CN117168289A - Method, device, equipment and medium for material height measurement circuit - Google Patents
Method, device, equipment and medium for material height measurement circuit Download PDFInfo
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Abstract
The embodiment of the application discloses a method, a device, equipment and a medium for a material height measuring circuit, wherein the method is used for an industrial material height measuring circuit, the circuit comprises a main control circuit, a node control circuit and a sampling circuit, and the method comprises the following steps: the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface; the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal; the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit; the node control circuit processes the received sampling result to obtain the actual height of the measured material, and the accuracy and the practicability of the industrial material allowance measurement are effectively improved.
Description
Technical Field
The application relates to the technical field of material position sensing equipment, in particular to a method for a material height measuring circuit.
Background
In industrial applications, raw materials of products are generally stored in a storage tank, and a feeding system increasingly tends to be automated, and raw materials in the storage tank can be gradually pumped into a mixing tank to perform production operation along with the progress of a production process, so that in order to continuously perform production, the amount of residual materials in the storage tank needs to be detected and timely added.
At present, the detection of the residual quantity of materials in a large-scale storage tank, particularly under the condition that a sealed container and a container are non-transparent, the detection of the residual quantity by manual operation is very difficult, the function of detecting the newly added residual quantity of materials for the existing equipment generally needs to ensure that the existing container is not damaged, and the sensor system also needs to ensure certain expandability and the problem of wiring complexity in consideration of the condition that the added container needs to be connected into the current material height sensing system. Therefore, how to realize the low cost, easily scalable, non-invasive, mass deployment characteristics of the material level sensor, and sensor solutions that accommodate containers of different form factors, is a critical factor in realizing mass applications of the material level sensor.
In the prior art, the common material monitoring method comprises the following steps: float mechanical switch, amperometric probe, optical ToF or reflective and occlusion type sensor, ultrasonic distance sensor, microwave radar and capacitive sensor.
The floating ball mechanical switch comprises a movable part, has the problems of longer mechanical life and larger volume, and is not suitable for monitoring the height of dry powder; the current probe can only realize the fixed-height detection of the conductive liquid, and has an electrolysis effect, which is not beneficial to the stability of medium components; the optical sensor is easy to be interfered by steam and dust, if the optical sensor is arranged outside the container, the optical sensor can only be used on the container transparent to specific wavelength, and the common reflection type sensor and the shielding type sensor can only realize the detection of whether the material exists at a single point; for ultrasonic sensors and microwave radars, certain requirements are placed on the reflection characteristics of the measured medium, and the ultrasonic sensor and the microwave radars cannot be installed outside a container usually due to low coupling degree and attenuation caused by the outer wall of the container, and the cost is high; the bridge method and the resonance method used by the capacitive sensor require complex calculation and external circuits, and have high implementation cost.
Disclosure of Invention
Based on this, there is a need to address the above-mentioned problems by providing a method, apparatus, computer device and storage medium for a material height measurement circuit to improve the accuracy and practicality of industrial material balance measurement.
A method for a material level measurement circuit for an industrial material level measurement circuit, the circuit comprising a main control circuit, a node control circuit, a sampling circuit, the method comprising:
the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface;
the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit;
and the node control circuit processes the received sampling result to obtain the actual height of the measured material.
A single chip microcomputer-based material height measurement device, the device comprising:
the system comprises a main control module, an FFC flat cable module, a node control board module and a coaxial cable assembly module;
and the main control module, the FFC flat cable module and the coaxial cable assembly module are respectively connected with the node control board module.
A computer device comprising a memory and a processor, the memory storing a computer program which, when executed by the processor, causes the processor to perform the steps of:
a method for a material level measurement circuit for an industrial material level measurement circuit, the circuit comprising a main control circuit, a node control circuit, a sampling circuit, the method comprising:
the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface;
the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit;
and the node control circuit processes the received sampling result to obtain the actual height of the measured material.
A computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the steps of:
a method for a material level measurement circuit for an industrial material level measurement circuit, the circuit comprising a main control circuit, a node control circuit, a sampling circuit, the method comprising:
the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface;
the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit;
and the node control circuit processes the received sampling result to obtain the actual height of the measured material.
The embodiment of the application has the following beneficial effects:
the application provides a non-invasive material height sensing node with a communication function and convenient batch deployment and expansion, which realizes batch automatic residue detection, can convert the material height into a measurable electric quantity signal, and then calculates the actual height of the measured material in a tank body by combining the dielectric constant of the measured material, the mounting height of the sensing node and the physical size of an FFC flat cable, and finally the sensing node sends data back to an external total control node through a bus, thereby realizing the function of residue information report.
