CN117213550A - Temperature and pressure sensor - Google Patents
Temperature and pressure sensor Download PDFInfo
- Publication number
- CN117213550A CN117213550A CN202310280343.7A CN202310280343A CN117213550A CN 117213550 A CN117213550 A CN 117213550A CN 202310280343 A CN202310280343 A CN 202310280343A CN 117213550 A CN117213550 A CN 117213550A
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- metal substrate
- pressure
- temperature
- circuit board
- pressure sensor
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- 239000002184 metal Substances 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000009530 blood pressure measurement Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 17
- 239000010408 film Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910002708 Au–Cu Inorganic materials 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
A temperature pressure sensor, comprising: a housing having a pressure introduction hole; the pressure measuring assembly comprises a metal substrate provided with a downward pressure receiving hole and a metal diaphragm plugged at the upper end of the pressure receiving hole; the metal diaphragm is integrally connected with the metal substrate, and a pressure measuring circuit is arranged on the surface of one side of the metal diaphragm, which is far away from the pressure receiving hole; the metal substrate divides the inner cavity of the shell into an upper cavity and a lower cavity; the circuit board is fixedly arranged on the upper side of the metal substrate and is electrically connected to the pressure measurement circuit through the first lead, and a yielding hole for allowing the first lead to pass through is formed in the circuit board; the plurality of contact pins are fixedly arranged on the shell, and the lower ends of the contact pins extend into the upper cavity and are electrically connected with the circuit board through the first elastic conductor; and temperature sensitive elements which are arranged in the pressure leading-in holes and are respectively led out of a conducting rod at two ends, wherein the upper ends of the conducting rods penetrate through the metal substrate and are electrically connected with the circuit board through second conducting wires of the conducting plates, and sintered glass is sealed between the conducting rods and the metal substrate.
Description
Technical Field
The application relates to the technical field of pressure sensors, in particular to a temperature and pressure sensor.
Background
Liquid carbon dioxide has wide application in fire fighting, refrigeration and power industries. The liquid state dioxygenation pressure can reach tens of megapascals at normal temperature. High-range pressure sensors for measuring such high pressures cannot be manufactured by MEMS (micro-mechanical systems) technology, but are generally manufactured by metal diaphragm technology, and at the same time, a temperature sensitive element needs to be provided to detect the temperature. In the existing metal diaphragm type temperature and pressure sensor, a temperature sensing element is arranged, so the temperature sensing element needs to penetrate through a metal substrate and be sealed with the metal substrate. This makes electrical connection of the temperature sensing element to the processing circuitry problematic.
For the above problems, there are two main existing treatments. One such method is to isolate the temperature sensing element from the medium to be measured by a well thermally conductive metal housing, such as the integrated pressure and temperature sensor disclosed in CN102980714A, CN107817015a, so that the temperature sensing element and the pressure sensing element do not need to be isolated, but a thermally conductive material must be filled between the metal housing and the temperature sensor element. The temperature gradient has lower accuracy of measured temperature data, longer response time and complex process.
Another approach is to place a temperature sensitive element on an insulating base and electrically connect the temperature sensitive element to a circuit board through conductive spring plates and conductive elements (e.g., metal probes) as disclosed in CN112611504 a. However, in actually manufacturing the above-described temperature and pressure sensor, the following difficulties are involved: firstly, the upper end of the conductive elastic sheet is elastically abutted against the lower end of the conductive element upwards, and the connection between the conductive elastic sheet and the conductive element is easy to cause failure when used for a long time, especially under the vibration working condition; second, in sealing conductive elements passing through the substrate, complex via metallization processes are required, i.e., plating Mo-Mn alloy first, plating a layer of metallic Ni, and soldering with Au-Cu alloy solder, to achieve transition and adaptation of the coefficient of thermal expansion (CTE, coefficient of thermal expansion) to avoid adverse effects of temperature on measurement accuracy.
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Disclosure of Invention
In view of the shortcomings of the prior art, the present application provides a temperature and pressure sensor that facilitates connection of a temperature sensitive element to a circuit board.
