CN117182233A - Intelligent soldering tin detection method and system - Google Patents
Intelligent soldering tin detection method and system Download PDFInfo
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- CN117182233A CN117182233A CN202311215170.7A CN202311215170A CN117182233A CN 117182233 A CN117182233 A CN 117182233A CN 202311215170 A CN202311215170 A CN 202311215170A CN 117182233 A CN117182233 A CN 117182233A
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- 238000005476 soldering Methods 0.000 title claims abstract description 278
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 227
- 238000001514 detection method Methods 0.000 title claims abstract description 55
- 230000002159 abnormal effect Effects 0.000 claims abstract description 80
- 238000004140 cleaning Methods 0.000 claims abstract description 47
- 238000003466 welding Methods 0.000 claims abstract description 40
- 238000007689 inspection Methods 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims description 57
- 230000005856 abnormality Effects 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000010924 continuous production Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims 4
- 238000000034 method Methods 0.000 abstract description 27
- 238000012423 maintenance Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses an intelligent soldering tin detection method and system, wherein the method comprises the following steps: acquiring soldering temperature of soldering points; if the soldering temperature is within the preset range, marking that the temperature point inspection is normal, and obtaining product information; when the product is placed, soldering is carried out, and the soldering times of a soldering head are obtained; if the number of soldering tin times of the soldering heads reaches the number of the soldering heads for cleaning, a cleaning instruction is sent, and the soldering heads are controlled to clean; after the welding head is cleaned, continuing to open soldering tin, and acquiring the soldering tin temperature; if the soldering tin temperature is normal after the soldering tin is cleaned, controlling the soldering tin to be continuously produced; if the soldering tin temperature is abnormal after the soldering tin is cleaned, a shutdown instruction is sent, and the control equipment sends out an alarm prompt.
Description
Technical Field
The application relates to the field of equipment management, in particular to an intelligent soldering tin detection method and system.
Background
The soldering machine is a device for welding by a welding method of penetrating and filling gaps at the joints of metal pieces after low-melting-point metal solder is heated and melted, is mainly applied to electronic processing and is used for welding and fixing a printed circuit board, but in the soldering process, the soldering effect is poor and even the soldering machine is damaged due to the change of some parameters, so that the intelligent soldering detection is performed on the soldering machine, the soldering efficiency is improved, and the technical problem to be solved is urgent.
Disclosure of Invention
The application aims to realize intelligent soldering tin detection and improve soldering tin efficiency.
The technical aim of the application is realized by the following technical scheme:
the application discloses an intelligent soldering tin detection method, which comprises the following steps:
acquiring soldering temperature of soldering points;
if the soldering temperature is within the preset range, marking that the temperature point inspection is normal, and obtaining product information;
when the product is placed, soldering is carried out, and the soldering times of a soldering head are obtained;
if the number of soldering tin times of the soldering heads reaches the number of the soldering heads for cleaning, a cleaning instruction is sent, and the soldering heads are controlled to clean;
after the welding head is cleaned, continuing to open soldering tin, and acquiring the soldering tin temperature;
if the soldering tin temperature is normal after the soldering tin is cleaned, controlling the soldering tin to be continuously produced;
if the soldering tin temperature is abnormal after the soldering head is cleaned, a shutdown instruction is sent, and the control equipment sends out an alarm prompt.
According to the scheme, the temperature of the soldering point is detected, the soldering tin is started when the temperature is normal, the number of times of soldering tin is monitored in the soldering tin process, when the number of times of soldering tin reaches the number of the cleaning welding heads, the cleaning of the welding heads is controlled, the soldering tin is continued after the cleaning is finished if the temperature of the soldering tin is normal, and if the temperature of the soldering tin is abnormal, the machine is stopped for maintenance, so that the soldering tin stability is ensured, and the soldering tin efficiency is improved.
Optionally, the method for detecting intelligent soldering tin further includes:
and if the quantity of the soldering tin products reaches the production set quantity, sending the cleaning quality, and controlling the welding head to clean.
According to the scheme, when the number of soldering tin products reaches the production set number, the soldering tips are controlled to be cleaned, so that the number of the cleaning soldering tips can be cleared when soldering tin is performed next time, and the stability of soldering tin is ensured.
