CN117156679A - Processing method of copper surface bulge of packaging substrate and packaging substrate - Google Patents
Processing method of copper surface bulge of packaging substrate and packaging substrate Download PDFInfo
- Publication number
- CN117156679A CN117156679A CN202311165192.7A CN202311165192A CN117156679A CN 117156679 A CN117156679 A CN 117156679A CN 202311165192 A CN202311165192 A CN 202311165192A CN 117156679 A CN117156679 A CN 117156679A
- Authority
- CN
- China
- Prior art keywords
- packaging substrate
- brushing
- substrate
- drilling
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 159
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 110
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 239000010949 copper Substances 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 43
- 238000003672 processing method Methods 0.000 title claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims description 61
- 238000005553 drilling Methods 0.000 claims description 61
- 230000001680 brushing effect Effects 0.000 claims description 37
- 238000004140 cleaning Methods 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 27
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 25
- 230000008569 process Effects 0.000 claims description 17
- 238000005406 washing Methods 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 9
- 239000003153 chemical reaction reagent Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 8
- 239000000126 substance Substances 0.000 description 13
- 239000002904 solvent Substances 0.000 description 12
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 6
- 239000002893 slag Substances 0.000 description 6
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 5
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005554 pickling Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Abstract
The invention relates to the technical field of circuit board processing, in particular to a processing method of copper surface bulges of a packaging substrate and the packaging substrate.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a processing method of a copper surface bulge of a packaging substrate and the packaging substrate.
Background
In the manufacturing process of the packaging substrate, after the required blind holes and through holes are manufactured in a laser drilling mode, residues which are not drilled completely remain at the hole openings, the blind holes and the through holes are subjected to microetching and acid washing treatment after the holes are drilled, and the residues are removed by utilizing chemical reaction, so that the residues are not completely removed, the residues which remain form bulges after the packaging substrate is subjected to electroplating hole filling, poor electroplating is caused, and the reliability of products is affected.
Disclosure of Invention
The embodiment of the invention provides a processing method of copper surface bulges of a packaging substrate and the packaging substrate, which are used for solving the problem that the packaging substrate forms bulges after electroplating and hole filling and causes poor electroplating due to orifice residues after laser drilling of the packaging substrate.
In a first aspect, the present invention provides a method for processing a copper bump on a package substrate, where the method includes:
providing a packaging substrate, and drilling the packaging substrate;
cleaning the drilling position of the packaging substrate, including sequentially performing ultrasonic cleaning and hydraulic cleaning;
filling holes in the packaging substrate, and brushing the raised parts at the drilling positions of the packaging substrate by adopting ceramic brushing equipment so that the drilling positions of the packaging substrate are flush with the board surface of the packaging substrate.
In one embodiment, the ceramic brush plate device comprises at least one upper ceramic brush roller, at least one lower ceramic brush roller and a conveying device, wherein the conveying device comprises a driving mechanism and a conveying belt arranged on the driving mechanism; the upper ceramic brush roller and the lower ceramic brush roller are respectively and fixedly connected with the driving mechanism, the upper ceramic brush roller is positioned above the conveyor belt, and the lower ceramic brush roller is positioned below the conveyor belt.
In one embodiment, brushing the raised portions at the drilling locations of the package substrate with a ceramic brushing apparatus comprises:
and the driving mechanism is used for controlling the conveyor belt to convey the packaging substrate, the upper ceramic brush roller is used for brushing the upper surface of the packaging substrate, and the lower ceramic brush roller is used for brushing the lower surface of the packaging substrate.
In one embodiment, the hydraulic wash includes: cleaning the packaging substrate by using liquid pressure to remove impurities generated during drilling the packaging substrate, wherein the liquid pressure is in the range of 3.0-3.5Kg/cm 2 。
In one embodiment, the ultrasonic cleaning includes: and (3) washing the packaging substrate by using an ultrasonic processor to remove impurities generated when the packaging substrate is drilled.
