CN117202545A - High-density packaging structure and packaging method of aerospace module power supply - Google Patents
High-density packaging structure and packaging method of aerospace module power supply Download PDFInfo
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- CN117202545A CN117202545A CN202311106827.6A CN202311106827A CN117202545A CN 117202545 A CN117202545 A CN 117202545A CN 202311106827 A CN202311106827 A CN 202311106827A CN 117202545 A CN117202545 A CN 117202545A
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- substrate
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- control circuit
- shell
- power circuit
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000013461 design Methods 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 12
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 238000000638 solvent extraction Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 230000036039 immunity Effects 0.000 abstract description 2
- 230000002401 inhibitory effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
The invention provides a high-density packaging structure and a packaging method of an aerospace module power supply, wherein the high-density packaging structure comprises a shell and a multi-layer three-dimensional substrate, the multi-layer three-dimensional substrate is arranged in the shell and comprises a power circuit substrate and a multi-layer control circuit substrate, the power circuit substrate is fixedly arranged at the bottom end of the shell, and the multi-layer control circuit substrate is fixedly arranged on the power circuit substrate, so that the space utilization rate in the shell is improved; the control circuit is integrated on the multi-layer control circuit substrate, so that the occupied area of the control circuit is reduced; the power circuit is integrated on the power circuit substrate, so that the problems of large current and concentrated heating points of the power part circuit are solved; the upper layers and the lower layers of the multilayer three-dimensional substrate are interconnected through the through holes and the flexible flat cables, so that the problem of difficult wiring of enameled wires is solved; the circuit design divides the control circuit and the power circuit into boards, thereby ensuring the stability of the control circuit, ensuring the reliable and stable transmission of control signals, effectively inhibiting the electromagnetic interference on the power circuit and preventing various faults caused by insufficient immunity.
Description
Technical Field
The invention relates to the technical field of high-density packaging, in particular to a high-density packaging structure and a packaging method of an aerospace module power supply.
Background
In recent years, in the fields of aerospace, vehicle-mounted chargers of electric vehicles and communication power supplies, the size and weight of high-precision equipment are gradually reduced, a power module is gradually developed towards miniaturization, light weight, high reliability, low cost and the like, a system is gradually smaller and lighter, components which need to be integrated together are gradually more and more, higher requirements are provided for application of a switching power supply, and the precision requirements of the components are correspondingly increased, so that new packaging and assembly forms are continuously emerging.
Limited space, the original assembly technology cannot meet the requirements of the electronic assembly technology, and the improvement of the power density of the module power supply can be realized through high-density packaging, so that the key point is generally how to reduce the size of the module power supply, namely, realize larger power in a smaller space, and the high-density packaging technology is an important technical approach for achieving the aims of miniaturization, light weight, high reliability and the like of electronic equipment.
The high-density three-dimensional assembly technology uses a high-density multi-layer substrate, through holes are adopted between the substrate layers for interconnection, and a plurality of semiconductor bare chips are mounted on a circuit substrate by adopting a micro-assembly process to realize physical and electrical connection. The high-density assembly technology is one of key technologies for realizing miniaturization, high performance and high reliability of electronic equipment, and has wide application in the field of army and civilian.
Disclosure of Invention
In a first aspect, the invention provides a high-density packaging structure of an aerospace module power supply, which comprises a shell and a multi-layer three-dimensional substrate, wherein the multi-layer three-dimensional substrate is arranged in the shell and comprises a power circuit substrate and a multi-layer control circuit substrate, the power circuit substrate is fixedly arranged at the bottom end in the shell and is used for bearing power components, the control circuit substrate is fixedly arranged on the power circuit substrate and is used for bearing the control components, through holes are formed in the control circuit substrate, and the upper layer and the lower layer of the multi-layer three-dimensional substrate are interconnected through the through holes and a flexible flat cable.
Optionally, the power circuit substrate adopts aluminium nitride AMB base plate, the positive circuit subregion of power circuit substrate sets up, including power input district, power output district, input control district, LTCC base plate subsides dress district, inductance subsides dress district and non-functional district, the power circuit substrate back is the welding area, and the welding area covers latticed conductor, is provided with the exhaust passage between the latticed conductor.
Optionally, the control circuit substrate is an LTCC ceramic substrate.
In a second aspect, the present invention provides a high density packaging method for an aerospace module power supply, including:
according to the circuit function design, a thick film hybrid integration process is adopted to generate a power circuit on an aluminum nitride AMB substrate, and a control circuit is generated on an LTCC ceramic substrate;
fixing an aluminum nitride AMB substrate at the bottom end of the inside of the shell, and bonding a plurality of layers of LTCC ceramic substrates on an LTCC substrate mounting area of the aluminum nitride AMB substrate through insulating glue;
connecting the substrates by using flexible flat cables to penetrate through holes on the LTCC ceramic substrate;
and packaging the upper opening of the shell to obtain the high-density packaged aerospace module power supply.
