CN116896860A - SMT production line quality monitoring and analyzing method and system based on 5G - Google Patents
SMT production line quality monitoring and analyzing method and system based on 5G Download PDFInfo
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Abstract
The invention provides a quality monitoring and analyzing method and system for a SMT production line based on 5G. The monitoring and analyzing method comprises the following steps: acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of SMT production line equipment and PCB pictures after SMT slicing in real time, and sending the operation data parameters and the PCB pictures after SMT slicing to a quality monitoring terminal through 5G communication equipment; the quality monitoring terminal judges whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters; the quality monitoring terminal screens a patch quality monitoring strategy according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of SMT production line equipment; and the quality monitoring terminal detects and identifies the PCB picture according to the determined patch quality monitoring strategy, and judges whether the SMT sliced product is abnormal or not. The system comprises modules corresponding to the method steps.
Description
Technical Field
The invention provides a quality monitoring and analyzing method and system of an SMT production line based on 5G, and belongs to the technical field of SMT operation quality detection.
Background
The SMT chip is a process flow for processing on a Printed Circuit Board (PCB), and equipment required by the SMT chip is an SMT chip mounter. The SMT chip mounter comprises positioning equipment, a mechanical arm and welding equipment, and each part needs to be precisely matched to realize precise alignment of each electronic component on a Printed Circuit Board (PCB).
Most of the existing SMT patch quality detection systems only acquire PCB pictures for continuous image detection to the SMT patches, so that the quality of products is judged, but comprehensive detection cannot be performed on the whole operation quality of the production line, so that larger inferior products continuously appear, and cost loss is increased. The existing comprehensive evaluation of some production lines usually only detects all data acquired by all sensors of the production lines at a certain moment, so that abnormal operation equipment cannot be determined, the accuracy of the overall total evaluation of the production lines is low, and the problem of easy occurrence of abnormal misjudgment is caused.
Disclosure of Invention
The invention provides a quality monitoring and analyzing method and system for an SMT production line based on 5G, which are used for solving the problems that in the prior art, the accuracy of overall total evaluation of the production line is low and abnormal misjudgment is easy to occur because targeted operation evaluation cannot be carried out according to different equipment types for the operation quality of the SMT production line:
a 5G-based SMT production line quality monitoring and analysis method, said monitoring and analysis method comprising:
acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of SMT production line equipment and PCB pictures after SMT slicing in real time, and transmitting the operation data parameters and the PCB pictures after SMT slicing to a quality monitoring terminal through 5G communication equipment;
the quality monitoring terminal judges whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters;
the quality monitoring terminal screens a patch quality monitoring strategy according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of the SMT production line equipment; the patch quality monitoring strategies comprise a first patch quality monitoring strategy and a second patch quality monitoring strategy;
and the quality monitoring terminal detects and identifies the PCB picture according to the determined patch quality monitoring strategy, and judges whether the SMT sliced product is abnormal or not.
Further, the quality monitoring terminal judges whether the operation of the SMT production line equipment is abnormal according to the operation data parameters, and the quality monitoring terminal comprises:
acquiring operation data parameters of positioning equipment, a Surface Mount Technology (SMT) production line equipment, a surface mount mechanical arm and welding equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount mechanical arm and the welding equipment;
acquiring comprehensive factor parameters of the SMT production line by using the first equipment factor, the second equipment factor and the third equipment factor;
fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor respectively to obtain a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line;
and when any one of the first comprehensive evaluation parameter, the second comprehensive evaluation parameter and the third comprehensive evaluation parameter is lower than a first threshold value and any one of the remaining two comprehensive evaluation parameters is lower than a second threshold value, judging that the operation of the current SMT production line equipment is abnormal.
Further, acquiring operation data parameters of positioning equipment, a Surface Mount Technology (SMT) production line equipment, a surface mount technology (SMD) mechanical arm and welding equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the SMD mechanical arm and the welding equipment, wherein the method comprises the following steps:
extracting positioning parameter data of the positioning equipment, and acquiring a first equipment factor according to the positioning parameter data of the positioning equipment;
extracting the operation parameter data of the surface mount mechanical arm, and acquiring a second equipment factor according to the operation parameter data of the positioning equipment;
and extracting actual patch position parameter data of the welding equipment, and acquiring a third equipment factor according to the actual patch position parameter data of the positioning equipment.