In an embodiment, after the ultrasonic cleaning and the hydraulic cleaning are performed at the drilling position of the package substrate, the processing method further includes:
and carrying out microetching and washing on the packaging substrate, wherein the microetching and washing comprises the step of removing impurities generated when the packaging substrate is drilled by using a chemical reagent.
In one embodiment, the package substrate is drilled by a laser drilling process, and through holes and/or blind holes are formed in the package substrate.
In an embodiment, before brushing the raised portion at the drilling position of the package substrate with the ceramic brushing board device, the processing method further includes:
and manufacturing a printed circuit layer on the packaging substrate.
In one embodiment, performing hole filling on the package substrate includes:
and filling copper in the through holes and the blind holes of the packaging substrate in an electroplating hole filling mode.
In a second aspect, the present invention provides a package substrate comprising the package substrate of the first aspect and the improvement of the processing method.
Compared with the prior art, the embodiment of the invention has the beneficial effects that:
the invention provides a processing method of copper surface bulges of a packaging substrate, which comprises the steps of carrying out ultrasonic cleaning on the packaging substrate subjected to laser drilling, cleaning residues generated by drilling by utilizing the physical acting force of ultrasonic cleaning, carrying out hydraulic cleaning on the packaging substrate subjected to ultrasonic cleaning, and cleaning residues which are not cleaned during ultrasonic cleaning by utilizing the physical acting force of hydraulic cleaning;
and (3) carrying out microetching and washing on the packaging substrate after hydraulic washing, washing the residues which are not washed during hydraulic washing by utilizing chemical reaction of microetching and washing, washing the residues generated by drilling as much as possible, electroplating and hole filling the washed packaging substrate, and brushing the bulges at the hole filling positions caused by the residues by utilizing ceramic brushing equipment so as to avoid the problem of poor electroplating caused by the bulges formed after electroplating the packaging substrate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for processing copper bumps on a package substrate according to an embodiment of the invention;
fig. 2 is a flow chart of a method for processing copper bumps on a package substrate according to an embodiment of the invention;
FIG. 3 is a schematic diagram showing structural connection of a ceramic brush board apparatus according to an embodiment of the present invention;
the device comprises a main body, an upper ceramic brush roll, a lower ceramic brush roll, a transmission device, a driving mechanism and a conveyor belt, wherein the main body comprises a main body, an upper ceramic brush roll, a main body, a lower ceramic brush roll, a transmission device, a main body, a driving mechanism and a conveyor belt.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the present invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for the same elements throughout for clarity.
In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships that are based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the following description, for the purpose of providing a thorough understanding of the present invention, detailed structures and steps are presented in order to illustrate the technical solution presented by the present invention. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments in addition to these detailed descriptions.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
In one embodiment, as shown in fig. 1, a flow chart of a method for processing copper bumps of a package substrate is provided; the processing method comprises the following steps:
step S1: providing a packaging substrate, and drilling the packaging substrate.
Wherein, the packaging substrate can be a copper-clad laminate, which is prepared by dipping a reinforcing material with a resin adhesive, drying, cutting, laminating to form a blank, then cladding copper foil, using a steel plate as a die, and carrying out high-temperature high-pressure forming processing in a hot press; the reinforcing material can be glass fiber, ceramic, metal, etc.
Before the copper clad laminate is drilled, the copper clad laminate is baked for 2-3 hours at the temperature of 100-120 ℃, and the baked copper clad laminate can remove moisture in the board, eliminate internal stress of the board and stabilize the size of the copper clad laminate.
The drilling mode adopts a mechanical drilling and/or laser drilling process to drill holes in the copper-clad laminate.
