CN117177447A - PTH half-hole circuit board manufacturing method and PTH half-hole circuit board - Google Patents

Abstract

The invention discloses a PTH half-hole circuit board manufacturing method and a PTH half-hole circuit board, wherein the method comprises the steps of obtaining PNL jointed boards to be molded; performing first peripheral molding on each unit plate on the PNL jointed board to form a PTH half-hole; removing burrs from the PTH half holes of each unit plate; performing second peripheral molding on the PNL jointed board to obtain the PNL jointed board meeting molding requirements; and testing and checking the PNL jointed boards meeting the molding requirements. The first peripheral molding is carried out on the unit plate and the second peripheral molding is carried out on the PNL jointed plate based on the optical positioning principle, so that the tolerance problem of the overall dimension of the unit plate can be effectively avoided; meanwhile, when the first peripheral molding is carried out, the milled PTH half hole can effectively avoid cracks by a processing mode of direct milling or reverse milling; the PTH half hole is subjected to the treatment of removing the flash, so that the problem of severe flash at the position of feeding and discharging is solved.

Description

PTH half-hole circuit board manufacturing method and PTH half-hole circuit board

Technical Field

The invention relates to the field of circuit board processing, in particular to a PTH half-hole circuit board manufacturing method and a PTH half-hole circuit board.

Background

In the existing circuit board processing technology, the peripheral dimensional tolerance of the formed unit board is larger, and the requirement of a customer cannot be met; when the PTH half-hole circuit board in the unit board is molded, the feeding direction is often inconsistent with the self-transmission direction of the molding cutter, so that the board is stressed without support and is easy to crack; in addition, after the PTH half-hole circuit board is molded, burrs are serious at the positions of feeding and discharging.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides a manufacturing method of a PTH half-hole circuit board, which solves the problems of larger tolerance, plate cracks and severe burrs in the current processing process of the PTH half-hole circuit board.

The invention also provides a PTH half-hole circuit board.

According to the first aspect of the invention, the manufacturing method of the PTH half-hole circuit board comprises the following steps:

obtaining PNL jointed boards to be molded;

performing first peripheral molding on each unit plate on the PNL jointed board to form a PTH half-hole;

removing burrs from the PTH half holes of each unit plate;

performing second peripheral molding on the PNL jointed board to obtain the PNL jointed board meeting molding requirements;

and testing and checking the PNL jointed board meeting the molding requirement.

The manufacturing method of the PTH half-hole circuit board provided by the embodiment of the invention has at least the following beneficial effects:

the first peripheral molding is carried out on the unit plate and the second peripheral molding is carried out on the PNL jointed plate based on the optical positioning principle, so that the tolerance problem of the overall dimension of the unit plate can be effectively avoided; meanwhile, when the first peripheral molding is carried out, the milled PTH half hole can effectively avoid cracks by a processing mode of direct milling or reverse milling; the PTH half hole is subjected to the treatment of removing the flash, so that the problem of severe flash at the position of feeding and discharging is solved.

According to some embodiments of the present invention, the first peripheral molding is performed on each unit board on the PNL panel to form a PTH half-hole, including the steps of:

punching a pipe locating nail on a locating hole of the PNL jointed board, and fixing the PNL jointed board on a workbench of a forming machine;

and (3) taking the optical point of each unit plate as a positioning, and milling a PTH half hole of each unit plate by using a forming cutter of the forming machine.

According to some embodiments of the invention, the step of milling the PTH half hole of each unit plate by using a forming cutter of the forming machine is implemented by using a clockwise milling hole mode.

According to some embodiments of the invention, the step of milling the PTH half hole of each unit plate by using a forming cutter of the forming machine is implemented by using a counter-clockwise milling hole mode.

According to some embodiments of the invention, the forming knife employs a diameter of 2.0 mm to 2.4 mm.

According to some embodiments of the invention, the removing the flash for the PTH half-hole of each cell plate comprises the steps of:

and (3) taking the optical point of each unit plate as a position, and milling the burrs on the PTH half holes of each unit plate by using the drilling tool of the forming machine.

