made at the same height position.
In the step 3, the total thickness of the heat dissipation cover 2 to the substrate 1 is measured at the hot pressing station by laser, and specifically comprises the following steps:
step 3.1, before the operation of the hot pressing station, the base 5 is lifted to the height of the operation, and the base plate 1 (covered with the heat dissipation cover 2) is jacked up and vacuum absorbed by the vacuum absorption holes9, a fixed position B is taken at the base edge 51, see FIG. 2, the fixed position B is not covered by the jig 6, and the height h at the fixed position B is measured by laser Hot pressing B ；
Shooting and identifying the position of the heat dissipation cover 2 of the workpiece by using a camera, then calculating the position of the mounting station corresponding to the height measurement on the heat dissipation cover 2, taking the substrate 1 away after vacuum suction is closed, and then moving the laser to the corresponding position to measure the height value h at the position corresponding to the base Hot pressing base ；
The method for calculating the height measurement position of the mounting station corresponding to the heat radiation cover 2 comprises the following steps: the method is characterized in that the method comprises the steps of visually recognizing, photographing a picture with a heat radiation cover 2 chip in advance, setting a position point on the picture according to the height measurement positions of the two previous stations, calculating offset and rotation angle of the position point by recognizing the heat radiation cover 2 in the operation process, and calculating the position of the current position point according to affine transformation. It should be noted that some height measurement positions may require synchronization of different stations, for example: the dispensing station measures the height at the chip position P, the mounting station also needs to measure the thickness of the heat-dissipating cover 2 at a more or less position before the heat-dissipating cover 2 is not assembled, and the total height of the heat-dissipating cover 2 needs to be measured at a corresponding position to the hot-pressing station, and the positions are generally corresponding through visual identification and teaching.
Step 3.2, when the hot pressing station is operated, that is, after the workpiece is jacked up and sucked by the vacuum suction hole 9, that is, after the workpiece flow corresponding to the mounting station is transferred to the hot pressing station, the laser is controlled to move to the fixed position B, and the height h of the fixed position B is measured ’ Hot pressing B ；
Shooting and identifying the position of the heat radiation cover 2 of the workpiece by using a camera, then calculating the position of the mounting station corresponding to the height measurement on the heat radiation cover 2, and measuring the height value h at the height measurement position ’ Hot-pressing heat-dissipating cover ；
Step 3.3, calculating the actual height h of the pedestal elevation 52 Hot press-base bump ：
Actual value h of height of base boss 52 Hot press-base bump Is at the position corresponding to the base in the 3.1 th stepHeight value h of (2) Hot pressing base Plus the height value h at the fixed position B in step 3.2 ’ Hot pressing B Subtracting the height value h at the fixed position B in step 3.1 Hot pressing B Is the final number of (3); the specific calculation formula is as follows:
h hot press-base bump =h Hot pressing base +h ’ Hot pressing B -h Hot pressing B （6）
Calculating the actual value h of the total thickness of the heat dissipation cover 2 to the substrate 1 Hot pressing assembly ：
Case one, when the adhesive 3 adheres to the periphery of the heat dissipation cover 2, then the actual value h of the total thickness of the heat dissipation cover 2 to the substrate 1 Hot pressing assembly The height value h of the mounting station corresponding to the height measurement position on the heat dissipation cover 2 in the 3.2 step ’ Hot-pressing heat-dissipating cover Subtracting the actual value h of the height of the pedestal elevation 52 in step 3.3 Hot press-base bump The method comprises the steps of carrying out a first treatment on the surface of the The specific calculation formula is as follows:
h hot pressing assembly =h ’ Hot-pressing heat-dissipating cover -h Hot press-base bump （7）
In case two, when the adhesive 3 adheres to the inside of the heat dissipation cover 2, the total thickness of the heat dissipation cover 2 to the substrate 1 is an actual value h Hot pressing assembly Is the sum of the thickness of the substrate and the thickness of the heat dissipation cover, namely h Dispensing-substrate And h Heat radiation cover And (3) summing; the specific calculation formula is as follows:
h hot pressing assembly =h Dispensing-substrate +h Heat radiation cover （8）
The lasers in the 3.1 st and 3.2 nd steps are lasers at the same height position and are downward-emitting lasers. I.e. height value h Hot pressing B 、h Hot pressing base 、h ’ Hot pressing B And h ’ Hot-pressing heat-dissipating cover All laser measurements were made at the same height position.