Optionally, the intelligent solder detecting method further includes, after the step of obtaining the solder temperature of the solder point:
if the soldering tin temperature exceeds a preset range, marking temperature point detection abnormality, and acquiring the abnormality times of the point detection position;
if the abnormal number of the spot detection positions of the abnormal temperature spot detection is smaller than or equal to the abnormal number threshold, controlling the soldering tin temperature, and carrying out soldering tin temperature compensation;
and after the temperature compensation of the soldering tin, carrying out temperature spot inspection on the abnormal point position again, and if the abnormal times of the temperature spot inspection of the soldering tin is greater than a threshold value, sending a shutdown instruction, and sending an alarm prompt by the control equipment.
According to the scheme, when the soldering tin temperature exceeds the preset range, if the abnormal times of the temperature point detection of the soldering tin point do not exceed the abnormal times threshold, temperature compensation is carried out, detection is carried out again, if the abnormal times of the temperature point detection of the soldering tin point exceed the abnormal times threshold, shutdown maintenance is carried out, and the abnormal reasons are determined through the temperature compensation.
Optionally, the intelligent solder detecting method, wherein before the step of obtaining the solder temperature of the solder point, further includes:
the feeder is provided with a tin wire;
and acquiring the radius of the tin wire, selecting a corresponding functional component, and feeding.
According to the scheme, the feeder is used for installing the tin wire, and the functional component is determined to feed based on the radius of the tin wire, so that the stability of the tin wire of soldering tin is ensured.
Optionally, the method for detecting intelligent soldering tin further includes:
acquiring a feeder signal;
and if the feeder signal is abnormal, sending a shutdown instruction, and sending an alarm prompt by the control equipment.
According to the scheme, the feeder signal is obtained, and the machine is stopped for maintenance when the signal is abnormal, so that the damage caused by the dry running of equipment is reduced.
Optionally, the abnormal signal of the feeder includes a material shortage signal and a tin blocking signal.
According to the scheme, when the feeder lacks materials or has tin blockage, an abnormal signal of the feeder is output, and the feeder is stopped and maintained in time.
In another aspect of the present application, an intelligent solder detection system is disclosed, comprising:
the soldering tin temperature acquisition module is used for acquiring soldering tin temperature of the soldering tin point positions;
the product information acquisition module is used for marking that the temperature spot inspection is normal if the soldering tin temperature is within a preset range and acquiring product information;
the welding head parameter acquisition module is used for carrying out soldering tin after the product is placed, and acquiring the soldering times of the welding head;
the welding head cleaning control module is used for sending a cleaning instruction to control the welding head to clean if the number of times of welding head soldering tin reaches the number of cleaning welding heads;
the soldering tin temperature acquisition module is also used for acquiring soldering tin temperature after the soldering tin is continuously started after the soldering tip is cleaned;
the control module is used for controlling continuous production of soldering tin if the soldering tin temperature is normal after the soldering tin is cleaned;
and the control module is also used for sending a shutdown instruction if the soldering tin temperature is abnormal after the soldering tin is cleaned, and the control equipment sends out an alarm prompt.
According to the scheme, the temperature of the soldering point is detected, the soldering tin is started when the temperature is normal, the number of times of soldering tin is monitored in the soldering tin process, when the number of times of soldering tin reaches the number of the cleaning welding heads, the cleaning of the welding heads is controlled, the soldering tin is continued after the cleaning is finished if the temperature of the soldering tin is normal, and if the temperature of the soldering tin is abnormal, the machine is stopped for maintenance, so that the soldering tin stability is ensured, and the soldering tin efficiency is improved.
Optionally, in the intelligent solder detecting system, the soldering head cleaning control module is further configured to send cleaning quality and control the soldering head to clean if the quantity of the solder products reaches the production set quantity.
According to the scheme, when the number of soldering tin products reaches the production set number, the soldering tips are controlled to be cleaned, so that the number of the cleaning soldering tips can be cleared when soldering tin is performed next time, and the stability of soldering tin is ensured.
