CN117782230A - Sensing device, heat pump system and vehicle - Google Patents

Abstract

The present application relates to a sensor device comprising a housing part, a connector assembly arranged on a first side of the housing part and a sensor assembly arranged on a second side of the housing part opposite the first side, wherein the sensor device further comprises a first circuit board arrangement and a second circuit board arrangement spaced apart from each other in a longitudinal direction of the sensor device, the second circuit board arrangement being arranged close to the sensor assembly and being electrically connected to the sensor assembly by means of an electrically conductive wire, the first circuit board arrangement being integrated with a temperature-sensitive device and being arranged further away from the sensor assembly relative to the second circuit board arrangement, the first circuit board arrangement being electrically connected to the second circuit board arrangement via an electrically conductive structure. The sensor device can thus have improved temperature resistance. Furthermore, the application relates to a heat pump system and a vehicle.

Description

Sensing device, heat pump system and vehicle

Technical Field

The present application relates to the field of sensing devices, and more particularly to a sensing device, in particular for a heat pump system, and to a heat pump system and a vehicle.

Background

In some temperature regulation systems, such as air conditioning systems or heat pump systems, it is often necessary to deploy corresponding sensing devices to measure the temperature of a medium, such as a refrigerant. In some cases, it is also necessary to measure the pressure of the medium by means of corresponding sensor devices. If the medium is at a higher temperature, a higher requirement is placed on the temperature resistance of the sensing device. This challenge is particularly pronounced when the sensor device is equipped with a temperature sensitive device, such as a processing chip. In particular, in some applications, the temperature-sensitive device must be electrically connected to the media-side sensor assembly, so that the temperature-sensitive device is generally not allowed to be disposed away from the media-side sensor assembly, which would otherwise affect the reliability of the electrical connection.

It is therefore desirable to provide a solution that can improve the temperature resistance of a sensing device so that the sensing device can reliably operate at high temperatures even in the presence of temperature sensitive devices. Furthermore, it may also be desirable to implement the sensing device in a structurally simplified and/or cost-effective manner.

Disclosure of Invention

It is therefore an object of the present application to provide a sensing device, a heat pump system and a vehicle which are capable of overcoming at least one of the drawbacks of the prior art, whereby the temperature resistance of the sensing device is advantageously improved.

According to a first aspect of the present application, a sensor device is provided, comprising a housing part, a connector assembly arranged on a first side of the housing part and a sensor assembly arranged on a second side of the housing part opposite the first side, wherein the sensor device further comprises a first circuit board arrangement and a second circuit board arrangement spaced apart from each other in a longitudinal direction of the sensor device, the second circuit board arrangement being arranged close to the sensor assembly and being electrically connected to the sensor assembly by means of electrically conductive wires, the first circuit board arrangement being integrated with a temperature sensitive device and being arranged further away from the sensor assembly relative to the second circuit board arrangement, the first circuit board arrangement being electrically connected to the second circuit board arrangement via electrically conductive structures.

Therefore, the sensing device provided by the application has the beneficial effect that the scheme for further improving the temperature resistance of the sensing device can ensure that the sensing device can reliably operate at high temperature even if a temperature sensitive device exists. Furthermore, some embodiments of the present application may be advantageous in that they allow the sensing device to be implemented in a structurally simplified, assembly efficient and/or cost effective manner.

In some embodiments, the first circuit board arrangement is mounted within the connector assembly such that the connector assembly and the first circuit board arrangement form a mounting assembly that is mounted as a unit to the housing portion when assembled.

In some embodiments, the first circuit board arrangement includes a through hole through which an electrical connection terminal of the connector assembly extends and a pad surrounding the through hole, the electrical connection terminal of the connector assembly extending through the through hole and being soldered to the pad of the first circuit board arrangement.

In some embodiments, the temperature sensitive device is mounted on a first surface of the first circuit board arrangement facing away from the sensor assembly.

In some embodiments, a thermally conductive adhesive is filled between the first surface of the first circuit board device and the connector assembly.