Compared with the prior art, the invention has the following positive effects:
the multi-layer three-dimensional substrate is adopted, so that the space utilization rate in the shell is improved by more than 50%;
integrating a control circuit on a multilayer LTCC ceramic substrate, wherein the occupied area of the control circuit is reduced by 20%;
the power circuit is integrated on the aluminum nitride AMB substrate, so that the problems of large current and concentrated heating points of the power part circuit are solved;
the upper and lower layers of substrates are interconnected by adopting flexible flat cables, so that the problem of difficult wiring of the enameled wires is solved;
the circuit design divides the control circuit and the power circuit into boards, thereby ensuring the stability of the control circuit, ensuring the reliable and stable transmission of control signals, effectively inhibiting the electromagnetic interference on the power circuit and preventing various faults caused by insufficient immunity.
It should be understood that the description of the invention above is not intended to limit key or critical features of embodiments of the invention, nor to limit the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it will be obvious that the drawings in the following description are some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort to a person skilled in the art.
Fig. 1 is a schematic diagram of a high-density package structure of an aerospace module power supply according to an embodiment of the disclosure;
fig. 2 is a circuit division schematic of a power circuit substrate.
Detailed Description
Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While the invention is susceptible of embodiment in the drawings, it is to be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, but rather are provided to provide a more thorough and complete understanding of the invention. It should be understood that the drawings and embodiments of the invention are for illustration purposes only and are not intended to limit the scope of the present invention.
In the process of high-density packaging of the power supply module, the process flow of three-dimensional assembly is required to be designed and planned in the early stage, and a reasonable three-dimensional packaging structure and process flow are selected.
In terms of structure, as shown in fig. 1, the high-density packaging structure of the aerospace module power supply comprises a shell and a double-layer three-dimensional substrate, wherein the double-layer three-dimensional substrate is arranged inside the shell and comprises a power circuit substrate and a control circuit substrate, and the assembly is changed from the traditional two-dimensional assembly to the three-dimensional assembly, so that the space utilization rate in the shell is greatly improved;
the power circuit substrate is fixedly arranged at the bottom end inside the shell, the power circuit substrate adopts an aluminum nitride AMB substrate, the total thickness of the substrate is 1.04mm, the ceramic thickness is 0.64mm, the thickness of an oxygen-free copper conductor on the front side and the back side is 0.2mm, four corners of the substrate are dulled (45 degrees, 0.4 mm), devices with larger current or larger size are assembled on the aluminum nitride AMB substrate in the power module, the devices assembled on the aluminum nitride AMB substrate comprise an input inductor, a capacitor, a transformer, a main switching tube, an output inductor, a capacitor and a synchronous rectification switching tube, the circuit area on the front side of the power circuit substrate is arranged, as shown in fig. 2, the power circuit substrate comprises a power input area, a power output area, an input control area, an LTCC substrate mounting area, an inductor mounting area and a non-functional area, the insulation safety distance between the input and the output is more than or equal to 0.6mm, the isolation exceeds 1800V, in order to ensure that the patterns on the front side of the substrate are uniform and symmetrical, the grid-shaped conductors are covered by the grid-shaped conductors, the grid-shaped conductors are 4mm by 4mm, the back side of the power circuit substrate is a welding area, the welding area covers the grid-shaped conductors, the exhaust channel is arranged between the grid-shaped conductors, the exhaust channel width is 0.9mm, the positive voltage-resistant conductor is required to be high, and the voltage-resistant channel is designed to be 78 mm;
the control circuit substrate is adhered to the power circuit substrate through insulating glue, the control circuit substrate adopts an LTCC ceramic substrate, devices assembled on the LTCC ceramic substrate comprise an auxiliary power supply part, a PWM control part, a feedback control loop and the like, the total thickness is 1.5mm, 9 layers of conductors are arranged, the surface layer of the substrate is made of gold (a wire bonding area, a glue bonding area and a wiring) and platinum (a welding area), the inner layer of the substrate is made of silver, the wiring line width/line spacing in the substrate is 0.2mm, the minimum line spacing is 0.15mm, through holes are formed in the LTCC ceramic substrate, the diameter is 0.2mm, the center distance of the holes is 0.4mm at the minimum, more than 30 film resistors are arranged on the LTCC ceramic substrate, more than 30 bare chips such as a second triode and the like are connected physically and electrically, the production cost of electronic products is greatly reduced, the physical space is reduced, and the electronic products are miniaturized, portable and attractive;
the aluminum nitride AMB substrate and the LTCC ceramic substrate are interconnected through the through holes and the flexible flat cables, so that the traditional enameled wire interconnection is replaced, manual welding spots are reduced, and the manufacturability of products is greatly improved.