According to some embodiments of the invention, the drill adopts a diameter of 0.6 mm to 1.0 mm.

According to some embodiments of the present invention, the PNL panel is subjected to a second peripheral molding to obtain a PNL panel meeting molding requirements, comprising the steps of:

and carrying out edge hollowed-out on each unit plate of the PNL jointed board by taking the alignment holes of the PNL jointed board as references so as to mill the PNL jointed board meeting the molding requirement.

According to some embodiments of the invention, the obtaining PNL panels to be formed comprises the steps of:

and sequentially carrying out cutting, inner layer circuit manufacturing, pressing treatment, laser drilling, copper deposition electroplating, outer layer circuit manufacturing and solder resist treatment on the substrate to obtain the PNL jointed board to be formed.

According to the PTH half-hole circuit board of the second aspect of the embodiment of the invention, the PTH half-hole circuit board is manufactured by the manufacturing method of the PTH half-hole circuit board according to any one of the first aspect of the embodiment of the invention.

The PTH half-hole circuit board provided by the embodiment of the invention has at least the following beneficial effects:

by utilizing the PTH half-hole circuit board manufacturing method provided by the embodiment of the invention, the PTH half-hole circuit board can be obtained, so that the peripheral dimensional tolerance of the formed unit board in the PTH half-hole circuit board is smaller, and the customer requirement is met; and the processing mode of forward milling or reverse milling is adopted, so that the plate is ensured not to generate cracks; meanwhile, the PTH half hole is subjected to the treatment of removing the flash, so that the flash existing on the PTH half hole circuit board is eliminated, and the damage to parts, poor matching of parts and poor appearance and performance defects of the circuit board caused by the flash cutting and other parts piercing are prevented.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a flow chart of a method of fabricating a PTH half-hole circuit board in accordance with one embodiment of the present invention;

FIG. 2 is a schematic view of a first state of a cell plate according to one embodiment of the present invention;

FIG. 3 is a schematic view of a second state of a cell plate according to an embodiment of the present invention;

FIG. 4 is a schematic view of a third state of a cell plate according to an embodiment of the present invention;

FIG. 5 is a fourth state diagram of a cell plate according to an embodiment of the present invention;

fig. 6 is a schematic view of a PNL panel according to one embodiment of the present invention.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

In the description of the present invention, the description of first, second, etc. is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, it should be understood that the direction or positional relationship indicated with respect to the description of the orientation, such as up, down, etc., is based on the direction or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, and does not indicate or imply that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be determined reasonably by a person skilled in the art in combination with the specific content of the technical solution.

The following description of the embodiments of the present invention will be made with reference to the accompanying drawings, in which it is apparent that the embodiments described below are some, but not all embodiments of the invention.

Referring to fig. 1, a flowchart of a method for manufacturing a PTH half-hole circuit board according to an embodiment of the present invention includes the following steps:

obtaining PNL jointed boards to be molded;

performing first peripheral molding on each unit plate on the PNL jointed board to form a PTH half-hole;

removing burrs from the PTH half holes of each unit plate;

performing second peripheral molding on the PNL jointed board to obtain the PNL jointed board meeting molding requirements;

and testing and checking the PNL jointed boards meeting the molding requirements.

Specifically, as shown in fig. 1, a PNL jigsaw to be formed is first obtained preliminarily through circuit board fabrication, then a first peripheral forming is performed on each unit board on the PNL jigsaw, a flash at a PTH half hole of each unit board is removed, and a second peripheral forming is performed on the NL jigsaw, so as to obtain a PNL jigsaw meeting the requirement of customer forming. And finally, carrying out electric test and appearance inspection on the formed PNL jointed board.