In some embodiments, the first circuit board arrangement comprises a first conductive region and the second circuit board arrangement comprises a second conductive region corresponding to the first conductive region, the conductive structure being configured to electrically connect with the first conductive region on a first side and with the second conductive region on a second side opposite the first side so as to create an electrical connection between the first circuit board arrangement and the second circuit board arrangement.

In some embodiments, the first conductive region is configured as a first conductive ring and the second conductive region is configured as a second conductive ring, the first conductive ring surrounding the first via and the second conductive ring surrounding the second via, wherein the conductive structure is configured to be mechanically and electrically connected to the first conductive ring and the second conductive ring, respectively, by press contact and/or soldering.

In some embodiments, the conductive structure is configured as a conductive spring.

In some embodiments, the conductive spring extends through a second via on the second circuit board device and is mechanically and electrically connected to the second conductive region by press contact and/or soldering, and the conductive spring extends after passing through the second circuit board device toward the first circuit board device and press contact onto the first conductive region of the first circuit board device.

In some embodiments, the conductive structure is configured as a flexible circuit board configured to create an electrical connection between the first circuit board arrangement and the second circuit board arrangement.

In some embodiments, the temperature sensitive device includes a processing chip and the second circuit board arrangement is devoid of a processing chip.

In some embodiments, the sensing device is configured as an integrated temperature and pressure sensing device, wherein the sensor assembly includes a first receiving cavity, a second receiving cavity, a temperature sensing element and a pressure sensing element, the temperature sensing element being received within the first receiving cavity, the second receiving cavity allowing a medium to be measured to flow into and to the pressure sensing element mounted downstream of the second receiving cavity.

In some embodiments, the conductive wire is configured as a bond wire or a bond wire.

In some embodiments, the second circuit board arrangement is electrically connected to the temperature sensing element via a first electrically conductive wire and to the pressure sensing element via a second electrically conductive wire.

In some embodiments, the sensing device comprises a jumper circuit board mounted between a second circuit board arrangement and the first receiving cavity, the second circuit board arrangement being electrically connected to the jumper circuit board via a first conductive wire and the jumper circuit board being electrically connected to the temperature sensing element via a cable, thereby enabling an electrical connection between the second circuit board arrangement and the temperature sensing element.

In some embodiments, the first circuit board arrangement is raised at least 3 mm, 4 mm, 5 mm or even 6 mm relative to the second circuit board arrangement in the longitudinal direction of the sensing arrangement.

According to a second aspect of the present application there is provided a heat pump system, for example a carbon dioxide heat pump system, comprising one or more sensing devices according to some embodiments of the present application, the sensing devices being configured to measure the temperature and/or pressure of a medium within the heat pump system.

According to a third aspect of the present application, there is provided a vehicle, such as an electric vehicle, comprising a heat pump system according to some embodiments of the present application.

Drawings

The present application is described in more detail below with reference to the accompanying drawings by means of specific embodiments. The schematic drawings are briefly described as follows:

FIG. 1 illustrates an exemplary perspective view of a sensing device according to some embodiments of the present application;

FIG. 2 shows an exploded view of the sensing device of FIG. 1;

FIG. 3 shows a side view of the sensing device of FIG. 1;

FIG. 4 shows a cross-sectional view of the sensing device of FIG. 3;

FIG. 5 illustrates a partial enlarged view of the sensing device of FIG. 4;

FIG. 6 shows a side view of the sensing device rotated 90 degrees relative to FIG. 3;

FIG. 7 shows a cross-sectional view of the sensing device of FIG. 6;

FIG. 8 illustrates a partial enlarged view of the sensing device of FIG. 7;

FIG. 9 illustrates an exemplary perspective view of a first assembly scheme of a first circuit board device and a second circuit board device of a sensing device according to some embodiments of the present application;

fig. 10 illustrates an exemplary perspective view of a second assembly scheme of a first circuit board device and a second circuit board device of a sensing device according to some embodiments of the present application.