The application does not need special peripheral equipment when measuring the height of materials, utilizes the interconnection characteristic of the peripheral equipment inside the singlechip, realizes the driving and collecting functions of the capacitive material sensor through the combination of some peripheral equipment and a small amount of external circuits, has wide adaptability, has lower sensitivity to the types of the singlechip and the external circuits, can be suitable for application scenes of batch and low cost, can carry out non-invasive measurement on the height of materials in a container, and simultaneously has high adaptability to the shape of the outer wall of the container due to the softness of the FFC flat cable and the split design of the node control board and the FFC flat cable.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Wherein:
FIG. 1 is a flow chart of a method of measuring material height in one embodiment;
FIG. 2 is a diagram of drive and sample timing relationships in one embodiment;
FIG. 3 is a block diagram of a material level measuring device in one embodiment;
FIG. 4 is a diagram showing the positional relationship between a measuring device and a container and a medium according to one embodiment;
FIG. 5 is a flow chart of capacitance measurement in one embodiment;
FIG. 6 is a diagram of a main circuit topology in one embodiment;
FIG. 7 is a block diagram of a computer device in one embodiment.
In the figure: the device comprises a 1-FFC flat cable, a 2-adapter plate, a 3-container to be tested, 4-materials to be tested, a 5-coaxial cable assembly, a 6-driving circuit, a 7-singlechip, an 8-power management circuit, a 9-communication interface, a 10-audible and visual alarm circuit, an 11-node control board, a 12-differential communication bus, 13-external power supply lines, 14-induction electrodes and 15-shielding electrodes.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As shown in fig. 1, in one embodiment, a method for a material level measurement circuit is provided, for an industrial material level measurement circuit, the circuit including a main control circuit, a node control circuit, and a sampling circuit, the method specifically including the steps of:
step S1, the main control circuit sends out a data reading request signal and transmits the data reading request signal to a node control circuit through a communication interface;
in one example, the master control circuit presets a single measurement period before the master control circuit issues a data read request signal; if the main control circuit does not receive the feedback signal within the single measurement time length, determining that a circuit fault event occurs and sending an alarm; and if the main control circuit receives the feedback signal within the single measurement time, confirming that no circuit fault event occurs, displaying the feedback signal by the main control circuit, and exiting the measurement.
Step S2, the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
in one example, prior to beginning to measure capacitance, the node control circuit configures timer 1 and the ADC, starts ADC1 waiting for a timer trigger event to arrive, and starts an analog watchdog interrupt; and then, the initial state of PWM output is configured, so that the analog switch U3 is connected to VDD, and then the Q1 is driven to completely discharge Cint, thereby completing the measurement initialization flow. In addition, the program needs to record the current time with enough resolution, and in order to avoid the situation that the sensor is not connected and the integral capacitor Cint cannot be charged to the voltage threshold value, a single measurement timeout event needs to be set through software, for example, 50ms, and the sensor is considered to be faulty after timeout, and an audible and visual alarm is sent out and fault information is reported to the master control node through the communication interface.
In one example, as shown in fig. 2, the node control circuit configures the channel 1 of the timer 1 to be in a PWM output mode, the switching frequency is 500KHz, the duty ratio is 50%, the channel 2 is configured to output a comparison mode and turn off the external output, the comparison pulse position is configured to be 65%, when the counter value of the timer is higher than 65% of the period, the flag bit of the internal channel 0 is high, and the internal channel 0 is used for triggering the ADC1 to sample when the voltage on the integrating capacitor Cint is stable through an internal signal, and avoiding malfunction caused by noise caused by the PWM signal through shifting the sampling timing.
Step S3, the sampling circuit carries out ADC sampling on the voltage of the integrating capacitor according to the continuous PWM wave and sends the sampling result to the node control circuit;
in one example, the channel 1 of the ADC1 is configured as a single-channel single injection conversion mode, and the injection conversion sequence is triggered by the rising edge of the internal flag of the channel 0 of the timer 1, and meanwhile, the conversion value of the analog watchdog monitoring channel 0 of the ADC1 in the injection conversion mode is configured, and when the conversion value exceeds the upper limit, the interruption is triggered, so that the single chip microcomputer 1 can perform other calculations in the measurement process without monitoring the voltage in each PWM period; because the ADC resolution of the singlechip 1 is 12 bits, the analog power supply is 3.3V, and if the threshold value for ending the conversion period of the integrating capacitor Cint is set to be 2.5V, the analog watchdog upper limit trigger value is set to be 0x0C1F.