In order to achieve the above purpose, the present application provides the following technical solutions: a temperature pressure sensor, comprising:
a housing having a pressure introduction hole;
the pressure measuring assembly comprises a metal substrate provided with a downward pressure receiving hole and a metal diaphragm plugged at the upper end of the pressure receiving hole; the metal diaphragm is integrally connected with the metal substrate, and a pressure measuring circuit consisting of a strain resistor is arranged on the surface of one side of the metal diaphragm, which is far away from the pressure receiving hole; the metal substrate divides the inner cavity of the shell into an upper cavity and a lower cavity;
the circuit board is fixedly arranged on the upper side of the metal substrate and is electrically connected to the pressure measurement circuit through the first lead, and a yielding hole for allowing the first lead to pass through is formed in the circuit board;
the plurality of pins are fixedly arranged on the shell, and the lower ends of the pins extend into the upper cavity and are electrically connected with the circuit board through the first elastic conductor;
and temperature sensitive elements which are arranged in the pressure leading-in holes and are respectively led out of a conducting rod at two ends, wherein the upper ends of the conducting rods penetrate through the metal substrate and are electrically connected with the circuit board through second conducting wires of the conducting plates, and sintered glass is sealed between the conducting rods and the metal substrate.
Preferably, the housing includes a terminal button, a metal housing, and a lower housing, the pressure introduction hole being provided on the lower housing; the upper end of the metal shell is embedded and fixed on the end button, and the lower end is connected with the lower shell in a sealing way; the contact pin is fixed on the terminal button.
Preferably, the temperature and pressure sensor further comprises an O-shaped ring, wherein the shell comprises an upper shell and a lower shell which are fixedly connected up and down, and the O-shaped ring is filled and extruded between the upper end of the pressing piece and the upper shell.
Preferably, the edge of the circuit board is fixed and electrically connected with a conductive sheet, and the conductive sheet is pressed downwards by a pressing piece and electrically connected to the metal substrate; the metal substrate is downward abutted on the lower shell; the pressing piece is internally provided with a second via hole which can be used for the first elastic conductor to pass through up and down.
Preferably, the periphery of the pressing piece protrudes downwards to form at least two second buckles, and the second buckles are clamped on the corresponding positioning concave parts on the outer wall of the circuit board supporting piece.
Preferably, the elastic sleeve comprises an upper thick section and a lower thin section, the thick section and the thin section are integrally connected, and the thin section is cooperatively arranged in the pressure introduction hole; the upper end of the thick section is propped against the lower end surface of the metal substrate, and the lower end is propped against a sealing supporting surface formed in the lower cavity; the pressure receiving hole is downwards communicated to the inner cavity of the thick section; the temperature sensitive element is positioned at the lower part of the inner cavity of the thin section.
Preferably, the circuit board may be formed with a first circumferential positioning portion corresponding to an inner sidewall of the second buckle.
Preferably, a part of the lower end of the end button extends downwards into the positioning convex ring, and a part of the inner wall of the positioning convex ring and the lower end of the end button extends downwards into the positioning convex ring correspondingly form a second circumferential positioning part.
Preferably, the strain resistor is a thick film resistor, a glass micro-fuse strain resistor or a sputtered thin film resistor.
Preferably, the strain resistor is a thick film resistor, and the thick film resistor and the sintered glass are sintered together on a metal substrate.
Drawings
FIG. 1 is an exploded view of a temperature and pressure sensor according to a preferred embodiment of the present application;
FIG. 2 is a top view of a temperature and pressure sensor according to a preferred embodiment of the present application;
FIG. 3 is a cross-sectional view of a temperature and pressure sensor taken along line A-A of FIG. 2 in accordance with a preferred embodiment of the present application;
FIG. 4 is a cross-sectional view of a temperature and pressure sensor taken along B-B of FIG. 2 in accordance with a preferred embodiment of the present application;
in the figure: 101. an end button; 102. a metal housing; 103. a contact pin; 1. an upper housing; 201. a pressure introduction hole; 202. a first support step; 204. sealing the support surface; 2. a lower housing; 300. a pressure receiving hole; 30. a metal substrate; 312. a metal diaphragm; 31. a pressure sensitive element; 33. a protective layer; 34. a lead-out bonding pad; 351. a conductive rod; 352. a temperature sensitive element; 353. sintering glass; 3. a pressure measurement assembly; 500. a first bonding pad; 501. a relief hole; 502. a first circumferential positioning portion; 504. an electronic component; 505. a second bonding pad; 506. a first wire; 5. a circuit board; 601. a second buckle; 605a, a holding cylinder; 605. a second via; 607. a second circumferential positioning portion; 609. positioning the convex ring; 6. a pressing member; 700. a barrel cavity; 701. a thin section; 702. a thick section; 7. an elastic sleeve; 91. a first elastic conductor; 92. a second wire; 93. a conductive sheet;
Detailed Description
The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings. The following examples are illustrative only and are not to be construed as limiting the application. In the following description, the same reference numerals are used to designate the same or equivalent elements, and duplicate descriptions are omitted.