Optionally, the intelligent solder detection system, wherein the system further includes:
the temperature spot inspection abnormal times acquisition module is used for marking temperature spot inspection abnormal times and acquiring abnormal times of spot inspection positions if the temperature of the soldering tin exceeds a preset range;
the temperature compensation module is used for controlling the soldering tin temperature and carrying out soldering tin temperature compensation if the abnormal number of the point detection position of the abnormal temperature point detection is smaller than or equal to the abnormal number threshold value;
the temperature point detection abnormality processing module is used for detecting the temperature point of the abnormal point again after the temperature compensation of the soldering tin, sending a shutdown instruction if the abnormal times of the temperature point detection of the soldering tin is greater than a threshold value, and sending an alarm prompt by the control equipment
According to the scheme, when the soldering tin temperature exceeds the preset range, if the abnormal times of the temperature point detection of the soldering tin point do not exceed the abnormal times threshold, temperature compensation is carried out, detection is carried out again, if the abnormal times of the temperature point detection of the soldering tin point exceed the abnormal times threshold, shutdown maintenance is carried out, and the abnormal reasons are determined through the temperature compensation.
Optionally, the intelligent solder detection system, wherein the system further includes:
the feeder signal acquisition module is used for acquiring feeder signals;
and the feeder abnormality processing module is used for sending a shutdown instruction if the feeder signal is abnormal, and the control equipment sends out an alarm prompt.
According to the scheme, the feeder is used for installing the tin wire, and the functional component is determined to feed based on the radius of the tin wire, so that the stability of the tin wire of soldering tin is ensured.
In summary, the application has at least one of the following beneficial effects
1, detecting the temperature of a soldering point, opening soldering tin when the temperature is normal, monitoring the number of times of soldering tin in the soldering tin process, controlling soldering tin to be cleaned when the number of times of soldering tin reaches the number of cleaning soldering heads, continuing soldering tin after cleaning is finished, continuing soldering tin if the temperature of the soldering tin is normal after cleaning is finished, stopping for maintenance if the temperature of the soldering tin is abnormal, ensuring the stability of the soldering tin, and improving the soldering tin efficiency;
2 when the number of soldering tin products reaches the set number of production, the cleaning of the welding heads can be controlled, so that the number of the cleaning welding heads can be cleared when soldering tin is carried out next time, and the stability of the soldering tin is ensured.
And 3, when the soldering temperature exceeds a preset range, if the abnormal times of the temperature point detection of the soldering point do not exceed the abnormal times threshold, performing temperature compensation, detecting again, and if the abnormal times of the temperature point detection of the soldering point exceeds the abnormal times threshold, stopping the machine for maintenance, and determining the reason of the abnormality through the temperature compensation.
Drawings
FIG. 1 is a flowchart illustrating steps of a method for intelligent solder inspection according to a preferred embodiment of the present application.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings.
The first embodiment of the application discloses an intelligent soldering tin detection method, which comprises the following steps:
acquiring soldering temperature of soldering points;
the soldering machine may include a plurality of soldering tin points, carries out the temperature point to the soldering tin point through the soldering tin temperature that acquires the soldering tin point and examines, and different soldering tin scenes, standard soldering tin temperature can be distinguished, consequently, can carry out the temperature contrast through the soldering tin temperature of predetermineeing the soldering tin temperature, reacquiring the soldering tin point again, confirm whether soldering tin temperature is normal.
If the soldering temperature is within the preset range, marking that the temperature point inspection is normal, and obtaining product information;
as described in the foregoing embodiment, after the solder temperature of the solder point is obtained, the standard solder temperature is determined, and then compared with the standard solder temperature, if the solder temperature is within the preset range, in the embodiment of the present application, it is preferable that the difference between the standard solder temperature and the standard solder temperature is within 10 degrees, that is, the solder temperature of the solder point is within the range of plus or minus 10 degrees, which means that the solder temperature of the solder point is normal, and at this time, the temperature point of the solder point is marked as normal, so that the solder operation can be performed, product information can be obtained, product information to be soldered can be obtained, and whether to open the solder is determined.
When the product is placed, soldering is carried out, and the soldering times of a soldering head are obtained;
after the product information of the to-be-soldered tin is obtained, whether the to-be-soldered tin is placed is determined, after the placement is completed, the soldering tin is started, in the soldering tin process, the soldering head possibly needs to be cleaned along with the increase of the soldering tin times, so that the soldering tin efficiency is ensured, and whether the soldering head needs to be cleaned is determined by obtaining the soldering tin times of the soldering head.
If the number of soldering tin times of the soldering heads reaches the number of the soldering heads for cleaning, a cleaning instruction is sent, and the soldering heads are controlled to clean;
in the soldering process, the soldering head is required to be cleaned when the number of times of soldering tin reaches a certain number, so that the cleaning quality is sent when the number of times of soldering tin is counted, and the cleaning of the soldering head is controlled. The specific number of cleaning heads may be preset.