S2, cleaning the drilling position of the packaging substrate, including sequentially performing ultrasonic cleaning and hydraulic cleaning;
ultrasonic cleaning is carried out on the drilled copper-clad laminate, the ultrasonic cleaning is to convert high-frequency oscillation electric signals into high-frequency mechanical vibration, the copper-clad laminate is cleaned, the hole port residues caused by drilling at the hole port are cleaned by physical acting force, the ultrasonic cleaning can directly carry out spray cleaning by using the physical acting force, and the copper-clad laminate can also be cleaned by using cavitation, acceleration and direct current of ultrasonic waves in chemical solvents, and the copper-clad laminate is cleaned under the combination of the physical acting force and the chemical solvents.
The method comprises the steps of carrying out hydraulic cleaning on the copper-clad laminate subjected to ultrasonic cleaning, wherein the hydraulic cleaning is carried out by utilizing the pressure of liquid, carrying out spray cleaning on the copper-clad laminate, utilizing physical acting force to clean off the residues of the opening which are not cleaned after ultrasonic cleaning at the opening, and carrying out the hydraulic cleaning by utilizing the pressure of water, wherein the hydraulic cleaning can directly carry out spray cleaning or change water into a chemical reagent for cleaning, and the copper-clad laminate is cleaned under the combination of the action of the liquid pressure and the chemical solvent.
Through carrying out ultrasonic cleaning to copper clad laminate, get rid of the produced partial residue of drilling, through hydraulic cleaning again, get rid of the not clean drill way residue of ultrasonic cleaning back in drill way department, make the cleanness of drill way more thorough, avoid forming protruding behind the follow-up hole filling, cause the product bad.
Step S3: filling holes in the packaging substrate, and brushing the raised parts at the drilling positions of the packaging substrate by adopting ceramic brushing equipment so that the drilling positions of the packaging substrate are flush with the board surface of the packaging substrate.
Filling holes in the cleaned copper clad laminate, filling the holes with conductive materials such as silver and copper, metallizing the holes, and connecting signals among different layers penetrated by the holes on the copper clad laminate.
The raised parts at the filling positions are brushed flatly by adopting ceramic brushing plate equipment, the ceramic brushing plate equipment can be ceramic plates and ceramic brushing rollers, manual brushing can be performed, and the motor can be used as an aid to automatically perform brushing flatly.
The bulges of the orifices are more obvious after the holes are filled, and the bulges are brushed flat by using ceramic brushing plate equipment, so that the copper surface of the finished packaging substrate is flat, and poor products are avoided.
According to the embodiment, the drilled copper-clad laminate is drilled, the drilled copper-clad laminate is subjected to ultrasonic cleaning, the residues generated by drilling are cleaned by utilizing the physical acting force of ultrasonic cleaning, the copper-clad laminate after ultrasonic cleaning is subjected to hydraulic cleaning, the residues which are not cleaned during ultrasonic cleaning are cleaned by utilizing the physical acting force of hydraulic cleaning, the residues generated by drilling are cleaned as much as possible, the cleaned copper-clad laminate is subjected to hole filling, the protrusions at the hole filling positions caused by the residues are brushed flat by utilizing ceramic brushing equipment, and the problem of poor products caused by the residues is avoided.
In an embodiment, the drilling of the package substrate in step S1 may use a laser drilling process to drill the package substrate, and the through holes and/or blind holes are formed on the package substrate.
The laser drilling is to irradiate the package substrate with high power density laser beam to heat the package substrate to vaporization temperature and evaporate to form holes.
The specific steps of laser drilling include: setting proper laser parameters according to the properties of the material and the size of the required hole, wherein the laser parameters comprise laser power, frequency, focusing mode and the like; focusing the laser beam to a position on the surface of the packaging substrate, which needs to be perforated, through a lens or a reflecting mirror; by controlling the moving speed and power of the laser beam, the laser beam is instantaneously heated on the surface of the packaging substrate, so that the punching effect is achieved.
The laser drilling process can be adopted to process the required blind holes and through holes at proper positions according to specific conditions.
As other embodiments, the package substrate is drilled by a mechanical drilling process, and the drilling speed and depth are easy to control during mechanical drilling.