And carrying out relevant calculation and detection according to the positions of the mounting station measuring points and the dispensing positions. The positions of the mounting station measuring points are as follows: such as the position of the cover body 21 and the position of the cover rim 22 in the heat dissipating cover 2. Unless otherwise specified, the calculated data is taken to correspond to the same workpiece and the same location. The pre-heat press data and the post-heat press data are used for calculating the corresponding dispensing thickness and flatness in the same way. The data after hot pressing is the final data, and is usually taken for calculation.
When the adhesive 3 is adhered by the above second and third processes, and when the adhesive 3 is closely adhered between the substrate 1 and the heat dissipation cover 2, the adhesive thickness h Adhesive agent For the actual value h of the total thickness of the heat-dissipating cover 2 to the substrate 1 Hot pressing assembly Subtracting the thickness value h of the corresponding substrate 1 of the workpiece Dispensing-substrate Subtracting the thickness h of the heat dissipating cover 2 Heat radiation cover The method comprises the steps of carrying out a first treatment on the surface of the The specific calculation formula is as follows:
h adhesive agent =h Hot pressing assembly -h Dispensing-substrate -h Heat radiation cover （9）
After sampling and calculating at a plurality of positions on the workpiece, the thickness and the flatness of the adhesive can be judged according to the process requirements, namely whether the deviation of thickness values at all positions is within a certain range or not, and whether the process requirements are met or not.
In addition, for the convenience of understanding, before the dispensing station actually operates, when the number of measurement positions excluding the vacuum suction holes 9 on one base bump 52 is set to N, where N is a positive integer greater than or equal to 1, the substrate measurement position p of the measurement position of the base bump is photographed by a camera Base-substrate The number of the base projections is N, and the chip measurement positions p of the base projection measurement positions are taught through camera shooting Base-chip Also N in number. When the dispensing station actually operates, the base plate measuring position p of the base plate protrusion measuring position is calculated through camera shooting identification Dispensing-substrate Number of (d) and chip measurement position p Dispensing-chip The number of (2) is N. At the same time, before the mounting station operates, the camera shoots and identifies the corresponding substrate measuring position p on the heat radiating cover 2 Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is measured at position p of heat radiation cover Front surface of heat dissipation cover Also N in number; identifying the measured position p of the heat sink cover 2 and the heat sink cover by teaching or shooting with an upward facing camera Front surface of heat dissipation cover Corresponding position p Reverse side of heat dissipation cover Also N, the recorded device coordinate positions p Apparatus and method for controlling the operation of a device Also N in number. And, during the operation of the mounting station, the upward camera is used for shooting and identifying the measuring position p of the heat dissipation cover 2 and the heat dissipation cover Reverse side of heat dissipation cover Corresponding position p ’ Reverse side of heat dissipation cover Also N in number. And at the hot pressing station, the number of positions of the mounting station corresponding to the height measurement on the heat dissipation cover 2 is calculated to be N after the positions of the heat dissipation cover 2 of the workpiece are shot and identified by using a camera. The positions mentioned above are uniform and correspond to one another.
According to the bonding height detection method in the heat dissipation cover mounting process, the thickness of the substrate, the thickness of the chip, the thickness of the heat dissipation cover and the overall thickness after bonding are measured through laser, so that whether the corresponding thickness meets the process requirement is detected; the thickness uniformity or flatness of the same relevant area is judged by taking a plurality of thickness values in the same relevant area, that is to say, the thickness uniformity of the substrate, the thickness uniformity of the chip, the thickness uniformity of the heat dissipation cover and the thickness uniformity of the whole attached area can be judged, and whether the whole attached flatness meets the process requirement can be detected.