In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "left", "right", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships in which the product of the present application is conventionally put in use, or the directions or positional relationships in which those skilled in the art conventionally understand are merely for convenience of describing the present application and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present application.
In addition, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood as appropriate by those of ordinary skill in the art.
It should be further understood that the term "and/or" as used in the present description and the corresponding claims refers to any and all possible combinations of one or more of the listed items.
As shown in fig. 1 to 4. In one embodiment of the application, the temperature and pressure sensor comprises a housing (not labeled), a pressure measurement assembly 3, and a circuit board 5. The housing includes an upper housing 1 and a lower housing 2 made of metal. The upper housing 1 may include a terminal button 101 and a metal shell 102. The upper end of the metal casing 102 is embedded in the end button 101, and the lower end of the metal casing 102 is fixed on a first support step 202 formed by sinking the outer periphery of the lower end of the lower casing 2 by welding or the like.
The pressure measuring assembly 3 comprises a metal substrate 30 and a pressure sensitive element 31, wherein the metal substrate 30 divides the inner cavity of the shell into an upper cavity and a lower cavity. The lower housing 2 is provided with a pressure introduction hole 201 for introducing a pressure medium into the lower chamber. The metal base 30 is provided with a downward pressure receiving hole 300. The pressure sensor 31 includes a metal diaphragm 312 integrally connected to the metal substrate 30, and the metal diaphragm 312 is plugged into the upper end of the pressure receiving hole 300. The metal diaphragm 312 deforms when the underside surface receives the pressure of the pressure medium. The side surface (i.e., the upper side surface) of the metal diaphragm 312 remote from the pressure receiving hole 300 is provided with a pressure measurement circuit (e.g., a wheatstone bridge) composed of a plurality of strain resistors. These strain resistors may be thick film resistors, glass micro-fuse strain resistors, or sputtered thin film resistors or other resistors capable of changing resistance values by deformation of the metal diaphragm 312. Since the sintering temperatures of the thick film resistor and the sintered glass 353 are relatively close, the thick film resistor and the sintered glass 353 are preferably sintered together on the metal substrate 30, thereby reducing the number of steps and saving energy. The pressure measurement circuit may be protected by a protective layer 33 (e.g., a glaze layer) and the plurality of lead pads 34 are exposed.
The circuit board 5 is adhered to the upper surface of the metal substrate 30. The circuit board 5 is electrically connected to the pressure measurement circuit by a first wire 506. The circuit board 5 is provided with a relief hole 501 for allowing the first wire 506 to pass through, so that the signal measured by the pressure measuring circuit can be transmitted to the circuit board 5. The upper side of the circuit board 5 is provided with electronic components 504 such as conditioning chips.
The temperature and pressure sensor further includes a plurality of pins 103 for transmitting the signals processed by the circuit board 5 to an external device. The pins 103 may be embedded on the terminal 101, with one end thereof protruding outwards, and the other end thereof passing through the terminal 101 downwards and then being partially exposed in the upper cavity, and the portion of the pins 103 exposed in the upper cavity and the plurality of second pads 505 disposed on the upper side of the circuit board 5 form one-to-one electrical connection, for example, may form electrical connection through the first elastic electrical conductor 91. The first elastic conductive body 91 may be a metal spring plate, but is preferably a connection spring. In other embodiments, the portion of pin 103 exposed in the upper cavity may also be soldered to second pad 505 by a flexible electrical conductor (e.g., a flexible circuit board) to form an electrical connection.
The temperature and pressure sensor also includes a temperature sensitive element 352. The temperature sensing element 352 is disposed in the pressure introduction hole 201 and has two ends led out of a conductive rod 351. The upper end of the conductive rod 351 is electrically connected to the circuit board 5 through the conductive sheet second wire 92 or the second flexible conductor after penetrating the metal substrate 30. A sintered glass 353 is sealed between the conductive rod 351 and the metal substrate 30 to form a fixation and seal with the metal substrate 30 and to maintain insulation.