The specific process flow of mechanical drilling comprises the following steps: the packaging substrate is fixed on a drilling machine, drilling and positioning are carried out, wherein the packaging substrate is prevented from being drilled on the drilling machine, the drilling position and the hole diameter are determined, the packaging substrate can be drilled according to the preset diameter and depth of a drill bit, and in the drilling process, the drilling speed is required to be noted, so that the drilling quality and efficiency are ensured.
In the embodiment, the laser drilling speed is high, the efficiency is high, and the method is applicable to high-density group hole machining; the drilling speed and depth of the mechanical drilling are easy to control.
In one embodiment, in step S2, the ultrasonic cleaning includes ultrasonic washing the package substrate with an ultrasonic processor to remove impurities generated when drilling the package substrate.
Placing the drilled packaging substrate in a cleaning tank of an ultrasonic processor, pouring a certain amount of chemical solvent into the tank, and cleaning the drilled packaging substrate by adopting a mode of combining physical acting force of ultrasonic waves and action of chemical solvent, wherein the chemical solvent can be a strong alkaline chemical solvent, so that greasy dirt can be effectively removed; the chemical solvent can also be a strong acid chemical solvent, and can react with residues at the orifice to remove the residues and greasy dirt at the orifice.
In the embodiment, burrs, copper slag and oil stains generated by drilling can be removed by utilizing the physical acting force of ultrasonic waves and the action of chemical solvents, so that the phenomenon that bulges are formed after holes are filled to cause bad products is avoided.
In one embodiment, the hydraulic cleaning in step S2 includes cleaning the package substrate with a liquid pressure in the range of 3.0-3.5Kg/cm to remove impurities generated during drilling the package substrate 2 。
In this embodiment, the package substrate is cleaned by liquid pressure in the range of 3.0-3.5Kg/cm 2 And the burrs and residues of the orifice are cleaned under the physical action, so that the residues are prevented from forming bulges after filling holes.
In this embodiment, the effect of the physical force of liquid is utilized, burr, copper slag, greasy dirt that the drilling that does not wash clean produced when ultrasonic cleaning can be clear away, the formation arch after the hole filling is avoided, leads to the fact the product bad.
In one embodiment, as shown in fig. 2, a flow chart of a method for processing copper bumps of a package substrate is provided; after cleaning ultrasonic cleaning and hydraulic cleaning are performed at the drilling position of the packaging substrate, the processing method further comprises the following steps:
and S21, carrying out microetching and washing on the packaging substrate, wherein the microetching and washing comprises the step of removing impurities generated when the packaging substrate is drilled by using a chemical reagent.
The packaging substrate is placed in an acid chemical reagent, pollutants on the surface of the packaging substrate are dissolved by utilizing the corrosion action of the acid chemical solvent, in the acid chemical reagent, copper slag on the packaging substrate undergoes oxidation-reduction reaction, the copper slag is reduced into copper ions and is dissolved in the acid chemical reagent, the purpose of removing the copper slag is achieved, and projections are formed on the packaging substrate after hole filling is avoided, so that poor products are caused.
Before pickling, the temperature is regulated in the pickling process according to the properties of different packaging substrates, so that the packaging substrates are prevented from deforming and cracking in the pickling process; placing the package substrate after pickling into a surface treatment tank, and adopting polishing, degreasing and other treatments according to the material of the package substrate so as to achieve the required surface effect; and placing the surface-treated packaging substrate into a dryer, and completely dissipating moisture and humidity on the surface of the packaging substrate under the action of air flow in the dryer so as to achieve a better surface effect of the packaging substrate.
In this embodiment, the burrs, copper slag and oil stains generated by the un-cleaned drilling holes during hydraulic cleaning can be removed by utilizing the chemical reaction generated by the residues and the chemical solvent, so as to avoid the formation of bulges after hole filling, thereby causing bad products.