And S4, the node control circuit processes the received sampling result to obtain the actual height of the measured material.
In one example, the node control circuit starts the PWM output of timer 1, waits for an analog watchdog interrupt trigger or measurement timeout event to occur, stops the PWM output and records a measurement end event or timeout error event, respectively, and finally performs capacitance and media height calculations or error information reporting based on the difference in the occurrence event.
In one example, the node control circuit determines whether the voltage value of the integrating capacitor sampled by the sampling circuit exceeds a preset voltage value;
if the node control circuit detects that the voltage value of the integrating capacitor sampled by the sampling circuit exceeds a preset voltage value, stopping PWM wave output, and determining the actual height of the measured material, wherein the actual height of the measured material is the capacitance to the ground through the FFC flat cable electrode; determining the initial height of the tested material according to the capacity of the integral capacitor, the number of emitted PWM waves, the capacitance of the FFC flat cable electrode to the ground, the dielectric constant of the tested material and the characteristics of the FFC flat cable; filtering the initial height; and determining the actual height of the tested material by adding the initial height after the filtering processing and the installation height of the FFC flat cable.
Wherein, confirm FFC winding displacement electrode to the electric capacity of ground, include: collecting the voltage of an integrating capacitor Cint;
after the FFC flat cable electrode is charged to the VDD by the stray capacitance Cx, which is connected in parallel with the integration capacitance Cint with lower voltage and fixed capacity, the charges on the stray capacitance Cx and the integration capacitance Cint are redistributed until the voltages on the stray capacitance Cx and the integration capacitance Cint are the same;
the voltage on the integrating capacitor Cint before voltage equalizing is started is Uint k, and the voltage on the stray capacitor Cx is VDD;
according to the formulaThe capacitance of the FFC flat cable electrode to ground stray capacitance Cx is determined.
If the node control circuit detects that the voltage value of the integrating capacitor sampled by the sampling circuit does not exceed the preset voltage value, the PWM wave is continuously output until the node control circuit detects that the voltage value of the integrating capacitor sampled by the sampling circuit exceeds the preset voltage value.
As shown in fig. 3, in one embodiment, a material height measurement device based on a single chip microcomputer is provided, including: FFC flat cable module, node control board module and coaxial cable assembly module.
In one example, the FFC flat cable module includes the FFC flat cable 1, a plurality of sensing electrodes 14 and shielding electrodes 15 that are distributed in a staggered manner, all of the sensing electrodes 14 are connected in parallel, and all of the shielding electrodes 15 are connected in parallel and constitute a capacitance sensing part.
Wherein, in order to form the induction electrode 14 and the shielding electrode 15, an adapter plate 2 is adopted, the adapter plate 2 is connected with the FFC flat cable 1 through an FFC connector, the adapter plate 2 is provided with a plurality of printed copper wires, and the conductors on the FFC flat cable 1 are connected through the printed copper wires, so that the induction electrode 14 and the shielding electrode 15 are formed.
In one example, the coaxial cable assembly module includes a coaxial cable assembly 5, an IPX radio frequency connector soldered to the patch panel 2, a radio frequency connector J2 soldered to the node control board 11, and a coaxial cable connecting the IPX radio frequency connectors J1 and J2.
The cable part in the coaxial cable assembly 5 is used for electrically connecting the induction electrode 14 and the shielding electrode 15 formed by the FFC flat cable 1 and the adapter plate 2 with the driving circuit 6, the outer shielding layer of the cable part is connected with the output of the shielding layer driver U4 and the shielding electrode 15 in the driving circuit 6, the wire core of the cable part is connected with the induction electrode 14, and meanwhile, the cable part is connected with a node connected with the Rs in-phase input end of the shielding layer driver U4 in the driving circuit 6.
In one example, the node control board module includes a node control board 11, a single chip microcomputer 1, a driving circuit 6, a communication interface 9, a power management circuit 8, and an audible and visual alarm circuit 10.
The communication interface 9 is externally connected with a main control board through a differential communication bus 12, and the main control board can read data from the singlechip 1 and send control instructions to the singlechip 1. The singlechip 1 controls the driving circuit 6 and collects return data, the calculated result is sent to the differential communication bus 12 through the communication interface 9, meanwhile, the control signal of an external main control board is received through the differential communication bus 12 and the communication interface 9, and meanwhile, if an error occurs, the singlechip 1 drives the audible and visual alarm circuit 10 to perform alarm action; the power management circuit 8 is connected to an external power supply line 13 and generates the power rails required for all circuits on the node control board 11.