The lead-out pads 34 of the upper surface of the metal film 312 are electrically connected to the first pads 500 provided on the upper surface of the circuit board 5 through the first wires 506. The upper surface of the metal substrate 30 is preferably a flat surface. In order to enable the metal casing 102 to be grounded, a conductive sheet 93 is also fixed and electrically connected to the edge of the circuit board 5, and one of the pins 103 is a grounding pin, and the conductive sheet 93 is connected to the grounding pin through the circuit board 5.
The lower end of the pressing member 6 presses the conductive sheet 93 downward and is electrically connected to the upper end surface of the metal substrate 30, and since the lower end of the metal housing 102 is welded to the lower case 2, the metal substrate 30 is abutted downward on the lower case 2, so that the metal housing 102 can be grounded through the grounding pad on the circuit board 5. . The pressing member 6 has a second via 605 formed therein through which the first elastic conductive body 91 passes up and down. The upper end of the hold down 6 near the outer edge may protrude upward to form a ring of positioning bosses 609. In other embodiments, the edge of the second via 605 may protrude downward to form a retaining cylinder 605a to avoid displacement of the first elastic conductor 91.
The periphery of the pressing piece 6 may be protruded downward to form at least two second buckles 601. The second buckle 601 is clamped on the positioning concave part 403 correspondingly arranged on the outer wall of the circuit board support 4, so that the compressing piece 6, the circuit board 5 and the circuit board support 4 can be fixed in advance.
In other embodiments, the temperature and pressure sensor may preferably further comprise an elastic sleeve 7 interposed between the lower end of the metal base plate 30 and the inner wall of the lower case 2 so as to achieve a sealed connection therebetween. The elastic sleeve 7 comprises in particular an upper thick section 702 and a lower thin section 701. The thick section 702 is integrally connected with the thin section 701. The thin section 701 is fittingly provided in the pressure introduction hole 201. The upper end of the thick section 702 is pressed against the lower end surface of the metal substrate 30. The lower end is pressed against a sealing support surface 204 formed in the lower chamber. The pressure receiving bore 300 communicates downwardly into the interior cavity of the coarse section 702. Temperature sensing element 352 is located in the lower portion of lumen 700 of thin section 701.
The circuit board 5 may be formed with a first circumferential positioning portion 502 corresponding to an inner sidewall of the second clip 601, thereby fixing the pressing member 6 to the circuit board 5; on this basis, the temperature and pressure sensor may further comprise an O-ring 8, which is filled between the upper end of the pressing member 6 and the inner wall of the upper housing 1, and the pressing member 6 is supported downward on the circuit board 5, so that the pressing member 6 and the circuit board 5 are pressed on the metal substrate 30 through the upper housing 1 and the O-ring 8. In order to achieve circumferential positioning between the pressing member 6 and the end knob 101, a second circumferential positioning portion 607 may be formed on the inner wall of the positioning boss 609. A portion of the lower end of the end knob 101 extends downward into the positioning boss 609 and a second circumferential positioning portion is correspondingly provided on the outer wall of the portion. The two corresponding circumferential positioning parts can be flat sides, a combination of a positioning groove and a positioning ridge, or a structure with two other complementary horizontal cross-section shapes.
The scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.
Claims (10)
1. A temperature and pressure sensor, comprising:
a housing having a pressure introduction hole (201);
the pressure measuring assembly (3) comprises a metal substrate (30) provided with a downward pressure receiving hole (300) and a metal diaphragm (312) plugged at the upper end of the pressure receiving hole (300); the metal diaphragm (312) is integrally connected with the metal substrate (30), and a pressure measuring circuit composed of strain resistors is arranged on the surface of one side of the metal diaphragm (312) far away from the pressure receiving hole (300); the inner cavity of the shell is divided into an upper cavity and a lower cavity by the metal substrate (30);
the circuit board (5) is fixedly arranged on the upper side of the metal substrate (30), the circuit board (5) is electrically connected to the pressure measurement circuit through the first lead (506), and the circuit board (5) is provided with a yielding hole (501) for allowing the first lead (506) to pass through;
a plurality of contact pins (103) fixedly arranged on the shell, wherein the lower ends of the contact pins (103) extend into the upper cavity and are electrically connected with the circuit board (5) through the first elastic conductor (91);
and temperature sensitive elements (352) which are arranged in the pressure introduction holes (201) and are respectively provided with a conducting rod (351) at two ends, wherein the upper ends of the conducting rods (351) penetrate through the metal substrate (30) and are electrically connected with the circuit board (5) through second conducting wires (92) of the conducting plates, and sintered glass (353) is sealed between the conducting rods (351) and the metal substrate (30).