In one embodiment, in step S21, the chemical reagents used in the microetching process are sodium persulfate and sulfuric acid.
Wherein sodium persulfate is an oxidant, residual copper can be oxidized first, then the oxidation layer is etched away by sulfuric acid, and the copper layer on the surface of the packaging substrate can be prevented from being corroded by sulfuric acid.
As other embodiments, the chemicals used in the microetching process are sodium persulfate and hydrochloric acid.
Wherein, sodium persulfate is an oxidant, residual copper can be oxidized first, then the oxide layer is etched by hydrochloric acid, and the oxide layer can be removed better by adopting hydrochloric acid.
In this embodiment, sodium persulfate is used to oxidize the residual copper, and sulfuric acid is used to react with the oxide layer to remove the oxide layer, so that the copper layer on the surface of the package substrate can be prevented from being corroded by sulfuric acid.
In one embodiment, in step S3, performing hole filling on the package substrate includes:
and filling copper in the through holes and the blind holes of the packaging substrate in an electroplating hole filling mode.
The electroplating hole filling comprises: placing the packaging substrate into a plating tank, injecting electrolyte into the tank to enable the packaging substrate to be completely soaked in the electrolyte, then depositing copper ions from the electrolyte onto the hole wall of the packaging substrate through the action of current to form a copper layer, wherein the hole wall of the packaging substrate is filled with the copper layer, electroplating hole filling of the packaging substrate is achieved, hole filling post-treatment is further carried out on the packaging substrate after electroplating hole filling, and the packaging substrate after hole filling is cleaned to remove residual electrolyte and copper particles.
In the embodiment, the electroplating hole filling can improve the connection reliability between different layers and avoid electromagnetic interference; the electroplated copper can improve the binding force of the plating layer, so that the holes are metallized, and signals between different layers penetrated by the holes on the copper-clad laminate are connected.
In an embodiment, in step S3, before the ceramic brushing device is used to brush the raised portion at the drilling position of the package substrate, the processing method further includes manufacturing a printed circuit layer on the package substrate.
The manufacturing of the printed circuit layer on the packaging substrate comprises the steps of pasting a film on the packaging substrate, wherein the pasting comprises the step of pasting a photosensitive material on a copper surface through a film pressing machine; exposing the package substrate after film pasting, wherein the exposure comprises the steps of utilizing a photosensitive photographic principle to enable a photosensitive material to be subjected to ultraviolet irradiation and then to perform polymerization reaction so as to complete pattern transfer; developing the exposed packaging substrate, wherein the developing comprises the steps of dissolving and washing the unexposed dry film by using weak alkalinity of a developing solution, and reserving the exposed part; etching the developed packaging substrate, wherein the etching comprises the step of exposing a copper surface after the unexposed dry film is removed by a developing solution, dissolving and corroding the exposed copper surface by using hydrochloric acid mixed type liquid medicine to obtain a required circuit, stripping the etched packaging substrate, stripping the exposed dry film for protecting the copper surface by using sodium hydroxide solution to expose a circuit pattern, and obtaining the printed circuit layer on the packaging substrate after the film stripping treatment.
In the embodiment, the printed circuit layer manufactured by the method enables the packaging substrate to be flat, the holes are free of protrusions, and the quality of finished products is high.
In one embodiment, the schematic structural diagram of the ceramic brushing device in step S3 is shown in fig. 3, where the ceramic brushing device includes at least one upper ceramic brush roller 31, at least one lower ceramic brush roller 32, and a conveying device 33, and the conveying device includes a driving mechanism 331 and a conveyor belt 332 mounted on the driving mechanism; the upper ceramic brush roll 31 and the lower ceramic brush roll 32 are respectively fixedly connected with the driving mechanism 331, the upper ceramic brush roll 31 is positioned above the conveyor belt 332, and the lower ceramic brush roll 32 is positioned below the conveyor belt 332.