After the welding head is cleaned, continuing to open soldering tin, and acquiring the soldering tin temperature;
after the soldering tin is cleaned, the soldering tin can be started again, the number of the cleaning soldering tin is cleared at the moment, the counting is started again, and in order to determine the stability of the soldering tin, the soldering tin temperature needs to be acquired again, and whether the soldering tin temperature is normal or not is judged.
If the soldering tin temperature is normal after the soldering tin is cleaned, controlling the soldering tin to be continuously produced;
in the specific implementation, if the soldering tin temperature is normal after the soldering tin is cleaned, the stability is normal after the soldering tin is cleaned, and the continuous production of soldering tin can be controlled normally.
If the soldering tin temperature is abnormal after the soldering head is cleaned, a shutdown instruction is sent, and the control equipment sends out an alarm prompt.
And after the welding head is cleaned, if the soldering tin temperature is abnormal, the welding head is damaged after the cleaning is finished, at the moment, a shutdown instruction is sent, the equipment is controlled to stop, an alarm prompt, such as a buzzing prompt mode, is sent, subsequent maintenance personnel can perform manual processing, the equipment is controlled to reset, and the carrier is controlled to withdraw for manual blanking. And opening the soldering tin again after the equipment is maintained.
In some possible embodiments of the present application, the method for intelligent solder detection, wherein the method further comprises:
and if the quantity of the soldering tin products reaches the production set quantity, sending the cleaning quality, and controlling the welding head to clean.
In the implementation, besides the quantity of the welding heads for cleaning, there is a lot of products produced, and when the next lot of product soldering tin is waited, there is a possibility that the time is long, in order to reduce the influence caused by the welding heads in the next lot of product soldering tin process, the welding heads are cleaned when the quantity of soldering tin products reaches the set quantity of production, at this time, the quantity of the welding heads for cleaning can be guaranteed to be cleared when the next lot of soldering tin is started, and the stability of the next lot of product soldering tin is facilitated.
In some possible embodiments of the present application, the intelligent solder detecting method further includes, after the step of obtaining the solder temperature of the solder point:
if the soldering tin temperature exceeds a preset range, marking temperature point detection abnormality, and acquiring the abnormality times of the point detection position;
if the abnormal number of the spot detection positions of the abnormal temperature spot detection is smaller than or equal to the abnormal number threshold, controlling the soldering tin temperature, and carrying out soldering tin temperature compensation;
and after the temperature compensation of the soldering tin, carrying out temperature spot inspection on the abnormal point position again, and if the abnormal times of the temperature spot inspection of the soldering tin is greater than a threshold value, sending a shutdown instruction, and sending an alarm prompt by the control equipment.
In the embodiment of the application, when the soldering temperature is normal, the soldering step is directly carried out, and when the soldering temperature exceeds a preset range, for example, the positive and negative difference is more than 10 degrees, at this time, the abnormal times of abnormal points are counted, if the times are less than or equal to the abnormal times threshold value, for example, 2 times, the abnormal times are counted, the self-repairing is carried out at this time, the soldering temperature is controlled in a temperature compensation mode, after the temperature compensation, the self-repairing is carried out again, if the temperature is still not in the preset range, when the abnormal times are more than 2 times, the self-repairing cannot be finished, at this time, a shutdown instruction is required to be sent, equipment shutdown is controlled, and an alarm prompt, for example, a buzzer prompt mode is sent, the subsequent maintenance personnel can carry out manual processing, control equipment reset and control the carrier to exit, and manual blanking is carried out. And opening the soldering tin again after the equipment is maintained.
In some possible embodiments of the present application, the intelligent solder detecting method, before the step of obtaining the solder temperature of the solder point, further includes:
the feeder is provided with a tin wire;
and acquiring the radius of the tin wire, selecting a corresponding functional component, and feeding.
In the embodiment of the application, the feeder can feed and mount tin wires through the feeder, and in the mounting process, different tin wires correspond to different functional components, for example, the radius of the tin wires is 0.3-0.6mm, the tin wire is not broken, the radius of the tin wires is 0.7-1.6mm, the tin wire is fed by the tin breaking functional components, the tin wires are determined based on different tin soldering products, and then the corresponding functional components are determined, so that the stability of tin soldering is ensured.