It should be noted that, the PNL Panel refers to a large-sized circuit board (Panel), i.e., PNL is an abbreviation of Panel; PTH (Plating Through Hole) the plated through holes. It is understood that electrical testing is the functional testing of the board by energizing it. In some embodiments, the visual inspection may be performed using se:Sub>A magnifying glass and performing an all-round inspection of the circuit board in accordance with the IPC-A-600H standard. It should be noted that the IPC-se:Sub>A-600H standard specifies classification and evaluation criterise:Sub>A for various defects of the PCB board, including pads, circuit lines, PCB board surfaces, internal structures, PCB thickness, and PCB holes, etc. At the same time, it also specifies the structure and sequence of the checklist so that the device manufacturer and the manufacturing provider can better understand and evaluate the quality of the PCB board.

In the embodiment, the tolerance problem of the overall dimension of the unit plate can be effectively avoided by performing the first peripheral molding on the unit plate and the second peripheral molding on the PNL jointed plate based on the optical positioning principle; meanwhile, when the first peripheral molding is carried out, the milled PTH half hole can effectively avoid cracks by a processing mode of direct milling or reverse milling; the PTH half hole is subjected to the treatment of removing the flash, so that the problem of severe flash at the position of feeding and discharging is solved.

In some embodiments, as shown in fig. 2-4, a first peripheral molding is performed on each cell plate on a PNL panel to form a PTH half-hole, comprising the steps of:

punching a pipe locating nail on a locating hole of the PNL jointed board, and fixing the PNL jointed board on a workbench of a forming machine;

and (3) taking the optical point of each unit plate as a positioning, and milling a PTH half hole of each unit plate by using a forming cutter of a forming machine.

Specifically, referring to fig. 2 to 4, it can be understood that fig. 2 shows a unit board which has not been molded, a plurality of plated through holes are formed in the middle of the unit board, optical points are disposed at four corners of the unit board, fig. 3 shows a process of milling half holes of PTH, and fig. 4 shows a state of the unit board after milling half holes of PTH. For the first peripheral molding, specifically, firstly, punching a pipe locating nail on a locating hole of the PNL jointed board, and fixing the PNL jointed board on a workbench of a molding machine; and then the molding machine positions the optical points of the unit plates, and a molding cutter with a certain diameter is used for milling the half hole of the PTH. The process of processing the cell plate into PTH half holes from PTH round holes can be referred to in sequence with respect to the variation of fig. 2 to 4. In this embodiment, the optical point of the unit board is used as a reference, so that the tolerance problem of the external dimension of the unit board can be effectively avoided.

In some embodiments, as shown in fig. 3, the step of milling the PTH half holes of each cell plate using a forming tool of a forming machine is accomplished by milling the holes clockwise.

Specifically, referring to fig. 3, it can be understood that in the process of milling the PTH half hole by using the forming tool, the forward milling can be specifically performed in a forward milling manner, where the forward milling means that the self-rotation direction of the forming tool is consistent with the feeding direction of cutting feeding, and has the following advantages:

(1) The milling load is small: when workpiece materials are removed by direct milling, the stress on the main shaft direction is smaller, the abrasion of a forming machine and a cutter is reduced, and the load of the whole operation system is reduced.

(2) The surface quality is good: the cutting force of the down milling process is small, the damage to the surface of the workpiece is slight, the surface with higher precision can be processed, and the method is suitable for processing tasks with high requirements on the surface quality.

(3) The forming machine has high utilization rate: the milling direction is consistent with the axis of the milling cutter, so that the effective working range of the forming machine can be utilized to the maximum extent, and the utilization rate of the forming machine is improved.

The embodiment adopts a mode of milling half holes of the PTH clockwise, and has the main advantage of effectively avoiding the cracking of the plate.

In some embodiments, the step of milling the PTH half holes of each cell plate using a forming tool of a forming machine is accomplished by counter-clockwise milling of the holes, as shown in connection with fig. 3.

Specifically, referring to fig. 3 in combination, it will be appreciated that, in addition to the forward milling mode as illustrated in fig. 3, in some embodiments, reverse milling may be performed, where reverse milling means that the direction of rotation of the forming tool is opposite to the direction of feed of the cutting feed, and has the following advantages:

(1) The milling force is large: during the back milling cutting, the milling force in the main shaft direction is larger, and workpieces with higher hardness can be processed.