Further, the first patch quality monitoring strategy includes:
when the operation of the SMT production line equipment is not abnormal, extracting an image range of a region to be detected of the PCB picture;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds a preset gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset first quantity threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
Further, the second patch quality monitoring strategy includes:
when the operation of the SMT production line equipment is abnormal, extracting comprehensive evaluation parameters lower than a first threshold value and lower than a second threshold value, and adjusting a preset gray level difference threshold value by utilizing the comprehensive evaluation parameters lower than the first threshold value and lower than the second threshold value to obtain an adjusted gray level difference threshold value;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds the adjusted gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset second number threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
A 5G-based SMT production line quality monitoring and analysis system, said monitoring and analysis system comprising:
the real-time acquisition module is used for acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of the SMT production line equipment and PCB pictures after SMT slicing in real time, and sending the operation data parameters and the PCB pictures after SMT slicing to the quality monitoring terminal through the 5G communication equipment;
the abnormality judging module is used for judging whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters by the quality monitoring terminal;
the strategy determining module is used for screening a patch quality monitoring strategy by the quality monitoring terminal according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of the SMT production line equipment; the patch quality monitoring strategies comprise a first patch quality monitoring strategy and a second patch quality monitoring strategy;
and the image recognition module is used for detecting and recognizing the PCB picture by the quality monitoring terminal according to the determined patch quality monitoring strategy and judging whether the SMT sliced product is abnormal or not.
Further, the abnormality determination module includes:
the independent factor acquisition module is used for acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of SMT production line equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount device mechanical arm and the welding equipment;
the comprehensive factor acquisition module is used for acquiring comprehensive factor parameters of the SMT production line by utilizing the first equipment factor, the second equipment factor and the third equipment factor;
the evaluation parameter acquisition module is used for respectively fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor to acquire a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line;
and the abnormal operation judging module is used for judging that the operation of the current SMT production line equipment is abnormal when any one of the first comprehensive evaluation parameter, the second comprehensive evaluation parameter and the third comprehensive evaluation parameter is lower than a first threshold value and any one of the remaining two comprehensive evaluation parameters is lower than a second threshold value.
Further, the independent factor obtaining module includes:
the first equipment factor acquisition module is used for extracting positioning parameter data of the positioning equipment and acquiring a first equipment factor according to the positioning parameter data of the positioning equipment;
the second equipment factor acquisition module is used for extracting the operation parameter data of the surface mount mechanical arm and acquiring a second equipment factor according to the operation parameter data of the positioning equipment;
and the third equipment factor acquisition module is used for extracting the actual patch position parameter data of the welding equipment and acquiring a third equipment factor according to the actual patch position parameter data of the positioning equipment.
Further, the first patch quality monitoring strategy includes:
when the operation of the SMT production line equipment is not abnormal, extracting an image range of a region to be detected of the PCB picture;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds a preset gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset first quantity threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
Further, the second patch quality monitoring strategy includes:
when the operation of the SMT production line equipment is abnormal, extracting comprehensive evaluation parameters lower than a first threshold value and lower than a second threshold value, and adjusting a preset gray level difference threshold value by utilizing the comprehensive evaluation parameters lower than the first threshold value and lower than the second threshold value to obtain an adjusted gray level difference threshold value;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds the adjusted gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset second number threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
The invention has the beneficial effects that:
according to the SMT production line quality monitoring and analyzing method and system based on 5G, the first equipment factor, the second equipment factor and the third equipment factor are acquired aiming at the positioning equipment, the surface mount mechanical arm and the welding equipment, and the comprehensive operation evaluation parameters of the production line are acquired by combining the first equipment factor, the second equipment factor and the third equipment factor, so that accuracy of SMT production line quality monitoring is improved, and meanwhile, the positions of equipment with abnormal operation can be determined by combining the first comprehensive evaluation parameters, the second comprehensive evaluation parameters and the third comprehensive evaluation parameters corresponding to the positioning equipment, the surface mount mechanical arm and the welding equipment, so that follow-up maintenance is facilitated. Meanwhile, when various devices are abnormal in operation, the variation trend of the gray value of the final PCB image is different, the same gray threshold value is still adopted as the detection basis of the defective rate, the problem that defective products cannot be accurately acquired can be caused, and the screening accuracy of the defective products is reduced, so that the screening accuracy of the defective products can be improved to the greatest extent by adjusting the gray threshold value.
