CN117214488A - Semiconductor steady flow test module - Google Patents
Semiconductor steady flow test module Download PDFInfo
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- CN117214488A CN117214488A CN202311187364.0A CN202311187364A CN117214488A CN 117214488 A CN117214488 A CN 117214488A CN 202311187364 A CN202311187364 A CN 202311187364A CN 117214488 A CN117214488 A CN 117214488A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
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- 230000008569 process Effects 0.000 abstract description 9
- 239000000523 sample Substances 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 3
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Abstract
The invention discloses a semiconductor steady flow testing module which comprises a fixing module, wherein a plurality of cavities are arranged in the fixing module, springs are arranged in each cavity, a needle rod is arranged in each spring, a fixing hole is formed in the side part of each needle rod, a plurality of empty slots are formed in one side of the fixing module, a push-pull module is arranged on the front side of the fixing module, a plurality of clamping grooves are formed in the push-pull module, and a fixing rod is assembled in each clamping groove, each empty slot and each fixing hole. The semiconductor steady-flow test module solves the problems that the test data false detection rate is high and the test transmission is unstable due to the jitter of the test probe in the test process of the conventional test probe.
Description
Technical Field
The invention belongs to the technical field of semiconductor detection, and particularly relates to a semiconductor steady flow test module.
Background
In the production process of PCBA in the semiconductor industry, electrical tests are required to be carried out on the PCBA to judge whether the electrical parameters (such as resistance, capacitance or inductance and the like) of components of the PCBA meet the standard requirements. The common testing method of the printed circuit board is to set a test point on the printed circuit board, print solder paste on the surface of the test point, and make a probe directly contact with the solder paste of the test point by an automatic testing device or an on-line testing device to obtain relevant electrical parameters.
The probe head type in the existing online test equipment has different requirements according to different test points, such as single head single action, double head double action and the like, and the test probe is often high in false test rate and unstable in test transmission due to jitter of the test probe in the test process.
Disclosure of Invention
The invention aims to provide a semiconductor steady-flow test module, which solves the problems of high false test rate and unstable test transmission of test data caused by jitter of a test probe in the test process of the conventional test probe.
In order to solve the technical problems, the invention discloses a semiconductor steady flow testing module which comprises a fixing module, wherein a plurality of cavities are arranged in the fixing module, a spring is arranged in each cavity, a needle bar is arranged in the spring, a fixing hole is formed in the side part of the needle bar, a plurality of empty slots are formed in one side of the fixing module, a push-pull module is arranged on the front side of the fixing module, a plurality of clamping slots are formed in the push-pull module, and a fixing rod is assembled in each group of clamping slots, each empty slot and each fixing hole.
The technical scheme of the invention also has the following characteristics:
as a preferable mode of the invention, the cavity is a stepped hole.
As a preferable scheme of the invention, the push-pull module is provided with a pin hole, a fixed pin is arranged in the pin hole, a fixed pin is arranged at the side part of the fixed module, and a tension spring is arranged between the fixed pin and the fixed pin.
As a preferable mode of the invention, a step is formed between the tail part and the head part of the needle bar, and the outer diameter of the tail part is larger than that of the head part.
As a preferable mode of the invention, a clamping groove is arranged at the side part of the fixing module, and the push-pull module is installed in the clamping groove.
Compared with the prior art: the semiconductor steady flow test module provided by the invention has the advantages that the needle rod cannot move up and down in the test process, and cannot shake due to the abnormality of the upper pressure, so that the stability of current in the test process can be ensured, and the test module has better market response and better market popularization and use prospect through experiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic diagram of a semiconductor steady flow test module according to the present invention;
FIG. 2 is a disassembled view of a semiconductor steady flow test module according to the present invention.
In the figure: 1. the device comprises a fixing module, a cavity, a spring, a fixing hole, a needle bar, a clamping groove, a push-pull module, a pin hole, a hollow groove, a tension spring, a fixing rod, a fixing pin and a clamping groove.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
As shown in fig. 1 and fig. 2, the semiconductor steady flow test module of the invention comprises a fixed module 1, wherein a plurality of cavities 2 are arranged in the fixed module 1, a spring 3 is arranged in each cavity 2, a needle bar 5 is arranged in the spring 3, a fixing hole 4 is arranged at the side part of the needle bar 5, a plurality of empty slots 9 are arranged at the front side of the fixed module 1, a push-pull module 7 is arranged at the front side of the fixed module 1, a plurality of clamping slots 6 are arranged on the push-pull module 7, and a fixing rod 11 is assembled in each group of clamping slots 6, empty slots 2 and fixing holes 4.