Detailed Description

The present application will be described below with reference to the accompanying drawings, which show several embodiments of the present application. It should be understood, however, that this application may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; indeed, the embodiments described hereinafter are intended to provide a more complete disclosure of the present application and to fully convey the scope of the application to those skilled in the art. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide yet additional embodiments.

It should be understood that the terminology herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present application. All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art unless otherwise defined. Well-known functions or constructions may not be described in detail for brevity and/or clarity.

In this document, spatially relative terms such as "upper," "lower," "left," "right," "front," "rear," "high," "low," and the like may be used to describe one feature's relationship to another feature in the figures. It will be understood that the spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, when the device in the figures is inverted, features that were originally described as "below" other features may be described as "above" the other features. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the relative spatial relationship will be explained accordingly.

In this document, the term "a or B" includes "a and B" and "a or B", and does not include exclusively only "a" or only "B", unless otherwise specifically indicated.

In this document, the terms "schematic" or "exemplary" mean "serving as an example, instance, or illustration," rather than as a "model" to be replicated accurately. Any implementation described herein by way of example is not necessarily to be construed as preferred or advantageous over other implementations. Furthermore, there is no intention to be bound by any expressed or implied theory presented in the preceding technical field, background, brief summary or the detailed description.

As used herein, the term "substantially" is intended to encompass any minor variation due to design or manufacturing imperfections, tolerances of the device or element, environmental effects and/or other factors.

In addition, for reference purposes only, the terms "first," "second," and the like may also be used herein, and are thus not intended to be limiting. For example, the terms "first," "second," and other such numerical terms referring to structures or elements do not imply a sequence or order unless clearly indicated by the context.

The present application relates to a sensing device that may be arranged to detect, for example, an operating parameter of a fluid medium, such as temperature and/or pressure. Accordingly, the sensing device according to the present application may be configured as a temperature sensing device, a pressure sensing device or an integrated temperature and pressure sensing device. Such sensing devices may be deployed within different types of process control systems, such as temperature regulating systems, e.g., heat pump systems, internal combustion engine systems.

Currently, particularly with the development of electric vehicles, different types of heat pump systems, such as carbon dioxide heat pump systems, are increasingly applied to vehicles. However, in heat pump systems, in particular carbon dioxide heat pump systems, both the ambient temperature in which the sensing device is located and the medium temperature measured by the sensing device may be at a high level. In some cases, the ambient temperature, or rather the upper ambient temperature limit, at which the sensing device is located may be near or even above 140 degrees celsius, while the medium temperature, or rather the upper medium temperature limit, may be near or even above 180 degrees celsius. Thus, a temperature gradient from the ambient temperature to the medium temperature may occur inside the sensing device. This places high demands on the temperature resistance of the sensing device. This challenge is particularly pronounced when the sensing device is equipped with a temperature sensitive device, such as a processing chip. In some cases, the upper operating temperature limit of certain temperature sensitive devices, such as specialized processing chips or application specific integrated circuits, may be set between the upper ambient temperature limit and the upper medium temperature limit, such as 150 degrees celsius. Once the temperature of the temperature sensitive device exceeds its upper operating temperature limit, the reliability of the sensing device may be negatively affected.

Furthermore, in some cases, the temperature-sensitive device should be electrically connected to the sensor assembly on the medium side for the purpose of analyzing the sensor data, so that the temperature-sensitive device is generally not allowed to be arranged away from the sensor assembly on the medium side, which would otherwise affect the reliability of the electrical connection, since excessively long conductive lines, such as bonding wires or bonding wires, may be damaged or even broken under strong vibrations or vibrations. For example, some typical bond wires or wirebonds may have a diameter or width of only tens of microns, which is susceptible to failure once the conductive wire is too long.

For this purpose, the present application proposes a solution that can improve the temperature resistance of the sensor device, so that the sensor device can be operated reliably at high temperatures even in the presence of temperature-sensitive components. Furthermore, some embodiments of the present application also allow for the sensor device to be implemented in a structurally simplified, assembly efficient, and/or cost effective form.