(2) The processing efficiency is high: the milling feeding speed of the back milling can be higher, the processing efficiency is improved, and the milling device is particularly suitable for processing tasks with higher requirements on the processing efficiency.

(3) Is suitable for chip removal: the reverse milling cutting is sufficient, the unqualified metal scraps of milling are easy to discharge, the cutting quality is good, and the reverse milling cutting device is suitable for processing tasks with low requirements on surface quality and easy discharge of milling scraps.

It will be appreciated that in some other embodiments, to machine a high hardness cell plate or to eliminate the need for plate surface quality, a counter-clockwise milling of the PTH half holes may be used to maximize the efficiency of the machining process.

In some embodiments, the forming knife employs a diameter of 2.0 millimeters to 2.4 millimeters.

In particular, it will be appreciated that in general, the machining area is proportional to the diameter of the milling cutter, the larger the diameter the larger the machining area. When the machining area is smaller, a milling cutter with smaller diameter is preferred, so that reasonable distribution of cutting force can be ensured, and the machining stability is improved; and when the processing area is larger, the milling cutter with larger diameter is selected, so that the cutting efficiency can be improved. Therefore, the present embodiment can ensure the balance and the combination of the stability and the high efficiency in the processing process by determining the proper diameter of the forming cutter, specifically, 2.0 mm to 2.4 mm.

In some embodiments, as shown in fig. 4 and 5, the PTH half-hole removal flash for each cell plate includes the steps of:

and (3) taking the optical point of each unit plate as a position, and milling the burrs on the PTH half holes of each unit plate by using a drilling tool of a forming machine.

Specifically, referring to fig. 4 and 5, the unit plate of fig. 4 has a flash after the half hole of PTH is milled, and fig. 5 shows the state of the unit plate after the flash is removed. It can be understood that, further, the forming machine uses the optical point of the unit plate as the positioning, and the cutting edge can be milled by milling the hole at the cutting and cutting positions on the half hole of the PTH by using the drilling tool with a certain diameter. The process of removing the flash may refer to the variation of fig. 4 to 5.

In some embodiments, the drill bit employs a diameter of 0.6 millimeters to 1.0 millimeters.

In particular, it will be appreciated that by determining a suitable drill diameter, in particular 0.6 mm to 1.0 mm, a balance between stability and efficiency during machining may be ensured.

In some embodiments, as shown in fig. 6, the PNL panels are second peripherally formed to obtain PNL panels meeting the forming requirements, comprising the steps of:

and (3) taking the alignment holes of the PNL splice plates as references, and carrying out edge hollowed-out on each unit plate of the PNL splice plates so as to mill the PNL splice plates meeting the molding requirements.

Specifically, referring to fig. 6, fig. 6 shows a PNL panel that has not been formed. It can be understood that further, the shaping machine uses the alignment hole of PNL jointed board as reference at last, and the edge of each unit board is hollowed out, thereby milling the finished product required by the customer.

In some embodiments, obtaining PNL panels to be formed comprises the steps of:

sequentially carrying out cutting, inner layer circuit manufacturing, pressing treatment, laser drilling, copper deposition electroplating, outer layer circuit manufacturing and solder resist treatment on the substrate to obtain the PNL jointed board to be formed.

In particular, it is understood that in some embodiments, the process of making a circuit board may be substantially:

cutting: selecting a plurality of substrates, cutting the substrates according to actual needs, and then placing the substrates in an oven for baking;

and (3) inner layer circuit manufacturing: etching the inner core plate of the substrate to obtain a required circuit pattern so as to finish the manufacture of an inner circuit;

and (3) pressing: laminating the inner core boards of the plurality of substrates, and simultaneously adding an insulating board and a copper foil for lamination to obtain a semi-finished board;

laser drilling: drilling holes on the semi-finished plate formed after the lamination by using a laser machine;

copper deposition electroplating: copper deposition is carried out on the drilled plate, so that the hole wall is metallized, and then the whole plate is electroplated and thickened;

and (3) outer layer circuit manufacturing: manufacturing an outer layer circuit of the plate subjected to copper deposition electroplating, and specifically, performing dry film pressing, exposure, development, etching and film stripping treatment on an outer copper foil layer;

and (3) solder resist treatment: and printing solder resist on the surface of the plate to form a solder resist ink layer.