The push-pull module 7 is provided with a pin hole 8, a fixed pin 12 is arranged in the pin hole 8, a fixed pin 13 is arranged on the side part of the fixed module 1, and a tension spring 10 is arranged between the fixed pin 13 and the fixed pin 12. The side of the fixed module 1 is provided with a clamping groove 14, and the push-pull module 7 is installed from the clamping groove 14.
A step is formed between the tail and the head of the needle bar 5, and the outer diameter of the tail is larger than that of the head. The cavity 2 is a step hole, the head of the needle bar 5 can be inserted into the step hole, and the tail of the needle bar 5 is clamped outside the step hole.
The invention describes the assembly method steps in connection with fig. 2: (1) the springs 3 are respectively arranged in the cavities 2 of the fixed modules 1, and the cavities 2 are designed as a step hole; (2) the needle bar 5 is taken and put into the cavity 2 of the fixing module 1 in the last step, and the fixing hole 4 of the needle bar 5 is aligned with the empty slot 9 of the fixing module 1; (3) the push-pull module 7 is taken and put into the clamping groove 14 of the fixing module 1 in the previous step; (4) the fixing rod 11 is taken and put into the empty groove 9 to be tightly matched with the fixing hole 4; (5) the fixed pin 12 is taken and put into the pin hole 8 of the push-pull module 1; (6) and taking the tension spring 10, and respectively fixing two ends of the tension spring on the fixed pin 13 and the fixed pin 12 to complete assembly.
The invention is described with reference to fig. 1 and 2 in terms of the working principle: the upper end of the needle bar 5 is contacted with the signal transmission block, when the transmission block is pressed down, the needle bar 5 moves downwards, the push-pull module 7 moves leftwards under the force of the tension spring 10 after the working stroke is reached, the needle bar 5 is fixed after the fixing bar 11 is contacted with the clamping groove 6, the needle point is contacted with the test PAD point, the test is started, the needle bar 5 cannot move up and down in the test process, the jitter caused by the abnormal upper pressure is avoided, the stability of current in the test process is ensured, the push-pull module 7 is pushed rightwards after the test work is finished, the needle bar 5 moves upwards to return to the test initial position, and the test is finished.
Thus, compared with the prior art: the semiconductor steady flow test module provided by the invention has the advantages that the needle rod cannot move up and down in the test process, and cannot shake due to the abnormality of the upper pressure, so that the stability of current in the test process can be ensured, and the test module has better market response and better market popularization and use prospect through experiments.
While the foregoing description illustrates and describes several preferred embodiments of the invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of use in various other combinations, modifications and environments and is capable of changes or modifications within the spirit of the invention described herein, either as a result of the foregoing teachings or as a result of the knowledge or skill of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (5)
1. The utility model provides a semiconductor stationary flow test module, its characterized in that, including fixed module (1), be provided with a plurality of cavitys (2) in fixed module (1), every all be provided with spring (3) in cavity (2), be provided with needle bar (5) in spring (3), the lateral part of needle bar (5) is provided with fixed orifices (4), and the front side of fixed module (1) is provided with a plurality of empty slots (9), and the front side of fixed module (1) is provided with push-pull module (7), be provided with a plurality of screens groove (6) on push-pull module (7), all assemble a dead lever (11) in every group screens groove (6), empty slot (2) and the fixed orifices (4).
2. The semiconductor steady flow test module as claimed in claim 1, characterized in that the cavity (2) is a stepped hole.
3. The semiconductor steady flow test module according to claim 2, characterized in that a pin hole (8) is arranged on the push-pull module (7), a fixing pin (12) is arranged in the pin hole (8), a fixing pin (13) is arranged on the side part of the fixing module (1), and a tension spring (10) is arranged between the fixing pin (13) and the fixing pin (12).
4. A semiconductor steady flow test module according to claim 3, characterized in that a step is formed between the tail and the head of the pin rod (5), and the outer diameter of the tail is larger than the outer diameter of the head.
5. The semiconductor steady flow test module as claimed in claim 4, characterized in that the side of the stationary module (1) is provided with a clamping groove (14), and the push-pull module (7) is fitted in from the clamping groove (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311187364.0A CN117214488A (en) | 2023-09-14 | 2023-09-14 | Semiconductor steady flow test module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311187364.0A CN117214488A (en) | 2023-09-14 | 2023-09-14 | Semiconductor steady flow test module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117214488A true CN117214488A (en) | 2023-12-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311187364.0A Pending CN117214488A (en) | 2023-09-14 | 2023-09-14 | Semiconductor steady flow test module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117214488A (en) |
-
2023
- 2023-09-14 CN CN202311187364.0A patent/CN117214488A/en active Pending
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