Some embodiments of the present application will now be described in more detail with reference to the accompanying drawings. Fig. 1 and 2 illustrate an exemplary perspective view of a sensing device 100 and an exploded view of the sensing device 100, respectively, according to some embodiments of the present application. FIG. 3 illustrates a side view of a sensing device 100 according to some embodiments of the present application; FIG. 4 shows a cross-sectional view of the sensing device 100 taken along the section line CN-CN shown in FIG. 3; fig. 5 shows a partial enlarged view of the enlarged area a shown in fig. 4 of the sensing device 100. FIG. 6 shows a side view of the sensing device 100 rotated 90 degrees relative to FIG. 3; FIG. 7 illustrates a cross-sectional view of the sensing device 100 taken along the section line CP-CP shown in FIG. 6; fig. 8 shows a partial enlarged view of the enlarged region B shown in fig. 7 of the sensor device 100.

The sensing device 100 may include a housing portion 10, a connector assembly 20 disposed on a first side of the housing portion 10, and a sensor assembly 30 disposed on a second side of the housing portion 10 opposite the first side. In other words, the connector assembly 20, the housing part 10 and the sensor assembly 30 may be sequentially arranged along the longitudinal direction L of the sensing device 100, i.e., the connector assembly 20 and the sensor assembly 30 may be mounted on both sides of the housing part 10 along the longitudinal direction L of the sensing device 100.

The housing portion 10 may include a first receptacle 11 open to the connector assembly 20 and a second receptacle 12 open to the sensor assembly 30. In the illustrated embodiment, the second receptacle 12 can be configured in a retracted manner relative to the first receptacle 11, and the sealing sleeve 13 can be inserted around between the first receptacle 11 and the sensor assembly 30, thereby facilitating a compact sealing design of the sensor device 100. Furthermore, the first receptacle 11 may have a hexagonal profile section, which facilitates the assembly process of the sensor device 100. It should be understood that the configuration of the housing portion 10 may be varied and should not be limited to the specific embodiments described herein.

The connector assembly 20 may provide an electrical interface with an external system for outputting electrical signals to the external system. In the illustrated embodiment, the connector assembly 20 may function as a female connector, and a male connector of an external system may be plugged onto the connector assembly 20 to make an electrical connection. In other embodiments, the connector assembly 20 may function as a male connector and a female connector of an external system may be plugged onto the connector assembly 20. It should be understood that the connector assembly 20 may be variously configured as long as it allows for the provision of an electrical interface to an external system and should not be limited to the specific embodiments described herein.

The sensor assembly 30 may be integrated with a sensing element for detecting an operating parameter, such as temperature and/or pressure, of the fluid medium, for example. As shown in fig. 2 and 7, since the sensing device 100 is configured as an integrated temperature and pressure sensing device, the sensor assembly 30 may include a first receiving chamber 31, a second receiving chamber 32, a temperature sensing element 33, and a pressure sensing element 34. The temperature sensing element 33 may be accommodated in a first accommodation chamber 31, and a second accommodation chamber 32 allows a medium to be measured to flow into and to a pressure sensing element 34 installed downstream of the second accommodation chamber 32. Advantageously, the sensor assembly 30 may include an optional threaded portion 35 on the outer peripheral surface that may facilitate reliable installation of the sensor assembly 30 into the wall of the fluid medium path. Furthermore, an additional sealing ring 36 can be provided on the end face of the sensor assembly 30 in order to ensure good sealing performance of the sensor device 100.

In some embodiments, the temperature sensing element 33 may be configured as a thermistor-based temperature sensing element, such as an NTC thermistor. In some embodiments, the pressure sensing element 34 may be configured as a MEMS pressure sensing element. It should be understood that the sensor assembly 30 may be constructed in a wide variety of forms and should not be limited to the specific embodiments described herein. In some embodiments, additionally or alternatively, the sensor assembly 30 may be integrated with other types of sensing elements, such as flow rate sensing elements, flow sensing elements. In some embodiments, the sensing device 100 may be configured as a simple temperature sensing device or a pressure sensing device.