The quality monitoring and analyzing method and system for the SMT production line based on 5G provided by the invention can reduce the false diagnosis rate of the inferior goods to the maximum extent by combining the operation evaluation parameters of each device with the first quality detection strategy or the second quality detection strategy, and can improve the accuracy of screening the inferior goods when the production line is abnormal in operation by the second quality detection strategy.
Drawings
FIG. 1 is a flow chart of the method of the present invention;
fig. 2 is a system block diagram of the system of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
The embodiment provides a 5G-based SMT production line quality monitoring and analysis method, as shown in FIG. 1, comprising the following steps:
s1, acquiring operation data parameters of positioning equipment, a Surface Mount Technology (SMT) production line equipment, a surface mount technology (SMD) mechanical arm and welding equipment and PCB pictures after SMT slicing in real time, and sending the operation data parameters and the PCB pictures after SMT slicing to a quality monitoring terminal through 5G communication equipment;
s2, the quality monitoring terminal judges whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters;
s3, the quality monitoring terminal screens a patch quality monitoring strategy according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of the SMT production line equipment; the patch quality monitoring strategies comprise a first patch quality monitoring strategy and a second patch quality monitoring strategy;
and S4, the quality monitoring terminal detects and identifies the PCB picture according to the determined patch quality monitoring strategy, and judges whether the SMT sliced product is abnormal or not.
The quality monitoring terminal judges whether the operation of the SMT production line equipment is abnormal according to the operation data parameters, and the quality monitoring terminal comprises the following steps:
s201, acquiring operation data parameters of positioning equipment, a Surface Mount Technology (SMT) production line equipment, a surface mount mechanical arm and welding equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount mechanical arm and the welding equipment;
s202, acquiring comprehensive factor parameters of the SMT production line by using the first equipment factor, the second equipment factor and the third equipment factor; wherein, the comprehensive factor parameter is obtained by the following formula:
wherein X is z Representing the comprehensive factor parameters; w (w) 1 And w 2 Respectively representing a preset first weight value and a preset second weight value; x is X 0 Representing preset reference parameters; x is X 01 Representing a first device factor; x is X 02 Representing a second device factor; x is X 03 Representing a third device factor;
s203, fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor respectively to obtain a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line;
wherein Q is 01 、Q 02 And Q 03 Respectively representing a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter;
s204, when any one of the first comprehensive evaluation parameter, the second comprehensive evaluation parameter and the third comprehensive evaluation parameter is lower than a first threshold value, and any one of the remaining two comprehensive evaluation parameters is lower than a second threshold value, judging that the operation of the current SMT production line equipment is abnormal.
The method comprises the steps of acquiring operation data parameters of positioning equipment, a Surface Mount Technology (SMT) production line equipment, a surface mount technology (mechanical arm) and welding equipment in real time, acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount technology (mechanical arm) and the welding equipment, and comprises the following steps:
s2011, extracting positioning parameter data of the positioning equipment, and acquiring a first equipment factor according to the positioning parameter data of the positioning equipment; the first device factor is obtained through the following formula:
X 01 ＝e a
wherein X is 01 Representing a first device factor; a represents a first index parameter; n represents the number of patches that have been positioned; l (L) maxi And L mini Respectively representing the maximum distance difference between the positioning position of the ith positioning completion patch and the target standard position and the minimum distance difference between the positioning completion patch and the target standard position; l (L) 0 Representing a distance difference value corresponding to the standard error of positioning;
s2012, extracting operation parameter data of the surface mount mechanical arm, and acquiring a second device factor according to the operation parameter data of the positioning device; the second device factor is obtained through the following formula:
X 02 ＝e b
wherein X is 02 Representing a second device factor; b represents a second index parameter; m represents the number of execution actions required to be executed by the patch mechanical arm to complete one patch action; t (T) i Representing the actual action operation delay T corresponding to the ith execution action b Representing a preset maximum total delay time value corresponding to completing one patch action;
s2013, extracting actual patch position parameter data of the welding equipment, and acquiring a third equipment factor according to the actual patch position parameter data of the positioning equipment; wherein the third device factor is obtained by the following formula:
X 03 ＝e c
wherein X is 03 Representing a third device factor; c represents a third index parameter; l (L) smaxi And L smini Respectively representing the maximum distance difference and the minimum distance difference between the actual positions of the patch compared with the target positions after the patch is actually completed; l (L) maxi And L mini Respectively representing the maximum distance difference between the positioning position of the ith positioning completion patch and the target standard position and the minimum distance difference between the positioning completion patch and the target standard position; l (L) 0 Representing the distance difference corresponding to the standard error of the positioning.