In the embodiment, the ceramic brush roller is adopted to brush the bulges after hole filling caused by residues on the packaging substrate, and the ceramic brush roller cannot fall off scraps, so that redundant residues can be easily ground out, and the surface of the packaging substrate is free from scratches and uniform; the driving mechanism 331 is adopted as an aid to control the work of the ceramic brush roller and the conveying belt 332 to convey so as to realize automatic brushing; the upper ceramic brush roller 31 is adopted to brush the upper plane of the packaging substrate, and the lower ceramic brush roller 32 is adopted to brush the lower plane of the packaging substrate, so that no bulges are arranged on both sides of the packaging substrate; the packaging substrate is conveyed by the conveyor belt 332, so that automatic conveying is realized, and personnel safety is ensured.
In one embodiment, brushing the raised portions at the drilling locations of the package substrate with a ceramic brushing apparatus comprises:
the driving mechanism 331 controls the conveyor belt 332 to convey the package substrate, the upper ceramic brush roller 31 smoothes the upper surface of the package substrate, and the lower ceramic brush roller 32 smoothes the lower surface of the package substrate.
In this embodiment, the package substrate after hole filling is placed on a conveyor belt 332 of the ceramic brushing device, a driving mechanism 331 of the conveyor device 33 controls the conveyor belt 332 to rotate, the upper ceramic brush roller 31 and the lower ceramic brush roller 32 are closely attached to the conveyor belt 332 and continuously rotate, the package substrate after hole filling is conveyed to the ceramic brush roller position, the upper ceramic brush roller 31 smoothes the protrusions on the upper plane of the package substrate, and the lower ceramic brush roller 32 smoothes the protrusions on the lower plane of the package substrate. And the product defect caused by the plane bulge of the packaging substrate is avoided.
In one embodiment, a package substrate is provided, where the package substrate includes the package substrate obtained by the processing method according to any of the above embodiments.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.
Claims (10)
1. The processing method for the copper surface bulge of the packaging substrate is characterized by comprising the following steps of:
providing a packaging substrate, and drilling the packaging substrate;
cleaning the drilling position of the packaging substrate, including sequentially performing ultrasonic cleaning and hydraulic cleaning;
filling holes in the packaging substrate, and brushing the raised parts at the drilling positions of the packaging substrate by adopting ceramic brushing equipment so that the drilling positions of the packaging substrate are flush with the board surface of the packaging substrate.
2. The process of claim 1, wherein,
the ceramic brushing plate equipment comprises at least one upper ceramic brushing roller, at least one lower ceramic brushing roller and a conveying device, wherein the conveying device comprises a driving mechanism and a conveying belt arranged on the driving mechanism; the upper ceramic brush roller and the lower ceramic brush roller are respectively and fixedly connected with the driving mechanism, the upper ceramic brush roller is positioned above the conveyor belt, and the lower ceramic brush roller is positioned below the conveyor belt.
3. The process of claim 2, wherein,
brushing the raised portions at the drilling positions of the package substrate with ceramic brushing plate equipment comprises:
and the driving mechanism is used for controlling the conveyor belt to convey the packaging substrate, the upper ceramic brush roller is used for brushing the upper surface of the packaging substrate, and the lower ceramic brush roller is used for brushing the lower surface of the packaging substrate.
4. The process of claim 1, wherein,
the hydraulic cleaning includes: and cleaning the packaging substrate by utilizing liquid pressure to remove impurities generated when the packaging substrate is drilled, wherein the liquid pressure is in the range of 3.0-3.5Kg/cm < 2 >.
5. The process of claim 1, wherein,
the ultrasonic cleaning includes: and (3) washing the packaging substrate by using an ultrasonic processor to remove impurities generated when the packaging substrate is drilled.
6. The processing method according to claim 1, wherein after cleaning ultrasonic cleaning and hydraulic cleaning are performed at the drilling position of the package substrate, the processing method further comprises:
and carrying out microetching and washing on the packaging substrate, wherein the microetching and washing comprises the step of removing impurities generated when the packaging substrate is drilled by using a chemical reagent.