The differential communication bus 12 has the capability of mounting a plurality of devices, in one example, the differential communication bus 12 is a CAN bus, which CAN meet the anti-interference requirement in an industrial environment, greatly reduce the wiring pressure, and mount the newly added nodes on the already arranged bus to meet the requirement of large-scale deployment.
As shown in fig. 4, in one embodiment, a positional relationship diagram of a measuring device, a container and a medium is provided, and both the back surfaces of the FFC flat cable 1 and the adapter plate 2 are provided with adhesive, by which the FFC flat cable 1 can be adhered to the outer wall of the container 3 to be measured containing the measured material 4.
In one example, as shown in fig. 5, the flow of the method for measuring the height of the measured material includes: when the PWM signal sent by the singlechip 1 is controlled and connected to the VDD, the stray capacitance Cx is charged to the VDD after a certain time;
when the analog switch U3 is controlled to be connected to the integral capacitor Cint, the stray capacitor Cx and the integral capacitor Cint perform voltage equalizing, so that the voltage of the integral capacitor Cint increases from zero; meanwhile, the operational amplifier U4 tracks the voltage of the sensing electrode 14 and drives the shielding layer of the coaxial cable, so that the voltages of the shielding layer, the shielding electrode 15 and the sensing electrode 14 are kept consistent, thereby eliminating the influence of the capacitance Cp1 formed between the inner conductor and the outer conductor of the coaxial cable and the capacitance Cp2 between the conductors of the FFC flat cable 1, and making the sensing electrode 14 more sensitive to external medium changes.
The single chip microcomputer 1 continuously sends out continuous PWM waves and records the cycle number of sent waveforms, simultaneously samples the voltage on the integral capacitor Cint through the ADC until the acquired voltage exceeds a preset value, such as 2.5V, stops PWM waveform output at the moment, calculates the capacitance of the stray capacitance Cx of the sensing electrode 14 to the ground according to the known capacity of the integral capacitor Cint and the number of sent PWM waves, and finally calculates the height of the tested material 4 occupying the FFC bus according to the preset dielectric constant of the tested material 4, the thickness of the FFC bus, the conductor spacing, the conductor length and the wall thickness of the container, and the actual height of the material in the container can be obtained by adding the sensor installation height.
And after the multiple measurement results are filtered, stable material height values are obtained and stored in the memory of the singlechip 1, and data are sent to the main control board through the communication interface according to the reading request of the external main control board, so that the functions of measurement, conversion, filtering and communication which are needed to be realized by the nodes are completed.
As shown in FIG. 6, in one embodiment, the main circuit of the height measurement circuit of the present application comprises a single chip microcomputer, a driving circuit, an audible and visual alarm circuit, a power management circuit, and a communication interface.
In one example, the driving circuit specifically includes a buffer operational amplifier, an integrating capacitor, a bleeder MOS transistor, an analog switch, a resistor, and an operational amplifier:
one end of the resistor is connected with the central conductor of the coaxial cable assembly and the non-inverting input end of the operational amplifier, and the other end of the resistor is connected with the common end of the analog switch; the inverting input end and the output end of the operational amplifier are connected and then connected to the shielding layer of the coaxial cable assembly; the normally-closed end of the analog switch is connected to a power supply VDD, and the normally-open end of the analog switch is connected with one end of the integrating capacitor, the drain electrode of the bleeder MOS tube and the in-phase input end of the buffer operational amplifier; the inverting input end and the output end of the buffer operational amplifier are connected and then connected to an ADC pin of the singlechip; the other end of the integrating capacitor and the source electrode of the bleeder MOS tube are grounded; and the grid electrode of the discharge MOS tube is connected to a GPIO pin with a PWM output function of the singlechip.
In one example, the model U3 of the analog switch is SGM3001, which has the characteristics of low voltage rail-to-rail operation and low on-resistance Rs, VDD is 3.3V, and the buffer op-amp U2 and the op-amp U4 both use the dual op-amp SGM8632, which has the characteristics of high input impedance and rail-to-rail input and output, and moderate bandwidth and slew rate, so that better voltage tracking performance can be achieved.
In one example, the SCM 1 model is GD32F450ZE.