In addition, the embodiment of the invention also provides a PTH half-hole circuit board, which is manufactured by the PTH half-hole circuit board manufacturing method.

It can be understood that by utilizing the PTH half-hole circuit board manufacturing method of the embodiment of the invention, the PTH half-hole circuit board can be obtained, so that the peripheral dimensional tolerance of the formed unit board in the PTH half-hole circuit board is smaller, and the customer requirement is met; and the processing mode of forward milling or reverse milling is adopted, so that the plate is ensured not to generate cracks; meanwhile, the PTH half hole is subjected to the treatment of removing the flash, so that the flash existing on the PTH half hole circuit board is eliminated, and the damage to parts, poor matching of parts and poor appearance and performance defects of the circuit board caused by the flash cutting and other parts piercing are prevented.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the invention, the scope of which is defined by the claims and their equivalents.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.

Claims (10)

1. The manufacturing method of the PTH half-hole circuit board is characterized by comprising the following steps of:

obtaining PNL jointed boards to be molded;

performing first peripheral molding on each unit plate on the PNL jointed board to form a PTH half-hole;

removing burrs from the PTH half holes of each unit plate;

performing second peripheral molding on the PNL jointed board to obtain the PNL jointed board meeting molding requirements;

and testing and checking the PNL jointed board meeting the molding requirement.

2. The method of manufacturing a PTH half-hole circuit board of claim 1, wherein said first peripherally shaping each cell board on said PNL panel to form a PTH half-hole comprises the steps of:

punching a pipe locating nail on a locating hole of the PNL jointed board, and fixing the PNL jointed board on a workbench of a forming machine;

and (3) taking the optical point of each unit plate as a positioning, and milling a PTH half hole of each unit plate by using a forming cutter of the forming machine.

3. The method of manufacturing a PTH half-hole circuit board of claim 2, wherein said step of milling a PTH half-hole of each of said cell boards using a forming tool of said forming machine is performed by a clockwise milling hole.

4. The method of manufacturing a PTH half-hole circuit board of claim 2, wherein said step of milling a PTH half-hole of each of said cell boards with a forming blade of said forming machine is performed by counter-clockwise milling of holes.

5. The method of manufacturing a PTH half-hole circuit board of claim 2, wherein said forming blade has a diameter of 2.0 mm to 2.4 mm.

6. The method of manufacturing a PTH half-hole circuit board of claim 2, wherein said removing the flash of the PTH half-hole of each of said cell boards comprises the steps of:

and (3) taking the optical point of each unit plate as a position, and milling the burrs on the PTH half holes of each unit plate by using the drilling tool of the forming machine.

7. The method of manufacturing a PTH half-hole circuit board of claim 6, wherein said drill is 0.6 mm to 1.0 mm in diameter.

8. The method of manufacturing a PTH half-hole circuit board of claim 6, wherein performing a second peripheral molding of said PNL panel to obtain a PNL panel meeting molding requirements, comprising the steps of:

and carrying out edge hollowed-out on each unit plate of the PNL jointed board by taking the alignment holes of the PNL jointed board as references so as to mill the PNL jointed board meeting the molding requirement.

9. The method for manufacturing a PTH half-hole circuit board according to claim 1, wherein the step of obtaining the PNL board to be molded comprises the steps of:

and sequentially carrying out cutting, inner layer circuit manufacturing, pressing treatment, laser drilling, copper deposition electroplating, outer layer circuit manufacturing and solder resist treatment on the substrate to obtain the PNL jointed board to be formed.

10. A PTH half-hole circuit board, characterized in that the PTH half-hole circuit board is manufactured by the PTH half-hole circuit board manufacturing method according to any one of claims 1 to 9.