As shown in fig. 4, 5 and 7, 8, the sensing device 100 may include a first circuit board arrangement 40 and a second circuit board arrangement 50 spaced apart from each other along a longitudinal direction L of the sensing device 100. The first circuit board arrangement 40 and the second circuit board arrangement 50 may advantageously each be configured as separate rigid circuit board arrangements. The first circuit board arrangement 40 may be disposed proximate to the connector assembly 20 and the second circuit board arrangement 50 may be disposed proximate to the sensor assembly 30. That is, the first circuit board arrangement 40 may be arranged further away from the sensor assembly 30 than the second circuit board arrangement 50. Thus, the first circuit board arrangement 40 can be arranged further away from the high-temperature medium than the second circuit board arrangement 50. This arrangement away from the high-temperature medium results in a lower temperature distribution in the vicinity of the first circuit board arrangement 40, more precisely a temperature distribution close to the temperature of the surroundings, and a higher temperature distribution in the vicinity of the second circuit board arrangement 50, more precisely a temperature distribution close to the temperature of the high-temperature medium.

Advantageously, provision is made for: the temperature-sensitive device 41 can be integrated on the first circuit board arrangement 40 and the temperature-sensitive device 41 can no longer be integrated on the second circuit board arrangement 50, but rather only the electrical connection features for the sensor assembly 30. Thus, by introducing a dual circuit board structure, the temperature sensitive device 41 can be allowed to be arranged away from the high temperature medium, avoiding the temperature sensitive device 41 from being subjected to high temperature interference. In some embodiments, the first circuit board arrangement 40 may be raised at least 4 mm, 5 mm, or even 6 mm relative to the second circuit board arrangement 50 along the longitudinal direction L of the sensing arrangement 100 to achieve a satisfactory temperature of the temperature sensitive device 41.

Furthermore, in order to avoid excessively long electrical connections between the temperature sensitive device 41 and the sensor assembly 30, the second circuit board arrangement 50 may function as an intermediate electrical switching arrangement between the first circuit board arrangement 40 and the temperature sensitive device 41. For this purpose, provision can be made for: the sensor assembly 30 is first electrically connected to an adjacent second circuit board arrangement 50 via conductive lines 42, 43, such as bond wires or bonding wires, and the second circuit board arrangement 50 may then be electrically connected to the first circuit board arrangement 40 via conductive structures 51. As shown in fig. 7 and 8, the temperature sensing element 33 may be electrically connected with an adjacent second circuit board arrangement 50 via a first electrically conductive line 42, and the pressure sensing element 34 may be electrically connected with an adjacent second circuit board arrangement 50 via a second electrically conductive line 43. The second circuit board arrangement 50 may then be electrically connected with the first circuit board arrangement 40 via a plurality of conductive structures 51. A reliable indirect electrical connection between the temperature-sensitive device 41, for example a processing chip, and the sensor assembly 30 is thereby achieved. It is to be understood that "electrically connected" in this application, unless explicitly stated otherwise, may include direct electrical connection between two components, as well as indirect electrical connection between two components via an intermediate transfer member.

In some embodiments, to further avoid excessively long conductive wires 42, 43 between the temperature sensitive device 41 and the second circuit board arrangement 50, as shown in fig. 7 and 8, the sensing arrangement 100 may comprise a jumper circuit board 60, which jumper circuit board 60 may be mounted between the second circuit board arrangement 50 and the first receiving cavity 31. Thereby, the second circuit board arrangement 50 can be electrically connected with the jumper circuit board 60 via the relatively short first electrically conductive line 42 and the jumper circuit board 60 can be electrically connected with the temperature sensing element 33 via the cable 61, thereby enabling a reliable electrical connection between the second circuit board arrangement 50 and the temperature sensing element 33. In some embodiments, the respective conductive lines 42, 43 may extend only a few millimeters in length to reach the second circuit board arrangement 50.