7. The processing method of claim 6, wherein drilling the package substrate comprises:
and drilling the packaging substrate by adopting a laser drilling process, and forming through holes and/or blind holes on the packaging substrate.
8. The processing method of claim 7, wherein prior to brushing the raised portions at the drilled locations of the package substrate with a ceramic brushing apparatus, the processing method further comprises:
and manufacturing a printed circuit layer on the packaging substrate.
9. The processing method of claim 8, wherein performing hole filling on the package substrate comprises:
and filling copper in the through holes and the blind holes of the packaging substrate in an electroplating hole filling mode.
10. A package substrate comprising the package substrate obtained by the treatment method according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311165192.7A CN117156679A (en) | 2023-09-08 | 2023-09-08 | Processing method of copper surface bulge of packaging substrate and packaging substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311165192.7A CN117156679A (en) | 2023-09-08 | 2023-09-08 | Processing method of copper surface bulge of packaging substrate and packaging substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117156679A true CN117156679A (en) | 2023-12-01 |
Family
ID=88900519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311165192.7A Pending CN117156679A (en) | 2023-09-08 | 2023-09-08 | Processing method of copper surface bulge of packaging substrate and packaging substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117156679A (en) |
-
2023
- 2023-09-08 CN CN202311165192.7A patent/CN117156679A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100557540B1 (en) | BGA package board and method for manufacturing the same | |
| EP1843650B1 (en) | Method of manufacturing a multilayered printed circuit board | |
| US8366903B2 (en) | Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method | |
| JP2007109902A (en) | Method for manufacturing multilayer printed wiring board, and photosensitive dry film used for same | |
| JP2005322868A (en) | Method for electrolytic gold plating of printed circuit board | |
| CN111511120B (en) | Raided Pad manufacturing method | |
| CN113163623B (en) | Method for manufacturing blind hole buried hole filling packaging substrate of multilayer board | |
| WO2009113396A1 (en) | Method of treating surface of copper and method of treating surface of printed wiring board | |
| CN109451655A (en) | A kind of method and its structure producing pcb board control plate body size and warpage | |
| CN111988915A (en) | Manufacturing process of PCB resin plug hole | |
| CN101662896B (en) | Method for manufacturing printed wiring board | |
| CN114190011A (en) | High-heat-dissipation PCB and manufacturing process thereof | |
| CN111935916B (en) | Printed circuit board including fine lines with line width of 30-50 μm and method of manufacturing the same | |
| CN117156679A (en) | Processing method of copper surface bulge of packaging substrate and packaging substrate | |
| CN113973440B (en) | Circuit board insulating layer treatment process | |
| CN115843155A (en) | PCB manufacturing method | |
| JP2003115662A (en) | Method of manufacturing semiconductor device substrate | |
| JP2000261149A (en) | Mutilayer printed wiring board and manufacture thereof | |
| JP3223814B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JPH08264957A (en) | Manufacture of multilayer printed wiring board | |
| JP4180192B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JP4366632B2 (en) | Metal-clad laminate with inner layer circuit, multilayer printed wiring board, and manufacturing method thereof | |
| CN116723635A (en) | Preparation method of circuit board capable of preventing white edges and high-TG circuit board | |
| JP3951938B2 (en) | Etching method and printed wiring board manufacturing method using the same | |
| CN113950198A (en) | Production method of multilayer asymmetric circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Country or region after: China Address after: No. 1321 Zhixin Road, Huangpu District, Guangzhou City, Guangdong Province, 510700 Applicant after: Guangzhou Guangxin packaging substrate Co.,Ltd. Address before: Room 643, Room 406, No. 1, Yichuang Street, Huangpu District, Guangzhou City, Guangdong Province, 510700 (for office only) Applicant before: Guangzhou Guangxin packaging substrate Co.,Ltd. Country or region before: China |