The height measurement principle of the height sensing node is as follows:
the FFC flat cable and the systematic ground have certain stray capacitance to the ground, so that the polar plate has stray capacitance Cx to the systematic ground; the relative dielectric constant of air is 1, and if a substance with a higher relative dielectric constant is present near the FFC flat cable, the stray capacitance Cx increases. If the stray capacitance Cx charged to VDD is connected in parallel with the integral capacitance Cint with lower voltage and fixed capacity, the charges on the stray capacitance Cx and the integral capacitance Cint will be redistributed, and finally the voltages on the stray capacitance Cx and the integral capacitance Cint are the same, if the integral capacitance Cint has the voltage with the value of Uint k before voltage equalizing, the stray capacitance Cx is charged to VDD, then the voltage equalizing is satisfied before and after voltage equalizing
If the capacity of the stray capacitance Cx is larger, the more the charge can be provided when the stray capacitance Cx is in voltage equalizing with the integrating capacitance Cint, the voltage of the integrating capacitance Cint can be raised to a certain fixed comparison voltage by using fewer voltage equalizing times, that is, the capacity of the stray capacitance Cx can be calculated by the voltage equalizing times under the condition that the capacity of the integrating capacitance Cint and the comparison voltage are fixed and known, then the respective duty ratio of the two media can be estimated according to the preset dielectric constant of the measured medium and the dielectric constant of the non-measured medium, and then the height of the substrate covered by the measured medium can be calculated by combining the physical size of the FFC flat cable.
FIG. 7 illustrates an internal block diagram of a computer device in one embodiment. The computer device may specifically be a terminal or a server. As shown in fig. 7, the computer device includes a processor, a memory, and a network interface connected by a system bus. The memory includes a nonvolatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system, and may also store a computer program that, when executed by a processor, causes the processor to implement an age identification method. The internal memory may also have stored therein a computer program which, when executed by the processor, causes the processor to perform the age identification method. It will be appreciated by those skilled in the art that the structure shown in FIG. 7 is merely a block diagram of some of the structures associated with the present inventive arrangements and is not limiting of the computer device to which the present inventive arrangements may be applied, and that a particular computer device may include more or fewer components than shown, or may combine some of the components, or have a different arrangement of components.
In one embodiment, a computer device is presented comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of:
the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface;
the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit;
and the node control circuit processes the received sampling result to obtain the actual height of the measured material.
In one embodiment, a computer-readable storage medium is provided, storing a computer program which, when executed by a processor, causes the processor to perform the steps of:
the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface;
the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit;
and the node control circuit processes the received sampling result to obtain the actual height of the measured material.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples illustrate only a few embodiments of the application and are described in detail herein without thereby limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (13)
1. A method for a material level measurement circuit, the method for an industrial material level measurement circuit, the circuit comprising a main control circuit, a node control circuit, a sampling circuit, the method comprising:
the main control circuit sends out a data reading request signal and transmits the data reading request signal to the node control circuit through the communication interface;
the node control circuit converts the data reading request signal into a driving signal, and sends continuous PWM waves to the sampling circuit under the driving signal;
the sampling circuit performs ADC sampling on the voltage of the integrating capacitor according to the continuous PWM waves and sends a sampling result to the node control circuit;
and the node control circuit processes the received sampling result to obtain the actual height of the measured material.
2. The method for a material level measurement circuit of claim 1, wherein the main control circuit issues a data read request signal, further comprising:
presetting a single measurement time length;
if the main control circuit does not receive the feedback signal within the single measurement time length, determining that a circuit fault event occurs and sending an alarm;
and if the main control circuit receives the feedback signal within the single measurement time, confirming that no circuit fault event occurs, displaying the feedback signal by the main control circuit, and exiting the measurement.
3. The method for a material level measurement circuit according to claim 1, wherein the node control circuit processes the received sampling result to obtain the material level, and specifically comprises:
judging whether the voltage value of the integrating capacitor sampled by the sampling circuit is higher than a preset voltage value or not detected by the node control circuit;
if the node control circuit detects that the voltage value of the integrating capacitor sampled by the sampling circuit exceeds a preset voltage value, stopping PWM wave output and determining the actual height of the measured material;
if the node control circuit detects that the voltage value of the integrating capacitor sampled by the sampling circuit does not exceed the preset voltage value, the PWM wave is continuously output until the node control circuit detects that the voltage value of the integrating capacitor sampled by the sampling circuit exceeds the preset voltage value.