In some possible embodiments of the present application, the method for intelligent solder detection, wherein the method further comprises:
acquiring a feeder signal;
and if the feeder signal is abnormal, sending a shutdown instruction, and sending an alarm prompt by the control equipment.
In the embodiment of the application, besides the soldering tin detection in the soldering tin process, the method also comprises the steps of obtaining a signal of the feeder, sending a stop instruction based on an abnormal signal of the feeder, controlling equipment to stop, and sending an alarm prompt, such as a buzzing prompt mode, wherein subsequent maintenance personnel can perform manual processing, control equipment to reset, control a carrier to withdraw, and perform manual blanking. And opening the soldering tin again after the equipment is maintained. Specifically, the abnormal signals of the feeder comprise a material shortage signal and a tin blocking signal, and when the material is deficient or the tin is blocked, the control equipment stops and gives an alarm for prompting.
In another embodiment of the present application, an intelligent solder detection system is disclosed, which includes:
the soldering tin temperature acquisition module is used for acquiring soldering tin temperature of the soldering tin point positions;
the product information acquisition module is used for marking that the temperature spot inspection is normal if the soldering tin temperature is within a preset range and acquiring product information;
the welding head parameter acquisition module is used for carrying out soldering tin after the product is placed, and acquiring the soldering times of the welding head;
the welding head cleaning control module is used for sending a cleaning instruction to control the welding head to clean if the number of times of welding head soldering tin reaches the number of cleaning welding heads;
the soldering tin temperature acquisition module is also used for acquiring soldering tin temperature after the soldering tin is continuously started after the soldering tip is cleaned;
the control module is used for controlling continuous production of soldering tin if the soldering tin temperature is normal after the soldering tin is cleaned;
and the control module is also used for sending a shutdown instruction if the soldering tin temperature is abnormal after the soldering tin is cleaned, and the control equipment sends out an alarm prompt.
The functions and implementation of each module of the system of the present application have been described in detail in the method steps correspondingly, and will not be described herein.
Optionally, in the intelligent solder detecting system, the soldering head cleaning control module is further configured to send cleaning quality if the number of solder products reaches the production set number, and control the soldering head to clean
The functions and implementation of each module of the system of the present application have been described in detail in the method steps correspondingly, and will not be described herein.
Optionally, the intelligent solder detection system, wherein the system further includes:
the temperature spot inspection abnormal times acquisition module is used for marking temperature spot inspection abnormal times and acquiring abnormal times of spot inspection positions if the temperature of the soldering tin exceeds a preset range;
the temperature compensation module is used for controlling the soldering tin temperature and carrying out soldering tin temperature compensation if the abnormal number of the point detection position of the abnormal temperature point detection is smaller than or equal to the abnormal number threshold value;
the temperature point detection abnormality processing module is used for detecting the temperature point of the abnormal point again after the temperature compensation of the soldering tin, sending a shutdown instruction if the abnormal times of the temperature point detection of the soldering tin is greater than a threshold value, and sending an alarm prompt by the control equipment
The functions and implementation of each module of the system of the present application have been described in detail in the method steps correspondingly, and will not be described herein.
Optionally, the intelligent solder detection system, wherein the system further includes:
the feeder signal acquisition module is used for acquiring feeder signals;
and the feeder abnormality processing module is used for sending a shutdown instruction if the feeder signal is abnormal, and the control equipment sends out an alarm prompt.
The functions and implementation of each module of the system of the present application have been described in detail in the method steps correspondingly, and will not be described herein.
The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in this way, therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (10)
1. An intelligent solder detection method is characterized by comprising the following steps:
acquiring soldering temperature of soldering points;
if the soldering temperature is within the preset range, marking that the temperature point inspection is normal, and obtaining product information;
when the product is placed, soldering is carried out, and the soldering times of a soldering head are obtained;
if the number of soldering tin times of the soldering heads reaches the number of the soldering heads for cleaning, a cleaning instruction is sent, and the soldering heads are controlled to clean;
after the welding head is cleaned, continuing to open soldering tin, and acquiring the soldering tin temperature;
if the soldering tin temperature is normal after the soldering tin is cleaned, controlling the soldering tin to be continuously produced;
if the soldering tin temperature is abnormal after the soldering head is cleaned, a shutdown instruction is sent, and the control equipment sends out an alarm prompt.