In some embodiments, to achieve efficient and reliable assembly, the first circuit board arrangement 40 may be mounted within the connector assembly 20. As shown in fig. 2, 3 and 4, the first circuit board arrangement 40 may be mounted in a receiving section 21 of the connector assembly 20 plugged onto the housing part 10. The connector assembly 20 and the first circuit board arrangement 40 may thus form a mounting assembly which is mounted as a whole to the housing part 10 during assembly. The second circuit board arrangement 50 may be secured to the sensor assembly 30. Advantageously, the second circuit board arrangement 50 may be supported on a support structure 52 and fixed to the sensor assembly 30 by means of metal snaps 53. Furthermore, an optional sealing ring 54 may be provided for the second circuit board arrangement 50 to ensure good sealing within the housing part 10.

Advantageously, the temperature sensitive device 41 may be mounted on a first surface of the first circuit board arrangement 40 facing away from the sensor assembly 30, thereby keeping the temperature sensitive device 41 as far away from the high temperature medium as possible. Further advantageously, a thermally conductive glue may be filled between the first surface of the first circuit board arrangement 40 and the connector assembly 20. The filled thermally conductive paste facilitates heat dissipation of the temperature sensitive device 41 on the first surface of the first circuit board arrangement 40 towards the ambient environment such that the temperature of the temperature sensitive device 41 is closer to the ambient temperature. In addition, the filled thermally conductive paste may further enhance the integration between the first circuit board assembly 40 and the connector assembly 20, which may also facilitate efficient and reliable assembly.

Additionally or alternatively, a thermal insulation glue may be filled between the first circuit board arrangement 40 and the second circuit board arrangement 50, the filled thermal insulation glue being advantageous for preventing the transfer of temperature from the high temperature medium towards the temperature sensitive device 41. In addition, the filled heat-insulating glue may further enhance the secure fit between the first circuit board arrangement 40 and the second circuit board arrangement 50.

In order to allow the transmission of the electrical signals detected by the sensing device 100 to an external system, the connector assembly 20 should be electrically connected with the first circuit board arrangement 40. As shown in fig. 4 and 5, the first circuit board arrangement 40 may include a through hole 23 through which the electrical connection terminal 22 of the connector assembly 20 passes and a pad around the through hole 23, and the electrical connection terminal 22 of the connector assembly 20 may extend through the through hole 23 and be soldered to the pad of the first circuit board arrangement 40. Thus, a reliable mechanical and electrical connection of the connector assembly 20 to the first circuit board arrangement 40 is advantageously achieved by soldering the electrical connection terminals 22 of the connector assembly 20 directly to the first circuit board arrangement 40. It should be appreciated that the electrical connection between the electrical connection terminals 22 of the connector assembly 20 and the first circuit board arrangement 40 may also be made indirectly through other conductive structures, such as conductive springs.

In order to achieve an electrical connection between the first circuit board arrangement 40 and the second circuit board arrangement 50, at least one electrically conductive structure 51, preferably a plurality of electrically conductive structures, may be connected across the first circuit board arrangement 40 and the second circuit board arrangement 50 and electrically connected to the first circuit board arrangement 40 and the second circuit board arrangement 50, respectively. The first circuit board arrangement 40 may include a first conductive region 55 and the second circuit board arrangement 50 may include a second conductive region 56 corresponding to the first conductive region. The first and second conductive areas 55, 56 may be disposed on the first and second circuit board arrangements 40, 50, for example, towards each other. The conductive structure 51 may be configured to electrically connect with the first conductive region 55 on a first side and with the second conductive region on a second side opposite the first side so as to create an electrical connection between the first circuit board device 40 and the second circuit board device 50. Advantageously, the conductive structure 51 may be configured to establish a reliable mechanical and electrical connection with the first and second conductive areas, respectively, by suitable means such as press contact and/or soldering.

In some embodiments, the first circuit board arrangement 40 may include a distributed arrangement of a plurality of first conductive regions 55 and the second circuit board arrangement 50 may include a distributed arrangement of a plurality of second conductive regions 56 corresponding to the first conductive regions 55, whereby the distributed arrangement of the plurality of conductive structures 51 may create a plurality of mechanical and electrical connections between the first circuit board arrangement 40 and the second circuit board arrangement 50, respectively. This further optimizes the reliable mechanical and electrical connection between the first circuit board arrangement 40 and the second circuit board arrangement 50.