2. The temperature-pressure sensor according to claim 1, wherein the housing includes a terminal button (101), a metal case (102) and a lower housing (2), and the pressure introduction hole (201) is provided in the lower housing (2); the upper end of the metal shell (102) is embedded and fixed on the end button (101), and the lower end is connected with the lower shell (2) in a sealing way; the pin (103) is fixed on the terminal (101).
3. Temperature and pressure sensor according to claim 1, characterized in that the edge of the circuit board (5) is fixed and electrically connected with a conductive sheet (93), the conductive sheet (93) being pressed downwards by a pressing member (6) and electrically connected to the metal substrate (30); the metal substrate (30) is downward abutted on the lower shell (2); a second via hole (605) through which the first elastic conductor (91) passes up and down is formed in the pressing member (6).
4. A temperature and pressure sensor according to claim 3, characterized in that the periphery of the pressing member (6) protrudes downwards to form at least two second buckles (601), and the second buckles (601) are clamped on corresponding positioning concave parts (403) arranged on the outer wall of the circuit board support member (4).
5. The temperature and pressure sensor according to claim 1, further comprising an O-ring (8), wherein the housing comprises an upper housing (1) and a lower housing (2) fixedly connected up and down, and the O-ring (8) is filled between the upper end of the pressing member (6) and the upper housing (1).
6. The temperature and pressure sensor according to claim 1, further comprising an elastic sleeve (7), the elastic sleeve (7) comprising an upper thick section (702) and a lower thin section (701), the thick section (702) being integrally connected with the thin section (701), the thin section (701) being fittingly arranged within the pressure introduction hole (201); the upper end of the thick section (702) is propped against the lower end surface of the metal substrate (30), and the lower end is propped against a sealing supporting surface (204) formed in the lower cavity; the pressure receiving hole (300) is downwards communicated to the inner cavity of the thick section (702); a temperature sensitive element (352) is located in the lower portion of the lumen of the thin section (701).
7. A temperature and pressure sensor according to claim 1, characterized in that the circuit board (5) is formed with a first circumferential positioning portion (502) corresponding to the inner side wall of the second clip (601).
8. The temperature and pressure sensor according to claim 1, wherein a portion of the lower end of the end knob (101) extends downward into the positioning boss (609), and a second circumferential positioning portion (607) is correspondingly formed on the inner wall of the positioning boss (609) and a portion of the lower end of the end knob (101) extending downward into the positioning boss (609).
9. The temperature-pressure sensor of claim 1, wherein the strain resistance is a thick film resistance, a glass micro-fuse strain resistance, or a sputtered thin film resistance.
10. Temperature-pressure sensor according to any one of claims 1 to 9, characterized in that the strain resistance is a thick film resistance which is sintered together with a sintered glass (353) onto a metal substrate (30).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310280343.7A CN117213550A (en) | 2023-03-21 | 2023-03-21 | Temperature and pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310280343.7A CN117213550A (en) | 2023-03-21 | 2023-03-21 | Temperature and pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117213550A true CN117213550A (en) | 2023-12-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310280343.7A Pending CN117213550A (en) | 2023-03-21 | 2023-03-21 | Temperature and pressure sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN117213550A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117782230A (en) * | 2024-02-28 | 2024-03-29 | 森萨塔科技（常州）有限公司 | Sensing device, heat pump system and vehicle |
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2023
- 2023-03-21 CN CN202310280343.7A patent/CN117213550A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117782230A (en) * | 2024-02-28 | 2024-03-29 | 森萨塔科技（常州）有限公司 | Sensing device, heat pump system and vehicle |
| CN117782230B (en) * | 2024-02-28 | 2024-05-24 | 森萨塔科技（常州）有限公司 | Sensing device, heat pump system and vehicle |
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