2. The intelligent solder testing method of claim 1, further comprising:
and if the quantity of the soldering tin products reaches the production set quantity, sending the cleaning quality, and controlling the welding head to clean.
3. The intelligent solder testing method according to claim 1, wherein the step of obtaining the solder temperature of the solder site further comprises:
if the soldering tin temperature exceeds a preset range, marking temperature point detection abnormality, and acquiring the abnormality times of the point detection position;
if the abnormal number of the spot detection positions of the abnormal temperature spot detection is smaller than or equal to the abnormal number threshold, controlling the soldering tin temperature, and carrying out soldering tin temperature compensation;
and after the temperature compensation of the soldering tin, carrying out temperature spot inspection on the abnormal point position again, and if the abnormal times of the temperature spot inspection of the soldering tin is greater than a threshold value, sending a shutdown instruction, and sending an alarm prompt by the control equipment.
4. The intelligent solder testing method according to claim 1, wherein the step of obtaining the solder temperature of the solder dot further comprises:
the feeder is provided with a tin wire;
and acquiring the radius of the tin wire, selecting a corresponding functional component, and feeding.
5. The intelligent solder detection method of claim 4, further comprising:
acquiring a feeder signal;
and if the feeder signal is abnormal, sending a shutdown instruction, and sending an alarm prompt by the control equipment.
6. The intelligent solder testing method of claim 5, wherein the feeder anomaly signal comprises a starved signal and a blocked tin signal.
7. An intelligent solder detection system, comprising:
the soldering tin temperature acquisition module is used for acquiring soldering tin temperature of the soldering tin point positions;
the product information acquisition module is used for marking that the temperature spot inspection is normal if the soldering tin temperature is within a preset range and acquiring product information;
the welding head parameter acquisition module is used for carrying out soldering tin after the product is placed, and acquiring the soldering times of the welding head;
the welding head cleaning control module is used for sending a cleaning instruction to control the welding head to clean if the number of times of welding head soldering tin reaches the number of cleaning welding heads;
the soldering tin temperature acquisition module is also used for acquiring soldering tin temperature after the soldering tin is continuously started after the soldering tip is cleaned;
the control module is used for controlling continuous production of soldering tin if the soldering tin temperature is normal after the soldering tin is cleaned;
and the control module is also used for sending a shutdown instruction if the soldering tin temperature is abnormal after the soldering tin is cleaned, and the control equipment sends out an alarm prompt.
8. The intelligent solder inspection system of claim 7, wherein the solder head cleaning control module is further configured to send a cleaning quality to control solder head cleaning if the quantity of solder product reaches a production set quantity.
9. The intelligent solder detection system of claim 7, wherein the system further comprises:
the temperature spot inspection abnormal times acquisition module is used for marking temperature spot inspection abnormal times and acquiring abnormal times of spot inspection positions if the temperature of the soldering tin exceeds a preset range;
the temperature compensation module is used for controlling the soldering tin temperature and carrying out soldering tin temperature compensation if the abnormal number of the point detection position of the abnormal temperature point detection is smaller than or equal to the abnormal number threshold value;
and the temperature point detection abnormality processing module is used for carrying out temperature point detection on the abnormal point position again after the temperature compensation of the soldering tin, and sending a shutdown instruction if the abnormal times of the soldering tin temperature point detection are greater than a threshold value, and the control equipment sends an alarm prompt.
10. The intelligent solder detection system of claim 7, wherein the system further comprises:
the feeder signal acquisition module is used for acquiring feeder signals;
and the feeder abnormality processing module is used for sending a shutdown instruction if the feeder signal is abnormal, and the control equipment sends out an alarm prompt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311215170.7A CN117182233A (en) | 2023-09-20 | 2023-09-20 | Intelligent soldering tin detection method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311215170.7A CN117182233A (en) | 2023-09-20 | 2023-09-20 | Intelligent soldering tin detection method and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117182233A true CN117182233A (en) | 2023-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311215170.7A Pending CN117182233A (en) | 2023-09-20 | 2023-09-20 | Intelligent soldering tin detection method and system |
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| Country | Link |
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| CN (1) | CN117182233A (en) |
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2023
- 2023-09-20 CN CN202311215170.7A patent/CN117182233A/en active Pending
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