The working principle and the technical effect of the technical scheme are as follows: according to the SMT production line quality monitoring and analyzing method based on 5G, the first equipment factor, the second equipment factor and the third equipment factor are acquired aiming at the positioning equipment, the surface mount mechanical arm and the welding equipment, and the comprehensive operation evaluation parameters of the production line are acquired by combining the first equipment factor, the second equipment factor and the third equipment factor, so that accuracy of SMT production line quality monitoring is improved, and meanwhile, the position of equipment with abnormal operation can be determined by combining the first comprehensive evaluation parameters, the second comprehensive evaluation parameters and the third comprehensive evaluation parameters corresponding to the positioning equipment, the surface mount mechanical arm and the welding equipment, so that follow-up maintenance is facilitated.
Specifically, through the technical scheme, the operation monitoring and the abnormality detection of SMT (surface mounting technology) production line equipment are realized. Specifically, the scheme utilizes the real-time operation data parameters of the positioning device, the surface mount device (SMT) production line device, the Surface Mount Device (SMD) mechanical arm and the welding device to obtain the first device factor, the second device factor and the third device factor.
The parameters of the comprehensive factors of the SMT production line are calculated by combining the device factors. And then, fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor, so as to obtain a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line. And when any one of the comprehensive evaluation parameters is lower than a first threshold value and any one of the two remaining comprehensive evaluation parameters is lower than a second threshold value, judging that the current SMT production line equipment has abnormal operation. Real-time monitoring and anomaly detection of SMT production line equipment are realized, production line management personnel are helped to find and solve equipment operation problems in time, stability and efficiency of the production line are improved, production risks are reduced, equipment maintenance planning is optimized, and downtime is reduced.
Meanwhile, the technical scheme can acquire the operation data parameters of the positioning equipment, the Surface Mount Technology (SMT) production line equipment, the surface mount technology mechanical arm and the welding equipment in real time. The monitoring of the equipment state can be performed in a real-time mode, and the change of the equipment running state is timely captured. The influence of a plurality of equipment factors on the whole operation state of the SMT production line can be comprehensively considered by acquiring the first equipment factor, the second equipment factor and the third equipment factor and then fusing the first equipment factor, the second equipment factor and the third equipment factor with the comprehensive factor parameters. The comprehensive evaluation mode reflects the running condition of the equipment more comprehensively. By setting the threshold value, when any one of the comprehensive evaluation parameters is lower than the first threshold value and any one of the remaining two comprehensive evaluation parameters is lower than the second threshold value, the abnormal operation of the current SMT production line equipment can be judged. The judging mode can effectively judge whether the equipment has a problem or not, and trigger an alarm or a notification so as to take measures in time for maintenance or repair. Through real-time monitoring and abnormality judgment, a manager can timely discover and process abnormal conditions of equipment, so that production line downtime caused by equipment faults is avoided, and the stability and production efficiency of the production line are improved. The real-time monitoring and abnormality judgment of the technical scheme are beneficial to reducing the risk of the production line. In time, the equipment abnormality can be prevented from being expanded, the large-area fault of the production line is avoided, the economic loss caused by production line production stoppage is reduced by utilizing equipment factors and factor fusion to correspond, the equipment abnormality monitoring and judging are carried out by combining comprehensive evaluation parameters, the comprehensive monitoring and accurate judging of the running state of the equipment of the SMT production line can be realized, and therefore the stability, the efficiency and the safety of the production line are improved.