In some embodiments, the first conductive region 55 may be configured as a first conductive ring disposed around the first via or first metallized via, and the second conductive region 56 may be configured as a second conductive ring disposed around the second via 57 or second metallized via. Thereby, the optimized electrical connection design of the conductive structure 51 with the first circuit board arrangement 40 and the second circuit board arrangement 50 is further improved. In some embodiments, the first conductive ring and the second conductive ring may be formed as an entirely continuous metal ring. In some embodiments, the first conductive ring and the second conductive ring may be formed as part of a metal ring or as an intermittent metal ring. Further, the shape of the first and second conductive rings may be varied, and the corresponding conductive rings may be circular rings, square rings, or other shaped rings.

Fig. 9 illustrates an exemplary perspective view of a first assembly scheme of a first circuit board device 40 and a second circuit board device 50 of a sensing device 100 according to some embodiments of the present application. As shown in fig. 9, the conductive structure 51 may advantageously be configured as a conductive spring which may be bridged between the first circuit board arrangement 40 and the second circuit board arrangement 50 along the longitudinal direction L of the sensor arrangement 100. To achieve an efficient and reliable assembly, the conductive spring may first extend through a second via on the second circuit board device 50 and be mechanically and electrically connected to the second conductive region by suitable means such as press contact and/or soldering. That is, the conductive spring may be preassembled on the second circuit board arrangement 50, thereby forming a preassembled assembly. For this purpose, the second via should be formed with a widening in size relative to a conventional via, for example the first via, in order to accommodate the conductive spring extending through. The first circuit board arrangement 40 or the connector assembly 20 integrated with the first circuit board arrangement 40 can then be moved along the longitudinal direction L of the sensor arrangement 100 towards the second circuit board arrangement 50, or rather towards the conductive springs extending out of the second circuit board arrangement 50, so that the first conductive areas on the first circuit board arrangement 40 are in pressing contact with the conductive springs. In the illustrated embodiment, the conductive spring may not extend through the first via on the first circuit board arrangement 40, but merely press contact onto the first conductive region of the first circuit board arrangement 40, via which the temperature sensitive device 41 on the other side of the first circuit board arrangement 40 may be electrically connected with the conductive spring. In some embodiments, one or more detents 14 may be formed on the outer periphery of the first receptacle 11 of the housing portion 10, the detents 14 being configured to abut against the receptacle section 21 of the connector assembly 20 so as to effectively resist the spring-back force caused by the compression of the conductive spring.

It should be understood that the conductive structure 51 may be configured as various forms of conductive structures 51, such as conductive pins or pins, and the like, and is not limited to the embodiments described herein.

Fig. 10 illustrates an exemplary perspective view of a second assembly scheme of a first circuit board device 40 and a second circuit board device 50 of a sensing device 100 according to some embodiments of the present application. As shown in fig. 10, the conductive structure 51 may advantageously be configured as a flexible circuit board, which may be configured to create an electrical connection between the first circuit board arrangement 40 and the second circuit board arrangement 50. Thereby a combination of a rigid first circuit board arrangement 40 and a rigid second circuit board arrangement 50 via a flexible circuit board is formed. In some embodiments, additional conductive structures, such as conductive springs, may also be bridged between the first circuit board arrangement 40 and the second circuit board arrangement 50 to make additional electrical connections.

Although exemplary embodiments of the present application have been described, it will be understood by those skilled in the art that various changes and modifications can be made to the exemplary embodiments of the present application without departing from the spirit and scope of the present application in essence. Accordingly, all changes and modifications are intended to be included within the scope of the present application.