The present invention is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present invention and the inventive concept thereof, can be replaced or changed within the scope of the present invention.
Claims (8)
1. The utility model provides a laminating height detection method among heat dissipation lid mounting technology, is applicable to the high detection after laminating heat dissipation lid (2) in flip-chip, laminate through adhesive (3) between heat dissipation lid (2) and the flip-chip, flip-chip includes base plate (1) and loads chip (4) on base plate (1), heat dissipation lid (2) cover is in on chip (4), its characterized in that:
the bonding height detection method in the heat dissipation cover mounting process comprises the following steps of:
step 1, calculating the thickness of a substrate and the thickness of a chip at a dispensing station through laser measurement; the dispensing station is provided with a jacking mechanism, a base (5) arranged on the jacking mechanism and a jig (6) which can be moved to the upper part of the base (5) and is used for loading the substrate (1), the base (5) comprises a base edge (51) and a plurality of base bulges (52), the base edges (51) and the base bulges (52) are arranged in an array mode, the base bulges (52) are of an integrated structure, vacuum adsorption holes (9) matched with a vacuum pump are distributed on each base bulge (52), and during operation, the base (5) is jacked up through the jacking mechanism, and the substrate (1) is adsorbed through the vacuum adsorption holes (9) after the vacuum pump is started; designating any one base boss (52), specifically comprising the steps of:
step 1.1, before the dispensing station operates, the base (5) is lifted to the height when in operation, and when the substrate (1) is jacked up and is adsorbed by the vacuum adsorption hole (9), a fixed position A is taken at the edge (51) of the base, the fixed position A is not covered by the jig (6), and the height value h at the fixed position A is measured by laser Dispensing A ；
Meanwhile, the measuring position except the vacuum adsorption hole (9) is taken out on the base bulge (52), and the base plate measuring position p for taking the measuring position of the base bulge is shot by a camera Base-substrate The method comprises the steps of carrying out a first treatment on the surface of the And take the chip measuring position p of the protruding measuring position of base through the camera shooting teaching Base-chip Then closing the vacuum and taking away the substrate (1);
and measuring the position p of the substrate by laser Base-substrate And chip measurement position p Base-chip Measuring the heights, wherein the height values are h respectively Base-substrate And h Base-chip ；
Step 1.2, when the dispensing station actually operates, the base (5) is lifted to the height during operation, and after the substrate (1) is jacked up and adsorbed by the vacuum adsorption holes (9), the height value h at the fixed position A is measured by laser ’ Dispensing A ；
Base plate measuring position for calculating base boss measuring position through camera shooting identificationPut p Dispensing-substrate And chip measurement position p Dispensing-chip ；
And measuring the position p of the substrate by laser Dispensing-substrate And chip measurement position p Dispensing-chip Measuring the heights, wherein the height values are h respectively ’ Dispensing-substrate And h ’ Dispensing-chip ；
Step 1.3, calculating the actual value h of the height of the pedestal elevation (52) Dispensing-base A thickness value h corresponding to the substrate (1) on the base bump (52) Dispensing-substrate And a thickness value h of the chip (4) Dispensing-chip ；
Case one, actual value h of height of base bump (52) Dispensing-base Measuring the height h of the position for the base projection (52) in step 1.1 Base-substrate Plus the height value h at the fixed position A in step 1.2 ’ Dispensing A Subtracting the height value h at the fixed position A in step 1.1 Dispensing A Is the final number of (3);
case two, actual value h of height of base bump (52) Dispensing-base Measuring the height h of the position for the base projection (52) in step 1.1 Base-chip Plus the height value h at the fixed position A in step 1.2 ’ Dispensing A Subtracting the height value h at the fixed position A in step 1.1 Dispensing A Is the final number of (3);
thickness value h of substrate (1) Dispensing-substrate Measuring the height value h of the position for the substrate (1) in step 1.2 ’ Dispensing-substrate Actual value h of height with base boss (52) Dispensing-base Is a difference in (2);
thickness value h of chip (4) Dispensing-chip Measuring the height value h of the location for the chip (4) in step 1.2 ’ Dispensing-chip Subtracting the actual value h of the height of the base bump (52) Dispensing-base Subtracting the thickness value h of the substrate (1) Dispensing-substrate Is the final number of (3);
step 2, calculating the thickness of the heat dissipation cover through laser measurement at the mounting station;
and 3, measuring the total thickness from the heat dissipation cover (2) to the substrate (1) at the hot pressing station through laser.
2. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 1, wherein: the adhesive (3) is pre-adhered to the chip (4), and the adhesive (3) adheres the chip (4) and the heat dissipation cover (2) together.
3. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 1, wherein: the adhesive (3) is adhered to the substrate (1) in advance, the adhesive (3) adheres the substrate (1) and the heat dissipation cover (2) together, and the chip (4) is wrapped therein, and the adhesive thickness is calculated according to the substrate thickness, the heat dissipation cover thickness, and the total thickness of the heat dissipation cover (2) to the substrate (1).
4. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 1, wherein: the adhesive (3) is pre-adhered to the chip (4) and the substrate (1), and when the adhesive (3) adheres the chip (4), the substrate (1) and the heat dissipation cover (2) together, the thickness of the adhesive on the substrate (1) is calculated according to the thickness of the substrate, the thickness of the heat dissipation cover and the total thickness from the heat dissipation cover (2) to the substrate (1).
5. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 1, wherein the step 2 specifically comprises the steps of:
step 2.1, before the mounting station operates, the base (5) is lifted to the operating height, the base plate (1) is jacked up and is adsorbed by the vacuum adsorption holes (9), and the base plate measuring position p in the step 1.2 is shot and identified on the base plate bulge (52) through a downward camera Dispensing-substrate And chip measurement position p Dispensing-chip After the heat dissipation cover (2) is assembled, the camera shoots and identifies the heat dissipationThe thermal cover (2) corresponds to the substrate measuring position p Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is measured at position p of heat radiation cover Front surface of heat dissipation cover The mounting head (7) sucks the heat dissipation cover (2) to move to a preset position, and the heat dissipation cover (2) and the heat dissipation cover measuring position p are identified through teaching or shooting by an upward camera Front surface of heat dissipation cover Corresponding position p Reverse side of heat dissipation cover Moving the mounting head (7) to align the upward laser beam with p Reverse side of heat dissipation cover Recording the device coordinate position p Apparatus and method for controlling the operation of a device Subsequently removing the heat-dissipating cover (2); the mounting head (7) moves to the equipment coordinate position p Apparatus and method for controlling the operation of a device Measuring the mounting head height value h by using laser Mounting head ；
2.2, when the mounting station is running, before the heat dissipation cover (2) is covered on the chip (4), the upward camera is used for shooting and identifying the heat dissipation cover (2) and the heat dissipation cover measuring position p Reverse side of heat dissipation cover Corresponding position p ’ Reverse side of heat dissipation cover Moving the mounting head (7) to align the upward laser beam to the position p ’ Reverse side of heat dissipation cover Measuring the height value h of the heat dissipation cover by using laser ’ Heat radiation cover ；
Step 2.3, calculating the thickness of the heat dissipation cover, namely calculating the measurement position p of the corresponding substrate Heat dissipating cover-substrate And chip measurement position p Heat dissipating cover chip Is a heat dissipation cover thickness h Heat radiation cover : corresponding to the thickness h of the heat dissipation cover Heat radiation cover For the height h of the heat radiation cover ’ Heat radiation cover And the mounting head height value h Mounting head Is a difference in (c).
6. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 5, wherein: the step 3 specifically comprises the following steps:
step 3.1, before the hot pressing station operates, the base (5) is lifted to the operating height, and when the substrate (1) is jacked up and adsorbed by the vacuum adsorption hole (9), a fixed position B is taken at the edge (51) of the base, the fixed position B is not covered by the jig (6), and the fixed position is measured by laserHeight value h at B Hot pressing B ；
Shooting and identifying the position of the heat dissipation cover (2) of the workpiece by using a camera, then calculating the height measurement position of the mounting station corresponding to the heat dissipation cover (2), taking away the substrate (1) after vacuum suction is closed, and then moving the laser to the corresponding position to measure the height value h at the position corresponding to the base Hot pressing base ；
Step 3.2, when the hot pressing station is operated, namely when the workpiece is jacked up and is absorbed by the vacuum absorption hole (9), controlling the laser to move to a fixed position B, and measuring the height value h at the fixed position B ’ Hot pressing B ；
Shooting and identifying the position of the heat radiation cover (2) of the workpiece by using a camera, then calculating the height measurement position of the mounting station corresponding to the heat radiation cover (2), and measuring the height value h at the height measurement position ’ Hot-pressing heat-dissipating cover ；
Step 3.3, calculating the actual height h of the pedestal protrusion (52) Hot press-base bump ：
Actual value h of height of base boss (52) Hot press-base bump Is the height value h corresponding to the base position in the 3.1 step Hot pressing base Plus the height value h at the fixed position B in step 3.2 ’ Hot pressing B Subtracting the height value h at the fixed position B in step 3.1 Hot pressing B Is the final number of (3);
calculating the actual value h of the total thickness from the heat dissipation cover (2) to the substrate (1) Hot pressing assembly ：
In case one, when the adhesive (3) adheres to the periphery of the heat dissipating cover (2),
the actual value h of the total thickness from the heat dissipation cover (2) to the substrate (1) Hot pressing assembly The height value h of the mounting station corresponding to the height measurement position on the heat dissipation cover (2) in the 3.2 th step ’ Hot-pressing heat-dissipating cover Subtracting the actual value h of the height of the pedestal elevation (52) in step 3.3 Hot press-base bump ；
In case two, when the adhesive (3) adheres to the inside of the heat dissipating cover (2),
the total thickness of the heat dissipation cover (2) to the substrate (1)Actual value of degree h Hot pressing assembly Thickness h of the substrate Dispensing-substrate And a heat dissipation cover thickness h Heat radiation cover And (3) summing.
7. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 3 or 4, wherein: when the adhesive (3) is tightly attached between the substrate (1) and the heat dissipation cover (2), the thickness of the adhesive is the final result of subtracting the thickness value of the heat dissipation cover (2) from the thickness value of the substrate (1) corresponding to the workpiece from the actual thickness value of the heat dissipation cover (2) to the substrate (1).
8. The method for detecting a bonding height in a heat dissipating cover mounting process according to claim 1, wherein: the height measurement positions of the dispensing station, the mounting station and the hot pressing station are identified through camera shooting and have corresponding relations, namely the base (5), the base (1), the chip (4) and the heat dissipation cover (2) are respectively measured at the same plane positions on the base plate (1) or the chip (4), and the total height of the flip chip is bonded.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070013479A (en) * | 2005-07-26 | 2007-01-31 | 삼성전자주식회사 | Die bonding apparatus having bond level thickness measuring part |
| CN113534112A (en) * | 2021-09-16 | 2021-10-22 | 常州铭赛机器人科技股份有限公司 | Laser height measurement calibration method for arc-shaped transparent workpiece |
| CN114353676A (en) * | 2021-12-07 | 2022-04-15 | 江苏华创微系统有限公司 | Automatic measurement device for height of surface-mounted chip and test method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7015577B2 (en) * | 2004-07-21 | 2006-03-21 | Advanced Semiconductor Engineering, Inc. | Flip chip package capable of measuring bond line thickness of thermal interface material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070013479A (en) * | 2005-07-26 | 2007-01-31 | 삼성전자주식회사 | Die bonding apparatus having bond level thickness measuring part |
| CN113534112A (en) * | 2021-09-16 | 2021-10-22 | 常州铭赛机器人科技股份有限公司 | Laser height measurement calibration method for arc-shaped transparent workpiece |
| CN114353676A (en) * | 2021-12-07 | 2022-04-15 | 江苏华创微系统有限公司 | Automatic measurement device for height of surface-mounted chip and test method thereof |
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