In one embodiment of the present invention, the first patch quality monitoring policy includes:
a1, when the operation of the SMT production line equipment is not abnormal, extracting an image range of a region to be detected of the PCB picture;
step A2, extracting gray values corresponding to preset standard pixel points, and comparing the gray values with the gray values of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
a3, when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds a preset gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and A4, when the abnormal pixel points exceed a preset first quantity threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
Meanwhile, the second patch quality monitoring strategy includes:
step B1, when the operation of the SMT production line equipment is abnormal, extracting comprehensive evaluation parameters lower than a first threshold value and lower than a second threshold value, and adjusting a preset gray level difference threshold value by utilizing the comprehensive evaluation parameters lower than the first threshold value and lower than the second threshold value to obtain an adjusted gray level difference threshold value;
step B2, extracting gray values corresponding to preset standard pixel points, and comparing the gray values with the gray values of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
step B3, when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds the adjusted gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and B4, when the abnormal pixel points exceed a preset second number threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
The working principle and the technical effect of the technical scheme are as follows: when various devices are abnormal in operation, the variation trend of the gray value of the final PCB image is also different, the same gray threshold value is still adopted as the defective rate detection basis, the problem that defective products cannot be accurately acquired is caused, and the screening accuracy of the defective products is reduced, so that the gray threshold value can be adjusted in a targeted manner according to different operation parameters, the gray threshold value can be effectively matched with the operation state of each device in the production line, and the screening accuracy of the defective products is further improved to the maximum extent.
According to the quality monitoring and analyzing method for the SMT production line based on 5G, the false diagnosis rate of the inferior products can be reduced to the maximum extent through the mode of combining the operation evaluation parameters of all the equipment with the first quality detection strategy or the second quality detection strategy, and meanwhile, the accuracy of screening the inferior products can be improved when the production line is abnormal in operation through the second quality detection strategy.
The embodiment of the invention provides a 5G-based SMT production line quality monitoring and analyzing system, as shown in FIG. 2, comprising:
the real-time acquisition module is used for acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of the SMT production line equipment and PCB pictures after SMT slicing in real time, and sending the operation data parameters and the PCB pictures after SMT slicing to the quality monitoring terminal through the 5G communication equipment;
the abnormality judging module is used for judging whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters by the quality monitoring terminal;
the strategy determining module is used for screening a patch quality monitoring strategy by the quality monitoring terminal according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of the SMT production line equipment; the patch quality monitoring strategies comprise a first patch quality monitoring strategy and a second patch quality monitoring strategy;
and the image recognition module is used for detecting and recognizing the PCB picture by the quality monitoring terminal according to the determined patch quality monitoring strategy and judging whether the SMT sliced product is abnormal or not.
Wherein, the abnormality determination module includes:
the independent factor acquisition module is used for acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of SMT production line equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount device mechanical arm and the welding equipment;
the comprehensive factor acquisition module is used for acquiring comprehensive factor parameters of the SMT production line by utilizing the first equipment factor, the second equipment factor and the third equipment factor;
the evaluation parameter acquisition module is used for respectively fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor to acquire a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line;
and the abnormal operation judging module is used for judging that the operation of the current SMT production line equipment is abnormal when any one of the first comprehensive evaluation parameter, the second comprehensive evaluation parameter and the third comprehensive evaluation parameter is lower than a first threshold value and any one of the remaining two comprehensive evaluation parameters is lower than a second threshold value.
Wherein, the independent factor obtaining module includes:
the first equipment factor acquisition module is used for extracting positioning parameter data of the positioning equipment and acquiring a first equipment factor according to the positioning parameter data of the positioning equipment;
the second equipment factor acquisition module is used for extracting the operation parameter data of the surface mount mechanical arm and acquiring a second equipment factor according to the operation parameter data of the positioning equipment;
and the third equipment factor acquisition module is used for extracting the actual patch position parameter data of the welding equipment and acquiring a third equipment factor according to the actual patch position parameter data of the positioning equipment.