Claims (18)

1. A sensor device, characterized in that the sensor device comprises a housing part, a connector assembly arranged on a first side of the housing part and a sensor assembly arranged on a second side of the housing part opposite the first side, wherein the sensor device further comprises a first circuit board arrangement and a second circuit board arrangement spaced apart from each other in the longitudinal direction of the sensor device, the second circuit board arrangement being arranged close to the sensor assembly and being electrically connected to the sensor assembly by means of an electrically conductive wire, the first circuit board arrangement being integrated with a temperature-sensitive device and being arranged further away from the sensor assembly relative to the second circuit board arrangement, the first circuit board arrangement being electrically connected to the second circuit board arrangement via an electrically conductive structure.

2. The sensing device of claim 1, wherein the first circuit board arrangement is mounted within the connector assembly such that the connector assembly and the first circuit board arrangement form a mounting assembly that is mounted as a unit to the housing portion during assembly.

3. The sensing device of claim 2, wherein the first circuit board arrangement includes a through hole through which an electrical connection terminal of the connector assembly extends and a pad surrounding the through hole, the electrical connection terminal of the connector assembly extending through the through hole and being soldered to the pad of the first circuit board arrangement.

4. The sensing device of claim 1, wherein the temperature sensitive device is mounted on a first surface of the first circuit board arrangement facing away from the sensor assembly.

5. The sensing device of claim 4, wherein a thermally conductive paste is filled between the first surface of the first circuit board arrangement and the connector assembly.

6. The sensing device of claim 1, wherein the first circuit board arrangement comprises a first conductive region and the second circuit board arrangement comprises a second conductive region corresponding to the first conductive region, the conductive structure being configured to electrically connect with the first conductive region on a first side and with the second conductive region on a second side opposite the first side so as to create an electrical connection between the first circuit board arrangement and the second circuit board arrangement.

7. The sensing device of claim 6, wherein the first conductive region is configured as a first conductive ring and the second conductive region is configured as a second conductive ring, the first conductive ring surrounding the first via and the second conductive ring surrounding the second via, wherein the conductive structure is configured to mechanically and electrically connect with the first conductive ring and the second conductive ring, respectively, by press contact and/or soldering.

8. The sensing device of claim 7, wherein the conductive structure is configured as a conductive spring.

9. The sensing device of claim 8, wherein the conductive spring extends through a second via on the second circuit board device and is mechanically and electrically connected to the second conductive region by press contact and/or soldering, and wherein the conductive spring extends toward the first circuit board device after extending through the second circuit board device and is press contacted to the first conductive region of the first circuit board device.

10. The sensing device of claim 1, wherein the conductive structure is configured as a flexible circuit board configured to create an electrical connection between the first circuit board arrangement and the second circuit board arrangement.

11. The sensing apparatus of claim 1, wherein the temperature sensitive device comprises a processing chip and the second circuit board means is devoid of a processing chip.

12. The sensor device according to claim 1, characterized in that the sensor device is configured as an integrated temperature and pressure sensor device, wherein the sensor assembly comprises a first receiving cavity, a second receiving cavity, a temperature sensor element and a pressure sensor element, the temperature sensor element being received in the first receiving cavity, the second receiving cavity allowing a medium to be measured to flow into and to the pressure sensor element mounted downstream of the second receiving cavity.

13. The sensing device of claim 1, wherein the conductive wire is configured as a bond wire or a bond wire.

14. The sensing device of claim 12, wherein the second circuit board arrangement is electrically connected to the temperature sensing element via a first conductive wire and to the pressure sensing element via a second conductive wire.

15. The sensing device of claim 14, wherein the sensing device comprises a jumper circuit board mounted between a second circuit board arrangement and the first receiving cavity, the second circuit board arrangement being electrically connected to the jumper circuit board via a first conductive line and the jumper circuit board being electrically connected to the temperature sensing element via a cable, thereby effecting an electrical connection between the second circuit board arrangement and the temperature sensing element.

16. The sensing device of claim 1, wherein the first circuit board arrangement is raised at least 4 millimeters relative to the second circuit board arrangement in a longitudinal direction of the sensing device.

17. Heat pump system, characterized in that it comprises one or more sensing devices according to one of claims 1 to 16, configured to measure the temperature and/or pressure of a medium within the heat pump system.

18. A vehicle, characterized in that it comprises a heat pump system according to claim 17.