In the aspect of assembly technology, high-density three-dimensional mounting is adopted, so that mounting precision and mounting density are improved, and mounting consistency is ensured; meanwhile, the integrated design of the substrate ensures that the welding is seamless, achieves better shielding effect and makes isolation of signals; in addition, different solders are adopted among different layers, so that the matching among the welding, the temperature gradient of the solders, the welding process curve and the sealing effect after welding are ensured, and the requirement of a product is finally met.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (4)
1. The utility model provides a high density packaging structure of space navigation module power, its characterized in that includes shell and multilayer three-dimensional base plate, multilayer three-dimensional base plate sets up inside the shell, including power circuit base plate and multilayer control circuit base plate, power circuit base plate is fixed to be set up in the inside bottom of shell for bear power components and parts, control circuit base plate is fixed on power circuit base plate for bear control components and parts, be provided with the through-hole on the control circuit base plate, interconnect through-hole and flexible winding displacement between the upper and lower layers of multilayer three-dimensional base plate.
2. The high-density packaging structure of an aerospace module power supply according to claim 1, wherein the power circuit substrate is an aluminum nitride AMB substrate, the front circuit of the power circuit substrate is arranged in a partitioning mode and comprises a power input area, a power output area, an input control area, an LTCC substrate mounting area, an inductance mounting area and a non-functional area, the back surface of the power circuit substrate is a welding area, the welding area covers grid conductors, and exhaust channels are arranged between the grid conductors.
3. The high-density package structure of an aerospace module power supply of claim 1, wherein the control circuit substrate is an LTCC ceramic substrate.
4. A high density packaging method for an aerospace module power supply, comprising:
according to the circuit function design, a thick film hybrid integration process is adopted to generate a power circuit on an aluminum nitride AMB substrate, and a control circuit is generated on an LTCC ceramic substrate;
fixing an aluminum nitride AMB substrate at the bottom end of the inside of the shell, and bonding a plurality of layers of LTCC ceramic substrates on an LTCC substrate mounting area of the aluminum nitride AMB substrate through insulating glue;
connecting the substrates by using flexible flat cables to penetrate through holes on the LTCC ceramic substrate;
and packaging the upper opening of the shell to obtain the high-density packaged aerospace module power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311106827.6A CN117202545B (en) | 2023-08-30 | 2023-08-30 | High-density packaging structure of aerospace module power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311106827.6A CN117202545B (en) | 2023-08-30 | 2023-08-30 | High-density packaging structure of aerospace module power supply |
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| Publication Number | Publication Date |
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| CN117202545A true CN117202545A (en) | 2023-12-08 |
| CN117202545B CN117202545B (en) | 2024-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311106827.6A Active CN117202545B (en) | 2023-08-30 | 2023-08-30 | High-density packaging structure of aerospace module power supply |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170034913A1 (en) * | 2015-07-28 | 2017-02-02 | Infineon Technologies Ag | PCB Based Semiconductor Package Having Integrated Electrical Functionality |
| CN107063232A (en) * | 2016-12-23 | 2017-08-18 | 中国电子科技集团公司信息科学研究院 | The navigator fix time service microdevice and its integrated approach of High Density Integration |
| CN206947320U (en) * | 2017-06-21 | 2018-01-30 | 北京七星华创微电子有限责任公司 | A kind of electronic device package shell |
| CN110176439A (en) * | 2019-05-29 | 2019-08-27 | 中国电子科技集团公司第四十三研究所 | A kind of module SiP structure and its manufacturing method |
| US20230268251A1 (en) * | 2021-08-11 | 2023-08-24 | Huawei Technologies Co.,Ltd. | Encapsulation Structure and Encapsulation Method of Power Module |
-
2023
- 2023-08-30 CN CN202311106827.6A patent/CN117202545B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170034913A1 (en) * | 2015-07-28 | 2017-02-02 | Infineon Technologies Ag | PCB Based Semiconductor Package Having Integrated Electrical Functionality |
| CN107063232A (en) * | 2016-12-23 | 2017-08-18 | 中国电子科技集团公司信息科学研究院 | The navigator fix time service microdevice and its integrated approach of High Density Integration |
| CN206947320U (en) * | 2017-06-21 | 2018-01-30 | 北京七星华创微电子有限责任公司 | A kind of electronic device package shell |
| CN110176439A (en) * | 2019-05-29 | 2019-08-27 | 中国电子科技集团公司第四十三研究所 | A kind of module SiP structure and its manufacturing method |
| US20230268251A1 (en) * | 2021-08-11 | 2023-08-24 | Huawei Technologies Co.,Ltd. | Encapsulation Structure and Encapsulation Method of Power Module |
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| Publication number | Publication date |
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| CN117202545B (en) | 2024-05-10 |
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