Wherein the first patch quality monitoring strategy comprises:
when the operation of the SMT production line equipment is not abnormal, extracting an image range of a region to be detected of the PCB picture;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds a preset gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset first quantity threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
Meanwhile, the second patch quality monitoring strategy includes:
when the operation of the SMT production line equipment is abnormal, extracting comprehensive evaluation parameters lower than a first threshold value and lower than a second threshold value, and adjusting a preset gray level difference threshold value by utilizing the comprehensive evaluation parameters lower than the first threshold value and lower than the second threshold value to obtain an adjusted gray level difference threshold value;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds the adjusted gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset second number threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
The working principle and the technical effect of the technical scheme are as follows: according to the SMT production line quality monitoring and analyzing system based on 5G, the first equipment factor, the second equipment factor and the third equipment factor are acquired by aiming at the positioning equipment, the surface mount mechanical arm and the welding equipment, and the comprehensive operation evaluation parameters of the production line are acquired by combining the first equipment factor, the second equipment factor and the third equipment factor, so that accuracy of SMT production line quality monitoring is improved, and meanwhile, the position of equipment with abnormal operation can be determined by combining the first comprehensive evaluation parameters, the second comprehensive evaluation parameters and the third comprehensive evaluation parameters corresponding to the positioning equipment, the surface mount mechanical arm and the welding equipment, so that follow-up maintenance is facilitated.
When various devices are abnormal in operation, the variation trend of the gray value of the final PCB image is also different, the same gray threshold value is still adopted as the defective rate detection basis, the problem that defective products cannot be accurately acquired is caused, and the screening accuracy of the defective products is reduced, so that the gray threshold value can be adjusted in a targeted manner according to different operation parameters, the gray threshold value can be effectively matched with the operation state of each device in the production line, and the screening accuracy of the defective products is further improved to the maximum extent.
The quality monitoring and analyzing system of the SMT production line based on 5G provided by the embodiment can reduce the false diagnosis rate of the inferior goods to the maximum extent by combining the operation evaluation parameters of all the devices with the first quality detection strategy or the second quality detection strategy, and can improve the accuracy of screening the inferior goods when the production line is abnormal in operation by the second quality detection strategy.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A 5G-based SMT production line quality monitoring and analysis method, characterized in that the monitoring and analysis method comprises:
acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of SMT production line equipment and PCB pictures after SMT slicing in real time, and transmitting the operation data parameters and the PCB pictures after SMT slicing to a quality monitoring terminal through 5G communication equipment;
the quality monitoring terminal judges whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters;
the quality monitoring terminal screens a patch quality monitoring strategy according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of the SMT production line equipment; the patch quality monitoring strategies comprise a first patch quality monitoring strategy and a second patch quality monitoring strategy;
and the quality monitoring terminal detects and identifies the PCB picture according to the determined patch quality monitoring strategy, and judges whether the SMT sliced product is abnormal or not.
2. A method of monitoring and analyzing as defined in claim 1, wherein the quality monitoring terminal determining whether the operation of the SMT production line apparatus is abnormal based on the operation data parameter comprises:
acquiring operation data parameters of positioning equipment, a Surface Mount Technology (SMT) production line equipment, a surface mount mechanical arm and welding equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount mechanical arm and the welding equipment;
acquiring comprehensive factor parameters of the SMT production line by using the first equipment factor, the second equipment factor and the third equipment factor;
fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor respectively to obtain a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line;
and when any one of the first comprehensive evaluation parameter, the second comprehensive evaluation parameter and the third comprehensive evaluation parameter is lower than a first threshold value and any one of the remaining two comprehensive evaluation parameters is lower than a second threshold value, judging that the operation of the current SMT production line equipment is abnormal.
3. The method of monitoring and analyzing of claim 2, wherein acquiring in real time operational data parameters of a positioning device, a bonding robot, and a welding device of an SMT production line device and acquiring first, second, and third device factors using the operational data parameters of the positioning device, the bonding robot, and the welding device comprises:
extracting positioning parameter data of the positioning equipment, and acquiring a first equipment factor according to the positioning parameter data of the positioning equipment;
extracting the operation parameter data of the surface mount mechanical arm, and acquiring a second equipment factor according to the operation parameter data of the positioning equipment;
and extracting actual patch position parameter data of the welding equipment, and acquiring a third equipment factor according to the actual patch position parameter data of the positioning equipment.