4. A method for a material level measurement circuit according to claim 3, wherein said determining the actual level of the material under test comprises:
determining the capacitance of the FFC flat cable electrode to the ground;
determining the initial height of the tested material according to the capacity of the integral capacitor, the number of emitted PWM waves, the capacitance of the FFC flat cable electrode to the ground, the dielectric constant of the tested material and the characteristics of the FFC flat cable;
filtering the initial height;
and determining the actual height of the tested material by adding the initial height after the filtering processing and the installation height of the FFC flat cable.
5. The method for a material level measurement circuit of claim 4, wherein determining the capacitance of the FFC flat cable electrode to ground comprises:
collecting the voltage of an integrating capacitor Cint;
after the FFC flat cable electrode is charged to the VDD by the stray capacitance Cx, which is connected in parallel with the integration capacitance Cint with lower voltage and fixed capacity, the charges on the stray capacitance Cx and the integration capacitance Cint are redistributed until the voltages on the stray capacitance Cx and the integration capacitance Cint are the same;
the voltage on the integrating capacitor Cint before voltage equalizing is Uint k, and the voltage on the stray capacitor Cx is VDD;
according to the formulaThe capacitance of the FFC flat cable electrode to ground stray capacitance Cx is determined.
6. A height measurement device for carrying out the method according to any one of claims 1-5, characterized in that the device comprises:
the system comprises a main control module, an FFC flat cable module, a node control board module and a coaxial cable assembly module;
and the main control module, the FFC flat cable module and the coaxial cable assembly module are respectively connected with the node control board module.
7. The sensing node height measurement device based on the single chip microcomputer according to claim 6, wherein the FFC flat cable module comprises an FFC flat cable and an adapter plate, and the FFC flat cable and the adapter plate are connected to the outer wall of a container to be measured, which is filled with a material to be measured, through adhesive.
8. The sensing node height measurement device based on the single chip microcomputer according to claim 7, wherein the adapter plate is connected with an FFC flat cable through an FFC connector and is provided with a plurality of printed copper wires, conductors on the FFC flat cable are connected through the printed copper wires to form an induction electrode and a shielding electrode, the induction electrode is connected with a central conductor of the coaxial cable assembly module, and the shielding electrode is connected with a shielding layer of the coaxial cable assembly module.
9. The sensing node height measuring device based on the single chip microcomputer according to claim 6, wherein the node control board module comprises a single chip microcomputer, a driving circuit, an audible and visual alarm circuit, a power management circuit and a communication interface, and the driving circuit, the audible and visual alarm circuit, the power management circuit and the communication interface are respectively connected with the pins of the single chip microcomputer.
10. The singlechip-based sensing node height measurement device according to claim 9, wherein the driving circuit comprises a buffer operational amplifier, an integrating capacitor, a bleeder MOS tube, an analog switch, a resistor and an operational amplifier;
one end of the resistor is connected with the central conductor of the coaxial cable assembly and the non-inverting input end of the operational amplifier, and the other end of the resistor is connected with the common end of the analog switch; the inverting input end and the output end of the operational amplifier are connected and then connected to the shielding layer of the coaxial cable assembly; the normally-closed end of the analog switch is connected to a power supply VDD, and the normally-open end of the analog switch is connected with one end of the integrating capacitor, the drain electrode of the bleeder MOS tube and the in-phase input end of the buffer operational amplifier; the inverting input end and the output end of the buffer operational amplifier are connected and then connected to an ADC pin of the singlechip; the other end of the integrating capacitor and the source electrode of the bleeder MOS tube are grounded; and the grid electrode of the discharge MOS tube is connected to a GPIO pin with a PWM output function of the singlechip.
11. The single chip microcomputer based sensing node height measurement device according to claim 6, wherein the coaxial cable assembly module comprises a coaxial cable connected with an IPX radio frequency connector and a radio frequency connector J2, respectively.
12. A computer readable storage medium storing a computer program which, when executed by a processor, causes the processor to perform the steps of the method of any one of claims 1 to 5.
13. A computer device comprising a memory and a processor, the memory storing a computer program that, when executed by the processor, causes the processor to perform the steps of the method of any of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311052745.8A CN117168289A (en) | 2023-08-21 | 2023-08-21 | Method, device, equipment and medium for material height measurement circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311052745.8A CN117168289A (en) | 2023-08-21 | 2023-08-21 | Method, device, equipment and medium for material height measurement circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117168289A true CN117168289A (en) | 2023-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311052745.8A Pending CN117168289A (en) | 2023-08-21 | 2023-08-21 | Method, device, equipment and medium for material height measurement circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117168289A (en) |
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2023
- 2023-08-21 CN CN202311052745.8A patent/CN117168289A/en active Pending
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