4. The method of monitoring and analyzing of claim 1, wherein the first patch quality monitoring strategy comprises:
when the operation of the SMT production line equipment is not abnormal, extracting an image range of a region to be detected of the PCB picture;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds a preset gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset first quantity threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
5. The monitoring and analysis method of claim 1, wherein the second patch quality monitoring strategy comprises:
when the operation of the SMT production line equipment is abnormal, extracting comprehensive evaluation parameters lower than a first threshold value and lower than a second threshold value, and adjusting a preset gray level difference threshold value by utilizing the comprehensive evaluation parameters lower than the first threshold value and lower than the second threshold value to obtain an adjusted gray level difference threshold value;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds the adjusted gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset second number threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
6. A 5G-based SMT production line quality monitoring and analysis system, said monitoring and analysis system comprising:
the real-time acquisition module is used for acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of the SMT production line equipment and PCB pictures after SMT slicing in real time, and sending the operation data parameters and the PCB pictures after SMT slicing to the quality monitoring terminal through the 5G communication equipment;
the abnormality judging module is used for judging whether the operation of the SMT production line equipment is abnormal or not according to the operation data parameters by the quality monitoring terminal;
the strategy determining module is used for screening a patch quality monitoring strategy by the quality monitoring terminal according to whether abnormal operation conditions occur in positioning equipment, a patch mechanical arm and welding equipment of the SMT production line equipment; the patch quality monitoring strategies comprise a first patch quality monitoring strategy and a second patch quality monitoring strategy;
and the image recognition module is used for detecting and recognizing the PCB picture by the quality monitoring terminal according to the determined patch quality monitoring strategy and judging whether the SMT sliced product is abnormal or not.
7. The monitoring and analysis system of claim 6, wherein the anomaly determination module comprises:
the independent factor acquisition module is used for acquiring operation data parameters of positioning equipment, a surface mount device (SMT) mechanical arm and welding equipment of SMT production line equipment in real time, and acquiring a first equipment factor, a second equipment factor and a third equipment factor by utilizing the operation data parameters of the positioning equipment, the surface mount device mechanical arm and the welding equipment;
the comprehensive factor acquisition module is used for acquiring comprehensive factor parameters of the SMT production line by utilizing the first equipment factor, the second equipment factor and the third equipment factor;
the evaluation parameter acquisition module is used for respectively fusing the comprehensive factor parameters with the first equipment factor, the second equipment factor and the third equipment factor to acquire a first comprehensive evaluation parameter, a second comprehensive evaluation parameter and a third comprehensive evaluation parameter of the SMT production line;
and the abnormal operation judging module is used for judging that the operation of the current SMT production line equipment is abnormal when any one of the first comprehensive evaluation parameter, the second comprehensive evaluation parameter and the third comprehensive evaluation parameter is lower than a first threshold value and any one of the remaining two comprehensive evaluation parameters is lower than a second threshold value.
8. The monitoring and analysis system of claim 7, wherein the independent factor acquisition module comprises:
the first equipment factor acquisition module is used for extracting positioning parameter data of the positioning equipment and acquiring a first equipment factor according to the positioning parameter data of the positioning equipment;
the second equipment factor acquisition module is used for extracting the operation parameter data of the surface mount mechanical arm and acquiring a second equipment factor according to the operation parameter data of the positioning equipment;
and the third equipment factor acquisition module is used for extracting the actual patch position parameter data of the welding equipment and acquiring a third equipment factor according to the actual patch position parameter data of the positioning equipment.
9. The monitoring and analysis system of claim 6, wherein the first patch quality monitoring strategy comprises:
when the operation of the SMT production line equipment is not abnormal, extracting an image range of a region to be detected of the PCB picture;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds a preset gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset first quantity threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
10. The monitoring and analysis system of claim 6, wherein the second patch quality monitoring strategy comprises:
when the operation of the SMT production line equipment is abnormal, extracting comprehensive evaluation parameters lower than a first threshold value and lower than a second threshold value, and adjusting a preset gray level difference threshold value by utilizing the comprehensive evaluation parameters lower than the first threshold value and lower than the second threshold value to obtain an adjusted gray level difference threshold value;
extracting a gray value corresponding to a preset standard pixel point, and comparing the gray value with the gray value of each pixel point in the image range of the region to be detected corresponding to the PCB picture after SMT slicing;
when the gray level difference value between the gray level value corresponding to the standard pixel point and the pixel point in the image range of the region to be detected exceeds the adjusted gray level difference threshold value, judging that the current pixel point is an abnormal pixel point;
and when the abnormal pixel points exceed a preset second number threshold, judging that the patch product corresponding to the current PCB picture is unqualified.
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| CN117291582B (en) * | 2023-11-27 | 2024-03-29 | 合肥宝康自动化系统有限公司 | Industrial production interconnection monitoring system based on data analysis |
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